CN113512752A

CN113512752A - Electroplating clamp for compound semiconductor microwave chip

Info

Publication number: CN113512752A
Application number: CN202110498141.0A
Authority: CN
Inventors: 王静辉; 崔健; 黎荣林; 段磊; 郭跃伟
Original assignee: Bowei Integrated Circuits Co ltd
Current assignee: Bowei Integrated Circuits Co ltd
Priority date: 2021-05-08
Filing date: 2021-05-08
Publication date: 2021-10-19

Abstract

The invention discloses an electroplating clamp for a compound semiconductor microwave chip, and relates to the technical field of electroplating. The utility model provides a be used for compound semiconductor microwave chip electroplating jig, includes the bottom plate, bottom plate top both sides are provided with elevating gear, elevating gear one side fixedly connected with connecting rod, connecting rod bottom fixedly connected with horizontal pole, the horizontal pole middle part is provided with anchor clamps, anchor clamps include spacing frame, spacing frame both ends inner wall swing joint has the effect pole, effect pole one end fixedly connected with splint, reset spring one end fixed connection is in splint one side. According to the invention, through the arrangement of the limiting piece and the clamp, the chip can be immersed into the electrolyte through the lifting device, and when the electroplating is carried out, such as additives or conductive materials such as copper and the like are added into the hole, the limiting frame is limited by the limiting rod, so that the height of the limiting frame is kept stable, and the error is reduced.

Description

Electroplating clamp for compound semiconductor microwave chip

Technical Field

The invention relates to the technical field of electroplating, in particular to an electroplating clamp for a compound semiconductor microwave chip.

Background

The traditional through hole plating realizes through hole filling of silicon by an electroplating method, the electroplating method has the advantages of cost and simple process when used for filling through holes, but for through holes with larger depth-to-width ratio, defect-free filling in the through holes is not easy, and the main problems are as follows: the electric line at the orifice is concentrated; there is a difference in the metal ion concentration at the orifice and via bottom. Therefore, during the electroplating process, conductive materials such as copper are difficult to deposit on the bottom, which easily results in premature sealing of the via hole and causes defects in the via hole.

The 5G microwave chip is the most important thing in the current chip development trade, 5G microwave chip needs to have high integration compared with traditional chip, be equivalent to increase more communication antennas in inside, each technological requirement of chip all has improved to some extent, the through-hole electroplating of traditional chip is not being applicable to 5G microwave chip, because the through-hole diameter that is used for on the 5G microwave chip is littleer, the accuracy is higher, no matter through-hole electroplating is spraying additive or access conducting material, because the through-hole diameter is minimum, slight deviation can lead to the flaw of chip, so in through-hole electroplating process, the chip needs to keep high stability, for this reason, the invention provides a novel solution.

Disclosure of Invention

The invention aims to provide a compound semiconductor microwave chip electroplating clamp to solve the problems in the background technology.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a be used for compound semiconductor microwave chip electroplating jig, includes the bottom plate, bottom plate top both sides are provided with elevating gear, elevating gear one side fixedly connected with connecting rod, connecting rod bottom fixedly connected with horizontal pole, the horizontal pole middle part is provided with anchor clamps, anchor clamps include spacing frame, spacing frame both ends inner wall swing joint has the action bars, action bars one end fixedly connected with splint, reset spring has been cup jointed on the action bars surface, reset spring one end fixed connection is in splint one side, the spacing groove has been seted up to the splint opposite side.

Preferably, the equal fixedly connected with dwang in middle part of spacing frame both ends, one of them dwang one end swing joint is in horizontal pole middle part one side, the opposite side the dwang other end is provided with first motor, first motor fixed connection is in horizontal pole one side.

Preferably, the surface of the cross rod is movably connected with a limiting piece, the limiting piece comprises sliding blocks, every two limiting rods are fixedly connected between the sliding blocks, the inner walls of the sliding blocks are movably connected to the surface of the cross rod, one side of each sliding block is fixedly connected with a limiting block, the middle of each limiting block is movably connected with a bidirectional threaded screw rod, one side of the cross rod is provided with a second motor, and the output end of the second motor is fixedly connected to one end of the bidirectional threaded screw rod.

Preferably, elevating gear includes the support column, the support column is provided with a plurality ofly, one of them the spout has been seted up to support column one side, swing joint has the threaded rod between spout top and the bottom, support column top fixedly connected with step motor, step motor output fixed connection is in threaded rod one end, threaded rod surface swing joint has the slider, slider one side fixed connection is in connecting rod top one side, elevating gear is connected with the horizontal pole through the connecting rod.

