CN113504846A - Electronic device and manufacturing method thereof - Google Patents
Electronic device and manufacturing method thereof Download PDFInfo
- Publication number
- CN113504846A CN113504846A CN202110760840.8A CN202110760840A CN113504846A CN 113504846 A CN113504846 A CN 113504846A CN 202110760840 A CN202110760840 A CN 202110760840A CN 113504846 A CN113504846 A CN 113504846A
- Authority
- CN
- China
- Prior art keywords
- lead
- leads
- redundant
- region
- electronic device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 14
- 239000002346 layers by function Substances 0.000 claims abstract description 56
- 239000010410 layer Substances 0.000 claims abstract description 33
- 239000000758 substrate Substances 0.000 claims abstract description 8
- 238000000034 method Methods 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 23
- 230000000694 effects Effects 0.000 abstract description 4
- 230000002950 deficient Effects 0.000 description 3
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2203/00—Indexing scheme relating to G06F3/00 - G06F3/048
- G06F2203/041—Indexing scheme relating to G06F3/041 - G06F3/045
- G06F2203/04103—Manufacturing, i.e. details related to manufacturing processes specially suited for touch sensitive devices
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Electroluminescent Light Sources (AREA)
- Wire Bonding (AREA)
Abstract
The electronic device comprises a substrate at least provided with a first surface, and a first functional layer, an insulating layer and a second functional layer which are sequentially formed on the first surface, wherein the first surface comprises a functional region and a lead region which is adjacent to and surrounds the functional region. The lead wire area comprises a plurality of first lead wires and a plurality of second lead wires, each first lead wire is positioned in the first functional layer, and one end of each first lead wire is connected with the first electrode; each second lead is located on the second functional layer, and one end of each second lead is connected with the second electrode. The first redundant lead wires with different lengths are added to the different second lead wires through adjustment, so that the resistance of the second lead wires tends to be consistent, the technical problem that the resistance difference between the lead wires with different lengths in the electronic device is large is effectively solved, the signal consistency of the electronic device is improved, and the use experience effect of a user is improved.
Description
Technical Field
The present application relates to electronic devices, and more particularly, to an electronic device and a method for manufacturing the same.
Background
Currently, in the design of leads at the periphery of the functional area of an electronic device, the width of the leads is generally uniform. However, since one end of the lead is connected to the functional electrode of the functional area, the other end of the lead is connected to the driving control circuit (driving IC), and the functional area is provided with a plurality of functional electrodes, and the distances between the plurality of functional electrodes and the driving control circuit are different, so that the lengths of the plurality of leads are not the same, and in a large-sized electronic device, the length difference between the leads is large, so that the resistance difference is also large, which easily causes the consistency of the functional signals of the electronic device to be poor, for example, the electronic device may be a display screen, a touch screen, a backlight module, or the like, and in the display screen or the touch screen, the consistency of the display performance or the touch performance is poor due to the resistance difference between the leads.
Also, in a small-sized electronic device, there is the same problem of functional signal uniformity, differing only in that in a small-sized electronic device, the functional signal uniformity difference is not noticeable in a large-sized electronic device.
In order to solve the problem of functional signal consistency, a solution is proposed, as shown in fig. 1, which is a schematic plan view of an existing electronic device, and an electronic device 10 includes a functional region 11 and a lead region 13 adjacent to and surrounding the functional region 11. The functional region 11 includes a plurality of first electrodes 21 and a plurality of second electrodes 23, the plurality of first electrodes 21 are disposed on a first functional layer, the plurality of second electrodes 23 are disposed on a second functional layer above the first functional layer, and the plurality of first electrodes 21 and the plurality of second electrodes 23 are separated by an insulating layer. The lead region 13 includes a plurality of first leads 31 and a plurality of second leads 33, each of the first leads 31 is located in the first functional layer, one end of each of the first leads is connected to one of the first electrodes 21, and the other end of each of the first leads is connected to another electronic device (not shown); each of the second leads 33 is located in the second functional layer, one end of each of the second leads is connected to one of the second electrodes 23, and the other end of each of the second leads is connected to another electronic device (not shown), and the distances between the different first leads 31 and the electronic devices are not greatly different from each other, so that the consistency of functional signals is not affected. Different second lead wire 33 and electron device distance greatly differ, so will increase the linewidth width of the second lead wire 33 far away from electron device among the prior art to satisfy signal uniformity demand, however increase the linewidth of second lead wire 33 and be unfavorable for narrow frame design, the linewidth increases simultaneously, after covering BM printing ink, second lead wire 33 seal of a government organization in old china can also be obviously seen to naked eye, and visual effect is relatively poor.
