CN113543454A

CN113543454A - Preparation method of circuit board assembly and circuit board assembly

Info

Publication number: CN113543454A
Application number: CN202010297118.0A
Authority: CN
Inventors: 李成佳
Original assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Current assignee: Hongqisheng Precision Electronics Qinhuangdao Co Ltd; Avary Holding Shenzhen Co Ltd
Priority date: 2020-04-15
Filing date: 2020-04-15
Publication date: 2021-10-22

Abstract

A method of making a circuit board assembly comprising the steps of: providing a first circuit board, wherein the first circuit board comprises a first base layer and a first circuit layer, and the first circuit board is provided with a first side surface; providing a second circuit board, wherein the second circuit board comprises a second base layer and a second circuit layer, and the second circuit board is provided with a second side surface; forming a first plating layer on the surface of the first base layer on the first side surface and forming a second plating layer on the surface of the second base layer on the second side surface, wherein the first plating layer is connected with the first circuit layer, and the second plating layer is connected with the second circuit layer; forming a first conducting layer and a second conducting layer on the surfaces of the first coating and the second coating respectively, and pressing to connect the first conducting layer and the second conducting layer to form an electric connection part; and filling the colloid in the electric connection part, wherein the colloid coats the electric connection part and is connected with the areas of the first side surface and the second side surface which are not provided with the plating layers so as to form the circuit board assembly. The application also provides a circuit board assembly.

Description

Preparation method of circuit board assembly and circuit board assembly

Technical Field

The present disclosure relates to the field of circuit board manufacturing, and more particularly, to a method for manufacturing a circuit board assembly and a circuit board assembly manufactured by the method.

Background

With the wide application of circuit boards in the electronic field, in order to fully exert the functions of electronic products, two or more circuit boards with different functions are generally required to be connected together to exert the functions in a cooperative manner, so that the requirements of increasing the unit density of parts on a substrate, shortening the length of conductors, reducing the parasitic capacitance effect between lines, improving the connection flatness and the like are always constant technical pursuits.

At present, the connection mode between circuit boards usually has: anisotropic Conductive Film (ACF) connection, thermocompression bonding (Hotbar) process connection, Board To Board (BTB) connection, and the like. However, the above connection method may have disadvantages of increasing a wiring space of the circuit board, reducing flatness of a product, or limiting the kind of the circuit board to be connected, and the circuit board connected by the above connection method cannot be bent during an assembly process.

Disclosure of Invention

In view of the above, it is desirable to provide a method for manufacturing a flexible circuit board assembly that can reduce the wiring space, improve the flatness, and does not limit the types of circuit boards, so as to solve the above problems.

In addition, it is necessary to provide a circuit board assembly.

A method of making a circuit board assembly, comprising the steps of:

providing a first circuit board, wherein the first circuit board comprises a first base layer and at least one first circuit layer formed on the first base layer, and the first circuit board is provided with a first side surface;

providing a second circuit board, wherein the second circuit board comprises a second base layer and a second circuit layer formed on the second base layer, and the second circuit board is provided with a second side surface;

forming a first plating layer on the surface of a first base layer on the first side surface and forming a second plating layer on the surface of a second base layer on the second side surface, wherein the first plating layer is connected with the first circuit layer, and the second plating layer is connected with the second circuit layer;

forming a first conducting layer and a second conducting layer on the surfaces of the first plating layer and the second plating layer respectively, and pressing the first conducting layer and the second conducting layer to connect the first conducting layer and the second conducting layer to form an electric connection part, wherein the first circuit layer and the second circuit layer are electrically connected through the electric connection part; and

and filling glue into the electric connection part, wherein the glue coats the electric connection part and is connected with the first side surface and the second side surface in the areas without the plating layers so as to form the circuit board assembly.

In one embodiment of the present application, before forming the first plating layer and the second plating layer, the method further includes:

and carrying out metallization treatment on the first base layer positioned on the first side surface and the second base layer positioned on the second side surface so as to form a first active layer and a second active layer on the surfaces of the first base layer and the second base layer respectively.

In an embodiment of the present application, at least one of the first circuit layers includes at least one first inner circuit layer and at least one first outer circuit layer, and the manufacturing of the first circuit board includes the following steps:

providing a double-sided copper-clad plate, wherein the double-sided copper-clad plate comprises a first base layer and first copper layers positioned on two opposite surfaces of the first base layer;

exposing and developing the first copper layer to form the first inner circuit layer;

sequentially forming a first glue layer, an insulating layer and a second copper layer on the surface of the first inner circuit layer far away from the first base layer;

exposing and developing the second copper layer to form the first outer circuit layer; and

and forming another first adhesive layer on the surface of the first outer layer circuit layer far away from the first base layer, and covering a first covering layer on each first adhesive layer to obtain the first circuit board.

In one embodiment of the present application, after covering the first covering layer, an intermediate body is obtained, the intermediate body includes a product zone and a waste zone, and the method further includes:

and performing plate edge punching treatment on the intermediate body along the electric connection parts of the product area and the waste area, and removing the waste area to obtain the first circuit board, wherein the electric connection parts of the product area and the waste area form the first side surface.

In an embodiment of the present application, the preparation method further includes exposing and developing the first plating layer to form a conductive circuit electrically connected to the first circuit layer.

A circuit board assembly, comprising: the first circuit board, the second circuit board, the electric connection part and the colloid. The first circuit board comprises a first base layer and a first circuit layer formed on the first base layer, and the first circuit board is provided with a first side surface; the second circuit board comprises a second base layer and a second circuit layer formed on the second base layer, and the second circuit board is provided with a second side surface; the electrical connection portion includes: a first plating layer, a second plating layer and a conducting layer; the first plating layer is electrically connected with the first circuit layer on the first side surface, and the second plating layer is electrically connected with the second circuit layer on the second side surface; the conducting layer coats the first plating layer and the second plating layer and is electrically connected with the first plating layer and the second plating layer; the colloid coats the electric connection part and is connected with the first side surface and the second side surface in the region without the plating layer.

In an embodiment of the present application, the circuit board further includes a first active layer disposed between the first base layer and the first plating layer on the first side, and a second active layer disposed between the second base layer and the second plating layer on the second side.

In an embodiment of the present application, the circuit board assembly further includes a side trace disposed on a surface of the first circuit board and/or the second circuit board, the surface having a direction different from an extending direction of the first circuit board and/or the second circuit board.

In an embodiment of the present application, the colloid covers the side circuit.

In an embodiment of the present application, the number of the electrical connection portions is one or more.

According to the preparation method of the circuit board assembly, the electrical connection parts are formed on the side surfaces of the first circuit board and the second circuit board, the side space of the circuit boards is fully utilized, the electrical connection of the circuit boards can be realized without changing the circuit on the original circuit board or increasing the thickness of the circuit board, the space utilization rate of the circuit boards is improved, the connection flatness is improved, and compared with the circuit board assembly connected by other circuit board connection methods, the length of a circuit layer can be shortened, so that the parasitic capacitance between the circuit layers is reduced; in addition, the type of the circuit board is not limited; the electric connection part is coated and connected with the first circuit board and the second circuit board through the colloid, so that the circuit board can be bent.

Drawings

Fig. 1 is a schematic cross-sectional view of a double-sided copper-clad plate provided in an embodiment of the present application.

Fig. 2 is a schematic cross-sectional view of a first inner circuit layer formed after exposure and development of a first copper layer of the double-sided copper-clad plate shown in fig. 1.

Fig. 3 is a schematic cross-sectional view of the first inner circuit layer shown in fig. 2 after a first glue layer, an insulating layer and a second copper layer are sequentially formed on the surface of the first inner circuit layer away from the first base layer.

Fig. 4 is a schematic cross-sectional view of the second copper layer shown in fig. 3 after exposure and development to form a first outer circuit layer.

