CN113549959A

CN113549959A - Electric field-based machining device and machining method

Info

Publication number: CN113549959A
Application number: CN202010325294.0A
Authority: CN
Inventors: 季鹏凯
Original assignee: Yuanzhi Technologies Shanghai Co ltd
Current assignee: Yuanzhi Technologies Shanghai Co ltd
Priority date: 2020-04-23
Filing date: 2020-04-23
Publication date: 2021-10-26
Anticipated expiration: 2040-04-23
Also published as: CN113549959B

Abstract

The invention relates to a processing device and a processing method based on an electric field, the device comprises a forming rotary drum which can rotate along a central axis and can conduct electricity, at least one photoelectric layer, a power supply and a box body, wherein the photoelectric layer is in a rotary drum shape, an inner layer and an outer layer of the photoelectric layer are mutually combined to form a transparent conducting layer and a light-operated conducting layer, ionic liquid is filled in the box body, the photoelectric layer is rotatably and partially immersed in the ionic liquid, the forming rotary drum and the photoelectric layer are correspondingly arranged in parallel and matched, the photoelectric layer is protruded out of the outer side face of the ionic liquid, an ionic liquid layer is attached to the outer side face of the photoelectric layer through rotation of the photoelectric layer, the ionic liquid layer is electrically connected with the forming surface of the forming rotary drum, one pole of the power supply is electrically connected with the forming rotary drum, the other pole of the power supply is electrically connected with the transparent conducting layer, and light can selectively irradiate the light-operated conducting layer from the inside of the photoelectric layer through the transparent conducting layer. The invention can realize the shape-controllable electro-deposition and electro-etching processing, improves the processing precision and efficiency and is beneficial to realizing the processing of a complex structure model.

Description

Electric field-based machining device and machining method

Technical Field

The invention belongs to the technical field of electrodeposition and electroetching processing, and particularly relates to a processing device and a processing method based on an electric field.

Background

In the existing electrochemical deposition, micro electroforming or electrolytic etching processes, the process is relatively complex and high in cost, and the problems of lack of flexibility and insufficient precision exist generally.

For example, in electroforming, it is often necessary to customize the anode, and electroforming different molds requires customizing different anodes, which is costly and time consuming for the fabrication of a small number of molds. In the electrolytic processing, typically, a plurality of steps such as gluing, exposing, developing and the like are required to be performed on the anode in the process of mask electrolysis, which wastes time and labor and has high cost. Also, different anode mask patterns need to be customized for different process patterns. Even if the electrolytic transfer printing process is adopted, a specific pattern mask (tool cathode) still needs to be manufactured, and the process is complicated and poor in flexibility.

The electrolytic method is also an important process for producing a shaped foil (e.g., copper foil), for example, in the electrolytic process of raw foil for producing a copper foil based on the electrodeposition process, a metal roll having a smooth surface and continuously rotating is used as a cathode, and metal copper is continuously electrodeposited on the surface of the cathode roll by electrolytic reaction while continuously peeling off the produced copper foil from the cathode roll. By adopting the process, the forming foil with patterns cannot be selectively generated, and the forming foil with selective thickness arrangement cannot be produced. For example, when a conventional Printed Circuit Board (PCB) is manufactured, a copper foil is usually first combined with an insulating material (e.g., organic resin) to form a copper-clad plate, then a preset copper layer pattern can be generated through complex processes of coating photosensitive oil or pasting a photosensitive dry film, exposing, developing, etching, film stripping and the like, each layer of copper pattern usually needs to be customized for a negative film (such as a film and a silver salt photosensitive film) respectively, and multiple chemical materials are adopted for cleaning for multiple times in the process, so that the process is complicated, inflexible and environmentally-friendly.

Disclosure of Invention

The invention aims to provide a processing device and a processing method based on an electric field, which realize the shape-controllable electro-deposition and electro-etching processing, improve the processing precision and efficiency and are beneficial to realizing the processing of a complex structure model.

First, the technical solution adopted to solve the technical problems of the present invention is to provide an electric field-based processing apparatus, comprising a forming drum capable of rotating along a central axis and conducting electricity, at least one photoelectric layer, a power supply and a box body, the photoelectric layer is in a drum shape and comprises a transparent conducting layer and a light-control conducting layer, wherein the inner layer and the outer layer are mutually combined, the box body is filled with ionic liquid, the photoelectric layer can be rotatably and partially immersed in the ionic liquid, the forming rotary drum and the photoelectric layer are correspondingly arranged in parallel in a matching way, an ion liquid layer is attached to the outer side surface of the photoelectric layer protruding out of the ion liquid through the rotation of the photoelectric layer, and the ion liquid layer is electrically connected with the forming surface of the forming rotary drum, one pole of the power supply is electrically connected with the forming rotary drum, the other pole of the power supply is electrically connected with the transparent conducting layer, and light beams can selectively irradiate the light-controlled conducting layer from the inside of the photoelectric layer through the transparent conducting layer.

The negative electrode of the power supply is electrically connected with the forming rotary drum, the positive electrode of the power supply is electrically connected with the transparent conducting layer of the photoelectric layer, the light beam can selectively irradiate the light-controlled conducting layer through the transparent conducting layer and carry out selective electrodeposition on the forming surface of the forming rotary drum to form a deposition model with a controllable shape, and the ionic liquid layer is in contact with the forming surface of the forming rotary drum or in contact with the deposition model to keep electrical connection with the forming surface of the forming rotary drum.

The forming surface of the forming drum forms a continuous deposition pattern which is peeled along the forming surface of the forming drum to form a forming foil.

Also included is a photosensitive resin photocuring printing mechanism for selectively photocuring the combined photosensitive resin layer on the molding foil.

The forming foil is of a composite structure and is obtained by combining the base material and the forming foil.

Or the processing device based on the electric field is arranged on two sides of the base material respectively, and the formed foils formed on two sides of the base material are combined with two sides of the base material through the compression roller respectively to obtain the formed foils with double-sided composite structures.

And the conductive film is partially attached to the forming drum between the forming drum and the photoelectric layer and is conveyed along with the rotation of the forming drum, and the light beam selectively irradiates the light control conductive layer and carries out selective electrodeposition on the surface of the conductive film, which is opposite to the photoelectric layer, so as to form a forming foil with a controllable shape.

Also included are guide rollers for guiding the fibers into the forming surface of the forming drum, the fibers being integrated into the deposition pattern or forming foil following the electrodeposition process.

The light-operated conducting layer is a PN junction structure layer, a PIN photodiode structure layer, a PNP triode structure layer or a light guide material layer.

The forming drum and photovoltaic layer may be moved relatively away from each other in the radial direction of the forming drum, either intermittently or continuously.

The box body is internally provided with a scraper which is in clearance fit or sliding fit with the outer surface of the photoelectric layer, the inner cavity of the box body is divided by the scraper to form a high-concentration ionic liquid area and a low-concentration ionic liquid area, and the high-concentration ionic liquid area and the low-concentration ionic liquid area are respectively connected with an ionic liquid supplementing device to form an ionic liquid supplementing loop.

The positive pole of the power supply is electrically connected with the forming rotary drum, the negative pole of the power supply is electrically connected with the transparent conducting layer, and the light beam penetrates through the transparent conducting layer to selectively irradiate the light-controlled conducting layer to perform selective electric etching on the forming surface of the forming rotary drum to form an etching groove with a controllable shape.

The forming foil is partially attached to the forming drum between the forming drum and the photoelectric layer and is transmitted along with the rotation of the forming drum, the positive electrode of the power supply is electrically connected with the forming foil, the negative electrode of the power supply is electrically connected with the transparent conducting layer, and light beams penetrate through the transparent conducting layer to selectively irradiate the light control conducting layer to perform selective electric etching on the surface of the forming foil, which is opposite to the photoelectric layer, so that etching grooves with controllable shapes are formed.

And a mask with a preset pattern light-transmitting area is laid on the surface of the transparent conducting layer.

The electric field-based processing device comprises a plurality of stages, wherein a forming rotary drum of a first-stage electric field-based processing device forms continuous forming foil, the forming foil sequentially passes through a lower-stage electric field-based processing device through roller guiding and is attached and wound with the forming rotary drum of the lower-stage electric field-based processing device, and selective electrodeposition processing and/or selective electroetching processing are continuously carried out on the forming foil through the lower-stage electric field-based processing device.

And the cleaning device is used for removing the residual ionic liquid on the formed foil.

The ionic liquid in at least one stage of the electric field-based processing device in the lower stage of the electric field-based processing device can also adopt electrophoretic liquid for forming the shape-controllable insulating layer on the forming foil through selective electrophoretic deposition.

Secondly, the technical scheme adopted by the invention for solving the technical problems is to provide a processing device based on an electric field, which comprises a forming rotary drum, at least one photoelectric layer, a power supply, a box body and a supporting seat, wherein the forming rotary drum can rotate along a central axis and can conduct electricity, the photoelectric layer comprises a transparent conductive layer and a light-operated conductive layer which are mutually combined, ionic liquid is filled in the box body, the forming drum is at least partially immersed in the ionic liquid, the supporting seat is arranged on the box body and keeps sliding sealing fit with the box body, the photoelectric layer is arranged at the inner side end of the supporting seat, the light-operated conducting layer faces the molding surface of the molding rotary drum and corresponds to the molding surface of the molding rotary drum, the light-operated conducting layer and the forming rotary drum are filled with ionic liquid, one pole of the power supply is electrically connected with the forming rotary drum, the other pole of the power supply is electrically connected with the transparent conducting layer, and light beams can selectively irradiate the light-operated conducting layer from the outer side of the photoelectric layer through the transparent conducting layer.

The negative electrode of the power supply is electrically connected with the forming rotary drum, the positive electrode of the power supply is electrically connected with the transparent conducting layer of the photoelectric layer, and the light beam can selectively irradiate the light-controlled conducting layer through the transparent conducting layer and carry out selective electrodeposition on the forming surface of the forming rotary drum to form a deposition model with a controllable shape.

Thirdly, the technical scheme adopted by the invention for solving the technical problems is to provide a processing device based on an electric field, which comprises a forming rotary drum, a photoelectric layer and a power supply, wherein the forming rotary drum can rotate along a central axis and can conduct electricity, the photoelectric layer comprises a light control conducting layer and a transparent conducting layer which are mutually combined into an inner layer and an outer layer, the inner part of the photoelectric layer is hollow, the forming rotary drum is arranged in the photoelectric layer and forms a gap flow channel of ionic liquid with the photoelectric layer, the gap flow channel is filled with ionic liquid, the forming rotary drum is at least partially immersed in the ionic liquid, the negative electrode of the power supply is electrically connected with the forming rotary drum, the positive electrode of the power supply is electrically connected with the transparent conducting layer, light beams can selectively irradiate the light-operated conducting layer from the outer side of the photoelectric layer through the transparent conducting layer and carry out selective electrodeposition on the forming surface of the forming rotary drum to obtain a deposition model with a controllable shape, and the deposition model is peeled along the forming surface of the forming rotary drum to form a forming foil.

