CN113492115B - Clamping mechanism and machining process - Google Patents
Clamping mechanism and machining process Download PDFInfo
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- CN113492115B CN113492115B CN202010199413.2A CN202010199413A CN113492115B CN 113492115 B CN113492115 B CN 113492115B CN 202010199413 A CN202010199413 A CN 202010199413A CN 113492115 B CN113492115 B CN 113492115B
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- 230000007246 mechanism Effects 0.000 title claims abstract description 32
- 238000003754 machining Methods 0.000 title description 2
- 238000001179 sorption measurement Methods 0.000 claims abstract description 132
- 239000003292 glue Substances 0.000 claims abstract description 73
- 238000005516 engineering process Methods 0.000 claims abstract description 11
- 238000000034 method Methods 0.000 claims description 20
- 230000008569 process Effects 0.000 claims description 16
- 230000009471 action Effects 0.000 claims description 7
- 230000001174 ascending effect Effects 0.000 claims description 3
- 238000003825 pressing Methods 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 claims 2
- 238000004026 adhesive bonding Methods 0.000 abstract description 10
- 238000004140 cleaning Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 238000005056 compaction Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 238000010073 coating (rubber) Methods 0.000 description 2
- 230000005574 cross-species transmission Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000007789 sealing Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 230000007306 turnover Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/10—Cleaning by methods involving the use of tools characterised by the type of cleaning tool
- B08B1/14—Wipes; Absorbent members, e.g. swabs or sponges
- B08B1/143—Wipes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16B—DEVICES FOR FASTENING OR SECURING CONSTRUCTIONAL ELEMENTS OR MACHINE PARTS TOGETHER, e.g. NAILS, BOLTS, CIRCLIPS, CLAMPS, CLIPS OR WEDGES; JOINTS OR JOINTING
- F16B11/00—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding
- F16B11/006—Connecting constructional elements or machine parts by sticking or pressing them together, e.g. cold pressure welding by gluing
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- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Casings For Electric Apparatus (AREA)
Abstract
The application relates to the technical field of processing of electronic equipment, in particular to a clamping mechanism and a processing technology. The clamping mechanism comprises a first auxiliary plate and a second auxiliary plate, the first auxiliary plate is arranged on the first side of the electronic equipment, and the second auxiliary plate is arranged on the second side of the electronic equipment; one of the first adsorption plate and the second adsorption plate is provided with a first adsorption part, the other one of the first adsorption plate and the second adsorption plate is provided with a second adsorption part or a part to be adsorbed, and the first adsorption plate and the second adsorption plate are adsorbed by the second adsorption part or the part to be adsorbed and the first adsorption part so as to clamp the electronic equipment. Because first attaching plate and second attach the board and adsorb each other with the electronic equipment centre gripping, consequently do not need first attaching plate of extra holder centre gripping and second to attach the board, electronic equipment when carrying out glue and cleaning, first attaching plate and second attach the board and can centre gripping electronic equipment always, firmly grasp electronic equipment, glue bonding department was pulled open when avoiding cleaning electronic equipment, has alleviated the problem that the electronic equipment bonding strength that prior art processed is low.
Description
Technical Field
The application relates to the technical field of processing of electronic equipment, in particular to a clamping mechanism and a processing technology.
Background
After the touch pad is bonded with the middle frame, joint filling is needed, glue can overflow through joint filling, the overflowing glue needs to be cleaned, and a common pre-pressure-maintaining integrated scheme cannot be adopted. Therefore need take out electronic equipment after the pre-compaction and clean electronic equipment business turn over, then carry out the pressurize, but at the transfer in-process, stress release leads to the touch pad perk after the pressure is relieved, and then leads to glue to be pulled open the layering, and layering glue can bond together again and form the hole after the pressurize, leads to glue bonding strength to descend.
Disclosure of Invention
The application aims to provide the clamping mechanism and the processing technology, and the problem that the bonding strength of electronic equipment processed by the prior art is low is solved.
The above and other objects are achieved by the features of the independent claims. Further implementations are presented in the dependent claims, the description and the drawings.
In a first aspect, there is provided a clamping mechanism comprising:
the first auxiliary board is arranged on a first side of the electronic equipment;
a second accessory plate disposed on a second side of the electronic device;
one of the first adsorption plate and the second adsorption plate is provided with a first adsorption part, the other one of the first adsorption plate and the second adsorption plate is provided with a second adsorption part or a part to be adsorbed, and the first adsorption plate and the second adsorption plate are adsorbed by adsorbing the second adsorption part or the part to be adsorbed and the first adsorption part so as to clamp the electronic equipment.
