CN1135383C - Process for preparing gold electrode - Google Patents
Process for preparing gold electrode Download PDFInfo
- Publication number
- CN1135383C CN1135383C CNB00118931XA CN00118931A CN1135383C CN 1135383 C CN1135383 C CN 1135383C CN B00118931X A CNB00118931X A CN B00118931XA CN 00118931 A CN00118931 A CN 00118931A CN 1135383 C CN1135383 C CN 1135383C
- Authority
- CN
- China
- Prior art keywords
- gold
- electrode
- silicon rubber
- rubber sealant
- gold electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y02E60/12—
Landscapes
- Sealing Material Composition (AREA)
Abstract
The present invention belongs to a preparing method of a gold electrode. In the method, a gold surface is coated with a film of a silicon rubber sealant, and the gold material coated with the film of the silicon rubber sealant is then fixed in a hole of an electrode sleeve or a notch groove of a casing; after the silicon rubber sealant is solidified, a gold electrode is prepared. The preparing method has the advantages of simple technology, application to gold materials in different shapes, low price, etc. and can be easily popularized and used.
Description
Technical field
The invention belongs to the method for making of gold electrode.
Background technology
Gold electrode is one of most principal work electrode in the electrochemical research, is widely used in the research of self-assembled film etc.At present, the preparation method of gold electrode mainly contains following several, and first kind is the way that adopts glass to fire, promptly at glass tube of the outside of spun gold cover, then burn on the flame combine closely to glass and spun gold till.Because the expansion coefficient of the expansion coefficient of gold and common glass is different, the phenomenon of seepage often takes place easily with the electrode of general glass head seal, therefore must adopt special glass, and the expansion coefficient specific glass consistent with metallographic often is difficult to obtain, its compositing formula complexity, fire difficulty, price is also relatively more expensive.Another kind method is at double-deck teflon heat-shrink tube of spun gold overcoat, handles a period of time then at a certain temperature to get final product.This method can play good sealing effectiveness to the very smooth spun gold in surface.But double-deck teflon heat-shrink tube is rare expensive, and surface not too smooth spun gold or gold copper-base alloy in irregular shape just are difficult to play sealing effectiveness.
Summary of the invention
The method for making that the purpose of this invention is to provide a kind of gold electrode.This method is fixed on gold copper-base alloy by fluid sealant in the hole of electrode sleeve or in the cutting of housing, thereby has prevented the seepage phenomenon of gold electrode, utilizes electrode sleeve or housing to protect sealed Cellophane simultaneously.
The present invention selects to contain electrode sleeve that size and gold copper-base alloy match or the housing that has cutting, only be coated with the skim silicon rubber sealant then on the surface of gold, the gold copper-base alloy that will scribble the skim silicon rubber sealant is at last inserted in the hole of electrode sleeve or in the cutting of housing, is treated promptly to make gold electrode after silicon rubber sealant fully solidifies.Electrode sleeve is selected teflon and stainless steel material respectively with the housing that has cutting.
The method for making of gold electrode provided by the invention have technology simple, applicable to difform gold copper-base alloy and advantage such as cheap, because the sealant material that is adopted is a silicon rubber, it has good stability, so the electrode of making of this method has the wider scope of application.
Embodiment
Embodiment 1: the spun gold of getting 1 millimeter of a diameter is coated with the skim silicon rubber sealant on its surface, then this spun gold is inserted in the glass tube of 1.1 millimeters of internal diameters, treats can use after the silicone rubber seal adhesive curing.
Embodiment 2: the spun gold of getting 1 millimeter of a diameter is coated with the skim silicon rubber sealant on its surface, then this spun gold is inserted in the polyfluortetraethylene pipe of 1.1 millimeters of internal diameters, treats can use after the silicone rubber seal adhesive curing.
Embodiment 3: the gold rod of getting 3 millimeters of diameters is coated with the skim silicon rubber sealant on its surface, then this spun gold is inserted in the polyfluortetraethylene pipe of 3.1 millimeters of internal diameters, treats can use after the silicone rubber seal adhesive curing.
Embodiment 4: carve 2.1 millimeters high holes of 5.1 millimeters of long 2.1 mm wides on teflon rod, then 2 millimeters high gold bullions of 5 millimeters of length 2 mm wides that scribble the skim silicon rubber sealant are put into this hole, treat to use after the silicone rubber seal adhesive curing.
Embodiment 5: carve 2.1 millimeters high cuttings of 0.6 millimeter of long 5.1 mm wides on piece of stainless steel, the gold plaque that then a slice is scribbled 0.5 millimeter of length 5 mm wides 2 millimeters thick of skim silicon rubber sealant is put into this cutting, treats can use after the silicone rubber seal adhesive curing.
Claims (1)
1. the method for making of a gold electrode, it is characterized in that selecting containing the electrode sleeve that size and gold copper-base alloy match or the housing of cutting, only be coated with the skim silicon rubber sealant then on the surface of gold, the gold copper-base alloy that will scribble the skim silicon rubber sealant is at last inserted in the hole of electrode sleeve or in the cutting of housing, is treated to make gold electrode after silicon rubber sealant fully solidifies.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB00118931XA CN1135383C (en) | 2000-08-09 | 2000-08-09 | Process for preparing gold electrode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB00118931XA CN1135383C (en) | 2000-08-09 | 2000-08-09 | Process for preparing gold electrode |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1306204A CN1306204A (en) | 2001-08-01 |
| CN1135383C true CN1135383C (en) | 2004-01-21 |
Family
ID=4587360
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB00118931XA Expired - Fee Related CN1135383C (en) | 2000-08-09 | 2000-08-09 | Process for preparing gold electrode |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1135383C (en) |
-
2000
- 2000-08-09 CN CNB00118931XA patent/CN1135383C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1306204A (en) | 2001-08-01 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C19 | Lapse of patent right due to non-payment of the annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |