CN113498276A - Control method of printed circuit board production equipment and printed circuit board production equipment - Google Patents

Control method of printed circuit board production equipment and printed circuit board production equipment Download PDF

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Publication number
CN113498276A
CN113498276A CN202110803838.4A CN202110803838A CN113498276A CN 113498276 A CN113498276 A CN 113498276A CN 202110803838 A CN202110803838 A CN 202110803838A CN 113498276 A CN113498276 A CN 113498276A
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China
Prior art keywords
layer plate
laminate
plate
layer
identification points
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CN202110803838.4A
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CN113498276B (en
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冯颖灵
徐灵丰
徐玲玲
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Fengshun County Jinshun Technology Co ltd
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Fengshun County Jinshun Technology Co ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
    • Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The invention discloses a control method of printed circuit board production equipment, which comprises three steps of inner layer board lamination, outer layer board lamination and inner layer board and outer layer board combination lamination, wherein the inner layer board, the outer layer board and a PCB board are formed by stacking lamination. In the inner layer plate laminating step, when an L1 layer plate is stacked, the position information of a plurality of identification points on the L1 layer plate is identified at the same time; then when stacking the L2 laminates, identifying the position information of a plurality of identification points on the L2 laminate, simultaneously comparing the acquired position information of a plurality of identification points on the L2 laminate with the position information of a plurality of identification points on the L1 laminate to enable the plurality of identification points on the two L laminates to correspond, and placing the L2 laminate on the L1 laminate to enable the same connecting nodes on the L2 laminate and the L1 laminate to coincide. And then the rest L-shaped laminates are stacked according to the method, so that the identification points of the upper and lower adjacent L-shaped laminates are mutually corresponding, the connection nodes in the adjacent L-shaped laminates are corresponding, the stacking error rate is reduced, and the production efficiency is improved.

Description

Control method of printed circuit board production equipment and printed circuit board production equipment
Technical Field
The invention relates to the technical field of electronic information technology, in particular to a control method of printed circuit board production equipment and the printed circuit board production equipment.
Background
A PCB, also called a printed circuit board, is a support for electronic components and is a carrier for electrical interconnection of electronic components. The PCB panel includes an inner layer panel composed of a single layer, a double layer or a multi layer panel, each of which is generally referred to as L1 layer, L2 layer, … …, Ln layer when the inner layer panel is composed of a plurality of layers, and an outer layer panel disposed at two planes of the inner layer panel, which is generally formed of PP plate, copper foil plate, steel plate, kraft paper or cushion pad by press-fitting.
When the inner layer board comprises double-layer or multilayer, each L layer board is stacked according to a certain order and placed, then after the pressfitting, through exposure development shaping after relevant chemical treatment, wherein, all can have the same connected node in the adjacent L layer board of the inner layer board in the PCB board of multiply wood, make connected node communicate each other after handling through processing methods such as chemical plating. In actual production, the circuit wiring of each plywood of the inner layer board of the PCB board of multiply wood is usually through the shaping of sculpture mode, and be in on the panel that the size is unanimous, then carry out the pressfitting after piling according to certain order through manipulator or manual mode, but because the glyptic circuit of each plywood is comparatively complicated usually in the inner layer board, the same connected node of every adjacent L plywood is all still unable to be compared to corresponding the coincidence with the manipulator, but only align the appearance of adjacent plywood at the pile in-process through manual work or manipulator, wait until after the machine-shaping, just can judge after the connected circuit to the PCB board detects that whether there is connected the connected node in the PCB board that forms not corresponding, and cause the wrong condition of pile.
In addition, the above manner that each L-layer board of the inner-layer board is aligned in shape during stacking process, and then detection is performed after a complete PCB is formed often results in an increase in stacking error rate and a decrease in processing efficiency.
Disclosure of Invention
In order to overcome the defects of the prior art, the invention aims to provide a control method of printed circuit board production equipment and the printed circuit board production equipment, which can stack each L-layer board of a multilayer inner-layer board in sequence and enable connection nodes in adjacent L-layer boards to correspond to each other one by one in the process of producing the PCB, so that the stacking error rate is reduced and the production efficiency is improved.
The purpose of the invention is realized by the following technical scheme:
the utility model provides a printed circuit board production facility, is including the pressfitting machine that is provided with work platform, one side of pressfitting machine is provided with the removal track, be provided with the manipulator on the removal track, the removal track is arranged and is provided with a plurality of special layer boards that are used for placing each L plywood of inner plating respectively and is used for placing inner plating and outer plywood's inner plating memory area and outer plywood memory area respectively far away from one side of pressfitting machine, work platform's pressfitting machine's discharge gate is provided with the conveyer belt, the conveyer belt is provided with cutting machine and chemical treatment equipment respectively along direction of delivery's end.
Further, a plurality of clamping suckers arranged in an array are arranged at the clamping end of the manipulator, and a recognition device for recognition is arranged at the clamping end of the manipulator and is connected with the control system.
Further, all be provided with around the work platform of pressfitting machine and promote positioner, promote positioner include with the promotion jar that work platform is connected, the promotion jar direction level orientation of promotion jar the work platform is placed the face center and is set up, the promotion end of promotion jar is provided with the slurcam, the slurcam is kept away from the side of promoting the jar is provided with the buffer layer.