Disclosure of Invention
The present application is directed to an electronic device and a method for manufacturing the same, including but not limited to solving the technical problem of large difference in resistance between leads of different lengths in the electronic device.
In order to solve the above technical problem, the present application provides an electronic device, including a substrate having at least a first surface, and a first functional layer, an insulating layer, and a second functional layer sequentially formed on the first surface, wherein the first surface includes a functional region and a lead region adjacent to and surrounding the functional region. The functional region comprises a plurality of first electrodes and a plurality of second electrodes, wherein the plurality of first electrodes are all positioned on the first functional layer, the plurality of second electrodes are all positioned on the second functional layer above the first functional layer, and the plurality of first electrodes and the plurality of second electrodes are separated by insulating layers. The lead wire area comprises a plurality of first lead wires and a plurality of second lead wires, each first lead wire is positioned in the first functional layer, one end of each first lead wire is connected with the first electrode, and the other end of each first lead wire is connected with other electronic devices; each second lead is positioned on the second functional layer, one end of each second lead is connected with one second electrode, and the other end of each second lead is connected with other electronic devices.
The electronic device is different from the conventional electronic device in that the lengths of the plurality of second leads are different, the electronic device is provided with an opening on the insulating layer of the lead area, at least one opening is positioned in the projection area of the second lead with the longest length on the insulating layer, and the opening is internally provided with a bonding element.
In the electronic device, the first functional layer of the lead wire area is provided with the first redundant lead wire, at least one first redundant lead wire and the second lead wire with the longest length are provided with a projection overlapping area on the first surface, and the first redundant lead wire and the second lead wire with the longest length are electrically conducted through the lapping piece. The second leads are lapped through the first redundant leads, so that functional signal difference between the second electrode connected with the longest second lead and the second electrodes of other second leads can be relieved.
In an alternative scheme, a plurality of first redundant leads are arranged on the first functional layer of the lead area, the opening is located in a projection area of the plurality of second leads on the insulating layer 18, and a lap joint is arranged in the opening. Each first redundant lead and one second lead are respectively provided with a projection overlapping area on the first surface and are electrically conducted through the lapping piece. The first redundant leads corresponding to the second leads with different lengths have the following length relationship: the longer the second lead length, the longer the length of the corresponding first redundant lead needed to compensate for the second lead.
In an alternative scheme, in order to prevent the plurality of second leads and the plurality of first redundant leads from being attached insecurely due to overlarge contact area of a single lapping surface, falling off is easy to generate, and thus, defective products are generated. In this embodiment, a plurality of openings are formed in the insulating layer, and a plurality of bonding members are formed in the openings, each of the first redundant leads and one of the second leads being connected by a plurality of bonding members, and the bonding members are integrally formed with the first redundant leads and the second leads.
In a specific manufacturing process, the first lead and the first redundant lead are manufactured firstly, namely the first redundant lead and the first lead can be manufactured at one time, then the insulating layer with the opening is manufactured, and then the lap joint part and the second lead are manufactured, namely the lap joint part and the second lead can also be manufactured and molded at one time.
In an alternative, the following relationship exists between the numbers of the openings corresponding to the second leads with different lengths: the longer the second lead length, the greater the number of corresponding openings and straps, and the greater the amount of resistance that is reduced.
