CN113529157A - Electrolyte for aluminum-silicon plated plate strain analysis and grid printing method - Google Patents
Electrolyte for aluminum-silicon plated plate strain analysis and grid printing method Download PDFInfo
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- CN113529157A CN113529157A CN202110673245.0A CN202110673245A CN113529157A CN 113529157 A CN113529157 A CN 113529157A CN 202110673245 A CN202110673245 A CN 202110673245A CN 113529157 A CN113529157 A CN 113529157A
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/04—Etching of light metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
- C25F3/00—Electrolytic etching or polishing
- C25F3/02—Etching
- C25F3/14—Etching locally
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N1/00—Sampling; Preparing specimens for investigation
- G01N1/28—Preparing specimens for investigation including physical details of (bio-)chemical methods covered elsewhere, e.g. G01N33/50, C12Q
- G01N1/32—Polishing; Etching
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
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Abstract
The invention discloses an electrolyte for strain analysis of an aluminum-silicon plated plate and a grid printing method, wherein the electrolyte is prepared from sulfuric acid, a sulfate solution, a phosphate solution, oxalic acid and a sodium fluoride solution; the grid printing method comprises the following steps: the electrolyte is adopted to carry out grid printing on the aluminum-silicon coating, in the grid printing process, the voltage of a marking machine is controlled to be 6-12V, the pressure of a marking head is controlled to be 10-30N, and the marking time is controlled to be 4-8 s. The electrolyte and the grid printing method provided by the invention have the advantages that the corrosion depth of the aluminum-silicon plating layer plate is proper, the matrix and the transition layer are not damaged, the stamping forming of a plate material is not influenced, the grid is clear, the deformation state is acquired by taking a picture after the part is formed, no impurity point exists, and the strain analysis can be rapidly completed.
Description
Technical Field
The invention belongs to the field of material analysis, and particularly relates to an electrolyte for aluminum-silicon plated plate strain analysis and a grid printing method.
Background
The aluminum-silicon plated steel plate has excellent corrosion resistance and oxidation resistance under the high temperature condition (650 plus 800 ℃), has wide application prospect in the automobile industry, can be used for parts such as engine heat insulation plates, supports, exhaust pipes, oil tanks and the like, and can effectively ensure the service performance of parts at high temperature. In order to evaluate the manufacturability of the part, the part needs to be subjected to forming limit test so as to carry out risk evaluation, and strain analysis in FLC forming limit performance test needs to adopt DIC or grid strain analysis. DIC equipment is expensive, and data processing has high requirements on technical personnel and is mostly applied to colleges and universities or research institutes; the enterprise mostly adopts grid strain to analyze.
The key step in the grid strain analysis process is to carry out grid printing on the plate surface, and the grid printing process of the traditional common carbon steel, galvanized plate, aluminum plate and the like can not effectively carry out grid printing on the aluminum-silicon plate plating plate, thereby seriously influencing the subsequent strain analysis. At present, no grid printing process specially suitable for the aluminum-silicon coating plate is available, and effective and rapid analysis and measurement of subsequent grid strain data can be guaranteed.
Disclosure of Invention
The invention aims to provide an electrolyte for aluminum-silicon plated plate strain analysis and a grid printing method.
In order to achieve the purpose, the technical scheme provided by the invention is as follows:
an electrolyte for the strain analysis of an aluminum-silicon plated plate is prepared from a sodium fluoride solution, oxalic acid, a phosphate solution, a sulfate solution and sulfuric acid.
The phosphate solution is one or more of sodium phosphate solution, potassium phosphate solution and calcium phosphate solution.
The sulfate solution is one or more of a sodium sulfate solution, a potassium sulfate solution, a sodium bisulfate solution and a potassium bisulfate solution.
The concentration of the sodium fluoride solution is 2-10 g/L; the concentration of the phosphate solution is 5-25 g/L; the concentration of the sulfate solution is 5-20 g/L.
The volume ratio of the sodium fluoride solution, the oxalic acid, the phosphate solution, the sulfate solution and the sulfuric acid in the electrolyte is 1: 2-8: 2-3.5: 1.5-3: 1-1.5.
The preparation process of the electrolyte comprises the following steps: according to the volume ratio of the sodium fluoride solution to the oxalic acid to the phosphate solution to the sulfate solution to the sulfuric acid of 1: 2-8: 2-3.5: 1.5-3: 1-1.5, slowly adding the oxalic acid, the phosphate solution, the sulfate solution and the sulfuric acid into the sodium fluoride solution, and cooling to room temperature.
