CN113540826B - Linear tapered slit form-based radiating fin antenna array structure - Google Patents
Linear tapered slit form-based radiating fin antenna array structure Download PDFInfo
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- CN113540826B CN113540826B CN202110794721.4A CN202110794721A CN113540826B CN 113540826 B CN113540826 B CN 113540826B CN 202110794721 A CN202110794721 A CN 202110794721A CN 113540826 B CN113540826 B CN 113540826B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q21/00—Antenna arrays or systems
- H01Q21/06—Arrays of individually energised antenna units similarly polarised and spaced apart
- H01Q21/061—Two dimensional planar arrays
- H01Q21/064—Two dimensional planar arrays using horn or slot aerials
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/12—Supports; Mounting means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q13/00—Waveguide horns or mouths; Slot antennas; Leaky-waveguide antennas; Equivalent structures causing radiation along the transmission path of a guided wave
- H01Q13/10—Resonant slot antennas
- H01Q13/18—Resonant slot antennas the slot being backed by, or formed in boundary wall of, a resonant cavity ; Open cavity antennas
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Abstract
The invention discloses a radiating fin antenna array structure based on a linear tapered gap form, and aims to solve the problems that effective heat dissipation cannot be realized and an antenna array cannot be easily carried out in the high-frequency working of the conventional design scheme. The key points of the technical scheme are as follows: the radiating fin type metal radiating fin comprises a linear opening fin type metal radiating fin, a radiating fin metal base and a substrate, wherein the upper surface of the substrate is connected with the radiating fin metal base, and the lower surface of the substrate is connected with a heat source chip. The invention realizes the conformal of the antenna and the heat dissipation structure, and greatly saves the system space.
Description
Technical Field
The invention relates to the technical field of antennas, in particular to a radiating fin antenna array structure based on a linear tapered slot form.
Background
In recent years, in order to fully utilize limited system space resources, reduce energy loss caused by overlong feeder lines and interface discontinuity, and realize a miniaturized and highly integrated wireless communication system, various active and passive devices including chips, front-end circuits and radio-frequency antennas are often integrated in the same package in design. Although the total input power of the wireless communication system is gradually reduced at present, the power consumption per unit volume of the system is actually increased due to the further reduction of the overall size of the system, and the heat dissipation problem is easy to cause the deterioration of the device performance, so that the system cannot work normally or even is seriously damaged. Therefore, in practical design, the heat dissipation performance of the system is always considered. In order to dissipate the excess heat in the system, and considering the thermal conductivity of the material, an additional metal heat dissipation structure, such as a common metal heat sink, is usually designed. However, in practical applications, the metal heat sink structure is susceptible to parasitic electromagnetic coupling with various radio frequency devices such as adjacent integrated circuits and antennas, thereby causing an electromagnetic compatibility problem, and parasitic radiation of the metal heat sink structure may cause distortion and deterioration of an overall directional diagram of the antenna, which affects normal operation of the system. In contrast, conventional solutions often desire to suppress radiation generated by the metal heat sink, but this increases the complexity of the design. The scheme of the electric heating cooperative heat dissipation antenna provides a new idea, and the scheme can give consideration to normal work and heat dissipation performance of a wireless communication system on the basis of conformal design.
The existing radiating antenna scheme mainly adopts the combination of a radiating fin and a microstrip patch antenna, and the most direct mode is to add a fin type metal radiating fin on the top of the microstrip patch antenna. However, the scheme also requires that the size of the metal heat sink base is completely consistent with that of the microstrip patch, and when the working frequency is increased, the size of the microstrip patch is continuously reduced along with the shortening of the wavelength, so that the design space of the metal heat sink is greatly limited, and the sufficient heat dissipation capability cannot be realized. In addition, the antenna array is not easy to perform by the scheme, and application scenarios requiring high gain, narrow beams, beam scanning and the like are difficult to meet. The above problem is particularly serious for the extension of the heat dissipation antenna in the millimeter wave frequency band.