The diameter length of the opening is 10um-50um,
in an optional scheme, the diameter length of the opening is 10um-50um, a plurality of bridging pieces with small diameter lengths are arranged in the opening, and the first redundant lead and the second lead can be well attached through connection of the plurality of bridging pieces.
The invention also provides a method for manufacturing the electronic device, which comprises the following steps:
s1: providing a substrate at least having a first surface, the first surface including a functional region and a lead region adjacent to and surrounding the functional region;
s2: forming a first functional layer on the first surface, wherein a plurality of first electrodes positioned in the functional region, a plurality of first leads positioned in the lead region and a plurality of first redundant leads are formed in the first functional layer, one end of each first lead is connected with one first electrode, the other end of each first lead is connected with other electronic devices, and each first redundant lead is electrically isolated from each other;
s3: forming an insulating layer on the surface of one side of the first functional layer, which is far away from the first surface, and forming an opening on the insulating layer covered by the projection of each first redundant lead;
s4: and forming a second functional layer on the surface of one side of the insulating layer, which is far away from the first surface, wherein a plurality of second electrodes positioned in a functional region and a plurality of second leads positioned in a lead region are formed in the first functional layer, one end of each second lead is connected with one second electrode, the other end of each second lead is connected with other electronic devices, when the second leads are formed, a plurality of bonding parts are formed in the plurality of openings, the projections of the plurality of second leads on the first surface are respectively superposed with the projection parts of the first redundant leads on the first surface, and the second leads are conducted with the first redundant leads through the plurality of bonding parts.
The application provides an electronic device increases the first redundant lead wire of different length for different second lead wires through the adjustment, makes the resistance of many second lead wires tend to unanimously to solved the big technical problem of resistance difference between the lead wire of different length among the electronic device effectively, improved the uniformity of electronic device signal, promoted user's use and experienced the effect.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.
Fig. 1 is a top view of a conventional electronic device;
FIG. 2 is a top view of an electronic device of the present application;
FIG. 3 is a cross-sectional view of an electronic device of the present application taken along line A-A;
FIG. 4 is a top view of a first functional layer of an electronic device of the present application;
fig. 5 is a cross-sectional view of the electronic device of the present application taken along line B-B.
Wherein, in the figures, the respective reference numerals:
10-electronic device, 11-functional region, 13-lead region, 16-first functional layer,
17-second functional layer, 18-insulating layer, 20-substrate, 20 a-first surface,
21-first electrode, 23-second electrode, 31-first lead, 33-second lead,
35-first redundant lead, 34-strap, 34 a-opening.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects to be solved by the present application clearer, the present application is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected" to another element, it can be directly or indirectly connected to the other element. When a component is referred to as being "electrically connected" to another component, it can be electrically connected by conductors, or can be electrically connected by radios, or can be connected by various other means capable of carrying electrical signals. The terms "upper", "lower", "left", "right", and the like, indicate orientations or positional relationships based on those shown in the drawings, are merely for convenience of description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the patent, and the specific meanings of the above terms will be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
It should be noted that the width of the whole or each part of the lead in the present application is a uniform structure unless it is specified that it is a completely uniform and unchanging width value; otherwise, it generally refers to the average width of the lead in the length interval of the whole or each partial segment, that is, the width of the lead partial segment in the length interval can maintain a certain differential non-uniform structure, and of course, in some embodiments, the width of the lead partial segment can also be a uniform structure which is kept completely consistent and unchanged.
