CN113550737A - Heat insulation cooling device, measurement while drilling device and drilling tool - Google Patents
Heat insulation cooling device, measurement while drilling device and drilling tool Download PDFInfo
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- CN113550737A CN113550737A CN202010266310.3A CN202010266310A CN113550737A CN 113550737 A CN113550737 A CN 113550737A CN 202010266310 A CN202010266310 A CN 202010266310A CN 113550737 A CN113550737 A CN 113550737A
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- heat
- insulating layer
- medium
- cooling device
- absorbing medium
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- 238000009413 insulation Methods 0.000 title claims abstract description 55
- 238000001816 cooling Methods 0.000 title claims abstract description 40
- 238000005553 drilling Methods 0.000 title claims abstract description 33
- 238000005259 measurement Methods 0.000 title description 14
- 238000010521 absorption reaction Methods 0.000 claims description 13
- 239000012782 phase change material Substances 0.000 claims description 12
- 238000004146 energy storage Methods 0.000 claims description 11
- 238000001704 evaporation Methods 0.000 claims description 11
- 239000002826 coolant Substances 0.000 claims description 9
- 238000000034 method Methods 0.000 claims description 6
- 230000008569 process Effects 0.000 claims description 6
- 239000003463 adsorbent Substances 0.000 claims description 4
- 230000008020 evaporation Effects 0.000 description 10
- 230000001502 supplementing effect Effects 0.000 description 9
- 238000010248 power generation Methods 0.000 description 8
- 239000007789 gas Substances 0.000 description 4
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 3
- 239000003208 petroleum Substances 0.000 description 3
- 239000013589 supplement Substances 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 238000011161 development Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000012774 insulation material Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003345 natural gas Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003209 petroleum derivative Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000001179 sorption measurement Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B41/00—Equipment or details not covered by groups E21B15/00 - E21B40/00
-
- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B47/00—Survey of boreholes or wells
- E21B47/01—Devices for supporting measuring instruments on drill bits, pipes, rods or wirelines; Protecting measuring instruments in boreholes against heat, shock, pressure or the like
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geology (AREA)
- Mining & Mineral Resources (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Fluid Mechanics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Geophysics (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明提供了一种隔热冷却装置、随钻测量装置以及钻具，所述隔热冷却装置，包括包裹在所述芯片组(6)外侧的绝缘层(7)、位于所述绝缘层(7)外侧的隔热层以及吸热介质流动控制系统，所述隔热层和所述绝缘层(7)之间容纳有吸热介质(8)；所述吸热介质流动控制系统用于控制所述隔热层内吸热介质(8)的蒸发流动和补充，所述吸热介质(8)在蒸发流动过程中能够吸热。本发明通过对所要保护的芯片组设置隔热层，并在高温时使吸热介质蒸发吸热，有效的增加了芯片组所能正常工作的温度范围，使得整个装置能够在较高温度环境下正常工作。
The present invention provides an adiabatic cooling device, a measurement-while-drilling device, and a drilling tool. The adiabatic cooling device comprises an insulating layer (7) wrapped on the outer side of the chip set (6), and an insulating layer (7) located on the insulating layer ( 7) An outer heat insulating layer and an endothermic medium flow control system, an endothermic medium (8) is accommodated between the heat insulating layer and the insulating layer (7); the endothermic medium flow control system is used to control Evaporative flow and replenishment of the heat-absorbing medium (8) in the thermal insulation layer, and the heat-absorbing medium (8) can absorb heat during the evaporative flow. The invention effectively increases the temperature range in which the chip set can work normally by setting the heat insulation layer on the chip set to be protected, and makes the heat-absorbing medium evaporate and absorb heat at high temperature, so that the whole device can operate in a higher temperature environment. normal work.
Description
Technical Field
The invention relates to the field of high-temperature drilling of petroleum and geothermal wells, in particular to a heat-insulating and cooling device, a measurement-while-drilling device and a drilling tool.
Background
Measurement While Drilling (MWD) is a technology for measuring parameters such as underground well deviation and azimuth in a Drilling process and realizing wireless transmission, transmits Measurement information data to the ground by using mud pulses in a drill string, and consists of a directional Measurement module, a Measurement and control and signal transmission circuit module, a power supply module and a ground encoding and decoding module.
With the exploration and development of petroleum and geothermal wells, the temperature of a target layer is higher and higher, and exceeds 175 ℃ and even can reach more than 300 ℃. The current MWD instrument with stable performance only resists high temperature of 175 ℃ due to the limitation of temperature resistance of a chipset, and if the temperature is exceeded, the chip fails, so that track monitoring and downhole parameter acquisition cannot be carried out during high-temperature drilling, and smooth drilling of petroleum, natural gas and geothermal resources is severely restricted.