Disclosure of Invention
The invention aims to provide a radiating fin antenna array structure based on a linear tapered gap form.
The technical purpose of the invention is realized by the following technical scheme:
a linear tapered slot form-based radiating fin antenna array structure comprises a linear opening fin type metal radiating fin, a radiating fin metal base and a substrate, wherein the upper surface of the substrate is connected with the radiating fin metal base, the lower surface of the substrate is connected with a heat source chip, a double-ridge waveguide through cavity array serving as an antenna radiation aperture is formed in the radiating fin metal base, and the linear opening fin type metal radiating fin is arranged on the double-ridge waveguide through cavity array;
the substrate comprises a plurality of metal layers, a dielectric layer is arranged between the metal layers, and the dielectric layer comprises a metal through hole array for forming a substrate integrated waveguide structure.
The invention is further provided with: the opening size of the double-ridge waveguide through cavity array meets the TE10 working mode of double-ridge waveguides, and each double-ridge waveguide through cavity and two adjacent linear opening fin type metal radiating fins form a linear tapered slot antenna.
The invention is further provided with: the height of the linear opening fin type metal radiating fin is larger than one half of working wavelength, the size of the linear tapered gap opening is smaller than one half of working wavelength, and the distance between the radiating fin fins is not larger than one working wavelength.
The invention is further provided with: the substrate is arranged below the radiating fin metal base and comprises an upper metal layer, an upper dielectric layer, a middle metal layer, a middle dielectric layer, a lower metal layer, a lower dielectric layer and a bottom metal layer which are arranged in sequence from top to bottom, wherein,
the upper metal layer, the upper dielectric layer, the upper metal via hole array, the middle metal layer, the middle dielectric layer, the middle metal via hole array, the lower metal layer, the lower dielectric layer, the lower metal via hole array and the bottom metal layer form a longitudinal substrate integrated waveguide structure.
The invention is further configured as follows: the middle metal layer, the strip line feed input structure and the lower metal layer form a strip line T-shaped input power distribution feed network.
The invention is further provided with: the upper layer metal layer is provided with an upper layer rectangular opening array, the middle layer metal layer is provided with a middle layer rectangular opening array, and the lower layer metal layer is provided with a bottom layer rectangular opening array which corresponds to the double ridge waveguide through cavity array of the radiating fin metal base and is used as a feed structure of the radiating fin antenna array.
The invention is further provided with: and a strip line feed input structure used for switching feed with the longitudinal substrate integrated waveguide structure is arranged on the middle layer dielectric layer.
The invention is further provided with: the substrate is a low-temperature co-fired ceramic substrate.
The invention is further provided with: the heat source chip is located below the substrate, and the metal through hole array, the metal through hole array and the metal through hole array are used as heat conducting through holes to conduct heat of the heat source chip to the linear opening fin type metal radiating fin.
In conclusion, the invention has the following beneficial effects:
1. based on an electric heating cooperation scheme, the structure of the fin type metal radiating fin is optimally designed, and the double-ridge waveguide through cavity is introduced into the base of the radiating structure to serve as the radiation caliber of the antenna, so that the radiating fin is designed into an antenna array with a radiation function, the antenna and the radiating structure are conformal, and the system space is greatly saved.
2. Compared with a rectangular waveguide, the double-ridge waveguide is of a miniaturized structure, has lower cut-off frequency, effectively shortens unit spacing between arrays and improves side lobe level of a directional diagram.
3. In order to take heat dissipation performance of the antenna into consideration, an antenna feed network of a longitudinal substrate integrated waveguide structure is designed in the substrate, and a large number of metal through holes contained in the antenna feed network can be used as heat conduction through holes to conduct heat of a heat source to the finned radiating fins, so that design complexity is reduced, and design cost is saved.
4. The designed radiating fin antenna array structure based on the linear tapered slit form has the advantages that the whole size is not limited to the working frequency and wavelength any more, and the radiating fin antenna array structure can be well applied to microwave and even millimeter wave frequency bands.
