CN113500312B

CN113500312B - Laser cutting machine

Info

Publication number: CN113500312B
Application number: CN202111067483.3A
Authority: CN
Inventors: 王仕初; 李奇林; 欧阳鸿
Original assignee: Shenzhen Shuangshi Technology Co Ltd
Current assignee: Shenzhen Shuangshi Technology Co Ltd
Priority date: 2021-09-13
Filing date: 2021-09-13
Publication date: 2021-11-23
Anticipated expiration: 2041-09-13
Also published as: CN113500312A

Abstract

The invention relates to the technical field of electric element manufacturing, and discloses a laser cutting machine which comprises a feeding mechanism, a transmission mechanism and a laser cutting mechanism, wherein the feeding mechanism is arranged on the feeding mechanism; the feeding mechanism comprises a fixed seat, a first mounting seat, a push rod, a first pair of roller type conveying devices and a second pair of roller type conveying devices; the first pair of roller type conveying devices comprise two first press rollers which are vertically distributed, the second pair of roller type conveying devices comprise a first rotating element and at least two second press rollers which are vertically distributed, the first press rollers and the second press rollers are both rotatably arranged on the first mounting seat, at least one second press roller is in transmission connection with the first rotating element, and push rods are respectively arranged between the two first press rollers and between the second press rollers in an extruding manner; the transmission mechanism is positioned at one end of the fixed seat far away from the pushing end; the laser cutting mechanism is in butt joint with the transmission mechanism. The laser cutting machine can prevent the push rod from damaging the circuit board, can perform full-automatic feeding, and is convenient for realizing flow line production.

Description

Laser cutting machine

Technical Field

The invention relates to the technical field of electric element manufacturing, in particular to a laser cutting machine.

Background

At present, a laser cutting technology is generally adopted for cutting a Printed Circuit Board (PCB) into chips, and because a plurality of circuits are integrated on the PCB and the chips, the requirement on the precision of PCB cutting is high. Because the PCB and the chip are very small, if the assembly line and the full-automatic production operation are realized, great difficulty exists in the transmission, the transfer and the like of the PCB, especially, the very small and thin PCB is difficult to be continuously and stably sent into the production line in the feeding step, and the PCB is very easy to be blocked in the feeding and the transmission, so that the PCB is damaged, and the full-automatic production operation is difficult to realize.

Disclosure of Invention

The invention provides a laser cutting machine, which aims to solve the technical problems that in the prior art, a PCB is difficult to feed, the PCB is easy to damage, and full-automatic production operation is difficult to realize.

In order to solve the above technical problem, an embodiment of the present invention provides a laser cutting machine, including:

the feeding mechanism comprises a fixed seat, a first mounting seat, a push rod, a first pair of roller type conveying devices and a second pair of roller type conveying devices;

the first pair of roller type conveying devices comprise two first press rollers which are vertically distributed, the second pair of roller type conveying devices comprise a first rotating element and at least two second press rollers which are vertically distributed, the first press rollers and the second press rollers are both rotatably arranged on the first mounting seat, at least one second press roller is in transmission connection with the first rotating element, the push rods are respectively arranged between the two first press rollers and between the second press rollers in an extruding mode, the fixing seats are used for placing circuit boards or material boxes, and the circuit boards or the material boxes placed on the fixing seats are located at the pushing ends of the push rods;

the transmission mechanism is positioned at one end, far away from the pushing end, of the fixed seat, so that the push rod can push the circuit board from the fixed seat to the transmission mechanism;

the laser cutting mechanism is in butt joint with the transmission mechanism and used for cutting the circuit board into the electronic component and the waste material frame.

Optionally, the number of the second compression roller is three, wherein two the second compression roller is horizontally arranged side by side, another the second compression roller is located two levels and is arranged side by side the top of the second compression roller, two levels are arranged the second compression roller is located the one side of the push rod, another the second compression roller is located the another side of the push rod.

Optionally, the first pair of roller conveyors further includes a hinge rod, one end of the hinge rod is hinged to the first mounting seat, the other end of the hinge rod is in transmission connection with the first pressing roller located above, and a first elastic element is further disposed between the hinge rod and the first mounting seat in a propping manner and is used for enabling the two first pressing rollers to press the pushing rod.

Optionally, the feeding mechanism further comprises a limit switch, and the push rod is provided with a trigger part for triggering the limit switch;

the push rod penetrates through the first installation seat, limiting portions are arranged at two ends of the push rod respectively, and the two limiting portions are arranged at two ends of the first installation seat in a blocking mode respectively.

Optionally, a positioning camera is arranged on the transmission mechanism and used for taking pictures of the circuit board in transmission; the laser cutting mechanism comprises a laser head, and the laser cutting mechanism adjusts the cutting angle of the laser head according to the photographing information of the positioning camera.

Optionally, the feeding mechanism further includes a second mounting seat and a first linear module, the first mounting seat and the second mounting seat are respectively located on two opposite sides of the fixed seat, at least one belt transmission device is respectively arranged on two sides of the second mounting seat, the belt transmission devices are parallel to each other, the second mounting seat is arranged on the first linear module, a screening camera is arranged above the first linear module, the screening camera can photograph the circuit board on the second mounting seat, and the transmission mechanism rejects the unqualified circuit board according to the photographing information of the screening camera; the second mounting seat can move towards the direction of the fixed seat under the driving of the first linear module, so that one end of the belt transmission device is in butt joint with the fixed seat; under the drive of the first straight line module, the second mounting seat can also move towards the direction away from the fixed seat, so that the other end of the belt transmission device is in butt joint with the transmission mechanism.

Optionally, each belt transmission device comprises two transmission wheels, a pressing wheel and a transmission belt, the transmission belt is sleeved on the two transmission wheels, and a transmission position is formed between the pressing wheel and the transmission belt and used for transmitting the circuit board;

the second mount pad is close to the both sides of fixing base one end are equipped with tubaeform guide way respectively, the great one end orientation of guide way opening the fixing base sets up, conveying position with the less one end butt joint of guide way opening.

