CN113517234A - Ceramic shell, ceramic packaging structure and microsystem - Google Patents
Ceramic shell, ceramic packaging structure and microsystem Download PDFInfo
- Publication number
- CN113517234A CN113517234A CN202110790150.7A CN202110790150A CN113517234A CN 113517234 A CN113517234 A CN 113517234A CN 202110790150 A CN202110790150 A CN 202110790150A CN 113517234 A CN113517234 A CN 113517234A
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- Prior art keywords
- ceramic
- ceramic shell
- packaging area
- area
- chip
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- Pending
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- 239000000919 ceramic Substances 0.000 title claims abstract description 51
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 35
- 229910000833 kovar Inorganic materials 0.000 claims abstract description 13
- 238000005538 encapsulation Methods 0.000 claims abstract description 11
- 238000004021 metal welding Methods 0.000 claims abstract description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 238000007789 sealing Methods 0.000 claims description 6
- 230000017525 heat dissipation Effects 0.000 abstract description 12
- 230000010354 integration Effects 0.000 abstract description 7
- 230000009286 beneficial effect Effects 0.000 abstract description 3
- 230000000694 effects Effects 0.000 description 4
- 238000003466 welding Methods 0.000 description 3
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 230000004888 barrier function Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/04—Containers; Seals characterised by the shape of the container or parts, e.g. caps, walls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/16—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
Abstract
The invention provides a ceramic shell, a ceramic packaging structure and a micro-system. The ceramic shell comprises a ceramic shell body, the ceramic shell body is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an air-tight packaging area and a non-air-tight packaging area, the non-air-tight packaging area is provided with a circular inverted bonding pad, and the second surface is provided with an air-tight packaging area and a lead; the gas tightness encapsulation district is enclosed by kovar metal welding ring and closes and forms, and is equipped with chip mounting area and/or components and parts installing zone in the gas tightness encapsulation district, the chip mounting area is for the multilayer cavity structure who is used for installing bonding class chip. The ceramic shell can be provided with various devices and chips on the first surface and the second surface, the air tightness requirement of a common bonding chip can be ensured through the air tightness packaging area, the flip chip can be arranged in the non-air tightness packaging area, the heat dissipation requirement of the flip chip with high power consumption can be met, and the ceramic shell is beneficial to realizing miniaturization and high integration.
Description
Technical Field
The invention belongs to the technical field of integrated circuit packaging, and particularly relates to a ceramic shell, a ceramic packaging structure and a micro-system.
Background
With the continuous improvement of the integration level of the microsystem, the requirements on the number of the packaging cores, the power consumption and the packaging form of the chips are more and more diversified, and how to simultaneously realize the miniaturization, the high integration, the air tightness and the good heat dissipation performance of the product becomes more and more prominent problems. At present, the types of components and parts which can be installed on the traditional ceramic shell are few, the packaging integration level is low, and the requirements of miniaturization and high integration level are not met. Moreover, the traditional ceramic shell can not simultaneously realize the requirements of bonding chip air tightness packaging and high-power flip chip heat dissipation.
Disclosure of Invention
An object of the present invention is to provide a ceramic case capable of achieving airtightness and good heat dissipation performance.
The invention also aims to provide a ceramic packaging structure with the ceramic shell.
It is still another object of the present invention to provide a microsystem having the ceramic package structure.
In order to achieve the purpose, the invention adopts the technical scheme that:
providing a ceramic shell, which comprises a ceramic shell, wherein the ceramic shell is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an airtight packaging area and a non-airtight packaging area, the non-airtight packaging area is provided with a circular inverted bonding pad, and the second surface is provided with an airtight packaging area and a lead; the gas tightness encapsulation district is enclosed by kovar metal welding ring and closes and forms, and is equipped with chip mounting area and/or components and parts installing zone in the gas tightness encapsulation district, the chip mounting area is for the multilayer cavity structure who is used for installing bonding class chip.
In some embodiments, the pads of the component mounting area are square pads.
In some embodiments, the lead is made of kovar.
In some embodiments, the non-hermetic sealing region is gold plated to a thickness of 0.03-0.3 μm and the hermetic sealing region is gold plated to a thickness of 1.3-5.7 μm.
