CN113541850B - Light splitting device, light splitting device manufacturing method and optical access system - Google Patents

Light splitting device, light splitting device manufacturing method and optical access system Download PDF

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Publication number
CN113541850B
CN113541850B CN202110818191.2A CN202110818191A CN113541850B CN 113541850 B CN113541850 B CN 113541850B CN 202110818191 A CN202110818191 A CN 202110818191A CN 113541850 B CN113541850 B CN 113541850B
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optical
layer
optical waveguide
light splitting
splitter
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CN113541850A (en
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余长亮
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Fiberhome Telecommunication Technologies Co Ltd
Wuhan Fisilink Microelectronics Technology Co Ltd
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Fiberhome Telecommunication Technologies Co Ltd
Wuhan Fisilink Microelectronics Technology Co Ltd
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    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04JMULTIPLEX COMMUNICATION
    • H04J14/00Optical multiplex systems
    • H04J14/02Wavelength-division multiplex systems
    • H04J14/0201Add-and-drop multiplexing
    • H04J14/0202Arrangements therefor
    • GPHYSICS
    • G02OPTICS
    • G02BOPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B6/00Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
    • G02B6/10Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type
    • G02B6/12Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings of the optical waveguide type of the integrated circuit kind
    • G02B6/122Basic optical elements, e.g. light-guiding paths
    • G02B6/125Bends, branchings or intersections
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04JMULTIPLEX COMMUNICATION
    • H04J14/00Optical multiplex systems
    • H04J14/02Wavelength-division multiplex systems
    • H04J14/0201Add-and-drop multiplexing
    • H04J14/0202Arrangements therefor
    • H04J14/0204Broadcast and select arrangements, e.g. with an optical splitter at the input before adding or dropping
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04JMULTIPLEX COMMUNICATION
    • H04J14/00Optical multiplex systems
    • H04J14/02Wavelength-division multiplex systems
    • H04J14/0227Operation, administration, maintenance or provisioning [OAMP] of WDM networks, e.g. media access, routing or wavelength allocation
    • H04J14/0254Optical medium access
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04QSELECTING
    • H04Q11/00Selecting arrangements for multiplex systems
    • H04Q11/0001Selecting arrangements for multiplex systems using optical switching
    • H04Q11/0062Network aspects
    • H04Q11/0067Provisions for optical access or distribution networks, e.g. Gigabit Ethernet Passive Optical Network (GE-PON), ATM-based Passive Optical Network (A-PON), PON-Ring

Abstract

The invention discloses a light splitting device, a manufacturing method of the light splitting device and an optical access system, wherein the light splitting device comprises a first 1:2 light splitting part, the tail ends of two branch optical waveguides of the first 1:2 light splitting part are respectively provided with a first WDM filter, a second 1:2 light splitting part and a first optical waveguide are arranged behind each first WDM filter in parallel, and the first WDM filters are used for separating uplink and downlink optical signals from local area intercommunication optical signals; the main optical waveguide of the second 1:2 light splitting part is butted with the corresponding first WDM filter; the two second 1:2 optical splitters are communicated through respective first branch optical waveguides so as to establish a transmission path of local intercommunication optical signals between the two branch optical waveguides of the first 1:2 optical splitters. By the scheme, each user terminal optical modem can directly carry out optical communication on the bottom layer, and the local area intercommunication function is realized for terminal optical modem users under the same ODN of the optical access network.

Description

Light splitting device, light splitting device manufacturing method and optical access system
[ technical field ] A method for producing a semiconductor device
The present invention relates to a light splitting device, a method for manufacturing the light splitting device, and an optical access system, and more particularly, to a light splitting device, a method for manufacturing the light splitting device, and an optical access system.
[ background of the invention ]
With the popularization and application of broadband services such as electronic commerce, 4K/8K high-definition video, internet of things, cloud computing and the like, and the gradual rise of ultra-wideband services such as VR (Virtual Reality), AI (Artificial Intelligence), smart cities and the like in the future, network equipment needs to meet the characteristic requirements of ultra-wideband, ultra-large capacity, low delay and the like, and the popularization and application of broadband services such as electronic commerce, 4K/8K high-definition video, internet of things, cloud computing and the like are greatly promoted to actively upgrade the existing network equipment so as to meet the requirements of emerging services. For example, over the last 20 years, access networks have revolutionized from telephone line access (Kbps rate), to copper line access (Mbps rate), to fiber access (Gbps), increasing the bandwidth rates of home users from the early Kbps level to the Gbps level. At present, Gigabit-Capable Passive Optical Networks (GPON)/Ethernet Passive Optical Networks (EPON) access Network deployment at Gigabit rate is basically completed in China, and the scale commercial deployment stage of 10G-GPON/10G-EPON is entered, and meanwhile, the standard establishment and system prototype development of the next generation 50G-PON are started.
That is, in order to meet the development requirements of broadband and ultra-wideband services, the optical access network has completely entered the optical fiber era from the copper wire era, and the optical fiber access has been basically implemented in china to replace the copper wire access. However, in the process of the access network optical access and the process of the access network optical access, the focus is always on improving the network transmission rate of the terminal user, and the local area intercommunication function advantage of the copper wire access is lost in the optical fiber access. In the copper wire access era, a plurality of users can be simultaneously connected through a router and a switch under the same interface, and a local area network is formed, and the users can directly communicate with each other at the bottom layer. But after entering the optical fiber access era, the terminal optical modem is directly used for entering the home; even if the Optical modems of the Terminal are under the same ODN (Optical Distribution Network) and OLT (Optical Line Terminal), they cannot directly perform local area communication, and it is necessary to establish a physical connection link through the upper layer networks such as the ODN and OLT and then return communication information to both sides. That is, in The current FTTH (Fiber To The Home) network, there is no local communication function between The user terminals of each family and The optical modems.
In view of the above, it is an urgent problem in the art to overcome the above-mentioned drawbacks of the prior art.
[ summary of the invention ]
The present invention provides an optical splitter, a method for manufacturing the optical splitter, and an optical access system, aiming to add a physical interconnection path for optical signals between branches in the optical splitter, so that the optical signals can be directly transmitted between the branches of the optical splitter, thereby solving the technical problem that the local communication function cannot be realized between optical modems of a user terminal.
In order to achieve the above object, according to one aspect of the present invention, there is provided an optical splitting apparatus, comprising a first 1:2 optical splitting element 11, wherein two branch optical waveguide ends of the first 1:2 optical splitting element 11 are respectively provided with a first WDM filter 12, and a second 1:2 optical splitting element 13 and a first optical waveguide 14 are arranged in parallel behind each first WDM filter 12;
the first WDM filter 12 is configured to separate the upstream and downstream optical signals from the local interconnect optical signal; the uplink optical signal transmitted by the first optical waveguide 14 directly passes through the first WDM filter 12 and is transmitted to the corresponding branch optical waveguide of the first 1:2 optical splitter 11, and the local area intercommunication optical signal transmitted by the first optical waveguide 14 is reflected by the first WDM filter 12 and is transmitted to the corresponding second 1:2 optical splitter 13;
the main optical waveguide of the second 1:2 light splitting component 13 is butted with the corresponding first WDM filter 12; the two second 1:2 optical splitters 13 are communicated through respective first branch optical waveguides, so that a transmission path of local intercommunication optical signals is established between the two branch optical waveguides of the first 1:2 optical splitters 11; the end of the second branch optical waveguide of each second 1:2 splitter 13 is provided with an evanescent wave coupling member 15, and the evanescent wave coupling member 15 is communicated with the adjacent optical splitting device so as to transmit local intercommunication optical signals with the adjacent optical splitting device.
Preferably, the second branch optical waveguide of the second 1:2 splitter 13 is a semi-ring optical waveguide for converting the transmission direction by 180 degrees to achieve matching interfacing with the corresponding evanescent wave coupling 15.
Preferably, the evanescent coupling 15 comprises an upper layer optical waveguide, a middle layer optical waveguide and a lower layer optical waveguide, the overlapping portion of the upper layer optical waveguide and the middle layer optical waveguide forming a first evanescent coupling region, and the overlapping portion of the middle layer optical waveguide and the lower layer optical waveguide forming a second evanescent coupling region;
the first evanescent wave coupling region is configured to evanescently couple a local area intercommunication optical signal from the core layer of the upper layer optical waveguide to the core layer of the middle layer optical waveguide, the second evanescent wave coupling region is configured to evanescently couple the local area intercommunication optical signal from the core layer of the middle layer optical waveguide to the core layer of the lower layer optical waveguide, and the lower layer optical waveguide is configured to transmit the local area intercommunication optical signal from below the corresponding branch optical waveguide of the first 1:2 optical splitter 11 to an adjacent optical splitting device.
Preferably, the light splitting device further comprises a third 1:2 light splitting element 16 and a fourth 1:2 light splitting element 17;
the main optical waveguide of the third 1:2 light splitting part 16 is communicated with the first branch optical waveguide of one of the second 1:2 light splitting parts 13, and the first branch optical waveguide of the third 1:2 light splitting part 16 is communicated with the first branch optical waveguide of the other second 1:2 light splitting part 13;
the main optical waveguide of the fourth 1:2 optical splitter 17 is communicated with the evanescent wave coupling component 15 corresponding to one of the second 1:2 optical splitters 13, and the two branch optical waveguides of the fourth 1:2 optical splitter 17 are respectively communicated with the second branch optical waveguide of the other second 1:2 optical splitter 13 and the second branch optical waveguide of the third 1:2 optical splitter 16.
According to a second aspect of the present invention, there is provided a manufacturing method of a light splitting device, for manufacturing the light splitting device according to the first aspect, the manufacturing method including:
processing the substrate by utilizing the first layer of intrinsic material;
manufacturing an upper layer optical waveguide and a middle layer optical waveguide of two evanescent wave coupling pieces 15 on the surface of the substrate through epitaxial growth and etching;
continuously manufacturing upper-layer optical waveguides of two evanescent wave coupling pieces 15 and two second 1:2 light splitting pieces 13 on the surface of the substrate through epitaxial growth and etching;
continuously manufacturing a first 1:2 light splitting part 11 and two first optical waveguides 14 on the surface of the substrate through epitaxial growth and etching, and reserving positions for two first WDM filters 12;
the two first WDM filters 12 are mounted and fixed at the corresponding reserved positions.
Preferably, the manufacturing of the upper layer optical waveguide and the middle layer optical waveguide of the two evanescent wave coupling pieces 15 on the substrate surface by epitaxial growth and etching specifically includes:
epitaxially growing a first layer of outer cladding material on the surface of the substrate to serve as a lower cladding of the lower optical waveguide of the evanescent wave coupling piece 15;
growing a layer of first material on the surface of the first layer of outer packaging material to serve as a core layer of the lower-layer optical waveguide of the evanescent wave coupling piece 15;
etching the first material out of the lower-layer optical waveguide region of the evanescent wave coupling piece 15, and growing a second outer cladding material in the region where the first material is etched to fill up;
epitaxially growing a first layer of a second material as a core layer of a layer optical waveguide in the evanescent wave coupling 15;
and etching the first layer of second material out of the layer optical waveguide region of the evanescent wave coupling piece 15, and growing a third layer of outer packaging material in the region where the first layer of second material is etched for filling.
Preferably, the method for manufacturing the upper-layer optical waveguide of the two evanescent wave coupling pieces 15 and the two second 1:2 light splitting pieces 13 on the substrate surface continuously by epitaxial growth and etching specifically comprises the following steps:
epitaxially growing a second layer of a second material as a bottom layer portion of a core layer of the upper optical waveguide of the evanescent wave coupling 15;
etching a second layer of second material outside the upper optical waveguide region of the evanescent wave coupling piece 15, and growing a fourth layer of outer cladding material in the region where the second layer of second material is etched for filling;
epitaxially growing a third layer of a second material as a top layer portion of a core layer of an upper optical waveguide of the evanescent wave coupling 15 and a core layer of the second 1:2 splitter 13;
and etching off the third layer of second material outside the region of the upper layer optical waveguide of the evanescent wave coupling piece 15 and the second 1:2 splitter 13.
Preferably, the continuously manufacturing the first 1:2 light splitting element 11 and the two first optical waveguides 14 on the substrate surface through epitaxial growth and etching, and reserving positions for the two first WDM filters 12 specifically include:
growing a second layer of intrinsic material in the region where the third layer of second material is etched away, wherein the second layer of intrinsic material is used as a core layer of the first 1:2 light splitter 11 and a core layer of the first optical waveguide 14;
etching away a second layer of intrinsic material outside the region of the first 1:2 splitter 11 and the first optical waveguide 14 and within the region of the first WDM filter 12;
growing a fifth layer of outer cladding material in the area where the second layer of intrinsic material is etched away, wherein the fifth layer of outer cladding material is used as a side cladding layer of the first 1:2 light splitting part 11 and a side cladding layer of the first optical waveguide 14;
epitaxially growing a sixth-layer cladding material as an upper cladding layer of the first 1:2 splitter 11 and an upper cladding layer of the first optical waveguide 14;
the fifth and sixth layer of outer cladding material in the area of the first WDM filter 12 is etched away to reserve a position for the first WDM filter 12.
According to another aspect of the present invention, there is provided an optical access system, comprising a 1:2N optical splitter 1 and 2N four-way optical transceiving modules 2;
the 1:2N optical splitter 1 includes N optical splitting devices 10 according to the first aspect, and the end of each first optical waveguide 14 of each optical splitting device 10 is communicated with one of the four-way optical transceiver modules 2;
the four-direction optical transceiver module 2 comprises a first optical transceiver module 21 and a second optical transceiver module 22; the first optical transceiver module 21 is configured to transmit an uplink optical signal and receive a downlink optical signal, and the second optical transceiver module 22 is configured to transmit a local area intercommunication optical signal and receive a local area intercommunication optical signal.
Preferably, the four-way optical transceiver component 2 further comprises a mirror 23 and a second WDM filter 24;
the second WDM filter 24 is disposed between the first optical waveguide 14 and the first optical transceiver component 21, and the mirror 23 is disposed between the second WDM filter 24 and the second optical transceiver component 22;
the second WDM filter 24 is configured to separate the upstream and downstream optical signals from the local interconnect optical signal; the uplink and downlink optical signals directly pass through the second WDM filter 24 and then are transmitted, and the local area intercommunication optical signals are respectively reflected by the second WDM filter 24 and the mirror 23 and then are transmitted.
Generally, compared with the prior art, the technical scheme of the invention has the following beneficial effects: in the optical splitting device provided by the invention, two 1:2 optical splitting element structures with intercommunicating paths, a WDM filter and an evanescent wave coupling element structure are creatively added, an uplink optical signal and a downlink optical signal can be separated from a local intercommunicating optical signal through the WDM filter, and the local intercommunicating optical signal can be mutually transmitted between each branch optical waveguide of the optical splitting device by establishing a physical intercommunicating path between the two 1:2 optical splitting element structures; and local intercommunication optical signals can be further mutually transmitted between the optical coupler structure and the branched optical waveguide of the adjacent optical splitting device by connecting the evanescent wave coupling structure. Therefore, each user terminal optical modem can directly carry out optical communication at the bottom layer, and does not need to establish physical link through an upper layer network such as an ODN (optical distribution network) and an OLT (optical line terminal) and then carry out mutual communication, thereby realizing the local area intercommunication function for terminal optical modem users under the same ODN of the optical access network.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings required to be used in the embodiments of the present invention will be briefly described below. It is obvious that the drawings described below are only some embodiments of the invention, and that for a person skilled in the art, other drawings can be derived from them without inventive effort.
Fig. 1 is a structural diagram of an optical splitter with a local area interworking function according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional view of the light-splitting device of FIG. 1 along section line 1 of FIG. 1;
FIG. 3 is a schematic cross-sectional view of the light-splitting device of FIG. 1 along section line 2 of FIG. 1;
FIG. 4 is a schematic structural diagram of a first 1:2 light-splitting component in the light-splitting device provided by the embodiment of the invention;
FIG. 5 is a schematic structural diagram of a second 1:2 light-splitting component in the light-splitting device provided by the embodiment of the invention;
FIG. 6 is a schematic structural diagram of an evanescent wave coupling member in the spectroscopic apparatus according to an embodiment of the present invention;
fig. 7 is a schematic transmission diagram of uplink and downlink optical signals in the optical splitter according to the embodiment of the present invention;
fig. 8 is a schematic diagram of transmission of a local area interworking optical signal in an optical splitting device according to an embodiment of the present invention;
fig. 9 is a flowchart of a method for manufacturing a light splitting device according to an embodiment of the present invention;
FIG. 10 is a flow chart illustrating the fabrication of an upper optical waveguide and a middle optical waveguide of an evanescent coupling according to an embodiment of the present invention;
FIG. 11 is a flow chart illustrating the fabrication of an upper optical waveguide and a second 1:2 splitter of an evanescent coupling according to an embodiment of the present invention;
FIG. 12 is a flow chart illustrating the fabrication of a first 1:2 splitter and a first optical waveguide in accordance with embodiments of the present invention;
FIG. 13 is a schematic diagram of a prior art 1:2N optical splitter;
FIG. 14 is a schematic structural diagram of a 1:2N optical splitter according to an embodiment of the present invention;
fig. 15 is a diagram illustrating an example of an optical access system according to an embodiment of the present invention;
fig. 16 is a schematic diagram illustrating transmission of uplink and downlink optical signals in a four-way optical transceiver module according to an embodiment of the present invention;
fig. 17 is a schematic transmission diagram of local area intercommunication optical signals in a four-way optical transceiver module according to an embodiment of the present invention;
fig. 18 is a structural diagram of another optical splitting device with a local area interworking function according to an embodiment of the present invention;
FIG. 19 is a schematic cross-sectional view of the light-splitting device of FIG. 18 taken along section line 3 of FIG. 18;
FIG. 20 is a schematic structural diagram of another 1:2N optical splitter according to an embodiment of the present invention;
fig. 21 is a diagram of another example of an optical access system according to an embodiment of the present invention.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
In the description of the present invention, the terms "inside", "outside", "longitudinal", "lateral", "upper", "lower", "top", "bottom", "left", "right", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of describing the present invention but do not require that the present invention must be constructed and operated in a specific orientation, and thus should not be construed as limiting the present invention.
In the embodiments of the present invention, the symbol "/" indicates the meaning of having both functions, and the symbol "a and/or B" indicates that the combination between the preceding and following objects connected by the symbol includes three cases of "a", "B", "a and B".
In addition, the technical features involved in the embodiments of the present invention described below may be combined with each other as long as they do not conflict with each other. The invention will be described in detail below with reference to the figures and examples.
Example 1
To solve the technical problem that the local communication function cannot be implemented between the optical modems of the user terminal, an embodiment of the present invention provides a novel optical splitter with a local interworking function, which mainly includes a first 1:2 optical splitter 11, two first WDM filters 12, two second 1:2 optical splitters 13, two first optical waveguides 14, and two evanescent wave coupling elements 15, as shown in fig. 1 to 8.
The connection mode among each structure spare is as follows: the two branch optical waveguide ends of the first 1:2 splitter 11 are respectively provided with a first WDM filter 12, and a second 1:2 splitter 13 and a first optical waveguide 14 are arranged in parallel behind each first WDM filter 12. The main optical waveguide of the second 1:2 light splitting component 13 is butted with the corresponding first WDM filter 12; the two second 1:2 light splitting parts 13 are communicated through respective first branch optical waveguides, the end of the second branch optical waveguide of each second 1:2 light splitting part 13 is provided with an evanescent wave coupling part 15, and the evanescent wave coupling part 15 is communicated with the adjacent light splitting devices.
The following describes the light splitting device in the embodiment of the present invention with reference to the accompanying drawings:
with reference to fig. 1 and 4, the first 1:2 light splitting component 11 includes a main optical waveguide and two branch optical waveguides, and the main optical waveguide can be split into the two branch optical waveguides by an annular gradient structure, so as to implement a 1:2 light splitting function. The first 1:2 light splitting component 11 mainly has the following functions: the downlink optical signals transmitted by the main optical waveguide are equally divided into two paths by the two branch optical waveguides, and the uplink optical signals transmitted by the two branch optical waveguides are combined into the main optical waveguide.
With continued reference to fig. 1, while the first 1:2 splitter 11 is processed, two first optical waveguides 14 are also processed, respectively butted behind the two branch optical waveguides of the first 1:2 splitter 11. Since the two first optical waveguides 14 are fabricated simultaneously with the first 1:2 splitter 11 in the same step, the core and cladding dimensions are the same. The main functions of the first optical waveguide 14 are: and transmitting the downlink optical signal transmitted from the first 1:2 optical splitter 11 to the corresponding branch subscriber, and transmitting the uplink optical signal and the local intercommunication optical signal transmitted from the subscriber ONU side to the corresponding first WDM filter 12.
Referring to fig. 1 and 5, two second 1:2 light splitting members 13 having an interconnection path are disposed between the two branch optical waveguides of the first 1:2 light splitting member 11, and the two second 1:2 light splitting members 13 are symmetrical in structure. Each of the second 1:2 optical splitters 13 includes a main optical waveguide and two branch optical waveguides (hereinafter, referred to as a first branch optical waveguide and a second branch optical waveguide, respectively, for convenience of description), and the two second 1:2 optical splitters 13 are communicated through respective first branch optical waveguides, that is, the first branch optical waveguide of one second 1:2 optical splitter 13 is communicated with the first branch optical waveguide of the other second 1:2 optical splitter 13, so as to establish a transmission path of a local intercommunication optical signal between the two branch optical waveguides of the first 1:2 optical splitter 11. An evanescent wave coupling piece 15 is arranged at the tail end of the second branch optical waveguide of each second 1:2 light splitting piece 13, and the evanescent wave coupling piece 15 is communicated with an adjacent evanescent wave coupling piece in an adjacent light splitting device so as to transmit local intercommunication optical signals between branches of the adjacent light splitting device; the second branch optical waveguide of the second 1:2 splitter 13 is a semi-ring optical waveguide structure, and functions to convert the transmission direction by 180 degrees, so as to realize matching and butt joint with the corresponding evanescent wave coupling component 15.
In conjunction with fig. 1 and 6, both of the evanescent wave couplings 15 are preferably of a tap-type evanescent wave coupling, which functions to extend the semi-ring optical waveguide path of the second 1:2 splitter 13 and to pass through the branch optical waveguide of the first 1:2 splitter 11 under the bottom layer as an optical interconnection interface for local interconnection of optical signal transmission with the first optical waveguide in an adjacent optical splitter. Wherein each of the evanescent coupling members 15 includes an upper layer optical waveguide, a middle layer optical waveguide, and a lower layer optical waveguide, an overlapping portion of the upper layer optical waveguide and the middle layer optical waveguide forming a first evanescent coupling region, and an overlapping portion of the middle layer optical waveguide and the lower layer optical waveguide forming a second evanescent coupling region. The first evanescent wave coupling region is configured to evanescently couple a local area intercommunication optical signal from the core layer of the upper optical waveguide to the core layer of the middle optical waveguide, the second evanescent wave coupling region is configured to evanescently couple the local area intercommunication optical signal from the core layer of the middle optical waveguide to the core layer of the lower optical waveguide, and the lower optical waveguide is configured to transmit the local area intercommunication optical signal from right below the corresponding branch optical waveguide of the first 1:2 optical splitter 11 in a three-dimensional manner so as to transmit the local area intercommunication optical signal to an adjacent optical splitting device.
With continued reference to fig. 1, the first WDM filter 12 is disposed between each branch optical waveguide of the first 1:2 optical splitter 11 and the corresponding first optical waveguide 14, and is configured to separate the uplink optical signal and the downlink optical signal from the local interconnection optical signal. With reference to fig. 7 and fig. 8, on one hand, the uplink optical signal transmitted by the first optical waveguide 14 may directly pass through the first WDM filter 12 and be transmitted to the corresponding branch optical waveguide of the first 1:2 optical splitter 11, and the local area intercommunication optical signal transmitted by the first optical waveguide 14 is reflected by the first WDM filter 12 and then transmitted to the corresponding second 1:2 optical splitter 13, and further transmitted to another first optical waveguide 14 through another second 1:2 optical splitter 13, so as to implement local area intercommunication between two branches; on the other hand, the downlink optical signal transmitted from the first 1:2 optical splitter 11 can directly pass through the first WDM filter 12 and be transmitted to the corresponding first optical waveguide 14, and the local area intercommunication optical signal on the other branch transmitted from the second 1:2 optical splitter 13 is reflected by the first WDM filter 12 and then transmitted to the corresponding first optical waveguide 14, so as to implement local area intercommunication between the two branches. Meanwhile, each second 1:2 light splitting element 13 is also communicated with the branch in the adjacent light splitting device through the evanescent wave coupling element 15, so that local intercommunication with the branch in the adjacent light splitting device can be realized.
It should be noted that, since the uplink and downlink optical signals and the local interconnect optical signal are both optical signals, it is necessary to perform standard definition on the wavelength, the working rate, and the like of these optical signals, so that the wavelength of the local interconnect optical signal and the wavelength of the uplink and downlink optical signals are not in a same band, so that the local interconnect optical signal can be separated from the uplink and downlink optical signals by using the first WDM filter 12. If the wavelength of the local intercommunication optical signal and the wavelength of the uplink and downlink optical signals are in the same wavelength band, the optical signals will affect each other and are difficult to be separated. For example, the wavelength of the uplink and downlink optical signals can be selected to be in a 1310-1600 nm band, and the wavelength of the local intercommunication optical signal is in a band below 1290nm, so that the optical signals of the two bands can be separated through one WDM filter.
Further, the outer cladding layers of the first 1:2 splitter 11, the second 1:2 splitter 13, the first optical waveguide 14, and the evanescent wave coupling 15 may be of the same material. The core layer material of each structural member is variable, and the refractive indexes of various materials meet the requirements of optical waveguides, evanescent optical waveguides and the like for transmitting optical signals. For example, in one particular embodiment, SiO may be used2As the outer coating material, the core layer material of the rest structural components can be selected from Si, Ge and SiGe. Referring to fig. 1-6, the upper and lower cladding layers and both side cladding layers of the first 1:2 splitter 11 are both SiO2The core layer is Si; accordingly, the outer cladding of the first optical waveguide 14 is SiO2The core layer is Si; the core layer of the second 1:2 light splitting piece 13 is SiGe, and the upper and lower cladding layers and the cladding layers at both sides are SiO2(ii) a The core layer of the upper-layer optical waveguide of the evanescent wave coupling piece 15 is SiGe, and the upper cladding and the side cladding are both SiO2The core layer of the middle layer optical waveguide is SiGe, and the upper and lower cladding layers and the side cladding layer are both SiO2The core layer of the lower optical waveguide layer is Ge, and the side cladding and the lower cladding are both SiO2
In the above embodiment, Si and SiO are used2The light splitting device is made of four common materials, namely Ge and SiGe, and the refractive indexes of the four materials are 3.426, 1.45, 40004 and 3.5-3.9 respectively. The design of the spectroscopic device is not limited to Si and SiO2Ge and SiGe, and other semiconductor materials can be selected according to actual requirements. Wherein, the principle of material selection is as follows: the refractive index of the core material of the optical waveguide must be greater than that of the cladding material of the optical waveguide to ensure that the optical signal can be transmitted forward along the core with low loss.
It should be further noted that the light splitting device provided in the embodiment of the present invention is not formed by simply splicing and connecting the devices, but is manufactured by growing the cladding layer and the core layer of each structural member layer by layer on the substrate, and is manufactured synchronously in the same set of production process, and has very high requirements on the precision of the manufacturing process, and the manufacturing difficulty is very high when the precision is required to reach the nm level. The coupling alignment between the structural members is also completed in the next step of the high-precision production process. If the devices with the same function are simply spliced to realize the whole function, the failure will occur, the coupling precision cannot reach the nm magnitude, and the corresponding function cannot be realized. The specific manufacturing process will be developed in embodiment 2, and will not be described herein.
In summary, in the optical splitting apparatus provided in the embodiment of the present invention, two 1:2 optical splitting device structures with intercommunicating paths and WDM filters and evanescent wave coupling device structures are creatively added, the WDM filters can separate uplink and downlink optical signals from local area intercommunicating optical signals, and a physical intercommunicating path is established between the two 1:2 optical splitting device structures, so that local area intercommunicating optical signals can be mutually transmitted between the branch optical waveguides; and local intercommunication optical signals can be further mutually transmitted between the optical coupler structure and the branched optical waveguide of the adjacent optical splitting device by connecting the evanescent wave coupling structure. Therefore, each user terminal optical modem can directly carry out optical communication at the bottom layer, and does not need to establish physical link through an upper layer network such as an ODN (optical distribution network) and an OLT (optical line terminal) and then carry out mutual communication, thereby realizing the local area intercommunication function for terminal optical modem users under the same ODN of the optical access network.
Example 2
On the basis of the foregoing embodiment 1, an embodiment of the present invention further provides a manufacturing method of a spectroscopic apparatus, which is used for manufacturing the spectroscopic apparatus described in embodiment 1. The embodiment of the invention adopts Si and SiO2For example, as shown in fig. 9, the manufacturing method mainly includes the following steps:
and step 10, processing the substrate by utilizing the first layer of intrinsic material.
With reference to fig. 1-3, where the intrinsic material is Si, the substrate is processed using a first layer of Si material, typically about 300 μm thick.