Optionally, the fixing seat includes a first fixing portion and a second fixing portion that are oppositely disposed, an accommodating space is provided between the first fixing portion and the second fixing portion, a tightening device is disposed on the second fixing portion, and the tightening device can be tightened towards the first fixing portion;

a placing table is arranged below the accommodating space, a vertical moving device is arranged on the first fixing part or the second fixing part, the vertical moving device is in transmission connection with the placing table to drive the placing table to move along the vertical direction, and the placing table is used for placing the circuit board or the material box;

the feeding mechanism further comprises a pushing element, a pushing rod and a waste material platform, the placing platform is in butt joint with the waste material platform, the pushing rod is in transmission connection with the pushing element, and the pushing rod can push empty material boxes on the placing platform into the waste material platform under the action of the pushing element.

Optionally, the transport mechanism comprises:

the second linear module is provided with a bearing table;

the third straight line module is located above the second straight line module, a first sucker is arranged on the third straight line module, the first sucker can place the circuit board transmitted by the feeding mechanism on the bearing table under the driving of the third straight line module, and the bearing table can enable the circuit board to be brought to the cutting position of the laser cutting mechanism under the driving of the second straight line module.

Optionally, the laser cutting machine further comprises a tray placing mechanism for transferring the tray, the transfer mechanism further comprises a fourth linear module, the fourth linear module is located above the second linear module, a second suction cup is arranged on the fourth linear module, and the second suction cup can bring the electronic element into the tray placing mechanism and place the electronic element into the tray under the driving of the fourth linear module.

Optionally, the wobble plate mechanism comprises:

the empty tray station is used for placing the tray;

a full tray station for placing the tray filled with the electronic components;

the empty tray station is located on the upstream of the transmission channel, the full tray station is located on the downstream of the transmission channel, the transmission channel is used for transmitting the tray of the empty tray station to the full tray station, and the second sucker can place the electronic element into the tray transmitted on the transmission channel under the driving of the fourth linear module.

Optionally, the conveying mechanism further comprises a deviation rectifying camera, the deviation rectifying camera can shoot the second sucker which sucks the electronic element, an adjusting device is arranged on the fourth straight line module, the second sucker is arranged on the adjusting device, and the adjusting device adjusts the second sucker according to shooting information of the deviation rectifying camera, so that the second sucker can place the electronic element into the tray which is conveyed on the conveying channel.

Optionally, laser cutting mechanism with be equipped with annular dust ring between the plummer, laser cutting mechanism's laser can pass the cutting of dust ring the circuit board, be equipped with the dust removal passageway in the dust removal ring, the dust removal ring is close to the one end of plummer is equipped with the dust removal hole, the dust removal hole passes through the dust removal passageway can communicate with first negative pressure air supply.

Optionally, a truncated cone-shaped inclined plane is arranged on the inner side of one end, close to the bearing table, of the dust removing ring, one end, with a larger diameter, of the truncated cone-shaped inclined plane is close to the bearing table, and the dust removing holes are formed in the end faces, close to one end of the bearing table, of the truncated cone-shaped inclined plane and the dust removing ring respectively.

Compared with the prior art, in the laser cutting machine, the laser cutting mechanism is used for cutting the circuit board into the electronic component and the waste frame. When feeding, the circuit board or the material box with the circuit board can be placed on the fixed seat. Wherein, the magazine is provided with a plurality of layers of clapboards, each layer of clapboard can be respectively provided with a circuit board, and thus, a plurality of circuit boards can be arranged in one magazine. The push rod is extruded in the first pair of roller type conveying devices and the second pair of roller type conveying devices, wherein the second pair of roller type conveying devices are in driving drive, the first pair of roller type conveying devices are in driven drive, the second press roller is driven to rotate through the first rotating element, the push rod can move in a reciprocating mode along the length direction of the push rod, the first pair of roller type conveying devices achieve the effects of transmission and support on the push rod, and the push rod can stably move in a reciprocating mode along the length direction of the push rod. Because be the contact transmission between first pair of roller-type conveyer, the second is to roller-type conveyer and the push rod, it mainly promotes the push rod through the frictional force of first compression roller, second compression roller and push rod and removes, when the circuit board cardboard, can appear skidding between first compression roller, second compression roller and the push rod, can avoid the push rod to damage the circuit board. Can full automatic feeding, the material loading is accurate, is convenient for realize streamlined production.

Drawings

One or more embodiments are illustrated in drawings corresponding to, and not limiting to, the embodiments, in which elements having the same reference number designation may be represented as similar elements, unless specifically noted, the drawings in the figures are not to scale.

FIG. 1 is a schematic diagram of a circuit board cut into electronic components and a waste frame in accordance with one embodiment of the present invention;

FIG. 2 is a schematic view of a first view of a laser cutting machine according to an embodiment of the present invention;

FIG. 3 is a schematic view of a first perspective of a loading mechanism according to an embodiment of the present disclosure;

FIG. 4 is an enlarged fragmentary view of FIG. 3 at section A;

FIG. 5 is a schematic view of a first portion of a laser cutting machine according to an embodiment of the present invention;

FIG. 6 is a schematic structural diagram of a second portion of a laser cutting machine according to an embodiment of the present invention;

FIG. 7 is a schematic structural diagram of a second perspective view of the feeding mechanism in an embodiment of the present invention;

FIG. 8 is a schematic structural view of a second mount and belt drive according to an embodiment of the present invention;

FIG. 9 is a schematic structural diagram of a third perspective of the loading mechanism according to an embodiment of the present disclosure;

FIG. 10 is a schematic structural view of a third portion of a laser cutting machine according to an embodiment of the present invention;

FIG. 11 is a schematic diagram illustrating a second view of a laser cutting machine according to an embodiment of the present invention;

FIG. 12 is a schematic view of a third view of a laser cutting machine according to an embodiment of the present invention;

FIG. 13 is a schematic structural view of a fourth part of a laser cutting machine according to an embodiment of the present invention;

FIG. 14 is a schematic structural diagram of a wobble plate mechanism according to an embodiment of the present invention;

FIG. 15 is a schematic diagram illustrating a fourth view of a laser cutting machine according to an embodiment of the present invention;

FIG. 16 is a schematic structural diagram of a carrier stage according to an embodiment of the invention;

FIG. 17 is an exploded view of a carrier table according to an embodiment of the invention;

FIG. 18 is a schematic structural view of a carrier plate, a flow equalizer plate and a vent plate according to an embodiment of the present invention;

FIG. 19 is a schematic diagram illustrating a fifth view of a laser cutting machine according to an embodiment of the present invention;

FIG. 20 is a schematic structural view of a dust ring according to an embodiment of the present invention;

FIG. 21 is a cross-sectional view of a wiper ring according to an embodiment of the present invention.