The sodium fluoride solution, the phosphate solution and the sulfate solution are all prepared by water.
The invention also provides a grid printing method for the strain analysis of the aluminum-silicon plated plate, which is specifically characterized in that the grid printing is carried out on the aluminum-silicon plated layer by adopting the electrolyte, and the voltage of a marking machine is controlled to be 6-12V in the grid printing process; controlling the pressure of the marking head to be 10-30V; and the marking time is controlled to be 4-8 s.
When the aluminum-silicon plating layer plate is subjected to grid printing by adopting the process parameters, a plating layer with the thickness of 2-5 um can be subjected to chemical reaction with electrolyte within a control time, the printed grid lines are clear and continuous, the requirements are met, the substrate cannot be deeply corroded, the thickness and the width of the substrate cannot be too large and too wide, the analysis result cannot be influenced, and the data acquisition cannot be influenced too shallow. After the grid is printed, the bulging test is carried out on the plate, and then the deformation state of the grid is photographed and collected, so that the strain analysis can be carried out.
The invention has the beneficial effects that:
the electrolyte provided by the invention only generates electrochemical corrosion on the plating layer during grid printing, does not damage the base body and the transition layer, keeps the transition layer and the base body complete, and does not influence the formability of parts.
The grid printing process provided by the invention is suitable for any aluminum-silicon plating plate, is not influenced by the thickness, components and process fluctuation of the plating layer, can obtain grids with proper and clear corrosion depth, can quickly perform grid strain analysis on a formed part, and has good effect and low cost.
Drawings
FIG. 1 shows the screen-printed and stamped part of example 1.
FIG. 2 shows the part of example 2 after screen printing and stamping.
FIG. 3 shows the part of example 3 after screen printing and stamping.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1
0.5mm thick for a certain manufacturer, and the weight of the coating is 120g/m2The aluminum-silicon plating layer plate is subjected to strain analysis, and the specific process is as follows:
(1) preparing an electrolyte
The electrolyte of the embodiment is prepared from a sodium fluoride solution, oxalic acid, a sodium phosphate solution, a potassium sulfate solution and sulfuric acid; wherein the concentration of the sodium fluoride solution is 8g/L, the concentration of the sodium phosphate solution is 25g/L, and the concentration of the potassium sulfate solution is 20 g/L.
The electrolyte preparation process of the embodiment is as follows: according to the volume ratio of the sodium fluoride solution, the oxalic acid, the sodium phosphate solution, the potassium sulfate solution and the sulfuric acid of 1: 6: 3: 2.5: 1.25, the oxalic acid, the sodium phosphate solution, the potassium sulfate solution and the sulfuric acid are sequentially and slowly added into the sodium fluoride solution, and the mixture is cooled to the room temperature.
(2) Grid printing
And (2) carrying out grid printing on the silicon coating plate by adopting the electrolyte prepared in the step (1), wherein in the grid printing process, the voltage of a marking machine is set to be 8V, the pressure of a marking head is 20N, and the marking time is 6 s.
After the grid printing is finished, the grids on the surface of the aluminum-silicon coating plate can be seen to be clear, the corrosion depth is on the surface layer of the coating, and the part after the part is formed by stamping is shown in figure 1.
As can be seen from FIG. 1, the part cracking position is not along the grid lines, which shows that the grid printed by the method does not influence the forming cracking of the part.
(3) Strain analysis
And carrying out bulging experiments on the plate material printed with the grids, then photographing to acquire the deformation state of the grids, and carrying out strain analysis to obtain the ultimate strain of the grids.
Example 2
The weight of a coating with the thickness of 0.4mm of a certain manufacturer is 80g/m2The grid printing process method for the aluminum-silicon plating plate strain analysis comprises the following specific implementation steps:
(1) preparing an electrolyte
The electrolyte of the embodiment is prepared from a sodium fluoride solution, oxalic acid, a potassium phosphate solution, a sodium sulfate solution and sulfuric acid; wherein the concentration of the sodium fluoride solution is 4g/L, the concentration of the potassium phosphate solution is 20g/L, and the concentration of the sodium sulfate solution is 15 g/L.
The electrolyte preparation process of the embodiment is as follows: according to the volume ratio of the sodium fluoride solution to the oxalic acid to the potassium phosphate solution to the sodium sulfate solution to the sulfuric acid of 1: 4: 1.5: 1.0, the oxalic acid, the potassium phosphate solution, the sodium sulfate solution and the sulfuric acid are sequentially and slowly added into the sodium fluoride solution, and the mixture is cooled to room temperature.