Fig. 5 is a schematic cross-sectional view of the first circuit board obtained after the first cover film is formed on the surface of the first outer circuit layer away from the first base layer shown in fig. 4.

Fig. 6 is a schematic cross-sectional view of a second circuit board according to an embodiment of the present disclosure.

Fig. 7 is a schematic cross-sectional view of a first active layer formed on a first side of a first circuit board.

Fig. 8 is a schematic cross-sectional view of forming a first plating layer on the first active layer shown in fig. 7.

Fig. 9 is a schematic cross-sectional view of a first conductive layer formed on a surface of the first plating layer shown in fig. 8.

Fig. 10 is a schematic cross-sectional view of a first conductive layer of a first circuit board and a second conductive layer of a second circuit substrate before lamination according to an embodiment of the present application.

Fig. 11 is a schematic cross-sectional view of the first conductive layer and the second conductive layer after being laminated.

Fig. 12 is a schematic cross-sectional view of the circuit board obtained after filling the gel.

Description of the main elements

Circuit board assembly 100

First circuit board 10

First base layer 11

Insulating layer 114

First wiring layer 12

First inner circuit layer 122

First outer circuit layer 124

First cover film 135

First cover layer 13

First adhesive layer 14

First side 15

First

active layer

16, 16a

First plating

layers

17, 17a

First

conductive layers

18, 18a

Double-sided copper-clad plate 191

First copper layer 192

Second copper layer 195

Second circuit board 20

Second base layer 21

Second wiring layer 22

Second cover film 235

Second adhesive layer 23

Second cover layer 24

Second side 25

Second active layer 26

Second plating layer 27

Second conductive layer 28

Electrical connection 30

Side circuit 40

Gel 50

The following detailed description will further illustrate the present application in conjunction with the above-described figures.

Detailed Description

In order that the above objects, features and advantages of the present application can be more clearly understood, a detailed description of the present application will be given below with reference to the accompanying drawings and detailed description. In addition, the embodiments and features of the embodiments of the present application may be combined with each other without conflict. In the following description, numerous specific details are set forth to provide a thorough understanding of the present application, and the described embodiments are merely a subset of the embodiments of the present application, rather than all embodiments. All other embodiments obtained by a person of ordinary skill in the art without any inventive work based on the embodiments in the present application are within the scope of protection of the present application.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and/or" includes all and any combination of one or more of the associated listed items.

In various embodiments of the present application, for convenience in description and not limitation, the term "coupled" as used in the specification and claims of the present application is not limited to physical or mechanical connections, either direct or indirect. "upper", "lower", "above", "below", "left", "right", and the like are used merely to indicate relative positional relationships, and when the absolute position of the object being described is changed, the relative positional relationships are changed accordingly.

Referring to fig. 1 to 12, an embodiment of the present invention provides a method for manufacturing a circuit board assembly 100, including the following steps:

step S1: referring to fig. 1 to 5, a first circuit board 10 is provided, where the first circuit board 10 includes a first base layer 11 and at least a first circuit layer 12 formed on the first base layer 11, and the first circuit board 10 has a first side surface 15.

In some embodiments, the first circuit board 10 may be a single-layer circuit board, a double-layer circuit board, or a multi-layer circuit board. In the present embodiment, the first circuit board 10 is a multilayer circuit board.

In some embodiments, the first circuit board 10 may be a flexible board, a rigid board or a rigid-flex board.

Specifically, the number of the first circuit layers 12 on one side of the first base layer 11 is plural, and each of the plural first circuit layers includes at least one first inner circuit layer 122 and one first outer circuit layer 124. A first glue layer 14 and an insulating layer 114 are arranged between two adjacent first inner layer circuit layers 122 and between the adjacent first inner layer circuit layers 122 and the first outer layer circuit layer 124. The first glue layer 14 fills the space between the insulating layer 114 and the first inner layer circuit layer 122 or the first outer layer circuit layer 124.

A first cover film 135 is further formed on the first outer circuit layer 124. The first cover film 135 includes another first glue layer 14 and a first cover layer 13 sequentially formed on the first outer circuit layer 124.

