CN111668621B - Flexible circuit board, laminating method and circuit board assembly - Google Patents
Flexible circuit board, laminating method and circuit board assembly Download PDFInfo
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- CN111668621B CN111668621B CN202010518821.XA CN202010518821A CN111668621B CN 111668621 B CN111668621 B CN 111668621B CN 202010518821 A CN202010518821 A CN 202010518821A CN 111668621 B CN111668621 B CN 111668621B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/61—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures
- H01R12/613—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to flexible printed circuits, flat or ribbon cables or like structures by means of interconnecting elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
- H01R12/65—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures characterised by the terminal
Abstract
The invention relates to a flexible circuit board, a laminating method and a circuit board assembly, wherein the flexible circuit board comprises a main body part and a binding part; the binding part comprises a first area and a second area, the second area is arranged between the first area and the main body part, the binding part forms a boundary line at the connecting position of the first area and the second area, the binding part is provided with an exhaust hole penetrating through the first area, the binding part is provided with a plurality of wiring contacts arranged at intervals at the same side of the second area, and the wiring contacts extend to the boundary line. When the conductive adhesive is pressed, gas in the conductive adhesive can be exhausted from the exhaust holes along the gap between the electrodes (the gap between two adjacent wiring contacts), and the gas in the conductive adhesive can be easily exhausted, so that residual bubbles in the conductive adhesive can be greatly reduced, and the binding adhesive force and the electric connection performance of the flexible circuit board on the panel to be pressed are ensured.
Description
Technical Field
The invention relates to the technical field of circuit binding, in particular to a flexible circuit board, a laminating method and a circuit board assembly.
Background
With the development of science and technology, the demand and dependence of modern people on 3C products are increasing day by day, and one machine needs to have multiple functions, and in order to integrate multiple functions on the same product, the size of each component is necessarily reduced. For the binding areas of the touch panel, the display panel and the circuit board waiting for binding the panel, when the size of the binding area is reduced, the more obvious the alignment error between the binding area and the flexible circuit board is. In order to solve the problem of the alignment error, the binding region needs to be hot-pressed and bound with the flexible circuit board through conductive adhesive. However, bubbles are easily formed in the conductive adhesive and are not easily discharged, which affects the binding adhesion and the electrical connection performance of the flexible circuit board.
Disclosure of Invention
Therefore, it is necessary to provide a flexible circuit board, a press-fitting method and a circuit board assembly for solving the problems that bubbles are easily formed in the conductive adhesive and are not easily discharged, and the binding adhesion and the electrical connection performance of the flexible circuit board are affected.
A flexible circuit board comprising:
a main body portion; and
binding portion, including first region and second area, the second area is located first region with between the main part, binding portion is in first region with the hookup location in second area forms the boundary line, binding portion is equipped with and runs through the exhaust hole in first region, binding portion is in the same one side in second area is provided with the wiring contact that a plurality of intervals were arranged, the wiring contact extends to the boundary line.
In one embodiment, the first region, the second region, and the main body portion are sequentially arranged along a first direction, and the plurality of wire contacts are arranged at intervals along a second direction; wherein the first direction and the second direction are perpendicular to each other.
In one embodiment, the number of the vent holes is multiple, and the vent holes are opened in a portion of the first region, which is opposite to the plurality of wiring contacts.
In one embodiment, a metal film which is equal in number and corresponds to the exhaust holes in a one-to-one manner is arranged on one side, opposite to the wiring contact, of the second area, and the metal film is arranged on the periphery of the exhaust holes and is connected with the inner wall of the exhaust holes.
In one embodiment, the metal film comprises a plurality of metal lines, and the metal lines are arranged around the exhaust holes at intervals.
A method of bonding comprising the steps of:
providing a panel to be laminated and the flexible circuit board, wherein the panel to be laminated is provided with an electric connection part, the electric connection part comprises a plurality of conductive contacts which are arranged at intervals, and the number of the conductive contacts is equal to that of the wiring contacts and corresponds to that of the wiring contacts one by one;
coating conductive adhesive on at least one of the electric connection part and the second area, and attaching the second area to the electric connection part in a contraposition mode through the conductive adhesive, wherein the conductive adhesive comprises adhesive glue, tin-bismuth particles and soldering flux which are mixed into the adhesive glue;
heating the conductive adhesive to enable the tin bismuth particles in the conductive adhesive to be gathered in the bonding adhesive into a plurality of aggregates with the number equal to that of the wiring contacts, wherein the aggregates are located between the wiring contacts and the conductive contacts, and the aggregates are electrically connected with the wiring contacts and the conductive contacts; and
and pressing the flexible circuit board and the panel to be pressed, so that bubbles in the conductive adhesive between every two adjacent aggregates diffuse towards one side where the vent hole is located to be discharged by the vent hole.
In one embodiment, in the step of applying the conductive paste, one of a self-assembly paste and a solder paste is used as the conductive paste.
A circuit board assembly comprising:
the panel to be laminated is provided with an electric connection part, and the electric connection part comprises a plurality of conductive contacts which are arranged at intervals;
the flexible circuit board comprises a main body part and a binding part, wherein the binding part comprises a first area and a second area, the second area is arranged between the first area and the main body part, the binding part forms a boundary line at the connecting position of the first area and the second area, the binding part is provided with an exhaust hole penetrating through the first area, the binding part is provided with a plurality of wiring contacts arranged at intervals at the same side of the second area, the wiring contacts extend to the boundary line, and the number of the wiring contacts is equal to that of the conductive contacts and corresponds to that of the conductive contacts one by one; and
the conducting resin is located the electricity connect with between the binding portion, the conducting resin is including the bonding resin and a plurality of aggregates by the gathering of tin bismuth particle in the bonding resin, the aggregate with the quantity of wiring contact equals, the aggregate is located wiring contact with between the conductive contact, the conducting resin passes through aggregate electric connection wiring contact with the conductive contact.
In one embodiment, metal films which are equal in number and correspond to the exhaust holes one by one are arranged on one side, opposite to the wiring contact, of the first area, and the metal films are arranged on the peripheries of the exhaust holes; and the conductive adhesive spreads to one side of the second area back to the wiring contact along the hole wall of the exhaust hole and is adsorbed on the metal film.
In one embodiment, the first region, the second region, and the main body portion are sequentially arranged along a first direction, and the plurality of wiring contacts are arranged at intervals along a second direction, the first direction and the second direction being perpendicular to each other; and/or the number of the exhaust holes is multiple, and the exhaust holes are arranged on the part of the first area, which is opposite to the plurality of wiring contacts; and/or the conductive adhesive is one of anisotropic conductive adhesive, self-assembly paste and soldering paste; and/or the panel to be pressed is a flexible circuit board, and the circuit board assembly is an integrated circuit board.
The flexible circuit board, the laminating method and the circuit board assembly provided by the invention have the following beneficial effects:
in the related art, when the flexible circuit board is laminated with the panel to be laminated through the conductive adhesive, gas in the conductive adhesive needs to be compressed to the edge of the flexible circuit board along with the conductive adhesive and then discharged from the edge, and the gas is difficult to discharge. When the flexible circuit board is used for being pressed with a panel to be pressed through the conductive adhesive, the binding part is divided into a first area and a second area which are adjacent, the wiring contact is arranged in the second area, the exhaust hole is arranged in the first area, and the arrangement of the exhaust hole can enable the gas of the conductive adhesive to be exhausted from the exhaust hole when the second area is pressed with the electric connection part of the panel to be pressed. Based on the fact that gas has upward buoyancy, when the conductive adhesive is pressed, the gas in the conductive adhesive can be discharged from the exhaust holes along the gap between the electrodes (the gap between two adjacent wiring contacts), and the gas in the conductive adhesive can be discharged more easily, so that residual bubbles in the conductive adhesive can be greatly reduced, and the binding adhesion and the electric connection performance of the flexible circuit board are ensured.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is an exploded view of a circuit board assembly according to an embodiment of the present invention;