Detailed Description

In order to facilitate an understanding of the invention, the invention is described in more detail below with reference to the accompanying drawings and specific examples. It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may be present. The terms "vertical," "horizontal," "left," "right," "inner," "outer," and the like as used herein are for descriptive purposes only.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.

Furthermore, the technical features mentioned in the different embodiments of the invention described below can be combined with each other as long as they do not conflict with each other.

Referring to fig. 1, the circuit board 101 is cut into a scrap frame 1011 and an electronic component 1012 by a laser. In one embodiment, the circuit board 101 may be a PCB, an ultra-thin circuit board, a thick copper plate, etc., the electronic component 1012 is a chip, a PCB may be cut into many square chips, and the waste material cut from the PCB is the waste frame 1011.

Referring to fig. 2 to 4, a laser cutting machine 100 includes a laser cutting mechanism 10, a feeding mechanism 40 and a transmission mechanism 50; the feeding mechanism 40 comprises a fixed seat 41, a first mounting seat 42, a push rod 43, a limit switch 44, a first pair of roller type conveying devices 45 and a second pair of roller type conveying devices 46; the first pair of roller conveyors 45 comprises a hinge rod 452 and two first press rollers 454 distributed up and down, the second pair of roller conveyors 46 comprises a first rotating element 462 and at least two second press rollers 464 distributed up and down, the first press roller 454 and the second press rollers 464 are both rotatably arranged on the first mounting seat 42, one end of the hinge rod 452 is hinged with the first mounting seat 42, the other end of the hinge rod 452 is in transmission connection with the first press roller 454 positioned above, a first elastic element 456 is further abutted between the hinge rod 452 and the first mounting seat 42, and the first elastic element 456 presses the hinge rod 452, so that the two first press rollers 454 press the push rod 43; the at least one second pressing roller 464 is in transmission connection with the first rotating element 462, the push rod 43 is respectively squeezed between the two first pressing rollers 454 and between the second pressing rollers 464, the fixed seat 41 is used for placing the circuit board 101 or the magazine 102, and the circuit board 101 or the magazine 102 placed on the fixed seat 41 is located at the pushing end 430 of the push rod 43; the push rod 43 is provided with a triggering portion for triggering the limit switch 44, the triggering portion is a sensing hole 434 formed in the push rod 43, and when the limit switch 44 senses the sensing hole 434, the push rod 43 reaches the limit position.

Referring to fig. 5, the first mounting seat 42, the push rod 43, the limit switch 44, the first pair of roller conveyors 45, and the second pair of roller conveyors 46 may be all installed in the protection cover 422, and the protection cover 422 may be connected to the fixing seat 41.

Referring to fig. 2 to 4 again, the transmission mechanism 50 is located at an end of the fixing base 41 away from the pushing end 430, the push rod 43 can push the circuit board 101 from the fixing base 41 to the transmission mechanism 50, the transmission mechanism 50 is in butt joint with the laser cutting mechanism 10, and the plummer 20 is disposed on the transmission mechanism 50.

In the laser cutting machine 100 of the present embodiment, the laser cutting mechanism 10 is used to cut the circuit board 101 into the electronic component 1012 and the scrap frame 1011. When loading, the circuit board 101 or the magazine 102 with the circuit board 101 can be placed on the fixing base 41. Wherein, the magazine 102 is provided with a plurality of layers of partition boards, each layer of partition board can be respectively provided with a circuit board 101, and thus, one magazine 102 can be provided with a plurality of circuit boards 101. The push rod 43 is squeezed between the first pair of roller type conveying devices 45 and the second pair of roller type conveying devices 46, wherein the second pair of roller type conveying devices 46 are in driving drive, the first pair of roller type conveying devices 45 are in driven drive, the second press roller 464 is driven to rotate through the first rotating element 462, the push rod 43 can move in a reciprocating mode along the length direction of the push rod, and the first pair of roller type conveying devices 45 achieve the functions of transmission and support on the push rod 43, so that the push rod 43 can stably move in a reciprocating mode along the length direction of the push rod 43. Because the first roller conveyer 45, the second roller conveyer 46 and the push rod 43 are in contact transmission, the push rod 43 is pushed to move mainly by the friction force of the first pressing roller 454, the second pressing roller 464 and the push rod 43, when the circuit board 101 is clamped, slipping occurs among the first pressing roller 454, the second pressing roller 464 and the push rod 43, and the circuit board 101 can be prevented from being damaged by the push rod 43. Can full automatic feeding, the material loading is accurate, is convenient for realize streamlined production.

The first rotating element 462 is a motor, etc., the first elastic element 456 is a spring, etc., the two first pressing rollers 454 can press the push rod 43 by compressing the hinge rod 452 through the first elastic element 456, and the pressure for pressing the push rod 43 can be adjusted by adjusting the first elastic element 456, so that the push rod 43 does not fall off or fall off when moving. The limit switches 44 are photoelectric switches, etc., the number of the limit switches 44 is two, and the two limit switches 44 are respectively used for sensing the limit positions of the two ends of the push rod 43 and preventing the push rod 43 from being separated from the first pair of roller type conveying devices 45 and the second pair of roller type conveying devices 46. Specifically, one of the limit positions is a position where the push rod 43 is located when the push rod 43 completely pushes out the circuit board 101; the other limit position is a position where the plunger 43 is located when the plunger 43 is completely retracted. The two limit positions are respectively represented by the two sensing holes 434, the limit switch 44 is aligned with the push rod 43, and when the limit switch 44 senses the sensing holes 434, the push rod 43 reaches the limit positions.

In an embodiment, the number of the second pressing rollers 464 is three, wherein two second pressing rollers 464 are horizontally arranged side by side, another second pressing roller 464 is located above the two second pressing rollers 464 which are horizontally arranged side by side, the two second pressing rollers 464 which are horizontally arranged are located on one surface of the pushing rod 43, and another second pressing roller 464 is located on the other surface of the pushing rod 43. Since the second pair of roller conveyors 46 is actively driven, the pushing rod 43 is supported by two second pressing rollers 464 horizontally arranged side by side, and the other second pressing roller 464 can be in transmission connection with the first rotating element 462, so as to ensure stable driving of the pushing rod 43.