And 20, manufacturing an upper layer optical waveguide and a middle layer optical waveguide of the two evanescent wave coupling pieces 15 on the surface of the substrate through epitaxial growth and etching. The specific process is as shown in fig. 10, and mainly includes:
step 201, epitaxially growing a first layer of outer cladding material on the surface of the substrate to serve as a lower cladding of the lower optical waveguide of the evanescent wave coupling member 15. In conjunction with FIGS. 1-3, the cladding material is SiO2That is, epitaxially growing a first SiO layer on the surface of the Si substrate2And the oxide layer is used as a lower cladding layer of the lower optical waveguide of the evanescent wave coupling piece 15.
Step 202, growing a layer of first material on the surface of the first layer of outer cladding material to serve as a core layer of the lower-layer optical waveguide of the evanescent wave coupling piece 15. With reference to fig. 1-3, where the first material is Ge, this step is to form a first SiO layer2And a layer of Ge grows on the surface of the oxidation layer and is used as a core layer of the lower-layer optical waveguide in the evanescent wave coupling piece 15.
Step 203, etching the first material out of the lower-layer optical waveguide region of the evanescent wave coupling piece 15, and growing a second layer cladding material in the region where the first material is etched to perform leveling. With reference to FIGS. 1-3, the Ge is etched away from the lower waveguide region of the evanescent coupling 15 to the first SiO layer2Oxidizing the surface of the layer and growing a second SiO layer in the region etched away Ge2The oxide layer is filled, i.e. a second SiO layer is grown in the region of the coupling 15 except the lower optical waveguide2The oxide layer is filled and leveled to serve as a side cladding layer of the lower layer optical waveguide of the evanescent coupling member 15 and a lower cladding layer of the middle layer optical waveguide of the evanescent coupling member 15.
Step 204, epitaxially growing a first layer of a second material as a core layer of a layer optical waveguide in the evanescent wave coupling member 15. With reference to fig. 1-3, where the second material is SiGe, this step is followed by growing a layer of SiGe epitaxially as a core layer of a layer optical waveguide in the evanescent coupling 15 after filling.
Step 205, etching away the first layer of second material outside the layer optical waveguide region of the evanescent wave coupling member 15, and growing a third layer of outer cladding material in the region where the first layer of second material is etched away for filling. Referring to FIGS. 1-3, the SiGe layer is etched away from the layer waveguide region of the evanescent coupling 15, and a third SiO layer is grown in the SiGe etched region2Filling the oxide layer by growing a third SiO layer in the region of the coupling 15 except the layer optical waveguide2The oxide layer is filled and leveled to serve as a side cladding layer for the layer optical waveguide in the evanescent wave coupling 15.
And step 30, continuously manufacturing the upper-layer optical waveguides of the two evanescent wave coupling pieces 15 and the two second 1:2 light splitting pieces 13 on the surface of the substrate through epitaxial growth and etching. The specific process is as shown in fig. 11, and mainly includes:
step 301, epitaxially growing a second layer of a second material as a bottom layer portion of the core layer of the upper optical waveguide of the evanescent wave coupler 15. In conjunction with FIGS. 1-3, i.e., after step 205, a third SiO layer is grown2After the oxide layer is filled and leveled up,and continuing to epitaxially grow a second SiGe layer as a bottom layer part of the core layer of the upper optical waveguide of the evanescent wave coupling 15.
Step 302, etching off a second layer of second material outside the upper-layer optical waveguide region of the evanescent wave coupling member 15, and growing a fourth layer of outer cladding material in the region where the second layer of second material is etched off for filling. Referring to FIGS. 1-3, the SiGe layer is etched away from the upper optical waveguide region of the evanescent coupling member 15, and a fourth SiO layer is grown in the SiGe-etched region2An oxide layer is filled in as an upper cladding layer of a layer optical waveguide and a side cladding layer of a bottom layer portion of an upper layer optical waveguide in the evanescent coupling member 15, and also as a lower cladding layer of the first 1:2 splitter 11 and a lower cladding layer of the first optical waveguide 14.
Step 303, epitaxially growing a third layer of the second material as a top layer portion of the core layer of the upper optical waveguide of the evanescent wave coupling member 15 and the core layer of the second 1:2 splitter 13. With reference to fig. 1-3, i.e. after the filling in step 302, a third layer of SiGe is epitaxially grown again as the top layer portion of the core layer of the upper optical waveguide of the evanescent coupling 15 and the core layer of the second 1:2 splitter 13.
Step 304, etching away the third layer of the second material outside the area of the upper layer of the optical waveguide of the evanescent wave coupling 15 and the second 1:2 splitter 13. In connection with FIGS. 1-3, the SiGe is etched away from the upper optical waveguide of the evanescent coupling 15 and from the area of the second 1:2 splitter 13.
And step 40, continuously manufacturing the first 1:2 light splitting part 11 and the two first optical waveguides 14 on the surface of the substrate through epitaxial growth and etching, and reserving positions for the two first WDM filters 12. The specific process is as shown in fig. 12, and mainly includes:
step 401, growing a second layer of intrinsic material in the region where the third layer of second material is etched away, as the core layer of the first 1:2 splitter 11 and the core layer of the first optical waveguide 14. In conjunction with FIGS. 1-3, i.e., after step 304, i.e., at the fourth SiO layer2Etching the third SiGe layer on the surface of the oxide layer, and continuing to epitaxially grow a second Si layer as the core layer of the first 1:2 splitter 11 and the first SiGe layerThe core layer of the first optical waveguide 14.
Step 402 etches away a second layer of intrinsic material outside the first 1:2 splitter 11 and the first optical waveguide 14 region and within the first WDM filter 12 region. In connection with fig. 1-3, the second layer Si outside the first 1:2 splitter 11 and the first optical waveguide 14 is etched away, while also the second layer Si in the area of the first WDM filter 12 is etched away.
In step 403, a fifth layer of cladding material is grown in the region where the second layer of intrinsic material is etched away, as the side cladding of the first 1:2 splitter 11 and the side cladding of the first optical waveguide 14. With reference to FIGS. 1-3, i.e. growing a fifth layer of SiO in the regions where the second layer of Si is etched away2And an oxide layer as a side cladding layer of the first 1:2 splitter 11 and a side cladding layer of the first optical waveguide 14, and also as a side cladding layer of a top layer portion of the upper optical waveguide of the evanescent wave coupling member 15 and a side cladding layer of the second 1:2 splitter 13.
Step 404 of epitaxially growing a sixth cladding material as an upper cladding layer of the first 1:2 splitter 11 and an upper cladding layer of the first optical waveguide 14. In conjunction with FIGS. 1-3, i.e., SiO in the fifth layer2The surface of the oxide layer continues to epitaxially grow a sixth SiO layer2And an oxide layer as an upper cladding of the first 1:2 splitter 11 and an upper cladding of the first optical waveguide 14, and also as an upper cladding of an upper optical waveguide of the evanescent wave coupling member 15 and an upper cladding of the second 1:2 splitter 13.
Step 405, etching away the fifth layer cladding material and the sixth layer cladding material in the area of the first WDM filter 12 to reserve a position for the first WDM filter 12. With reference to FIGS. 1-3, the fifth SiO layer is etched away in the region of the first WDM filter 122Oxide layer and sixth SiO layer2And oxidizing the layer to the lower surface of the Si core layer.
Step 50, mounting and fixing the two first WDM filters 12 at the corresponding reserved positions. So far, the whole light splitting device is manufactured.
