CN113490335B

CN113490335B - Depth control groove processing method and circuit board

Info

Publication number: CN113490335B
Application number: CN202110651348.7A
Authority: CN
Inventors: 殷景锋; 李少强; 张军; 林友锟
Original assignee: Kinwong Electronic Technology Longchuan Co Ltd
Current assignee: Kinwong Electronic Technology Longchuan Co Ltd
Priority date: 2021-06-10
Filing date: 2021-06-10
Publication date: 2022-06-07
Anticipated expiration: 2041-06-10
Also published as: CN113490335A

Abstract

The invention relates to the technical field of circuit board manufacturing, and provides a depth control groove processing method, which comprises the following steps: providing a substrate, wherein the substrate is provided with a region to be subjected to groove routing, and at least one PTH hole is arranged in the region to be subjected to groove routing; inserting peelable glue into the PTH hole in the area to be grooved; curing the peelable glue; and routing depth control grooves on the substrate corresponding to the region to be routed. The invention also provides a circuit board. According to the depth control groove processing method and the circuit board, the strippable glue is filled into the PTH during the process of routing the depth control groove, so that the hole wall of the PTH can be effectively supported, and the problems of burrs, strain, stripping and the like are avoided.

Description

Depth control groove processing method and circuit board

Technical Field

The invention relates to the technical field of circuit board manufacturing, in particular to a depth control groove processing method and a circuit board.

Background

With the development of the electronic industry, circuit board products are gradually diversified. When processing the circuit board, need gong out the accuse deep trouth on the base plate, its principle is: and arranging the substrate on a table board of a depth control gong machine, and gong a depth control groove on the substrate.

Because the substrate has plated Through holes (plated Through holes), these PTH holes often exist at positions where the depth control grooves need to be processed on the substrate, when the depth control grooves are processed on the substrate by using the existing method, the Hole walls of the PTH holes at the depth control grooves are easily scratched, peeled off, and the like, thereby affecting the quality of the circuit board.

Disclosure of Invention

The invention provides a depth control groove processing method and a circuit board, and aims to solve the problem that burrs, strains, peeling and the like are easily generated on the hole wall of a PTH hole at a depth control groove when the depth control groove is processed on a substrate in the prior art.

An embodiment of a first aspect of the present application provides a depth control groove processing method, including:

providing a substrate, wherein the substrate is provided with a region to be subjected to groove routing, and at least one PTH hole is arranged in the region to be subjected to groove routing;

filling peelable glue into the PTH hole in the area to be grooved;

curing the peelable glue;

and routing depth control grooves on the substrate corresponding to the region to be routed.

In some embodiments, after routing a depth control groove on the substrate corresponding to the region to be routed, the depth control groove processing method further includes: and removing the peelable glue in the PTH hole.

In some embodiments, after the depth control groove is routed on the substrate corresponding to the region to be routed, routing the substrate to obtain a plurality of circuit board units, and removing the peelable glue.

In some embodiments, after the peelable glue is removed, the substrate is cleaned.

In some embodiments, routing depth control slots on the substrate corresponding to the to-be-routed area includes:

placing the substrate with the groove area to be milled upward on a table board of a depth-control milling machine with a vacuum suction plate function, wherein the substrate is tightly attached to the table board of the depth-control milling machine under vacuum adsorption;

and routing a depth control groove on the substrate through the depth control routing machine corresponding to the region to be routed with the groove.

In some embodiments, when the depth control groove is routed on the substrate by the depth control routing machine, a lower cutting point of the depth control routing machine is any position in the region of the groove to be routed.

In some embodiments, when a peelable glue is plugged into the PTH hole located inside the region to be grooved, the peelable glue is plugged into the PTH hole by a screen printing method using a jack screen plate with the same hole diameter as the PTH hole.

In some embodiments, before inserting the peelable glue into the PTH hole located inside the region to be grooved, the substrate is subjected to a gold immersion treatment.

In some of these embodiments, the peelable glue is a blue glue.

Embodiments of the second aspect of the present application provide a circuit board, which is manufactured by using the depth control groove processing method according to the first aspect.

The depth control groove processing method provided by the invention has the beneficial effects that: because can fill in strippable glue in the PTH that is located treating gong groove region inside earlier to carry out solidification treatment to strippable glue, correspond again and treat gong groove region, gong out the accuse deep groove on the base plate, the strippable glue that makes fill in the PTH when gong accuse deep groove can effectively support the pore wall in PTH hole, avoids it to produce to drape over one's hair, draw and peels off scheduling problem.

