CN113539994A - Integrated circuit packaging structure - Google Patents
Integrated circuit packaging structure Download PDFInfo
- Publication number
- CN113539994A CN113539994A CN202110787689.7A CN202110787689A CN113539994A CN 113539994 A CN113539994 A CN 113539994A CN 202110787689 A CN202110787689 A CN 202110787689A CN 113539994 A CN113539994 A CN 113539994A
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- Prior art keywords
- ring
- integrated circuit
- circuit board
- magnetic
- wall
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/373—Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an integrated circuit packaging structure, which is provided with a sealing structure, an integrated circuit board, a pin and a sealing rubber ring, wherein the integrated circuit board is detachably arranged in the sealing structure, the top of the pin is welded and connected at the outer end of the integrated circuit board, the top of the pin penetrates through the sealing rubber ring, the sealing rubber ring is fixedly clamped and clamped in the outer wall of the sealing structure, the integrated circuit board is provided with a chip, a circuit board, a heat dissipation hole, a fan and a cooling mechanism, the chip is detachably arranged at the center of the circuit board, the heat dissipation hole is arranged below the fan, the fan is fixedly arranged below the chip, and the bottom of the cooling mechanism is clamped and arranged in the circuit board. The internal chip is prevented from being indirectly influenced in service life due to overhigh temperature of the working environment when in use.
Description
Technical Field
The present invention relates to integrated circuit packaging technologies, and more particularly, to an integrated circuit package structure.
Background
The integrated circuit is formed by connecting the contact of the electronic component with the end point on the circuit board and then melting and welding the electronic component and the end point on the circuit board by using a tin wire, and the integrated circuit plays a role in converting and controlling the output and frequency of signals in the equipment.
Based on the above description, the inventor finds that the existing integrated circuit package structure mainly has the following disadvantages, such as:
because integrated circuit in the packaging structure is when the operation, inside components and parts can be in the continuous heating of operation in-process, and the heat is piled up inside, because of the chip is sealed through the encapsulation glue and is fixed on the base plate, inside heat can lead to the fact the influence to the chip in the integrated circuit, can make the too high indirect life who has influenced the chip of operational environment temperature when using of chip.
Disclosure of Invention
In order to solve the above technical problems, the present invention discloses an integrated circuit package structure to solve the existing problems.
Aiming at the defects of the prior art, the purpose and the effect of the integrated circuit packaging structure are achieved by the following specific technical means: the utility model provides an integrated circuit packaging structure, its structure is equipped with seal structure, integrated circuit board, pin, sealing rubber ring, integrated circuit board demountable installation is inside seal structure, pin top welded connection is in the integrated circuit board outer end, the pin top runs through inside sealing rubber ring, the fixed block of sealing rubber ring is in the seal structure outer wall.
As a further improvement, the integrated circuit board is provided with a chip, a circuit board, heat dissipation holes, a fan and a cooling mechanism, wherein the chip is detachably mounted at the center of the circuit board, the heat dissipation holes are formed in the lower portion of the fan, the fan is fixedly mounted below the chip, the bottom of the cooling mechanism is clamped and mounted inside the circuit board, and the cooling mechanism is of a symmetrical structure.
As a further improvement, the cooling mechanism comprises heat sink, guide plate, stiff end, venthole, heat sink fixed mounting is between the guide plate, guide plate fixed connection is in the stiff end top, the venthole is embedded solid and is connected in the guide plate top, guide plate quantity is eight and is symmetrical structure.
As a further improvement, the heat absorbing device comprises an overflow plate, a heat absorbing end and a filtering end, wherein the filtering end is fixedly connected below the overflow plate, and the heat absorbing end is detachably mounted below the filtering end.
As a further improvement, the heat absorption end is provided with limiting structures, heat absorption belts and a material storage groove, the heat absorption belts are movably connected between the limiting structures, the outer sides of the heat absorption belts are connected with the material storage groove in a matched mode, the front end of the material storage groove is connected to the rear end of the limiting structures in a clamping mode, and a cavity arranged in the material storage groove is used for storing liquid paraffin.
As a further improvement, the limiting structure comprises a driving wheel, a hole belt, a limiting wheel and a smearing end, the driving wheel is movably connected to the right end of the limiting wheel, the inner side of the hole belt is connected to the outer wall of the limiting wheel and the outer wall of the driving wheel in a fit mode, the right end of the smearing end is connected to the outer side of the hole belt in a matched mode, and a plurality of gaps are formed in the smearing end.
As a further improvement, the driving wheel consists of driving teeth, a magnetism isolating ring and a magnetic rotary ring, the driving teeth are arranged on the outer wall of the magnetism isolating ring, the magnetism isolating ring is fixedly connected to the outer wall of the magnetic rotary ring, and the magnetism isolating ring is made of silicon steel materials.
As a further improvement, the magnetic rotating ring comprises a connecting ring, a repulsive force ring and six magnetic blocks, wherein the inner side of the connecting ring is connected with the magnetic blocks in a matching manner, the magnetic blocks are fixedly connected to the outer wall of the repulsive force ring, and the magnetic blocks are averagely arranged on the outer wall of the repulsive force ring.
As a further improvement, the repulsion ring is provided with a matching ring, a fixed column, a magnetic ring piece and a magnetic stripe of the same polarity, the matching ring is movably connected to the periphery of the fixed column, the magnetic stripe of the same polarity is fixedly connected to the outer end of the fixed column, the outer side of the magnetic stripe of the same polarity is connected with the outer side of the magnetic ring piece in a matching manner, two ends of the magnetic ring piece are fixedly connected to the inner wall of the matching ring in an embedded manner, and the number of the magnetic ring pieces is six and is averagely fixedly embedded on the inner side of the matching ring.
Compared with the prior art, the invention has the following advantagesAdvantageous effects：
According to the invention, the driving wheel rotates automatically due to the characteristics of the internal magnetic block to drive the heat absorption belt to be matched with the smearing end, and the liquid paraffin is smeared on the outer wall of the heat absorption belt uniformly, so that the paraffin on the outer wall of the heat absorption belt can absorb heat entering the internal heat independently, and the internal chip is prevented from being influenced in service life indirectly due to overhigh working environment temperature when in use.
Drawings
Fig. 1 is a schematic structural diagram of an integrated circuit package structure according to the present invention.
Fig. 2 is a schematic left-view cross-sectional structure diagram of an integrated circuit board according to the present invention.
FIG. 3 is a left side view of the cooling mechanism.
FIG. 4 is a schematic view of the internal cross-sectional structure of a heat sink of the present invention.
FIG. 5 is a schematic diagram of the internal structure of the heat sink.
Fig. 6 is a schematic view of a partially enlarged structure of a position limiting structure.
FIG. 7 is a schematic view of a partially enlarged structure of the driving wheel according to the present invention.
FIG. 8 is a schematic view of the internal structure of the magnetic swivel according to the present invention.
FIG. 9 is a schematic view of the inner structure of the repulsive force ring according to the present invention.
In the figure: sealing structure-1, integrated circuit board-2, pin-3, sealing rubber ring-4, chip-21, circuit board-22, heat dissipation hole-23, fan-24, cooling mechanism-25, heat absorbing device-251, guide plate-252, fixing end-253, air outlet-254, flow passing plate-A1, heat absorbing end-A2, filtering end-A3, limiting structure-A21, heat absorbing belt-A22, material storage tank-A23, driving wheel-B1, hole belt-B2, limiting wheel-B3, smearing end-B4, driving tooth-B11, magnetism isolating ring-B12, magnetism rotating ring-B13, connecting ring-C1, repulsion ring-C2, magnetic block-C3, matching ring-C21, fixing column-C22, magnetic ring sheet-C23, magnetic ring-B23, heat dissipation hole-A21, limiting structure-A21, heat absorbing belt-A22, magnetic band-B23, magnetic block-C3, repulsion ring-C21, magnetic block-C11, and magnetic ring-C23, Isotropic magnetic stripe-C24.
Detailed Description
The embodiments of the present invention will be described in further detail with reference to the drawings and examples. The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention.
In the description of the present invention, "a plurality" means two or more unless otherwise specified; the terms "upper", "lower", "left", "right", "inner", "outer", "front", "rear", "head", "tail", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, should not be construed as limiting the invention. Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "connected" and "connected" are to be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Example 1
As shown in figures 1 to 6:
the invention discloses an integrated circuit packaging structure which is provided with a sealing structure 1, an integrated circuit board 2, a pin 3 and a sealing rubber ring 4, wherein the integrated circuit board 2 is detachably arranged in the sealing structure 1, the top of the pin 3 is welded and connected to the outer end of the integrated circuit board 2, the top of the pin 3 penetrates through the sealing rubber ring 4, and the sealing rubber ring 4 is fixedly clamped in the outer wall of the sealing structure 1.
Wherein, integrated circuit board 2 is equipped with chip 21, circuit board 22, louvre 23, fan 24, cooling mechanism 25, chip 21 demountable installation is in circuit board 22 center department, louvre 23 is established in fan 24 below, fan 24 fixed mounting is in chip 21 below, cooling mechanism 25 bottom block is installed inside circuit board 22, cooling mechanism 25 structure is symmetrical structure, can separate chip 21 and prevent to receive other component influences.
The cooling mechanism 25 is composed of a heat absorber 251, a guide plate 252, a fixed end 253 and air outlet holes 254, the heat absorber 251 is fixedly installed between the guide plates 252, the guide plate 252 is fixedly connected above the fixed end 253, the air outlet holes 254 are fixedly connected above the guide plate 252, the number of the guide plates 252 is eight, the guide plates are symmetrical, and heat of electronic elements on two sides can be absorbed by means of heat absorbing materials below.
The heat absorbing device 251 comprises an overflow plate A1, a heat absorbing end A2 and a filtering end A3, wherein the filtering end A3 is fixedly connected below the overflow plate A1, and the heat absorbing end A2 is detachably mounted below the filtering end A3.
The heat absorption end A2 is provided with a limiting structure A21, a heat absorption band A22 and a material storage groove A23, the heat absorption band A22 is movably connected between the limiting structures A21, the outer side of the heat absorption band A22 is connected with the material storage groove A23 in a matched mode, the front end of the material storage groove A23 is connected to the rear end of the limiting structure A21 in a clamped mode, a cavity in the material storage groove A23 is used for storing liquid paraffin, and the outer wall of the heat absorption band A22 can be coated.
Wherein, limit structure A21 includes driving wheel B1, hole belt B2, spacing wheel B3, paints end B4, driving wheel B1 swing joint is at spacing wheel B3 right-hand member, the inboard laminating of hole belt B2 is connected on spacing wheel B3 outer wall and driving wheel B1 outer wall, paint end B4 right-hand member cooperation and connect in the hole belt B2 outside, paint the inside a plurality of spaces that are equipped with of end B4, can carry out evenly painting to the hole belt B2 of process with the help of the space with liquid paraffin.
The specific use mode and function of the embodiment are as follows:
in the invention, the integrated circuit packaging structure arranged in a machine is electrified to operate, the components on two sides of the integrated circuit board 2 generate heat when operating, the heat of the components on two sides of the integrated circuit board 2 is absorbed by the heat absorbing material below the guide plate 252, the chip 21 generates heat when operating for a long time, the heat emitted by the chip 21 can be blown to the inside of the heat absorbing device 251 by the fan 24 below the chip 21, the heat absorbing belt A22 is driven to move by the automatic force of the internal parts of the driving wheel B1 in the heat absorbing device 251, the gap inside the smearing end B4 is utilized when the heat absorbing belt A22 moves, the liquid paraffin in the material storage groove A23 evenly smears the passing hole belt B2 by the internal gap, the heat entering the inside is absorbed by the paraffin smeared on the heat absorbing belt A22 and converted into gas, and the converted gas is blown to the overflowing plate A1 by the fan 24, gas is communicated to the baffle 252 through flow plate a1 and exits through outlet aperture 254.
Example 2
As shown in fig. 7 to 9:
the invention discloses an integrated circuit packaging structure, wherein a driving wheel B1 consists of driving teeth B11, a magnetism isolating ring B12 and a magnetic rotating ring B13, the driving teeth B11 are arranged on the outer wall of the magnetism isolating ring B12, the magnetism isolating ring B12 is fixedly connected to the outer wall of the magnetic rotating ring B13, and the magnetism isolating ring B12 is made of silicon steel materials and can effectively isolate a magnetic field emitted by the magnetic rotating ring B13 on the inner side.
The magnetic rotating ring B13 comprises a connecting ring C1, a repulsive force ring C2 and a magnetic block C3, the inner side of the connecting ring C1 is connected with a magnetic block C3 in a matched mode, the magnetic block C3 is fixedly connected to the outer wall of the repulsive force ring C2, six magnetic blocks C3 are arranged and are placed on the outer wall of the repulsive force ring C2 on average, and the magnetic rotating ring B13 can be driven by the inner portion to rotate the connecting ring C1.
The repulsive ring C2 is provided with a matching ring C21, a fixing column C22, magnetic ring pieces C23 and a like-pole magnetic strip C24, the matching ring C21 is movably connected to the periphery of the fixing column C22, the outer end of the fixing column C22 is fixedly connected with the like-pole magnetic strip C24, the outer side of the like-pole magnetic strip C24 is connected with the outer side of the magnetic ring pieces C23 in a matching mode, two ends of each magnetic ring piece C23 are fixedly connected to the inner wall of the matching ring C21 in an embedded mode, the number of the magnetic ring pieces C23 is six, the magnetic ring pieces C23 are embedded on the inner side of the matching ring C21 in an average mode, and the magnetic ring C24 with the like-pole magnetic strip can rotate in a matching mode in the largest range.
The specific use mode and function of the embodiment are as follows:
in the invention, when heat absorption is carried out, the magnetic ring piece C23 is rotated by the same magnetic strip C24 at the outer end of the fixed column C22 in the repulsive ring C2 by virtue of the characteristics, so that the matching ring C21 drives the magnetic block C3 at the outer end to rotate the matching connecting ring C1, when the connecting ring C1 at the inner part rotates, the magnetism isolating ring B12 fixed at the outer part is also driven, and when the driving teeth fixed at the outer part of the magnetism isolating ring B12 rotate at the magnetism isolating ring B12, the driving teeth B11 are driven to move the heat absorption band A22 attached at the outer part, so that the subsequent heat absorption action can normally operate.
The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the invention and the practical application, and to enable others of ordinary skill in the art to understand the invention for various embodiments with various modifications as are suited to the particular use contemplated.
Claims (8)
1. The utility model provides an integrated circuit packaging structure, its structure is equipped with seal structure (1), integrated circuit board (2), pin (3), rubber gasket (4), its characterized in that: the integrated circuit board (2) is detachably mounted in the sealing structure (1), the top of the pin (3) is welded to the outer end of the integrated circuit board (2), the top of the pin (3) penetrates through the inside of the sealing rubber ring (4), and the sealing rubber ring (4) is fixedly clamped in the outer wall of the sealing structure (1);
integrated circuit board (2) are equipped with chip (21), circuit board (22), louvre (23), fan (24), cooling mechanism (25), chip (21) demountable installation is in circuit board (22) center department, louvre (23) are established in fan (24) below, fan (24) fixed mounting is in chip (21) below, cooling mechanism (25) bottom block is installed inside circuit board (22).