At present, MWD instrument chip manufacturers at home and abroad mainly adopt forward technology research and development for overcoming high-temperature resistant chips, and the technical bottleneck is not broken through.
Disclosure of Invention
The invention aims to provide a heat insulation cooling device, a measurement while drilling device and a drilling tool, and aims to solve the problem that a device with a chipset in the prior art is difficult to work at a high temperature.
In order to achieve the above object, the present invention provides a heat insulation cooling device for heat insulation and cooling of a chipset, including an insulation layer wrapped outside the chipset, a heat insulation layer located outside the insulation layer, and a heat absorption medium flow control system, wherein an accommodating cavity for accommodating a heat absorption medium is provided between the heat insulation layer and the insulation layer;
the heat-absorbing medium flow control system is used for controlling the evaporation flow and supplement of the heat-absorbing medium in the heat-insulating layer, and the heat-absorbing medium can absorb heat in the evaporation flow process.
Optionally, the heat-insulating cooling device further comprises a storage tank and a supplementing device, and the heat-absorbing medium is stored in the supplementing device;
the storage tank is communicated with the accommodating cavity for accommodating the heat absorbing medium and is used for accommodating the heat absorbing medium flowing out of the heat insulating layer;
the supplementing device is communicated with the accommodating cavity for accommodating the heat absorbing medium and is used for conveying the heat absorbing medium into the heat insulating layer.
Optionally, the heat absorbing medium flow control system comprises a temperature control flow valve and a pressure valve;
the temperature control flow valve is arranged on a channel between the storage tank and the accommodating cavity and used for controlling the evaporated heat absorption medium to flow into the storage tank according to a preset temperature;
the pressure valve is arranged on a channel between the supplementing device and the containing cavity and used for controlling heat absorbing media in the supplementing device to be conveyed into the insulating layer according to preset pressure.
Optionally, the heat-insulating cooling device further comprises a power generation set, and the temperature control flow valve and the pressure valve are both electrically connected with the power generation set.
Optionally, the storage tank is communicated with the heat absorbing medium in the heat insulating layer through a steam channel, and the temperature control flow valve is arranged on the steam channel.
Optionally, a coolant is disposed in the storage tank, and the coolant is used for cooling the heat absorbing medium evaporated into the storage tank.
Optionally, an energy storage unit is further disposed in the supplementary device, and the energy storage unit is configured to apply pressure to the heat absorbing medium, so that the heat absorbing medium in the supplementary device can flow into the heat insulating layer.
Optionally, the heat absorbing medium comprises an adsorbent and a phase change material;
the heat insulation layer comprises a first heat insulation layer and a second heat insulation layer wrapped on the outer side of the first heat insulation layer.
The invention also provides a measurement while drilling device which comprises a chip set and adopts the heat insulation cooling device provided by the invention to heat-insulate and cool the chip set.
In another aspect of the invention, the invention also provides a drilling tool which is provided with the measurement while drilling device provided by the invention.
The heat insulation layer is arranged on the chipset to be protected, and the heat absorption medium is evaporated and absorbs heat at high temperature, so that the temperature range of normal work of the chipset is effectively enlarged, and the whole device can work normally in a high-temperature environment.
Drawings
Fig. 1 is a schematic view of a thermally insulated cooling device according to an embodiment of the present invention.
Reference numerals:
1-a power generation set; 2-a coolant; 3-a storage tank; 4-a steam channel; 5-temperature control flow valve; 6-a chipset; 7-an insulating layer; 8-a heat-absorbing medium; 9-a first insulating layer; 10-a second thermally insulating layer; 11. 12-a pressure valve; 13-inlet and outlet; 15-an energy storage unit; 16-a gas-filled one-way valve; 17-air inlet pipe.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and examples. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. The specific embodiments described herein are merely illustrative of the invention and are not to be construed as limiting the invention. All other embodiments, which can be derived by a person skilled in the art from the described embodiments of the invention, are within the scope of the invention.
Referring to fig. 1, the present embodiment provides a heat insulation cooling device for heat insulation and cooling of a chipset 6, the heat insulation cooling device includes an insulation layer 7 wrapped outside the chipset 6, a heat insulation layer located outside the insulation layer 7, and a heat absorption medium flow control system, and an accommodating cavity for accommodating a heat absorption medium 8 is provided between the heat insulation layer and the insulation layer 7; the insulating layer 7 plays an insulating role, so that the faults of short circuit and the like of the chip set 6 are avoided, and the normal operation of the chip set 6 is ensured. The chipset 6 is an object to be protected, and the chipset 6 may be a processor of any device, and the present device may be used as long as there is a need for heat insulation and temperature reduction of a chip.