FIG. 2 is a bottom view of the flexible circuit board of FIG. 1;
FIG. 3 is an assembled circuit board assembly, taken along section line II-II of FIG. 1;
FIG. 4 is an assembled circuit board assembly, taken along section line III-III of FIG. 1;
fig. 5 is a schematic flow chart illustrating a stitching method according to an embodiment of the present invention;
fig. 6 is a schematic structural view illustrating the second region being aligned and attached to the electrical connection portion through a conductive adhesive;
FIG. 7 is a schematic structural view of the conductive adhesive and the electrical connection portion of FIG. 6 after heating the conductive adhesive;
fig. 8 is a bottom view of the flexible circuit board of fig. 7 after pressing and removing a part of the structure of the panel to be pressed.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, but rather should be construed as broadly as the present invention is capable of modification in various respects, all without departing from the spirit and scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1, the present application provides a circuit board assembly 10, which may be applied to smart terminals such as smart phones, tablet computers, notebook computers, wearable devices, and the like. The circuit board assembly 10 includes a panel 100 to be laminated, a flexible circuit board 200 and a conductive adhesive 300, wherein the flexible circuit board 200 and the panel 100 to be laminated are laminated with each other through the conductive adhesive 300, so that the flexible circuit board 200 and the panel 100 to be laminated are electrically conducted through the conductive adhesive 300, and therefore signal interaction between the flexible circuit board 200 and the panel 100 to be laminated is realized.
In an embodiment, the panel 100 to be laminated may be a flexible circuit board, and the flexible circuit board 200 are laminated to form an integrated circuit board. In a specific application, one of the panel 100 and the flexible circuit board 200 to be laminated may be a touch control circuit board of a touch screen, and the other may be a display control circuit board of a corresponding touch screen, and in order to implement touch display on the touch screen, the two flexible boards may be electrically connected by laminating the touch control circuit board and the display control circuit board, so that the display control circuit board may receive a touch electrical signal of the touch control circuit board and drive the touch screen to correspondingly display according to the touch electrical signal. It should be understood that the embodiments of the present application do not limit the panel to be bonded 100 to be a flexible board, and any panel to be bonded 100 capable of being bonded to the flexible circuit board 200 by pressing is within the scope of the present application, such as a touch panel and a display panel.
Referring to fig. 1, the panel to be bonded 100 has an electrical connection portion 110, the electrical connection portion 110 includes a plurality of conductive contacts 111 arranged at intervals, and the conductive contacts 111 can be understood as conductive pins. The electrical connection portion 110 may be disposed at an edge of the panel 100 to be bonded, and the conductive contact 111 extends to the edge of the panel 100 to be bonded.
As shown in connection with fig. 2, the flexible circuit board 200 includes a body portion 210 and a binding portion 220. The binding part 220 includes a first region 221 and a second region 222, and the second region 222 is provided between the first region 221 and the main body part 210. The binding portion 220 forms a boundary line 201 at a connecting position of the first region 221 and the second region 222. The binding portion 220 is provided with an air vent 2211 penetrating through the first region 221, and the binding portion 220 is further provided with a plurality of wiring contacts 2221 arranged at intervals on the same side of the second region 222, where "a plurality" in the embodiments of the present application means two or more, for example, three, four, five, and so on. The wire contacts 2221 extend to the intersection line 201, and the wire contacts 2221 are used to mate with the conductive contacts 111 in an aligned manner. Wherein the number of the wire contacts 2221 and the number of the conductive contacts 111 may be equal to or greater than the number of the conductive contacts 111.
In one embodiment, the first region 221, the second region 222, and the main body 210 are sequentially arranged along a first direction, which may be understood as an X-axis extending direction illustrated in fig. 2, and the plurality of wire contacts 2221 are arranged at intervals along a second direction, which may be understood as a Y-axis extending direction illustrated in fig. 2, wherein the first direction and the second direction are perpendicular to each other. Of course, the first direction and the second direction may be disposed at an acute angle.
Referring to fig. 3, the conductive adhesive 300 is disposed between the electrical connection portion 110 and the binding portion 220, the conductive adhesive 300 includes a bonding adhesive 310 and a plurality of aggregates 320 aggregated by sn — bi particles in the bonding adhesive 310, the number of the aggregates 320 is equal to that of the wire contacts 2221, the aggregates 320 are located between the wire contacts 2221 and the conductive contacts 111, and the conductive adhesive 300 electrically connects the wire contacts 2221 and the conductive contacts 111 through the aggregates 320.
It should be noted that, before the flexible circuit board 200 is bonded to the panel 100 to be bonded through the conductive adhesive 300, the conductive adhesive 300 is not heated, the tin-bismuth particles in the conductive adhesive 300 are still in a free state and are not aggregated, and the conductive adhesive 300 further includes the flux mixed into the adhesive 310. After heating the conductive paste 300, the free tin bismuth particles aggregate between the wire contact 2221 and the conductive contact 111 to form an aggregate 320, and the flux is heated to react with the oxides in the conductive paste 300 and the oxidation products in the wire contact 2221 and the conductive contact 111 to produce bubbles 330 that aggregate in the adhesive paste 310. On the one hand, the flux ensures that tin-bismuth particles are collected between the wire contact 2221 and the conductive contact 111 after removing the oxide. On the other hand, the reaction of the flux also generates the bubbles 330 accumulated in the adhesive 310, and the existence of the bubbles 330 affects the binding adhesion and the electrical connection performance of the flexible circuit board 200 on the panel 100 to be bonded.
Based on this, when the flexible circuit board 200 and the panel 100 to be pressed are pressed through the conductive adhesive 300, the wiring contact 2221 is disposed in the second area 222, the exhaust hole 2211 is disposed in the first area 221, and the exhaust hole 2211 is disposed such that when the second area 222 is pressed with the electrical connection portion 110 of the panel 100 to be pressed, the conductive adhesive 300 can fill up the whole area between the flexible circuit board 200 and the panel 100 to be pressed, and the gas of the conductive adhesive 300 can be exhausted from the exhaust hole 2211 during the pressing process. Referring to fig. 4, when the conductive adhesive 300 is pressed, the gas in the conductive adhesive 300 can be discharged from the gas discharge hole 2211 along the gap between the electrodes (the gap between two adjacent wiring contacts 2221) based on the upward buoyancy of the gas in the bubbles 330, and the gas in the conductive adhesive 300 can be discharged more easily, so that the residual bubbles 330 in the conductive adhesive 300 can be greatly reduced, and the reduction of the bubbles 330 ensures the binding adhesion and the electrical connection performance of the flexible circuit board 200 on the panel 100 to be bonded. The conductive Paste 300 may be one of a Self-Assembly Paste (SAP: Self Assembly Paste/epoxy + Sn-Bi) and a solder Paste (solder Paste). The number of the gas discharge holes 2211 may be plural, and the gas discharge holes 2211 are preferably provided at a portion of the first region 221 opposite to the plurality of wiring contacts 2221 to more quickly diffuse the gas bubbles 330 to the gas discharge holes 2211.