(2) Grid printing
And (2) carrying out grid printing on the silicon coating plate by adopting the electrolyte prepared in the step (1), wherein in the grid printing process, the voltage of a marking machine is set to be 8V, the pressure of a marking head is 15N, and the marking time is 4 s.
After the grid printing is finished, the grids on the surface of the aluminum-silicon coating plate can be seen to be clear, the corrosion depth is on the surface layer of the coating, and the part after the part is formed by stamping is shown in figure 2.
As can be seen from FIG. 2, the part cracking position is not along the grid lines, which shows that the grid printed by the method does not influence the forming cracking of the part.
(3) Strain analysis
And carrying out bulging experiments on the plate material printed with the grids, then photographing to acquire the deformation state of the grids, and carrying out strain analysis to obtain the ultimate strain of the grids.
Example 3
The weight of a 1.0mm thick coating of a certain manufacturer is 100g/m2The grid printing process method for the aluminum-silicon plating plate strain analysis comprises the following specific implementation steps:
(1) preparing an electrolyte
The electrolyte of the embodiment is prepared from a sodium fluoride solution, oxalic acid, a calcium phosphate solution, a sodium bisulfate solution and sulfuric acid; wherein the concentration of the sodium fluoride solution is 6g/L, the concentration of the calcium phosphate solution is 11g/L, and the concentration of the sodium sulfate solution is 8 g/L.
The electrolyte preparation process of the embodiment is as follows: according to the volume ratio of sodium fluoride solution, oxalic acid, calcium phosphate solution, sodium bisulfate solution and sulfuric acid of 1: 5: 2.5: 2: 1, the oxalic acid, the calcium phosphate solution, the sodium bisulfate solution and the sulfuric acid are sequentially and slowly added into the sodium fluoride solution, and the mixture is cooled to room temperature.
(2) Grid printing
And (2) carrying out grid printing on the silicon coating plate by adopting the electrolyte prepared in the step (1), wherein in the grid printing process, the voltage of a marking machine is set to be 10V, the pressure of a marking head is 13N, and the marking time is 5 s.
After the grid printing is finished, the grids on the surface of the aluminum-silicon coating plate can be seen to be clear, the corrosion depth is on the surface layer of the coating, and the part after the part is formed by stamping is shown in figure 3.
As can be seen from FIG. 3, the part cracking position is not along the grid lines, which shows that the grid printed by the method does not influence the forming cracking of the part.
(3) Strain analysis
And carrying out bulging experiments on the plate material printed with the grids, then photographing to acquire the deformation state of the grids, and carrying out strain analysis to obtain the ultimate strain of the grids.
Example 4
The weight of a coating with the thickness of 0.4mm of a certain manufacturer is 120g/m2The grid printing process method for the aluminum-silicon plating plate strain analysis comprises the following specific implementation steps:
(1) preparing an electrolyte
The electrolyte of the embodiment is prepared by a sodium fluoride solution with the concentration of 10g/L, oxalic acid, a phosphate solution, a potassium hydrogen sulfate solution with the concentration of 5g/L and sulfuric acid; wherein the phosphate solution is formed by mixing 8g/L sodium phosphate solution and 6g/L potassium phosphate solution according to the volume ratio of 1: 1.
The electrolyte preparation process of the embodiment is as follows: according to the ratio of the total volume of the sodium fluoride solution, the oxalic acid and the phosphate solution to the volume ratio of the potassium hydrogen sulfate solution to the sulfuric acid of 1: 8: 3.5: 2.5: 1.5, the oxalic acid, the phosphate solution, the potassium hydrogen sulfate solution and the sulfuric acid are slowly added into the sodium fluoride solution in sequence, and the mixture is cooled to room temperature.
(2) Grid printing
And (2) carrying out grid printing on the silicon coating plate by adopting the electrolyte prepared in the step (1), wherein in the grid printing process, the voltage of a marking machine is set to be 12V, the pressure of a marking head is 10N, and the marking time is 7 s.
After the grid printing is finished, the grid on the surface of the aluminum-silicon coating plate can be seen to be clear, the corrosion depth is on the surface layer of the coating, and the cracking position of the part after the part is stamped and formed does not follow grid lines, which shows that the grid printed by the method does not influence the forming cracking of the part.
(3) Strain analysis
And carrying out bulging experiments on the plate material printed with the grids, then photographing to acquire the deformation state of the grids, and carrying out strain analysis to obtain the ultimate strain of the grids.