Preferably, one side of the cross rod on one side is fixedly connected with a fixing block. And one side of the fixed block is fixedly connected with a second motor.

Compared with the prior art, the invention has the beneficial effects that:

(1) this a be used for compound semiconductor microwave chip electroplating jig, through the setting of limiting piece and anchor clamps for the chip can be through the elevating gear chip dip in electrolyte, and when electroplating in downthehole additive or conducting material such as copper, use the gag lever post to carry out spacingly to spacing frame, lets it keep highly stable, reduces the error.

(2) The electroplating clamp for the compound semiconductor microwave chip has the advantages that the working principle is simple, the effect is good, manual assistance is basically not needed in operation, and the operation process is simple.

Drawings

FIG. 1 is a schematic diagram of the main structure of the present invention;

FIG. 2 is a schematic structural diagram of a limiting member according to the present invention;

FIG. 3 is a schematic view of the clamp of the present invention;

FIG. 4 is a schematic diagram of the right side structure of the present invention.

In the figure: 1. a base plate; 2. a lifting device; 201. a support pillar; 202. a chute; 203. a threaded rod; 204. a slider; 205. a stepping motor; 3. a connecting rod; 4. a cross bar; 5. a clamp; 501. a limiting frame; 502. an action rod; 503. a return spring; 504. a splint; 505. a limiting groove; 506. rotating the rod; 507. a first motor; 6. a limiting member; 601. a slider; 602. a limiting rod; 603. a limiting block; 604. a fixed block; 605. a bidirectional threaded screw rod; 606. a second motor.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, which are only for convenience of description and simplification of description, and do not indicate or imply that the referred device or element must have a specific orientation, be configured in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

Further, it will be appreciated that the dimensions of the various elements shown in the figures are not drawn to scale, for ease of description, and that the thickness or width of some layers may be exaggerated relative to other layers, for example.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus, once an item is defined or illustrated in one figure, it will not need to be further discussed or illustrated in detail in the description of the following figure.

As shown in fig. 1 to 4, the present invention provides a technical solution: an electroplating clamp for compound semiconductor microwave chips comprises a bottom plate 1, wherein lifting devices 2 are arranged on two sides of the top of the bottom plate 1 and used for adjusting the height of a clamp 5, a plating solution groove is arranged below the electroplating clamp and can be used for conveniently carrying out plating solution electrolysis work on microwave chips, a connecting rod 3 is fixedly connected to one side of each lifting device 2, a cross rod 4 is fixedly connected to the bottom of the connecting rod 3, a clamp 5 is arranged in the middle of the cross rod 4, the clamp 5 comprises a limiting frame 501, action rods 502 are movably connected to the inner walls of two ends of the limiting frame 501, a clamping plate 504 is fixedly connected to one end of each action rod 502, the action rods have elasticity under the action of the clamping plate 504 and a reset spring 503, the chip can be clamped in the middle of the clamping plate and play a limiting role, the reset spring 503 is sleeved on the surface of each action rod 502, one end of the reset spring 503 is fixedly connected to one side of the clamping plate 504, the other side of the clamping plate 504 is provided with a limiting groove 505.

Preferably, the middle parts of both ends of the limiting frame 501 are fixedly connected with rotating rods 506, one end of one of the rotating rods 506 is movably connected to one side of the middle part of the cross bar 4, the other end of the other rotating rod 506 is provided with a first motor 507, the first motor 507 is fixedly connected to one side of the cross bar 4, the surface of the cross bar 4 is movably connected with a limiting piece 6, the limiting piece 6 comprises a sliding block 601, a limiting rod 602 is fixedly connected between every two sliding blocks 601, the inner wall of the sliding block 601 is movably connected to the surface of the cross bar 4, one side of the sliding block 601 is fixedly connected with a limiting block 603, the middle part of the limiting block 603 is movably connected with a two-way threaded screw rod 605, one side of the cross bar 4 is provided with a second motor 606, the output end of the second motor 606 is fixedly connected to one end of the two-way threaded screw rod 605, and the two-way threaded screw rod 605 can enable the limiting block 603 to drive the sliding blocks 601 at both sides to move towards the middle, then, the limiting frame 501 is fixed under the action of the limiting rod 602, in the three-dimensional packaging of the semiconductor chip, a through hole is taken as an interconnection mode and is the mainstream direction of the packaging, and the corresponding through hole electroplating technology is the key of the development of the three-dimensional packaging. The traditional through hole plating method is used for realizing through hole filling of silicon, the through hole filling of the plating method has the advantage of cost, the through holes are usually in the apertures of dozens of microns, one end of the through hole is deviated or shaken to cause errors in the plating process, so the stability of the clamp is enhanced through the double limitation of a clamping plate 504 and a limiting rod 602, the lifting device 2 comprises a plurality of supporting columns 201, a sliding groove 202 is arranged on one side of one supporting column 201, a threaded rod 203 is movably connected between the top and the bottom of the sliding groove 202, a stepping motor 205 is fixedly connected to the top of the supporting column 201, the output end of the stepping motor 205 is fixedly connected to one end of the threaded rod 203, a sliding block 204 is movably connected to the surface of the threaded rod 203, one side of the sliding block 204 is fixedly connected to one side of the top of a connecting rod 3, and the lifting device 2 is connected with a cross rod 4 through the connecting rod 3, one side of the cross rod 4 at one side is fixedly connected with a fixing block 604. One side of the fixed block 604 is fixedly connected with a second motor 606, and all parts of the fixture 5 of the device are made of silicon carbide ceramic materials and can resist strong acid corrosion.