In an embodiment, the push rod 43 is inserted into the first mounting seat 42, two ends of the push rod 43 are respectively provided with a limiting portion 432, and the two limiting portions 432 can be respectively arranged at two ends of the first mounting seat 42 in a blocking manner. Specifically, the limiting portion 432 is a limiting block, when the pushing rod 43 is pushed to the limiting position, except that the limiting switch 44 senses the pushing rod, the first rotating element 462 reversely rotates or stops rotating after the limiting switch 44 senses the pushing rod, so that the pushing rod 43 does not move forward any more. The first rotating element 462 can be controlled by a control system, the electrical components of all embodiments of the present invention can be controlled by a control system, the control system can be a computer, and the like, and certainly, the control system is not adopted, but can be realized by manual control. The limiting portion 432 is stopped at the end of the first mounting seat 42, so as to mechanically limit the push rod 43 and prevent the push rod 43 from separating from the first pair of roller conveyors 45 and the second pair of roller conveyors 46.

Referring to fig. 6 to 8, in an embodiment, the feeding mechanism 40 further includes a second mounting seat 47 and a first linear module 48, the first mounting seat 42 and the second mounting seat 47 are respectively located at two opposite sides of the fixing seat 41, at least one belt transmission device 49 is respectively disposed at two sides of the second mounting seat 47, the belt transmission devices 49 are parallel to each other, the second mounting seat 47 is disposed on the first linear module 48, a screening camera 482 is disposed above the first linear module 48, the screening camera 482 photographs the circuit board 101 on the second mounting seat 47, and the transmission mechanism 50 removes the unqualified circuit board 101 according to the photographing information of the screening camera 482; under the driving of the first linear module 48, the second mounting seat 47 moves toward the fixed seat 41, so that one end of the belt transmission device 49 is in butt joint with the fixed seat 41, or the second mounting seat 47 moves in a direction away from the fixed seat 41, so that the other end of the belt transmission device 49 is in butt joint with the transmission mechanism 50. After the push rod 43 pushes out the circuit board 101 on the fixed seat 41, the second installation seat 47 is in butt joint with the fixed seat 41 under the driving of the first linear module 48, so that the circuit board 101 pushed out by the push rod 43 is received by the belt transmission devices 49 on the two sides of the second installation seat 47, and after the two belt transmission devices 49 receive the circuit board 101, the first linear module 48 can drive the second installation seat 47 to be in butt joint with the transmission mechanism 50. Two belt drive 49 can adjust the position of circuit board 101, makes circuit board 101 be located a default position of second mount pad 47, drives second mount pad 47 and transmission device 50 butt joint back when first straight line module 48, and transmission device 50 can all convey away circuit board 101 from this default position at every turn, guarantees that the position in the circuit board 101 data send process keeps unanimous, is favorable to improving cutting accuracy and cutting efficiency. After the screening camera 482 photographs the circuit board 101, in the subsequent transmission process, the transmission mechanism 50 can directly reject the unqualified circuit board 101, or the laser cutting mechanism 10 cannot cut the unqualified circuit board 101, and then the transmission mechanism 50 rejects the unqualified circuit board 101.

In one embodiment, each belt driving device 49 includes two driving wheels 492, a pressing wheel 494 and a driving belt 496, at least one driving wheel 492 is connected with a second rotating element 4942 in a driving manner to drive the driving wheels 492, the driving belt 496 is sleeved on the two driving wheels 492, and a conveying position is formed between the pressing wheel 494 and the driving belt 496 for conveying the circuit board 101; the second installation seat 47 is close to both sides of one end of the fixed seat 41 are respectively provided with a horn-shaped guide groove 472, the larger opening end of the guide groove 472 faces the fixed seat 41, and the conveying position is in butt joint with the smaller opening end of the guide groove 472. When the push rod 43 pushes the circuit board 101 out, and the second mounting seat 47 is close to the fixed seat 41, the circuit board 101 can be continuously driven forwards under the driving of the pinch roller 494 and the transmission belt 496 as long as a small part of the circuit board 101 enters the transmission position between the pinch roller 494 and the transmission belt 496, so that the distance for pushing out the push rod 43 can be small, the circuit board 101 between the fixed seat 41 and the second mounting seat 47 can be stably butted and transmitted, and even if the push rod 43 is not pushed in place, the continuous transmission can be realized as long as the small part of the circuit board 101 enters the transmission position, and the transmission cannot be influenced.

In an embodiment, the fixing base 41 includes a first fixing portion 412 and a second fixing portion 414 that are oppositely disposed, an accommodating space 416 is provided between the first fixing portion 412 and the second fixing portion 414, a tightening device 418 is provided on the second fixing portion 414, and the tightening device 418 can tighten toward the first fixing portion 412; a placing table 60 is arranged below the accommodating space 416, a vertical moving device 62 is arranged on the first fixing portion 412 or the second fixing portion 414, the vertical moving device 62 is in transmission connection with the placing table 60 to drive the placing table 60 to move in the vertical direction, and the placing table 60 is used for placing the circuit board 101 or the material box 102. The accommodating space 416 is used for accommodating the magazine 102, the magazine 102 can be stacked in a plurality, and the magazine 102 cannot fall down as long as the pushing device 418 pushes the lowermost magazine 102. The distance between the first and second fixing

portions

412, 414 is adjustable, enabling different sizes of cartridges 102 to be placed. When feeding, the jacking device 418 can eject one magazine 102 into the placing table 60, and since there are multiple layers of circuit boards 101 on the magazine 102, the position of the magazine 102 can be adjusted by the vertical moving device 62, so that after the push rod 43 pushes one circuit board 101, the push rod 43 can be aligned with the next circuit board 101 in the magazine 102. Wherein, vertical mobile device 62 includes lead screw, transmission piece and lead screw seat, and the lead screw sets up along vertical direction, and the lead screw rotating rack is established on the lead screw seat, and the transmission piece is established on the lead screw, and put platform 60 establishes on the transmission piece, drives the lead screw through the motor and rotates, makes put platform 60 can follow vertical direction and remove. The jacking device 418 comprises a first cylinder 4182 and a contact block 4184, the contact block 4184 is arranged at the output end of the first cylinder 4182, and the first cylinder 4182 can jack the magazine 102 when driving the contact block 4184 to push forwards.

