CN113523910A - Hole groove machining method for tungsten-copper composite board and tungsten-copper composite board - Google Patents
Hole groove machining method for tungsten-copper composite board and tungsten-copper composite board Download PDFInfo
- Publication number
- CN113523910A CN113523910A CN202110693029.2A CN202110693029A CN113523910A CN 113523910 A CN113523910 A CN 113523910A CN 202110693029 A CN202110693029 A CN 202110693029A CN 113523910 A CN113523910 A CN 113523910A
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- China
- Prior art keywords
- tungsten
- copper composite
- composite plate
- processing
- hole
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23H—WORKING OF METAL BY THE ACTION OF A HIGH CONCENTRATION OF ELECTRIC CURRENT ON A WORKPIECE USING AN ELECTRODE WHICH TAKES THE PLACE OF A TOOL; SUCH WORKING COMBINED WITH OTHER FORMS OF WORKING OF METAL
- B23H1/00—Electrical discharge machining, i.e. removing metal with a series of rapidly recurring electrical discharges between an electrode and a workpiece in the presence of a fluid dielectric
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
- B28D1/18—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by milling, e.g. channelling by means of milling tools
Abstract
The invention discloses a hole and groove processing method of a tungsten-copper composite plate and the tungsten-copper composite plate, wherein the hole and groove processing method comprises the steps of utilizing a graphite electrode to perform electric spark processing and the like; the tungsten-copper composite plate is formed with the hole groove by the hole groove processing method. The method has the advantages of short processing time and high production efficiency, can realize the hole slot processing of the tungsten-copper composite plate, ensures the stability of the installation of the temperature sensor, and leads the monitoring of the divertor to be more stable and reliable.
Description
Technical Field
The invention relates to the technical field of nuclear fusion device manufacturing, in particular to a hole and groove processing method of a tungsten-copper composite plate and the tungsten-copper composite plate.
Background
The divertor functions to remove heat flow, particle flow and helium ash from fusion plasma in the thermal nuclear reactor, and effectively shield impurities from the walls, reducing contamination of the central plasma. The expected steady-state heat flux of the target plate surface of the divertor is 10 MW/m2And when abnormal working conditions such as plasma rupture occur, the divertorThe divertor is subjected to a more severe thermal load, and the target plate position of the divertor is a W/Cu/CuCrZr tubular structure (Mono-block).
During installation, the tungsten-copper composite board with the blind holes and the grooves is needed to be used for installing the temperature sensor and monitoring the state of the divertor.
Because tungsten in the tungsten-copper composite plate is a high-hardness material, a PCD (synthetic diamond) or CBN (cubic boron nitride) cutter is required; the copper in the tungsten-copper composite plate is soft in material, a tool without a hard alloy coating needs to be used, and the requirement difference of the two materials for the tool is too large, so that the conventional milling method is difficult to process holes and grooves.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a tungsten-copper composite plate hole and groove processing method capable of realizing tungsten-copper composite plate hole and groove processing.
The invention also provides a tungsten-copper composite plate processed by the method for processing the hole and the groove of the tungsten-copper composite plate.
A hole and groove processing method of a tungsten-copper composite plate comprises the following steps:
(1) grinding the tungsten-copper composite plate: grinding the tungsten-copper composite plate to the surface roughness Ra0.8 mu m by using a ceramic bond green silicon carbide grinding wheel on a surface grinding machine;
(2) preparing a graphite electrode: processing a graphite electrode on a high-speed vertical processing center by using a PCD end mill;
(3) carrying out electric spark machining by using a graphite electrode: and processing the hole groove on the tungsten-copper composite plate by using a graphite electrode on a high-power electric spark forming machine.
The tungsten-copper composite plate is processed by the hole and groove processing method of the tungsten-copper composite plate, and the hole and groove are formed by the hole and groove processing method.
The method has the advantages of short processing time and high production efficiency, can realize the hole slot processing of the tungsten-copper composite plate, ensures the stability of the installation of the temperature sensor, and leads the monitoring of the divertor to be more stable and reliable.
Detailed Description
The following detailed description of the preferred embodiments of the present invention is provided to enable those skilled in the art to more readily understand the advantages and features of the present invention and to clearly and unequivocally define the scope of the present invention.
The invention provides a hole and groove processing method of a tungsten-copper composite plate, which comprises the following steps:
(1) grinding the tungsten-copper composite plate: grinding the tungsten-copper composite plate to the surface roughness Ra0.8 mu m by using a ceramic bond green silicon carbide grinding wheel on a surface grinding machine; the technological parameters are that the linear velocity of the grinding wheel is 25m/s, the feeding velocity of the worktable is 10m/min, and the grinding depth is 8 mu m;
(the purpose of grinding is to flatten the surface of the tungsten-copper composite plate, the adopted green silicon carbide grinding wheel has better grinding effect on tungsten and copper, and the grinding effect is good and the safety is higher when the green silicon carbide grinding wheel is matched with transformer oil as grinding fluid);
(2) preparing a graphite electrode: processing a graphite electrode on a high-speed vertical processing center by using a PCD (polycrystalline diamond) end mill with the diameter of 6 mm; the technological parameters are the rotating speed of a main shaft 25000rpm, the linear speed of a cutter 471m/s, the feeding speed of a workbench 4.5m/min, the cutting width 0.35mm and the cutting depth 0.25 mm;
(3) carrying out electric spark machining by using a graphite electrode: processing a hole groove (a temperature sensor mounting hole and a wire embedding groove) on the tungsten-copper composite plate on a high-power electric spark forming machine by using a graphite electrode; the process parameters are peak current 120A, pulse width 100 mus and pulse interval 480 mus;
(when the graphite electrode is used for processing tungsten, the electrode loss is large, the electrode needs to be repaired frequently, and the condition that the cutter is replaced frequently can be avoided by adopting PCD)
(4) Cleaning and drying: cleaning the workpiece by using ultrasonic waves and drying;
(5) sealing: packaging into sealed plastic bag, and charging nitrogen gas for protection.
The tungsten-copper composite plate is processed by the hole and groove processing method of the tungsten-copper composite plate, and the hole and groove are formed by the hole and groove processing method.
The above description is only a preferred embodiment of the present invention, and the protection scope of the present invention is not limited to the above embodiments, and all technical solutions belonging to the idea of the present invention belong to the protection scope of the present invention. It should be noted that modifications and embellishments within the scope of the invention may occur to those skilled in the art without departing from the principle of the invention, and are considered to be within the scope of the invention.
Claims (5)
1. A hole and groove processing method of a tungsten-copper composite plate is characterized by comprising the following steps: the method comprises the following steps:
grinding the tungsten-copper composite plate: grinding the tungsten-copper composite plate to the surface roughness Ra0.8 mu m by using a ceramic bond green silicon carbide grinding wheel on a surface grinding machine;
preparing a graphite electrode: processing a graphite electrode on a high-speed vertical processing center by using a PCD end mill;
carrying out electric spark machining by using a graphite electrode: and processing the hole groove on the tungsten-copper composite plate by using a graphite electrode on a high-power electric spark forming machine.
2. The method for processing the hole slot of the tungsten-copper composite plate according to claim 1, wherein the method comprises the following steps: in the step (1), the process parameters are that the linear speed of the grinding wheel is 25m/s, the feeding speed of the worktable is 10m/min, and the grinding depth is 8 mu m.
3. The method for processing the hole slot of the tungsten-copper composite plate according to claim 1, wherein the method comprises the following steps: in the step (2), the technological parameters are the rotating speed of the main shaft 25000rpm, the linear speed of the cutter 471m/s, the feeding speed of the workbench 4.5m/min, the cutting width 0.35mm and the cutting depth 0.25 mm.
4. The method for processing the hole slot of the tungsten-copper composite plate according to claim 1, wherein the method comprises the following steps: in the step (3), the process parameter is peak current 120A, the pulse width is 100 μ s, and the pulse interval is 480 μ s.
5. A tungsten-copper composite plate using the hole slot machining method of any one of claims 1 to 4, characterized in that: a tungsten-copper composite plate for forming a hole groove by the hole groove processing method according to claims 1 to 4.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110693029.2A CN113523910A (en) | 2021-06-22 | 2021-06-22 | Hole groove machining method for tungsten-copper composite board and tungsten-copper composite board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110693029.2A CN113523910A (en) | 2021-06-22 | 2021-06-22 | Hole groove machining method for tungsten-copper composite board and tungsten-copper composite board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113523910A true CN113523910A (en) | 2021-10-22 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110693029.2A Pending CN113523910A (en) | 2021-06-22 | 2021-06-22 | Hole groove machining method for tungsten-copper composite board and tungsten-copper composite board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113523910A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0441264A2 (en) * | 1990-02-03 | 1991-08-14 | Olaf Fischer | Spark erosion electrode and method for manufacturing such an electrode |
| US20040195296A1 (en) * | 2003-04-02 | 2004-10-07 | Bertram Schedler | Composite component for fusion reactors |
| CN1559734A (en) * | 2004-03-10 | 2005-01-05 | 温州洁瓴不锈钢制品有限公司 | Processing method machining surface pattern of mould cavity |
| CN103302367A (en) * | 2013-03-19 | 2013-09-18 | 北京航星机器制造有限公司 | Electrical discharge machining (EDM) shaping method for external spiral structure |
| CN104588620A (en) * | 2014-12-26 | 2015-05-06 | 天龙钨钼（天津）有限公司 | Manufacturing method for tungsten copper mold blocks |
| CN104874876A (en) * | 2015-05-25 | 2015-09-02 | 北京控制工程研究所 | Tool electrode machining technology and method for machining micro hole through tool electrode |
| CN104999143A (en) * | 2015-07-22 | 2015-10-28 | 江苏扬碟钻石工具有限公司 | Electric spark grinding tool for PCD piece |
| CN206550454U (en) * | 2017-02-17 | 2017-10-13 | 青岛宝拓精密模具有限公司 | A kind of electrical spark working tool and mould |
-
2021
- 2021-06-22 CN CN202110693029.2A patent/CN113523910A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0441264A2 (en) * | 1990-02-03 | 1991-08-14 | Olaf Fischer | Spark erosion electrode and method for manufacturing such an electrode |
| US20040195296A1 (en) * | 2003-04-02 | 2004-10-07 | Bertram Schedler | Composite component for fusion reactors |
| CN1559734A (en) * | 2004-03-10 | 2005-01-05 | 温州洁瓴不锈钢制品有限公司 | Processing method machining surface pattern of mould cavity |
| CN103302367A (en) * | 2013-03-19 | 2013-09-18 | 北京航星机器制造有限公司 | Electrical discharge machining (EDM) shaping method for external spiral structure |
| CN104588620A (en) * | 2014-12-26 | 2015-05-06 | 天龙钨钼（天津）有限公司 | Manufacturing method for tungsten copper mold blocks |
| CN104874876A (en) * | 2015-05-25 | 2015-09-02 | 北京控制工程研究所 | Tool electrode machining technology and method for machining micro hole through tool electrode |
| CN104999143A (en) * | 2015-07-22 | 2015-10-28 | 江苏扬碟钻石工具有限公司 | Electric spark grinding tool for PCD piece |
| CN206550454U (en) * | 2017-02-17 | 2017-10-13 | 青岛宝拓精密模具有限公司 | A kind of electrical spark working tool and mould |
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