In an embodiment, referring to fig. 1 and 4, the metal films 230 are disposed in the same number and one-to-one correspondence to the number of the exhaust holes 2211 on the side of the first region 221 facing away from the connection contact 2221, and the metal films 230 are used for adsorbing the conductive adhesive 300 that spreads to the side of the second region 222 facing away from the connection contact 2221 along the hole walls of the exhaust holes 2211. The metal film 230 is disposed on the outer circumference of the exhaust hole 2211 and engaged with the inner wall of the exhaust hole 2211, and the metal film 230 may not be engaged with the inner wall of the exhaust hole 2211. In an embodiment, the metal film 230 includes a plurality of metal lines 231, the plurality of metal lines 231 are arranged at intervals around the exhaust hole 2211, and the metal film 230 has a metal line 231 with a shape that is a relatively obviously thickened line when the projection sheet is manufactured, and it should be noted that the shape of the metal film 230 is not limited herein as long as the metal film 231 around the exhaust hole 2211 can absorb the conductive adhesive 300 that spreads along the hole wall of the exhaust hole 2211 to the side of the second area 222 opposite to the wiring contact 2221. The material of the metal film can be selected from metal materials such as gold, silver, copper, tin and the like. The conductive adhesive 300 spreads along the hole wall of the exhaust hole 2211 to the side of the second region 222 opposite to the wiring contact 2221 and is adsorbed to the metal film 230, and the conductive adhesive 300 is specifically adsorbed to the metal film 230 through the discrete tin-bismuth particles mixed in the conductive adhesive 300 to the adhesive 310. Since the viscosity of the conductive adhesive 300 heated during the pressing process is low, the conductive adhesive 300 flows toward the exhaust hole 2211 while infiltrating the binding portion between the flexible circuit board 200 and the panel 100 to be pressed. The metal film 230 can adsorb and hold the tin-bismuth particles in the conductive adhesive 300, so that the conductive adhesive 300 can be prevented from being accumulated in the exhaust hole 2211 to block the exhaust hole 2211, and gas can be smoothly exhausted.
Referring to fig. 5, an embodiment of the present application further provides a pressing method for pressing a panel 100 to be pressed by using the flexible circuit board 200 provided in the foregoing embodiments, where the pressing method includes the following steps:
step S10, referring to fig. 6, provides the flexible circuit board 200 and the panel 100 to be bonded.
The flexible circuit board 200 includes a body portion 210 and a binding portion 220. The binding part 220 includes a first region 221 and a second region 222, and the second region 222 is provided between the first region 221 and the main body part 210. The binding portion 220 forms a boundary line 201 at a connecting position of the first region 221 and the second region 222. The binding portion 220 is provided with an air vent 2211 penetrating through the first region 221, and the binding portion 220 is further provided with a plurality of wiring contacts 2221 arranged at intervals on the same side of the second region 222, where "a plurality" in the embodiments of the present application means two or more, for example, three, four, five, and so on. The wiring contacts 2221 extend to the intersection line 201, and the number of the wiring contacts 2221 is equal to and corresponds one-to-one with the number of the conductive contacts 111.
The panel 100 to be bonded has an electrical connection portion 110, the electrical connection portion 110 includes a plurality of conductive contacts 111 arranged at intervals, the conductive contacts 111 can be understood as conductive pins, the conductive contacts 111 can extend to the edge of the panel 100 to be bonded, and the number of the conductive contacts 111 is equal to the number of the wiring contacts 2221 and corresponds to one another.
Step S20, applying a conductive adhesive 300 on at least one of the electrical connection portion 110 and the second region 222, and aligning and attaching the second region 222 to the electrical connection portion 110 through the conductive adhesive 300. The conductive paste 300 includes a paste 310, and tin bismuth particles 320a and a flux mixed into the paste 310. The conductive Paste 300 may be a Self-Assembly Paste (SAP: Self Assembly Paste/epoxy + Sn-Bi) or a solder Paste (solder Paste).
The conductive paste 300 may be in a liquid state or a semi-cured state. If the liquid conductive adhesive 300 is adopted, the conductive adhesive 300 is smeared on the surface to be covered. If the semi-cured conductive adhesive 300 is adopted, the conductive adhesive 300 is attached to the surface to be covered. The surface to be covered is the second region 222 of the electrical connection portion 110 or the binding portion 220 of the panel 100 to be pressed. In addition, in the specific application, the conductive adhesive 300 may be applied to both the panel 100 to be laminated and the binding portion 220. The conductive adhesive 300 may also be applied to the side of the second region 222 of the binding portion 220 where the wire contacts 2221 are arranged, and the conductive adhesive 300 is not applied to the electrical connection portion 110 of the panel 100 to be bonded. Alternatively, the conductive adhesive 300 may be applied only to the electrical connection portion 110 of the panel 100 to be bonded, and the conductive adhesive is not applied to the side of the second region 222 of the binding portion 220 where the wire contacts 2221 are disposed. In short, there are various ways to apply the conductive adhesive 300, which is not limited in the embodiments of the present invention.
Step S30, referring to fig. 7, the conductive adhesive 300 between the flexible circuit board 200 and the panel 100 to be bonded is heated, so that the tin-bismuth particles 320a in the conductive adhesive 300 are gathered into a plurality of aggregates 320 equal to the number of the wire contacts 2221 in the adhesive 310, the aggregates 320 are located between the wire contacts 2221 and the conductive contacts 111, and the aggregates 320 electrically connect the wire contacts 2221 and the conductive contacts 111. At the same time, the flux is heated to react with the oxides in the conductive paste 300 and with the oxidation products in the wire contact 2221 and the conductive contact 111 to produce air bubbles 330 that accumulate in the adhesive paste 310. On the one hand, the flux ensures that tin-bismuth particles are collected between the wire contact 2221 and the conductive contact 111 after removing the oxide. On the other hand, the reaction of the flux also generates the bubbles 330 accumulated in the adhesive 310, and the existence of the bubbles 330 affects the binding adhesion and the electrical connection performance of the flexible circuit board 200 on the panel 100 to be bonded.
In step S40, the flexible circuit board 200 and the panel 100 to be bonded are bonded, and as shown in fig. 8, the bubbles 330 in the conductive adhesive 300 between two adjacent aggregates 320 are diffused toward the side where the exhaust hole 2211 is located to be exhausted through the exhaust hole 2211. It should be noted that the pressing process may use a hot-pressing head to perform pressing, so that the thermally conductive adhesive 300 is also heated during the pressing process to generate the aggregation 320, thereby establishing an electrical connection channel between the wire contact 2221 and the electrically conductive contact 111 through the aggregation 320.
After the flexible circuit board 200 and the panel 100 to be bonded are bonded, the conductive adhesive 300 may be heated and cured to firmly bond the flexible circuit board 200 and the panel 100 to be bonded together.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (9)
1. A flexible circuit board, comprising:
a main body portion; and
the binding part comprises a first area and a second area, the second area is arranged between the first area and the main body part, the binding part forms a boundary line at the connecting position of the first area and the second area, the binding part is provided with an exhaust hole penetrating through the first area, the binding part is provided with a plurality of wiring contacts arranged at intervals on the same side of the second area, and the wiring contacts extend to the boundary line;
one side of the first area, which faces away from the wiring contact, is provided with metal films which correspond to the exhaust holes in the same number in a one-to-one mode, the metal films are arranged on the peripheries of the exhaust holes and comprise a plurality of metal lines, the metal lines are arranged around the exhaust holes at intervals, and the metal films are configured to adsorb tin bismuth particles in conductive adhesive.
2. The flexible circuit board according to claim 1, wherein the first region, the second region, and the main body portion are arranged in order in a first direction, and a plurality of the wiring contacts are arranged at intervals in a second direction; wherein the first direction and the second direction are perpendicular to each other.
3. The flexible circuit board according to claim 1, wherein the number of the vent holes is plural and the vent holes are opened at portions of the first region which are disposed opposite to the plurality of wiring contacts.
4. The flexible circuit board of claim 1, wherein the metal film engages an inner wall of the vent hole.
5. A pressing method is characterized by comprising the following steps:
providing a panel to be laminated and the flexible circuit board as claimed in any one of claims 1 to 4, wherein the panel to be laminated is provided with an electrical connection part, the electrical connection part comprises a plurality of conductive contacts arranged at intervals, and the number of the conductive contacts is equal to that of the wiring contacts and corresponds to that of the wiring contacts;
coating conductive adhesive on at least one of the electric connection part and the second area, and attaching the second area to the electric connection part in a contraposition mode through the conductive adhesive, wherein the conductive adhesive comprises adhesive glue, tin-bismuth particles and soldering flux which are mixed into the adhesive glue;
heating the conductive adhesive to enable the tin bismuth particles in the conductive adhesive to be gathered in the bonding adhesive into a plurality of aggregates with the number equal to that of the wiring contacts, wherein the aggregates are located between the wiring contacts and the conductive contacts, and the aggregates are electrically connected with the wiring contacts and the conductive contacts; and
and pressing the flexible circuit board and the panel to be pressed, so that bubbles in the conductive adhesive between every two adjacent aggregates diffuse towards one side where the vent hole is located to be discharged by the vent hole.
6. A laminating method according to claim 5, characterised in that in the step of applying a conductive paste, one of a self-assembly paste and a solder paste is used as the conductive paste.
7. A circuit board assembly, comprising:
the panel to be laminated is provided with an electric connection part, and the electric connection part comprises a plurality of conductive contacts which are arranged at intervals;
the flexible circuit board comprises a main body part and a binding part, wherein the binding part comprises a first area and a second area, the second area is arranged between the first area and the main body part, the binding part forms a boundary line at the connecting position of the first area and the second area, the binding part is provided with an exhaust hole penetrating through the first area, the binding part is provided with a plurality of wiring contacts arranged at intervals at the same side of the second area, the wiring contacts extend to the boundary line, and the number of the wiring contacts is equal to that of the conductive contacts and corresponds to that of the conductive contacts one by one; and
the conducting resin is located the electricity connect with between the binding portion, the conducting resin is including the bonding resin and a plurality of aggregates by the gathering of tin bismuth particle in the bonding resin, the aggregate with the quantity of wiring contact equals, the aggregate is located wiring contact with between the conductive contact, the conducting resin passes through aggregate electric connection wiring contact with the conductive contact.
8. The circuit board assembly according to claim 7, wherein the side of the first region facing away from the wiring contacts is provided with a number of metal films corresponding to the number of the vent holes, and the metal films are arranged on the peripheries of the vent holes; and the conductive adhesive spreads to one side of the second area back to the wiring contact along the hole wall of the exhaust hole and is adsorbed on the metal film.
9. The circuit board assembly according to claim 7, wherein the first region, the second region, and the main body portion are sequentially arranged in a first direction, and a plurality of the wiring contacts are arranged at intervals in a second direction, the first direction and the second direction being perpendicular to each other; and/or the number of the exhaust holes is multiple, and the exhaust holes are arranged on the part of the first area, which is opposite to the plurality of wiring contacts; and/or the conductive adhesive is one of self-assembly paste and soldering paste; and/or the panel to be pressed is a flexible circuit board, and the circuit board assembly is an integrated circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010518821.XA CN111668621B (en) | 2020-06-09 | 2020-06-09 | Flexible circuit board, laminating method and circuit board assembly |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010518821.XA CN111668621B (en) | 2020-06-09 | 2020-06-09 | Flexible circuit board, laminating method and circuit board assembly |
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| CN111668621A CN111668621A (en) | 2020-09-15 |
| CN111668621B true CN111668621B (en) | 2022-04-15 |
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| CN114143986A (en) * | 2021-11-24 | 2022-03-04 | Tcl华星光电技术有限公司 | Display module and manufacturing method thereof |
| CN114745850A (en) * | 2022-04-13 | 2022-07-12 | 业成科技（成都）有限公司 | Fingerprint identification device and manufacturing method of fingerprint identification device |
| CN114980509B (en) * | 2022-06-14 | 2024-03-19 | 昆山国显光电有限公司 | Binding connection structure, preparation method of binding connection structure and display module |
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| CN2908003Y (en) * | 2006-04-11 | 2007-06-06 | 陈丽鸿 | Equipment for pressing and connecting electronic element |
| CN102559092A (en) * | 2012-01-09 | 2012-07-11 | 吴祖 | Conductive adhesive for circuit board, single/double-sided multi-layer printed circuit board, and production method |
| GB2494223B (en) * | 2012-03-02 | 2014-03-12 | Novalia Ltd | Circuit board assembly |
| CN107613675A (en) * | 2017-08-10 | 2018-01-19 | 维沃移动通信有限公司 | A kind of compression method of flexible PCB, surface-mounted integrated circuit and mobile terminal |
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