The electronic devices provided in the present application are now exemplified:
the first embodiment is as follows:
referring to fig. 2-3, in the present embodiment,
fig. 2 is a schematic plan view of an electronic device according to the present invention, and fig. 3 is a sectional view taken along line a-a of fig. 2. The electronic device 10 comprises a substrate 20 having at least a first surface 20, and a first functional layer 16, an insulating layer 18 and a second functional layer 17 sequentially formed on the first surface 20a, wherein the first surface 20a comprises a functional region 11 and a lead region 13 adjacent to and surrounding the functional region 11. The functional region 11 includes a plurality of first electrodes 21 and a plurality of second electrodes 23, the plurality of first electrodes 21 are disposed on the first functional layer 16, the plurality of second electrodes 23 are disposed on the second functional layer 17 on the first functional layer 16, and the plurality of first electrodes 21 and the plurality of second electrodes 23 are separated by an insulating layer 18. The lead region 13 includes a plurality of first leads 31 and a plurality of second leads 33, each of the first leads 31 is disposed on the first functional layer 16, and has one end connected to one of the first electrodes 21 and the other end connected to other electronic devices (not shown); each of the second leads 33 is located on the second functional layer 17, and has one end connected to one of the second electrodes 23 and the other end connected to other electronic devices (not shown).
The electronic device 10 of the present invention is different from the conventional electronic device in that the electronic device 10 of the present invention has an opening 34a in the insulating layer 18 of the lead region 13, at least one of the openings 34a is located in a projection region of the second lead 33 having the longest length on the insulating layer 18, and the bonding element 34 is disposed in the opening 34 a.
Fig. 4 is a schematic plan view of the first functional layer 16 of the electronic device according to the present invention, and first redundant leads 35 are disposed on the first functional layer 16 in the lead region 13. referring to fig. 3-4, at least one of the first redundant leads 35 and the second lead 33 having the longest length have a projection overlapping region on the first surface 20a, and the first redundant lead 35 and the second lead 33 having the longest length are electrically connected through a bonding element 34. Overlapping the second leads 33 by the first redundant lead 35 may mitigate the functional signal difference between the second electrode 23 to which the longest second lead 33 is connected and the second electrodes 23 of the other second leads 33.
In an alternative scheme, a plurality of first redundant lead wires 35 are arranged on the first functional layer 16 of the lead region 13, a plurality of openings 34a are arranged on the insulating layer 18 of the lead region 13, the openings 34a are located in the projection areas of the plurality of second lead wires 33 on the insulating layer 18, and bonding elements 34 are arranged in the openings 34 a. Each of the first redundant leads 35 and one of the second leads 33 have a projected overlapping area on the first surface 20a, and are electrically connected through the bonding element 34. If the lengths of the two different second leads 33 are L1 and L2, respectively, and the lengths of the corresponding first redundant leads 35 are L1 'and L2', respectively, and if L1> L2, the length relationship of L1'/L1> L2'/L2 is formed, that is, the longer the length of the second lead 33 is, the longer the length of the corresponding first redundant lead 35 needed to compensate the second lead 33 is.
Fig. 5 is a cross-sectional view taken along line B-B of fig. 2, and as shown in fig. 5, in order to prevent the plurality of second leads 33 and the plurality of first redundant leads 35 from being weakly attached due to an excessively large contact area of a single overlapping surface, and easily coming off, thereby generating a defective product. In the present embodiment, a plurality of openings 34a are formed in the insulating layer 18, a bonding member 34 is formed in the openings 34a, each of the first redundant lead 35 and the second lead 33 is connected by the plurality of bonding members 34, and the bonding member 34 is integrally formed with the first redundant lead 35 and the second lead 33.
In a specific manufacturing process, the first lead 31 and the first redundant lead 35 are manufactured, that is, the first redundant lead 35 and the first lead 31 can be manufactured at one time, then the insulating layer 18 with the opening 34a is manufactured, and then the bonding element 34 and the second lead 33 are manufactured, that is, the bonding element 34 and the second lead 33 can also be manufactured and molded at one time. The one-step manufacturing and forming can reduce production processes and improve production efficiency.
It can be understood that each of the first redundant lead 35 and the second lead 33 is connected by a plurality of bonding members 34 to form a plurality of bonding points, so that the contact area of the first redundant lead 35 and the second lead 33 at a single bonding point is reduced, and the second lead 33 is prevented from being broken or falling off during the forming process or the using process, thereby reducing the defective rate. The bonding element 34 and the second lead 33 are integrally formed, so that the production process of the electronic device 10 is simplified, and the conductive performance and the mechanical performance between the first redundant lead 35 and the second lead 33 are improved.