According to the mechanical structure of the printed circuit board production equipment, the following control method for the printed circuit board production equipment is formed, and the specific method is as follows:
a control method of printed circuit board production equipment comprises an inner layer plate laminating step, an outer layer plate laminating step, and an inner layer plate and an outer layer plate combining and laminating step;
the laminating step of the A inner layer plate comprises the following steps:
s10: after receiving the inner layer plate laminating processing information sent by the control system, the control system acquires the stacking sequence of each L layer plate in the inner layer plates, each L layer plate is respectively defined as an L1 layer, an L2 layer plate, a … layer plate and an Ln layer plate according to the stacking sequence, a manipulator of the production equipment grabs the L1 layer plate and flatly places the L1 layer plate on a processing platform, then identifies a plurality of identification points on the L1 layer plate, acquires the position information of the identification points on the L1 layer plate and stores the acquired position information into a memory;
s20: a manipulator of the production equipment grabs the L2 laminate, identifies a plurality of identification points on the L2 laminate, acquires position information of the plurality of identification points on the L2 laminate, stores the acquired position information into a memory, compares the acquired position information of the plurality of identification points on the L2 laminate with the position information of the plurality of identification points on the L1 laminate, enables the plurality of identification points on the L2 laminate to be in one-to-one correspondence with the plurality of identification points on the L1 laminate, and then flatly places the L2 laminate on the L1 laminate;
s30: according to the mode of horizontally placing the L2 layer plate in the step S20, a next L3 layer plate is grabbed by a mechanical hand and horizontally placed on a last L2 layer plate until all L layer plates are stacked, then pressing treatment and chemical exposure development treatment are carried out to form an inner layer plate, and the mechanical hand places the inner layer plate formed by pressing in an inner layer plate storage area;
b, outer laminated plate pressing step:
s40: the method comprises the steps that after a control system receives outer-layer plate pressing processing information sent by the control system, the stacking sequence of each layer plate is obtained, a mechanical arm of production equipment sequentially stacks PP plates, copper foil plates, steel plates and cushion pads on a processing platform according to the stacking sequence of each layer plate of the outer layer plates, the appearances of the layer plates are aligned with each other, then pressing processing is carried out to form the outer layer plates, and the mechanical arm places the formed outer layer plates in an outer-layer plate storage area;
c, combining and laminating the inner layer plate and the outer layer plate:
s50: after control system received the inner plating and outer plywood pressfitting information that control system sent, the manipulator snatched outer plywood on the outer plywood storage area and kept flat on processing platform, and make the PP board of outer plywood set up, the manipulator snatched inner plating on the inner plating storage area and kept flat on processing platform's outer plywood after that, and make the appearance of inner plating align with the appearance of outer plywood, the manipulator snatchs outer plywood on the outer plywood storage area and keeps flat on processing platform's inner plating after that, make the PP board of this outer plywood set up down, and make the appearance of this outer plywood and inner plating align, then form the PCB board after carrying out pressfitting processing and cutting processing respectively.
Furthermore, in the inner-layer plate pressing step, the shape and size of each L-layer plate of the inner-layer plate are consistent, and the structures of a plurality of identification points arranged on the L-layer plate are as follows: the identification points of the L-layer plate are circular, serial numbers are sprayed in the circular identification points, the serial numbers of the identification points of the L-layer plate are identical, and the serial numbers of the identification points of the L-layer plates of the inner-layer plate are sequentially arranged according to the stacking sequence of the L-layer plates of the inner-layer plate.
Furthermore, the L-shaped laminate is rectangular, the number of the identification points on the L-shaped laminate is three, the three identification points of the L-shaped laminate are respectively positioned at three vertex angles of the front surface of the plane of the L-shaped laminate, and one of the identification points is respectively vertical to a connecting line of the other two identification points.
Further, in the inner-layer plate pressing step, numbering each L-layer plate according to the stacking sequence of a plurality of L-layer plates in the inner-layer plate, setting the number as i ═ n, wherein n is an integer, establishing a coordinate system on the plane of the L-layer plate on the nth layer to be grabbed, and defining the circle center coordinates of three identification points in each L-layer plate grabbed by the manipulator as follows:
ai (Ai, bi): the coordinate value of the circle center of the recognition point which is vertical to the connecting line of the other two recognition points;
bi (Ci, di) and Ci (ei, fi): circle center coordinate values of the other two identification points are respectively;
by the above definition, obtaining the vector AiBi ═ ci ═ Ai, di-bi, and the vector AiCi ═ ei-Ai, fi-bi, and then obtaining the model length | AiBi | ═ Li1 of the vector AiBi, and obtaining the model length | AiCi | ═ Li2 of the vector AiCi, taking the coordinate Ai (Ai, bi) as a new coordinate origin, taking the length direction of the vector AiBi as a new X axis, and taking the length direction of the vector AiCi as a new Y axis, then obtaining the coordinate values of the centers of the three recognition points as: ai (0,0), Bi (Ci,0), Ci (0, fi), where | Ci | ═ Li1, | fi | ═ Li 2;
therefore, in step S10, when the robot grips the L1 laminate and places the laminate on the working platform, the a1 coordinate of the L1 laminate is made to coincide with the mechanical origin coordinate on the working platform, and the X axis and the Y axis of the newly established coordinate system on the L1 laminate are made to coincide with the X axis and the Y axis of the mechanical coordinate system on the working platform, respectively;
further during step S20, when the robot grips the L2 layer and lays flat on the L1 layer on the work platform, the a2 coordinate of the L2 layer also corresponds to the mechanical origin coordinate on the work platform; when the coordinates B2(c2,0) on the L2 laminate and the coordinates B1(c1,0) on the L1 laminate satisfy: when | c1| ═ c2|, the recognition point corresponding to the circle center coordinate B2(c2,0) and the recognition point corresponding to the circle center coordinate B1(c1,0) are overlapped and correspond to each other by the manipulator, and then the L2 laminate is laid flat; if not, superposing and corresponding the identification point corresponding to the circle center coordinate C2(0, f2) and the identification point corresponding to the circle center coordinate B1(C1,0), and then horizontally placing the L2 laminate;
further in step S30, the L3 plies are laid flat according to the above-described manner of laying the L2 plies flat until the stack completes all the L plies.
Further, in the step of laminating the outer plate, after the outer plate is formed through laminating treatment and before the outer plate is placed in the outer plate storage area by the manipulator, the outer plate is conveyed to a cutting device through a conveying belt, and the outer plate is cut by the cutting device, so that the outer plate is consistent with the inner plate in shape and size.
Further, in the process of combining and pressing the inner plate and the outer plate, after the outer plate, the inner plate and the outer plate are grabbed by a mechanical arm and placed on the working platform, pushing and positioning devices which are positioned on the periphery of the working platform in production equipment push and extrude the edges of the stacked outer plate and inner plate, so that the appearance edges of the outer plate, the inner plate and the outer plate are aligned.
The invention has the following beneficial effects:
a control method of printed circuit board production equipment is characterized in that an inner layer board laminating step, an outer layer board laminating step and an inner layer board and outer layer board combining and laminating step are set, and an inner layer board, an outer layer board and a PCB board are formed through stacking and laminating. In the inner layer plate laminating step, under the control of a control system, the stacking sequence of each L layer plate of the inner layer plate is named in sequence: the laminated plates include L1 laminated plates, L2 laminated plates, … laminated plates and Ln laminated plates, and the positions of a plurality of identification points in each L laminated plate are the same due to the consistent appearance of each L laminated plate. Therefore, when the L1 laminate is stacked, the position information of a plurality of identification points on the L1 laminate is simultaneously identified and stored in the memory for subsequent processing; then when stacking the L2 laminate, the position information of a plurality of identification points on the L2 laminate also needs to be identified and stored in the memory, and meanwhile, after the obtained position information of a plurality of identification points on the L2 laminate is compared with the position information of a plurality of identification points on the L1 laminate, the identification points on the two L laminates are in one-to-one correspondence, and the L2 laminate is placed on the L1 laminate, so that the L2 laminate is superposed with the same connecting nodes on the L1 laminate, and the same connecting nodes are connected after subsequent corresponding chemical treatment. Further, when grabbing the Ln laminate of L3 and later by using the manipulator to perform a mode, stacking can be performed after corresponding a plurality of identification points on the L laminate to a plurality of identification points on the last placed L laminate by referring to the mode of placing the L2 laminate, so that the identification points of the upper and lower two adjacent L laminates are correspondingly overlapped, and then the connection nodes in the adjacent L laminates are in one-to-one correspondence, thereby reducing the stacking error rate and improving the production efficiency.
The utility model provides a printed circuit board production facility, through set up the manipulator on the removal track of pressfitting machine one side to in control system's control action, make the manipulator remove the position in corresponding special layer board, inner plating memory area or outer plywood memory area, place on work platform with each plywood, inner plating or the outer plywood of snatching Ln plywood, outer plywood, utilize the pressfitting effect of pressfitting machine, thereby form inner plating, outer plywood or PCB board, thereby realize the effect of intelligent mechanized operation. Meanwhile, the cutting machine and the chemical processing equipment are arranged, so that an outer layer board or a PCB board processed and formed on the working platform can be conveniently transmitted to the cutting machine through the conveying belt to be cut, and meanwhile, the PCB board can be transmitted to the chemical processing equipment to be subjected to corresponding chemical processing, such as exposure and development processing and the like, so that the complete structure is formed. Through the exposed core at manipulator sets up the centre gripping sucking disc, in order to grab corresponding Ln plywood through the mode of vacuum absorption, each plywood (can be the PP board) of outer plywood, the copper foil board, the steel sheet, kraft paper or blotter), inner plating or outer plywood to work platform on, simultaneously at the in-process that the pile formed the inner plywood, can utilize recognition device on the manipulator to discern the identification point on the L plywood, thereby make the identification point position on the Ln plywood of grabbing and last place the identification point position on the Ln-1 plywood on work platform right-hand, thereby make the identification point of two adjacent L plywoods from top to bottom correspond the coincidence each other, and then make the connected node in the adjacent L plywood carry out the one-to-one, in order to reduce the pile error rate, and improve production efficiency.
Drawings
Fig. 1 is a method flowchart of a method of controlling a printed circuit board manufacturing apparatus of the present invention.
FIG. 2 is a flow chart of the method of the inner layer board laminating step of the present invention.
FIG. 3 is a schematic diagram illustrating a lamination process of the inner layer board according to the present invention.
Fig. 4 is a layout diagram of the overall structure of the present invention.
Fig. 5 is a structural view of a PCB panel of the present invention.
In the figure: 1. a pressing machine; 11. a working platform; 12. pushing the positioning device; 13. a conveyor belt; 2. a moving track; 21. a manipulator; 211. a suction cup; 212. an identification device; 3. a special supporting plate; 4. an inner-layer board storage area; 5. an outer plate storage area; 6. a cutter; 7. a chemical processing apparatus; 8. a PCB board; 81. an inner layer board; 811. an L-layer plate; 812. identifying a point; 82. an outer plate; 821. a PP plate; 822. a copper foil plate; 823. a steel plate; 824. a cushion pad.
Detailed Description
The invention is described in further detail below with reference to the figures and the specific embodiments. In the present specification, the terms "upper", "inner", "middle", "left", "right" and "one" are used for clarity of description only, and are not used to limit the scope of the present invention, and the relative relationship between the terms and the modifications may be regarded as the scope of the present invention without substantial technical changes.
Referring to fig. 1 to 5, a printed circuit board production equipment comprises a laminating machine 1 provided with a working platform 11, a moving track 2 is arranged on one side of the laminating machine 1, a mechanical arm 21 is arranged on the moving track 2, a plurality of special supporting plates 3 used for placing each L-shaped laminate 811 of an inner laminate 81 and inner and outer laminates 81 and 82 storage areas 4 and 5 used for placing the inner and outer laminates 81 and 82 are arranged on one side of the moving track 2 away from the laminating machine 1, a conveying belt is installed at a discharge port of the laminating machine 1 of the working platform 11, and a cutting machine 6 and a chemical treatment device 7 are respectively arranged at the tail end of the conveying belt along the conveying direction.
Specifically, the manipulator 21 is arranged on the moving track 2 on one side of the laminating machine 1, so that the control function of the control system can be realized, the manipulator 21 can move the corresponding position of the special supporting plate 3, the inner layer plate 81 storage area 4 or the outer layer plate 82 storage area 5 to grab each layer plate of the Ln layer plate and the outer layer plate 82, the inner layer plate 81 or the outer layer plate 82 and place the layer plate on the working platform 11, and the inner layer plate 81, the outer layer plate 82 or the PCB plate 8 can be formed by utilizing the laminating function of the laminating machine 1, so that the intelligent mechanical operation function can be realized. Meanwhile, the cutting machine 6 and the chemical processing device 7 are arranged, so that the outer layer board 82 or the PCB board 8 processed and formed on the working platform 11 can be conveyed to the cutting machine 6 through the conveying belt for cutting, and meanwhile, the PCB board 8 can be conveyed to the chemical processing device 7 for corresponding chemical processing, such as exposure and development processing, so as to form a complete product.
The clamping end of the manipulator 21 is provided with a plurality of clamping suckers 211 which are arranged in an array, the clamping end of the manipulator 21 is provided with a recognition device 212 for recognition, and the recognition device 212 is connected with the control system. Specifically, by providing the holding suction cups 211 at the holding ends of the robot 21, each of the Ln laminate, the outer laminate 82 (which may be a PP plate 821, a copper foil plate 822, a steel plate 823, kraft paper or a cushion 824), the inner laminate 81 or the outer laminate 82 can be held on the working platform 11 by vacuum suction, meanwhile, in the process of stacking and forming the inner layer plate 81, the recognition device 212 on the robot 21 can be used for recognizing the recognition point 812 on the L layer plate 811, so that the position of the recognition point 812 on the grasped Ln laminate is used in comparison with the position of the recognition point 812 on the last Ln-1 laminate placed on the working platform 11, so that the identification points 812 of the upper and lower adjacent L-laminates 811 are correspondingly overlapped with each other, and then the connection nodes in the adjacent L-layer boards 811 are in one-to-one correspondence, so as to reduce the stacking error rate and improve the production efficiency.
Working platform 11 of pressfitting machine 1 is the cuboid form, and all be provided with around working platform 11 and promote positioner 12, and promotion positioner 12 includes the promotion jar (not shown in the figure) of being connected with working platform 11, and the promotion jar direction level of promotion jar is placed the face center towards working platform 11 and is set up, and the promotion end of promotion jar is provided with the kickboard (not shown in the figure), and the side that the kickboard kept away from the promotion jar is provided with the buffer layer (not shown in the figure). Specifically, by arranging the pushing positioning device, after the outer plate 82, the inner plate 81 and the outer plate 82 are sequentially stacked on the working platform 11 by using the manipulator 21, the pushing cylinder can push the extending pushing plate to be extended, so that the peripheries of the buffer layer of the pushing plate and the stacked PCB 8 are abutted against each other, and the edges of the adjacent inner plate 81 and the outer plate 82 are aligned with each other.