5. In the low-temperature co-fired ceramic substrate, the substrate integrated waveguide structure is adopted as a feed network of the radiating fin antenna, the feed network comprises a large number of metallized holes, and can be used as heat conduction through holes to conduct heat of a heat source to the fin type radiating fins, so that an additional heat conduction structure is not needed, the design complexity is reduced, and the design cost is saved.
Drawings
Fig. 1 is a schematic structural diagram of a 2 x 2 heat sink antenna array structure.
Fig. 2 is a schematic structural diagram of a 4 x 4 heat sink antenna array structure.
Fig. 3 is a schematic diagram of a vertical substrate integrated waveguide structure.
Fig. 4 is a schematic plan view of a stripline feed input structure.
Figure 5 is a plot of 4 x 4 heat sink antenna array element gain versus fin height.
Figure 6 is a plot of 4 x 4 fin array element gain versus fin opening spacing.
Fig. 7 is a 4 x 4 fin array reflection coefficient plot.
Fig. 8 is a 4 x 4 heat sink antenna array gain curve.
Fig. 9 is a 4 x 4 fin antenna array radiation pattern.
And (3) labeling: 1. the radiating fin comprises a radiating fin metal base 2, an upper metal layer 3, a metal via hole array 4, a middle metal layer 5, a metal via hole array 6, a lower metal layer 7, a metal via hole array 8, a linear opening fin type metal radiating fin 9, a double-ridge waveguide through cavity array 10, a rectangular opening array 11, an upper dielectric layer 12, a rectangular opening array 13, a middle dielectric layer 14, a strip line feed input structure 15, a rectangular opening array 16, a lower dielectric layer 17, a bottom metal layer
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further explained by combining the drawings and the specific embodiments.
As shown in fig. 1, the present invention provides a linear tapered slot-based heat sink antenna array structure, which includes a linear opening fin type metal heat sink 8, a heat sink metal base 1 and a substrate, wherein the upper surface of the substrate is connected to the heat sink metal base 1, and the lower surface of the substrate is connected to a heat source chip, and is characterized in that the heat sink metal base 1 is provided with a double-ridge waveguide through cavity array 9 serving as an antenna radiation aperture, and the double-ridge waveguide through cavity array 9 is provided with the linear opening fin type metal heat sink 8;
the substrate comprises a plurality of metal layers, a dielectric layer is arranged between the metal layers, and the dielectric layer contains a metal through hole array for forming a substrate integrated waveguide structure.
The invention is further provided with: the opening size of the double-ridge waveguide through cavity array 9 meets the TE10 working mode of double-ridge waveguides, and each double-ridge waveguide through cavity and two adjacent linear opening fin type metal radiating fins 8 form a linear tapered slot antenna.
The invention is further configured as follows: the height of the linear opening fin type metal radiating fin 8 is larger than one half of the working wavelength, the size of the linear tapered gap opening is smaller than one half of the working wavelength, and the distance between the radiating fin fins is not larger than one working wavelength.
The invention is further provided with: the substrate is positioned below the radiating fin metal base 1 and comprises an upper metal layer 2, an upper dielectric layer 11, an upper metal via hole array 3, a middle metal layer 4, a middle dielectric layer 13, a middle metal via hole array 5, a strip line feed input structure 14, a lower metal layer 6, a lower dielectric layer 16, a lower metal via hole array 7 and a bottom metal layer 17,
the upper metal layer 2, the upper dielectric layer 11, the upper metal via hole array 3, the middle metal layer 4, the middle dielectric layer 13, the middle metal via hole array 5, the lower metal layer 6, the lower dielectric layer 16, the lower metal via hole array 7 and the bottom metal layer 17 form a longitudinal substrate integrated waveguide structure;
the heat source chip is positioned below the substrate, and the upper layer metal via hole array 3, the middle layer metal via hole array 5 and the lower layer metal via hole array 7 are used as heat conducting through holes to conduct heat of the heat source chip to the linear opening fin type metal radiating fin.
The invention is further configured as follows: the middle metal layer 4, stripline feed input structure 14, and lower metal layer 6 form a stripline T-shaped input power splitting feed network.
