CN113524111A

CN113524111A - Automatic assembly machine for inlaid ceramic chip

Info

Publication number: CN113524111A
Application number: CN202110947259.7A
Authority: CN
Inventors: 唐亮; 辛惠显
Original assignee: Suzhou Da Vinci Automation Technology Co ltd
Current assignee: Suzhou Da Vinci Automation Technology Co ltd
Priority date: 2021-05-12
Filing date: 2021-08-18
Publication date: 2021-10-22

Abstract

The invention provides an automatic ceramic chip embedding assembling machine which comprises a ceramic chip glue-removing and film-tearing mechanism, a ceramic chip visual embedding mechanism, a substrate alternate material-changing mechanism and a substrate laminating mechanism which are sequentially arranged along the working procedure, wherein the ceramic chip glue-removing and film-tearing mechanism is used for removing glue and tearing off a ceramic chip slice back glue film and feeding and supplying materials for the ceramic chip visual embedding mechanism; and the ceramic wafer visual embedding mechanism is used for embedding the ceramic wafer with the adhesive film removed by the ceramic wafer debonding and film tearing mechanism into the through hole of the PCB so as to realize embedding of the ceramic wafer. The glue film can be quickly debonded and torn off, the working efficiency is improved, and the requirements of an automatic production line are met; the size of the hole in the identification plate that adopts visual identification's mode can be accurate to improve the accuracy of placing the potsherd, and trunked into the manipulator blowing by artifical blowing, improved automation level and production efficiency.

Description

Automatic assembly machine for inlaid ceramic chip

Technical Field

The invention relates to the technical field of PCB (printed circuit board) production equipment, in particular to an automatic assembling machine for ceramic chip embedding.

Background

The ceramic chip is embedded in the PCB and mainly used for solving the problem that faults are caused by the fact that the PCB is aged and the service life of a high-power heating element on the PCB is shortened due to heat dissipation in the using process, so that the ceramic chip needs to be embedded in the position, corresponding to the high-power heating element, on the PCB, the position precision requirement is higher (plus or minus 0.005 mm), and the process is widely applied to foreign mainstream automobile lamp factories at present and is a necessary process for LED light sources and laser light source PCBs.

In the manufacturing process of the PCB, firstly, the heat dissipation requirement of the heating element on the PCB determines how large the ceramic sheet is needed, then a suitable through hole 41 is processed on the PCB 4 according to the size of the ceramic sheet, and then the ceramic sheet with the corresponding size is placed in the through hole 41, as shown in fig. 2.

The raw material of the ceramic wafer is one piece and one piece, when in use, the whole ceramic wafer is required to be cut according to the required size and then is matched with the through hole formed in the PCB, so that the ceramic wafer on the PCB is placed. As shown in fig. 1, the cut ceramic sheet raw material includes an upper layer of ceramic sheet 1b and a lower layer of adhesive film 1a, in order to facilitate tearing off the adhesive film 1a, at least one corner position is reserved with a film tearing notch 1c, and the commonly used adhesive film 1a is a UV adhesive film.

On one hand, in the process of embedding the ceramic wafer, the whole ceramic wafer is smaller in size after being cut, and is generally square or rectangular with the side length of several millimeters to tens of millimeters; because the size is smaller after cutting, the circulation is not convenient, therefore, a layer of glue film is pasted on the back of the whole ceramic wafer, and the small ceramic wafer after cutting is adhered on the glue film, so that the ceramic wafer is not easy to scatter and convenient to circulate. However, when the ceramic chip is placed in the through hole of the PCB, the adhesive film on the back of the ceramic chip needs to be removed first, and then the small ceramic chip can be placed in the through hole of the PCB. If manual operation is adopted, the ceramic wafer after cutting is small, the ceramic wafer is not easy to tear, long-time operation is easy to fatigue, the workload is large, and the efficiency is low.

On the other hand, a plurality of through holes are formed in the PCB, the sizes of the through holes in the PCB are different, a corresponding ceramic wafer needs to be placed in each through hole, and if the through holes are placed manually, the efficiency is low, the workload is high, and the precision is not easy to control; moreover, manual operation is long in time and easy to fatigue, and placement errors can cause unqualified product quality and rework.

Therefore, in conclusion, the equipment capable of automatically removing the ceramic wafer adhesive film and automatically and accurately placing the ceramic wafer is designed to meet the requirements of the PCB production process.

Disclosure of Invention

The technical problem to be solved by the invention is as follows: in order to overcome the defects in the prior art, the invention provides an automatic assembling machine for ceramic chip embedding.

The technical scheme adopted for solving the technical problems is as follows: an automatic assembly machine for ceramic chip embedding, which comprises a ceramic chip glue-releasing and film-tearing mechanism, a ceramic chip visual embedding mechanism, a substrate alternate material-changing mechanism and a substrate laminating mechanism which are arranged in sequence along the working procedure, wherein,

the ceramic wafer debonding and film tearing mechanism is used for debonding and tearing off a back adhesive film of a ceramic wafer slice, and feeding and supplying materials for the ceramic wafer visual embedding mechanism;

the ceramic wafer visual embedding mechanism is used for embedding the ceramic wafer into the through hole of the PCB after the ceramic wafer adhesive film is removed by the ceramic wafer adhesive removing and film tearing mechanism so as to realize embedding of the ceramic wafer;

the base plate alternate material changing mechanism is used for moving the PCB subjected to ceramic piece embedding from the ceramic piece visual embedding mechanism to a PCB feeding station, and simultaneously moving the PCB which is not subjected to ceramic piece embedding from the PCB feeding station to the ceramic piece visual embedding mechanism;

and the substrate stacking mechanism is used for stacking the PCB subjected to ceramic chip embedding on the feeding station together to realize blanking of the PCB.

According to the processing procedure of the ceramic wafer of the PCB, aiming at the processes of removing the adhesive film and placing the ceramic wafer, the invention designs the specific structures of the ceramic wafer debonding and film tearing mechanism and the ceramic wafer visual embedding mechanism in an emphatic manner, so that the adhesive film and the ceramic wafer embedding material are removed, the specific structures of other mechanisms are not the innovation points of the invention, the specific structures can be realized by adopting the prior art, the detailed description is omitted, and the specific structures of the ceramic wafer debonding and film tearing mechanism and the ceramic wafer visual embedding mechanism are described in detail below.

Specifically, in order to remove the adhesive film, the ceramic wafer debonding and film tearing mechanism comprises a debonding platform, the debonding platform is provided with a debonding mechanism, a film tearing mechanism, a feeding manipulator and a storage bin for placing the ceramic wafer, and the debonding mechanism is used for enabling the adhesive film on the back of the ceramic wafer to lose viscosity; the film tearing mechanism is used for tearing the adhesive film which loses viscosity from the ceramic sheet; the bin is positioned on the side surface of the feeding mechanical arm and used for placing ceramic chip slices; the execution end of the feeding manipulator is connected with a feeding sucker mechanism and is used for adsorbing the circulation of ceramic chip slices among different stations;

in order to realize the embedding of the ceramic wafer into the through hole of the PCB, the ceramic wafer visual embedding mechanism comprises an embedding platform, and at least one embedding mechanical arm is arranged on the embedding platform. Set up the objective table in the work area of putty manipulator below, place the PCB board on the objective table, be equipped with a plurality of through-holes of placing the potsherd on the PCB board, be provided with vision positioning mechanism and sucking disc drop feed mechanism on the execution of putty manipulator, vision positioning mechanism is used for discerning the position of every through-hole on the PCB board, sucking disc drop feed mechanism will adsorb the potsherd on the sucking disc drop feed mechanism according to the position of the through-hole that vision positioning mechanism confirmed and place in the through-hole.

Further, the mechanism of debonding is including debonding lamp, lamp house and lamp controller, the debonding lamp is a plurality of parallel installations in the lamp house, the lamp house is fixed on the debonding platform, and the upper surface of lamp house is the printing opacity structure, the lamp controller sets up on the debonding platform and with the debonding lamp line connection for the operating condition of control debonding lamp. The light of the corresponding glue-releasing lamps of the glue films made of different materials is not necessarily the same, such as: the glued membrane on the ceramic wafer back is the UV glued membrane, therefore, generally adopts the ultraviolet lamp to the UV glued membrane debonding lamp, can make the UV glued membrane lose viscidity through the irradiation of ultraviolet ray, and although there is certain viscidity between the section with the ceramic wafer, nevertheless very easily tears the glued membrane through external force.

Further, in order to achieve removal of the adhesive film, the film tearing mechanism is designed by simulating manual film tearing, is located on one side of the film removing mechanism and comprises a vertical plate, a clamping piece and a film tearing cylinder, the bottom of the vertical plate is fixed on the film removing platform, the clamping piece is fixed on the top of the vertical plate, one end of the clamping piece extends outwards to form an adhesive film clamping portion, the film tearing cylinder is fixed below the adhesive film clamping portion, and a push rod of the film tearing cylinder is opposite to the adhesive film clamping portion. When the film is torn, the push rod of the film tearing cylinder moves upwards to clamp the adhesive film at the position of the film tearing notch of the ceramic wafer slice between the push rod and the adhesive film clamping part, and the ceramic wafer slice is driven by the feeding manipulator to move to tear the adhesive film.

Further, the feeding sucker mechanism comprises a rotary cylinder, the cylinder body of the rotary cylinder is transversely connected to the execution end of the feeding manipulator through a cylinder connecting column, the swinging end of the rotary cylinder can swing in a rotary manner in a vertical plane, and the swing end is fixedly connected with an adapter plate, the upper surface and the lower surface of the adapter plate are respectively provided with a group of sucker components, each group of sucker components comprises a sucker, a Y-shaped plate and a sucker connecting column, the Y-shaped plate is fixedly connected on the surface of the adapter plate, and the three branches of the Y-shaped plate are respectively connected with a sucker connecting column, the sucker is fixed at the top of the sucker connecting column, the sucker is fixed on the adapter plate through the sucker connecting column and the Y-shaped plate, the sucker connecting column is a stud, a nut is arranged on the sucker connecting column, locking of both ends about going on through the nut, the back of sucking disc is equipped with the air pipe and connects, just the air pipe connects and the positive air flue intercommunication of sucking disc.

All set up a set of sucking disc subassembly on the upper and lower two sides of keysets, can realize the sliced absorption of two potsherds simultaneously, can improve work efficiency, adopt revolving cylinder can satisfy the alternative of upper and lower two sets of sucking disc subassemblies.

Furthermore, the number of the bins is at least one, the bins comprise bin bases, at least one adjusting plate and a plurality of positioning columns, the bottoms of the bin bases are fixed on the dispergation platform, the adjusting plate and the plurality of positioning columns jointly enclose a rectangular material cavity with an opening on one side surface on the upper surface of the bin base, and the opening of the rectangular material cavity faces the feeding manipulator; at least one side surface of the rectangular material cavity is formed by a positioning column, and at least one side surface of the rectangular material cavity is formed by an adjusting plate; the adjusting plate can move on the upper surface of the stock bin base to adjust the size of the opening of the rectangular stock cavity. When the feed bin is a plurality of, the potsherd section of different specifications can be placed to every feed bin, satisfies the demand of the potsherd of equidimension not on the PCB board simultaneously.

Further, a guide sliding groove perpendicular to the plane of the adjusting plate is formed in the bin base, a guide strip matched with the guide sliding groove is arranged at the bottom of the adjusting plate, and the guide strip is embedded into the guide sliding groove; when the adjusting plate moves, the guide is carried out, the shape of the rectangular bin is convenient to maintain, and therefore the positioning and material storage of ceramic wafer slices can be better achieved.

The two sides of the guide sliding groove of the bin base are respectively provided with a row of connecting holes, the bottom surface of the adjusting plate is provided with a waist-shaped through hole, the waist-shaped through hole is aligned with the connecting holes up and down, and the adjusting plate is connected and fixed on the bin base through screws arranged in the waist-shaped through hole and the connecting holes. The position of the adjusting plate can be adjusted conveniently according to the size of the ceramic chip slices through the connecting holes, the waist-shaped through holes can achieve fine adjustment of the position of the adjusting plate, and therefore the same bin can meet the requirement for placing the ceramic chip slices of different sizes.

Specifically, the debonding platform includes the box and is used for supporting the support of fixed box, debonding mechanism, dyestripping mechanism, absorption formula blowing platform, feeding manipulator and feed bin all set up at the top of box, and the electric cabinet setting is in the side of box, and dyestripping mechanism, absorption formula blowing platform and feeding manipulator controller all set up in the inside of box, and the four corners of the bottom of box is equipped with universal castor, just the four corners of support is provided with the lower margin.

Furthermore, in order to place the ceramic chip in the through hole of the PCB and ensure the integrity of the ceramic chip, a gas adsorption type discharging mechanism is adopted, the sucker discharging mechanism comprises a cylinder guide rail mounting plate, a suction nozzle, a guide rail and a material sucking cylinder, the back of the cylinder guide rail mounting plate is fixed on a mounting block at the execution end of the embedding manipulator, the material suction cylinder is fixed above the front of the cylinder guide rail mounting plate through a cylinder bracket, the guide rail is fixed on a cylinder guide rail mounting plate below the cylinder bracket, the back of the suction nozzle mounting plate is connected on the guide rail in a vertical sliding way, the upper part of the suction nozzle mounting plate is connected with a telescopic rod of the material suction cylinder, the suction nozzle is fixed below the suction nozzle mounting plate, and can move up and down along the guide rail along with the suction nozzle mounting plate, and the suction nozzle is connected with the vacuum generator through a pipeline. The suction nozzle, the material suction cylinder and the guide rail can be a group or a plurality of groups and are arranged according to actual needs.

Further, in order to realize the accurate positioning of through-hole on the PCB board, visual positioning mechanism has been adopted, and is concrete, visual positioning mechanism includes camera mounting panel, camera, light source and light source mounting panel, the camera is located the light source directly over, just the camera passes through the camera mounting panel to be fixed on the installation piece of the execution end of abaculus material manipulator, the light source passes through the light source mounting panel to be fixed on the installation piece of the execution end of abaculus material manipulator. In this scheme, camera mounting panel and light source mounting panel are connected respectively in the both sides of installation piece, and the light source mounting panel is L shape, are convenient for hang the light source under the camera.

Because the angle of the ceramic chip on the suction nozzle is uncertain after the suction nozzle absorbs the ceramic chip and is not necessarily consistent with the length and width direction of the through hole, in order to accurately place the ceramic chip in the through hole, the ceramic chip embedding device further comprises an angle confirming mechanism arranged below the embedding platform, the angle confirming mechanism comprises an upper fixing block, a lower fixing block, a supporting rod, a light source fixing block, a camera fixing block, a light source adapter plate, a camera and a camera adapter plate, the upper end and the lower end of the supporting rod are respectively and fixedly connected on the embedding platform through the upper fixing block and the lower fixing block, the light source fixing block and the camera fixing block are respectively fixed on the supporting rod between the upper fixing block and the lower fixing block, the light source fixing block is positioned above the camera fixing block, the light source is connected on the light source fixing block through the light source adapter plate, the camera is connected on the camera fixing block through the camera adapter plate, and the camera is positioned right below the light source, and the shooting direction is upward. After the suction nozzle on the sucking disc drop feed mechanism adsorbs the potsherd, remove the camera top of angle confirmation mechanism earlier, shoot potsherd length and width direction through the camera to the length and width direction of the through-hole of shooting with the visual positioning mechanism of subsequence matches, rotates certain angle through the execution end of embedment manipulator, makes placing in the through-hole that the potsherd can be accurate.

Further, in order to facilitate the placement and loading of the ceramic wafer, at least one side of the ceramic wafer debonding and film tearing mechanism and the ceramic wafer visual embedding mechanism is provided with an adsorption type discharging table, the adsorption type discharging table comprises an adsorption bottom plate, an adsorption upper plate and a backlight source, the adsorption bottom plate is fixed on the debonding platform and/or the embedding platform, the upper surface of the adsorption bottom plate is provided with a plurality of concentric annular air grooves, the adsorption upper plate is fixed on the adsorption bottom plate and provided with adsorption air holes, the adsorption air holes are communicated with the annular air grooves and used for adsorbing a ceramic wafer tray placed on the adsorption upper plate, and the surface of the ceramic wafer tray is also provided with adsorption air holes for adsorbing and removing the ceramic wafer of the adhesive film; the small ceramic wafer after slicing is directly placed on the ceramic wafer tray due to the small size, and the gap between the adjacent small ceramic wafers is not easy to identify, so that the ceramic wafer tray is of a transparent structure, and the backlight source is arranged below the ceramic wafer tray and used for illuminating the bottom of the ceramic wafer tray. The ceramic plates are illuminated from the lower side of the ceramic plate tray through the backlight source, and light rays can penetrate through the cut gaps between the adjacent small ceramic plates, so that the camera can distinguish and determine the positions of the small ceramic plates conveniently.

Furthermore, the ceramic wafer may be cracked after being cut, so that in order to remove waste materials on the adsorption type discharging platform, at least one side of the embedding platform and the glue dissolving platform is provided with a waste material box, and the waste material box is used for placing unqualified ceramic wafers.

The invention has the beneficial effects that: the automatic assembling machine for the embedded ceramic wafer can realize quick glue-releasing and tearing-off of a glue film, improves the working efficiency and meets the requirements of an automatic production line; the size of the hole in the identification plate that adopts visual identification's mode can be accurate to improve the accuracy of placing the potsherd, and trunked into the manipulator blowing by artifical blowing, improved automation level and production efficiency.

Drawings

The invention is further illustrated by the following figures and examples.

Fig. 1 is a schematic structural view of a ceramic chip sliced raw material.

Fig. 2 is a schematic structural view of a PCB board.

FIG. 3 is a schematic top view of the automatic ceramic wafer mounting apparatus of the present invention.

Fig. 4 is a schematic perspective view of a ceramic wafer debonding and film tearing mechanism.

Fig. 5 is a schematic top view of the ceramic wafer debonding and film tearing mechanism.

Fig. 6 is a schematic structural diagram of the film tearing mechanism.

FIG. 7 is a schematic diagram of a film tearing process of the film tearing mechanism.

FIG. 8 is a schematic view of the feed suction cup mechanism.

Fig. 9 is a schematic structural diagram of a single silo.

Fig. 10 is a schematic structural diagram of a double-bin arrangement of large-size ceramic wafer slices.

Fig. 11 is a schematic structural diagram of small-sized ceramic wafer slices placed in a double bunker.

Fig. 12 is a schematic perspective view of the ceramic chip visual embedding mechanism of the present invention.

Fig. 13 is a schematic top view of the structure of fig. 12.

Figure 14 is a schematic view of a panel robot.

Fig. 15 is a schematic structural view of a suction cup discharging mechanism.

Fig. 16 is a schematic structural view of the visual positioning mechanism.

Fig. 17 is a schematic structural view of the angle confirmation mechanism.

Fig. 18 is a schematic structural view of the adsorption type discharge table.

In the figure: 1. the device comprises ceramic chip slices, 1a, a glue film, 1b, a ceramic chip, 1c, a film tearing notch, 2, a ceramic chip dispergation and film tearing mechanism, 2-2 a dispergation platform, 2-21 a ground foot, 2-22 a universal caster, 2-24 a box body, 2-3 a dispergation mechanism, 2-4 a film tearing mechanism, 2-41 a vertical plate, 2-42 a film tearing cylinder, 2-43 a clamping piece, 2-44 a glue film clamping part, 2-5 a electric cabinet, 2-6 a feeding sucker mechanism, 2-61 a switching plate, 2-62 a Y-shaped plate, 2-63 a gas pipe connector, 2-64 a sucker connecting column, 2-65 a sucker, 2-66 a gas channel, 2-67 a rotary cylinder, 2-68 a cylinder connecting column, 2-7, 2-71 parts of a bin, 2-72 parts of a bin base, 2-72 parts of a positioning column, 2-73 parts of an adjusting plate, 2-74 parts of a guide chute, 2-75 parts of a guide strip, 2-76 parts of a connecting hole, 2-77 parts of a waist-shaped through hole, 2-8 parts of a waste box, 2-9 parts of a feeding manipulator; 3. ceramic chip visual embedding mechanism 3-1, embedding platform 3-2, embedding manipulator 3-21, execution end 3-22, mounting block 3-23, mounting seat 3-3, objective table 3-6, sucker discharging mechanism 3-61, cylinder guide rail mounting plate 3-62, suction nozzle mounting plate 3-63, suction nozzle 3-64, guide rail 3-65, suction cylinder 3-66, cylinder support 3-7, visual positioning mechanism 3-71, camera mounting plate 3-72, camera 3-73, light source 3-74, light source mounting plate 3-8, waste box 3-9, angle confirmation mechanism 3-91, upper fixing block 3-92, lower fixing block 3-93, 3-94 parts of supporting rod, 3-94 parts of light source fixing block, 3-95 parts of camera fixing block, 3-96 parts of light source, 3-97 parts of light source adapter plate, 3-98 parts of camera, 3-99 parts of camera adapter plate; 4. PCB board, 41, through hole; 5. the adsorption type discharging table comprises an adsorption type discharging table 51, a ceramic wafer tray 52, an adsorption upper plate 53, an adsorption bottom plate 54, adsorption air holes 55, an annular air groove 6, a substrate alternate material changing mechanism, a PCB feeding station 7 and a substrate stacking mechanism 8.

Detailed Description

The present invention will now be described in detail with reference to the accompanying drawings. This figure is a simplified schematic diagram, and merely illustrates the basic structure of the present invention in a schematic manner, and therefore it shows only the constitution related to the present invention.

As shown in fig. 3, the automatic ceramic chip mounting assembly machine of the present invention comprises a ceramic chip glue-releasing and film-tearing mechanism 2, a ceramic chip visual mounting mechanism 3, a substrate alternate material-changing mechanism 6 and a substrate lamination mechanism 8, which are sequentially arranged along the process, wherein the ceramic chip glue-releasing and film-tearing mechanism 2 is used for glue-releasing and tearing-off of a back adhesive film 1a of a ceramic chip slice 1, and is used for feeding and supplying materials to the ceramic chip visual mounting mechanism 3; the ceramic chip visual embedding mechanism 3 is used for embedding the ceramic chip 1b, from which the adhesive film 1a is removed by the ceramic chip glue-removing and film-tearing mechanism 2, into the through hole 41 of the PCB 4 to realize the embedding of the ceramic chip 1 b; the substrate alternate reloading mechanism 6 is used for moving the PCB 4 subjected to ceramic chip 1b embedding from the ceramic chip visual embedding mechanism 3 to a PCB loading station 7, and simultaneously moving the PCB 4 not subjected to ceramic chip 1b embedding from the PCB loading station 7 to the ceramic chip visual embedding mechanism 3; and the substrate stacking mechanism 8 is used for stacking the PCB 4 subjected to ceramic chip 1b embedding on the feeding station together to realize blanking of the PCB 4.

According to the processing procedure of the ceramic chip 1b of the PCB 4, aiming at the processes of removing the adhesive film 1a and placing the ceramic chip 1b, the invention designs the specific structures of the ceramic chip debonding and film tearing mechanism 2 and the ceramic chip visual embedding mechanism 3 emphatically, so that the embedding of the adhesive film 1a and the ceramic chip 1b is removed, the specific structures of other mechanisms are not the innovation point of the invention, the ceramic chip debonding and film tearing mechanism 2 and the ceramic chip visual embedding mechanism 3 can be realized by adopting the prior art, and the detailed description is omitted here, and the specific structures of the ceramic chip debonding and film tearing mechanism 2 and the ceramic chip visual embedding mechanism 3 are described in detail below.

Fig. 4-11 are schematic diagrams showing the related structure of the ceramic wafer debonding and film tearing mechanism 2. The ceramic wafer debonding and film tearing mechanism 2 is shown in fig. 4 and 5 and comprises a debonding platform 2-2, wherein the debonding platform 2-2 is provided with a debonding mechanism 2-3, a film tearing mechanism 2-4, a feeding manipulator and a bin for placing ceramic wafer slices 1, and the debonding mechanism 2-3 is used for enabling a glue film 1a on the back of a ceramic wafer 1b to lose stickiness; the film tearing mechanism 2-4 is used for tearing the adhesive film 1a losing viscosity from the ceramic sheet 1 b; the bin is positioned on the side surface of the feeding mechanical arm and used for placing the ceramic chip slices 1; the execution end of the feeding manipulator is connected with a feeding sucker mechanism for adsorbing the circulation of the ceramic chip slices 1 among different stations.

The glue dissolving platform 2-2 comprises a box body 2-24 and a support used for supporting and fixing the box body 2-24, the glue dissolving mechanism 2-3, the film tearing mechanism 2-4, the adsorption type discharging platform 5, the feeding manipulator 2-9 and the storage bin are all arranged at the top of the box body 2-24, the electric cabinet 2-5 is arranged on the side face of the box body 2-24, the film tearing mechanism 2-4, the adsorption type discharging platform 5 and the feeding manipulator 2-9 are all arranged inside the box body 2-24, universal casters 2-22 are arranged at four corners of the bottom of the box body 2-24, and feet 2-21 are arranged at four corners of the support.

The glue dissolving mechanism 2-3 comprises a glue dissolving lamp, a lamp box and a lamp controller, the glue dissolving lamp is installed in the lamp box in a plurality of parallel modes, the lamp box is fixed on the glue dissolving platform 2-2, the upper surface of the lamp box is of a light-transmitting structure, and the lamp controller is arranged on the glue dissolving platform 2-2 and is connected with the glue dissolving lamp through a circuit and used for controlling the working state of the glue dissolving lamp. The light of the corresponding glue-releasing lamps of the glue films 1a made of different materials is not necessarily the same, such as: the adhesive film 1a on the back of the ceramic sheet 1b is a UV adhesive film, so that the UV adhesive film debonding lamp generally adopts an ultraviolet lamp, the UV adhesive film can lose viscosity by irradiation of ultraviolet rays, and although a certain viscosity exists between the UV adhesive film debonding lamp and the ceramic sheet slice 1, the adhesive film 1a can be easily torn off by external force.

As shown in FIG. 6, in order to remove the adhesive film 1a, the invention designs a film tearing mechanism 2-4 by simulating manual film tearing, wherein the film tearing mechanism 2-4 is positioned at one side of a film stripping mechanism 2-3 and comprises a vertical plate 2-41, a clamping piece 2-43 and a film tearing cylinder 2-42, the bottom of the vertical plate 2-41 is fixed on a film stripping platform 2-2, the clamping piece 2-43 is fixed at the top of the vertical plate 2-41, one end of the clamping piece 2-43 extends outwards to form an adhesive film clamping part 2-44, the film tearing cylinder 2-42 is fixed below the adhesive film clamping part 2-44, and a push rod of the film tearing cylinder 2-42 is opposite to the adhesive film clamping part 2-44.

As shown in fig. 7, the hollow arrows in the figure indicate the change of the film tearing state, and the small arrows indicate the moving direction of the ceramic chip slice 1. When the film is torn, the ceramic chip slice 1 moves along the arrow a direction to be close to the film tearing mechanism 2-4, so that the adhesive film 1a at the film tearing notch 1c of the ceramic chip slice 1 moves to the position below the adhesive film clamping part 2-44 and is positioned between the adhesive film clamping part 2-44 and the push rod of the film tearing cylinder 2-42, and the adhesive film 1a at the film tearing notch 1c of the ceramic chip slice 1 is clamped between the push rod and the adhesive film clamping part 2-44 through the upward movement of the push rod of the film tearing cylinder 2-42, thereby simulating the process of pinching the adhesive film 1a by fingers; in order to avoid collision between the ceramic wafer 1b and the adhesive film clamping parts 2-44 of the clamping pieces 2-43, the ceramic wafer slice 1 is lifted upwards along the arrow b direction, then the ceramic wafer slice 1 is moved transversely along the arrow c direction, the adhesive film 1a at the bottom of the ceramic wafer slice 1 is torn off, and then the ceramic wafer 1b with the adhesive film 1a torn off is placed on the adsorption type discharging table 5.

As shown in fig. 8, the feeding sucker mechanism 2-6 comprises a rotary cylinder 2-67, the cylinder body of the rotary cylinder 2-67 is transversely connected to the execution end of the feeding manipulator 2-9 through a cylinder connection column 2-68, the swing end of the rotary cylinder 2-67 can swing in a vertical plane in a rotary manner, the swing end is fixedly connected with a transfer plate 2-61, the upper surface and the lower surface of the transfer plate 2-61 are respectively provided with a group of sucker components, each group of sucker components comprises a sucker 2-65, a Y-shaped plate 2-62 and a sucker connection column 2-64, the Y-shaped plate 2-62 is fixedly connected to the surface of the transfer plate 2-61, three branches of the Y-shaped plate 2-62 are respectively connected with a sucker connection column 2-64, and the suckers 2-65 are fixed at the top of the sucker connection column 2-64, the suction cup 2-65 is fixed on the adapter plate 2-61 through a suction cup connecting column 2-64 and a Y-shaped plate 2-62, the suction cup connecting column 2-64 is a stud, a nut is arranged on the suction cup connecting column, the upper end and the lower end of the suction cup connecting column are locked through the nut, a gas pipe connector 2-63 is arranged on the back of the suction cup 2-65, and the gas pipe connector 2-63 is communicated with a gas passage 2-66 in the front of the suction cup 2-65.

A group of sucker components are arranged on the upper surface and the lower surface of the adapter plate 2-61, so that the two ceramic chip slices 1 can be adsorbed simultaneously, the working efficiency can be improved, and the rotation cylinders 2-67 can be adopted to meet the requirement of alternation of the upper sucker component and the lower sucker component.

As shown in fig. 9-11, the bin 2-7 may be a single bin or a double bin, and specifically includes a bin base 2-71, at least one adjusting plate 2-73, and a plurality of positioning pillars 2-72, the bottom of the bin base 2-71 is fixed on the dispergation platform 2-2, the upper surface of the bin base 2-71 is enclosed by the adjusting plate 2-73 and the plurality of positioning pillars 2-72 to form a rectangular material cavity with an open side, and the opening of the rectangular material cavity faces the feeding manipulator 2-9; at least one side surface of the rectangular material cavity is formed by positioning columns 2-72, and at least one side surface of the rectangular material cavity is formed by adjusting plates 2-73; the adjusting plate 2-73 can move on the upper surface of the stock bin base 2-71 to adjust the opening size of the rectangular material cavity. In the embodiment, each rectangular material cavity is provided with an adjusting plate 2-73 and two groups of positioning columns 2-72 which are enclosed along three sides of the rectangular material cavity. The bin base 2-71 is provided with a guide chute 2-74 vertical to the plane where the adjusting plate 2-73 is located, the bottom of the adjusting plate 2-73 is provided with a guide strip 2-75 matched with the guide chute 2-74, and the guide strip 2-75 is embedded into the guide chute 2-74; when the adjusting plates 2-73 move, the guiding is carried out, so that the shape of the rectangular bin 2-7 is convenient to maintain, and the positioning and material storage of the ceramic chip slices 1 can be better realized. Two sides of the guide chute 2-74 of the bin base 2-71 are respectively provided with a row of connecting holes 2-76, the bottom surface of the adjusting plate 2-73 is provided with a kidney-shaped through hole 2-77, the kidney-shaped through hole 2-77 is aligned with the connecting holes 2-76 up and down, and the adjusting plate 2-73 is fixedly connected on the bin base 2-71 through screws arranged in the kidney-shaped through hole 2-77 and the connecting holes 2-76. The positions of the adjusting plates 2-73 can be conveniently adjusted according to the sizes of the ceramic chip slices 1 through the connecting holes 2-76, and the positions of the adjusting plates 2-73 can be finely adjusted through the waist-shaped through holes 2-77, so that the ceramic chip slices 1 of different sizes can be placed in the same bin 2-7.

In the embodiment, four storage bins 2-7 are arranged, two feeding manipulators 2-9 are arranged on each side, one storage bin is a single storage bin, a rectangular material cavity is formed in a storage bin base 2-71, and the single storage bin is obliquely arranged; the other is a double-bin, and two rectangular material cavities are arranged on the same bin base 2-71.

Fig. 12-17 are schematic diagrams of the related structure of the ceramic chip visual embedding mechanism 3. In order to realize the embedding of the ceramic chip 1b into the through hole 41 of the PCB 4, the ceramic chip visual embedding mechanism 3 comprises an embedding platform 3-1, and at least one embedding manipulator 3-2 is arranged on the embedding platform 3-1, in this embodiment, the number of the embedding manipulators 3-2 is two, and the two embedding manipulators are symmetrically fixed on two sides of the embedding platform 3-1 through a mounting seat 3-23 respectively. An object stage 3-3 is arranged in a working area below the embedding manipulator 3-2, a PCB 4 is placed on the object stage 3-3, a plurality of through holes 41 for placing ceramic plates 1b are formed in the PCB 4, a visual positioning mechanism 3-7 and a sucker discharging mechanism 3-6 are arranged on an execution end 3-21 of the embedding manipulator 3-2, the execution end 3-21 can axially rotate in a vertical plane, a cuboid mounting block 3-22 is arranged at the end part of the execution end 3-21 for connecting with other mechanisms, and different mechanisms can be connected to the execution end 3-21 of the embedding manipulator 3-2 through different side surfaces of the mounting block 3-22; the visual positioning mechanism 3-7 is used for identifying the position of each through hole 41 on the PCB 4, and the sucker discharging mechanism 3-6 is used for placing the ceramic chip 1b adsorbed on the sucker discharging mechanism 3-6 in the through hole 41 according to the position of the through hole 41 determined by the visual positioning mechanism 3-7; in order to accurately place the ceramic plate 1b in the through hole 41, an angle confirmation mechanism 3-9 is arranged below the embedding platform 3-1, and the angle confirmation mechanism 3-9 is used for confirming the angle of the ceramic plate 1b adsorbed on the sucker discharging mechanism 3-6.

As shown in fig. 14 and 15, the suction cup discharging mechanism 3-6 comprises a cylinder guide rail mounting plate 3-61, a suction nozzle mounting plate 3-62, a suction nozzle 3-63, a guide rail 3-64 and a suction cylinder 3-65, wherein the rear of the cylinder guide rail mounting plate 3-61 is fixed on a mounting block 3-22 of an execution end 3-21 of the panel manipulator 3-2, the suction cylinder 3-65 is fixed above the front of the cylinder guide rail mounting plate 3-61 through a cylinder bracket 3-66, the guide rail 3-64 is fixed on the cylinder guide rail mounting plate 3-61 below the cylinder bracket 3-66, the rear of the suction nozzle mounting plate 3-62 is connected on the guide rail 3-64 in a vertical sliding manner, and the upper part of the suction nozzle mounting plate 3-62 is connected with a telescopic rod of the suction cylinder 3-65, the suction nozzle 3-63 is fixed below the suction nozzle mounting plate 3-62 and can move up and down along the guide rail 3-64 along with the suction nozzle mounting plate 3-62, and the suction nozzle 3-63 is connected with the vacuum generator through a pipeline. The suction nozzles 3-63, the material suction cylinders 3-65 and the guide rails 3-64 can be one group or multiple groups and are arranged according to actual needs, in the embodiment, the suction nozzles 3-63, the material suction cylinders 3-65 and the guide rails 3-64 are divided into three groups and are arranged in front of the cylinder guide rail mounting plates 3-61 in parallel, and the multiple groups can suck a plurality of ceramic plates 1b at each time so as to improve the placing efficiency of the ceramic plates 1 b.

As shown in fig. 14 and 16, the visual positioning mechanism 3-7 includes a camera mounting plate 3-71, a camera 3-72, a light source 3-73 and a light source mounting plate 3-74, the camera 3-72 is positioned directly above the light source 3-73, the camera 3-72 is fixed on the mounting block 3-22 of the execution end 3-21 of the slug manipulator 3-2 through the camera mounting plate 3-71, and the light source 3-73 is fixed on the mounting block 3-22 of the execution end 3-21 of the slug manipulator 3-2 through the light source mounting plate 3-74. In this embodiment, the camera mounting plates 3-71 and the light source mounting plates 3-74 are respectively connected to two sides of the mounting blocks 3-22, and the light source mounting plates 3-74 are L-shaped, so that the light sources 3-73 can be suspended right below the cameras 3-72.

As shown in fig. 17, in this embodiment, in order to match with the inserting manipulator 3-2, the angle confirmation mechanisms 3-9 are two sets, and are respectively disposed below the inserting platform 3-1 between the two side absorption type material placing tables 5, each angle confirmation mechanism 3-9 includes an upper fixing block 3-91, a lower fixing block 3-92, a support rod 3-93, a light source fixing block 3-94, a camera fixing block 3-95, a light source 3-96, a light source adapter plate 3-97, a camera 3-98, and a camera adapter plate 3-99, upper and lower ends of the support rod 3-93 are respectively fixedly connected to the inserting platform 3-1 through the upper fixing block 3-91 and the lower fixing block 3-92, and the light source fixing block 3-94 and the camera fixing block 3-95 are respectively fixed to the support rod 3-93 between the upper fixing block 3-91 and the lower fixing block 3-92 The light source fixing block 3-94 is located above the camera fixing block 3-95, the light source 3-96 is connected to the light source fixing block 3-94 through the light source adapter plate 3-97, the camera 3-98 is connected to the camera fixing block 3-95 through the camera adapter plate 3-99, the camera 3-98 is located right below the light source 3-96, the shooting direction is upward, and the embedding material platform 3-1 is provided with a notch for shooting the angle of the ceramic chip 1b from bottom to top by the camera 3-98.