Example 5
The weight of a coating with the thickness of 0.8mm of a certain manufacturer is 100g/m2The grid printing process method for the aluminum-silicon plating plate strain analysis comprises the following specific implementation steps:
(1) preparing an electrolyte
The electrolyte of the embodiment is prepared from a sodium fluoride solution with the concentration of 10g/L, oxalic acid, a phosphate solution, a sulfate solution and sulfuric acid; wherein the phosphate solution is formed by mixing a potassium phosphate solution with the concentration of 7g/L and a calcium phosphate solution with the concentration of 7g/L according to the volume ratio of 2: 1; the sulfate solution is formed by mixing potassium sulfate solution with the concentration of 10g/L and sodium sulfate solution with the concentration of 10g/L according to the volume ratio of 1: 3.
The electrolyte preparation process of the embodiment is as follows: according to the ratio of the total volume of the sodium fluoride solution, the oxalic acid and the phosphate solution to the total volume of the sulfate solution to the volume of the sulfuric acid of 1: 3: 2: 3: 1.3, the oxalic acid, the phosphate solution, the sulfate solution and the sulfuric acid are slowly added into the sodium fluoride solution in sequence, and the sodium fluoride solution is cooled to room temperature.
(2) Grid printing
And (2) carrying out grid printing on the silicon coating plate by adopting the electrolyte prepared in the step (1), wherein in the grid printing process, the voltage of a marking machine is set to be 9V, the pressure of a marking head is 25N, and the marking time is 8 s.
After the grid printing is finished, the grid on the surface of the aluminum-silicon coating plate can be seen to be clear, the corrosion depth is on the surface layer of the coating, and the cracking position of the part after the part is stamped and formed does not follow grid lines, which shows that the grid printed by the method does not influence the forming cracking of the part.
(3) Strain analysis
And carrying out bulging experiments on the plate material printed with the grids, then photographing to acquire the deformation state of the grids, and carrying out strain analysis to obtain the ultimate strain of the grids.
Example 6
The weight of a 1.0mm thick coating of a certain manufacturer is 80g/m2The grid printing process method for the aluminum-silicon plating plate strain analysis comprises the following specific implementation steps:
(1) preparing an electrolyte
The electrolyte of the embodiment is prepared from a sodium fluoride solution with the concentration of 2g/L, oxalic acid, a phosphate solution, a sulfate solution and sulfuric acid; wherein the phosphate solution is formed by mixing 15g/L sodium phosphate solution and 10g/L calcium phosphate solution according to the volume ratio of 2: 1, and the sulfate solution is formed by mixing 10g/L potassium sulfate solution and 12g/L sodium bisulfate solution according to the volume ratio of 3: 1.
The electrolyte preparation process of the embodiment is as follows: according to the ratio of 1: 2: 1 of the total volume of the sodium fluoride solution, the oxalic acid and the phosphate solution, the total volume of the sulfate solution and the volume of the sulfuric acid, the oxalic acid, the phosphate solution, the sulfate solution and the sulfuric acid are slowly added into the sodium fluoride solution in sequence, and the sodium fluoride solution is cooled to room temperature.
(2) Grid printing
And (2) carrying out grid printing on the silicon coating plate by adopting the electrolyte prepared in the step (1), wherein in the grid printing process, the voltage of a marking machine is set to be 6V, the pressure of a marking head is 30N, and the marking time is 6 s.
After the grid printing is finished, the grid on the surface of the aluminum-silicon coating plate can be seen to be clear, the corrosion depth is on the surface layer of the coating, and the cracking position of the part after stamping forming does not follow grid lines, which shows that the grid printed by the method does not influence the forming cracking of the part.
(3) Strain analysis
And carrying out bulging experiments on the plate material printed with the grids, then photographing to acquire the deformation state of the grids, and carrying out strain analysis to obtain the ultimate strain of the grids.
Claims (8)
1. The electrolyte for the strain analysis of the aluminum-silicon plated plate is characterized by being prepared from a sodium fluoride solution, oxalic acid, a phosphate solution, a sulfate solution and sulfuric acid.
2. The electrolyte for aluminum-silicon plated plate strain analysis according to claim 1, wherein the phosphate solution is one or more of a sodium phosphate solution, a potassium phosphate solution, and a calcium phosphate solution.
3. The electrolyte for aluminum-silicon plated plate strain analysis according to claim 1, wherein the sulfate solution is one or more of a sodium sulfate solution, a potassium sulfate solution, a sodium hydrogen sulfate solution, and a potassium hydrogen sulfate solution.