Further, the heat-absorbing medium 8 can absorb heat by evaporation, and plays a role in cooling the chipset 6, wherein the heat-absorbing medium flow control system is used for controlling the evaporation flow and supplement of the heat-absorbing medium 8 in the heat insulation layer, and the heat-absorbing medium 8 can absorb heat in the evaporation flow process. The heat insulation layer is a cavity, on one hand, plays a role in heat insulation and reduces external heat transfer to the cavity, and on the other hand, is used for accommodating the heat absorption medium 8. When the device is in a high-temperature environment, the heat insulation layer firstly plays a certain heat insulation role, and with the rise of temperature, the heat absorption medium flow control system controls the heat absorption medium 8 to evaporate and absorb heat after the preset temperature is reached, so that the rise of temperature is slowed down, and under the heat insulation and cooling effects, the whole device can work in a well with high temperature (above 175 ℃).
In the present embodiment, the heat-insulating cooling device further includes a storage tank 3 and a replenishing device, in which a heat-absorbing medium 8 is stored; the storage tank 3 is communicated with a containing cavity containing the heat-absorbing medium 8 and is used for containing the heat-absorbing medium 8 flowing out of the heat-insulating layer; the supplementing device is communicated with the accommodating cavity for accommodating the heat absorbing medium 8 and is used for conveying the heat absorbing medium 8 into the heat insulating layer. The storage tank 3 and the supplement device are arranged, so that the heat-absorbing medium 8 can be stored and reused, and the influence on the surrounding environment of the device is reduced.
Further, the heat absorbing medium flow control system includes a temperature control flow valve 5 and a pressure valve 11; the temperature control flow valve 5 is arranged on a channel between the storage tank 3 and the accommodating cavity and is used for controlling the evaporated heat-absorbing medium 8 to flow into the storage tank 3 according to a preset temperature; a pressure valve 11 is arranged on the passage between the replenishing device and the accommodating cavity and is used for controlling the heat absorbing medium 8 in the replenishing device to be conveyed into the insulating layer 7 according to preset pressure. The temperature control flow valve 5 can control the flow amount (from 0 to maximum) according to the temperature. By adopting the scheme, in actual work, when the preset temperature is reached, the temperature control flow valve 5 is opened, the heat absorbing medium 8 in the heat insulating layer evaporates and absorbs heat and flows into the storage tank 3, when the quantity of the heat absorbing medium 8 in the heat insulating layer is reduced, the internal pressure is reduced, the pressure difference between the heat absorbing medium and the supplementing device is increased, and when the pressure difference reaches the preset value, the pressure valve 11 is opened, and the heat absorbing medium 8 in the supplementing device flows into the heat insulating layer for supplementing. The way of controlling the evaporation flow and replenishment of the heat absorbing medium 8 in the thermal insulation layer is not limited to this, and those skilled in the art can design other ways of controlling the evaporation flow and replenishment according to the need.
In the present embodiment, the heat-insulating cooling device further includes a power generation group 1, and the temperature control flow valve 5 and the pressure valve 11 are both electrically connected to the power generation group 1. The power generation unit 1 supplies electric power to the temperature control flow valve 5 and the pressure valve 11. The chip set 6 is also electrically connected with the power generation set 1 to obtain electric energy. The power of the chip set 6, the temperature control flow valve 5 and the pressure valve 11 may be the power generation set 1, or may be an external power supply, and those skilled in the art can ensure that the components which need the power in the use state can obtain the power.
Further, a coolant 2 is provided in the storage tank 3, and the coolant 2 is used to cool the heat-absorbing medium 8 evaporated into the storage tank 3. The type of coolant 2 can be selected by a person skilled in the art according to the actual circumstances. In the present embodiment, the heat-absorbing medium 8 directly contacts the coolant 2 and exchanges heat, and the heat-absorbing medium 8 cooled by the heat exchange can be reused.
In a specific embodiment, the storage tank 3 is in communication with the heat absorbing medium 8 in the insulating layer through the vapor passage 4, and the temperature control flow valve 5 is provided on the vapor passage 4. The steam channel 4 can promote the evaporation of the heat-absorbing medium 8, and the cooling speed is increased.
