CN113549871A

CN113549871A - Mask compensation method and evaporation system

Info

Publication number: CN113549871A
Application number: CN202110824719.7A
Authority: CN
Inventors: 张庆宇; 张浩瀚; 曹方义; 赵理; 肖一鸣
Original assignee: Hefei Visionox Technology Co Ltd
Current assignee: Hefei Visionox Technology Co Ltd
Priority date: 2021-07-21
Filing date: 2021-07-21
Publication date: 2021-10-26

Abstract

The application relates to the technical field of display, in particular to a mask compensation method and an evaporation system, and aims to solve the problem that the yield of an OLED product prepared by the existing mask plate is low. The mask compensation method comprises providing a mask plate with at least one mask opening; an outward-expanding part is formed at the corner of the mask opening of the mask plate, and the outward-expanding part can be used for increasing the opening area of the mask opening, so that the allowable offset relative to the to-be-evaporated opening is improved; the mask plate and the layer to be subjected to evaporation are combined for evaporation, so that the evaporation precision can be improved, and the yield of OLED products prepared from the mask plate can be improved.

Description

Mask compensation method and evaporation system

Technical Field

The application relates to the technical field of display, in particular to a mask compensation method and an evaporation system.

Background

Since an Organic Light-Emitting Diode (OLED) has excellent color and image quality, its application fields are increasing and its influence is increasing.

Vacuum evaporation is the most common method for preparing OLED products, a mask plate is used in vacuum evaporation, a chemical etching method is often used for preparing the mask plate, a layer to be evaporated is prepared by an exposure and development method, and various materials of a light-emitting layer are evaporated in the opening to be evaporated of the layer to be evaporated through a mask opening of the mask plate to form the light-emitting layer. For guaranteeing the coating by vaporization precision, need the mask plate can not shelter from treating the coating by vaporization mouth, owing to receive the preparation technology restriction, the mask opening with treat that the coating by vaporization mouth inevitablely exists the fillet, and the fillet of mask opening is showing and is being greater than the fillet of treating the coating by vaporization mouth.

However, the yield of the OLED product prepared by the mask plate is low.

Disclosure of Invention

The application provides a mask compensation method and an evaporation system, and aims to solve the problem that the yield of an OLED product prepared by the existing mask plate is low.

In order to achieve the above object, in a first aspect, the present application provides a mask compensation method, including:

providing a mask plate, wherein the mask plate is provided with at least one mask opening, and each mask opening is polygonal and is provided with a plurality of corners;

adjusting the shape of the mask opening, and forming an outward expansion part at least part of corners of the mask opening;

the mask plate is closed to the evaporation coating layer, and the mask opening corresponds to the evaporation coating opening to be coated on the evaporation coating layer.

According to the mask compensation method provided by the embodiment of the application, a mask plate with at least one mask opening is provided; an outward-expanding part is formed at the corner of the mask opening of the mask plate, and the outward-expanding part can be used for increasing the opening area of the mask opening, so that the allowable offset relative to the to-be-evaporated opening is improved; the mask plate and the layer to be subjected to evaporation are combined for evaporation, so that the evaporation precision can be improved, and the yield of OLED products prepared from the mask plate can be improved.

In the mask compensation method, optionally, the step of adjusting the shape of the mask opening and forming the flaring portion at least a part of the corners of the mask opening includes:

the mask opening comprises a plurality of straight line segments which are sequentially connected end to end, two adjacent straight line segments are connected through an arc line segment, and the arc line segment forms a corner of the mask opening;

and adjusting the shape of the corner to enable the arc line segment to deviate towards the direction far away from the center of the mask opening, and forming an outward expansion part.

The local structure of the mask opening can be adjusted, so that the opening area of the mask opening is increased, and excessive damage to the mask opening is avoided. In addition, the allowable offset of the mask opening relative to the evaporation coating opening can be improved, so that the yield of OLED products prepared by the mask plate is improved.

In the above mask compensation method, optionally, an arc transition section is disposed at a connection of the arc line segment and the straight line segment.

The arrangement can avoid the generation of wrinkles at the connection position and prevent the opening of the mask from cracking at the wrinkles due to excessive stress concentration; can also let evaporation material pass through the mask opening after, can the even deposition treat the coating by vaporization mouth to improve the coating by vaporization precision.