In this embodiment, the first adhesive layer 14 is made of polyimide, and the first cover layer 13 is made of polyvinyl chloride. The materials of the first adhesive layer 14 and the first covering layer 13 may be selected according to the requirement, and are not limited herein.

The direction of the first side 15 is different from the extension direction of the first circuit board 10. In the present embodiment, the direction of the first side surface 15 is perpendicular to the extending direction of the first circuit board 10.

In this embodiment, the first circuit board 10 is manufactured as follows:

step S101: referring to fig. 1, a double-sided copper clad laminate 191 is provided.

The double-sided copper-clad plate 191 comprises the first base layer 11 and first copper layers 192 positioned on two opposite surfaces of the first base layer 11. The material of the first base layer 11 may be one of Polyimide (PI), glass fiber epoxy (FR4), polyethylene terephthalate (PET), polyethylene naphthalate (PEN), and Polyethylene (PE). In this embodiment, the material of the first base layer 11 is polyimide.

Step S102: referring to fig. 2, the first copper layer 192 is exposed and developed to form the first inner circuit layer 122.

Further, the first copper layer 192 may be browned prior to exposure development, increasing the roughness of the first copper layer 192. Furthermore, the oxide film (not shown) on the surface of the first copper layer 192 may be further removed.

Step S103: referring to fig. 3, a first glue layer 14, an insulating layer 114 and a second copper layer 195 are sequentially formed on the surface of the first inner circuit layer 122 away from the first base layer 11.

In this embodiment, the material of the insulating layer 114 may be one of polyimide, glass epoxy resin, polyethylene terephthalate, polyethylene naphthalate, and polyethylene. In this embodiment, the insulating layer 114 is made of polyimide.

Step S104: referring to fig. 4, the second copper layer 195 is exposed and developed to form the first outer circuit layer 124.

Further, the second copper layer 195 may be browned prior to exposure development, increasing the roughness of the second copper layer 195. Furthermore, the oxide film (not shown) on the surface of the second copper layer 195 may be further removed.

Step S105: referring to fig. 5, another first adhesive layer 14 is formed on the surface of the first outer circuit layer 124 away from the first base layer 11, and each first adhesive layer 14 covers the first covering layer 13 to form an intermediate body (not shown).

Wherein the intermediate body comprises a product zone and a waste zone connected with the product zone.

Step S106: and performing plate edge punching treatment on the intermediate body along the electric connection part of the product area and the waste area, and removing the waste area to obtain the first circuit board 10. Wherein the electrical connection of the product area and the waste area forms the first side 15 which is flat.

Step S2: referring to fig. 6, a second circuit board 20 is provided, where the second circuit board 20 includes a second base layer 21 and at least one second circuit layer 22 formed on the second base layer 21, and the second circuit board 20 has a second side surface 25.

In some embodiments, the second circuit board 20 may be a single-layer circuit board, a double-layer circuit board, or a multi-layer circuit board. In the present embodiment, the second circuit board 20 is a double-layer circuit board.

In some embodiments, the second circuit board 20 may be a flexible board, a rigid board, or a rigid-flex board.

Specifically, the number of the second circuit layers 22 on one side of the second base layer 21 is one, that is, one second circuit layer 22 is disposed on each of two opposite surfaces of the second base layer 21.

A second cover film 235 is also formed on the second circuit layer 22. The second cover film 235 includes a second glue layer 23 and a second cover layer 24 sequentially formed on the second circuit layer 22.

The direction of the second side 25 is different from the extension direction of the second circuit board 20. In the present embodiment, the direction of the second side surface 25 is perpendicular to the extending direction of the second circuit board. A surface of the second substrate 21 and a surface of the second circuit layer 22 are exposed at the second side surface 25.

A person skilled in the art can perform simple replacement manufacturing on the second circuit board 20 according to the manufacturing steps of the first circuit board 10, which is not described herein again.