According to the mechanical structure of the printed circuit board production equipment, the following control method for the printed circuit board production equipment is formed, and the specific method is as follows:
referring to fig. 1 to 5, a method for controlling a printed circuit board manufacturing apparatus includes an inner board laminating step, an outer board laminating step, and an inner board and outer board combining and laminating step;
the laminating step of the A inner layer plate comprises the following steps:
s10: after receiving the inner layer plate laminating processing information sent by the control system, the control system acquires the stacking sequence of each L layer plate in the inner layer plates, each L layer plate is respectively defined as an L1 layer, an L2 layer plate, a … layer plate and an Ln layer plate according to the stacking sequence, a manipulator of the production equipment grabs the L1 layer plate and flatly places the L1 layer plate on a processing platform, then identifies a plurality of identification points on the L1 layer plate, acquires the position information of the identification points on the L1 layer plate and stores the acquired position information into a memory;
s20: a manipulator of the production equipment grabs the L2 laminate, identifies a plurality of identification points on the L2 laminate, acquires position information of the plurality of identification points on the L2 laminate, stores the acquired position information into a memory, compares the acquired position information of the plurality of identification points on the L2 laminate with the position information of the plurality of identification points on the L1 laminate, enables the plurality of identification points on the L2 laminate to be in one-to-one correspondence with the plurality of identification points on the L1 laminate, and then flatly places the L2 laminate on the L1 laminate;
s30: according to the mode of horizontally placing the L2 layer plate in the step S20, a next L3 layer plate is grabbed by a mechanical hand and horizontally placed on a last L2 layer plate until all L layer plates are stacked, then pressing treatment and chemical exposure development treatment are carried out to form an inner layer plate, and the mechanical hand places the inner layer plate formed by pressing in an inner layer plate storage area;
b, outer laminated plate pressing step:
s40: the method comprises the steps that after a control system receives outer-layer plate pressing processing information sent by the control system, the stacking sequence of each layer plate is obtained, a mechanical arm of production equipment sequentially stacks PP plates, copper foil plates, steel plates and cushion pads on a processing platform according to the stacking sequence of each layer plate of the outer layer plates, the appearances of the layer plates are aligned with each other, then pressing processing is carried out to form the outer layer plates, and the mechanical arm places the formed outer layer plates in an outer-layer plate storage area;
c, combining and laminating the inner layer plate and the outer layer plate:
s50: after control system received the inner plating and outer plywood pressfitting information that control system sent, the manipulator snatched outer plywood on the outer plywood storage area and kept flat on processing platform, and make the PP board of outer plywood set up, the manipulator snatched inner plating on the inner plating storage area and kept flat on processing platform's outer plywood after that, and make the appearance of inner plating align with the appearance of outer plywood, the manipulator snatchs outer plywood on the outer plywood storage area and keeps flat on processing platform's inner plating after that, make the PP board of this outer plywood set up down, and make the appearance of this outer plywood and inner plating align, then form the PCB board after carrying out pressfitting processing and cutting processing respectively.
Specifically, the inner layer board, the outer layer board and the PCB are formed by stacking and laminating through setting three steps of an inner layer board laminating step, an outer layer board laminating step and an inner layer board and outer layer board combining and laminating step. In the inner layer plate laminating step, under the control of a control system, the stacking sequence of each L layer plate of the inner layer plate is named in sequence: the laminated plates include L1 laminated plates, L2 laminated plates, … laminated plates and Ln laminated plates, and the positions of a plurality of identification points in each L laminated plate are the same due to the consistent appearance of each L laminated plate. Therefore, when the L1 laminate is stacked, the position information of a plurality of identification points on the L1 laminate is simultaneously identified and stored in the memory for subsequent processing; then when stacking the L2 laminate, the position information of a plurality of identification points on the L2 laminate also needs to be identified and stored in the memory, and meanwhile, after the obtained position information of a plurality of identification points on the L2 laminate is compared with the position information of a plurality of identification points on the L1 laminate, the identification points on the two L laminates are in one-to-one correspondence, and the L2 laminate is placed on the L1 laminate, so that the L2 laminate is superposed with the same connecting nodes on the L1 laminate, and the same connecting nodes are connected after subsequent corresponding chemical treatment. Further, when grabbing the Ln laminate of L3 and later by using the manipulator to perform a mode, stacking can be performed after corresponding a plurality of identification points on the L laminate to a plurality of identification points on the last placed L laminate by referring to the mode of placing the L2 laminate, so that the identification points of the upper and lower two adjacent L laminates are correspondingly overlapped, and then the connection nodes in the adjacent L laminates are in one-to-one correspondence, thereby reducing the stacking error rate and improving the production efficiency.
Referring to fig. 1 to 5, in the inner layer plate laminating step, the shape and size of each L layer plate of the inner layer plate are consistent, and the structure of a plurality of identification points arranged on the L layer plate is as follows: the identification points of the L-layer plate are circular, serial numbers are sprayed in the circular identification points, the serial numbers of the identification points of the L-layer plate are identical, and the serial numbers of the identification points of the L-layer plates of the inner-layer plate are sequentially arranged and sequenced according to the stacking sequence of the L-layer plates of the inner-layer plate.
Specifically, in the step, the structures of the identification points on the L-layer plates are limited, the serial numbers are sprayed in the circular shape of the identification points, and the serial numbers of the identification points of the plurality of L-layer plates of the inner-layer plate are sorted according to the stacking sequence of the plurality of L-layer plates of the inner-layer plate, so that in the identification process, whether the serial numbers in the identification points correspond to the serial numbers in the stacking sequence of the current L-layer plate can be identified while the identification points of the corresponding L-layer plate are identified at first, so that the identification and judgment in the stacking process are facilitated, the condition that the stacking sequence is wrong is reduced, and the beneficial effect of improving the stacking accuracy is achieved.
The L-shaped laminate is rectangular, the number of the identification points on the L-shaped laminate is three, the three identification points of the L-shaped laminate are respectively positioned at three vertex angles on the front surface of the plane of the L-shaped laminate, and one of the identification points is respectively vertical to a connecting line of the other two identification points.
Specifically, the position relation of three identification points on the L-layer plate is limited, so that the connecting line of one identification point and the other two identification points is vertical, after the identification device identifies the circle center coordinate positions of the three identification points, the positions of the corresponding identification points which are connected with the other two identification points and vertical to each other can be obtained through corresponding vector calculation, and as each L-layer plate has the identification point with identification and characteristic, when the identification point on the L-layer plate and the identification point on the L-layer plate which is horizontally placed are aligned, the identification points with identification and characteristic are firstly aligned, and then the two identification points are aligned, so that the beneficial effect of improving the efficiency of aligning the adjacent L-layer plates is achieved.
Referring to fig. 1 to 5, in the inner layer plate laminating step, each L layer plate is numbered according to a stacking order of a plurality of L layer plates in the inner layer plate, where the number is set to i ═ n, where n is an integer, a coordinate system is established on a plane of the L layer plate on the nth layer to be grasped, and coordinates of centers of circles of three identification points in each L layer plate grasped by the manipulator are defined as follows:
ai (Ai, bi): the coordinate value of the circle center of the recognition point which is vertical to the connecting line of the other two recognition points;
bi (Ci, di) and Ci (ei, fi): circle center coordinate values of the other two identification points are respectively;
by the above definition, obtaining the vector AiBi ═ ci ═ Ai, di-bi, and the vector AiCi ═ ei-Ai, fi-bi, and then obtaining the model length | AiBi | ═ Li1 of the vector AiBi, and obtaining the model length | AiCi | ═ Li2 of the vector AiCi, taking the coordinate Ai (Ai, bi) as a new coordinate origin, taking the length direction of the vector AiBi as a new X axis, and taking the length direction of the vector AiCi as a new Y axis, then obtaining the coordinate values of the centers of the three recognition points as: ai (0,0), Bi (Ci,0), Ci (0, fi), where | Ci | ═ Li1, | fi | ═ Li 2;
therefore, in step S10, when the robot grips the L1 laminate and places the laminate on the working platform, the a1 coordinate of the L1 laminate is made to coincide with the mechanical origin coordinate on the working platform, and the X axis and the Y axis of the newly established coordinate system on the L1 laminate are made to coincide with the X axis and the Y axis of the mechanical coordinate system on the working platform, respectively;
further during step S20, when the robot grips the L2 layer and lays flat on the L1 layer on the work platform, the a2 coordinate of the L2 layer also corresponds to the mechanical origin coordinate on the work platform; when the coordinates B2(c2,0) on the L2 laminate and the coordinates B1(c1,0) on the L1 laminate satisfy: when | c1| ═ c2|, the recognition point corresponding to the circle center coordinate B2(c2,0) and the recognition point corresponding to the circle center coordinate B1(c1,0) are overlapped and correspond to each other by the manipulator, and then the L2 laminate is laid flat; if not, superposing and corresponding the identification point corresponding to the circle center coordinate C2(0, f2) and the identification point corresponding to the circle center coordinate B1(C1,0), and then horizontally placing the L2 laminate;
further in step S30, the L3 plies are laid flat according to the above-described manner of laying the L2 plies flat until the stack completes all the L plies.
Specifically, in the process of stacking each L-layer plate of the inner-layer plate, the center coordinates of three identification points are obtained by taking the plane of the grabbed L-layer plate as a reference plane, further, the point a with identification and characteristics is taken as an original point, the vector AiBi is taken as a new X axis, the vector AiCi is taken as a new Y axis, and a new coordinate system is established, so that the center coordinate values corresponding to the three identification points are obtained, the original point coordinate a of the new coordinate system in the grabbed L1 is coincided with the original point of the mechanical coordinate on the working platform, and the X axis and the Y axis of the newly established coordinate system on the L1-layer plate are coincided with the X axis and the Y axis of the mechanical coordinate system on the working platform respectively; therefore, in the subsequent stacking process, a new coordinate system is only needed to be established on the captured L-layer coordinates, corresponding coordinates of An point, a point Bn and a point Cn are obtained at the same time, then the coordinates of the An point are overlapped with the mechanical origin coordinates on the working platform, the absolute value of the X coordinate of the point Bn is compared with the absolute value of the X coordinate of the last placed point Bn-1, if the absolute values of the two are equal, the identification point corresponding to the circle center coordinate Bn (Cn,0) is overlapped with the identification point corresponding to the circle center coordinate Bn-1(Cn-1,0) through the manipulator, and then the Ln-1 laminate is laid horizontally; if not, the identification points corresponding to the circle center coordinates Cn (0, fn) are overlapped and correspond to the identification points corresponding to the circle center coordinates Bn-1(Cn-1,0), and then the Ln-1 laminate is horizontally placed, so that the acquisition and corresponding modes of the identification points in the adjacent layers are specified, the operation speed of the computer is increased, the identification points of the upper and lower adjacent L laminates are overlapped correspondingly, the connecting nodes in the adjacent L laminates are in one-to-one correspondence, the stacking error rate is reduced, and the production efficiency is improved.
Referring to fig. 1 to 5, in the outer plate lamination process, after the outer plate is formed by the lamination process and before the outer plate is placed in the outer plate storage area by the manipulator, the outer plate is conveyed to a cutting device by a conveyor belt, and the outer plate is cut by the cutting device, so that the outer shape of the outer plate is consistent with the outer shape of the inner plate. Specifically, go on just to the outer plywood border that processes through setting up the cutting machine, the appearance of outer plywood aligns with the appearance border of inner plating, this operation is convenient for follow-up in merging pressfitting operating procedure to inner plating and outer plywood, make the border of adjacent plywood from top to bottom align, and then utilize the pressfitting machine to wholly receive the hot pressfitting time-sharing, can be so that adjacent inner plating and outer plywood surface heating from top to bottom is even, and then reach the firm effect of pressfitting, so that the condition of separation appears in adjacent inner plating and outer plywood in the reduction.
In the step of combining and pressing the inner layer plate and the outer layer plate, after the outer layer plate, the inner layer plate and the outer layer plate are grabbed by a mechanical arm and placed on a working platform, pushing and positioning devices which are positioned on the periphery of the working platform in production equipment are utilized to push and extrude the edges of the stacked outer layer plate and the stacked inner layer plate, so that the appearance edges of the outer layer plate, the inner layer plate and the stacked outer layer plate are aligned. Specifically, when outer plates, inner plates and outer plates are stacked in sequence and combined and pressed, the edges of the outer plates and the edges of the inner plates are pushed and positioned by the aid of the pushing and positioning devices, so that the situation that adjacent inner plates and adjacent outer plates are staggered and separated is reduced.
The embodiments of the present invention are not limited thereto, and according to the above-mentioned contents of the present invention, the present invention can be modified, substituted or combined in other various forms without departing from the basic technical idea of the present invention.

Claims (9)

1. A control method of printed circuit board production equipment is characterized in that: the method comprises an inner layer plate laminating step, an outer layer plate laminating step, and an inner layer plate and an outer layer plate combining and laminating step;
the laminating step of the A inner layer plate comprises the following steps:
s10: after receiving the inner layer plate laminating processing information sent by the control system, the control system acquires the stacking sequence of each L layer plate in the inner layer plates, each L layer plate is respectively defined as an L1 layer, an L2 layer plate, a … layer plate and an Ln layer plate according to the stacking sequence, a manipulator of the production equipment grabs the L1 layer plate and flatly places the L1 layer plate on a processing platform, then identifies a plurality of identification points on the L1 layer plate, acquires the position information of the identification points on the L1 layer plate and stores the acquired position information into a memory;
s20: a manipulator of the production equipment grabs the L2 laminate, identifies a plurality of identification points on the L2 laminate, acquires position information of the plurality of identification points on the L2 laminate, stores the acquired position information into a memory, compares the acquired position information of the plurality of identification points on the L2 laminate with the position information of the plurality of identification points on the L1 laminate, enables the plurality of identification points on the L2 laminate to be in one-to-one correspondence with the plurality of identification points on the L1 laminate, and then flatly places the L2 laminate on the L1 laminate;
s30: according to the mode of horizontally placing the L2 layer plate in the step S20, a next L3 layer plate is grabbed by a mechanical hand and horizontally placed on a last L2 layer plate until all L layer plates are stacked, then pressing treatment and chemical exposure development treatment are carried out to form an inner layer plate, and the mechanical hand places the inner layer plate formed by pressing in an inner layer plate storage area;
b, outer laminated plate pressing step:
s40: the method comprises the steps that after a control system receives outer-layer plate pressing processing information sent by the control system, the stacking sequence of each layer plate is obtained, a mechanical arm of production equipment sequentially stacks PP plates, copper foil plates, steel plates and cushion pads on a processing platform according to the stacking sequence of each layer plate of the outer layer plates, the appearances of the layer plates are aligned with each other, then pressing processing is carried out to form the outer layer plates, and the mechanical arm places the formed outer layer plates in an outer-layer plate storage area;
c, combining and laminating the inner layer plate and the outer layer plate:
s50: after control system received the inner plating and outer plywood pressfitting information that control system sent, the manipulator snatched outer plywood on the outer plywood storage area and kept flat on processing platform, and make the PP board of outer plywood set up, the manipulator snatched inner plating on the inner plating storage area and kept flat on processing platform's outer plywood after that, and make the appearance of inner plating align with the appearance of outer plywood, the manipulator snatchs outer plywood on the outer plywood storage area and keeps flat on processing platform's inner plating after that, make the PP board of this outer plywood set up down, and make the appearance of this outer plywood and inner plating align, then form the PCB board after carrying out pressfitting processing and cutting processing respectively.
2. The control method of a printed circuit board production apparatus according to claim 1, characterized in that: in the inner layer plate laminating step, the shape and the size of each L layer plate of the inner layer plate are consistent, and the structures of a plurality of identification points arranged on the L layer plates are as follows: the identification points of the L-layer plate are circular, serial numbers are sprayed in the circular identification points, the serial numbers of the identification points of the L-layer plate are identical, and the serial numbers of the identification points of the L-layer plates of the inner-layer plate are sequentially ordered according to the stacking sequence of the L-layer plates of the inner-layer plate.
3. The control method of a printed circuit board production apparatus according to claim 2, characterized in that: the L-shaped laminate is rectangular, the number of the identification points on the L-shaped laminate is three, the three identification points of the L-shaped laminate are respectively positioned at three vertex angles on the front surface of the plane of the L-shaped laminate, and one of the identification points is respectively vertical to a connecting line of the other two identification points.
4. A control method of a printed circuit board production apparatus according to claim 3, characterized in that: in the inner plate pressfitting step, numbering each L plywood according to the stacking order of a plurality of L plywoods in the inner plate, setting the serial number as i and becoming n, wherein n is the integer, establishing the coordinate system on the plane of the L plywood of the nth layer that snatchs, carrying out the following definition to the centre of a circle coordinate of three identification point in each L plywood that the manipulator snatched:
ai (Ai, bi): the coordinate value of the circle center of the recognition point which is vertical to the connecting line of the other two recognition points;
bi (Ci, di) and Ci (ei, fi): circle center coordinate values of the other two identification points are respectively;
by the above definition, obtaining the vector AiBi ═ ci ═ Ai, di-bi, and the vector AiCi ═ ei-Ai, fi-bi, and then obtaining the model length | AiBi | ═ Li1 of the vector AiBi, and obtaining the model length | AiCi | ═ Li2 of the vector AiCi, taking the coordinate Ai (Ai, bi) as a new coordinate origin, taking the length direction of the vector AiBi as a new X axis, and taking the length direction of the vector AiCi as a new Y axis, then obtaining the coordinate values of the centers of the three recognition points as: ai (0,0), Bi (Ci,0), Ci (0, fi), where | Ci | ═ Li1, | fi | ═ Li 2;
therefore, in step S10, when the robot grips the L1 laminate and places the laminate on the working platform, the a1 coordinate of the L1 laminate is made to coincide with the mechanical origin coordinate on the working platform, and the X axis and the Y axis of the newly established coordinate system on the L1 laminate are made to coincide with the X axis and the Y axis of the mechanical coordinate system on the working platform, respectively;
further during step S20, when the robot grips the L2 layer and lays flat on the L1 layer on the work platform, the a2 coordinate of the L2 layer also corresponds to the mechanical origin coordinate on the work platform; when the coordinates B2(c2,0) on the L2 laminate and the coordinates B1(c1,0) on the L1 laminate satisfy: when | c1| ═ c2|, the recognition point corresponding to the circle center coordinate B2(c2,0) and the recognition point corresponding to the circle center coordinate B1(c1,0) are overlapped and correspond to each other by the manipulator, and then the L2 laminate is laid flat; if not, superposing and corresponding the identification point corresponding to the circle center coordinate C2(0, f2) and the identification point corresponding to the circle center coordinate B1(C1,0), and then horizontally placing the L2 laminate;
further in step S30, the L3 plies are laid flat according to the above-described manner of laying the L2 plies flat until the stack completes all the L plies.
5. The control method of a printed circuit board production apparatus according to claim 1, characterized in that: in the step of outer plate pressing, after the outer plate is formed through pressing treatment, and before the outer plate formed is placed in the outer plate storage area by the manipulator, the outer plate is conveyed to cutting equipment through a conveying belt, and the outer shape of the outer plate is cut by the cutting equipment, so that the outer shape of the outer plate is consistent with the outer shape of the inner plate in size.
6. The control method of a printed circuit board production apparatus according to claim 1, characterized in that: in the step of combining and pressing the inner layer plate and the outer layer plate, after the outer layer plate, the inner layer plate and the outer layer plate are grabbed by a mechanical arm and placed on a working platform, pushing and positioning devices which are positioned on the periphery of the working platform in production equipment are utilized to push and extrude the edges of the stacked outer layer plate and the stacked inner layer plate, so that the appearance edges of the outer layer plate, the inner layer plate and the stacked outer layer plate are aligned.
7. A printed circuit board production facility which characterized in that: including the pressfitting machine that is provided with work platform, one side of pressfitting machine is provided with the removal track, be provided with the manipulator on the removal track, it keeps away from to remove the track one side of pressfitting machine is arranged and is provided with a plurality of special layer boards that are used for placing each L plywood of inner plating respectively and is used for placing inner plating and outer plywood's inner plating memory area and outer plywood memory area respectively, work platform's pressfitting machine's discharge gate is provided with the conveyer belt, the conveyer belt is provided with cutting machine and chemical treatment equipment respectively along direction of delivery's end.
8. A printed circuit board production apparatus according to claim 7, wherein: the clamping end of the manipulator is provided with a plurality of clamping suckers arranged in an array mode, the clamping end of the manipulator is provided with a recognition device used for recognition, and the recognition device is connected with the control system.
9. A printed circuit board production apparatus according to claim 7, wherein: all be provided with around the work platform of pressfitting machine and promote positioner, promote positioner include with the promotion jar that work platform connects, the promotion jar direction level orientation of promotion jar the work platform is placed a center and is set up, the promotion end of promotion jar is provided with the slurcam, the slurcam is kept away from the side of promotion jar is provided with the buffer layer.
CN202110803838.4A 2021-07-16 2021-07-16 Control method of printed circuit board production equipment and printed circuit board production equipment Active CN113498276B (en)

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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101808467A (en) * 2010-03-26 2010-08-18 深南电路有限公司 Lamination lay-up system and transfer machine thereof
CN105376964A (en) * 2015-12-03 2016-03-02 中山市惠亚线路版有限公司 Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board
CN109561605A (en) * 2018-12-14 2019-04-02 深圳市景旺电子股份有限公司 A kind of multi-layer board presses grasping means and the preparation method of sandwich plate of harmomegathus data

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101808467A (en) * 2010-03-26 2010-08-18 深南电路有限公司 Lamination lay-up system and transfer machine thereof
CN105376964A (en) * 2015-12-03 2016-03-02 中山市惠亚线路版有限公司 Multilayer circuit board expansion and shrinkage coefficient obtaining method and manufacturing method of multilayer circuit board
CN109561605A (en) * 2018-12-14 2019-04-02 深圳市景旺电子股份有限公司 A kind of multi-layer board presses grasping means and the preparation method of sandwich plate of harmomegathus data

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Denomination of invention: Control methods for printed circuit board production equipment and printed circuit board production equipment

Granted publication date: 20220712

Pledgee: Guangdong Fengshun Rural Commercial Bank Co.,Ltd. Tangkeng Branch

Pledgor: FENGSHUN COUNTY JINSHUN TECHNOLOGY CO.,LTD.

Registration number: Y2024980006526