CN113539641A - Surface-mounted inductor integrated structure and manufacturing method thereof - Google Patents
Surface-mounted inductor integrated structure and manufacturing method thereof Download PDFInfo
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- CN113539641A CN113539641A CN202010292131.7A CN202010292131A CN113539641A CN 113539641 A CN113539641 A CN 113539641A CN 202010292131 A CN202010292131 A CN 202010292131A CN 113539641 A CN113539641 A CN 113539641A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/29—Terminals; Tapping arrangements for signal inductances
- H01F27/292—Surface mounted devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F27/00—Details of transformers or inductances, in general
- H01F27/28—Coils; Windings; Conductive connections
- H01F27/32—Insulating of coils, windings, or parts thereof
- H01F27/327—Encapsulating or impregnating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/06—Coil winding
- H01F41/076—Forming taps or terminals while winding, e.g. by wrapping or soldering the wire onto pins, or by directly forming terminals from the wire
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01F—MAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
- H01F41/00—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
- H01F41/02—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
- H01F41/04—Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets for manufacturing coils
- H01F41/12—Insulating of windings
- H01F41/127—Encapsulating or impregnating
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- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Coils Or Transformers For Communication (AREA)
- Manufacturing Cores, Coils, And Magnets (AREA)
Abstract
The invention relates to the technical field of inductor elements, in particular to an integrated structure of a surface-mounted inductor, wherein two tail ends of a coil are respectively led out from the lower part of the outer side, the leads are bent to the bottom of the coil, the tail ends of the leads are loaded on parallel metal plates to be jointed and then are exposed on the bottom surface of a product, the coil and an encapsulation material are integrally formed, a wire formed by the coil is covered with an insulating resin film on a copper wire, an adhesive used for fixing the wire is further coated on the insulating film, the cross section of a copper wire is at least one of circular, square and flat, and the two tail ends of the copper wire are led out from the lower part of the outer side of the coil after winding. According to the manufacturing method of the present invention, the surface-mounted bottom electrode inductor can be easily manufactured, the inexpensive metal plate is used without using silver paste for bonding, and therefore, the inductor is low in cost, and the coil end and the metal plate can be directly bonded, and the bonding area is large, and therefore, the bonding reliability is high.
Description
Technical Field
The invention relates to the technical field of inductor elements, in particular to a surface-mounted inductor integrated structure and a manufacturing method thereof.
Background
At present, a sealing material made of magnetic powder and resin has been widely used in the industry to form a coil surface mount inductor.
In the conventional structure 1 shown in fig. 6, the terminal of the coil lead is exposed to the outside of the molded body, and Ni/Sn plating is performed after silver paste adhesion coating and curing. Since the silver paste used in this method is a mixture of silver and a resin, it has a characteristic of being weak against a humid atmosphere, and the adhesive force of the resin is lowered under a high humidity environment, and there is a possibility that the reliability of bonding with the coil end is lowered (at worst, there is a risk of poor bonding or disconnection). In addition, silver paste is very expensive, resulting in high cost.
In conventional structure 2 (patent document 1: Japanese patent laid-open No. 2003-290992) shown in FIG. 7, a method of manufacturing a surface mount inductor using a metal plate such as a lead frame is disclosed. In this method, the coil is joined at its end to a portion of a metal plate by resistance welding or the like, the coil is entirely molded with a sealing material, and the metal plate drawn out from the molded body is bent to form an external electrode. In this method, since the bonding area is small (spot bonding), the bonding reliability such as the bonding detachment is lowered by the springback of the coil, or if the bonding area is increased, the built-in coil becomes small, resulting in poor electrical characteristics.
The applicant has seen the shortcomings of the conventional inductor technology, inherits the spirit of research innovation and lean refinement, combines production practice, and provides a practical solution by using a professional scientific method, so that the application of the application is provided.
Disclosure of Invention
The present invention aims to provide a surface mount inductor which can realize stable bonding regardless of the size of the wire section, does not use silver paste, is low in cost, and has a bottom electrode structure.
The integrated structure of surface mounted inductor has two ends of the coil led out from the lower part of the outer side, the leads bent to the bottom of the coil, the ends of the leads connected to parallel metal plates and exposed to the bottom of the product, and the coil and the packing material formed integrally.
Specifically, the wire rod formed by the coil is covered with an insulating resin coating on a copper wire, and the insulating coating is further coated with an adhesive for fixing the wire rod.
Specifically, the cross section of the copper wire is at least one of circular, square and flat, and two tail ends of the copper wire are led out from the lower part of the outer side of the coil after winding.