Wherein, still set up in the supplementary device and have energy storage unit 15, energy storage unit 15 is used for exerting pressure to heat-absorbing medium 8 to make heat-absorbing medium 8 in the supplementary device can flow into the heat insulating layer. The energy storage unit 15 is arranged to ensure that the heat absorbing medium 8 in the supplementary device can be continuously and effectively conveyed into the heat insulation layer.
In a specific embodiment, the energy storage unit 15 is provided with an inlet pipe 17, and an inflation check valve 16 is arranged on the inlet pipe 17. When the pressure of the energy storage unit 15 is reduced, the air inlet pipe 17 can be used for inflating inwards, so that the effective pressure of the energy storage unit 15 is ensured.
In order to ensure that the heat-absorbing medium 8 can flow more quickly to the cooling device after evaporation, in this embodiment the cooling device is arranged above the thermally insulating layer and the supplementary device is arranged below the thermally insulating layer, so that the evaporated gas flows more easily upwards.
In the present embodiment, the heat absorbing medium 8 includes an adsorbent and a phase change material; the heat absorbing medium flow control system is additionally provided with a pressure valve 12, wherein the pressure valve 12 and the pressure valve 11 have the same function, but the channel of the supplementary device to the heat insulation layer is increased, and the skilled person can arrange more channels according to the requirement. The arrangement of the plurality of channels is beneficial to improving the flowing uniformity of the phase-change material. The adsorbent has a large specific surface area, a proper pore structure and a surface structure, has strong adsorption capacity on the phase-change material, and ensures that the phase-change material is slowly evaporated in a controlled state at the moment when the temperature control flow valve 5, the pressure valve 11 and the pressure valve 12 are opened; when the physical state of the phase-change material is changed, the temperature of the material is almost kept unchanged before the phase change is completed, a wide temperature platform is formed, and although the temperature is unchanged, the latent heat absorbed or released is quite large. The most common phase change material is water, which changes from liquid to gas when reaching a given temperature (which varies with ambient pressure, usually around 100 ℃), and absorbs heat during this process, but the temperature of the water does not change. The heat absorption principle of the phase-change material in the embodiment is similar to that of water, the phase-change material absorbs heat in the process of changing from liquid to gas, but the temperature of the phase-change material does not change, and the absorbed heat mainly comes from the chipset 6, so that the effect of cooling the chipset 6 can be achieved.
In the present embodiment, the thermal insulation layer includes a first thermal insulation layer 9 and a second thermal insulation layer 10 wrapped outside the first thermal insulation layer 9. A vacuum gap may be provided between the first and second insulating layers 9, 10 to further reduce the heat transfer efficiency and thereby slow down the rapid rise in internal temperature. The first heat insulation layer 9 and the second heat insulation layer 10 are both heat insulation materials.
The embodiment also provides a measurement while drilling device which comprises the chipset 6 and adopts the heat insulation cooling device provided by the embodiment to heat-insulate and cool the chipset 6. Of course, for those skilled in the art, the heat-insulating cooling device provided in this embodiment may also be applied to other devices requiring heat insulation and cooling, so as to perform heat insulation and cooling on the corresponding chipset.
Further, the embodiment also provides a drilling tool, and the drilling tool is provided with the measurement while drilling device provided by the embodiment. The measurement while drilling device of the drilling tool adopts the heat insulation material for heat insulation and the phase change material for evaporation and heat dissipation to reduce the system temperature of the core plate group part of the measurement while drilling device, so that the continuous operation of the measurement while drilling device under the ultra-high temperature condition is realized, the purpose that the chip group operates under the condition of higher working temperature, and the purposes of controlling the ultra-high temperature drilling track and obtaining the downhole parameters are met. The scheme solves the current situation that no measurement-while-drilling device is used for high-temperature drilling at the temperature of more than 175 ℃ at home and abroad, fills the technical blank in the field of the industry, and provides an indispensable technical means for the exploration and development of national high-temperature petroleum and natural gas and geothermal wells.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010266310.3A CN113550737A (en) | 2020-04-07 | 2020-04-07 | Heat insulation cooling device, measurement while drilling device and drilling tool |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010266310.3A CN113550737A (en) | 2020-04-07 | 2020-04-07 | Heat insulation cooling device, measurement while drilling device and drilling tool |
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| Publication Number | Publication Date |
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| CN113550737A true CN113550737A (en) | 2021-10-26 |
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| CN202010266310.3A Pending CN113550737A (en) | 2020-04-07 | 2020-04-07 | Heat insulation cooling device, measurement while drilling device and drilling tool |
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|---|---|---|---|---|
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2020
- 2020-04-07 CN CN202010266310.3A patent/CN113550737A/en active Pending
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