In the above embodiment, Si and SiO are used2Ge and SiGe from four common materialsThe spectral device is manufactured as an example, and specific structural parameters are shown in table 1.
TABLE 1 structural parameters of the spectroscopic apparatus
Figure BDA0003170919570000141
Figure BDA0003170919570000151
Of course, the fabrication of the light splitting device is not limited to Si and SiO2The four common materials, Ge and SiGe, may also be selected according to actual requirements, but the manufacturing method may be performed according to the above steps 10-40, and the refractive index of the selected optical waveguide core material needs to be greater than that of the cladding material, which is not described herein again.
According to the structure of the light splitting device, the cladding and the core of each structural part grow on the substrate layer by layer, the light splitting device is synchronously manufactured under the same set of production process flow, and the manufacturing process precision can reach the nm magnitude. The optical splitting device manufactured by the method can directly carry out optical communication on the bottom layer by each user terminal optical modem, does not need to establish physical link through an upper layer network such as an ODN (optical distribution network) and an OLT (optical line terminal) and then carry out communication with each other, and further realizes the local area intercommunication function for terminal optical modem users under the same ODN of the optical access network.
Example 3
As shown in fig. 13, a currently common 1:2N optical splitter has N common 1:2 optical splitters at the end, and N-1 common 1:2 optical splitters at the front end, and the N-1 common 1:2 optical splitters are connected with the N common 1:2 optical splitters at the end to form a 1:2N optical splitter having 2N branches. However, such a conventional 1:2N optical splitter does not have a local intercommunication function between branches, and only can transmit uplink and downlink optical signals, and each ONU cannot directly transmit local data service at the bottom layer, but needs to participate in the OLT.
In order to implement the local area interworking function between the ONUs, the embodiment of the present invention further provides a novel 1:2N optical splitter based on embodiment 1, as shown in fig. 14, the end of the 1:2N optical splitter employs N optical splitters 10 described in embodiment 1, and the front end employs N-1 common 1:2 optical splitters to connect the N optical splitters 10 at the end, thereby forming a 1:2N optical splitter 1 having 2N branches and a local area interworking function between the branches. Wherein N ≧ 2, the drawings provided in this embodiment all illustrate N ═ 2 as an example. The front end (i.e. the trunk end) of the 1:2N optical splitter 1 is used for being communicated with the OLT at the central machine room side, and the tail end (i.e. each branch end) of the 1:2N optical splitter 1 is used for being communicated with each ONU at the user side, so that each ONU can directly perform optical communication and local data service transmission with each other at the bottom layer without the participation of the OLT.
On this basis, the embodiment of the invention further adopts the 1:2N optical splitter 1 to replace a common 1:2N optical splitter in the traditional optical access network, and provides a novel optical access system. As shown in fig. 15, the optical access system includes a 1:2N optical splitter 1 and 2N four-way optical transceiver modules 2 disposed at an ONU side, where the 1:2N optical splitter 1 has a trunk and 2N branches, the trunk is communicated with the OLT at the central office side, each branch is communicated with one four-way optical transceiver module 2, and each four-way optical transceiver module 2 is correspondingly disposed at an ONU. The end of the 1:2N optical splitter 1 is provided with N optical splitting devices 10, and equivalently, the end of each first optical waveguide 14 of each optical splitting device 10 is communicated with one of the four-way optical transceiver modules 2.
With continuing reference to fig. 16 and 17, the four-way optical transceiver module 2 includes a first optical transceiver module 21 and a second optical transceiver module 22; the first optical transceiver module 21 is configured to transmit an uplink optical signal and receive a downlink optical signal, and the second optical transceiver module 22 is configured to transmit a local area intercommunication optical signal and receive a local area intercommunication optical signal. More specifically, the first optical transceiver module 21 includes a first optical transmitter module and a first optical receiver module, the first optical transmitter module is configured to transmit an uplink optical signal, and the first optical receiver module is configured to receive a downlink optical signal; the second optical transceiver component 22 includes a second light emitting component and a second light receiving component, the second light emitting component is configured to emit a local area intercommunication optical signal, and the second light receiving component is configured to receive the local area intercommunication optical signal.
That is, in practical use, the central office side and the OLT thereof remain unchanged, but since the ONU side needs to simultaneously transmit and receive the uplink and downlink optical signals and the local area interconnect optical signals, it is necessary to replace the pair of optical transceiver modules used on the ONU side with the four-way optical transceiver module shown in fig. 16 and 17. A first optical transceiver module 21 in the four-way optical transceiver module is the same as the optical transceiver module in the conventional scheme, and is used for transceiving uplink and downlink optical signals, as shown by a solid line with an arrow and a dashed line with an arrow in fig. 16; wherein, the transmission path of the downlink optical signal is transmitted from the OLT at the central machine room side to the ONU side through the 1:2N optical splitter 1; the transmission path of the uplink optical signal is transmitted from the ONU side to the OLT in the central office side via the 1:2N optical splitter 1. A second optical transceiver module 22 in the four-way optical transceiver module is an additional module, and is used for transceiving local area intercommunication optical signals, as shown by a solid line with an arrow and a dashed line with an arrow in fig. 17; the transmission path of the local area intercommunication optical signal is directly transmitted from one ONU to another ONU.
In order to realize the separation transmission of the local area intercommunication optical signal and the uplink optical signal, a mirror 23 disposed at an angle of 45 degrees and a second WDM filter 24 are additionally arranged in the four-way optical transceiver module 2, in combination with fig. 15-17. The second WDM filter 24 is disposed between the first optical waveguide 14 and the first optical transceiver component 21, and is configured to separate the uplink optical signal and the downlink optical signal from the local interconnect optical signal; the mirror 23 is disposed between the second WDM filter 24 and the second optical transceiver module 22. The uplink and downlink optical signals can directly pass through the second WDM filter 24 for transmission, and the local area intercommunication optical signals are respectively reflected by the second WDM filter 24 and the mirror 23 for transmission. The method comprises the following specific steps:
the uplink optical signal generated by the first optical transceiver component 21 in the four-way optical transceiver component 2 directly passes through the second WDM filter 24 and then is transmitted to the 1:2N optical splitter 1; the downlink optical signal transmitted by the 1:2N optical splitter 1 directly passes through the second WDM filter 24 and then is transmitted to the first optical transceiver module 21 in the four-way optical transceiver module 2, and is received by the first optical receiver module. The local intercommunication optical signal generated by the second optical transceiver component 22 in the four-way optical transceiver component 2 is reflected to the second WDM filter 24 by the reflector 23, then is reflected by the second WDM filter 24 and then is transmitted to the 1:2N optical splitter 1; the local intercommunication optical signals on the other branches transmitted by the 1:2N optical splitter 1 are reflected to the reflecting mirror 23 by the second WDM filter 24, then are transmitted to the second optical transceiver module 22 in the four-way optical transceiver module 2 after being reflected by the reflecting mirror 23.
With reference to fig. 15, the local intercommunication optical signal transmitted by the four-way optical transceiver module 2 of the ONU1 may be received by the ONU3 corresponding to another branch of the same optical splitter 10, or may be received by the ONU2 corresponding to an adjacent branch of an adjacent optical splitter 10, that is, the local intercommunication optical signal of the ONU1 may be received by the adjacent ONU2 and the ONU3, as shown by the solid arrows in the figure; similarly, the local interworking optical signal of ONU2 can be received by adjacent ONU1 and ONU4, thereby implementing the local interworking function of the adjacent ONU at the bottom layer.
In summary, the present invention adds the optical signal intercommunication physical path between the branches to the optical splitter, and forms the 1:2N optical splitter, so that each branch of the 1:2N optical splitter can transmit the local intercommunication optical signal directly, in addition to the downlink optical signal and the uplink optical signal. Therefore, the optical modems of the user terminal connected to the branches of the same 1:2N optical splitter can directly transmit optical messages to each other at the bottom layer, and do not need to establish physical links through upper-layer networks such as the ODN and the OLT and then communicate, namely, the local area intercommunication function is realized for the optical modem users of the terminal under the same ODN. The invention can be applied to the current optical access network, and can also be applied to the next generation 50G-PON and other similar optical access networks, and is used for solving the problem of local intercommunication of the optical access networks.
Example 4
As can be seen from fig. 15, in the optical access system provided in embodiment 3, the local interconnection optical signal of ONU1 can only be received by adjacent ONU2 and ONU3, but cannot be received by ONU 4; the local interworking optical signal of ONU2 can be received only by adjacent ONU1 and ONU4, but cannot be received by ONU 3. That is to say, when the 1:2N optical splitter composed of the optical splitting device in embodiment 1 is applied in an optical access network, the local optical signal communication between adjacent ONUs can only be satisfied, each ONU can only implement local intercommunication with two adjacent ONUs, and the local communication range has certain limitations.
In order to improve the local area intercommunication range, on the basis of embodiment 1, the embodiment of the invention further provides an improved light splitting device 10'. With reference to fig. 18 and fig. 19, the optical splitter 10' according to the embodiment of the present invention is obtained by adding a third 1:2 optical splitter 16 and a fourth 1:2 optical splitter 17 to the optical splitter 10 according to embodiment 1, and the structure of two optical splitters having communicating paths is changed to four optical splitter structures having communicating paths, that is, the third 1:2 optical splitter 16 and the fourth 1:2 optical splitter 17 are added between the two second 1:2 optical splitters 13 shown in fig. 1. The third 1:2 light splitting part 16 includes a main optical waveguide and two branch optical waveguides, and the fourth 1:2 light splitting part 17 also includes a main optical waveguide and two branch optical waveguides; for convenience of description, the two branch optical waveguides of each optical splitting element may be referred to as a first branch optical waveguide and a second branch optical waveguide, respectively.
As shown in fig. 18, the trunk optical waveguide of the third 1:2 optical splitter 16 communicates with the first branch optical waveguide (i.e., the left branch optical waveguide in the drawing) of one of the second 1:2 optical splitters 13 (i.e., the second 1:2 optical splitter 13 on the lower side in the drawing), and the first branch optical waveguide (i.e., the left branch optical waveguide in the drawing) of the third 1:2 optical splitter 16 communicates with the first branch optical waveguide (i.e., the left branch optical waveguide in the drawing) of the other of the second 1:2 optical splitters 13 (i.e., the second 1:2 optical splitter 13 on the upper side in the drawing). The trunk optical waveguide of the fourth 1:2 splitter 17 is communicated with the evanescent wave coupling 15 (i.e., the upper-side evanescent wave coupling 15 in the drawing) corresponding to the one second 1:2 splitter 13, the two branch optical waveguides of the fourth 1:2 splitter 17 are respectively communicated with the second branch optical waveguide (i.e., the right-side branch optical waveguide in the drawing) of the other second 1:2 splitter 13 and the second branch optical waveguide (i.e., the right-side branch optical waveguide in the drawing) of the third 1:2 splitter 16, or the second branch optical waveguide of the other second 1:2 splitter 13 and the second branch optical waveguide of the third 1:2 splitter 16 are the two branches of the fourth 1:2 splitter 17.
Except for this, the rest of the structural members are the same as those in embodiment 1, and are not described herein. The specific manufacturing method can refer to the related introduction in embodiment 2, but the difference is that the third 1:2 light splitting element 16 and the fourth 1:2 light splitting element 17 are required to be grown and manufactured; the third 1:2 light-splitting element 16 and the fourth 1:2 light-splitting element 17 can be manufactured synchronously with the two second 1:2 light-splitting elements 13.
On the basis of the optical splitter 10 ', the embodiment of the present invention further provides a 1:2N optical splitter 1', as shown in fig. 20, the end of the 1:2N optical splitter 1 'employs N optical splitters 10', and the front end also employs a plurality of common 1:2 optical splitters to connect the N optical splitters 10 ', so as to form a 1:2N optical splitter 1' having 2N branches and a local intercommunication function between the branches.
On this basis, the embodiment of the invention further adopts the 1:2N optical splitter 1' to replace a common 1:2N optical splitter in the traditional optical access network, thereby providing a novel optical access system. As shown in fig. 21, the optical access system includes a 1:2N optical splitter 1 'and 2N four-way optical transceiver modules 2 disposed at the ONU side, where the 1:2N optical splitter 1' has a trunk and 2N branches, the trunk is communicated with the OLT at the central office side, and each branch is communicated with one four-way optical transceiver module 2. The end of the 1:2N optical splitter 1 ' is provided with N optical splitting devices 10 ', which is equivalent to that the end of each first optical waveguide 14 of each optical splitting device 10 ' is communicated with one of the four-way optical transceiver modules 2.
The specific structure of the four-way optical transceiver module 2 and the transmission of the uplink optical signal, the downlink optical signal and the local area intercommunication optical signal in the four-way optical transceiver module 2 may refer to embodiment 3, which is not described herein again.
With reference to fig. 21, by using four intercommunication paths in the optical splitting device 10', the local intercommunication optical signal emitted by ONU1 can be transmitted to ONU2, ONU3 and ONU4 respectively through different optical paths, and can also be transmitted to an ONU (not shown) on an adjacent branch on the upper side of ONU3, as shown by an arrow and a solid line in the figure. That is, through the improved optical splitting device 10', each ONU can implement local area interworking with four adjacent ONUs, and the local area communication range is effectively improved.
Of course, on the basis of the embodiment of the present invention, if the local area communication range is further improved, more optical splitters may be further added between the two second 1:2 optical splitters 13 according to actual requirements, and related extension schemes are within the protection range of the present invention, and are not described in detail herein.
It will be understood by those skilled in the art that the foregoing is only a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the scope of the present invention.

Claims (10)

1. The light splitting device is characterized by comprising a first 1:2 light splitting part (11), wherein the tail ends of two branch optical waveguides of the first 1:2 light splitting part (11) are respectively provided with a first WDM filter (12), and a second 1:2 light splitting part (13) and a first optical waveguide (14) are arranged behind each first WDM filter (12) in parallel;
the first WDM filter (12) for separating the upstream and downstream optical signals from the local interconnect optical signal; the uplink optical signal transmitted by the first optical waveguide (14) directly passes through the first WDM filter (12) to be transmitted to a corresponding branch optical waveguide of the first 1:2 optical splitter (11), and the local intercommunication optical signal transmitted by the first optical waveguide (14) is transmitted to a corresponding second 1:2 optical splitter (13) after being reflected by the first WDM filter (12);
the main optical waveguide of the second 1:2 light splitting part (13) is butted with the corresponding first WDM filter (12); the two second 1:2 light splitting parts (13) are communicated through respective first branch optical waveguides so as to establish a transmission path of local intercommunication optical signals between the two branch optical waveguides of the first 1:2 light splitting part (11); the end of the second branch optical waveguide of each second 1:2 light splitting part (13) is provided with an evanescent wave coupling piece (15), and the evanescent wave coupling piece (15) is communicated with the adjacent light splitting device so as to transmit local intercommunication optical signals with the adjacent light splitting device.