Also included are guide rollers for guiding the fibers into the forming surface of the forming drum, the fibers being integrated into the forming foil with the electrodeposition process.

The photoelectric layer is in the shape of an arc curved surface which is coaxial with the forming rotary drum, and the thickness of a gap flow channel between the photoelectric layer and the forming rotary drum is uniform and consistent.

And the opposite sides of the photoelectric layer are respectively provided with an ionic liquid input port and an ionic liquid output port, and the ionic liquid is input through the ionic liquid input port, flows along the gap flow channel and is output from the ionic liquid output port.

The forming drum is a drum-shaped second photoelectric layer, the second photoelectric layer comprises a second transparent conducting layer and a second light-operated conducting layer, the inner layer and the outer layer of the second photoelectric layer are mutually combined, the negative electrode of the power supply is electrically connected with the second transparent conducting layer, a second light beam penetrates through the second transparent conducting layer from the inside of the forming drum to selectively irradiate the second light-operated conducting layer, and the shape-controllable electrodeposition is carried out on the forming surface of the forming drum to form a deposition model.

The electric field-based processing device comprises a plurality of stages, a forming rotary drum of a first-stage electric field-based processing device forms continuous forming foil, the forming foil sequentially passes through a lower-stage electric field-based processing device through roller guiding and is attached and wound with the forming rotary drum of the lower-stage electric field-based processing device, and selective electrodeposition processing is continuously carried out on the forming foil through the lower-stage electric field-based processing device.

Fourthly, the technical proposal adopted by the invention to solve the technical problem is to provide a processing device based on an electric field, which comprises a forming rotary drum, a power supply and an anode plate, the forming drum is a drum-shaped photoelectric layer, the photoelectric layer comprises a transparent conducting layer and a light-control conducting layer, the inner layer and the outer layer are mutually combined, the anode plate corresponds to the molding surface of the molding drum and ionic liquid is filled between the anode plate and the molding drum, the forming drum is rotatably and at least partially immersed in the ionic liquid, the negative electrode of the power supply is electrically connected with the transparent conducting layer, the positive electrode of the power supply is electrically connected with the positive plate, the light beam can selectively irradiate the light-controlled conducting layer from the inside of the forming drum through the transparent conducting layer and carry out selective electrodeposition on the forming surface of the forming drum to obtain a deposition model with a controllable shape, and the deposition model is peeled off along the forming surface of the forming drum to form a forming foil.

The light beam selectively irradiates the light control conductive layer and carries out selective electrodeposition on the peripheral surface of the anisotropic conductive layer to obtain a deposition model with a controllable shape, and the deposition model is peeled off along the tangential direction of the peripheral surface of the anisotropic conductive layer to form a molding foil;

or the device also comprises a conductive film which is partially wound on the forming drum in the ionic liquid and is conveyed along with the rotation of the forming drum, the conductive film is anisotropic conductive, and the light beam selectively irradiates the light-controlled conductive layer and selectively electrodeposits on the surface of the conductive film, which is far away from the photoelectric layer, to form the forming foil with controllable shape.

Fifthly, the technical scheme adopted by the invention for solving the technical problems is to provide a processing device based on an electric field, which comprises a forming rotary drum, a conductive film, a power supply and an anode plate, the forming drum is a drum-shaped transparent conductive layer, the anode plate corresponds to the outer side surface of the forming drum and ionic liquid is filled between the anode plate and the forming drum, the forming drum is rotatably and at least partially immersed in the ionic liquid, the conductive film is partially attached to the forming drum in the ionic liquid and is conveyed along with the rotation of the forming drum, the light beam from the inside of the forming drum can selectively irradiate the conductive film through the transparent conductive layer and selectively carry out electrodeposition on the irradiated surface of the conductive film to form a forming foil with a controllable shape.

The forming foil with the composite structure is obtained by separating the conductive film after the base material is combined with the forming foil.

Or the double-sided composite structure forming foil is obtained by separating the conductive film after the forming foils formed by the processing devices based on the electric field on the two sides are combined with the two sides of the base material through the compression roller.

Sixthly, the technical scheme adopted by the invention for solving the technical problems is to provide an electric field-based processing device, which comprises a forming drum, a conductive film, a transparent conductive layer and a power supply, wherein the forming drum is of a rotatable and conductive structure, the transparent conductive layer is hollow, the forming drum is arranged in the transparent conductive layer and forms an ionic liquid gap flow channel with the transparent conductive layer, flowable ionic liquid is filled in the gap flow channel, the forming drum is at least partially immersed in the ionic liquid, the conductive film is partially attached to the forming drum in the ionic liquid and is conveyed along with the rotation of the forming drum, the conductive film is a light-operated conductive layer, the negative electrode of the power supply is electrically connected with the forming drum, the positive electrode of the power supply is electrically connected with the transparent conductive layer, light beams can selectively irradiate the conductive film from the outer side of the transparent conductive layer through the transparent conductive layer and the ionic liquid and carry out shape-controllable electrodeposition on the irradiated surface of the conductive film to form a forming drum, and light beams can selectively irradiate the conductive layer through the transparent conductive layer and the ionic liquid A foil.

Seventh, an embodiment of the present invention to solve the above problems provides an electric field based processing method using the electric field based processing apparatus related to electrodeposition in the first, second, third, or fourth aspects, including:

(1) controlling the forming drum to rotate around the central axis thereof;

(2) according to the shape information of a preprocessed deposition model and the corner information of a forming rotary drum, a light beam is controlled through an algorithm to selectively irradiate the light-operated conductive layer through the transparent conductive layer, selective electrodeposition is carried out on the forming surface of the forming rotary drum to form the deposition model with a controllable shape, and the irradiation intensity distribution and/or the effective irradiation time distribution of the light beam can be controlled through the algorithm to control the deposition thickness of different positions of a deposition model layer pattern;

(3) the deposition pattern rotates with the forming drum and is peeled from the forming surface of the forming drum to form a forming foil.

Eighth, the present invention provides a processing method by an electric field using the processing apparatus by an electric field according to the first or second aspect, which includes:

(1) controlling the forming drum to rotate around the central axis thereof;

(2) according to the shape information of the preprocessed etching groove and the corner information of the forming rotary drum, the light beam is controlled by an algorithm to selectively irradiate the light-operated conductive layer through the transparent conductive layer, selective electric etching is carried out on the forming surface of the forming rotary drum to form the etching groove with the controllable shape, and the etching depths of different positions of the etching groove can be controlled by controlling the irradiation intensity distribution and/or the effective irradiation time distribution of the light beam by the algorithm.

Advantageous effects

First, in the present invention, the light control conductive layer (or the light control conductive film) is selectively illuminated, so that the illuminated region of the light control conductive layer forms an electrically conductive region, and an electrode pattern with a controllable shape can be obtained on the light control conductive layer, and a localized electric field with a controllable shape is formed in an ionic liquid or an ionic liquid layer near the molding surface of the rotating molding drum, thereby realizing flexible and accurate selective electrodeposition additive manufacturing or selective electrolytic etching. The rotary forming drum can be used for continuous rotation and continuous electro-deposition or electro-etching, has no reciprocating motion process, is more suitable for forming parts with circumferential characteristics, or etching patterns on the surfaces of shaft parts, or selectively generating forming foils with set patterns or thickness distribution by electro-deposition, and has the advantages of high forming precision, high forming speed and flexible and convenient application. The rotation of the forming rotary drum is also beneficial to the renewal and flow of the ionic liquid and the improvement of the efficiency of the electrodeposition and the electroetching.

Secondly, the invention can be set as that a plurality of processing devices based on the electric field work in a cascade way, or the processing devices based on the electric field are matched with a light curing mechanism or a compression roller for combining the base material, or a plurality of forming heads work in a matching and cascade way, thereby not only improving the forming processing speed of the forming model or the forming foil, but also realizing the forming manufacture of a complex structure model or the forming foil, and also realizing the forming manufacture of a composite model or a composite forming foil of different materials (heterogeneous materials), for example, the manufacture of a heterogeneous material metal model or a composite material forming foil combining different metal materials can be realized, and the electrodeposition and the electroetching processes can be combined with each other, thereby realizing the manufacture of complex forming foil patterns or forming foils with set convex structures more accurately and flexibly.

Thirdly, the forming foil with set patterns can be quickly formed through the rotation of the forming drum, and the forming foil can be formed on a conductive film which is pasted and wound on the forming drum, so that the transfer of the forming foil is facilitated, and the process method is simple and does not need to customize corresponding dies, anodes or negative plates and the like. Other base materials such as a resin film can be further combined with a forming foil (such as a copper foil) with a preset pattern or thickness distribution to form a rigid circuit board or a flexible printed circuit board, and a circuit board with a set conducting circuit on one side or two sides can be formed.

Drawings

FIG. 1 is a schematic diagram of the selective electrodeposition principle of the present invention.

Fig. 2 is a schematic sectional view taken along line a-a in fig. 1.

FIG. 3 is a schematic diagram of the principle of selective electrodeposition using multiple forming heads.

FIG. 4 is a schematic diagram of the principle of selective electrodeposition using a light-controlled electrolytic head.

FIG. 5 is a schematic diagram of the selective electrolytic etching principle of the present invention.

Fig. 6 is a schematic cross-sectional view taken along line B-B in fig. 5.

FIG. 7 is a schematic view of a photovoltaic layer selectively electrodepositing a forming foil on a forming drum.

FIG. 8 is a schematic representation of the selective electrodeposition of a plurality of photovoltaic layers on a forming drum to form a composite forming foil.

FIG. 9 is a schematic view of a selective electrodeposition forming foil with the forming drum disposed as a photovoltaic layer.

Fig. 10 is a schematic cross-sectional view taken along line C-C in fig. 9.

Fig. 11 is a schematic view of the selective electrodeposition of a forming foil on a forming drum through an arcuate photovoltaic layer.

Fig. 12 is a schematic cross-sectional view taken along line D-D in fig. 11.

FIG. 13 is a schematic diagram of a dual electro-optical layer implementation of selective electrodeposition of a molding foil.

FIG. 14 is a schematic illustration of selective electrodeposition of a formed foil by a plurality of electric field based processing devices.

FIG. 15 is a schematic illustration of a selectively electrodeposited shaped foil bonded to a substrate and further selectively electroetched.

Fig. 16 is a schematic cross-sectional view taken along line E-E in fig. 15.

FIG. 17 is a schematic illustration of another alternative selectively electrodeposited shaped foil bonded to a substrate and further selectively electroetched.

Fig. 18 is a schematic sectional view taken along line F-F in fig. 17.

FIG. 19 is a schematic illustration of simultaneous selective bonding of photocurable resin on a selectively electrodeposited forming foil.

FIG. 20 is a schematic illustration of a plurality of electric field based processing devices performing electrodeposition and electroetching in combination to form a selectively patterned foil.

Fig. 21 is a schematic sectional view taken along line G-G in fig. 20.

FIG. 22 is a schematic illustration of a selectively electrodeposited shaped foil bonded to a substrate and further selectively electrodeposited.

FIG. 23 is a schematic illustration of forming a fiber reinforced composite structure forming foil.