Referring to fig. 9, in an embodiment, the feeding mechanism 40 further includes a pushing element 497 and a pushing rod 498, the placing table 60 is abutted to the waste table 64, the pushing rod 498 is connected to the pushing element 497 in a transmission manner, and the pushing rod 498 can push the empty magazine 102 on the placing table 60 into the waste table 64 under the action of the pushing element 497. By pushing the empty magazine 102 into the waste table 64 by the push rod 498, automated production and line production can be achieved. The pushing element 497 is a second cylinder, and the pushing rod 498 is driven by the second cylinder to push the empty magazine 102 on the placing table 60 into the waste table 64. Specifically, the placing table 60 includes two horizontal support rods 66, the two support rods 66 are connected to the transmission block in a transmission manner, the two support rods 66 can be driven by the transmission block to move in the vertical direction, and meanwhile, the magazine 102 discharged from the accommodating space 416 can be erected on the two support rods 66. The push rod 498 is located between the two support rods 66, and when the push rod 498 moves along the length direction of the support rods 66, it can push the magazine 102 on the support rods 66 and bring the empty magazine 102 into the waste platform 64.

Referring to fig. 10 and 11, in an embodiment, the transmission mechanism 50 includes:

a second linear module 52, wherein the second linear module 52 is provided with a bearing table 20;

the third linear module 53 is located above the second linear module 52, the third linear module 53 is provided with a first suction cup 532, the first suction cup 532 can place the circuit board 101 transmitted by the feeding mechanism 40 on the bearing table 20 under the driving of the third linear module 53, and the bearing table 20 can bring the circuit board 101 to the cutting position of the laser cutting mechanism 10 under the driving of the second linear module 52. The circuit boards 101 on the second mounting seat 47 can be brought into the carrier 20 of the second linear module 52 by the first suction cups 532, specifically, the number of the second linear modules 52 is two, and the alternate operation can be realized. The third linear module 53 has two sets of first suction cups 532, wherein the first suction cups 532 of any one set can be used for carrying the cut waste frames 1011 back or for carrying the circuit boards 101 to the carrier 20.

In one embodiment, the transmission mechanism 50 further includes a fourth linear module 54, and the fourth linear module 54 is located above the second linear module 52. The fourth linear module 54 is provided with a positioning camera 51, and the positioning camera 51 can be driven to move by the fourth linear module 54, so that a group of positioning cameras 51 can photograph the bearing table 20 on the plurality of groups of second linear modules 52. The positioning camera 51 is used for taking pictures of the circuit board 101 in transmission; laser cutting mechanism 10 includes the laser head, laser cutting mechanism 10 basis the information regulation laser head's of shooing of location camera cutting angle. The positioning camera 51 is a CCD camera, the CCD camera shoots the circuit board 101, the circuit board 101 is shot by an angle a, then under the control of the control system, the laser head can also cut after deviating the angle a, so that the laser head can not deviate when cutting the circuit board 101, wherein the angle a is a deviation angle of the circuit board 101 compared with a target position, and the angle a can be any numerical value. Automatic adjustment can be realized through the positioning camera 51, and the precision and the cutting efficiency of laser cutting are improved.

In an embodiment, the transmission mechanism 50 further includes a rectification camera 56, an adjusting device 542 is disposed on the fourth linear module 54, a second suction cup 544 is disposed on the adjusting device 542, and the rectification camera 56 can take a picture of the second suction cup 544 which has sucked the electronic component 1012. Under the driving of the fourth linear module 54, the second suction cup 544 can bring the electronic component 1012 to a downstream station, and the adjusting device 542 adjusts the second suction cup 544 according to the photographing information of the rectification camera 56, so that the electronic component 1012 can be smoothly brought to a designated position by the second suction cup 544. The adjusting device 542 comprises a first slider 5422, a slide rail 5424 and a driving element 5426, the first slider 5422 is arranged on the slide rail 5424, the slide rail 5424 is arranged in the vertical direction, the driving element 5426 is a belt transmission structure, the belt transmission structure is connected with the first slider 5422, the driving element 5426 can drive the first slider 5422 to move in the vertical direction, the second suction cup 544 is arranged on the first slider 5422, and the up-and-down movement of the first slider 5422 can be realized by the driving of the belt transmission structure, so that the adjustment of the second suction cup 544 is realized. Preferably, a second elastic member 5428 is provided between the second suction pad 544 and the first slider 5422, and when the second suction pad 544 touches the electronic component 1012, a certain buffer effect can be achieved by the second elastic member 5428. Specifically, the second elastic element 5428 is a spring.

Referring to fig. 12 to 14, in an embodiment, the laser cutting machine 100 further includes a swinging tray mechanism 70, and the swinging tray mechanism 70 is used for conveying the tray 103. Under the driving of the fourth linear module 54, the second suction cup 544 can bring the electronic component 1012 into the tray swinging mechanism 70, and place the electronic component 1012 into the tray 103. After the laser cutting mechanism 10 cuts the circuit board 101 into the electronic components 1012 and the waste frames 1011, the carrier 20 is driven by the second linear module 52 to move toward the second mounting seat 47, when the carrier 20 moves below the fourth linear module 54, the fourth linear module 54 drives the second suction cups 544 to bring the electronic components 1012 on the carrier 20 into the tray swinging mechanism 70 one by one, and each electronic component 1012 is placed into the tray 103, so that transportation and turnover are facilitated, and full-automatic production operation can be realized. Wherein, the tray 103 has a plurality of holes for holding electronic components 1012.

In one embodiment, the wobble plate mechanism 70 includes:

an empty tray station 72 for placing the tray 103;

a full tray station 74 for placing the tray 103 filled with the electronic components 1012;

the conveying channel 76 is located upstream of the conveying channel 76, the empty tray station 72 is located downstream of the conveying channel 76, the conveying channel 76 is used for conveying the tray 103 of the empty tray station 72 to the full tray station 74, and the second suction cups 544 can place the electronic components 1012 into the tray 103 conveyed on the conveying channel 76 under the driving of the fourth linear module 54. The conveying channel 76 is a belt transmission or other devices capable of conveying, the conveying channel 76 conveys the hollow tray 103 in the empty tray station 72 to the full tray station 74, in the process, the second suction cups 544 are driven by the fourth linear module 54 to fill the tray 103 with the electronic components 1012, and after the tray 103 is filled with the electronic components 1012, the conveying channel 76 continues to convey the tray 103 to the full tray station 74 for stacking and storage, so as to facilitate transportation and turnover.

Referring to fig. 15 to 17, the susceptor 20 includes a carrier plate 22, a vent plate 24, a vent cover 26 and a first negative pressure gas source (not shown); the carrier plate 22, the vent plate 24 and the vent cover 26 are sequentially arranged from top to bottom, at least one accommodating position 222 for accommodating the electronic component 1012 is arranged on the carrier plate 22, and at least one first hole 224 is arranged on each accommodating position 222; at least one second hole 242 is formed in the aeration panel 24; the first aperture 224, the second aperture 242, the vent mask 26 and the first source of negative pressure gas are in serial communication.

In this embodiment, the number of the first holes 224 is equal to and corresponds to the number of the second holes 242, and in some other embodiments, the number of the second holes 242 is different from the number of the first holes 224, and one first hole 224 corresponds to a plurality of second holes 242, or a plurality of first holes 224 corresponds to one second hole 242, or a plurality of first holes 224 corresponds to a plurality of second holes 242, as long as the first holes 224 communicate with the second holes 242.

In the laser cutting machine 100 of the present embodiment, the laser cutting mechanism 10 is a laser cutting device or the like, and is capable of laser cutting the circuit board 101, and preferably, one first hole 224 is provided for each receiving position 222. When the circuit board 101 is cut, the circuit board 101 is placed on the bearing plate 22, the first negative pressure air source is started, the circuit board 101 and the cut chips are fixed in an adsorption manner sequentially through the ventilation cover 26, the second hole 242 and the first hole 224, and each chip or each chip-generating accommodation position 222 has one first hole 224, so that the circuit board 101 and the chips can be completely fixed. Meanwhile, dust and waste materials generated in the cutting process can be discharged from the first negative pressure air source through the first hole 224, the second hole 242 and the ventilation cover 26, so that the influence on cutting is avoided, the cutting precision of the circuit board 101 is higher, and higher yield is ensured.

In an embodiment, the carrier 20 further includes a fixing frame 21 and a pressing device 23 for pressing the circuit board 101 or the waste frame 1011, the air-permeable plate 24 and the pressing device 23 are both disposed on the fixing frame 21, the pressing device 23 is disposed at a side edge of the carrier plate 22, and the pressing device 23 is used for fixing the circuit board 101 or the waste frame 1011. The flow equalizing plate 28 and the bearing plate 22 are sequentially installed on the air vent plate 24, the air vent cover 26 is installed at the bottom end of the air vent plate 24, specifically, the air vent cover 26 includes a fixing plate 262 and a trumpet-shaped cover body 264, the fixing plate 262 is fixed at the bottom end of the air vent plate 24, a through hole 2622 is formed in the fixing plate 262, the cover body 264 is fixed at the bottom end of the fixing plate 262, and the cover body 264 is communicated with the air vent plate 24 through the through hole 2622. The embodiment can also fix the circuit board 101 through the pressing device 23, but the fixing effect is limited, and the chip cannot be fixed, so that the pressing device and the negative pressure adsorption fixing can be combined to realize the double fixing effect.

In one embodiment, the pressing device 23 includes a rotary pressing cylinder 232 and a pressing block 234, the pressing block 234 is disposed at an output end of the rotary pressing cylinder 232, and the rotary pressing cylinder 232 is located at a side edge of the bearing plate 22. The rotary compressing cylinder 232 can rotate and compress flexibly, when the circuit board 101 is placed on the bearing plate 22, the rotary compressing cylinder 232 drives the pressing block 234 to compress the circuit board 101, in the cutting process, the rotary compressing cylinder 232 can drive the pressing block 234 to press the cut waste frames 1011, and after the cutting is completed, the rotary compressing cylinder 232 drives the pressing block 234 to move away, so that the waste frames 1011 can be taken away.

Referring to fig. 16 to 18, in an embodiment, the carrier 20 further includes a flow equalizing plate 28, the flow equalizing plate 28 is located between the air vent plate 24 and the carrier plate 22, the carrier plate 22 is further provided with at least one third hole 226, the third hole 226 is not located in the accommodating position 222, that is, the third hole 226 is located outside the accommodating position 222, the flow equalizing plate 28 is distributed with at least one fourth hole 282, each first hole 224 and each third hole 226 are respectively communicated with the second hole 242 through the fourth hole 282, and a strip-shaped clearance groove 228 is respectively formed around each first hole 224. The cut waste frame 1011 can be sucked through the third hole 226. Preferably, a plurality of fourth holes 282 are distributed on the flow equalizing plate 28, the diameter of the fourth holes 282 may be smaller than the diameter of the third holes 226 and the diameter of the first holes 224, and the distribution density of the fourth holes 282 is greater than the distribution density of the third holes 226 and the distribution density of the first holes 224, so that each of the first holes 224 and each of the third holes 226 can be ensured to be communicated with at least one of the fourth holes 282, and finally, the negative pressure suction force generated by each of the first holes 224 and each of the third holes 226 can be uniform, and the suction force to each of the chips and each of the portions of the waste frame 1011 can be ensured to be substantially uniform.

It is further preferred that the third holes 226 are distributed along the edge of the carrier plate 22, the third holes 226 being arranged around the receiving locations 222, the first holes 224. The number of the receiving positions 222 and the first holes 224 is large, and each of the receiving positions 222 and the first holes 224 may be arranged in an array at a certain pitch. The strip-shaped clearance grooves 228 are distributed around each first hole 224, and during laser cutting, laser can cut along the clearance grooves 228, so that the bearing plate 22 can avoid the light path of the laser. Preferably, the empty avoiding groove 228 is a strip-shaped blind groove, and the blind groove is not communicated with the second hole 242, so that the pressure is not released, and the adsorption effect of the first hole 224 and the third hole 226 is not affected.

In the embodiment, the first hole 224 and the third hole 226 are funnel-shaped, and the larger openings of the first hole and the third hole are both facing the circuit board 101 or the waste frame 1011, so as to increase the absorption area of the circuit board 101 or the waste frame 1011.

In one embodiment, the top surface of the air-permeable plate 24 is provided with a receiving chamber 244, the receiving chamber 244 is provided with at least one protrusion 2442, the number of the protrusions 2442 and the number of the first holes 224 are equal and are in one-to-one correspondence, each protrusion 2442 is provided with a second hole 242, and the flow equalizing plate 28 is located in the receiving chamber 244. The accommodating chamber 244 is a square groove, and the bearing plate 22 covers the flow equalizing plate 28, so that the flow equalizing plate 28 can be completely enclosed in the accommodating chamber 244, which is beneficial to ensuring the air tightness among the bearing plate 22, the flow equalizing plate 28 and the air-breather plate 24, and making the negative pressure suction force of the first hole 224 and the third hole 226 better. The bumps 2442 can cushion the flow equalizing plate 28, and since the diameter of the fourth holes 282 can be smaller than the diameter of the third holes 226 and the diameter of the first holes 224, and the distribution density of the fourth holes 282 is greater than the distribution density of the third holes 226 and the distribution density of the first holes 224, the contact area of the fourth holes 282 on the flow equalizing plate 28 in the unit area of the first holes 224 and the unit area of the third holes 226 is substantially the same, and the flow equalizing and pressure equalizing effects can be achieved. It is further preferable that fifth holes 2444 are provided between the protrusions 2442, the third holes 226 and the first holes 224 can be communicated with the fifth holes 2444 through the fourth holes 282, if the second holes 242 in one area are blocked, the negative pressure between different areas of the bearing plate 22 will be different, and the negative pressure between different areas of the bearing plate 22 can be the same through the fifth holes 2444 between the protrusions 2442, and the fifth holes 2444 also have a certain flow and pressure equalizing effect, so that the negative pressure suction force generated by each first hole 224 and each third hole 226 is the same.

Referring to fig. 19 to 21, in an embodiment, an annular dust removing ring 30 is disposed between the laser cutting mechanism 10 and the carrying table 20, the laser of the laser cutting mechanism 10 can penetrate through the dust removing ring 30 to cut the circuit board 101, a dust removing channel 32 is disposed in the dust removing ring 30, a dust removing hole 34 is disposed at one end of the dust removing ring 30 close to the carrying table 20, and the dust removing hole 34 is communicated with a second negative pressure air source (not shown) through the dust removing channel 32. The dust removing ring 30 is a hollow cavity, and the dust removing channel 32 is a hollow cavity inside the dust removing ring 30. The laser of the laser cutting mechanism 10 can cut the circuit board 101 on the carrier 20 through the dust ring 30. If the dust ring 30 is not annular, and the laser of the laser cutting mechanism 10 cannot pass through the dust ring 30, the laser cutting mechanism 10 and the dust ring 30 need to be respectively reserved with installation positions, and the required installation space is larger. In the embodiment, the laser of the laser cutting mechanism 10 can pass through the dust removing ring 30, so that the space is saved. In addition, dust ring 30 and second negative pressure air supply intercommunication back, during the cutting, can remove dust to plummer 20 through dust removal hole 34, annular negative pressure suction also can be formed to dust removal hole 34 on the cyclic annular dust removal ring 30, according to the air current dynamics principle, under the prerequisite that other conditions are the same, annular negative pressure suction can be bigger more even, consequently, the dust removal effect of production can be better. Moreover, the dust removing range of the dust removing ring 30 is relatively large.

In an embodiment, a truncated cone-shaped inclined surface 36 is disposed on an inner side of one end of the dust ring 30 close to the bearing platform 20, one end of the truncated cone-shaped inclined surface 36 with a larger diameter is close to the bearing platform 20, and dust removing holes 34 are respectively disposed on end surfaces of the truncated cone-shaped inclined surface 36 and one end of the dust ring 30 close to the bearing platform 20. The dust removal holes 34 on the truncated cone-shaped inclined surface 36 form a horn-shaped adsorption range, so that the dust removal range is enlarged, and the truncated cone-shaped inclined surface 36 and the dust removal holes 34 on the end surface of the dust removal ring 30 close to one end of the bearing platform 20 are combined with each other, so that the dust removal range can be enlarged, and the dust removal effect can be ensured.

Based on the combination of the above embodiments, the working process of a preferred embodiment of the laser cutting machine 100 of the present invention is as follows: after a plurality of material boxes 102 are placed on the fixed seat 41, one material box 102 is ejected to the placing table 60 by the ejecting device 418, one circuit board 101 in the ejected material box 10 is ejected by the push rod 43, the first linear module 48 drives the second mounting seat 47 to be close to the fixed seat 41, and after the circuit board 101 is received by the conveying position between the pressing wheel 494 and the transmission belt 496, the first linear module 48 drives the second mounting seat 47 to move towards the transmission mechanism 50. At this time, the position of the magazine 102 is adjusted by the vertical moving device 62 so that the pusher 43 is aligned with the next circuit board 101 in the magazine 102. When the second mounting seat 47 passes through the screening camera 482, the screening camera 482 photographs the circuit board 101 on the second mounting seat 47, after the second mounting seat 47 reaches a certain position, the first suction disc 532 drives the circuit board 101 on the second mounting seat 47 to bring the circuit board 101 on the second mounting seat 47 into the carrier 20 on the second linear module 52 under the driving of the third linear module 53, then the second linear module 52 drives the carrier 20 to move towards the laser cutting mechanism 10, when the carrier 20 passes through the positioning camera 51, the positioning camera 51 photographs the carrier 20 and the circuit board 101 thereon, after the circuit board 101 is photographed to be deviated, under the control of the control system, the laser head in the laser cutting mechanism 10 is controlled to also adjust the deviation, when the carrier 20 reaches below the laser head, the adjusted laser head emits laser, and the laser penetrates through the dust removing ring 30 to cut the circuit board 101 on the carrier 20, during cutting, under the action of the second negative pressure air source, the dust removing ring 30 removes dust from the circuit board 101 being cut, and under the action of the first negative pressure air source, the loading plate 22, the flow equalizing plate 28, the vent plate 24 and the vent cover 26 adsorb the circuit board 101 or the electronic component 1012 and the scrap frame 1011, and meanwhile, the pressing block 234 also presses the circuit board 101 or the scrap frame 1011 under the action of the pressing device 23. After the cutting, under the driving of the second linear module 52, the carrier 20 drives the electronic component 1012 and the waste frame 1011 to move toward the second mounting seat 47, and in the cutting process, if the circuit board 101 photographed by the screening camera 482 is an unqualified circuit board 101, the laser head will not cut the unqualified circuit board 101. When the second suction cup 544 passes through the fourth linear module 54, the deviation rectifying camera 56 photographs the electronic component 1012 and the second suction cup 544, and after the electronic component 1012 is photographed to deviate by a certain distance, the adjusting device 542 can adjust the electronic component 1012 according to the deviated distance. Then, the second suction cups 544 carry the electronic components 1012 into the tray 103 in the transfer passage 76, and after the tray 103 is fully set, the transfer passage 76 carries the fully set tray 103 into the full tray station 74. The waste frame 1011 and the unqualified circuit board 101 are brought to a certain position by the carrier 20, and then are taken out of the carrier 20 by the first suction cup 532.