The present embodiment further provides a method for manufacturing the electronic device 10, which includes the following steps:
s1: providing a substrate 20 having at least a first surface 20a, the first surface 20a including a functional region 11 and a lead region 13 adjacent to and surrounding the functional region 11;
s2: forming a first functional layer 16 on the first surface 20a, wherein a plurality of first electrodes 21 located in the functional region 11, a plurality of first leads 31 located in the lead region 13, and a plurality of first redundant leads 35 are formed in the first functional layer 16, one end of each first lead 31 is connected to one first electrode 21, the other end is connected to other electronic devices, and the first redundant leads 35 are electrically isolated from each other;
s3: forming an insulating layer 18 on a side surface of the first functional layer 16 away from the first surface 20a, and forming an opening 34a on the insulating layer 18 that is covered by the projection of each first redundant lead 35;
s4: forming a second functional layer 17 on a side surface of the insulating layer 18 away from the first surface 20a, wherein a plurality of second electrodes 23 located in the functional region 11 and a plurality of second leads 33 located in the lead region 13 are formed in the second functional layer 17, one end of each second lead 33 is connected to one of the second electrodes 23, the other end is connected to other electronic devices, when forming the second leads 33, a plurality of bonding elements 34 are formed in the plurality of openings 34a, projections of the plurality of second leads 33 on the first surface 20a are respectively overlapped with projections of the first redundant lead 35 on the first surface 20a, and the second leads 33 are connected with the first redundant lead 35 through the plurality of bonding elements 34.
In a preferred embodiment, the lengths of the first redundant leads 35 corresponding to the second leads 33 with different lengths are in a relationship that if the lengths of the two different second leads 33 are L1 and L2, the lengths of the first redundant leads 35 corresponding to the different second leads 33 are L1 'and L2', and if L1> L2, the length relationship of L1'/L1> L2'/L2 is formed, i.e. the longer the length of the second lead 33 is, the longer the length of the corresponding first redundant lead 35 needed for compensating the second lead 33 is.
The application provides an electronic device 10, through the adjustment for the first redundant lead wire of different length of second lead wire 33 increase of difference, make many second lead wire 33's resistance tend to unanimously to solved the big technical problem of resistance difference between the lead wire of different length among the electronic device effectively, improved the uniformity of electronic device signal, promoted user's use and experienced the effect. In other embodiments, if the lengths of the different first leads 31 are different, a second redundant lead may be similarly disposed on the second functional layer 17, and the first lead 31 and the second redundant lead are connected by a connecting member, so as to reduce the technical problem of large resistance difference between the first leads 31 with different lengths, and improve the signal consistency of the electronic device. That is, the foregoing is merely an example of the present application and is not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (9)
1. An electronic device comprising a substrate (20) having at least a first surface (20a) and, formed in sequence on said first surface (20a), a first functional layer (16), an insulating layer (18) and a second functional layer (17);
the first surface (20a) comprises a functional region (11) and a lead region (13) adjacent to and surrounding the functional region (11), the functional region (11) comprises a plurality of first electrodes (21) and a plurality of second electrodes (23), the plurality of first electrodes (21) are all positioned on a first functional layer (16), the plurality of second electrodes (23) are all positioned on a second functional layer (17) above the first functional layer (16), the plurality of first electrodes (21) and the plurality of second electrodes (23) are separated by an insulating layer (18), the lead region (13) comprises a plurality of first leads (31) and a plurality of second leads (33), each first lead (31) is positioned on the first functional layer (16), one end of each first lead is connected with one first electrode (21), and the other end of each first lead is connected with other electronic devices; each second lead (33) is positioned on the second functional layer (17), one end of each second lead is connected with one second electrode (23), and the other end of each second lead is connected with other electronic devices;
the high-voltage fuse is characterized in that an opening (34a) is formed in an insulating layer (18) of a lead area (13), at least one opening (34a) is located in a projection area of a second lead (33) with the longest length on the insulating layer (18), a bonding part (34) is arranged in the opening (34a), a first redundant lead (35) is arranged on a first functional layer (16) of the lead area (13), at least one first redundant lead (35) and the second lead (33) with the longest length have a projection overlapping area on a first surface (20a), and the first redundant lead (35) is electrically conducted with the second lead (33) with the longest length through the bonding part (34).