The invention is further provided with: the upper layer metal layer 2 is provided with an upper layer rectangular opening array 10, the middle layer metal layer 4 is provided with a middle layer rectangular opening array 12, the lower layer metal layer 6 is provided with a bottom layer rectangular opening array 15, the bottom layer rectangular opening array corresponds to the double-ridge waveguide through cavity array 9 of the radiating fin metal base, and the radiating fin metal base serves as a feed structure of the radiating fin antenna array.
The invention is further provided with: and a strip line feed input structure 14 for switching feed with the longitudinal substrate integrated waveguide structure is arranged on the middle layer dielectric layer 13.
The invention is further configured as follows: the substrate is a low-temperature co-fired ceramic substrate, and more metal through holes outside the substrate integrated waveguide structure can be added into the substrate according to actual requirements, so that the number of heat conduction through holes is increased, and the thermal resistance between the heat source chip and the fin type radiating fin is reduced.
Taking the 2 × 2 heat sink antenna array structure as shown in fig. 1 as an example, the heat sink antenna array structure in the form of linear tapered slots proposed in the present application includes: the radiating fin metal base 1 and the base plate are provided with a plurality of groups of double-ridge waveguide through cavity permutation 9, linear opening fin type metal radiating fins 8 are arranged on the double-ridge waveguide through cavity permutation 9, each double-ridge waveguide through cavity and two adjacent linear opening fin type metal radiating fins 8 form a linear tapered slot antenna, the base plate comprises an upper metal layer 2, an upper dielectric layer 11, a middle metal layer 4, a middle dielectric layer 13, a lower metal layer 6, a lower dielectric layer 16 and a bottom metal layer 17 which are sequentially arranged from top to bottom, an upper rectangular opening array 10 is arranged on the upper metal layer 2, an upper metal via array 3 is arranged on the upper dielectric layer 11, a middle rectangular opening array 12 is arranged on the middle metal layer 4, a middle metal via array 5 and a strip line feed input structure 14 are arranged on the middle dielectric layer 13, a bottom rectangular opening array 15 is arranged on the lower metal layer 6, and a lower metal via array 7 is arranged on the lower dielectric layer 16.
In a specific implementation process, this embodiment provides a design scheme of a 4 × 4 heat sink antenna array, as shown in fig. 2, and the operating frequency is 28GHz. The linear opening fin type metal radiating fin 8 is processed and realized by adopting a 3D printing technology, and the upper dielectric layer 11, the middle dielectric layer 13 and the lower dielectric layer 16 are processed and realized by adopting a low-temperature co-fired ceramic process. In this example, the dielectric constant of the low-temperature co-fired ceramic substrate was 5.9, the loss tangent was 0.002, and the geometric dimensions were 30mm × 40mm × 0.96mm. The size of the plane of the radiating fin metal base 1 is 30mm multiplied by 40mm, and the thickness of the radiating fin metal base 1 is 1mm. According to actual requirements, if the working frequency is changed, the sizes of the radiating fins and the dielectric plates are correspondingly changed.
As shown in fig. 2, a 4 × 4 double-ridge waveguide through cavity array is formed on a radiating fin metal base 1, the size of the cavity is 3mm × 3mm × 1mm, the size of a double ridge is 1.2mm × 1.8mm × 1mm, the size of the double ridge satisfies the TE10 working mode of the double ridge waveguide, the width of a linear opening fin type metal radiating fin 8 is 1.2mm, the height of the linear opening fin type metal radiating fin is 10mm, the length of the upper side of the linear opening fin type metal radiating fin is 2.9mm, the length of the lower side of the linear opening fin type metal radiating fin is 5mm, and the distance between the fins is 5.4mm.