In order to realize feeding of the ceramic wafer 1b of the visual embedding mechanism and facilitate placement of the ceramic wafer 1b, at least one side of the ceramic wafer glue-releasing and film-tearing mechanism 2 and the ceramic wafer visual embedding mechanism 3 is provided with an adsorption type discharging table 5, the adsorption type discharging table 5 needs to be close to the ceramic wafer 1b visual embedding mechanism, so that grabbing of an embedding manipulator in an embedding process is facilitated, a plurality of glue-releasing platforms 2-2 can be arranged, and then a plurality of embedding platforms are arranged, so that ceramic wafers 1b with different sizes can be conveniently placed. The ceramic chip 1b may be cracked after being cut, so that in order to remove waste materials on the adsorption type discharging table 5, a waste material box 2-8 is arranged beside each adsorption type discharging table 5 on the glue dissolving platform 2-2, and a waste material box 3-8 is also arranged beside each group of adsorption type discharging tables 5 of the embedding platform 3-1 and is used for placing unqualified ceramic chips.

In the embodiment, the number of the adsorption type discharging tables 5 is six, wherein two adsorption type discharging tables 5 are placed on the dispergation platform and are respectively arranged on two sides of the dispergation mechanism 2-3; four material embedding platforms are arranged on each side, and two material embedding platforms are arranged on each side and respectively correspond to one material embedding mechanical arm. Every inlays material manipulator and supplies manipulator and all matches three absorption formula blowing platform 5 and can realize placing ceramic wafer tray in turn, also can realize placing the ceramic wafer 1b of different sizes to the continuous operation of manipulator is convenient for.

As shown in fig. 18, the adsorption type discharging table 5 includes an adsorption bottom plate 53, an adsorption upper plate 52 and a backlight source (not shown in the figure), the adsorption bottom plate 53 is fixed on the embedding platform 3-1, the upper surface of the adsorption bottom plate 53 is provided with a plurality of concentric annular air grooves 55, the adsorption upper plate 52 is fixed on the adsorption bottom plate 53, the adsorption upper plate 52 is provided with adsorption air holes 54, the adsorption air holes 54 are communicated with the annular air grooves 55 and used for adsorbing the ceramic wafer tray 51 placed on the adsorption upper plate 52, and the surface of the ceramic wafer tray 51 is also provided with adsorption air holes 54 for adsorbing and removing the ceramic wafer 1b of the adhesive film 1 a; the ceramic wafer tray 51 is of a transparent structure, and the backlight source is arranged below the ceramic wafer tray 51 and used for illuminating the bottom of the ceramic wafer tray 51, so that the ceramic wafer tray is convenient to identify.

The working process is as follows:

a feeding manipulator 2-9 adsorbs a ceramic wafer slice 1 with a glue film 1a in a storage bin, and the ceramic wafer slice is placed on a glue-releasing mechanism 2-3 of a glue-releasing platform for glue-releasing, so that the glue film 1a on the back of a ceramic wafer 1b loses viscosity and is convenient to tear; after the glue is released, the feeding mechanical arm 2-9 adsorbs the ceramic wafer slice 1 to the position 2-4 of the film tearing mechanism, and the adhesive film 1a is torn off; then the feeding mechanical arm 2-9 places the ceramic chip slice 1 with the adhesive film 1a removed in the ceramic chip tray 51 of the adsorption type discharging table 5; the ceramic chip 1b is absorbed by the embedding manipulator 3-2 through the suction nozzle 3-63, the ceramic chip is firstly moved to the position above the camera 3-98 of the angle confirming mechanism 3-9, the angle of the ceramic chip 1b in the length and width directions is shot through the camera 3-98, and the angle information is sent to a controller of the whole machine. Then, the embedding manipulator 3-2 carries the ceramic plate 1b to move to the position above the PCB 4, then the camera 3-72 on the embedding manipulator 3-2 shoots the position of the through hole 41 on the PCB 4, and the position information is sent to the controller of the whole machine. The whole machine controller matches the angle information of the ceramic chip 1b shot by the camera 3-98 with the angle in the length and width directions of the through hole 41 shot by the camera 3-72 of the visual positioning mechanism 3-7, and the ceramic chip 1b direction is aligned with the through hole 41 direction by rotating the execution end 3-21 of the embedding manipulator 3-2 by a certain angle; the controller controls the embedding manipulator 3-2 to drive the suction nozzle 3-63 to move to the position above the corresponding through hole 41, then the suction nozzle 3-2 is driven to descend to the position above the through hole 41, the suction nozzle mounting plate 3-62 is pushed downwards through the suction cylinder 3-65, the suction nozzle 3-63 is driven to place the ceramic chip 1b in the corresponding through hole 41, and one-time discharging is completed; the material embedding manipulators 3-2 at the two sides can alternately discharge materials and can also discharge materials simultaneously so as to improve the efficiency; the through holes 41 are positioned in a visual identification mode, the positioning precision is improved, and the through holes 41 with different sizes can be identified so as to place the ceramic plates 1b with proper sizes.

In light of the foregoing description of preferred embodiments in accordance with the invention, it is to be understood that numerous changes and modifications may be made by those skilled in the art without departing from the scope of the invention. The technical scope of the present invention is not limited to the contents of the specification, and must be determined according to the scope of the claims.

Claims

1. The utility model provides an automatic kludge of potsherd inlays which characterized in that: the ceramic wafer adhesive removing and film tearing mechanism is used for removing adhesive from and tearing off an adhesive film on the back surface of a ceramic wafer slice, and feeding and supplying materials to the ceramic wafer visual embedding mechanism;

2. The automatic assembling machine for ceramic chip inlays of claim 1, wherein: the ceramic wafer debonding and film tearing mechanism comprises a debonding platform, the debonding platform is provided with a debonding mechanism, a film tearing mechanism, a feeding manipulator and a storage bin for placing the ceramic wafer, and the debonding mechanism is used for enabling a glue film on the back of the ceramic wafer to lose viscosity; the film tearing mechanism is used for tearing the adhesive film which loses viscosity from the ceramic sheet; the bin is positioned on the side surface of the feeding mechanical arm and used for placing ceramic chip slices; the execution end of the feeding manipulator is connected with a feeding sucker mechanism and is used for adsorbing the circulation of ceramic chip slices among different stations;

potsherd vision insertion mechanism includes the insertion platform, set up at least one insertion manipulator on the insertion platform, set up the objective table in the work area of insertion manipulator below, place the PCB board on the objective table, be equipped with a plurality of through-holes of placing the potsherd on the PCB board, be provided with vision positioning mechanism and sucking disc drop feed mechanism on the execution end of insertion manipulator, vision positioning mechanism is used for discerning the position of every through-hole on the PCB board, sucking disc drop feed mechanism will adsorb the potsherd on sucking disc drop feed mechanism according to the position of the through-hole that vision positioning mechanism confirmed and place in the through-hole.

3. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: the mechanism of debonding is including debonding lamp, lamp house and lamp controller, the debonding lamp is a plurality of parallel installations in the lamp house, the lamp house is fixed on the debonding platform, and the upper surface of lamp house is light-transmitting structure, the lamp controller sets up on the debonding platform and glues the debonding lamp line connection with the UV for the operating condition of the control UV glue debonding lamp.

4. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: the film tearing mechanism is located on one side of the film separating mechanism and comprises a vertical plate, a clamping piece and a film tearing cylinder, the bottom of the vertical plate is fixed on the film separating platform, the clamping piece is fixed on the top of the vertical plate, one end of the clamping piece extends outwards to form a film clamping portion, the film tearing cylinder is fixed below the film clamping portion, and a push rod of the film tearing cylinder is opposite to the film clamping portion.

5. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: the feed sucking disc mechanism includes revolving cylinder, revolving cylinder's cylinder body passes through cylinder spliced pole transverse connection and serves at the execution of feed manipulator, revolving cylinder's swing end can be in vertical plane gyration swing, and swings and serve fixed connection keysets, the upper and lower two sides of keysets are equipped with a set of sucking disc subassembly respectively, every group the sucking disc subassembly all includes sucking disc, Y shaped plate and sucking disc spliced pole, Y shaped plate fixed connection is on the surface of keysets, and connects a sucking disc spliced pole on the three branch of Y shaped plate respectively, just the top at the sucking disc spliced pole is fixed to the sucking disc, the back of sucking disc is equipped with the trachea joint, just the trachea joint communicates with the positive air flue of sucking disc.

6. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: the device comprises at least one storage bin, a glue dissolving platform, a plurality of positioning columns and a plurality of glue dissolving devices, wherein the bottom of the storage bin base is fixed on the glue dissolving platform, the upper surface of the storage bin base is enclosed by the adjusting plate and the plurality of positioning columns into a rectangular material cavity with an opening on one side, and the opening of the rectangular material cavity faces to a feeding manipulator; at least one side surface of the rectangular material cavity is formed by a positioning column, and at least one side surface of the rectangular material cavity is formed by an adjusting plate; the adjusting plate can move on the upper surface of the stock bin base to adjust the size of the opening of the rectangular stock cavity;

the bin base is provided with a guide sliding groove perpendicular to the plane of the adjusting plate, the bottom of the adjusting plate is provided with a guide strip matched with the guide sliding groove, and the guide strip is embedded into the guide sliding groove;

the two sides of the guide sliding groove of the bin base are respectively provided with a row of connecting holes, the bottom surface of the adjusting plate is provided with a waist-shaped through hole, the waist-shaped through hole is aligned with the connecting holes up and down, and the adjusting plate is connected and fixed on the bin base through screws arranged in the waist-shaped through hole and the connecting holes.

7. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: the sucking disc drop feed mechanism comprises an air cylinder guide rail mounting plate, a suction nozzle, a guide rail and a suction cylinder, wherein the air cylinder guide rail mounting plate is fixed on a mounting block of an execution end of the embedding manipulator at the back, the suction cylinder is fixed above the front of the air cylinder guide rail mounting plate through an air cylinder support, the guide rail is fixed on the air cylinder guide rail mounting plate below the air cylinder support, the suction nozzle mounting plate is connected to the guide rail in a vertical sliding mode at the back, the top of the suction nozzle mounting plate is connected with a telescopic rod of the suction cylinder, the suction nozzle is fixed below the suction nozzle mounting plate and can move up and down along with the suction nozzle mounting plate along the guide rail, and the suction nozzle is connected with a vacuum generator through a pipeline.

8. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: the vision positioning mechanism comprises a camera mounting plate, a camera, a light source and a light source mounting plate, wherein the camera is positioned right above the light source, the camera is fixed on an installation block of an execution end of the material embedding manipulator through the camera mounting plate, and the light source is fixed on the installation block of the execution end of the material embedding manipulator through the light source mounting plate.

9. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: still including setting up the angle confirmation mechanism in the below of panel platform, angle confirmation mechanism includes fixed block, lower fixed block, bracing piece, light source fixed block, camera fixed block, light source keysets, camera and camera keysets, and both ends are respectively through last fixed block and fixed block fixed connection down on the panel platform about the bracing piece, light source fixed block and camera fixed block are fixed respectively on last fixed block and the bracing piece between the fixed block down, and the light source fixed block is located the top of camera fixed block, the light source passes through the light source keysets to be connected on the light source fixed block, the camera passes through the camera keysets to be connected on the camera fixed block, and the camera is located the light source under, and shoots the direction up.

10. The automatic assembling machine for ceramic chip inlays of claim 2, wherein: the ceramic chip debonding and film tearing mechanism and/or the ceramic chip visual embedding mechanism further comprises at least one adsorption type discharging table, the adsorption type discharging table comprises an adsorption bottom plate, an adsorption upper plate and a backlight source, the adsorption bottom plate is fixed on the debonding platform and/or the embedding platform, the upper surface of the adsorption bottom plate is provided with a plurality of concentric annular air grooves, the adsorption upper plate is fixed on the adsorption bottom plate, the adsorption upper plate is provided with adsorption air holes, the adsorption air holes are communicated with the annular air grooves and used for adsorbing a ceramic chip tray placed on the adsorption upper plate, and the surface of the ceramic chip tray is also provided with adsorption air holes used for adsorbing and removing a glue film of the ceramic chip; the ceramic wafer tray is of a transparent structure, and the backlight source is arranged below the ceramic wafer tray and used for illuminating the bottom of the ceramic wafer tray.