According to the circuit board, the strippable glue is filled in the PTH, so that the strippable glue can effectively support the hole wall of the PTH when the depth control groove is formed, the situations of burrs, strain, stripping and the like of the hole wall of the PTH are prevented, and the quality of the circuit board is ensured.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the embodiments or the prior art descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without inventive exercise.

FIG. 1 is a flow chart of a depth control groove machining method according to an embodiment of the present invention;

FIG. 2 is a schematic view of a substrate without a peelable adhesive inserted into a PTH hole according to one embodiment of the present invention;

FIG. 3 is a top view of the substrate of FIG. 2;

FIG. 4 is a schematic view of a substrate with a peelable adhesive inserted into a PTH hole but without a depth control groove formed therein according to one embodiment of the present invention;

FIG. 5 is a schematic view of a substrate with depth control grooves formed therein without removing the peelable glue from the PTH holes in accordance with one embodiment of the present invention;

FIG. 6 is a schematic diagram of a substrate with a peelable glue removed from a PTH hole according to one embodiment of the present invention.

The designations in the figures mean:

100. a substrate; 10. a groove region is to be milled; 20. a PTH hole; 30. stripping the glue; 40. and (6) depth control grooves.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in further detail below with reference to the accompanying drawings, which are examples. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.

In order to explain the technical solution of the present invention, the following description is made with reference to the specific drawings and examples.

Referring to fig. 1, fig. 2 and fig. 5, an embodiment of a first aspect of the present application provides a depth control groove processing method, including:

s10: a substrate 100 is provided, the substrate 100 has a region 10 to be routed, and at least one PTH hole 20 is disposed in the region 10 to be routed.

Specifically, the substrate 100 may be a circuit board after the processes of cutting, inner layer circuit, laminating, drilling, copper plating, electroplating, outer layer circuit, solder mask and writing, one, two or more regions 10 to be routed may be formed on the substrate 100, one, two or more PTH holes 20 may be formed in each region 10 to be routed, and when two or more regions 10 to be routed are formed on the substrate 100, no PTH hole 20 may be formed in a portion of the region 10 to be routed.

S20: the peelable glue 30 is inserted into the PTH hole 20 located inside the area 10 to be grooved.

Specifically, the peelable glue 30 is a glue which can be peeled off after being cured, and the peelable glue 30 can be plugged into the PTH hole 20 by a plugging machine in actual operation. The peelable glue 30 does not need to be plugged into the PTH hole 20 which is not located in the to-be-milled-groove area 10, and the peelable glue 30 only needs to be plugged into the PTH hole 20 which is located in the to-be-milled-groove area 10.

S30: the peelable glue 30 is cured.

Specifically, a multi-layer frame may be used to pad the bottom of the substrate 100, which is plugged with the peelable glue 30 in the PTH hole 20, with the copper-free substrate 100 for baking and curing, so that the peelable glue 30 is cured in the PTH hole 20 to support the hole wall of the PTH hole 20.

S40: and routing depth control grooves 40 on the substrate 100 corresponding to the groove region 10 to be routed.

Specifically, fill in strippable glue 30 and the base plate 100 after the solidification in PTH hole 20 and be fixed in the deep gong machine of accuse, at first carry out mesa or face with the optical ruler of the deep gong machine of accuse and survey to obtain the lower sword height control of the deep gong machine of accuse, if same equipment is the multiaxis, if four-axis or six-axis gong board simultaneously, need do the detection of mesa or face together to each axle when doing first, the machine can carry out the independent compensation to each axle automatically.

In prior art, treat gong under the condition of groove region 10 if there are a plurality of PTH holes 20, when gong out accuse deep groove 40, it has how many PTH holes 20 of gong groove region 10 to wait for same, just need to do the action of carrying the sword and cutting down again several times, the reason is PTH hole 20 is the fretwork state among the prior art, when gong out accuse deep groove 40, must outwards carry out accuse deep gong and mill from PTH hole 20 drill way, if gong in not going into from PTH hole 20 drill way, gong sword can drag the hole copper in PTH hole 20, lead to PTH hole 20's pore wall separation, and the condition such as flash is produced in PTH hole 20's drill way position.

According to the depth control groove 40, the processing path is that only one cutter lowering action is needed for one to-be-milled groove area 10 no matter a plurality of PTH holes 20 are provided, the to-be-milled groove area 10 is milled completely after the cutter lowering, the action of the cutter lowering after the cutter lifting is not needed in the process, the PTH holes 20 after hole plugging are in a fully filled state, supports are arranged in the holes and outside the holes of the PTH holes 20 at the moment, the path of the depth control groove 40 does not need to control the entering of the cutter from the hole openings of the PTH holes 20, the cutter can be lowered from any position, the whole to-be-milled groove area 10 can be milled by the cutter lowering once, the height error caused by multiple times of cutter lifting can be improved, the cutter lifting action is reduced, and the processing efficiency is improved.

According to the depth control groove processing method provided by the invention, the peelable glue 30 is firstly filled into the PTH hole 20 positioned in the to-be-grooved region 10, the peelable glue 30 is cured, and the depth control groove 40 is formed on the substrate 100 corresponding to the to-be-grooved region 10, so that the peelable glue 30 filled into the PTH hole 20 can effectively support the hole wall of the PTH hole 20 when the depth control groove 40 is formed, and the problems of burr, pulling, peeling and the like are avoided.

Referring to fig. 2 to fig. 6, in some embodiments, after routing the depth control groove 40 on the substrate 100 corresponding to the to-be-routed groove area 10, the method for processing the depth control groove further includes: the peelable glue 30 in the PTH hole 20 is removed.

Specifically, the peelable glue 30 in the PTH hole 20 may be removed manually or the like to restore the function of the PTH hole 20. Meanwhile, the strippable glue 30 in the PTH hole 20 is removed, so that the hole wall of the PTH hole 20 is prevented from being damaged.

Referring to fig. 4, fig. 5 and fig. 6, in some embodiments, after routing depth control grooves on the substrate 100 corresponding to the groove routing region 10, the substrate 100 is subjected to routing processing to obtain a plurality of circuit board units, and then the peelable glue 30 is removed.

Optionally, the board routing machine is used for routing the substrate 100 into a plurality of circuit board units along the outlines of the circuit board units according to the requirement of installation design dimensions, and the strippable glue 30 is still filled in the PTH holes 20 in the routing process, so that damage to the PTH holes 20 in the routing process can be reduced.

Referring to fig. 6, in some embodiments, after the peelable glue 30 is removed, the substrate 100 is cleaned.

By cleaning the substrate 100, the chips generated when the deep groove 40 is routed can be cleaned, and the chips generated when the board is routed can also be cleaned and removed.

After the cleaned substrate 100 is subjected to electrical measurement (such as high-voltage electrical measurement and short circuit opening of a test circuit), FQC (such as poor appearance as bending board warping, plating uniformity and oxidation condition detection and whether burrs and peeling exist at routing slots or not through board bending board warping and appearance inspection machine inspection) and FQA (such as nuclear inspection of products detected by FQC), qualified products can be packaged and delivered.

Referring to fig. 1, fig. 2 and fig. 5, in some embodiments, routing the depth control groove 40 on the substrate 100 corresponding to the to-be-routed groove area 10 includes:

firstly, the substrate 100 with the groove area 10 facing upwards is placed on the table top of a depth control gong machine with a vacuum suction function, and the substrate 100 is closely attached to the table top of the depth control gong machine under vacuum adsorption.

Specifically, fill in strippable glue 30 and the base plate 100 after the solidification in PTH hole 20 and place on the dark gong machine of accuse, open the evacuation function of the dark gong machine of accuse, be fixed in the dark gong machine of accuse with base plate 100 through vacuum adsorption on, because the stopper has strippable glue 30 in PTH hole 20 this moment, for encapsulated situation, can not lead to the vacuum adsorption ability variation of the dark gong machine of accuse to make base plate 100's fixity relatively poor because of PTH hole 20 gas leakage during the evacuation, influence follow-up machining precision.

And then routing a depth control groove 40 on the substrate 100 through a depth control routing machine corresponding to the region 10 to be routed.

Because be fixed in the dark gong machine of accuse with base plate 100 through vacuum adsorption, the plug has strippable glue 30 in PTH hole 20 this moment, for encapsulated situation for the vacuum adsorption ability of the dark gong machine of accuse is better, and the fixity of base plate 100 is better, and base plate 100 can not take place to rock easily when the dark groove 40 of gong accuse, has guaranteed the machining precision of the dark groove of accuse.

Through adopting above-mentioned scheme, adopt vacuum adsorption to be fixed in the dark gong machine of accuse with base plate 100 on, because the PTH hole 20 internal stopper has strippable to glue 30, for encapsulated situation, can not lead to the dark gong machine vacuum adsorption capacity variation of accuse to make base plate 100's fixity relatively poor because of sending PTH hole 20 gas leakage during the evacuation, guaranteed that base plate 100 can not take place to rock easily when the dark groove of gong accuse, improved the machining precision of accuse deep groove.

Referring to fig. 2, fig. 3 and fig. 5, in some embodiments, when the depth control groove 40 is routed on the substrate 100 by the depth control routing machine, the lower cutting point of the depth control routing machine is an arbitrary position in the to-be-routed groove area 10.

Through adopting above-mentioned scheme, one treats gong groove region 10 and all only need do a lower sword action no matter there are several PTH holes 20, accuse deep groove 40 machining route for from the lower knife point after cutting off and gong to the same whole gong of gong groove region 10 of treating, the lower knife point of accuse deep gong machine for treat gong groove region 10 in the optional position can, make things convenient for the tool setting, do not need again in the accuse deep groove 40 course of working to do the action of lower sword behind the griffe, can improve the high error because of griffe leads to many times, and reduce the griffe action, the efficiency of processing board has been improved.

Referring to fig. 4 to 6, in some embodiments, when the peelable glue 30 is inserted into the PTH holes 20 in the to-be-grooved area 10, the peelable glue 30 is inserted into the PTH holes 20 by screen printing using a hole-filling screen plate having the same hole diameter as the PTH holes 20.

Specifically, a drilling belt is designed, a copper-free base or plughole aluminum sheet is selected to drill a plughole screen corresponding to a PHT hole in a groove region 10 to be milled, the hole diameter is required to be as large as a PTH hole 20, glue overflow is avoided, white paper is padded under the plughole screen, the situation that glue overflow on the bottom surface causes the height of a base plate 100 plate surface to cause deviation to the size in the groove region is avoided, and the strippable glue 30 is stuffed into the PTH hole 20 in the groove region to be controlled in depth in a screen printing mode.

Referring to fig. 2 and 3, in some embodiments, before the peelable glue 30 is filled into the PTH hole 20 in the to-be-grooved region 10, the substrate 100 is subjected to a gold immersion treatment.

By adopting the scheme, the poor gold deposition caused by the strippable glue 30 on the substrate 100 is avoided, and the yield of the gold deposition treatment process is improved.

In some of these embodiments, peelable glue 30 is a blue glue.

Specifically, the blue gel is a blue viscous liquid with the viscosity of 900 +/-10% dPS, the curing and baking temperature is 150 ℃, the baking time is 30-45 min, the blue gel is cured into a solid from the liquid through baking, the blue gel is widely used, and the cost is low.

Embodiments of a second aspect of the present application provide a circuit board manufactured by the depth control groove processing method of the first aspect.

According to the circuit board, the peelable glue 30 is filled in the PTH 20, so that the peelable glue 30 can effectively support the hole wall of the PTH when the depth control groove is formed, the situations of burrs, strains, peeling and the like of the hole wall of the PTH are prevented, and the quality of the circuit board is ensured.

The above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.

Claims

1. A depth control groove machining method is characterized by comprising the following steps:

filling peelable glue into the PTH hole in the area to be grooved;

curing the peelable glue;

2. The depth control groove processing method according to claim 1, wherein after the depth control groove is routed on the substrate corresponding to the region to be routed, the depth control groove processing method further comprises: and removing the peelable glue in the PTH hole.

3. The depth control groove processing method according to claim 2, wherein after the depth control groove is routed on the substrate corresponding to the region to be routed, the substrate is routed to obtain a plurality of circuit board units, and then the peelable glue is removed.

4. The depth control groove processing method according to claim 3, wherein the substrate is cleaned after the peelable glue is removed.

5. The depth control groove processing method according to claim 1, wherein routing a depth control groove on the substrate corresponding to the region to be routed comprises:

6. The depth control groove processing method according to claim 5, wherein when the depth control groove is routed on the substrate by the depth control routing machine, a lower cutting point of the depth control routing machine is any position in the region to be routed.

7. The depth control groove processing method according to claim 1, wherein when a peelable rubber is inserted into the PTH hole located inside the region to be grooved, the peelable rubber is inserted into the PTH hole by screen printing using a jack screen plate having the same hole diameter as the PTH hole.

8. The depth control groove processing method according to claim 1, wherein the substrate is subjected to a gold immersion treatment before a peelable adhesive is inserted into the PTH hole located in the region to be grooved.

9. The depth control groove machining method according to claim 1, wherein the peelable glue is blue glue.