As shown in fig. 2, the upper metal layer 2, the upper dielectric layer 11, the upper metal via array 3, the middle metal layer 4, the middle dielectric layer 13, the middle metal via array 5, the lower metal layer 6, the lower dielectric layer 16, the lower metal via array 7, and the bottom metal layer 17 form a longitudinal substrate integrated waveguide structure, and the waveguide size is 4.6mm × 2.6mm; the upper layer metal layer 2 is provided with an upper layer rectangular opening array 10, the middle layer metal layer 4 is provided with a middle layer rectangular opening array 12, the lower layer metal layer 6 is provided with a bottom layer rectangular opening array 15, the bottom layer rectangular opening array corresponds to the double ridge waveguide through cavity array 9 of the radiating fin metal base, the two layers of rectangular opening arrays are used as a feed structure of the radiating fin antenna array and used as feed switching for providing radiating fin antenna array excitation through a stepped waveguide structure, and the size of each rectangular opening is 4mm multiplied by 2mm.
Fig. 3 is a schematic plan view of the vertical substrate integrated waveguide structure of fig. 2.
FIG. 4 is a plan view of the stripline feed input structure 14; in this embodiment, a T-type input power distribution network is adopted, and other power structures such as a Y-type power distribution network can be selected according to actual requirements.
As shown in fig. 4, patch feeding of the stripline feed input structure 14 and the longitudinal substrate integrated waveguide structure is accomplished using a probe-type structure. According to the actual requirement, other switching methods such as gap coupling and the like can be selected.
Fig. 5 is a plot of the 4 x 4 heat sink antenna array element gain as a function of fin height. It can be seen that increasing the fin height increases the gain of the antenna array when the fin height does not exceed a working wavelength.
Fig. 6 is a plot of the gain of the 4 x 4 heat sink antenna array element as a function of fin pitch. Therefore, when the distance between the fins does not exceed one quarter of the working wavelength, the gain of the antenna array can be improved by increasing the distance between the openings of the fins.
FIG. 7 shows the reflection coefficient of the 4 × 4 Fin array structure with a 10dB impedance bandwidth of 3.25GHz (from 26.25GHz to 29.50 GHz) and a relative bandwidth of 11.6%.
FIG. 8 is a gain curve for the 4 × 4 heat sink antenna array structure with 16.47dBi gain at operating frequency, 16.87dBi maximum gain (at 29.5 GHz), and flat gain over a 10dB impedance bandwidth (from 26.25GHz to 29.50 GHz).
Fig. 9 is a radiation pattern of the 4 x 4 fin array structure with 3dB main lobe beamwidths at the E-plane and H-plane of 24 ° and 25 °, respectively.
In the description of the present invention, it should be noted that the terms "upper", "lower", "inner", "outer", "left", "right", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings, or orientations or positional relationships that the product of the present invention is conventionally placed in use, or orientations or positional relationships that are conventionally understood by those skilled in the art, which are merely for convenience of description and simplification of the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and operate, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used solely to distinguish one from another, and are not to be construed as indicating or implying relative importance. In the description of the present invention, it is also to be noted that, unless otherwise explicitly stated or limited, the terms "disposed" and "connected" are to be interpreted broadly, and for example, "connected" may be a fixed connection, a detachable connection, or an integral connection; can be mechanically or electrically connected; the connection may be direct or indirect via an intermediate medium, and may be a communication between the two elements. The specific meanings of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art. As used herein, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, including not only those elements listed, but also other elements not expressly listed.
The foregoing shows and describes the general principles, essential features, and advantages of the invention. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are given by way of illustration of the principles of the present invention, and that various changes and modifications may be made without departing from the spirit and scope of the invention as defined by the appended claims. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (9)
1. A radiating fin antenna array structure based on a linear tapered slot form comprises a double-ridge waveguide through cavity array (9), a linear opening fin type metal radiating fin (8), a radiating fin metal base (1) and a substrate, wherein the upper surface of the substrate is connected with the radiating fin metal base (1), and the lower surface of the substrate is connected with a heat source chip;
the substrate comprises a plurality of metal layers, a dielectric layer is arranged between the metal layers, and the dielectric layer comprises a metal through hole array for forming a substrate integrated waveguide structure.