The invention also provides a ceramic packaging structure which comprises the ceramic shell and a parallel welding seam cover plate welded with the kovar metal welding ring.
The invention also provides a micro-system comprising the ceramic packaging structure.
The ceramic shell has the beneficial effects that: compared with the prior art, the ceramic shell can be provided with various devices and chips on the first surface and the second surface, the air tightness requirement of a common bonding chip can be ensured through the air tightness packaging area, the flip chip can be arranged on the non-air tightness packaging area, the heat sink can be attached to the upper surface of the flip chip to increase the upward heat dissipation channel to improve the heat dissipation effect, the heat dissipation requirement of the flip chip with high power consumption can be met, and the miniaturization and high integration are facilitated.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.
Fig. 1 is a schematic front view of a ceramic housing according to an embodiment of the present invention;
FIG. 2 is a schematic top view of the ceramic housing shown in FIG. 1;
FIG. 3 is a schematic bottom view of the ceramic shell shown in FIG. 1
Fig. 4 is a schematic diagram of the ceramic case of fig. 1 after components are mounted and packaged.
In the figure: 1. a ceramic housing; 2. a first surface; 3. a second surface; 4. an air-tight packaging region; 41. a chip mounting area; 42. a component mounting area; 5. a non-hermetic package region; 6. a lead wire; 7. a Kovar metal welding ring; 8. a parallel weld joint cover plate; 9. flip chip mounting; 10. a heat sink.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the detailed description and specific examples, while indicating the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
As shown in fig. 1 to 4, the embodiment of the invention discloses a ceramic shell, which comprises a ceramic shell 1, wherein the ceramic shell 1 is provided with a first surface 2 and a second surface 3 which are oppositely arranged. In actual use, the second surface 3 is a surface facing the PCB, and the first surface 2 is a surface facing away from the PCB. When the PCB is horizontally placed and the device made of the ceramic case is mounted above the PCB, the first surface 2 is the upper surface of the ceramic case 1, and the second surface 3 is the lower surface of the ceramic case 1.
On the first surface 2 there is provided a gas-tight encapsulation area 4 and a non-gas-tight encapsulation area 5, on which non-gas-tight encapsulation area 5 there is provided a circular flip-chip pad. At the second surface 3 there is provided a gastight package region 4 and leads 6. The lead is made of Kovar (Kovar). This gas tightness encapsulation district 4 is enclosed by kovar metal welding ring 7 and closes and forms, and kovar metal welding ring 7 welds the back with parallel welding seam apron 8, can form the good closed cavity of gas tightness, satisfies the gas tightness encapsulation requirement of bonding class chip. A plurality of chip mounting regions 41 are provided in the hermetic package region 4, and these chip mounting regions 41 are a multilayer cavity structure for mounting a bonding-type chip. The non-air-tight packaging region 5 can be used for mounting a flip chip 9 with high power consumption, and a heat sink 10 can be attached to the upper surface of the flip chip 9 to increase an upward heat dissipation channel, so that the heat dissipation effect is further improved. The heat sink material can be aluminum silicon carbide or aluminum silicon and other materials with small density and high heat conductivity coefficient commonly used for electronic devices. The hermetically sealed region 4 and the non-hermetically sealed region 5 and the leads 6 are interconnected by internal multilayer wiring.
In addition to the chip mounting area 41, a plurality of component mounting areas 42 may be provided in the hermetic package area 4, and the pads of the component mounting areas 42 are square pads and may be used to mount components such as capacitors, resistors, inductors, and the like.
In this embodiment, the non-hermetic sealing region 5 is plated with gold with a thickness of 0.03-0.3 μm and the hermetic sealing region is plated with gold with a thickness of 1.3-5.7 μm. During gold plating, a local plating mode is adopted, gold is firstly plated on the non-airtight packaging area 5, then a method of coating a barrier layer is adopted to protect the plated part, and then the rest parts are electroplated.
The ceramic shell of the embodiment of the invention can be provided with various devices and chips on the first surface 2 and the second surface 3, can ensure the air tightness requirement of a common bonding chip through the air tightness packaging area 4, can be provided with the flip chip in the non-air tightness packaging area 5, and can be provided with the heat sink 10 on the upper surface of the flip chip 9 in an attaching way to increase an upward heat dissipation channel, thereby further improving the heat dissipation effect, meeting the heat dissipation requirement of the flip chip with large power consumption and being beneficial to realizing miniaturization and high integration.