A manufacturing method of a surface-mounted inductor integrated structure comprises the following steps: the coil is mounted with its upper surface facing downward and its end parallel to the metal plate and is joined by resistance welding or the like;
step two: shaping the lead wire to enable the angle between the coil and the metal plate to be 90 degrees; step three: feeding the coil and the metal plate in a concave forming die (placed so that the coil comes out of an open face of the die);
step four: inserting a flat plate from above, the flat plate being placed on the metal plate;
step five: bending the lead wire so that the coil comes on the flat plate and the angle between the metal plate and the coil is 60 DEG or less);
step six: closing the open surface of the female mold with another mold and inserting a flat plate over the coil;
step seven: closing the forming mold, heating the whole mold, descending the PIN mold from the upper side, and forming by heat and pressure;
step eight: after the molding is completed, the mold is opened, the product is taken out, and burrs of the molded body are discharged and removed, and the metal plate is cut off to remove unnecessary portions.
Specifically, the metal plate is made of any one of copper alloy, phosphor bronze, brass and copper, and the surface of the copper alloy is subjected to Ni substrate electroplating and then Sn electroplating treatment.
The method for solving the problems comprises the following steps: 1. the coil is encapsulated with a molding die by using a sealing material composed of a magnetic material and a resin. 2. The coil is composed of a flat plate (plate core) formed by performing a packaging material, a coil and a metal plate. 3. After the winding, both ends are led out from the outside, respectively, and then the wiring is bent so as to be drawn out from the lower portion of the coil. 4. The coil end is placed on the metal plate in parallel with the metal plate, the end is joined to the metal plate, the flat plate core is placed on the metal plate, and then the wiring is bent to place the coil on the flat plate core. 5. Then, another flat plate core is placed on the upper surface of the coil, and the upper and lower surfaces of the coil are sandwiched by the flat plate cores, and the coil is molded and integrated by heat pressing or only by pressing. 6. On the bottom surface of the molded body, the metal plate is exposed at the same time as molding, and a bottom surface electrode is formed.
The invention has the beneficial effects that: according to the manufacturing method of the present invention, the surface-mounted bottom electrode inductor can be easily manufactured, the inexpensive metal plate is used without using silver paste for bonding, and therefore, the inductor is low in cost, and the coil end and the metal plate can be directly bonded, and the bonding area is large, and therefore, the bonding reliability is high.
Drawings
Fig. 1 is a perspective view of a surface mount inductor of the present invention;
FIG. 2 is a process diagram of a method of manufacturing a surface mount inductor according to the present invention;
FIG. 3 is a step diagram illustrating the shape of a surface mount inductor according to the present invention;
FIG. 4 is a modified view of a coil embodiment of the present invention;
FIG. 5 is a modified view of an embodiment of a surface mount inductor according to the present invention;
FIG. 6 is a diagram of a prior art embodiment;
fig. 7 is a diagram of a prior art embodiment.
Reference is made to the accompanying drawings in which: coil 1, metal sheet 2, copper line 3.
Detailed Description
The drawings are for illustrative purposes only and are not to be construed as limiting the patent; for the purpose of better illustrating the embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted. The positional relationships depicted in the drawings are for illustrative purposes only and are not to be construed as limiting the present patent.
Referring to fig. 1, which is a schematic view of the structure of the present invention, a surface mount inductor integrated structure is disclosed, two ends of a coil are respectively led out from the lower part of the outer side, leads are bent to the bottom of the coil, the ends of the leads are mounted on parallel metal plates for bonding and then exposed on the bottom surface of a product, and the coil and a packaging material are integrally formed.
According to the scheme, the wire formed by the coil is covered with the insulating resin coating on the copper wire, the insulating coating is further coated with the adhesive for fixing the wire, the cross section of the copper wire is at least one of circular, square and flat, and two ends of the copper wire are led out from the lower part of the outer side of the coil after winding. When Edgewise winding is performed on a rectangular wire, one end may be bent and drawn out from the same position as the other end. The coil is hollow, and both ends of the coil are wired to the lower part of the outside. The insulating film at the end is removed by heat (laser irradiation or the like) or mechanically (peeling blade). The flat plate core is formed into a shape of a flat plate by putting a powdery sealing material in which a metal magnetic powder and an epoxy resin are mixed into a molding die and pressing or by using heat and pressure in combination. Under the condition of heating and pressing, the incompletely cured state is maintained.
A manufacturing method of a surface-mounted inductor integrated structure is characterized in that: the method comprises the following steps: the coil is mounted with its upper surface facing downward and its end parallel to the metal plate and is joined by resistance welding or the like; step two: shaping the lead wire to enable the angle between the coil and the metal plate to be 90 degrees; step three: feeding the coil and the metal plate in a concave forming die (placed so that the coil comes out of an open face of the die); step four: inserting a flat plate from above, the flat plate being placed on the metal plate; step five: bending the lead wire so that the coil comes on the flat plate and the angle between the metal plate and the coil is 60 DEG or less); step six: closing the open surface of the female mold with another mold and inserting a flat plate over the coil; step seven: closing the forming mold, heating the whole mold, descending the PIN mold from the upper side, and forming by heat and pressure; step eight: after the molding is completed, the mold is opened, the product is taken out, and burrs of the molded body are discharged and removed, and the metal plate is cut off to remove unnecessary portions.