In this embodiment, first sharp module 48, second sharp module 52, third sharp module 53 and fourth sharp module 54 are sharp module, sharp module is linear module again, the cartesian robot, sharp slip table etc. including synchronous belt type and ball screw type, types such as straight line motor type, wherein, the sharp module of synchronous belt type includes the belt, second slider and transmission shaft, the second slider slides and establishes on the transmission shaft, the belt drives the second slider and slides on the transmission shaft, thereby realize linear motion.

Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; within the idea of the invention, also technical features in the above embodiments or in different embodiments may be combined, steps may be implemented in any order, and there are many other variations of the different aspects of the invention as described above, which are not provided in detail for the sake of brevity; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A laser cutting machine, characterized by comprising:

the transmission mechanism is positioned at one end, far away from the pushing end, of the fixed seat, and the push rod can push the circuit board from the fixed seat to the transmission mechanism;

2. The laser cutting machine according to claim 1, wherein the number of the second pressing rollers is three, two of the second pressing rollers are horizontally arranged side by side, another one of the second pressing rollers is located above the two second pressing rollers which are horizontally arranged side by side, the two second pressing rollers which are horizontally arranged are located on one surface of the push rod, and another one of the second pressing rollers is located on the other surface of the push rod.

3. The laser cutting machine according to claim 1, wherein the first pair of roller conveyors further includes a hinge rod, one end of the hinge rod is hinged to the first mounting seat, the other end of the hinge rod is in transmission connection with the first pressing roller located above, and a first elastic element is abutted between the hinge rod and the first mounting seat and used for enabling the two first pressing rollers to press the push rod.

4. The laser cutting machine according to claim 1, wherein the feeding mechanism further comprises a limit switch, and a trigger part for triggering the limit switch is provided on the push rod;

5. The laser cutting machine according to claim 1, wherein a positioning camera is arranged on the transmission mechanism, and the positioning camera is used for taking pictures of the circuit board in transmission; the laser cutting mechanism comprises a laser head, and the laser cutting mechanism adjusts the cutting angle of the laser head according to the photographing information of the positioning camera.

6. The laser cutting machine according to claim 1, wherein the feeding mechanism further comprises a second mounting seat and a first linear module, the first mounting seat and the second mounting seat are respectively located on two opposite sides of the fixed seat, at least one belt transmission device is respectively arranged on two sides of the second mounting seat, the belt transmission devices are parallel to each other, the second mounting seat is arranged on the first linear module, a screening camera is arranged above the first linear module, the screening camera can photograph the circuit board on the second mounting seat, and the transmission mechanism rejects the unqualified circuit board according to the photographing information of the screening camera; the second mounting seat can move towards the direction of the fixed seat under the driving of the first linear module, so that one end of the belt transmission device is in butt joint with the fixed seat; under the drive of the first straight line module, the second mounting seat can also move towards the direction away from the fixed seat, so that the other end of the belt transmission device is in butt joint with the transmission mechanism.

7. The laser cutting machine according to claim 6, wherein each of the belt transmission devices includes two transmission wheels, a pressing wheel and a transmission belt, the transmission belt is sleeved on the two transmission wheels, and a transmission position is formed between the pressing wheel and the transmission belt for transmitting the circuit board;

8. The laser cutting machine according to any one of claims 1 to 7, wherein the fixing base comprises a first fixing portion and a second fixing portion which are oppositely arranged, a receiving space is formed between the first fixing portion and the second fixing portion, and a tightening device is arranged on the second fixing portion and can be tightened towards the first fixing portion;

9. The laser cutting machine according to any one of claims 1 to 7, wherein the transport mechanism includes:

the second linear module is provided with a bearing table;

10. The laser cutting machine according to claim 9, further comprising a tray swinging mechanism for conveying a tray, wherein the conveying mechanism further comprises a fourth linear module, the fourth linear module is located above the second linear module, a second suction cup is disposed on the fourth linear module, and the second suction cup can bring the electronic component into the tray swinging mechanism and place the electronic component into the tray under the driving of the fourth linear module.

11. The laser cutting machine according to claim 10, wherein the wobble plate mechanism comprises:

the empty tray station is used for placing the tray;

a full tray station for placing the tray filled with the electronic components;

12. The laser cutting machine according to claim 11, wherein the transmission mechanism further includes a deviation camera, the deviation camera can photograph the second suction cup that has absorbed the electronic component, the fourth linear module is provided with an adjusting device, the second suction cup is provided on the adjusting device, and the adjusting device adjusts the second suction cup according to photographing information of the deviation camera, so that the second suction cup can place the electronic component into the tray transmitted on the transmission channel.

13. The laser cutting machine according to claim 9, wherein an annular dust ring is disposed between the laser cutting mechanism and the carrying table, the laser of the laser cutting mechanism can penetrate through the dust ring to cut the circuit board, a dust removal channel is disposed in the dust ring, a dust removal hole is disposed at one end of the dust ring close to the carrying table, and the dust removal hole can be communicated with a first negative pressure air source through the dust removal channel.

14. The laser cutting machine according to claim 13, wherein a truncated cone-shaped inclined surface is provided on an inner side of an end of the dust removing ring close to the supporting table, an end of the truncated cone-shaped inclined surface having a larger diameter is close to the supporting table, and the dust removing holes are provided on end surfaces of the truncated cone-shaped inclined surface and the end of the dust removing ring close to the supporting table, respectively.