FIG. 24 is a schematic view of the substrate on both sides respectively bonded to selectively electrodeposited forming foils.

FIG. 25 is a schematic view of both sides of a substrate being bonded to selectively electrodeposited molding foils, respectively, and further being electroetched.

Fig. 26 is a partially enlarged view of the portion X in fig. 25.

Fig. 27 is a schematic diagram based on selective electrodeposition on a conductive film.

Fig. 28 is a schematic view of a conductive film which is an anisotropic conductive material.

Fig. 29 is a schematic diagram of selective electrodeposition on a light control conductive film.

Fig. 30 is a schematic diagram of another embodiment based on selective electrodeposition on a light control conductive film.

FIG. 31 is a schematic sectional view taken along line H-H in FIG. 30.

Fig. 32 is a schematic view of a transfer of a shaped foil from a conductive film to a substrate.

Fig. 33 is a schematic view of an embodiment in which the two-sided formed foil is transferred from the conductive film to both sides of the substrate.

Fig. 34 is a schematic view of a method of controlling a beam irradiation pattern, an irradiation intensity distribution, and an irradiation time distribution.

Detailed Description

The invention will be further illustrated with reference to the following specific examples. It should be understood that these examples are for illustrative purposes only and are not intended to limit the scope of the present invention. Further, it should be understood that various changes or modifications of the present invention may be made by those skilled in the art after reading the teaching of the present invention, and such equivalents may fall within the scope of the present invention as defined in the appended claims.

Fig. 1 and 2 illustrate a method and a forming apparatus for selective electrodeposition forming on a rotating forming drum 1, comprising a forming drum 1, a forming head, a power source 6, wherein the forming head comprises a drum-shaped photoelectric layer 2 and a box 31, an ionic liquid 3 is arranged in the box 31, the drum-shaped photoelectric layer 2 comprises a transparent conductive layer 21 and a light control conductive layer 22 attached to the outer side of the transparent conductive layer 21, the transparent conductive layer 21 can transmit a light beam 51 (i.e. electromagnetic waves with a certain wavelength) and can conduct electricity, the light control conductive layer 22 is non-conductive or has a large resistance under the condition of no light beam irradiation, and the conductivity or resistivity of the position irradiated by the light beam is reduced. The photovoltaic layer 2 is partially immersed in the ionic liquid 3 and can rotate about the axis 76 in the direction of arrow 92 (but can of course also rotate in the opposite direction to arrow 92). The forming surface of the forming drum 1 is electrically conductive and the forming surface of the forming drum 1 refers to the surface of the bonding deposition pattern 41, as shown in the figure the outer surface of the forming drum 1, and the forming drum 1 or the forming surface of the forming drum 1 is rotatable around the axis 75, for example in the direction indicated by arrow 91, but may of course also be rotatable in the opposite direction indicated by arrow 91. The forming surface of the forming drum 1 and the photoelectric layer 2 are correspondingly arranged in parallel and matched, and the rotation central axes of the forming drum and the photoelectric layer are approximately parallel. The negative pole of the power source 6 is electrically connected to the forming drum 1, that is to say possibly to the forming surface of the forming drum, and the positive pole of the power source 6 is electrically connected to the transparent conductive layer 21 of the photovoltaic layer 2. The power supply 6 may be a dc power supply or a pulse power supply, and may be a power supply with adjustable output voltage or current, such as a digital power supply. Of course, a switch or the like may be provided in the electrical circuit, and a current detector 61 may be further included for detecting the current of the electrodeposition process, so that the illumination, rotation, movement, or the like of the apparatus can be controlled in combination with the fed-back current signal. The head illustrated in fig. 2 may also comprise a light source 5, for example, the light source 5 is arranged inside the drum-shaped photovoltaic layer 2 and is selectively operated according to the pattern to be deposited to emit a light beam 51 that selectively illuminates the photoconductive layer 22 through the transparent conductive layer 21 in the direction of the forming drum 1, and the light source 5 may also be arranged outside the photovoltaic layer 2 and may adjust the light beam 51 to the inside of the photovoltaic layer 2 by means of a mirror assembly. The light source 5 may be an LED array light source, or an LCD light source, and in other embodiments may also be a DLP light source, or a laser scanning light source.

During the electrodeposition forming process, the ionic liquid 3 attached to the surface of the photovoltaic layer 2 is brought above the photovoltaic layer 2, i.e., at a position between the photovoltaic layer 2 and the forming drum 1, to form an ionic liquid layer 39, and the distance between the forming drum 1 and the drum-like photovoltaic layer 2 is adjusted so that the forming drum 1 or the deposition pattern 41 on the forming drum 1 is in contact with the ionic liquid layer 39, during the rotation of the photovoltaic layer 2 about the axis 76. According to the layer pattern of the pre-electrodeposition deposition pattern and the position of the forming drum 1 rotating around the axis 75, the light beam 51 emitted by the light source 5 forms an irradiation arrangement or pattern, the light beam 51 selectively irradiates the light-operated conductive layer 22 through the transparent conductive layer 21 in the direction of the forming drum 1, the light-operated conductive layer 22 at the irradiation is conductive, and forms a loop with the power source 6 through the transparent conductive layer 21 and the ion liquid layer 39, the deposition pattern 41, and the forming drum 1, a localized electric field is formed in the ion liquid layer 39 between the photoelectric layer 2 and the forming drum 1, and ions in the ion liquid layer 39 move to the deposition pattern 41 for electrodeposition, forming an electrodeposition forming layer. Meanwhile, due to the rotation of the photoelectric layer 2, new ionic liquid 3 is continuously driven between the photoelectric layer 2 and the deposition model 4, and new ionic liquid and ions are supplemented, so that the electrodeposition process is continuously carried out. As the forming drum 1 is rotated about axis 75, the beam 51 dynamically adjusts the illumination pattern on the photoconductive layer 22 based on the layer electrodeposition forming pattern and the information on the angle of rotation of the forming drum 1 about axis 75, the conductive pattern or line arrangement pattern on the photoconductive layer 22 being dynamically adjusted, thereby electrodepositing ions in the ionic liquid 3 onto the forming drum 1 or deposition model 41 in a preformed pattern. If only one layer of electrodeposition is required, the electrodeposition forming is completed, and if a plurality of layers of electrodeposition are required, after completion of the electrodeposition forming of one layer, the forming drum 1 can be moved by a set distance along the arrow 93, but of course the photovoltaic layer 2 can also be moved by a set distance in the opposite direction to the arrow 93, so as to achieve a relative movement between the forming drum 1 and the photovoltaic layer 2, and then the photovoltaic layer 2 is subjected to selective electrodeposition of the next layer. This process is repeated until the entire deposition pattern 41 is finished with electrodeposition molding. The ionic liquid layer 39 is in contact with the forming surface of the forming drum 1 or with the deposition former 41 to remain electrically connected to the forming surface of the forming drum 1 and is initially in contact with the ionic liquid layer 39 with the forming surface of the forming drum 1, it being possible for the ionic liquid layer 39 to be in contact with only the deposition former 41 after the formation of the deposition former 41. The continuous relative movement between the forming drum 1 and the photovoltaic layer 2, for example the continuous movement of the forming drum 1 along arrow 93, during the rotation of the forming drum 1 about the axis 75, allows the successive winding and stacking of the electrodeposited layer on the forming drum 1, and the formation of the deposition pattern 41 more quickly and accurately. The adoption of the rotation of the forming rotary drum 1 for electrodeposition can realize the continuous electrodeposition in the continuous rotation process of the forming rotary drum 1, namely, the electrodeposition speed can be improved, and because of no reciprocating motion process, the rotation angle and the position relation between the forming rotary drum 1 and the photoelectric layer 2 are easier to accurately control the translational motion, and the improvement of the precision of a deposition model is also facilitated.

FIG. 3 illustrates that multiple molding heads can also be used to simultaneously perform electrodeposition molding. For example, the forming head a comprises the photovoltaic layer 2a and the box 31a, and the forming head B comprises the photovoltaic layer 2B and the box 31B. The former head a electrodeposits on the forming drum 1 to form the model part 41a, the former head B electrodeposits on the forming drum 1 to form the model part 41B, the materials of the model part 41a and the model part 41B may be the same, the electrodeposition deposition rate may be increased by the two former heads, and the materials of the model part 41a and the model part 41B may be different, to form a forming model of a composite material (heterogeneous material). It is also shown that a scraper 32 may be further arranged in the forming head a and fixed on the inner side of the ionic liquid tank 31, and the photoelectric layer 2 is positioned in the ionic liquid 3, for example, may be arranged at the position farthest away from the die forming platform 1 around the photoelectric layer 2. The scraper 32 keeps a tiny gap or sliding fit with the photoelectric layer 2, separates the ionic liquid with low ionic concentration after electrochemistry from the ionic liquid with high concentration in an ionic liquid box, and can lead a low-concentration ionic liquid area (such as the ionic liquid above the scraper 32 in fig. 3) to an ionic liquid supplementing device 33 through a return pipeline, and then flows into a high-concentration ionic liquid area (the area below the scraper 32 in fig. 3) through an ionic liquid supplementing pipeline, so as to supplement the electrolytic liquid for electrodeposition. In addition, an ion liquid wheel 34 can be arranged in the box body 31B of the forming head B, the ion liquid wheel 34 can rotate and keep a proper distance with the photoelectric layer 2B, and the replacement of the ion liquid layer 39B on the surface of the photoelectric layer 2B is quickened.

FIG. 4 shows that electrodeposition can also be performed simultaneously using multiple photo-controlled electrolytic heads. For example, the light-operated electrolytic head comprises a photoelectric layer 2 and a supporting seat 56, the light-operated electrolytic head is arranged on a box body 31, a forming drum 1 is arranged in the box body 31 and rotates along an arrow 91, and an ionic liquid 3 is arranged in the box body 31. During electrodeposition, the light beam 51 irradiates the photoconductive layer 22 through the transparent conductive layer 21, and forms an electrodeposition pattern 41 with the rotation of the forming drum 1. If multiple layers are to be deposited, the photo-controlled electrolytic head can be moved along arrow 92, i.e. the support seat 56 can be held in sliding sealing engagement with the tank 31. It is also possible to arrange a plurality of light-operated electrolysis heads (4 as schematically shown) to increase the electrodeposition rate. In addition, the fibers 85 can be added in the electrodeposition process, for example, carbon fiber materials are used, and the fibers 85 are integrated into the forming mold 41 in the electrodeposition process, so that the strength of the forming mold 41 is improved. In the figure, the negative electrode of the power supply 6 is schematically electrically connected to the forming drum 1, and the positive electrode is electrically connected to the transparent conductive layer 21 of each photo-controlled electrolytic head. The embodiments described above are particularly suitable for the formation of circular or annular parts or parts having a circumferential array of features, such as hubs, shafts, tubes, springs or propellers.

If the electrodes of the power source 6 in the embodiment shown in fig. 1 to 4 are reversed and the ionic liquid 3 is replaced by an etching electrolyte, it can also be used to electroetch the surface of the mold. An electrochemical-based selective electroetching apparatus, such as the structure for electrolytically forming etched grooves 49 in the forming drum 1, is schematically shown in fig. 5 and 6. In contrast to the electrodeposition device, in the electroetching device the positive pole of the power source 6 is electrically connected to the forming drum 1 and the negative pole of the power source 6 is electrically connected to the transparent conductive layer 21 of the photovoltaic layer 2. According to the groove pattern information, a light beam 51 selectively irradiates the photoconductive layer 22 through the transparent conductive layer 21 towards the forming drum 1, forming an electrode arrangement or electrode pattern, forming a localized electric field between the photovoltaic layer 2 and the forming drum 1, selectively electrolytically etching, and etching on the forming drum 1 with the rotation of the forming drum 1 about the axis 75 to form predetermined etching grooves 49. The rotation of the photoelectric layer 2 along the arrow 92 takes away the high-concentration ion liquid layer 39 and replenishes it with a new low-concentration ion liquid, ensuring that the electrochemical etching continues. The light control conductive layer 22 illustrated in fig. 6 may also be formed of a PN structure including an N-type semiconductor layer 222 and a P-type semiconductor layer 221. The P-type semiconductor layer 222 is attached to the transparent conductive layer 21, the N-type semiconductor layer 221 is electrically connected to the ionic liquid 3, for example, the N-type semiconductor layer 221 is electrically connected in a contact manner, or a conductive protection layer is disposed on the surface of the N-type semiconductor layer 221, and the protection layer is contacted with the ionic liquid 3 to achieve connection conduction. In FIG. 5, the scraper 32 and the ion replenishment device 33 in FIG. 3 can be used to form an ion replenishment circuit (not shown) for replenishing the electrolytic solution for electroetching.

Fig. 7 illustrates that the previously described embodiment can also be used for producing a forming foil having a predetermined pattern or layer thickness profile, the forming drum 1 being rotated along arrow 91 during electrodeposition, the electro-optical layer 2 being rotated to form the ionic liquid layer 39, the ionic liquid layer 39 being brought into contact with the forming drum 1, selective irradiation of the light beam 51 forming the forming foil 42 of the predetermined pattern and the predetermined thickness profile on the forming drum 1. The formed foil 42 is then peeled off from the tangential direction of the forming surface of the forming drum 1 to produce the final formed foil. The forming drum 1 corresponds to the cathode roll in the foil electrolysis process and can be a smooth-surfaced stainless steel or titanium drum. By adopting the embodiment, the formed foil with the set pattern and the set thickness distribution can be realized, and the electrodeposition is carried out through the ionic liquid layer 39, the non-deposition area is not contacted with the ionic liquid 3, so that unnecessary electrodeposition can be better avoided, the thickness and the pattern distribution of the formed foil can be more accurately controlled, the forming rotary drum 1 is not required to be immersed in the ionic liquid 3 in the electrodeposition process, the structure of the device can be simplified, the application of the ionic liquid 3 can be reduced, and the equipment cost can be favorably reduced. Cleaning devices 69, such as showering and drying devices, may also be provided to surface treat the shaped foil 42.

Figure 8 illustrates the electrodeposition of the forming foil 42 using the apparatus shown in figure 3. The forming head a selectively electrodeposits the formed foil portions 42a on the forming drum 1 and the forming head B selectively electrodeposits the formed foil portions 42B on the forming drum 1. The shaped

foil portions

42a and 42b may be the same material, may increase the shaped foil electrodeposition rate, or may be different, and may form a shaped foil of a composite material (heterogeneous material).

Fig. 9 and 10 show that the forming drum 1 is made of an electrically conductive layer 2, the outer surface of the drum-shaped electrically conductive layer 2 forming the forming surface of the forming drum 1, and the photovoltaic layer 2 comprises a light control conductive layer 22 and a transparent conductive layer 21, the inner and outer layers of which are bonded to each other. The forming surface of the forming drum 1 is at least partially immersed in the ionic liquid 3, and an anode plate 62 is also arranged in the ionic liquid 3. The positive electrode of the power supply 6 is electrically connected to the anode plate 62, and the negative electrode is electrically connected to the transparent conductive layer 21. The forming surface of the forming drum 1 is rotated according to arrow 91 while the light beam 51 selectively irradiates the photoconduction layer 22 through the transparent conductive layer 21, a localized electric field is formed between the anode plates 62 on the forming surface of the forming drum 1, a forming foil 42 with a set pattern is selectively electrodeposited on the forming surface of the forming drum 1, and the forming foil 42 is preferably peeled off from the forming surface of the forming drum 1 in a tangential direction of the forming surface to produce a final forming foil. Compared to the solution shown in fig. 7 or fig. 11, the present embodiment allows a selective electrodeposition of the forming foil to be achieved more accurately and at a faster electrodeposition rate than the solution shown in fig. 7, since the light beam 51 can be directly irradiated on the forming surface of the forming drum 1 to form the selectively conductive electrode pattern. The ionic liquid 3 may also flow along the bold arrows 95 so that the ionic liquid between the anode plate 62 and the forming surface of the forming drum 1 is rapidly flowed and replaced. The optimal anode plate 62 is in a circular arc shape concentrically arranged with the molding surface of the molding drum 1, and the gap between the anode plate 62 and the molding surface of the molding drum 1 is uniform and consistent. Fig. 10 illustrates that the light control conductive layer 22 may also be formed of a PN structure, and includes an N-type semiconductor layer 222 and a P-type semiconductor layer 221, where the N-type semiconductor layer 222 is electrically connected to the ionic liquid 3, and the P-type semiconductor layer 221 is attached to the transparent conductive layer 21. Of course, other materials may be used for the light control conductive layer 22, such as a layer of light guiding material. The anode plate 62 may be an insoluble anode, for example, a lead-antimony alloy (or a lead-silver alloy), using titanium. The anode plate 62 may be made of a metal material corresponding to ions in the ionic liquid 3. In addition, an anisotropic conductive layer (not shown) may be further disposed on the molding surface of the molding drum 1, that is, a conductive material with anisotropic conductive property is used, and is conductive in a direction perpendicular to the surface of the anisotropic conductive layer and non-conductive in a direction parallel to the anisotropic conductive layer, for example, an anisotropic conductive adhesive or film (ACA, ACP) is used, and the molding foil 42 is deposited on the surface of the anisotropic conductive layer, so as to protect the light control conductive layer 22 and facilitate the peeling of the molding foil 42.

Fig. 11 and 12 show that the forming drum 1 is arranged inside the photovoltaic layer 2 and the ionic liquid 3 is arranged inside the photovoltaic layer 2, the forming drum 1 is at least partially immersed in the ionic liquid 3, and the opposite sides of the photovoltaic layer 2 are respectively provided with an ionic liquid inlet 35 and an ionic liquid outlet 36, so that the ionic liquid 3 can flow along an arrow 95 in the gap between the photovoltaic layer 2 and the forming drum 1, and the gap between the photovoltaic layer 2 and the forming drum 1 corresponds to the ionic liquid 3 in the path where the illumination exists and is constantly renewed. The optimal photoelectric layer 2 is in a circular arc shape coaxially arranged with the forming rotary drum 1, and the gaps between the forming rotary drum 1 and the photoelectric layer 2 are uniform and consistent. The positive electrode of the power supply 6 is electrically connected to the transparent conductive layer 21, and the negative electrode is electrically connected to the forming drum 1. The forming drum 1 is rotated about the axis 75 in the direction of arrow 91 while the light beam 51 selectively irradiates the light controlling conductive layer 22 through the transparent conductive layer 21 towards the forming drum 1, forming a localized electric field between the photovoltaic layer 2 and the forming drum 1, selectively electrodepositing a forming foil 42 in a set pattern on the forming surface of the forming drum 1, and then peeling the forming foil 42 from the forming surface of the forming drum 1 to form a final forming foil, for example, optimally in a tangential direction along the forming surface, reducing stress. Compared with the example shown in fig. 7, in this embodiment, since the photoelectric layer 2 surrounds the forming drum 1, more light beams 51 can be irradiated simultaneously, and selective electrodeposition with a larger area can be realized, so that a faster electrodeposition speed can be realized. Compared with the embodiment shown in fig. 9, in this embodiment, since the photoelectric layer 2 surrounds the forming drum 1 at the outer side, the light source can be disposed at the outer side of the photoelectric layer 2, the arrangement and the heat dissipation are more convenient, and the forming foil 42 is not in contact with the photoelectric layer 2, which is more beneficial to prolonging the service life of the photoelectric layer 2. Fig. 12 shows that the light-controlling conductive layer 22 may also be formed by using a PN junction, for example, including a P-type semiconductor layer 221 and an N-type semiconductor layer 222, where the P-type semiconductor layer 221 may be an array structure and is electrically connected to the ionic liquid 3, and the N-type semiconductor layer 222 may be attached to the transparent conductive layer 21. Of course, other materials, such as light guiding materials, may be used for the light controlling conductive layer 22. The forming foil 42 typically comprises a glossy surface, which is the surface of the forming foil 42 that is to be joined to the forming surface of the forming drum 1, and a matte surface, which is the other side of the forming foil 42. The drawings show that the rough surface side of the formed foil 42 can be formed with a concavo-convex shape to realize different thickness distributions of the formed foil 42. The periphery selective electrodeposition of the whole forming drum 1 can be realized by utilizing the small area of the light guide layer 2 or the light irradiation area along with the rotation of the forming drum 1, the deposited deposition model can be taken down while the periphery selective electrodeposition of the forming drum 1 is carried out, more efficient processing of the deposition model can be realized, the rotation of the forming drum 1 is also beneficial to driving the flow and the replacement of the ionic liquid, and the acceleration of the electrodeposition speed is facilitated. This solution can also be used to dynamically adjust the irradiation pattern of the beam 51 with the rotation of the forming drum in the control manner shown in fig. 34.

Fig. 13 illustrates that a mask 55 having a predetermined pattern of light-transmitting areas 55a is laid on the surface of the transparent conductive layer 21, for example, in fig. 13, the mask 55 is disposed on the inner side of the transparent conductive layer 21, and the area of the mask 55 outside the light-transmitting areas 55a is an opaque area, so that the light beam 51a is not necessarily a light beam for selective irradiation, and the light beam 51a forms a predetermined illumination pattern through the light-transmitting areas 55a of the mask 55 to realize selective irradiation on the photoconductive layer 22, so that a light source or a photo control system for selective irradiation is not necessary, which can greatly reduce the cost, and is suitable for multiple repeated production of standard patterns. The anode 62 of fig. 9 may be employed in fig. 13, and the positive electrode of the power source 6 may be electrically connected to the anode 62. In further combination with the solution shown in fig. 11, the anode 62 is replaced by a photoelectric layer 2b surrounding the outside to form a double photoelectric layer structure, the ionic liquid 3 is disposed between the photoelectric layer 2 and the photoelectric layer 2b, and the forming surface of the forming drum 1 rotates along arrow 91. By adopting the embodiment, high-precision electrodeposition can be realized, and the electrodeposition speed is improved. Of course, in fig. 13, the mask 55 may not be used, and the light beam 51a may be selectively irradiated similarly to fig. 9. A mask 55 having a predetermined pattern of light-transmitting regions 55a may also be applied to the outer surface of the transparent conductive layer 21b, so that the light beam 51b does not need to be a light source or light control system for selective illumination.