According to the scheme, the metal plate is made of any one of copper alloy, phosphor bronze, brass and copper, and the surface of the copper alloy is subjected to Ni substrate electroplating and then Sn electroplating treatment.
As in example 1 in fig. 5, the coil ends may be joined to the metal plate on the opposite side and exposed to the outside of the product. As shown in example 2, the metal plate may not overflow from the bottom surface of the product, or may be bent after the overflow; as shown in example 3, the metal plate may be free from plating, and in this case, the plating treatment may be performed after the forming.
It should be understood that the above-described embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (5)
1. The utility model provides a surface mounting inductor integral type structure which characterized in that: two ends of the coil are respectively led out from the lower part of the outer side, the lead is bent to the bottom of the coil, the ends of the lead are mounted on the upper surfaces of the parallel metal plates for bonding and then exposed on the upper surface of the bottom surface of the product, and the coil and the packaging material are integrally molded.
2. The integrated structure of surface mount inductor as claimed in claim 1, wherein: the wire formed by the coil is covered with an insulating resin film on a copper wire, and the insulating film is further coated with an adhesive for fixing the wire.
3. The integrated structure of surface mount inductor as claimed in claim 2, wherein: the cross section of the copper wire is at least one of round, square and flat, and two tail ends of the copper wire are led out from the lower part of the outer side of the coil after winding.
4. A manufacturing method of a surface-mounted inductor integrated structure is characterized in that: the method comprises the following steps: the coil is mounted with its upper surface facing downward and its end parallel to the metal plate and is joined by resistance welding or the like;
step two: shaping the lead wire to enable the angle between the coil and the metal plate to be 90 degrees; step three: feeding the coil and the metal plate in a concave forming die (placed so that the coil comes out of an open face of the die);
step four: inserting a flat plate from above, the flat plate being placed on the metal plate;
step five: bending the lead wire so that the coil comes on the flat plate and the angle between the metal plate and the coil is 60 DEG or less);
step six: closing the open surface of the female mold with another mold and inserting a flat plate over the coil;
step seven: closing the forming mold, heating the whole mold, descending the PIN mold from the upper side, and forming by heat and pressure;
step eight: after the molding is completed, the mold is opened, the product is taken out, and burrs of the molded body are discharged and removed, and the metal plate is cut off to remove unnecessary portions.
5. The method for manufacturing the integrated structure of the surface mount inductor as claimed in claim 4, wherein: the metal plate is made of any one of copper alloy, phosphor bronze, brass and copper, and the surface of the copper alloy is firstly electroplated with a Ni substrate and then electroplated with Sn.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010292131.7A CN113539641A (en) | 2020-04-14 | 2020-04-14 | Surface-mounted inductor integrated structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010292131.7A CN113539641A (en) | 2020-04-14 | 2020-04-14 | Surface-mounted inductor integrated structure and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN113539641A true CN113539641A (en) | 2021-10-22 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010292131.7A Pending CN113539641A (en) | 2020-04-14 | 2020-04-14 | Surface-mounted inductor integrated structure and manufacturing method thereof |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637506A (en) * | 2012-03-20 | 2012-08-15 | 苏州达方电子有限公司 | Miniature inductance component and method for manufacturing same |
| EP2996124A1 (en) * | 2014-09-11 | 2016-03-16 | Sumida Corporation | Manufacturing method of coil component, and coil component |
| CN107039158A (en) * | 2015-09-30 | 2017-08-11 | 太阳诱电株式会社 | Coil component and its manufacture method |
| CN110875126A (en) * | 2018-08-31 | 2020-03-10 | 太阳诱电株式会社 | Coil component and electronic device |
-
2020
- 2020-04-14 CN CN202010292131.7A patent/CN113539641A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102637506A (en) * | 2012-03-20 | 2012-08-15 | 苏州达方电子有限公司 | Miniature inductance component and method for manufacturing same |
| EP2996124A1 (en) * | 2014-09-11 | 2016-03-16 | Sumida Corporation | Manufacturing method of coil component, and coil component |
| CN107039158A (en) * | 2015-09-30 | 2017-08-11 | 太阳诱电株式会社 | Coil component and its manufacture method |
| CN110875126A (en) * | 2018-08-31 | 2020-03-10 | 太阳诱电株式会社 | Coil component and electronic device |
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