2. The radiating fin antenna array structure based on the linear tapered slot form according to claim 1, wherein the opening size of the double-ridge waveguide through cavity array (9) meets the TE10 working mode of the double-ridge waveguide, and each double-ridge waveguide through cavity and two adjacent linear opening fin type metal radiating fins (8) form a linear tapered slot antenna.
3. The linear tapered slot based heat sink antenna array configuration as claimed in claim 1, wherein the height of said linear open finned metal heat sink (8) is greater than one-half of the operating wavelength, the size of the linear tapered slot opening is less than one-half of the operating wavelength, and the spacing between the heat sink fins is no greater than one operating wavelength.
4. The linear tapered slot based heat sink antenna array structure as claimed in claim 1, wherein the substrate is located below the heat sink metal base (1) and comprises an upper metal layer (2), an upper dielectric layer (11), a middle metal layer (4), a middle dielectric layer (13), a lower metal layer (6), a lower dielectric layer (16), and a bottom metal layer (17) arranged in sequence from top to bottom,
the upper metal layer (2), the upper dielectric layer (11), the upper metal via array (3), the middle metal layer (4), the middle dielectric layer (13), the middle metal via array (5), the lower metal layer (6), the lower dielectric layer (16), the lower metal via array (7) and the bottom metal layer (17) form a longitudinal substrate integrated waveguide structure.
5. The linear tapered slot based heat sink antenna array structure as claimed in claim 4, wherein the middle metal layer (4), the strip line feed input structure (14) and the lower metal layer (6) form a strip line T-shaped input power distribution feed network.
6. The linear tapered slot based heat sink antenna array structure as claimed in claim 4, wherein the upper rectangular opening array (10) is formed in the upper metal layer (2), the middle rectangular opening array (12) is formed in the middle metal layer (4), and the bottom rectangular opening array (15) is formed in the lower metal layer (6) and corresponds to the double ridge waveguide cavity array (9) of the heat sink metal base to serve as the feed structure of the heat sink antenna array.
7. The linear tapered slot based heat sink antenna array structure as claimed in claim 4, wherein the middle dielectric layer (13) is provided with a strip line feed input structure (14) for switching feed with the longitudinal substrate integrated waveguide structure.
8. The linear tapered slot based heat sink antenna array structure of claim 1, wherein the substrate is a low temperature co-fired ceramic substrate.
9. A heat sink antenna array structure according to any one of claims 1 to 8, wherein the heat source chip is located below the substrate, and the metal via array (3), the metal via array (5) and the metal via array (7) act as heat conducting vias to conduct heat from the heat source chip to the linear open-fin metal heat sink (8).
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| CN106299660A (en) * | 2016-09-17 | 2017-01-04 | 西安电子科技大学 | A kind of Sidelobe ridge chip integrated waveguide slot array antenna |
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| CN204425852U (en) * | 2015-01-23 | 2015-06-24 | 联想(北京)有限公司 | A kind of electronic equipment |
| CN206510820U (en) * | 2016-09-09 | 2017-09-22 | 陈景宜 | Automobile warning device |
| CN109687165A (en) * | 2018-12-29 | 2019-04-26 | 瑞声科技（南京）有限公司 | Millimeter wave array antenna mould group and mobile terminal |
| CN109611786A (en) * | 2018-12-29 | 2019-04-12 | 珠海市唯能车灯实业有限公司 | A kind of novel shark fins high-mount brake lamp |
| CN110676555B (en) * | 2019-10-22 | 2020-11-10 | 上海交通大学 | Radiating fin antenna array structure |
| CN111834743B (en) * | 2020-06-19 | 2021-04-06 | 北京微度芯智科技有限责任公司 | Level meter antenna radio frequency board, antenna structure and antenna system |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106299660A (en) * | 2016-09-17 | 2017-01-04 | 西安电子科技大学 | A kind of Sidelobe ridge chip integrated waveguide slot array antenna |
| CN108550987A (en) * | 2018-05-24 | 2018-09-18 | 南京航空航天大学 | A kind of double frequency slot array antenna based on SIW |
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