Step S3: referring to fig. 7 to 10, the first base layer 11 on the first side surface 15 and the second base layer 21 on the second side surface 25 are metallized to form a first active layer 16 and a second active layer 26 on the surfaces of the first base layer 11 and the second base layer 21, respectively.

The metallization process includes, but is not limited to, sputtering, coating, electroless plating, and electrodeposition, and the metallization process is to form a first active layer 16 on the first base layer 11 at the first side 15 and a second active layer 26 on the second base layer 21 at the second side 25, so as to provide an attachment point for a plating layer formed in a subsequent process, thereby uniformly attaching the plating layer to the surface of the first base layer 11 at the first side 15 and increasing the contact performance of the plating layer with the first side 15 of the first circuit board 10. The surface of the insulating layer 114 on the first side surface 15 is metallized to form a first active layer 16 a.

One skilled in the art can select different metallization methods according to the needs (e.g., the materials of the first base layer 11 and the second base layer 21, and the purpose of metallization), which is not limited herein. In the present embodiment, the first circuit board 10 is metallized by electroless plating, and the first base layer 11 is metallized as an example.

Specifically, referring to fig. 7, at least the first side surface 15 of the first circuit board 10 is immersed in a KOH aqueous solution to be roughened, so that functional groups such as amino groups (-NH) and carboxylate groups (-COO-) are formed on the surfaces of the first base layer 11 and the insulating layer 114 on the first side surface 15; will be provided withThe first circuit board 10 at the end of the roughened first side surface 15 is placed in the Pd-containing substrate²⁺In solution of catalyst, then Pd is reacted under the action of reducing agent²⁺Reduced to Pd and attached to the surfaces of the first base layer 11 and the insulating layer 114, and then a Ni-Pd alloy layer (i.e., the first active layer 16 and the first active layer 16a) is formed on the surfaces of the first base layer 11 and the insulating layer 114 by alkaline electroless nickel plating with Pd as a catalyst, thereby completing the metallization process.

Step S4: referring to fig. 8, a first plating layer 17 is formed on the first active layer 16, and a second plating layer 27 (see also fig. 10) is formed on the second active layer 26, wherein the first plating layer 17 is connected to the first circuit layer 12 on the first side surface 15, and the second plating layer 27 is connected to the second circuit layer 22 on the second side surface 25.

Methods of forming the first and second plating layers 17 and 27 include, but are not limited to, electroplating, electroless plating (e.g., chemical deposition), and the like. In this embodiment, the first plating layer 17 and the second plating layer 27 are formed by electroplating. The first plating layer 17 is formed on the surface of the first active layer 16, the first plating layer 17a is formed on the surface of the first active layer 16a, the first plating layer 17 is connected to the first inner circuit layer 122, the first plating layer 17a is connected to the first outer circuit layer 124, wherein the first plating layer 17 is further connected to the first inner circuit layer 122 on the opposite surfaces of the first base layer 11; the second plating layer 27 is formed on the surface of the second active layer 26, and the second plating layer 27 connects the second wiring layers 22 on the opposite surfaces of the second base layer 21.

In another embodiment, the first plating layer 17 and the first plating layer 17a may be further exposed and developed to form a conductive circuit electrically connected to the first circuit layer 12. In this embodiment, the first plating layer 17a is electrically connected to the first outer layer circuit layer 124.

In another embodiment, the first plating layer 17a may also be located on another side (not shown) of the first circuit board 10, i.e. a side different from the first side 15, and the direction of the side is different from the extending direction of the first circuit board 10.

Step S5: referring to fig. 9, 10 and 11, a first conductive layer 18 and a second conductive layer 28 are respectively formed on the surfaces of the first plating layer 17 and the second plating layer 27 and are pressed together to connect the first conductive layer 18 and the second conductive layer 28 to form an electrical connection portion 30, and the first circuit layer 12 and the second circuit layer 22 are electrically connected through the electrical connection portion 30.