The device is a plating clamp for compound semiconductor microwave chips, usually through hole plating is the development key of three-dimensional packaging of microwave chips, the through hole on the chip is usually only 50um to 100um, the aperture is very small, in the plating process, conductive materials are difficult to precipitate at the bottom, generally an additive is required to play a role in printing and leveling, then in the process, the microwave chip must be kept in an extremely stable state, slight errors can cause incomplete filling, therefore, the device adopts a dual-stable structure, the microwave chip is placed between clamping plates 504 to achieve first re-fixation, in order to facilitate the processing and immersion plating of the microwave chip, a motor is arranged on one side of a limiting frame 501 to control the limiting frame 501 to rotate, the limiting frame 501 is limited by a rotating rod 506 and is still unstable, so a limiting piece 6 is arranged, the limiting piece 6 drives a bidirectional threaded screw rod 605 to rotate through a second motor 606, the limiting block 603 drives the limiting rod 602 to move close to the middle, and the limiting frame 501 is clamped in the middle to be fixed, so that the microwave chip can keep high stability during electroplating.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. A plating jig for compound semiconductor microwave chips, comprising a base plate (1), characterized in that: bottom plate (1) top both sides are provided with elevating gear (2), elevating gear (2) one side fixedly connected with connecting rod (3), connecting rod (3) bottom fixedly connected with horizontal pole (4), horizontal pole (4) middle part is provided with anchor clamps (5), anchor clamps (5) are including spacing frame (501), spacing frame (501) both ends inner wall swing joint has effect pole (502), effect pole (502) one end fixedly connected with splint (504), reset spring (503) have been cup jointed on effect pole (502) surface, reset spring (503) one end fixed connection is in splint (504) one side, spacing groove (505) have been seted up to splint (504) opposite side.

2. A jig for plating a compound semiconductor microwave chip according to claim 1, characterized in that: spacing frame (501) both ends middle part equal fixedly connected with dwang (506), one of them dwang (506) one end swing joint is in horizontal pole (4) middle part one side, opposite side dwang (506) other end is provided with first motor (507), first motor (507) fixed connection is in horizontal pole (4) one side.

3. A jig for plating a compound semiconductor microwave chip according to claim 1, characterized in that: the limiting device is characterized in that a limiting piece (6) is movably connected to the surface of the cross rod (4), the limiting piece (6) comprises sliding blocks (601), a limiting rod (602) is fixedly connected between every two sliding blocks (601), the inner wall of each sliding block (601) is movably connected to the surface of the cross rod (4), a limiting block (603) is fixedly connected to one side of the sliding block (601) on one side, the middle of each limiting block (603) is movably connected with a two-way threaded screw rod (605), a second motor (606) is arranged on one side of the cross rod (4), and the output end of the second motor (606) is fixedly connected to one end of the two-way threaded screw rod (605).

4. A jig for plating a compound semiconductor microwave chip according to claim 1, characterized in that: elevating gear (2) are including support column (201), support column (201) are provided with a plurality ofly, one of them spout (202) have been seted up to support column (201) one side, swing joint has threaded rod (203) between spout (202) top and the bottom, support column (201) top fixedly connected with step motor (205), step motor (205) output end fixed connection is in threaded rod (203) one end, threaded rod (203) surface swing joint has slider (204), slider (204) one side fixed connection is in connecting rod (3) top one side, elevating gear (2) are connected with horizontal pole (4) through connecting rod (3).

5. A jig for plating a compound semiconductor microwave chip according to claim 1, characterized in that: one side of the cross rod (4) at one side is fixedly connected with a fixing block (604). And one side of the fixed block (604) is fixedly connected with a second motor (606).