In the mask compensation method, optionally, the rounding line between two adjacent straight line segments is located on one side of the arc line segment close to the center of the mask opening, and the radius of curvature of the arc line segment is equal to that of the rounding line.

The arrangement can realize the corner flaring of the mask opening only by changing the position of the rounding line, thereby reducing the steps and cost of design and/or processing and manufacturing which are increased due to the corner flaring.

In the mask compensation method, optionally, the center of the arc line segment, the center of the rounding line and the center of the mask opening are all located on the same straight line.

The mask opening can be guaranteed to be regular in shape, the difficulty of forming the outward expansion part of the arc line segment is reduced, and the difficulty of compensation and adjustment of the mask opening is reduced.

In the mask compensation method, optionally, the step of aligning the mask plate with the layer to be evaporated, wherein the mask opening corresponds to the opening to be evaporated of the layer to be evaporated, includes:

treat to be provided with a plurality of evaporation coating mouths of treating on the evaporation coating, a plurality of mask openings and a plurality of evaporation coating mouths of treating one-to-one set up.

So set up and to treat that the coating by vaporization mouth homoenergetic corresponds with the mask opening for every, guarantee to treat that the coating by vaporization material passes through the mask opening deposit and treat in the coating by vaporization mouth to improve the coating by vaporization precision.

in the same mask opening, the maximum distance between adjacent rounding lines and arc line segments is a first distance;

the minimum distance between two adjacent openings to be evaporated is a second distance;

the ratio of the first pitch to the second pitch ranges from 3 to 20%.

According to the arrangement, the allowable offset of the mask opening relative to the evaporation port can be increased on the premise that the resolution ratio of the OLED product is not influenced, and the evaporation precision is improved.

In the mask compensation method described above, it is optional that, among the plurality of corners of the mask opening, the corner formed with the flared portion is disposed opposite to each other.

According to the arrangement, when the mask opening moves along a certain direction relative to the evaporation coating port, the allowable offset of the mask opening and the allowable offset of the mask opening can be improved in the direction opposite to the direction, so that the yield of OLED products prepared by the mask plate can be improved.

In the mask compensation method, optionally, the mask opening is a parallelogram; preferably, the mask opening is diamond-shaped or rectangular; preferably, the mask openings are square.

So be provided with and do benefit to realizing arranging and processing of mask opening, also be favorable to the material of luminescent layer to pass through even deposition in waiting to evaporate and plate the mouth behind the mask opening to improve the evaporation coating precision.

In a second aspect, the application provides an evaporation system, including the mask plate and treating the evaporation coating, the mask plate with treat that the evaporation coating closes, the mask plate carries out compensation adjustment through foretell mask compensation method.

The application provides an evaporation coating system, including the mask plate with treat the evaporation coating, be equipped with the mask opening respectively on the mask plate with treat the evaporation coating and treat the evaporation coating mouth, the mask plate with treat the evaporation coating and to closing the back, adopt the mode of evaporation coating and form the luminescent layer in treating the evaporation coating mouth to through forming outer portion of expanding in mask open-ended corner, increase the relative permission offset of treating the evaporation coating mouth of mask opening, and then improve the yield of the OLED product of evaporation coating precision and mask plate preparation.

The construction of the present application and other objects and advantages thereof will be more apparent from the following description of the preferred embodiments taken in conjunction with the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments or related technologies of the present application, the drawings needed to be used in the description of the embodiments or related technologies are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

FIG. 1 is a schematic diagram of an allowable offset of a mask opening with respect to an evaporation opening provided in the related art;

fig. 2 is a schematic flowchart of a mask compensation method according to an embodiment of the present disclosure;

fig. 3 is a schematic structural diagram of a mask opening according to an embodiment of the present disclosure;

fig. 4 is a schematic view of an allowable offset of a mask opening with respect to an evaporation port according to an embodiment of the present disclosure;

fig. 5 is a schematic diagram illustrating a comparison between an allowable offset of a mask opening with respect to an opening to be vapor deposited and an allowable offset of a mask opening with respect to an opening to be vapor deposited in the related art according to an embodiment of the present disclosure;

FIG. 6 is a schematic diagram illustrating a relative position between a mask opening and an adjacent opening to be evaporated according to an embodiment of the present disclosure;

fig. 7 is a schematic structural diagram of a mask and a layer to be evaporated in the evaporation system according to the embodiment of the present application.

Description of reference numerals:

1-opening a mask;

1' -opening the involuted mask;

2-a port to be evaporated;

11-a mask plate;

110-mask opening;

110' -opening the involuted mask;

111-straight line segment;

112-radius line;

113-arc segment;

114-arc transition;

21-a layer to be evaporated;

210-a port to be evaporated;

31-substrate.

Detailed Description

When an OLED product is prepared by a vacuum evaporation method, in order to ensure the evaporation precision, the mask plate is required not to shield an evaporation opening to be evaporated, namely the evaporation opening to be evaporated is completely exposed in a mask opening of the mask plate corresponding to the evaporation opening. When the mask plate is prepared by using a chemical etching method, the corners of the mask opening can generate fillets due to the fact that etching precision of etching liquid is not high. When the exposure and development method is used for preparing the layer to be evaporated, the corner of the opening to be evaporated also generates a fillet due to the limitation of the light etching precision. And the fillet of the mask opening is obviously larger than that of the evaporation coating opening.

Simultaneously, for the yield of guaranteeing the OLED product, require the mask plate can not shelter from the mouth of treating the coating by vaporization that corresponds with the mask opening, the mask opening only exposes the mouth of treating the coating by vaporization that corresponds with it simultaneously, and can not expose adjacent mouth of treating the coating by vaporization, like this, just can make the various materials that treat each interior homoenergetic deposition luminescent layer of coating by vaporization mouth of treating on coating by vaporization layer, various materials of this luminescent layer include but not limited to formation luminescent layer, electron injection layer, electron transport layer, electron barrier layer, hole transport layer, the material of hole injection layer and hole barrier layer, and then guarantee OLED's whole display effect. The yield of the product refers to the yield of the product.

Fig. 1 is a schematic diagram of an allowable offset of a mask opening with respect to an opening to be evaporated according to the related art. Referring to fig. 1, the mask opening 1 is a state diagram in which there is no positional deviation between the mask opening 1 and the vapor deposition port 2, and the center of the mask opening 1 coincides with the center of the vapor deposition port 2. The mask opening 1' after the alignment is a state diagram in which the mask opening 1 and the opening to be vapor-deposited 2 are aligned with each other and then have a positional deviation. The allowable offset amount of the mask opening 1 with respect to the port to be evaporated 2 in the direction of the arrow shown in fig. 1 is OA. The allowable offset of the mask opening 1 with respect to the evaporation opening 2 is an important factor affecting the yield of the product. Wherein, it is fashionable that the allowable offset means that the mask plate is with treating that the coating by vaporization layer is to, under the prerequisite of guaranteeing that the mask plate is not sheltering from treating coating by vaporization mouth 2 of treating the coating by vaporization layer, there is the position deviation between allowable mask opening 1 and treating coating by vaporization mouth 2.

The allowable offset can be used for representing evaporation precision, and the larger the allowable offset is, the higher the evaporation precision is, and the higher the yield of the product is; conversely, the smaller the allowable offset, the lower the deposition accuracy, and the lower the yield of the product. However, since the fillet of the mask opening is significantly larger than that of the evaporation opening, so that the allowable offset OA of the mask opening 1 relative to the evaporation opening 2 is smaller, the allowable offset OA of the mask plate to the evaporation layer is correspondingly smaller, and the evaporation accuracy and the yield of the prepared OLED product are lower.

Aiming at least solving the problem that the yield of OLED products prepared by the mask plate is low, the mask compensation method and the evaporation system provided by the embodiment of the application provide the mask plate with at least one mask opening; an outward-expanding part is formed at the corner of the mask opening of the mask plate, and the outward-expanding part can be used for increasing the opening area of the mask opening, so that the allowable offset relative to the to-be-evaporated opening is improved; when the mask plate and the layer to be subjected to evaporation are combined for evaporation, the evaporation precision can be improved, and the yield of OLED products prepared from the mask plate can be improved.

In order to make the objects, technical solutions and advantages of the present application clearer, the technical solutions in the embodiments of the present application will be described in more detail below with reference to the accompanying drawings in the preferred embodiments of the present application. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are a subset of the embodiments in the present application and not all embodiments in the present application. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Embodiments of the present application will be described in detail below with reference to the accompanying drawings.

Fig. 2 is a schematic flowchart of a mask compensation method according to an embodiment of the present disclosure. Fig. 3 is a schematic structural diagram of a mask opening according to an embodiment of the present disclosure. Fig. 4 is a schematic view of an allowable offset of a mask opening with respect to an opening to be evaporated according to an embodiment of the present disclosure. Fig. 5 is a schematic diagram illustrating a comparison between an allowable shift amount of a mask opening with respect to an opening to be evaporated according to an embodiment of the present application and an allowable shift amount of the mask opening with respect to the opening to be evaporated according to the related art. Fig. 6 is a schematic diagram illustrating a relative position between a mask opening and an adjacent opening to be evaporated according to an embodiment of the present disclosure. Fig. 7 is a schematic structural diagram of a mask and a layer to be evaporated in the evaporation system according to the embodiment of the present application.

Referring to fig. 2, a mask compensation method according to one possible embodiment of the present application includes:

s1, providing a mask plate, wherein the mask plate is provided with at least one mask opening, and each mask opening is polygonal and is provided with a plurality of corners.

It should be noted that the mask plate of this embodiment may include a mask frame and a plurality of mask strips arranged in the mask frame, two ends of the mask strips are respectively bridged on the mask frame, the plurality of mask strips are arranged in a staggered manner inside a frame body of the mask frame, and inside the frame of the mask frame, the parts of the mask strips that are not overlapped and covered form a mask opening of the mask plate, and the mask opening may be a polygon. In use, the shape and size of the mask opening can be adjusted by chemical etching, which forms a fillet at the corners of the mask opening.

Wherein, set up the mask opening into the polygon, can reduce the processing degree of difficulty of mask opening, also be favorable to realizing the mask opening and treat the shape looks adaptation of coating by vaporization mouth of treating of coating by vaporization layer, guarantee involution between them.

And S2, adjusting the shape of the mask opening, and forming an outward expansion part at least partial corner of the mask opening.

It should be noted that, referring to fig. 3, the flaring portion is located at a partial corner of the mask opening 110, and the flaring portion can increase the opening area at the corner of the mask opening 110, thereby increasing the overall opening area of the mask opening 110. In the process that the mask opening 110 of the mask plate is offset relative to the to-be-evaporated opening of the to-be-evaporated layer, the allowable offset of the mask opening 110 relative to the to-be-evaporated opening can be improved.

The outward-expanded part can be obtained by processing the corner of the mask opening 110 in a wet etching mode, the wet etching mode is simple to operate, and the preparation cost is low. Of course, in the actual operation process, the outward expansion part can also be prepared in a dry etching mode to ensure the etching precision. The user can select a specific preparation method according to the requirement, which is not limited in this embodiment.

S3, matching the mask plate with the layer to be evaporated, wherein the mask opening corresponds to the opening to be evaporated of the layer to be evaporated.

In addition, as shown in fig. 3, during evaporation, the material to be evaporated can pass through the mask openings 110 and be deposited in the openings 210 to be evaporated by corresponding the mask openings 110 to the openings 210 to be evaporated. Based on the above structure adjustment of the mask opening 110, the material to be evaporated can be uniformly deposited in the evaporation opening 210, thereby ensuring the evaporation precision and the yield of the prepared OLED product. The material to be evaporated here may include various materials forming the light emitting layer of the OLED, which have been described above and will not be described here. Of course, the material to be evaporated may also include other materials forming the structural layer in the OLED by evaporation, which is not limited in this embodiment.

Referring to fig. 4, the mask opening 110 is a state diagram in which there is no positional deviation between the mask opening 110 and the vapor deposition port 210, and at this time, the mask opening 110 coincides with the center of the vapor deposition port 210. The aligned mask opening 110 'is a state diagram in which the mask opening 110 and the opening 210 to be vapor-deposited are aligned with each other and then have a positional deviation, and at this time, the centers of the aligned mask opening 110' and the opening 210 to be vapor-deposited are misaligned with each other. In fig. 4, the allowable offset amount of the mask opening 110 with respect to the vapor deposition port 210 is OB.

Referring to fig. 5, the allowable offset OA in the related art is significantly smaller than the allowable offset OB of the mask opening 110 provided in the embodiment of the present application. Therefore, according to the application, the corner of the mask opening 110 is expanded outwards to form the expanded part, so that the purpose of increasing the allowable offset of the mask opening 110 relative to the evaporation coating port 210 is achieved, and the evaporation coating precision and the yield of OLED products prepared by mask plates are improved. It should be noted that the allowable offset amount between the mask opening 110 and the vapor deposition port 210 may be in any direction, and the present application is only described by the direction shown in the drawing, and the direction of the allowable offset amount is not limited. That is, the mask openings 110 and the openings 210 to be evaporated are allowed to be offset in the same direction, but not limited to the same direction, the opposite direction, the vertical direction, or the angle.

Further, as shown in fig. 3, S1 includes: the mask opening 110 comprises a plurality of straight line segments 111 which are sequentially connected end to end, two adjacent straight line segments 111 are connected through an arc line segment 113, and the arc line segment 113 forms a corner of the mask opening 110; the shape of the corner is adjusted so that the arc segment 113 is offset in a direction away from the center of the mask opening 110 and forms an flaring portion.

It should be noted that, the arc segment 113 is shifted toward a direction away from the center of the mask opening 110 to form an outward expansion portion, so as to adjust the local structure of the mask opening 110, thereby increasing the opening area of the mask opening 110 and avoiding excessive damage to the mask opening 110. In addition, the allowable offset of the mask opening 110 relative to the evaporation opening 210 can be increased, so that the yield of the OLED product prepared by the mask plate is increased.

Continuing to refer to fig. 3, the junction of the arc segment 113 and the straight segment 111 is provided with an arc transition segment 114.

It should be noted that by providing the arc transition section 114 at the connection between the arc segment 113 and the straight segment 111, smooth connection between the arc segment 113 and the straight segment 111 is achieved, and wrinkles at the connection can be avoided, thereby preventing the mask opening 110 from cracking at the wrinkles due to excessive stress concentration. Moreover, the arc transition section 114 can also enable the evaporation material to uniformly deposit in the evaporation port 210 after passing through the mask opening 110, so that the deposition uniformity and the evaporation precision of the evaporation material are improved.

Specifically, in the mask opening 110, the rounding line 112 between two adjacent straight line segments 111 is located on one side of the arc line segment 113 close to the center of the mask opening 110, and the curvature radius of the arc line segment 113 is equal to that of the rounding line 112.

It should be noted that, by setting the radius of curvature of the arc segment 113 to be equal to the radius of curvature of the round line 112, it can be ensured that etching is performed along the existing round line 112 in the preparation process of the flaring portion, so that flaring is performed at the position of the round line 112 to form the flaring portion, thereby reducing the steps and costs of design and/or manufacturing increased by corner flaring.

In one implementation, the center of the arc line segment 113, the center of the rounding line 112, and the center of the mask opening 110 are all located on the same straight line.

It should be noted that, by setting the center of the arc line segment 113, the center of the rounding line 112, and the center of the mask opening 110 as three collinear points, it can be ensured that the shape of the mask opening 110 is regular. In the process of preparing the flaring portion, on the connection line between the center of the rounding line 112 and the center of the mask opening 110, the existing rounding line 112 is only required to be etched in the direction away from the center of the mask opening 110, and the flaring portion can be formed. Thus, the etching direction can be provided for the preparation process of the flaring portion, so that the difficulty of forming the flaring portion by the arc segment 113 and the difficulty of compensation adjustment of the mask opening 110 are reduced.

In addition, as shown in fig. 6, S3 includes:

the layer to be evaporated is provided with a plurality of openings 210 to be evaporated, and the plurality of mask openings 110 and the plurality of openings 210 to be evaporated are arranged in a one-to-one correspondence manner.

It should be noted that, taking the layer to be evaporated as an example of the light emitting layer, the light emitting layer includes a plurality of light emitting units, and each light emitting unit needs to deposit various materials of the light emitting layer. Therefore, the layer to be evaporated is provided with a plurality of openings 210 to be evaporated, and each opening 210 to be evaporated corresponds to one light emitting unit. Moreover, the plurality of mask openings 110 and the plurality of evaporation ports 210 to be evaporated are arranged in a one-to-one correspondence manner, so that the materials to be evaporated through each evaporation port 210 to be evaporated can be accurately deposited in the corresponding mask opening 110, and the evaporation precision is ensured.

Further, as shown in fig. 3 and 6, S3 includes:

in the same mask opening 110, the maximum distance between the adjacent rounded lines 112 and the arc line segments 113 is a first distance; the minimum distance between two adjacent openings to be evaporated 210 is a second distance; the ratio of the first pitch to the second pitch ranges from 3 to 20%.

It should be noted that the first pitch may be represented by d1 in fig. 3, the second pitch may be represented by d2 in fig. 6, and the two satisfy the following relation: d1 is (0.03-0.2) d 2. By means of the arrangement, the allowable offset of the mask opening 110 relative to the evaporation port 210 to be evaporated can be increased on the premise that resolution of an OLED product is not affected, and evaporation accuracy is improved. The ratio of d1 to d2 ranges from 3 to 20%. Wherein, the ratio can be in the range of 3%, 5%, 8%, 10%, 12%, 15%, 18%, 20%, preferably 6-9%.

When the ratio is less than 3%, the increase value of the allowable offset is small, so that the evaporation precision is not obviously improved; when the above ratio is greater than 20%, it is difficult to arrange adjacent mask openings 110 closely, which may reduce the distribution density of the mask openings 110, resulting in a reduction in the display resolution of the OLED.

Further, as shown in fig. 3 to 6, among the corners of the mask opening 110, the corner formed with the flared portion is disposed to face each other.

It should be noted that, in the corners of the mask opening 110, the corners formed with the outward-expanded portions are arranged oppositely, so that when the mask opening 110 moves along a certain direction relative to the evaporation opening 210 to be evaporated, the allowable offset of the two directions can be improved in the direction and the direction opposite to the direction, thereby being more beneficial to improving the yield of the OLED product prepared by the mask plate.

As an implementation, if the mask opening 110 has four corners, there may be a pair of corners formed with the flaring portion, and the pair of corners is located on a diagonal line of the mask opening 110. As another realizable embodiment, there may be two pairs of corners formed with the flaring portion, and the two pairs of corners are located on two diagonal lines of the mask opening 110, respectively.

Also, as shown in fig. 3 to 6, the mask opening may be a parallelogram. Through setting up mask opening 110 into parallelogram, be favorable to realizing arranging and processing of mask opening 110, reduce the design and the processing cost of mask opening 110, still be favorable to the material of luminescent layer evenly deposit in treating coating by vaporization mouth 210 behind mask opening 110 to improve the coating by vaporization precision.

As an implementation, the mask openings may also be diamond shaped or rectangular. By setting the mask opening 110 to be a diamond shape, four sides of the mask opening 110 are equal, so that the processing of the mask opening 110 is simpler; by setting the mask opening 110 to be rectangular, the four corners of the mask opening 110 are right angles, so that the problem that the material of the light-emitting layer cannot pass through smoothly due to the small corners can be avoided.

Alternatively, the mask opening may be square. By setting the mask opening 110 to be square, four sides of the mask opening 110 are equal, and four corners are right angles, so that the design and processing difficulty of the mask opening 110 can be reduced; the allowable offset difference of the mask plate to the evaporation port 210 to be evaporated along each direction is small, which is beneficial to improving the evaporation precision.

It should be noted that such an arrangement is beneficial to realizing the arrangement and processing of the mask openings 110, and is also beneficial to uniformly depositing the material of the light-emitting layer in the to-be-evaporated opening 210 after passing through the mask openings 110, thereby improving the evaporation precision. In practical applications, the user can adjust the specific shape of the mask opening 110 according to the requirement, which is not limited in this embodiment.