In order to prevent oxidation of the first plating layer 17 and the second plating layer 27, the first conductive layer 18 and the second conductive layer 28 are formed on the surfaces of the first plating layer 17 and the second plating layer 27, respectively, and a first conductive layer 18a is formed on the surface of the first plating layer 17 a.

Methods for forming the first and second

conductive layers

18 and 28 include, but are not limited to, tin plating, gold plating, tin spraying, silver depositing, and organic solder mask. In this embodiment, the first conductive layer 18 and the second conductive layer 28 are formed using tin.

The first conducting layer 18 and the second conducting layer 28 are pressed in a hot pressing manner, and the first conducting layer 18 and the second conducting layer 28 are connected with each other to form an electrical connection portion 30, so that the first circuit board 10 and the second circuit board 20 are connected into a whole, and the first circuit board 10 and the second circuit board 20 are electrically connected. The electrical connection portions 30 are located on the side surfaces (i.e., the first side surface 15 and the second side surface 25) of the first circuit board 10 and the second circuit board 20, and do not occupy areas (e.g., the upper surface and the lower surface of the circuit board assembly 100) different from the side surfaces of the circuit board assembly 100, so that the thickness of the circuit board assembly 100 is not increased, and the space utilization rate of the circuit board assembly 100 can be improved.

In the present embodiment, the number of the electrical connection portions 30 is one. It is understood that in other embodiments, the number of the electrical connection portions 30 may be plural.

In this embodiment, the number of the circuit boards connected by the electrical connection portion 30 is two, and in other embodiments, a plurality of circuit boards may be connected to each other by a plurality of electrical connection portions 30, so that the flexibility is high, and the invention is not limited herein.

Further, in the embodiment, the first plating layer 17a formed on the surface of the insulating layer 114 and the first conductive layer 18a formed on the surface of the first plating layer 17a do not have the corresponding second conductive layer 28 pressed thereon, and the first plating layer 17a formed on the surface of the insulating layer 114 can be designed as the side circuit 40, that is, a circuit can be additionally designed on the side without changing the circuit design inside the first circuit board 10 and the second circuit board 20, so as to increase the wiring area and further improve the space utilization rate of the circuit board assembly 100 per unit density.

Step S6: referring to fig. 12, a glue 50 is filled in the electrical connection portion 30, and the glue 50 covers the electrical connection portion 30 and is connected to the first side surface 15 and the second side surface 25 in the areas where no plating layer is disposed, so as to form the circuit board assembly 100.

In this embodiment, an underfill process is performed between the first side surface 15 and the second side surface 25 and is cured to form the encapsulant 50, the encapsulant 50 covers the electrical connection portion 30 and connects the first side surface 15 and the second side surface 25, and an outer surface of the encapsulant 50 is inclined. The adhesive 50 can meet the winding and folding requirements, and can realize three-dimensional packaging of the circuit board assembly 100.

Referring to fig. 12 again, the present application further provides a circuit board assembly 100, wherein the circuit board assembly 100 includes a first circuit board 10, a second circuit board 20, an electrical connection portion 30 and a sealant 50. The first circuit board 10 includes a first base layer 11 and a first circuit layer 12 formed on the first base layer 11, the first circuit board 10 has a first side 15; the second circuit board 20 comprises a second base layer 21 and a second circuit layer 22 formed on the second base layer 21, the second circuit board 20 has a second side surface 25; the electrical connection portion 30 includes a first plating layer 17, a second plating layer 27, and a conductive layer, the first plating layer 17 is electrically connected to the first circuit layer 12 on the first side surface 15, the second plating layer 27 is electrically connected to the second circuit layer 22 on the second side surface 25, and the conductive layer covers the first plating layer 17 and the second plating layer 27 and electrically connects the first plating layer 17 and the second plating layer 27; the glue 50 covers the electrical connection portion 30 and connects the first side surface 15 and the second side surface 25 in the areas where no plating layer is disposed.