2. The electronic device as claimed in claim 1, characterized in that a plurality of first redundant leads (35) are further provided on the first functional layer (16) in the lead region (13), a plurality of openings (34a) are further provided on the insulating layer (18) in the lead region (13), the openings (34a) are located in the projection regions of the plurality of second leads (33) on the insulating layer (18), a bonding element (34) is provided in the openings (34a), each first redundant lead (35) has a projection overlap region with one second lead (33) on the first surface (20a), and is electrically connected through the bonding element (34).
3. An electronic device according to claim 2, wherein the first redundant leads (35) corresponding to the second leads (33) of different lengths have the following length relationship: the lengths of the two different second leads (33) are respectively L1 and L2, the lengths of the corresponding first redundant leads (35) are respectively L1 'and L2', and if L1> L2, the length relationship of L1'/L1> L2'/L2 is formed.
4. An electronic device according to claim 1, wherein the first redundant lead (35) is formed in one piece with the first lead (31).
5. The electronic device as set forth in claim 1, wherein the bonding element (34) and the second lead (33) are formed in one piece.
6. The electronic device of claim 1, wherein the opening (34a) has a diameter length of 10um to 50 um.
7. The electronic device according to claim 2, wherein the second leads (33) of different lengths have the following relationship between the number of openings (34a) and the number of straps (34): the longer the length of the second lead (33), the greater the number of corresponding openings (34a) and straps (34).
8. A method for manufacturing an electronic device, comprising the steps of:
s1: providing a substrate (20) having at least a first surface (20a), the first surface (20a) comprising a functional region (11) and a lead region (13) adjacent to and surrounding the functional region (11);
s2: forming a first functional layer (16) on the first surface (20a), wherein a plurality of first electrodes (21) located in the functional region (11), a plurality of first leads (31) located in the lead region (13) and a plurality of first redundant leads (35) are formed in the first functional layer (16), one end of each first lead (31) is connected with one first electrode (21), the other end of each first lead is connected with other electronic devices, and the first redundant leads (35) are electrically isolated from one another;
s3: forming an insulating layer (18) on a side surface of the first functional layer (16) away from the first surface (20a), and forming an opening (34a) on the insulating layer (18) which is projected and covered by each first redundant lead (35);
s4: forming a second functional layer (17) on the surface of the insulating layer (18) far away from the first surface (20a), wherein a plurality of second electrodes (23) positioned in a functional region (11) and a plurality of second leads (33) positioned in a lead region (13) are formed in the second functional layer (17), one end of each second lead (33) is connected with one second electrode (23), the other end of each second lead is connected with other electronic devices, when the second leads (33) are formed, a plurality of bonding elements (34) are formed in the plurality of openings (34a), projections of the plurality of second leads (33) on the first surface (20a) are respectively overlapped with projection parts of the first redundant lead (35) on the first surface (20a), and the second leads (33) are conducted with the first redundant lead (35) through the plurality of bonding elements (34).