4. The electrolyte for the aluminum-silicon plated plate strain analysis according to claim 1, wherein the concentration of the sodium fluoride solution is 2-10 g/L; the concentration of the phosphate solution is 5-25 g/L; the concentration of the sulfate solution is 5-20 g/L.
5. The electrolyte for the aluminum-silicon plated plate strain analysis according to claim 4, wherein the volume ratio of the sodium fluoride solution to the oxalic acid to the phosphate solution to the sulfate solution to the sulfuric acid in the electrolyte is 1: 2-8: 2-3.5: 1.5-3: 1-1.5.
6. The electrolyte for aluminum-silicon plated sheet strain analysis according to claim 1, wherein the sodium fluoride solution, the phosphate solution and the sulfate solution are prepared from water.
7. The electrolyte for aluminum-silicon plated sheet strain analysis according to claim 1, wherein the electrolyte is prepared by the following process: according to the volume ratio of the sodium fluoride solution to the oxalic acid to the phosphate solution to the sulfate solution to the sulfuric acid of 1: 2-8: 2-3.5: 1.5-3: 1-1.5, slowly adding the oxalic acid, the phosphate solution to the sulfate solution and the sulfuric acid to the sodium fluoride solution, and cooling to room temperature.
8. A grid printing method for strain analysis of an aluminum-silicon plated plate is characterized in that the electrolyte of claim 1 is adopted to carry out grid printing on the aluminum-silicon plated layer, and in the grid printing process, the voltage of a marking machine is controlled to be 6-12V; controlling the pressure of the marking head to be 10-30V; and the marking time is controlled to be 4-8 s.
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Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4524125A (en) * | 1982-08-13 | 1985-06-18 | Polychrome Corporation | Chemical etching of lithographic aluminum substrate |
| JPH0214187A (en) * | 1988-07-01 | 1990-01-18 | Fuji Photo Film Co Ltd | Manufacture of aluminum support for lithographic printing plate |
| JPH05229275A (en) * | 1992-02-21 | 1993-09-07 | Okamoto Kagaku Kogyo Kk | Production of aluminum support for planographic printing plate |
| JP2003001960A (en) * | 2001-06-27 | 2003-01-08 | Fuji Photo Film Co Ltd | Original plate for planographic printing plate |
| JP2004106448A (en) * | 2002-09-20 | 2004-04-08 | Fuji Photo Film Co Ltd | Method for electrochemical surface-roughening treatment for substrate for lithographic printing plate, producing method comprising it, and substrate obtained by them |
| US20050003226A1 (en) * | 2000-07-11 | 2005-01-06 | Nisshin Steel Co., Ltd. | Chemically processed steel sheet excellent in corrosion resistance |
| CN111286770A (en) * | 2020-03-18 | 2020-06-16 | 王永芝 | Composite material with high binding force |
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2021
- 2021-06-17 CN CN202110673245.0A patent/CN113529157B/en active Active
Patent Citations (8)
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|---|---|---|---|---|
| US4524125A (en) * | 1982-08-13 | 1985-06-18 | Polychrome Corporation | Chemical etching of lithographic aluminum substrate |
| JPH0214187A (en) * | 1988-07-01 | 1990-01-18 | Fuji Photo Film Co Ltd | Manufacture of aluminum support for lithographic printing plate |
| JPH05229275A (en) * | 1992-02-21 | 1993-09-07 | Okamoto Kagaku Kogyo Kk | Production of aluminum support for planographic printing plate |
| US20050003226A1 (en) * | 2000-07-11 | 2005-01-06 | Nisshin Steel Co., Ltd. | Chemically processed steel sheet excellent in corrosion resistance |
| JP2003001960A (en) * | 2001-06-27 | 2003-01-08 | Fuji Photo Film Co Ltd | Original plate for planographic printing plate |
| JP2004106448A (en) * | 2002-09-20 | 2004-04-08 | Fuji Photo Film Co Ltd | Method for electrochemical surface-roughening treatment for substrate for lithographic printing plate, producing method comprising it, and substrate obtained by them |
| CN111286770A (en) * | 2020-03-18 | 2020-06-16 | 王永芝 | Composite material with high binding force |
| CN111719179A (en) * | 2020-05-11 | 2020-09-29 | 唐山钢铁集团有限责任公司 | Electro-corrosion marking liquid for aluminum-silicon-plated coating plate and preparation method thereof |
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| 张敏等: "一种先进的板材成形应变测量网格印制技术", 《锻压技术》, no. 03, 31 March 2005 (2005-03-31), pages 66 - 68 * |
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