The embodiment of the invention also discloses a ceramic packaging structure which comprises the ceramic shell and a parallel welding seam cover plate 8 welded with the kovar metal welding ring 7.
The embodiment of the invention also discloses a micro-system which comprises the ceramic packaging structure.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (6)
1. A ceramic shell comprises a ceramic shell body and is characterized in that the ceramic shell body is provided with a first surface and a second surface which are oppositely arranged, the first surface is provided with an airtight packaging area and a non-airtight packaging area, the non-airtight packaging area is provided with a circular inverted bonding pad, and the second surface is provided with an airtight packaging area and a lead; the gas tightness encapsulation district is enclosed by kovar metal welding ring and closes and forms, and is equipped with chip mounting area and/or components and parts installing zone in the gas tightness encapsulation district, the chip mounting area is for the multilayer cavity structure who is used for installing bonding class chip.
2. The ceramic package of claim 1, wherein the pads of the component mounting area are square pads.
3. The ceramic package of claim 1, wherein the lead is kovar.
4. The ceramic package of claim 1, wherein the non-hermetic sealing region is gold plated to a thickness of 0.03-0.3 μm and the hermetic sealing region is gold plated to a thickness of 1.3-5.7 μm.
5. A ceramic package structure comprising the ceramic shell of any one of claims 1 to 4, and further comprising a parallel seam cover plate welded to the Kovar ring.
6. A microsystem comprising the ceramic package structure of claim 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110790150.7A CN113517234A (en) | 2021-07-13 | 2021-07-13 | Ceramic shell, ceramic packaging structure and microsystem |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110790150.7A CN113517234A (en) | 2021-07-13 | 2021-07-13 | Ceramic shell, ceramic packaging structure and microsystem |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113517234A true CN113517234A (en) | 2021-10-19 |
Family
ID=78067659
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110790150.7A Pending CN113517234A (en) | 2021-07-13 | 2021-07-13 | Ceramic shell, ceramic packaging structure and microsystem |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113517234A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114323818A (en) * | 2021-11-17 | 2022-04-12 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Method for sampling internal atmosphere of ceramic airtight component and application |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5498900A (en) * | 1993-12-22 | 1996-03-12 | Honeywell Inc. | Semiconductor package with weldable ceramic lid |
| CN109411370A (en) * | 2018-09-20 | 2019-03-01 | 西安空间无线电技术研究所 | A kind of the HTCC system-in-package structure and packaging method of upside-down mounting welding core |
| CN111128925A (en) * | 2019-12-27 | 2020-05-08 | 中国电子科技集团公司第十三研究所 | Packaging structure and packaging method of digital circuit |
| US20210202346A1 (en) * | 2019-12-27 | 2021-07-01 | The 13Th Research Institute Of China Electronics Technology Group Corporation | Packaging structure and packaging method of digital circuit |
-
2021
- 2021-07-13 CN CN202110790150.7A patent/CN113517234A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5498900A (en) * | 1993-12-22 | 1996-03-12 | Honeywell Inc. | Semiconductor package with weldable ceramic lid |
| CN109411370A (en) * | 2018-09-20 | 2019-03-01 | 西安空间无线电技术研究所 | A kind of the HTCC system-in-package structure and packaging method of upside-down mounting welding core |
| CN111128925A (en) * | 2019-12-27 | 2020-05-08 | 中国电子科技集团公司第十三研究所 | Packaging structure and packaging method of digital circuit |
| US20210202346A1 (en) * | 2019-12-27 | 2021-07-01 | The 13Th Research Institute Of China Electronics Technology Group Corporation | Packaging structure and packaging method of digital circuit |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114323818A (en) * | 2021-11-17 | 2022-04-12 | 中国电子产品可靠性与环境试验研究所（（工业和信息化部电子第五研究所）（中国赛宝实验室）） | Method for sampling internal atmosphere of ceramic airtight component and application |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20211019 |
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| RJ01 | Rejection of invention patent application after publication |