On the basis of the foregoing embodiment, referring to fig. 7, a possible embodiment of the present application further provides an evaporation system, which includes a mask plate 11 and a layer to be evaporated 21, where the mask plate 11 is paired with the layer to be evaporated 21, and the mask plate 11 is compensated and adjusted by the mask compensation method.

Specifically, the coating by vaporization system that this application embodiment provided, including the mask plate with treat the coating by vaporization layer, be equipped with the mask opening respectively on the mask plate with treat the coating by vaporization layer and treat the coating by vaporization mouth, the mask plate with treat that the coating by vaporization layer closes the back, adopt the mode of coating by vaporization and form the luminescent layer in treating the coating by vaporization mouth, and through form the outer portion that expands in mask open-ended corner, increase the mask opening and treat the permission offset of coating by vaporization mouth relatively, and then improve the yield of the OLED product of coating by vaporization precision and mask plate preparation.

In the vapor deposition, the layer to be vapor deposited 21 is first placed on the substrate 31, and then the mask plate 11 is aligned with the layer to be vapor deposited 21, and the mask opening 110 is disposed opposite to the vapor deposition port 210 in the alignment.

The detailed operation process and explanation of the mask compensation method have been described in detail in the above embodiments, and are not repeated herein.

In the description of the embodiments of the present application, it should be understood that the terms "mounted," "connected," and "connected" are used broadly and can refer to a fixed connection, an indirect connection through intermediary media, communication between two elements, or an interaction between two elements, for example, unless explicitly stated or limited otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate. The terms "upper," "lower," "front," "rear," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like refer to an orientation or positional relationship indicated in the drawings for convenience in describing the present application and to simplify description, but do not indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application. In the description of the present application, "a plurality" means two or more unless specifically stated otherwise.

The terms "first," "second," "third," "fourth," and the like in the description and in the claims of the present application and in the above-described drawings are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the application described herein are, for example, capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.

Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.

Claims

1. A mask compensation method, comprising:

and the mask plate is abutted to the to-be-evaporated layer, and the mask opening corresponds to the to-be-evaporated opening of the to-be-evaporated layer.

2. The mask compensation method as claimed in claim 1, wherein the step of adjusting the shape of the mask opening and forming a flared portion at least one corner of the mask opening comprises:

and adjusting the shape of the corner to enable the arc line segment to deviate towards the direction far away from the center of the mask opening, and forming the outward expansion part.

3. The mask compensation method of claim 2, wherein a circular arc transition section is provided at a junction of the arc segment and the straight segment.

4. The mask compensation method as claimed in claim 2, wherein a rounding line between two adjacent straight line segments is located on a side of the arc line segment near the center of the mask opening, and a radius of curvature of the arc line segment is equal to a radius of curvature of the rounding line.

5. The mask compensation method of claim 4, wherein the center of the arc segment, the center of the rounding line and the center of the mask opening are all located on the same straight line.

6. The mask compensation method according to claim 4, wherein the step of matching the mask plate with the layer to be evaporated, wherein the mask opening corresponds to the opening to be evaporated of the layer to be evaporated, comprises:

treat to be provided with on the evaporation coating a plurality of treat the coating by vaporization mouth, it is a plurality of mask opening and a plurality of treat that the coating by vaporization mouth one-to-one sets up.

7. The mask compensation method according to claim 6, wherein the step of matching the mask plate with the layer to be evaporated, wherein the mask opening corresponds to the opening to be evaporated of the layer to be evaporated, comprises:

in the same mask opening, the maximum distance between the adjacent rounding lines and the arc line sections is a first distance;

the minimum distance between every two adjacent openings to be evaporated is a second distance;

the ratio of the first pitch to the second pitch ranges from 3 to 20%.

8. The mask compensation method of any one of claims 1 to 7, wherein, of the corners of the mask opening, the corners formed with the flared portions are disposed oppositely.

9. The mask compensation method of any one of claims 1-7, wherein the mask openings are parallelogram shaped;

preferably, the mask opening is rhombic or rectangular;

preferably, the mask opening is square.

10. An evaporation system is characterized by comprising a mask plate and a layer to be evaporated, wherein the mask plate is abutted with the layer to be evaporated, and the mask plate is compensated and adjusted by the mask compensation method according to any one of claims 1 to 9.