2. The integrated circuit package structure of claim 1, wherein: the cooling mechanism (25) is composed of a heat absorber (251), a guide plate (252), a fixed end (253) and an air outlet (254), the heat absorber (251) is fixedly installed between the guide plate (252), the guide plate (252) is fixedly connected above the fixed end (253), and the air outlet (254) is fixedly connected above the guide plate (252).
3. An integrated circuit package structure as recited in claim 2, wherein: the heat absorption device (251) comprises an overflow plate (A1), a heat absorption end (A2) and a filtering end (A3), wherein the filtering end (A3) is fixedly connected below the overflow plate (A1), and the heat absorption end (A2) is detachably mounted below the filtering end (A3).
4. An integrated circuit package structure as recited in claim 3, wherein: the heat absorption device is characterized in that the heat absorption end (A2) is provided with a limiting structure (A21), a heat absorption band (A22) and a material storage groove (A23), the heat absorption band (A22) is movably connected between the limiting structures (A21), the outer side of the heat absorption band (A22) is connected with the material storage groove (A23) in a matched mode, and the front end of the material storage groove (A23) is connected to the rear end of the limiting structure (A21) in a clamping mode.
5. The integrated circuit package structure of claim 4, wherein: limit structure (A21) is including driving wheel (B1), hole area (B2), spacing wheel (B3), paint end (B4), driving wheel (B1) swing joint is at spacing wheel (B3) right-hand member, hole area (B2) inboard laminating is connected on spacing wheel (B3) outer wall and driving wheel (B1) outer wall, paint end (B4) right-hand member cooperation and connect in the hole area (B2) outside.
6. An integrated circuit package structure as recited in claim 5, wherein: the driving wheel (B1) is composed of driving teeth (B11), a magnetism isolating ring (B12) and a magnetic rotating ring (B13), the driving teeth (B11) are arranged on the outer wall of the magnetism isolating ring (B12), and the magnetism isolating ring (B12) is fixedly connected to the outer wall of the magnetic rotating ring (B13).
7. The integrated circuit package structure of claim 6, wherein: the magnetic rotating ring (B13) comprises a connecting ring (C1), a repulsive force ring (C2) and a magnetic block (C3), the inner side of the connecting ring (C1) is connected with the magnetic block (C3) in a matched mode, and the magnetic block (C3) is fixedly connected to the outer wall of the repulsive force ring (C2).
8. An integrated circuit package structure as recited in claim 7, wherein: the repulsive force ring (C2) is provided with a matching ring (C21), a fixing column (C22), a magnetic ring piece (C23) and a like magnetic stripe (C24), the matching ring (C21) is movably connected to the periphery of the fixing column (C22), the outer end of the fixing column (C22) is fixedly connected with the like magnetic stripe (C24), the outer side of the like magnetic stripe (C24) is matched and connected with the outer side of the magnetic ring piece (C23), and two ends of the magnetic ring piece (C23) are fixedly connected to the inner wall of the matching ring (C21) in an embedded mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110787689.7A CN113539994A (en) | 2021-07-13 | 2021-07-13 | Integrated circuit packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110787689.7A CN113539994A (en) | 2021-07-13 | 2021-07-13 | Integrated circuit packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113539994A true CN113539994A (en) | 2021-10-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110787689.7A Pending CN113539994A (en) | 2021-07-13 | 2021-07-13 | Integrated circuit packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113539994A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390772A (en) * | 2021-12-29 | 2022-04-22 | 江苏密特科智能装备制造有限公司 | Precision assembly of semiconductor equipment |
-
2021
- 2021-07-13 CN CN202110787689.7A patent/CN113539994A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114390772A (en) * | 2021-12-29 | 2022-04-22 | 江苏密特科智能装备制造有限公司 | Precision assembly of semiconductor equipment |
| CN114390772B (en) * | 2021-12-29 | 2024-03-08 | 江苏密特科智能装备制造有限公司 | Precise component of semiconductor equipment |
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