2. A splitting arrangement according to claim 1, wherein the second branch optical waveguide of the second 1:2 splitting element (13) is a semi-ring optical waveguide for shifting the transmission direction by 180 degrees for matching interfacing with a corresponding evanescent coupling (15).
3. The optical splitting apparatus of claim 1, wherein the evanescent coupling (15) comprises an upper layer optical waveguide, a middle layer optical waveguide, and a lower layer optical waveguide, the overlapping portion of the upper layer optical waveguide and the middle layer optical waveguide forming a first evanescent coupling region, the overlapping portion of the middle layer optical waveguide and the lower layer optical waveguide forming a second evanescent coupling region;
the first evanescent wave coupling area is used for evanescently coupling a local intercommunication optical signal from the core layer of the upper layer optical waveguide to the core layer of the middle layer optical waveguide, the second evanescent wave coupling area is used for evanescently coupling the local intercommunication optical signal from the core layer of the middle layer optical waveguide to the core layer of the lower layer optical waveguide, and the lower layer optical waveguide is used for transmitting the local intercommunication optical signal from the lower part of the corresponding branch optical waveguide of the first 1:2 optical splitting component (11) to an adjacent optical splitting device.
4. A spectroscopic assembly according to any one of claims 1 to 3 wherein the spectroscopic assembly further comprises a third 1:2 spectroscopic member (16) and a fourth 1:2 spectroscopic member (17);
the main optical waveguide of the third 1:2 light splitting part (16) is communicated with the first branch optical waveguide of one second 1:2 light splitting part (13), and the first branch optical waveguide of the third 1:2 light splitting part (16) is communicated with the first branch optical waveguide of the other second 1:2 light splitting part (13);
the main optical waveguide of the fourth 1:2 light splitting part (17) is communicated with the evanescent wave coupling part (15) corresponding to one second 1:2 light splitting part (13), and the two branch optical waveguides of the fourth 1:2 light splitting part (17) are respectively communicated with the second branch optical waveguide of the other second 1:2 light splitting part (13) and the second branch optical waveguide of the third 1:2 light splitting part (16).
5. A manufacturing method of a spectroscopic apparatus according to any one of claims 1 to 4, the manufacturing method comprising:
processing the substrate by utilizing the first layer of intrinsic material;
manufacturing an upper layer optical waveguide and a middle layer optical waveguide of two evanescent wave coupling pieces (15) on the surface of the substrate through epitaxial growth and etching;
continuously manufacturing upper-layer optical waveguides of two evanescent wave coupling pieces (15) and two second 1:2 light splitting pieces (13) on the surface of the substrate through epitaxial growth and etching;
continuously manufacturing a first 1:2 light splitting piece (11) and two first optical waveguides (14) on the surface of the substrate through epitaxial growth and etching, and reserving positions for two first WDM filters (12);
the two first WDM filters (12) are mounted and fixed at the corresponding reserved positions.
6. The method for manufacturing a light splitting device according to claim 5, wherein the step of manufacturing the upper layer optical waveguide and the middle layer optical waveguide of the two evanescent wave couplers (15) on the surface of the substrate by epitaxial growth and etching comprises the following steps:
epitaxially growing a first layer of outer cladding material on the surface of the substrate to serve as a lower cladding of the lower optical waveguide of the evanescent wave coupling piece (15);
growing a layer of first material on the surface of the first layer of outer packaging material to serve as a core layer of the lower-layer optical waveguide of the evanescent wave coupling piece (15);
etching the first material outside the lower optical waveguide region of the evanescent wave coupling piece (15), and growing a second layer cladding material in the region where the first material is etched to carry out filling;
epitaxially growing a first layer of a second material as a core layer of a layer optical waveguide in the evanescent wave coupling (15);
and etching the first layer of second material outside the layer optical waveguide region of the evanescent wave coupling piece (15), and growing a third layer of outer packaging material in the region where the first layer of second material is etched for filling.
7. The method for manufacturing a light splitting device according to claim 6, wherein the upper optical waveguides of the two evanescent wave couplers (15) and the two second 1:2 light splitting elements (13) are manufactured on the surface of the substrate by epitaxial growth and etching, and the method specifically comprises the following steps:
epitaxially growing a second layer of a second material as a bottom layer portion of a core layer of an upper optical waveguide of the evanescent wave coupling (15);
etching a second layer of second material outside the upper layer optical waveguide region of the evanescent wave coupling piece (15), and growing a fourth layer of outer cladding material in the region where the second layer of second material is etched for filling;
epitaxially growing a third layer of a second material as a top layer portion of a core layer of an upper optical waveguide of the evanescent coupling (15) and as a core layer of the second 1:2 splitter (13);
and etching away the third layer of second material outside the upper layer optical waveguide of the evanescent wave coupling piece (15) and the area of the second 1:2 light splitter (13).
8. The method for manufacturing a light splitting device according to claim 7, wherein the step of continuously manufacturing the first 1:2 light splitting element (11) and the two first optical waveguides (14) on the surface of the substrate by epitaxial growth and etching and reserving positions for the two first WDM filters (12) comprises the steps of:
growing a second layer of intrinsic material in the region where the third layer of second material is etched away, as a core layer of the first 1:2 splitter (11) and a core layer of the first optical waveguide (14);
etching away a second layer of intrinsic material outside the first 1:2 splitter (11) and the first optical waveguide (14) region and within the first WDM filter (12) region;
growing a fifth layer of outer cladding material in the area where the second layer of intrinsic material is etched away, wherein the fifth layer of outer cladding material is used as a side cladding layer of the first 1:2 light splitting part (11) and a side cladding layer of the first optical waveguide (14);
epitaxially growing a sixth layer of cladding material as an upper cladding layer of said first 1:2 splitter (11) and an upper cladding layer of said first optical waveguide (14);
etching away the fifth and sixth layer of cladding material in the region of the first WDM filter (12) to reserve a location for the first WDM filter (12).
9. An optical access system is characterized by comprising a 1:2N optical splitter (1) and 2N four-way optical transceiving components (2);
the 1:2N optical splitter (1) comprises N optical splitting devices (10) according to any one of claims 1 to 4, each first optical waveguide (14) end of each optical splitting device (10) being in communication with one of the four-way optical transceiving components (2);
the four-direction optical transceiver component (2) comprises a first optical transceiver component (21) and a second optical transceiver component (22); the first optical transceiver component (21) is used for transmitting an uplink optical signal and receiving a downlink optical signal, and the second optical transceiver component (22) is used for transmitting a local area intercommunication optical signal and receiving a local area intercommunication optical signal.
10. An optical access system according to claim 9, characterized in that the four-way optical transceiving component (2) further comprises a mirror (23) and a second WDM filter (24);
the second WDM filter (24) is disposed between the first optical waveguide (14) and the first optical transceiver component (21), the mirror (23) is disposed between the second WDM filter (24) and the second optical transceiver component (22);
the second WDM filter (24) for separating the upstream and downstream optical signals from the local interconnect optical signal; the uplink optical signal and the downlink optical signal directly pass through the second WDM filter (24) and then are transmitted, and the local intercommunication optical signal is respectively transmitted after being reflected by the second WDM filter (24) and the reflector (23).
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CN211698499U (en) * 2020-03-31 2020-10-16 亨通洛克利科技有限公司 Integrated electro-optic modulator

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