Because first attach board and second and attach the board and adsorb the electronic equipment centre gripping each other, consequently do not need the first board and the second that attach of extra holder centre gripping to attach, electronic equipment is when carrying out glue and cleans the operation, first attach board and second attach the board and are located electronic equipment's upper and lower side, can avoid the frictioning route, make first attach board and second attach the board and can centre gripping electronic equipment always, can firmly grasp electronic equipment, glue film bonding department is pulled open when avoiding cleaning electronic equipment, the electronic equipment bonding strength who has avoided processing is low.
In a possible implementation manner, the clamping mechanism further includes a supporting plate, the supporting plate is used for supporting the electronic device, and the supporting plate is located between the first attached plate and the second attached plate.
The support plate can support the electronic device, and contact between the electronic device and other parts can be reduced.
In a possible implementation, the first attached plate is located below the second attached plate;
the first adsorption plate is provided with the first adsorption component, and the second adsorption plate is provided with the second adsorption component or the component to be adsorbed.
Because the first attached plate is heavier, the first attached plate is placed below the second attached plate, so that the first attached plate is also positioned below the electronic equipment, and the electronic equipment is prevented from being pressed.
In a possible implementation manner, the size of the second attached plate is smaller than that of the electronic device, so that the glue wiping path can be avoided when the glue is wiped, the first attached plate and the second attached plate can always clamp the electronic device, and the glue bonding position is prevented from being pulled open when the electronic device is wiped.
In a possible implementation manner, a through hole is formed in the support plate, and the first adsorption part extends into the through hole and adsorbs the second adsorption part or the part to be adsorbed.
The distance between the first adsorption part and the second adsorption part or the distance between the first adsorption part and the second adsorption part to be treated can be shortened through the through holes, and the adsorption effect is improved.
In a possible realization, at least one side of the support plate is provided with a protruding portion for gripping.
The setting of bellying is convenient for take of backup pad, has the convenient advantage of taking.
In a possible implementation manner, the supporting plate is further provided with a groove, and the groove is used for accommodating the electronic device to prevent the electronic device from moving.
In a possible implementation manner, the shape of the groove is matched with the shape of the electronic device, and when the electronic device is placed in the groove, the electronic device can be limited.
In one possible implementation, the clamping mechanism further comprises a shielding member connected to the supporting plate for shielding a side portion of the electronic device.
Because electronic equipment's lateral part is provided with the side key, makes glue enter into the side key during the point is glued easily, consequently this application covers the side key through the protection piece before the point is glued, makes protection piece and center lateral wall realize laminating sealedly, can avoid in the in-process glue that glues gets into the side key gap.
In a second aspect, a processing technology is also provided, which comprises the following steps:
placing a first accessory plate below the electronic equipment and placing a second accessory plate above the electronic equipment;
controlling the first attached plate and the second attached plate to be adsorbed mutually through the action of the first adsorption part and the second adsorption part; or controlling the first attached plate and the second attached plate to be adsorbed mutually through the interaction of the first adsorption part and the part to be adsorbed; and clamping the electronic equipment, and prepressing the electronic equipment.
Because first attach board and second and attach the board and adsorb the electronic equipment centre gripping each other, consequently do not need first attaching board of extra holder centre gripping and second to attach the board, electronic equipment is when carrying out glue and cleans the operation, first attaching board and second attach the board and are located electronic equipment's upper and lower side, can avoid wiping the gluey route, make first attaching board and second attach the board and can centre gripping electronic equipment always, glue film bonding department is pulled open when avoiding cleaning electronic equipment, the electronic equipment bonding strength who has avoided processing is low.
In a possible implementation mode, glue is dispensed to the middle frame, and then the touch panel assembly is placed on the middle frame and glued to form the electronic device. In a possible implementation manner, during the assembly process of the electronic device, the middle frame is placed on a supporting plate, the side keys on the side portion of the middle frame are protected by a protection piece positioned on the supporting plate, and then glue dispensing is performed.
The protection piece can cover the side key, avoids glue entering the side key gap in the process of dispensing.
In a possible implementation manner, the middle frame on the supporting plate is subjected to glue dispensing, the touch pad assembly is placed in the middle frame, and the touch pad assembly and the middle frame are bonded to form the electronic device;
and the convex part of the supporting plate is grabbed by a glue dispenser.
Place center and touch pad subassembly in the backup pad, can avoid equipment and center and touch pad subassembly contact, can be located the first top that attaches the board with the center through the bellying of centre gripping backup pad.
In a possible implementation manner, the first attached plate is placed on a base of a dispenser and is positioned below the support plate and the electronic equipment;
the first auxiliary plate is driven to ascend through the ascending of the base, so that the first auxiliary plate and the second auxiliary plate are adsorbed, the electronic equipment is clamped, and the electronic equipment is pre-pressed. The setting of base is used for supporting first attached plate, improves the first stability of attaching the board.
In a possible implementation manner, the edge of the electronic device is wiped in a prepressed mode, and the electronic device is clamped by the first attached plate and the second attached plate all the time in the wiping process. The adhesive layer is prevented from being pulled open when the electronic equipment is wiped, and the low bonding strength of the processed electronic equipment is avoided.
The technical scheme provided by the application can achieve the following beneficial effects:
the application provides a fixture, including first attached plate and second attached plate, in first attached plate and the second attached plate, one is provided with first adsorption element, and the other is provided with the second adsorption element or treats adsorption element, adsorbs first attached plate and second attached plate through second adsorption element or treat adsorption element and first adsorption element to centre gripping electronic equipment. Because first attach board and second and attach the board and adsorb each other with the electronic equipment centre gripping, consequently do not need first attached board of extra holder centre gripping and second to attach the board, therefore electronic equipment when carrying out glue and clean the operation, first attached board and second attach the board and can keep between the centre gripping electronic equipment always, can firmly grasp electronic equipment, and glue bonding department was pulled open when avoiding cleaning electronic equipment, has avoided the electronic equipment bonding strength who processes to hang down. The electronic equipment of this application carries out the pre-compaction after glue bonds, then cleans the glue at electronic equipment edge and carries out the pressurize again after, and whole process is first attaches board and second and attaches board centre gripping electronic equipment always, has consequently avoided electronic equipment's glue bonding department to be pulled open, and then has improved the cohesive strength of glue.
The processing technology provided by the application comprises the following steps: placing the first accessory plate below the electronic equipment and placing the second accessory plate above the electronic equipment; controlling the first attached plate and the second attached plate to be mutually adsorbed through the action of the first adsorption part and the second adsorption part; or the first attached plate and the second attached plate are controlled to be adsorbed mutually through the action of the first adsorption part and the part to be adsorbed; and clamping the electronic equipment, and prepressing the electronic equipment. Because first attach board and second and attach the board and adsorb the electronic equipment centre gripping each other, consequently do not need first attaching board of extra holder centre gripping and second to attach the board, electronic equipment is when carrying out glue and cleans the operation, first attaching board and second attach the board and are located electronic equipment's upper and lower side, can avoid wiping the gluey route, make first attaching board and second attach the board and can centre gripping electronic equipment always, glue film bonding department is pulled open when avoiding cleaning electronic equipment, the electronic equipment bonding strength who has avoided processing is low.
It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the application.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is an exploded view of a clamping mechanism provided in an embodiment of the present application;
FIG. 2 is a schematic structural diagram of a clamping mechanism according to an embodiment of the present disclosure;
FIG. 3 is a top view of a clamping mechanism provided in accordance with an embodiment of the present application;
fig. 4 is a sectional view based on the clamping mechanism shown in fig. 3;
fig. 5 is a cross-sectional view of a first electronic device according to an embodiment of the present application;
fig. 6 is a schematic diagram of a middle frame dispensing structure according to an embodiment of the present application;
FIG. 7 is a schematic structural diagram illustrating a middle frame and a touch pad assembly bonded according to an embodiment of the present disclosure;
FIG. 8 is a schematic structural diagram of a middle frame and a touch pad assembly after being rubbed with glue according to an embodiment of the present disclosure;
fig. 9 is a sectional view of a second electronic device according to an embodiment of the present application;
fig. 10 is a sectional view of a third electronic device according to an embodiment of the present application.
Reference numerals:
1-a first attached plate;
11-a first adsorption element;
2-a second accessory plate;
21-a second adsorption element;
3-a support plate;
31-a through hole;
32-a boss;
33-a groove;
4-a guard;
5-an electronic device;
51-middle frame;
52-touch pad assembly;
53-glue layer;
54-a battery;
55-battery cover;
56-connecting element.
The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present application and together with the description, serve to explain the principles of the application.
Detailed Description
For better understanding of the technical solutions of the present application, the following detailed descriptions of the embodiments of the present application are provided with reference to the accompanying drawings.
It should be understood that the embodiments described are only a few embodiments of the present application, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terminology used in the embodiments of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used in the examples of this application and the appended claims, the singular forms "a", "an", and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be understood that the term "and/or" as used herein is merely one type of association that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein generally indicates that the former and latter related objects are in an "or" relationship.
It should be noted that the terms "upper", "lower", "left", "right", and the like used in the embodiments of the present application are described in terms of the angles shown in the drawings, and should not be construed as limiting the embodiments of the present application. In addition, in this context, it will also be understood that when an element is referred to as being "on" or "under" another element, it can be directly on "or" under "the other element or be indirectly on" or "under" the other element through intervening elements.
In one embodiment, the present application is described in further detail by the following embodiments with reference to the accompanying drawings.
At present, some electronic equipment's touch pad subassembly and center bonding back need the caulking, and glue can spill over the edge of electronic equipment through caulking, need clean the glue that spills over, can not adopt ordinary pressurize integrative scheme in advance. Therefore, the electronic device needs to be wiped in and out after prepressing, and then pressure maintaining is performed, and the process route of the pressure maintaining scheme is as follows: dispensing → assembling → prepressing → applying glue → maintaining pressure.
The existing pressure maintaining scheme is that glue is firstly dispensed on a middle frame, then the touch panel assembly is aligned and assembled to be pre-pressed, and the electronic equipment and the plate bodies on the upper side and the lower side of the electronic equipment are clamped by the existing clamp through the clamping piece, so that the clamping piece can block rubber wiping in the rubber wiping process, the electronic equipment after pre-pressing needs to be taken out for rubber wiping, and the electronic equipment is placed in the pressure maintaining clamp after the rubber wiping is completed to maintain pressure and solidify glue. However, in the transferring process, after pressure is relieved, stress is released to lead the touch pad to tilt, glue is further pulled to be layered, air can enter the hollow air bag, the glue pulled after pressure maintaining is placed and bonded again, air holes can be formed in the middle of the glue or between the glue and a bonding interface, the bonding strength and the sealing performance of the glue are reduced, the water-proof reject ratio is greatly increased, and the problem is also known as secondary bonding of the glue. Therefore, the existing clamping mechanism and the processing technology need to be improved.
The clamping mechanism and the processing technology provided by the embodiment of the application mainly improve the bonding strength of the electronic equipment by improving the clamping mechanism and the processing technology.
FIG. 1 is an exploded view of a clamping mechanism provided in an embodiment of the present application; FIG. 2 is a schematic structural diagram of a clamping mechanism according to an embodiment of the present disclosure; FIG. 3 is a top view of a clamping mechanism provided in accordance with an embodiment of the present application; fig. 4 is a sectional view of the chucking mechanism shown in fig. 3. As shown in fig. 1 to 4, the present embodiment provides a clamping mechanism, which is mainly used for clamping an electronic device 5. The electronic equipment comprises a first attaching plate 1 and a second attaching plate 2, wherein the first attaching plate 1 is arranged on the first side of the electronic equipment 5, the second attaching plate 2 is arranged on the second side of the electronic equipment 5, one of the first attaching plate 1 and the second attaching plate 2 is provided with a first attaching part 11, the other one of the first attaching plate 1 and the second attaching plate 2 is provided with a second attaching part 21 or a part to be attached, and the first attaching plate 1 and the second attaching plate 2 are attached to clamp the electronic equipment 5 through the second attaching part 21 or the part to be attached to the first attaching part 11. Because first accessory plate 1 and second accessory plate 2 adsorb each other and centre gripping electronic equipment 5, consequently do not need first accessory plate 1 of extra holder centre gripping and second accessory plate 2, electronic equipment 5 is when carrying out glue and wiping the operation, first accessory plate 1 and second accessory plate 2 are located electronic equipment 5's upper and lower side, can avoid wiping the gluey route, make first accessory plate 1 and second accessory plate 2 centre gripping electronic equipment 5 always, can firmly grasp electronic equipment 5, glue film 53 bonding department is pulled open when avoiding wiping electronic equipment 5, the electronic equipment 5 bonding strength who has avoided processing is low.
The electronic device 5 of this application includes center 51 and touch pad subassembly 52, at the in-process that splices, need carry out the pre-compaction after gluing center 51 and touch pad subassembly 52, then will spill over to carry out the pressurize again after the glue at electronic device 5 edge is cleaned, the electronic device 5 is held always to the first accessory plate 1 of whole process and second accessory plate 2, consequently the glue film 53 of having avoided center 51 and touch pad subassembly 52 to bond the department is pulled open, and then the bonding strength of glue film 53 has been improved.
When the electronic device 5 is wiped, the wiping may be performed manually or by a glue wiper, but the edge of the electronic device 5 is generally wiped by a glue wiper for efficiency. The rubber coating machine adsorbs whole fixture through the mode of adsorption, then takes dustless cloth to clean the glue that overflows along the gap periphery of electronic equipment 5 through the gyro wheel of rubber coating machine, can realize that the periphery is cleaned the unblock.
When the first adsorption part 11 is fixedly arranged on the first adsorption plate 1, the second adsorption part 21 or the part to be adsorbed is fixedly arranged on the second adsorption plate 2; when the second adsorption plate 2 is fixedly provided with the first adsorption part 11, the first adsorption plate 1 is fixedly provided with a second adsorption part 21 or a part to be adsorbed; the first adsorption member 11 can adsorb the first adsorption plate 1 and the second adsorption plate 2 regardless of which adsorption plate is provided.
It should be noted that the first adsorption part 11 and the second adsorption part 21 may be configured as magnets, and the parts to be adsorbed may be configured as iron blocks, as long as the first adsorption plate 1 and the second adsorption plate 2 can be adsorbed, and the specific material is not limited herein.
As shown in fig. 1, the first attachment plate 1 is located below the second attachment plate 2, the first attachment plate 1 is provided with a first adsorption member 11, and the second attachment plate 2 is provided with a second adsorption member 21 or a member to be adsorbed.
When the second accessory plate 2 is provided with the part to be adsorbed, the second accessory plate 2 is placed above the first accessory plate 1, and the first accessory plate 1 can adsorb the second accessory plate 2 through the action of the first adsorption part 11 and the part to be adsorbed, so that the electronic equipment 5 is clamped; because the first accessory board 1 is heavier, the first accessory board 1 is placed below the second accessory board 2, so that the first accessory board 1 is also positioned below the electronic device 5, and the electronic device 5 is prevented from being pressed.
When the second adsorption part 21 is arranged on the second attaching plate 2, the second adsorption part 21 and the first adsorption part 11 are mutually adsorbed, so that the adsorption effect can be improved, the first attaching plate 1 and the second attaching plate 2 are firmly adsorbed, and the electronic device 5 is clamped; meanwhile, the first accessory board 1 is placed below the second accessory board 2 due to the weight of the first accessory board 1, and the electronic device 5 is prevented from being pressed.
Specifically, the first attachment plate 1 is provided with a plurality of lightening holes for reducing the weight of the first attachment plate 1.
Further, the top of the second attached plate 2 is provided with a handrail, so that the second attached plate 2 can be taken conveniently.
The size of the second attached plate 2 is smaller than that of the electronic device 5, so that the glue wiping path can be avoided during glue wiping, the electronic device 5 can be always clamped by the first attached plate 1 and the second attached plate 2, and the glue bonding position is prevented from being pulled apart during the glue wiping of the electronic device 5.
As shown in fig. 1 and 4, the clamping mechanism further includes a supporting plate 3, the electronic device 5 is placed on the supporting plate 3, and can be used for supporting the electronic device 5, and reducing the contact between the electronic device 5 and other components, and the supporting plate 3 is located between the first accessory plate 1 and the second accessory plate 2, that is, the supporting plate 3 and the electronic device 5 are both located between the first accessory plate 1 and the second accessory plate 2, and are clamped between the first accessory plate 1 and the second accessory plate 2.
Wherein the support plate 3 is further provided with a recess 33, the recess 33 being adapted to accommodate the electronic device 5. The shape of recess 33 and the shape looks adaptation of electronic equipment 5, when electronic equipment 5 placed in recess 33 back, can also play spacing effect to electronic equipment 5, avoid electronic equipment 5 to remove.
Specifically, the through hole 31 is formed in the support plate 3, the position of the through hole 31 corresponds to that of the first adsorption component 11, the first adsorption component 11 can conveniently stretch into the through hole 31, the distance between the first adsorption component 11 and the second adsorption component 21 is shortened, or the distance between the first adsorption component 11 and a component to be adsorbed is shortened, and the adsorption effect is improved.
Generally, four first adsorption parts 11 are provided, and every two first adsorption parts 11 are located on the same side of the first adsorption plate 1, and the two first adsorption parts 11 on the same side may be attached to each other or have a gap, which may be determined according to the size requirement of the electronic device 5.
When the second adsorption part 21 is arranged on the second adsorption plate 2, the two second adsorption parts 21 are arranged and positioned on two sides of the second adsorption plate 2, one second adsorption part 21 corresponds to the two first adsorption parts 11 on the same side of the first adsorption plate 1, and the central position formed by the two first adsorption parts 11 corresponds to the central position of the second adsorption part 21, so that the first adsorption plate 1 and the second adsorption plate 2 can be better adsorbed mutually, the adsorption force is strong, and the first adsorption plate 1 and the second adsorption plate 2 cannot deviate after being adsorbed.
When the second adsorption plate 2 is provided with two parts to be adsorbed, the two parts to be adsorbed are positioned on two sides of the second adsorption plate 2, one part to be adsorbed corresponds to the two first adsorption parts 11 on the same side of the first adsorption plate 1, and the central positions formed by the two first adsorption parts 11 correspond to the central positions of the parts to be adsorbed, so that the first adsorption plate 1 and the second adsorption plate 2 can be adsorbed better.
When a second adsorption part 21 and a to-be-adsorbed part are arranged on the second adsorption plate 2, one second adsorption part 21 corresponds to two first adsorption parts 11 on one side of the first adsorption plate 1, the to-be-adsorbed part corresponds to two first adsorption parts 11 on the other side of the first adsorption plate 1, the central position formed by the two first adsorption parts 11 on one side is arranged corresponding to the central position of the second adsorption part 21, and the central position formed by the two first adsorption parts 11 on the other side is arranged corresponding to the central position of the to-be-adsorbed part, so that the first adsorption plate 1 and the second adsorption plate 2 can be better adsorbed to each other.
Further, at least one side of the support plate 3 is provided with a convex part 32 for holding, so that the support plate 3 can be taken conveniently. When electronic equipment 5 is placed on backup pad 3, accessible operator snatchs bellying 32 and places backup pad 3 and electronic equipment 5 in and attach the board 1 and attach and carry out the centre gripping between the board 2 with the second in the first, have the convenient advantage of taking.
As shown in fig. 1, the clamping mechanism further includes a shielding member 4, and the shielding member 4 is connected to the support plate 3 for shielding a side portion of the electronic device 5. Because electronic equipment 5's lateral part is provided with the side key, make glue enter into the side key during the point is glued easily, this application covers the side key through protection piece 4 before the point is glued, makes protection piece 4 and center 51 lateral wall realize laminating sealed, can avoid getting into the side key gap at the in-process glue of point, has solved because the side key advances to glue the problem that the side key that leads to feels poor. While the tops of the side keys are lower than the surface of the electronic device 5, the placement of the guard 4 also does not hinder dispensing.
Wherein, the protection piece 4 can be fixedly connected with the supporting plate 3, and the protection piece 4 is prevented from falling.
The protection member 4 may be made of silicon gel so as to cover the side keys of the electronic device 5.
Fig. 5 is a cross-sectional view of a first electronic device according to an embodiment of the present application; fig. 6 is a schematic structural diagram of middle frame dispensing in an embodiment of the present application; FIG. 7 is a schematic structural diagram illustrating a middle frame and a touch pad assembly bonded according to an embodiment of the present disclosure; fig. 8 is a schematic structural diagram of the middle frame and the touch panel assembly after being rubbed with glue according to the embodiment of the application. As shown in fig. 5 to 8, based on the clamping mechanism provided in the embodiment of the present application, the embodiment of the present application further provides a processing process, including the following steps:
placing the middle frame 51 on the support plate 3, and protecting the side keys at the side part of the middle frame 51 through the protection part 4 positioned on the support plate 3 to prevent glue from entering gaps of the side keys in the glue dispensing process; then, dispensing the middle frame 51 (as shown in fig. 6), placing the touch pad assembly 52 on the middle frame 51, and gluing the touch pad assembly 52 and the middle frame 51 to form the electronic device 5 (as shown in fig. 7); and the convex part 32 of the support plate 3 is grabbed by the manipulator of the dispenser;
placing a first attached plate 1 on a base of a dispenser, and positioning an electronic device 5 above the first attached plate 1;
placing the second attached plate 2 above the electronic device 5, driving the first attached plate 1 to ascend through the ascending of the base, enabling the first attached plate 1 and the second attached plate 2 to adsorb through the action of the first adsorption part 11 and a part to be adsorbed or through the mutual adsorption of the first adsorption part 11 and the second adsorption part 21, clamping the electronic device 5, and pre-pressing the electronic device 5;
wiping the edge of the pre-pressed electronic equipment 5, and clamping the electronic equipment 5 by the first attached plate 1 and the second attached plate 2 in the wiping process; until the glue at the edge of the electronic device 5 (i.e. the gap of the electronic device 5) is wiped, the edge of the wiped electronic device 5 is smooth (as shown in fig. 8), and after the touch pad assembly 52 is firmly bonded with the middle frame 51 through the glue layer 53 (i.e. the glue is completely dried), the electronic device 5 is taken out from between the first attached plate 1 and the second attached plate 2, so that the bonding position of the glue layer 53 is prevented from being pulled apart when the electronic device 5 is wiped, and the bonding strength of the processed electronic device 5 is improved.
When the electronic device 5 needs to be clamped by the first attached plate 1 and the second attached plate 2, the dispenser controls the base to be raised to cause the first adsorption member 11 and the second adsorption member 21 to adsorb, or cause the first adsorption member 11 and the member to be adsorbed to adsorb, and further cause the first attached plate 1 and the second attached plate 2 to adsorb, the electronic device 5 can be clamped.
As shown in fig. 5, the electronic device 5 further includes a battery 54 and a battery cover 55, the battery cover 55 and the middle frame 51 form a space for accommodating the battery 54, and the battery cover 55 is also glued to the middle frame 51. The process of gluing the battery cover 55 and the middle frame 51 is the same as the process of gluing the touch pad assembly 52 and the middle frame 51, and thus, the detailed description thereof is omitted.
Fig. 9 is a sectional view of a second electronic device according to an embodiment of the present application. As shown in fig. 9, the electronic device 5 includes a middle frame 51 and a touch pad assembly 52, and the touch pad assembly 52 interfaces with the middle frame 51 through a glue layer 53. The electronic device 5 has a structure different from the electronic device 5, after the touch panel assembly 52 of the electronic device 5 is connected with the middle frame 51, the glue may overflow to the edge of the electronic device 5, but the glue of the electronic device 5 does not overflow, so that glue wiping is not required, but the electronic device 5 may also pre-press and hold the pressure of the electronic device 5 through a clamping mechanism.
Fig. 10 is a sectional view of a third electronic device according to an embodiment of the present application. As shown in fig. 10, the electronic device 5 includes a middle frame 51, a connector 56 and a touch pad assembly 52, wherein the connector 56 is fixedly connected with the middle frame 51, and the touch pad assembly 52 is glued to the connector 56 by a glue layer 53. The electronic device 5 has a structure different from the electronic device 5, after the touch panel assembly 52 of the electronic device 5 is connected with the middle frame 51, the glue may overflow to the edge of the electronic device 5, but the glue of the electronic device 5 does not overflow, so that glue wiping is not required, but the electronic device 5 may also be clamped by a clamping mechanism to pre-press and hold the electronic device 5.
The connector 56 is generally made of black plastic, and has a color close to that of the screen of the mobile phone, so that the 3D visual effect of the electronic device 5 can be improved by the connector 56.
It should be noted that the clamping mechanism may be used for other electronic products during gluing, which is not illustrated here.
To sum up, fixture and processing technology that this application embodiment provided, attach the setting of board 2 through first attaching board 1 and second and can be with 5 centre grippings of electronic equipment, do not need extra holder, when wiping the excessive glue of edge (electronic equipment 5's gap) to electronic equipment 5, first attaching board 1 and second attach board 2 can centre gripping electronic equipment 5 always, glue film 53 bonding department was pulled open the layering when avoiding wiping electronic equipment 5, avoid forming the gas pocket in the glue film 53, the bonding strength and the sealing performance of glue film 53 have been improved, water-proof effects promotes greatly.
It is noted that a portion of this patent application contains material which is subject to copyright protection. The copyright owner reserves copyright rights except for copies of patent documents or patent document contents of records at the patent office.
Claims (9)
1. A clamping mechanism, comprising:
the first accessory plate (1), wherein the first accessory plate (1) is arranged on a first side of the electronic equipment (5);
a second accessory plate (2), the second accessory plate (2) being disposed on a second side of the electronic device (5);
one of the first adsorption plate (1) and the second adsorption plate (2) is provided with a first adsorption component (11), the other one of the first adsorption plate and the second adsorption plate is provided with a second adsorption component (21) or a component to be adsorbed, and the first adsorption plate (1) and the second adsorption plate (2) are adsorbed by the second adsorption component (21) or the component to be adsorbed and the first adsorption component (11) so as to clamp the electronic equipment (5);
the electronic equipment comprises a supporting plate (3), wherein the supporting plate (3) is used for supporting the electronic equipment (5), and at least one side of the supporting plate (3) is provided with a protruding part (32) for holding.
2. Clamping mechanism according to claim 1, further comprising a support plate (3), said support plate (3) being located between said first accessory plate (1) and said second accessory plate (2).
3. A clamping mechanism according to claim 2, wherein a through hole (31) is provided in the support plate (3), and the first suction member (11) extends into the through hole (31) and is sucked to the second suction member (21) or the member to be sucked.
4. Clamping mechanism according to claim 2, wherein the support plate (3) is further provided with a recess (33), the recess (33) being adapted to accommodate the electronic device (5).
5. The clamping mechanism according to any one of claims 2-4, further comprising a shielding member (4), the shielding member (4) being connected to the support plate (3) for shielding a side of the electronic device (5).
6. A processing technology of electronic equipment is characterized by comprising the following steps:
the electronic device (5) comprises a middle frame (51) and a touch pad assembly (52), the middle frame (51) is placed on a support plate (3), the middle frame (51) on the support plate (3) is subjected to glue dispensing, the touch pad assembly (52) is placed on the middle frame (51), and the touch pad assembly (52) and the middle frame (51) are glued to form the electronic device (5);
the convex part (32) of the supporting plate (3) is grabbed by a glue dispenser;
placing a first accessory plate (1) below a support plate (3) and placing a second accessory plate (2) above the electronic equipment (5);
controlling the first attached plate (1) and the second attached plate (2) to be mutually adsorbed through the action of a first adsorption part (11) and a second adsorption part (21); or controlling the first attached plate (1) and the second attached plate (2) to be adsorbed mutually through the action of the first adsorption part (11) and the part to be adsorbed; and clamping the electronic equipment (5), and pre-pressing the electronic equipment (5).
7. The process for manufacturing an electronic device according to claim 6, wherein the electronic device (5) is assembled by protecting the side keys on the side of the middle frame (51) with a protecting part (4) on the supporting plate (3) and dispensing.
8. The processing technology of the electronic equipment according to claim 6, characterized in that the first attached plate (1) is placed at the base of a dispenser and is positioned below the support plate (3) and the electronic equipment (5);
the first auxiliary plate (1) is driven to ascend through the ascending of the base, so that the first auxiliary plate (1) and the second auxiliary plate (2) are adsorbed, the electronic equipment (5) is clamped, and the electronic equipment (5) is pre-pressed.
9. Process for manufacturing an electronic device according to any one of claims 6 to 8, characterized in that the edges of the pre-pressed electronic device (5) are wiped and the electronic device (5) is held by the first (1) and second (2) attachment plates at all times during the wiping.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010199413.2A CN113492115B (en) | 2020-03-20 | 2020-03-20 | Clamping mechanism and machining process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010199413.2A CN113492115B (en) | 2020-03-20 | 2020-03-20 | Clamping mechanism and machining process |
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| Publication Number | Publication Date |
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| CN113492115A CN113492115A (en) | 2021-10-12 |
| CN113492115B true CN113492115B (en) | 2022-10-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202010199413.2A Active CN113492115B (en) | 2020-03-20 | 2020-03-20 | Clamping mechanism and machining process |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907958A (en) * | 2015-05-27 | 2015-09-16 | 惠州Tcl移动通信有限公司 | Pressure maintaining fixture for electronic equipment |
| CN205342578U (en) * | 2016-01-07 | 2016-06-29 | 东莞市四象精密金属有限公司 | CNC processing magnet tool |
| CN107489679A (en) * | 2016-12-30 | 2017-12-19 | 闻泰通讯股份有限公司 | A kind of pressurize fixture |
| CN210022728U (en) * | 2019-05-13 | 2020-02-07 | 东莞市德普特电子有限公司 | Cell-phone display screen pressurize anchor clamps |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014202468B4 (en) * | 2013-08-21 | 2024-06-13 | Lenovo (Beijing) Co., Ltd. | Electronic device |
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2020
- 2020-03-20 CN CN202010199413.2A patent/CN113492115B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104907958A (en) * | 2015-05-27 | 2015-09-16 | 惠州Tcl移动通信有限公司 | Pressure maintaining fixture for electronic equipment |
| CN205342578U (en) * | 2016-01-07 | 2016-06-29 | 东莞市四象精密金属有限公司 | CNC processing magnet tool |
| CN107489679A (en) * | 2016-12-30 | 2017-12-19 | 闻泰通讯股份有限公司 | A kind of pressurize fixture |
| CN210022728U (en) * | 2019-05-13 | 2020-02-07 | 东莞市德普特电子有限公司 | Cell-phone display screen pressurize anchor clamps |
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| CN113492115A (en) | 2021-10-12 |
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