The first circuit board 10 may be a single-layer circuit board, a double-layer circuit board, or a multi-layer circuit board; the second circuit board 20 may be a single-layer circuit board, a double-layer circuit board, and a multi-layer circuit board. In this embodiment, the first circuit board 10 is a multilayer circuit board, and the second circuit board 20 is a double-layer circuit board.

The circuit board assembly 100 further includes a first active layer 16 and a second active layer 26, the first active layer 16 is disposed between the first base layer 11 and the first plated layer 17 on the first side surface 15, and the second active layer 26 is disposed between the second base layer 21 and the second plated layer 27 on the second side surface 25.

Referring to fig. 9, the circuit board assembly 100 further includes a side circuit 40, where the side circuit 40 is disposed on a side of the first circuit board 10 and/or the second circuit board 20, such as the first side 15 or the second side 25, where a direction of the side circuit is different from an extending direction of the first circuit board 10 and/or the second circuit board 20. The side circuit 40 is connected to the first circuit layer 12 or the second circuit layer 22 to form a complete circuit layer. The colloid 50 covers the side circuit 40.

In this embodiment, the side wiring 40 is located on the first side surface 15, the side wiring 40 includes the first active layer 16a, the first plating layer 17a, and the first conductive layer 18a, and the side wiring 40 is connected to the first wiring layer 12.

According to the preparation method of the circuit board assembly 100, the electrical connection parts are formed on the side surfaces of the first circuit board 10 and the second circuit board 20, the side space of the circuit boards is fully utilized, the electrical connection of a plurality of circuit boards can be realized without changing the circuits on the original circuit boards or increasing the thickness of the circuit boards, the space utilization rate of the circuit boards is improved, the connection flatness is improved, and compared with the circuit board assembly 100 connected by other circuit board connection methods, the length of the circuit layers can be shortened, so that the parasitic capacitance between the circuit layers is reduced; in addition, the type of the circuit board is not limited; the electrical connection portion 30 is covered and connected to the first circuit board 10 and the second circuit board 20 by the adhesive 50, so that the circuit board can be bent.

Although the present application has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted without departing from the spirit and scope of the present application.

Claims

1. A method for manufacturing a circuit board assembly, comprising the steps of:

2. The method of manufacturing a circuit board assembly according to claim 1, further comprising, before forming the first plating layer and the second plating layer, the steps of:

3. The method of claim 1, wherein the at least one first circuit layer comprises at least one first inner circuit layer and at least one first outer circuit layer, and the step of fabricating the first circuit board comprises:

4. The method of manufacturing a circuit board assembly of claim 3, wherein after covering the first cover layer, an intermediate body is obtained, the intermediate body including a product area and a waste area, the method further comprising:

5. The method of manufacturing a circuit board assembly according to claim 1, further comprising exposing and developing the first plating layer to form a conductive circuit electrically connected to the first wiring layer.

6. A circuit board assembly, comprising:

the first circuit board comprises a first base layer and a first circuit layer formed on the first base layer, and the first circuit board is provided with a first side surface;

the second circuit board comprises a second base layer and a second circuit layer formed on the second base layer, and the second circuit board is provided with a second side surface;

an electrical connection portion comprising:

the first plating layer is electrically connected with the first circuit layer on the first side surface;

a second plating layer electrically connected to the second circuit layer at the second side; and

a conductive layer that coats the first plating layer and the second plating layer and is electrically connected to the first plating layer and the second plating layer; and

and the colloid coats the electric connection part and is connected with the first side surface and the area of the second side surface where the plating layer is not arranged.

7. The circuit board assembly of claim 6, wherein the circuit board further comprises a first active layer disposed between the first base layer and the first plating layer on the first side and a second active layer disposed between the second base layer and the second plating layer on the second side.

8. The circuit board assembly according to claim 7, further comprising side traces disposed at a side of the first circuit board and/or the second circuit board having a direction different from an extending direction of the first circuit board and/or the second circuit board.

9. The circuit board assembly of claim 8, wherein the gel encapsulates the side traces.

10. The circuit board assembly of claim 6, wherein the number of electrical connections is one or more.