Figure 14 illustrates that multiple electric field based processing devices can also be used in tandem operation. For example, a first electric-field-based processing device includes the forming drum 1a, the photovoltaic layer 2a, and the power source 6a, and a second electric-field-based processing device includes the forming drum 1b, the photovoltaic layer 2b, and the power source 6 b. The first electric field based processing device forms the shaped foil sections 42a, the shaped foil 42a is supported by rollers 71 to be conveyed to the second electric field based processing device where the shaped foil sections 42b are successively formed by electrodeposition. The rough surface of the forming foil 42a is schematically shown in contact with the forming drum 1b and the forming foil portion 42b is electrodeposited on the smooth side. The shaped

foil portions

42a and 42b may be the same material, multiple electric field-based processing devices may increase the speed of shaped foil production, the shaped

foil portions

42a and 42b may be different materials, and a composite (heterogeneous) shaped foil may be formed. A formed foil cleaning or surface treatment device (not shown) may also be provided between the first and second electric field based processing devices to clean the formed foil surface prior to electrodeposition of the formed foil portions 42 b. Of course, the polarity reversal of the power source 6b of the second electric field-based machining device can also be used for selective etching of the shaped foil 42a, for example for etching of the smooth side of the shaped foil 42 a. In addition, the ionic liquid 3b in the second electric field-based processing apparatus may also be an electrophoretic liquid, and may be used, for example, to form the insulating layer 42b with a controllable shape on the molding foil 42a by selective electrophoretic deposition.

Fig. 15 illustrates that the substrate 81 may also be bonded to a shaped foil 42, such as a shaped foil that may form a composite structure that combines insulation and conduction. The substrate 81 may be a resin film material, an insulating film material, or another film material. The pressing roller 72 presses the base material 81 and the forming foil 42, and the base material 81 or the forming foil 42 can be heated in the pressing process, so that the bonding tightness is improved. The substrate 81 is shown to be bonded to the rough surface of the shaped foil 42, and the portions having different protrusions are bonded to the substrate 81, so that the bonding strength between the shaped foil 42 and the substrate 81 can be enhanced, and a certain conductive structure can be formed in the substrate 81. The smooth exposure of the composite structured profile foil 42 may better engage the roller 71. The figure further shows that an electric field-based processing device may be provided, and the base material side of the composite structured formed foil 42 is wound and bonded onto the forming drum 1b, and the formed foil 42 may be selectively etched electrically, and a groove pattern may be formed on the metal side of the composite structured formed foil, or the originally interconnected formed foils may be disconnected, such as the etched grooves 49 in fig. 16, to form a plurality of predetermined conductive paths. For example, if the forming foil 42 is a copper foil and the substrate 81 is an organic resin material, such as a glass fiber cloth-reinforced epoxy resin material, the forming foil with the composite structure can form a Printed Circuit Board (PCB) with a single-sided selective copper-clad function, and the circuit board not only realizes the arrangement of conductive circuits, but also can be set with different copper thicknesses according to the requirements of different conductive circuits, and the manufacturing process is simpler and more flexible than the conventional manufacturing process of the printed circuit board. In addition, in the process of forming the forming foil 42 by selective electrodeposition in the first electric field-based processing device, the metal layer of the portion to be cut off subsequently can be made as thin as possible, so that the subsequent etching time can be greatly shortened, the manufacturing efficiency of the printed circuit board can be improved, and the pollution can be reduced. Fig. 16 further illustrates that the light control conductive layer 22 includes an N-type semiconductor layer 222, a P-type semiconductor layer 221, and N-type electrodes 224 distributed in the P-type semiconductor layer 221 in an array, wherein the N-type electrodes 224 are electrically connected to the transparent conductive layer 21, and the N-type semiconductor layer 222 is electrically connected to the ionic liquid 3. The conductive layer 22 is equivalent to a phototransistor array, and can improve the response speed of the photoelectric layer 2 to the light beam 51, which is beneficial to improving the speed and precision of electrodeposition. The figure shows that the positive electrode of the power supply 6b of the second electric field based processing device is electrically connected to the forming foil 42 via the forming drum 1a, and the negative electrode is electrically connected to the transparent conductive layer 21b of the photovoltaic layer 2 b.

Fig. 17 illustrates that the shaped foil 42 formed by the electric field based processing device is treated by a cleaning or surface treatment device 69 and then a substrate 81 is bonded to the shaped foil 42 by a pressure roller 72, and then the shaped foil may also be selectively etched by the shaping head. The electric field based processing device comprises a forming drum 1, a photovoltaic layer 2a and a power supply 6a, and the forming head comprises a drum-like photovoltaic layer 2b partially immersed in an ionic liquid 3 and a box 31. The positive electrode of the power source 6b is electrically connected to the molding foil 42, and for example, the conductive roller 73 is electrically connected to the molding foil 42, and the negative electrode is electrically connected to the transparent conductive layer 21 of the photoelectric layer 2. The drum-shaped photoelectric layer 2b is rotated around the axis 76 to form the ion liquid layer 39, the ion liquid layer 39 is in contact with the molding foil 42, and the molding foil 42 is selectively etched by selective irradiation of the light beam 51b to form the etching groove 49, and as shown in fig. 18, the etching groove 49 can cut off the molding foil 42 to be connected, for example, a plurality of predetermined conductive traces can be formed. Compared with the embodiment shown in fig. 15, this embodiment can reduce the deformation of the molding foil of the composite structure, for example, for a rigid printed circuit board, the molding foil can pass through the molding head straight, and the problems of deformation of the molding foil of the composite structure or bonding failure caused by the substrate 81 and the molding foil 42 can be effectively avoided.

Fig. 19 illustrates that the electric field-based processing device further includes a photosensitive resin photocuring printing mechanism for selectively photocuring the combined photosensitive resin layer on the molding foil 42. The photosensitive resin photocuring printing mechanism as schematically shown in fig. 19 comprises a transparent drum 57, a feeder 83 and a light beam 51b, wherein the transparent drum 57 is correspondingly arranged in parallel and matched with the forming drum 1, the forming drum 1 rotates along an arrow 91, the transparent drum 57 rotates along an arrow 92, the rotation direction of the arrow 92 is opposite to the rotation direction of the arrow 91 in the embodiment, the feeder 83 is arranged outside the transparent drum 57 and is used for supplying the photosensitive resin 82 to the outer surface of the transparent drum 57 to form a photosensitive resin layer, the transparent drum 57 is brought into contact with the forming foil 42 between the transparent drum 57 and the forming drum 1 along with the rotation of the transparent drum 57, and the light beam 51b selectively irradiates the photosensitive resin 82 towards the forming drum 1 through the transparent drum 57, so that the photosensitive resin 82 is selectively cured and bonded to the forming foil 42 to form a forming foil with a composite structure of organic resin layers with preset patterns on the forming foil 42. A cleaning device 69 may also be provided for cleaning the molding foil 42 before the molding foil 42 is brought into contact with the photosensitive resin 82, which may facilitate enhancing the curing of the photosensitive resin 82 or the bonding strength with the molding foil 42.

The embodiment illustrated in fig. 20 is similar to the embodiment illustrated in fig. 14, the first electric field-based processing device forms the formed foil 42, the formed foil 42 is supported by a roller 71 and adjusted to be conveyed in the leftward direction in the drawing, the formed foil 42 enters the second electric field-based processing device, and the smooth surface is wound and contacted with the forming drum 1b, the second electric field-based processing device performs electro-etching on the rough surface of the formed foil 42 to form the etched grooves 49, or the surface of the formed foil 42 may be roughened. Of course, the opposite polarity of the power source 6b of the second electric field-based machining device can also be used for selective electrodeposition of the matte side of the forming foil 42. Fig. 21 is a cross-sectional view G-G of fig. 20, where the light control conductive layer 22 is schematically laminated to the transparent conductive layer 21 using a light guide material. Of course, the photoconductive layer 22 may have a PN junction structure.

Fig. 22 shows that the pressing roller 72 is provided on the basis of fig. 20 to bond the base material 81 and the smooth surface of the molding foil 42a to form a molding foil having a composite structure, but before bonding, a cleaning device 69a may be provided to clean or surface-treat the molding foil 42a to enhance the bonding strength between the molding foil 42a and the base material 81. The composite structured profile foil may then be further cleaned by a cleaning device 69b and fed into a second electric field-based processing device, which performs electrodeposition on the matte side of the composite structured profile foil 42 to form the profile foil portion 42b, and the ionic liquid 3b in the second electric field-based processing device may also be electrophoretic liquid, for example, which may be used to selectively perform electrophoretic deposition on the profile foil 42a to form the insulating layer 42b with a controllable shape. The second electric field based processing means can also be used to selectively etch the matte side of the shaped foil 42a if the polarity of the power source 6b is reversed. In addition, the composite structured mold foil of this embodiment is particularly suitable for flexible materials, such as flexible printed circuit boards and other composite structured mold foils, and this embodiment can also clean the mold foil 42a and further electroetch or electrodeposit the mold foil portion 42b by molding in a manner similar to that shown in fig. 17, so as to reduce the deformation of the composite structured mold foil, and for example, can be more suitable for the manufacture of rigid printed circuit boards. Generally, through the cascade cooperation work of a plurality of electric field-based processing devices or electric field-based processing devices and a forming head, the rough surface or the smooth surface of the formed foil can be selectively etched or further selectively electrodeposited, and the rough surface or the smooth surface of the formed foil can be combined with a base material or selectively solidified and combined with a photosensitive resin material to form the formed foil with a composite structure.

Fig. 23 further illustrates that other materials may be simultaneously bonded to both sides of the molding foil 42, for example, a base material 81 may be bonded to one side of the molding foil 42, and a resin material 82 may be selectively cured and bonded to the other side, or both sides of the molding foil 42 may be bonded to the base material 81, or both sides of the molding foil 82 may be selectively cured and bonded to form a molding foil having a composite structure, for example, a rigid printed circuit board or a flexible printed circuit board having an insulating layer on both sides. In addition, it is further possible to integrate fibers 85, such as carbon fiber material, during the electrodeposition of the formed foil 42, to further enhance the strength or other properties, such as electrical conductivity, thermal conductivity or electromagnetic radiation, of the formed foil 42 or the formed foil of the composite structure. Of course, the fibers 85 may also be introduced during the bonding of the molding foil 42 to the substrate 81, or the fibers 85 may be introduced during the selective curing of the photosensitive resin material 82 to the molding foil 42.

Fig. 24 illustrates 2 electric field-based processing devices respectively forming a forming foil 42a and a forming foil 42b, wherein the two forming foils are moved along the direction of arrow 93, a base material 81 is introduced between the two forming foils, the forming foil 42a, the base material 81 and the forming foil 42b are pressed together in a sandwich manner by rolling pressure (and possibly heating simultaneously) of a pair of press rollers 72, so as to form a forming foil with a composite structure having metal layers on both sides, and if the forming foil is a copper foil and the base material 81 is an insulating material, the forming foil with the composite structure on both sides can form a double-sided circuit board. Different from the traditional double-sided copper-clad plate, the double-sided copper layer in the embodiment can be selectively provided with patterns or copper thickness distribution, as shown by the forming foil of the composite structure in the figure. A cutter 89 may then be provided to cut the formed foil of the composite structure into composite boards, for example, a piece of double-sided copper-clad printed circuit board. It is also possible to subsequently etch the copper layer selectively on both sides. Of course, the thickness of the copper layer can be reduced at the position where selective etching is needed by adopting the embodiment, and the thickness of the copper layer part which needs to be reserved for conducting large current can be increased. The selective electroetching rate can be improved, and the conductive performance of the final printed circuit board can be improved.

The embodiments shown in fig. 25 and 26 are based on fig. 24 and show that a cleaning device 69a and a cleaning device 69b can be further added to clean or surface-treat the forming foil 42a and the forming foil 42b, respectively, and then the bonding strength is improved when the forming foil is bonded to the base material 81. For example, the photoelectric layer 2C of the forming head C selectively irradiates the forming foil 42a of the forming foil of the composite structure with a light beam 51C to selectively etch and form an etched groove 49C, the photoelectric layer 2D of the forming head D selectively irradiates the forming foil 42b of the forming foil of the composite structure with a light beam 51D to selectively etch and form an etched groove 49D, the etched groove 49C etches and breaks a part of the forming foil 42a to form a set circuit, and the etched groove 49D etches and breaks a part of the forming foil 42b to form a set circuit. The thickness of the metal layer can be made as thin as possible for the part needing to be etched and disconnected, and the etching speed can be improved. The thickness of the metal layer can be increased for the position needing to enhance the electric conduction capability. Alternatively, bumps may be formed on the foil, and contact between the bumps may form an electrical connection in a direction perpendicular to the surface of the foil. For example, in the figure, the corresponding contact between the projection 43a-1 on the forming foil 42a and the projection 43b-1 on the forming foil 42b makes the forming foil 42a and the forming foil 42b at the corresponding position electrically connected to each other, and similarly, the corresponding contact between the projection 43a-2 and the projection 43b-2 with the groove feature makes the forming foil 42a and the forming foil 42b at the corresponding position electrically connected to each other, and it is also possible to form a higher projection 43a-3 on the forming foil 42a to be exposed through the substrate 81 to the side of the forming foil 42b, and to make the forming foil 42a electrically connected to the side of the forming foil 42b, and to realize the selective interconnection of the double-sided forming foils by providing the projections on the forming foil, so that the subsequent processes of via hole turning and plating of a conductive via hole (via) can be omitted, the process can be simplified, the efficiency can be improved, the cost can be reduced, compared with the conventional conductive via hole (via hole), the boss can be of a solid structure and has higher conductivity. A cutter 89 may then be provided to slit the formed foil of the composite structure. By adopting the embodiment, the double-sided copper-clad printed circuit board can be generated more efficiently, the process flow is greatly shortened compared with the traditional process, for example, the processes of forming copper foil by electrolysis, then manufacturing the double-sided copper-clad plate, customizing the negative plate according to the conducting circuit pattern of each layer, coating photosensitive ink on the copper-clad plate, exposing, developing and the like can be omitted, the cost can be greatly reduced, and the environmental pollution can be reduced.

Fig. 27 illustrates the use of a conductive film 84 which is partially wound around the forming drum 1 in the ionic liquid 3, and which is transported with the rotation of the forming drum 1, and which conductive film 84 is electrically conductive and in conductive contact with the forming drum 1. The positive electrode of the power source 6 is electrically connected to the photoelectric layer 2, and the negative electrode is electrically connected to the conductive film 84, and is electrically connected to the conductive film 84 by, for example, electrically connecting to the forming drum 1 as shown in the figure. When the beam 51 selectively irradiates the photoelectric layer 2, a localized electric field is formed between the photoelectric layer 2 and the conductive film 84, and the molding foil 42 is selectively electrodeposited on the conductive film 84. And the molding foil 42 is moved in synchronization with the conveyance of the conductive film 84. The conductive film 84 is adopted to enable the forming foil 42 not to be bonded to the forming drum 1, so that the forming foil is more convenient to separate from the forming drum 1, and the forming foil 42 formed by the discrete lines can still maintain a preset electro-deposition pattern due to the supporting function of the conductive film 84, and can be bonded to the conductive film 84 to still form a continuous forming foil instead of a whole metal foil structure, for example, in the application of manufacturing a circuit board, the step of separating the forming foil 42 part needing to be separated by subsequent etching can be omitted, and the manufacturing process of the circuit board can be simplified.

The embodiment illustrated in fig. 28 differs from that shown in fig. 27 in that the photovoltaic layer 2 is integrated with the forming drum 1, and the conductive film 84 is an anisotropic conductive layer, i.e. a conductive material layer with anisotropic conductive properties is used, i.e. it can be conductive in a direction perpendicular to the surface of the conductive film 84, and is not conductive in a direction parallel to the surface of the conductive film, such as anisotropic conductive tape or film (ACA, ACP). The positive electrode of the power supply 6 is electrically connected to the anode plate 62, and the negative electrode is electrically connected to the photoelectric conductive layer 21. The anode plate 62 may also be a box for the ionic liquid 3, but may also be a box additionally provided with the ionic liquid 3, and the anode plate 62 is immersed in the ionic liquid 3. The conductive film 84 is partially immersed in the ionic liquid 3 and wound on the light control conductive layer 22, and the light beam 51 selectively irradiates the light control conductive layer 21 from the inner side of the transparent conductive layer 21 to the outer side to form a conductive area with a set pattern, the conductive area is electrically connected with the ionic liquid 3 through the conductive film 84, and the forming foil 42 with a preset pattern is formed on the surface of the conductive film 84 through electrodeposition. In this way, the influence of the distance between the conductive film 84 and the anode plate 62 on the electrodeposition precision can be reduced, which is beneficial to improving the forming precision of the forming foil 42 and simplifying the equipment structure.

The conductive film 84 illustrated in fig. 29 is a light-controlling conductive film, that is, the position of the conductive film 84 irradiated with the light beam in this embodiment is conductive, and the portion not irradiated with the light beam is not conductive. The forming drum 1 is made of a transparent conductive layer 21 which is both electrically conductive and light permeable. The negative pole of the power supply 6 is electrically connected to the forming drum 1 and the positive pole is electrically connected to the anode plate 62. The light beam 51 selectively irradiates the conductive film 84 through the transparent conductive layer 21 to form a predetermined pattern of conductive areas (i.e., electrode pattern) where the forming foil 42 is formed by electrodeposition. The arrangement may be simplified without providing the photoconductive layer 22, and electrodeposition may occur only at the position where the light beam 51 strikes the conductive film 84, with higher molding accuracy.

The embodiment illustrated in fig. 30 differs from that of fig. 29 in that the anode plate 62 is replaced by a transparent conductive layer 21, and the forming drum 1 may not necessarily be transparent. The negative electrode of the power supply 6 is electrically connected to the forming drum 1, and the positive electrode is electrically connected to the transparent conductive layer 21. The light beam 51 is transmitted through the transparent conductive layer 21 and directed through the ionic liquid 3 to selectively irradiate the conductive film 84 formed of a photoconduction conductive film, the irradiated position is electrically connected with the ionic liquid 3 and the forming drum 1, and the forming foil 42 is formed by electrodeposition on the conductive area of the conductive film 84. Compared with the embodiment of fig. 29, the light beam 51 in this structure is irradiated from the outer side to the inner side of the photoelectric conductive layer 21, which is more beneficial to the arrangement and heat dissipation of the light source, and improves the reliability and maintainability of the device. FIG. 31 illustrates a schematic H-H cross-sectional view of FIG. 30. In order to prevent the ionic liquid 3 from directly contacting and electrically connecting with the forming drum 1, annular insulating seal rings 15 are respectively arranged at two ends of the forming surface of the forming drum 1, and the vicinities of two sides of the conductive film 84 are respectively contacted and sealed with the two insulating seal rings 15, so that the ionic liquid 3 is prevented from flowing into the area between the conductive film 84 and the forming drum 1.

Fig. 32 shows that the molded foil 42 is transferred to the base material 81, the pressing roller 72 rotates and presses the base material 81, the molded foil 42 and the conductive film 84, the base material 81, the molded foil 42 and the like are heated during the pressing process, the base material 81 and the molded foil 42 are combined into a whole, then the conductive film 84 is separated, and the base material 81 and the molded foil 42 are combined to form a molded foil with a composite structure, such as a circuit board.

Fig. 33 illustrates that the two-sided shaped foil 42 is transferred to both sides of the substrate 81 at the same time to form a shaped foil with a composite structure of conductive traces on both sides, such as a double-sided circuit board. The conductive film 84-1 and the conductive film 84-2 are disposed opposite to each other so that the forming foil 42-1 on the conductive film 84-1 and the forming foil 42-1 on the conductive film 84-1 are both disposed opposite to each other at predetermined positions inward, the substrate 81 is disposed between the forming foil 42-1 and the forming foil 42-2, and the pair of rollers 72 rotate along the arrows in the figure to press the conductive film 84-1, the forming foil 41-1, the substrate 81, the forming foil 42-2, and the conductive film 84-2 into a whole, and simultaneously move the conductive film 84-1, the forming foil 41-1, the substrate 81, the forming foil 42-2, and the conductive film 84-2 in the directions of the arrows in the figure, respectively. The extrusion process can be heated to accelerate the combination of the formed foil 42-1, the base material 81 and the formed foil 42-2 and improve the combination strength, and the extrusion die can also be arranged in a vacuum environment to facilitate the discharge of gas in the extrusion process and reduce the formation of cavities. Then the conductive film 84-1 and the conductive film 84-2 are separated respectively, and the formed foil 42-1, the substrate 81 and the formed foil 42-2 can form a circuit board with conductive circuits on both sides. The process for bonding the forming foil 42 and the substrate 81 using the embodiment shown in fig. 32 or 33 is simpler and more reliable, for example, the forming foil 42 may be directly formed with a circuit pattern, the forming foil 42 is supported by the conductive film 84 to form a whole, and then a circuit board is formed on the substrate 81, or a composite film having an embedded grid metal layer may be formed, for example, a thin film material that is insulating and can also be electromagnetically shielded is formed, so that the subsequent etching process can be omitted, and the process can be simplified.

The embodiments shown in fig. 27 to 31 can also facilitate cooperation between an upstream enterprise and a downstream enterprise, for example, the upstream enterprise completes the forming foil 42, and the forming foil 42 is bonded to the conductive film 84, so that stability during the conveying process can be ensured, and the downstream enterprise completes the manufacture of circuit boards and the like. The conductive film (84) may also be recycled, reducing application costs.

Fig. 34 illustrates a dynamic control method of the irradiation pattern of the light beam 51, and the control algorithm controls the irradiation (e.g. area projection or scanning) of the light beam 51 onto the photoconductive layer 21 according to the layer pattern of the deposition model 41 or the pattern information of the etched grooves 49 in combination with the rotation angle information of the forming drum 1 to obtain a predetermined layer pattern of the deposition model 41 or the pattern of the etched grooves 49 on the forming drum 1. In addition, the control algorithm can also control the irradiation intensity distribution and/or the irradiation effective time distribution of the light beam 51 according to the rotation angle of the forming drum and the layer pattern of the deposition model 41 or the pattern information of the etching groove 49, so as to control the deposition thickness of the layer pattern of the deposition model 41 or the etching depth of the etching groove 49 pattern at different positions, or make the deposition thickness or the etching groove depth uniform. The rotational angle information of the forming drum 1 can be obtained by detecting a rotational angle signal of the forming drum 1 or by time recursion using rotational speed information of the forming drum 1.

The light control conductive layer 22 or the light control conductive film of the photovoltaic layer 2 of the present invention may be made of a photoconductive material, such as an organic photoconductive material (photoconductive polymer), such as polyvinylcarbazole, or an inorganic photoconductive material, or other photoconductive materials, and may form a micro-nano array of photovoltaic materials, where the photoconductive material changes resistivity by light irradiation according to a photoconductive effect (or referred to as a photoconductive effect). In addition, the light-operated conducting layer can also adopt a semiconductor material capable of forming a PN junction, such as silicon-based doping, or a material capable of forming a heterojunction and the like, and the materials can generate electromotive force according to the photovoltaic effect during illumination, and realize circuit conduction and current formation. The light control conductive layer 22 or the light control conductive film may also adopt a PIN photodiode structure, and a transition layer I is formed between the P-type semiconductor layer 222 and the N-type semiconductor layer 221, that is, the intrinsic region of the PN junction has a larger width, so that higher photovoltaic conversion sensitivity can be realized. In addition, the P-type semiconductor layer 222 and the N-type semiconductor layer 221 may be, but not limited to, single crystal silicon, polycrystalline silicon, amorphous silicon, CdTe, CIGS, GaAs, dye sensitization, organic thin film or compound, or MS junction or heterojunction including homotype heterojunction (e.g., P-P type heterojunction, or N-N type heterojunction) or inversion type heterojunction (e.g., P-N type heterojunction), and they are understood to form PN junction in different manners in the present invention. A cascaded PN junction may also be formed, for example, a wide bandgap PN junction (e.g., GalnP) may be located above a narrow bandgap PN junction (e.g., GaAs) in a heterojunction structure to form a cascaded PN junction. The cascaded photovoltaic panel formed by stacking the photovoltaic PN junctions is beneficial to improving the photoelectric conversion efficiency, and the current and the electrodeposition speed of electrodeposition can be improved under the condition of the same illumination. Of course, other semiconductor junctions that can achieve photovoltaic effect can also be used as PN junctions. Adopt the mode of PN knot can promote the response speed of light-operated conducting layer 22, the position that light beam 51 shines is electrically conductive fast, and the position that stops shining resumes insulating fast, does benefit to the rotational speed that promotes photoelectric layer 2 so, does benefit to and promotes the ionic liquid and changes speed, promotes the electrodeposition forming speed, is favorable to promoting the electrodeposition forming precision simultaneously. The conductive film 84 having the light control conductive property as shown in fig. 29 and 30 may also employ the above-described materials. Conventional conductive and also transparent materials are indium tin oxide materials, aluminum-doped zinc oxide, or other transparent and conductive materials, which may be used for the transparent conductive layer 21. It is also possible in embodiments to control the speed of electrodeposition or the thickness of the shaping foil 42 at different locations by controlling the intensity and time of the light beam irradiating the photoconductive layer, etc.

The ionic liquid 3 in the present invention may be a metal salt solution or an electrolyte for electroplating or electroforming, such as a metal, e.g., copper, nickel, iron, or an alloy, or an electrolyte for electroetching, or a metal salt solution or an electrolyte for other metal materials, e.g., a copper sulfate solution, a nickel sulfate solution (watt solution), an iron chloride solution, a fluoroborate solution, a sodium nitrate solution, a sodium chloride solution, or a sulfamate solution, or an acid electrolyte, e.g., a sulfuric acid solution or a hydrochloric acid solution. The shaped foil 42 may be a corresponding metal foil. The ionic liquid 3 may be an electrophoretic liquid, and may be used, for example, to form a selective insulating layer on the molding foil 42.

The directional terms such as "upper", "lower", "left", "right", etc. used in the description of the present invention are based on the convenience of the specific drawings and are not intended to limit the present invention. In practical applications, the actual orientation may differ from the drawings due to the spatial variation of the structure as a whole, but such variations are within the scope of the invention as claimed.

Claims

1. The utility model provides a processingequipment based on electric field which characterized in that: the device comprises a forming rotary drum (1) which can rotate along a central axis and is conductive, at least one photoelectric layer (2), a power supply (6) and a box body (31), wherein the photoelectric layer (2) is in a rotary drum shape and comprises a transparent conductive layer (21) and a light-operated conductive layer (22) which are combined with each other, the box body (31) is filled with ionic liquid (3), the photoelectric layer (2) is rotatably and partially immersed in the ionic liquid (3), the forming rotary drum (1) and the photoelectric layer (2) are correspondingly arranged in a parallel matching manner, the photoelectric layer (2) protrudes out of the outer side surface of the ionic liquid (3) and is adhered with an ionic liquid layer (39) through the rotation of the photoelectric layer (2), the ionic liquid layer (39) is electrically connected with the forming surface of the forming rotary drum (1), one pole of the power supply (6) is electrically connected with the forming rotary drum (1), and the other pole of the power supply is electrically connected with the transparent conductive layer (21), a light beam (51) from the inside of the photoelectric layer (2) can selectively irradiate the light-controlling conductive layer (22) through the transparent conductive layer (21).

2. The utility model provides a processingequipment based on electric field which characterized in that: the photoelectric drum forming device comprises a forming drum (1), at least one photoelectric layer (2), a power supply (6), a box body (31) and a supporting seat (56), wherein the forming drum (1), the photoelectric layer (2), the photoelectric layer and the supporting seat (56) can rotate along a central axis and can conduct electricity, the photoelectric layer (2) comprises a transparent conducting layer (21) and a light-operated conducting layer (22) which are combined with each other, ionic liquid (3) is filled in the box body (31), at least part of the forming drum (1) is immersed in the ionic liquid (3), the supporting seat (56) is arranged on the box body (31) and keeps sliding sealing fit with the box body (31), the photoelectric layer (2) is arranged at the inner side end of the supporting seat (56), the light-operated conducting layer (22) faces the forming surface of the forming drum (1) and corresponds to the forming surface of the forming drum (1), the ionic liquid (3) is filled between the light-operated conducting layer (22) and the forming drum (1), one pole of the power supply (6) is electrically connected with the forming drum (1), The other electrode is electrically connected with the transparent conductive layer (21), and light beams (51) can selectively irradiate the light-controlled conductive layer (22) from the outer side of the photoelectric layer (2) through the transparent conductive layer (21).

3. The utility model provides a processingequipment based on electric field which characterized in that: the device comprises a forming rotary drum (1), a photoelectric layer (2) and a power supply (6), wherein the forming rotary drum (1) can rotate along a central axis and is conductive, the photoelectric layer (2) comprises a light-control conductive layer (22) and a transparent conductive layer (21) which are combined with each other at the inner layer and the outer layer, the inner layer is hollow, the forming rotary drum (1) is arranged inside the photoelectric layer (2) and forms a gap flow channel of ionic liquid (3) with the photoelectric layer (2), the gap flow channel is filled with the ionic liquid (3), at least part of the forming rotary drum (1) is immersed in the ionic liquid (3), the negative electrode of the power supply (6) is electrically connected with the forming rotary drum (1), the positive electrode of the forming rotary drum is electrically connected with the transparent conductive layer (21), a light beam (51) is filled in the outer side of the photoelectric layer (2) through the transparent conductive layer (21) and can selectively irradiate the light-control conductive layer (22) and can be selectively electrodeposited on the forming surface of the forming rotary drum (1) to obtain a deposition model (41) with a controllable shape, the deposition pattern (41) is peeled along the forming surface of the forming drum (1) to form a forming foil (42).

4. The utility model provides a processingequipment based on electric field which characterized in that: the device comprises a forming rotary drum (1), a power supply (6) and an anode plate (62), wherein the forming rotary drum (1) is a rotary drum-shaped photoelectric layer (2), the photoelectric layer (2) comprises a transparent conducting layer (21) and a light-operated conducting layer (22) which are combined with an inner layer and an outer layer, the anode plate (62) corresponds to the forming surface of the forming rotary drum (1), an ionic liquid (3) is filled between the anode plate (62) and the forming rotary drum (1), the forming rotary drum (1) is rotatably and at least partially immersed in the ionic liquid (3), the cathode of the power supply (6) is electrically connected with the transparent conducting layer (21), the anode of the power supply is electrically connected with the anode plate (62), a light beam (51) penetrates through the transparent conducting layer (21) from the inside of the forming rotary drum (1) and can selectively irradiate the light-operated conducting layer (22) and carry out selective electrodeposition on the forming surface of the forming rotary drum (1) to obtain a deposition model (41) with a controllable shape, the deposition pattern (41) is peeled along the forming surface of the forming drum (1) to form a forming foil (42).

5. An electric-field-based machining apparatus as claimed in claim 1, wherein: the negative pole of power (6) is connected with forming rotary drum (1) electricity, the positive pole with transparent conducting layer (21) electricity of photoelectricity layer (2) is connected, light beam (51) see through transparent conducting layer (21) selectively shine light accuse conducting layer (22) and carry out selective electrodeposition at the shaping surface of forming rotary drum (1) and form controllable deposit model (41) of shape, ion liquid layer (39) through with the shaping surface contact of forming rotary drum (1) or through contacting with deposit model (41) realize with the shaping surface of forming rotary drum (1) keeps the electricity to be connected.

6. An electric-field-based machining apparatus as claimed in claim 5, wherein: the forming surface of the forming drum (1) forms a continuous deposition pattern (41), and the deposition pattern (41) is peeled off along the forming surface of the forming drum (1) to form a forming foil (42).

7. An electric-field-based machining apparatus as claimed in claim 2, wherein: the negative electrode of the power supply (6) is electrically connected with the forming rotary drum (1), the positive electrode of the power supply is electrically connected with the transparent conducting layer (21) of the photoelectric layer (2), and the light beam (51) can selectively irradiate the light-controlled conducting layer (22) through the transparent conducting layer (21) and carry out selective electrodeposition on the forming surface of the forming rotary drum (1) to form a deposition model (41) with a controllable shape.

8. An electric-field-based machining apparatus as claimed in claim 7, wherein: the forming surface of the forming drum (1) forms a continuous deposition pattern (41), and the deposition pattern (41) is peeled off along the forming surface of the forming drum (1) to form a forming foil (42).

9. An electric-field-based processing apparatus according to claim 3, 4, 6 or 8, wherein: also included is a photosensitive resin photocuring printing mechanism for selectively photocuring the combined photosensitive resin layer on the molding foil (42).

10. An electric-field-based processing apparatus according to claim 3, 4, 6 or 8, wherein: the forming device also comprises a press roller (72) for pressing the base material (81) and the forming foil (42), wherein the base material (81) and the forming foil (42) are combined to obtain the forming foil (42) with a composite structure; or the electric field-based processing device is also provided with a press roller (72) for pressing the base material (81) and the forming foil (42), the processing device based on the electric field is respectively arranged on two sides of the base material (81), and the forming foils (42) respectively formed on two sides of the base material (81) are respectively combined with two sides of the base material (81) through the press roller (72) to obtain the forming foil (42) with a double-sided composite structure.

11. An electric-field-based processing apparatus according to claim 3, 5 or 7, wherein: and the photoelectric layer (2) is partially attached to the forming drum (1) between the forming drum (1) and the photoelectric layer (2) and is conveyed along with the rotation of the forming drum (1), and the light beam (51) selectively irradiates the light control conductive layer (22) and carries out selective electrodeposition on the surface of the conductive film (84) opposite to the photoelectric layer (2) to form the forming foil (42) with controllable shape.

12. An electric-field-based machining apparatus as claimed in claim 4, wherein: the light-emitting device further comprises an anisotropic conductive layer covering the outer peripheral surface of the forming drum (1), the light beam (51) selectively irradiates the light-control conductive layer (22) and carries out selective electrodeposition on the outer peripheral surface of the anisotropic conductive layer to obtain a deposition model (41) with a controllable shape, and the deposition model (41) is peeled off along the tangential direction of the outer peripheral surface of the anisotropic conductive layer to form a forming foil (42); or the device also comprises a conductive film (84) which is partially attached to the forming drum (1) in the ionic liquid (3) and is conveyed along with the rotation of the forming drum (1), the conductive film (84) is anisotropic conductive, and the light beam (51) selectively irradiates the light control conductive layer (22) and carries out selective electrodeposition on the surface of the conductive film (84) away from the photoelectric layer (2) to form the forming foil (42) with controllable shape.

13. An electric field based processing apparatus according to any one of claims 3, 4, 5 and 7, wherein: also included is a guide roll (68) for guiding the fibers (85) towards the forming surface of the forming drum (1), the fibers (85) being integrated into the deposition pattern (41) or forming foil (42) with the electrodeposition process.

14. An electric-field-based processing apparatus according to any of claims 1 to 4, wherein: the light-operated conducting layer (22) is a PN junction structure layer, a PIN photodiode structure layer, a PNP triode structure layer or a light guide material layer.

15. An electric field based processing apparatus according to claim 5 or 7, wherein: the forming drum (1) and the photoelectric layer (2) can move relatively far away from each other along the radial direction of the forming drum (1) intermittently or continuously.

16. An electric-field-based machining apparatus as claimed in claim 1, wherein: the photoelectric layer (2) is arranged in the box body (31), a scraping plate (32) in clearance fit or sliding fit with the outer surface of the photoelectric layer (2) is arranged in the box body (31), an inner cavity of the box body (31) is divided by the scraping plate (32) to form a high-concentration ionic liquid area and a low-concentration ionic liquid area, and the high-concentration ionic liquid area and the low-concentration ionic liquid area are respectively connected with an ionic liquid supplementing device to form an ionic liquid supplementing loop.

17. An electric-field-based machining apparatus as claimed in claim 3, wherein: the photoelectric layer (2) is in an arc curved surface shape coaxially arranged with the forming rotary drum (1), and the thickness of a gap flow channel between the photoelectric layer (2) and the forming rotary drum (1) is uniform and consistent.

18. An electric-field-based machining apparatus as claimed in claim 3, wherein: and the opposite sides of the photoelectric layer (2) are respectively provided with an ionic liquid input port (35) and an ionic liquid output port (36), and the ionic liquid (3) is input through the ionic liquid input port (35), flows along the gap flow channel and is output from the ionic liquid output port (36).

19. An electric-field-based machining apparatus as claimed in claim 3, wherein: the forming drum (1) is a drum-shaped second photoelectric layer, the second photoelectric layer comprises a second transparent conducting layer and a second light-operated conducting layer, the inner layer and the outer layer of the second photoelectric layer are mutually combined, the negative electrode of the power supply (6) is electrically connected with the second transparent conducting layer, a second light beam penetrates through the second transparent conducting layer from the inside of the forming drum (1) to selectively irradiate the second light-operated conducting layer, and the shape controllable electrodeposition is carried out on the forming surface of the forming drum (1) to form a deposition model (41).

20. An electric field based processing apparatus according to claim 1 or 2, wherein: the positive pole of the power supply (6) is electrically connected with the forming rotary drum (1), the negative pole of the power supply is electrically connected with the transparent conducting layer (21), and the light beam (51) can selectively irradiate the light-controlled conducting layer (22) through the transparent conducting layer (21) to carry out selective electric etching on the forming surface of the forming rotary drum (1) to form an etching groove (49) with controllable shape.

21. An electric field based processing apparatus according to claim 1 or 2, wherein: the photoelectric layer etching device is characterized by further comprising a forming foil (42) to be etched, wherein the forming foil (42) is partially attached to the forming drum (1) between the forming drum (1) and the photoelectric layer (2) and is conveyed along with the rotation of the forming drum (1), the positive electrode of the power supply (6) is electrically connected with the forming foil (42), the negative electrode of the power supply is electrically connected with the transparent conductive layer (21), the light beam (51) penetrates through the transparent conductive layer (21) to selectively irradiate the light control conductive layer (22) to perform selective electric etching on the surface of the forming foil (42) relative to the photoelectric layer (2) to form an etching groove (49) with a controllable shape.

22. An electric-field-based processing apparatus as defined in claim 1, 3 or 4, wherein: and a mask (55) with a preset pattern light-transmitting area (55a) is paved on the surface of the transparent conductive layer (21).

23. An electric-field-based processing apparatus according to any of claims 1 to 4, wherein: including this processingequipment based on electric field of a plurality of grades, first order is based on forming rotary drum (1) of processingequipment of electric field and forms continuous forming foil (42), forming foil (42) pass through running roller (71) direction in proper order subordinate based on processingequipment of electric field and with subordinate based on processing equipment of electric field forming rotary drum (1) pastes and winds, through subordinate based on processing equipment of electric field is in continue to carry out selectivity electro-deposition processing and \ or selectivity electroetching processing on forming foil (42).

24. An electric field based processing apparatus according to any one of claims 23, wherein: and a cleaning device (69) for removing the residual ionic liquid on the forming foil (42).

25. An electric field based processing apparatus according to any one of claims 23, wherein: the ionic liquid (3) in at least one stage of the lower electric field-based processing device can also be electrophoretic liquid for forming the insulating layer with controllable shape on the forming foil (42) by selective electrophoretic deposition.

26. The utility model provides a processingequipment based on electric field which characterized in that: the forming drum (1) is a drum-shaped transparent conducting layer (21), the anode plate (62) corresponds to the outer side face of the forming drum (1), ionic liquid (3) is filled between the anode plate (62) and the forming drum (1), the forming drum (1) is rotatably and at least partially immersed in the ionic liquid (3), the conducting film (84) is partially attached to the forming drum (1) in the ionic liquid (3) and is conveyed along with the rotation of the forming drum (1), the conducting film (84) is a light-operated conducting layer, the negative electrode of the power source (6) is electrically connected with the transparent conducting layer (21), the positive electrode of the power source is electrically connected with the anode plate (62), and a light beam (51) can selectively irradiate the conducting film (84) from the inside of the forming drum (1) through the transparent conducting layer (21) and can irradiate the surface of the conducting film (84) Selective electrodeposition is performed to form a shaped foil (42) of controlled shape.

27. The utility model provides a processingequipment based on electric field which characterized in that: the forming device comprises a forming rotary drum (1), a conductive film (84), a transparent conductive layer (21) and a power supply (6), wherein the forming rotary drum (1) is of a rotatable and conductive structure, the transparent conductive layer (21) is hollow, the forming rotary drum (1) is arranged in the transparent conductive layer (21) and forms a gap flow channel of ionic liquid (3) with the transparent conductive layer (21), the gap flow channel is filled with flowable ionic liquid (3), at least part of the forming rotary drum (1) is immersed in the ionic liquid (3), the conductive film (84) is partially attached to the forming rotary drum (1) in the ionic liquid (3) and is transmitted along with the rotation of the forming rotary drum (1), the conductive film (84) is a light-operated conductive layer, the negative electrode of the power supply (6) is electrically connected with the forming rotary drum (1), and the positive electrode of the power supply is electrically connected with the transparent conductive layer (21), the light beam (51) can selectively irradiate the conductive film (84) from the outer side of the transparent conductive layer (21) through the transparent conductive layer (21) and the ionic liquid (3), and the shape-controllable electrodeposition is carried out on the irradiated surface of the conductive film (84) to form the forming foil (42).

28. An electric field based processing apparatus according to claim 26 or 27, wherein: the forming device further comprises a pressing roller (72) for pressing the base material (81) and the forming foil (42) on the conductive film (84), wherein the conductive film (84) is separated after the base material (81) is combined with the forming foil (42) to obtain the forming foil (42) with a composite structure; or the double-sided composite structure forming device further comprises a press roller (72) for pressing the base material (81) and the forming foil (42) on the conductive film (84), the electric field based processing devices are respectively arranged on two sides of the base material (81), and the forming foils (42) respectively formed by the electric field based processing devices on the two sides are respectively combined with the two sides of the base material (81) through the press roller (72), and then the conductive film (84) is separated to obtain the forming foil (42) with the double-sided composite structure.

29. An electric field-based processing method using the electric field-based processing apparatus according to claim 3, 4, 6 or 8, comprising the steps of:

(1) controlling the forming drum (1) to rotate around the central axis thereof;

(2) according to the shape information of a preprocessed deposition model (41) and the corner information of a forming drum (1), selectively irradiating the light-operated conductive layer (22) through a transparent conductive layer (21) by an algorithm control light beam (51), carrying out selective electrodeposition on the forming surface of the forming drum (1) to form the deposition model (41) with a controllable shape, and controlling the deposition thickness of different positions of a layer pattern of the deposition model (41) by controlling the irradiation intensity distribution and/or the effective irradiation time distribution of the light beam (51) through the algorithm;

(3) the deposition former (41) rotates with the forming drum (1) and is peeled from the forming surface of the forming drum (1) to form a forming foil (42).

30. An electric field-based processing method using the electric field-based processing apparatus according to claim 20, comprising the steps of:

(1) controlling the forming drum (1) to rotate around the central axis thereof;

(2) according to the shape information of a preprocessed etching groove (49) and the corner information of a forming drum (1), a light beam (51) is controlled through an algorithm to selectively irradiate the light-operated conductive layer (22) through the transparent conductive layer (21), selective electric etching is carried out on the forming surface of the forming drum (1) to form the etching groove (49) with a controllable shape, and the irradiation intensity distribution and/or the effective irradiation time distribution of the light beam (51) are controlled through the algorithm to control the etching depth of different positions of the etching groove (49).