9. The method for manufacturing an electronic device according to claim 8, wherein the first redundant leads (35) corresponding to the second leads (33) with different lengths have a length relationship, the lengths of the two different second leads (33) are L1 and L2, respectively, and the lengths of the corresponding first redundant leads (35) are L1 'and L2', respectively, so that if L1> L2, a length relationship of L1'/L1> L2'/L2 is formed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110760840.8A CN113504846B (en) | 2021-07-06 | 2021-07-06 | Electronic device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110760840.8A CN113504846B (en) | 2021-07-06 | 2021-07-06 | Electronic device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113504846A true CN113504846A (en) | 2021-10-15 |
| CN113504846B CN113504846B (en) | 2024-09-20 |
Family
ID=78011251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110760840.8A Active CN113504846B (en) | 2021-07-06 | 2021-07-06 | Electronic device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113504846B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023230898A1 (en) * | 2022-05-31 | 2023-12-07 | 京东方科技集团股份有限公司 | Touch-control display panel and touch-control display apparatus |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108073318A (en) * | 2016-11-14 | 2018-05-25 | 深圳莱宝高科技股份有限公司 | Touch panel and preparation method thereof |
| CN108153438A (en) * | 2016-12-04 | 2018-06-12 | 深圳莱宝高科技股份有限公司 | Touch panel and preparation method thereof |
| CN110794992A (en) * | 2019-11-12 | 2020-02-14 | 深圳莱宝高科技股份有限公司 | Touch screen and display device |
| CN211180782U (en) * | 2019-11-12 | 2020-08-04 | 深圳莱宝高科技股份有限公司 | Touch screen and display device |
-
2021
- 2021-07-06 CN CN202110760840.8A patent/CN113504846B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108073318A (en) * | 2016-11-14 | 2018-05-25 | 深圳莱宝高科技股份有限公司 | Touch panel and preparation method thereof |
| CN108153438A (en) * | 2016-12-04 | 2018-06-12 | 深圳莱宝高科技股份有限公司 | Touch panel and preparation method thereof |
| CN110794992A (en) * | 2019-11-12 | 2020-02-14 | 深圳莱宝高科技股份有限公司 | Touch screen and display device |
| CN211180782U (en) * | 2019-11-12 | 2020-08-04 | 深圳莱宝高科技股份有限公司 | Touch screen and display device |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023230898A1 (en) * | 2022-05-31 | 2023-12-07 | 京东方科技集团股份有限公司 | Touch-control display panel and touch-control display apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN113504846B (en) | 2024-09-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109308851B (en) | Stretchable display substrate, manufacturing method thereof and display device | |
| US11099682B2 (en) | Binding region connection structure, touch screen and display device | |
| CN113539108B (en) | Array substrate, display module and display device | |
| CN210323695U (en) | Display panel and display device | |
| KR20020029623A (en) | Cof-use tape carrier and cof-structured semiconductor device using the same | |
| JP4717604B2 (en) | Wiring substrate and semiconductor device using the same | |
| JPH0766253B2 (en) | Matrix type image display device | |
| US7379307B2 (en) | Wiring board and method for manufacturing the same, and semiconductor device | |
| CN113504846A (en) | Electronic device and manufacturing method thereof | |
| JP4071782B2 (en) | Semiconductor device | |
| CN114122009A (en) | Display panel, preparation method thereof and mobile terminal | |
| JP3648596B2 (en) | Semiconductor chip bonding structure and display device having the structure | |
| US10128588B2 (en) | Cable connecting structure | |
| US5555116A (en) | Liquid crystal display having adjacent electrode terminals set equal in length | |
| CN113871396A (en) | Display panel, chip on film, display device and manufacturing method | |
| CN115241179A (en) | Chip packaging structure | |
| CN114153330A (en) | Display module and display terminal | |
| CN111816635A (en) | Thin film flip chip packaging structure | |
| CN114242304B (en) | Conductive adhesive, manufacturing method thereof and display device | |
| WO1998015872A1 (en) | A display device and a telephone set comprising such a display device | |
| CN109686256B (en) | Display substrate, manufacturing method thereof and display panel | |
| CN114340145B (en) | Flexible circuit board and display device | |
| CN115686272A (en) | Touch display panel and electronic terminal | |
| JP3696418B2 (en) | Electrical component inspection socket | |
| CN117311530A (en) | Non-touch area conductive structure preparation method, non-touch area conductive structure and capacitive screen |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant |