CN113477583A - Feeding system of full-automatic degumming machine for semiconductor packaging - Google Patents
Feeding system of full-automatic degumming machine for semiconductor packaging Download PDFInfo
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- CN113477583A CN113477583A CN202111047933.2A CN202111047933A CN113477583A CN 113477583 A CN113477583 A CN 113477583A CN 202111047933 A CN202111047933 A CN 202111047933A CN 113477583 A CN113477583 A CN 113477583A
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 97
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 20
- 238000004140 cleaning Methods 0.000 claims abstract description 99
- 239000000463 material Substances 0.000 claims abstract description 60
- 230000003139 buffering effect Effects 0.000 claims abstract description 19
- 238000001179 sorption measurement Methods 0.000 claims abstract description 17
- 239000000428 dust Substances 0.000 claims description 33
- 229910052751 metal Inorganic materials 0.000 claims description 22
- 239000002184 metal Substances 0.000 claims description 22
- 239000003292 glue Substances 0.000 claims description 9
- 229920000742 Cotton Polymers 0.000 claims description 8
- 235000017166 Bambusa arundinacea Nutrition 0.000 claims description 6
- 235000017491 Bambusa tulda Nutrition 0.000 claims description 6
- 241001330002 Bambuseae Species 0.000 claims description 6
- 235000015334 Phyllostachys viridis Nutrition 0.000 claims description 6
- 239000011425 bamboo Substances 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 5
- 238000007664 blowing Methods 0.000 claims description 4
- 230000008859 change Effects 0.000 claims description 4
- 239000000696 magnetic material Substances 0.000 claims description 4
- 238000010030 laminating Methods 0.000 claims description 2
- 239000000725 suspension Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 12
- 238000007599 discharging Methods 0.000 abstract description 9
- 229920002120 photoresistant polymer Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000005096 rolling process Methods 0.000 description 3
- 239000012535 impurity Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- -1 etc. Chemical compound 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 230000010365 information processing Effects 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000008188 pellet Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000012495 reaction gas Substances 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
- B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B13/00—Accessories or details of general applicability for machines or apparatus for cleaning
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
- B08B7/02—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by distortion, beating, or vibration of the surface to be cleaned
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Packaging Frangible Articles (AREA)
- Cleaning In General (AREA)
Abstract
The invention relates to the technical field of feeding equipment and discloses a feeding system of a full-automatic semiconductor packaging degumming machine. Comprises a supporting plate and a supporting seat arranged at one side of the upper end of the supporting plate, elastic net ropes are arranged between the inner walls of the cleaning cavity in a criss-cross manner, inclined lifting ropes are arranged at the bottoms of the elastic net ropes in a funnel shape, the bottoms of the two buffer rings are respectively and fixedly connected with the top end of the discharging ring, the buffer rings are evenly arranged among the side walls of the inclined lifting ropes at the upper end of the discharging ring in parallel, elastic cleaning strips are uniformly arranged between the inclined inner walls of the cleaning cylinders, the rotary adsorption piece is used for adsorbing and fixing the semiconductor conveyed by the conveying crawler belt and then lifting up, when the semiconductor rotates to the port of the cleaning cavity, the semiconductor is blocked by the port along the wall and slides to the upper end of the cleaning cylinder along the material receiving inclined plate, the cleaning cylinder is driven by the rotation of the rotary roller to extrude and clean the semiconductor, then the semiconductor is buffered from the cleaning barrel to the elastic net rope through the gap, falls to the buffering ring from the gap during buffering, and is cleaned by the elastic cleaning strip on the inner wall in a vibration mode during sliding, and the cleaning effect is further improved.
Description
Technical Field
The invention relates to the technical field of feeding equipment, in particular to a feeding system of a full-automatic degumming machine for semiconductor packaging.
Background
The semiconductor is a substance with conductivity between an insulator and a conductor, and the conductivity of the semiconductor is easy to control and can be used as an element material for information processing. Common semiconductor materials are silicon, germanium, gallium arsenide, etc., and silicon is the most influential of various semiconductor materials in commercial applications. Scribble the photoresist on the semiconductor outer wall, need use the photoresist remover to carry out the photoresist when encapsulating it, utilize microwave plasma to carry out the ionization with oxygen or other reaction gas, form chemical activity's free radical, then react with the photoresist, generate volatilizable material, are taken out the cavity by the vacuum pump to realize the function that photoresist sculpture and got rid of.
The semiconductor is required to be continuously conveyed by a feeding device during photoresist stripping, the outer wall of the semiconductor can be contaminated by dust and impurities in the processing and conveying process, the photoresist stripping effect of the semiconductor can be influenced by the dust and the impurities attached to the outer wall of the semiconductor, and particularly, the dust contaminated on the outer wall of the semiconductor can be more. However, the feeding device of the conventional semiconductor photoresist remover lacks a function of cleaning the semiconductor, and cannot effectively remove dust on the outer wall of the semiconductor, so that the photoresist removing effect of the semiconductor is poor.
Therefore, a loading system of a full-automatic degumming machine for semiconductor packaging is provided.
Disclosure of Invention
The invention aims to provide a feeding system of a full-automatic semiconductor packaging degumming machine, and aims to solve the problem that the feeding device of the existing semiconductor degumming machine in the background art is poor in semiconductor degumming effect due to the fact that the feeding device is lack of a function of cleaning semiconductors and cannot remove dust on the outer walls of the semiconductors.
In order to achieve the purpose, the invention provides the following technical scheme: a loading system of a full-automatic semiconductor packaging degumming machine comprises a supporting plate and a supporting seat arranged on one side of the upper end of the supporting plate, wherein a cleaning box is arranged on the top of the supporting seat, an invagination mounting platform is arranged on one side of the top of the cleaning box, supporting frames are arranged on two sides of the upper end of a bottom plate of the invagination mounting platform, a conveying crawler belt is arranged between the side walls of the supporting frames and extends to the outside of the invagination mounting platform, a rotary adsorption piece is arranged between the inner walls of two sides of the invagination mounting platform on the top of the cleaning box and is used for adsorbing semiconductors conveyed at the upper end of the conveying crawler belt, a cleaning cavity is arranged in the cleaning box far away from one side of the invagination mounting platform, a top port of the cleaning cavity is arranged close to the invagination mounting platform, a material receiving inclined plate is obliquely arranged on the inner wall of the top port of the cleaning cavity, a buffer cleaning piece is arranged between the inner walls of the adjacent lower ends of the material receiving inclined plates, and a material discharging channel is arranged at the bottom of the cleaning cavity, the upper end of the supporting plate at the bottom of the discharging channel is provided with a feeding assembly;
buffering clearance piece includes that even vertically and horizontally staggered sets up the elastic net rope between clearance intracavity wall, separates each other between the elastic net rope, and the bottom of elastic net rope is that the infundibulate evenly is provided with oblique lifting rope, the bottom of oblique lifting rope is fixed connection respectively in the top of blowing ring, and evenly be provided with the buffering ring side by side between the oblique lifting rope lateral wall of blowing ring upper end, the buffering ring is the infundibulate structure, even interval is provided with the elasticity clearance strip between its slope inner wall, elasticity clearance strip end is the adjacent department in buffering ring port center of annular suspension.
Further, rotatory absorption piece is including setting up the pivot between the inner wall of sunken mounting platform, the fixed cover of having connect the carousel on the outer wall of pivot, the carousel suspends in the upper end of conveying track, and even interval is provided with the evacuation adsorption seat on the cambered surface outer wall of carousel, the evacuation adsorption seat is hollow structure, be provided with evacuation equipment on its one side outer wall, the setting of conveying track up end is pressed close to the evacuation adsorption seat, and the evacuation adsorption seat is provided with on keeping away from one side outer wall of stiff end and adsorbs the hole, it is used for adsorbing fixed semiconductor.
Furtherly, connect the slope upper end of material swash plate to set up and highly be less than clearance chamber port height, connect the slope lower extreme top of material swash plate to run through and seted up the mounting groove, evenly be provided with between the both sides inner wall of mounting groove and change the roller, be provided with a clearance section of thick bamboo on changing the outer wall of roller, evenly be provided with the cotton piece of clearance on the outer wall of a clearance section of thick bamboo, the crisscross setting of adjacent cotton piece of clearance.
Furthermore, a dust hood is arranged on the inner wall of the cleaning cavity on one side of the buffering cleaning piece, a connecting pipe of the dust hood penetrates through the side wall of the cleaning cavity and extends into the cavity inside the cleaning box, the tail end of the connecting pipe is connected with the input end of a dust collection fan, the dust collection fan is arranged at the upper end of the cavity bottom plate and is arranged below the sunken mounting platform, the output end of the dust collection fan is connected with one end of a dust exhaust pipe, and the other end of the dust exhaust pipe penetrates through the side wall of the cavity and extends to the outside of the cleaning box.
Furthermore, the elastic cleaning strip is a component made of elastic plastic materials, friction protrusions are evenly arranged on the outer wall of the elastic cleaning strip, a limiting cavity is formed in the tail end of the elastic cleaning strip, an eccentric large ball is placed in the limiting cavity, an eccentric small ball is placed in the hollow cavity of the eccentric large ball, and the eccentric large ball and the eccentric small ball are of local hollow structures.
Furthermore, the shape of the friction bulges is one of a hemisphere, a strip or a wave, the adjacent friction bulges are arranged in a staggered manner, the hollow cavity of the eccentric big ball is of a spherical structure, and the diameter of the eccentric small ball is smaller than that of the hollow cavity of the eccentric big ball.
Further, throw the material subassembly and include the brace table that is connected with the backup pad, the top of brace table is provided with the revolving stage, the brace table is hollow structure, its inside driving motor that is provided with, driving motor top output is connected in revolving stage lower extreme middle part department, the upper end border department of revolving stage is provided with the same material cassette that connects at even interval, connect the material cassette to be close to revolving stage border one side and be provided with and connect the silo, connect the silo to correspond the setting of unloading passageway bottom port, it is used for the joint to put in the semiconductor of board type.
Further, connect material cassette connect silo both sides inner wall within a definite time be close to bottom department and be provided with the rotary rod, one side outer wall middle part department of rotary rod is provided with the pressure board, even fixedly connected with gag lever post on its opposite side outer wall, is the setting of V style of calligraphy between gag lever post and pressure board, and the rotary rod both ends all run through and connect silo both ends lateral wall and extend to its outside, and its terminal fixedly connected with is spacing dish, and spacing dish laminating connects material cassette lateral wall setting.
Furthermore, fixedly connected with bracing piece on the spacing dish lateral wall of rotary rod one end, the bracing piece is on a parallel with the gag lever post setting, and the terminal fixedly connected with metal sheet of bracing piece, and the metal sheet can be adsorbed by magnetic material.
Furthermore, a timing control box is arranged on the side wall of the material receiving clamping seat at the same side of the metal plate, the timing control box is arranged on the side wall of the material receiving clamping seat at the upper end of the limiting disc, an electromagnet is arranged on the outer wall of the timing control box, which is close to one side of the port of the material receiving groove, and is arranged corresponding to the metal plate, a fixed plate is arranged at the bottom of the timing control box at the lower end of the electromagnet, and an elastic buffering part is arranged on one side of the fixed plate.
Compared with the prior art, the invention has the following beneficial effects:
1. the invention provides a loading system of a semiconductor packaging full-automatic degumming machine, wherein a material receiving inclined plate is obliquely arranged between inner walls at the end opening of a cleaning cavity, a mounting groove is arranged on the material receiving inclined plate, cleaning barrels with cleaning cotton blocks on the outer walls are arranged between the inner walls at two sides of the mounting groove by utilizing a rotating roller, elastic net ropes are arranged between the inner walls of the cleaning cavity at the lower end of the cleaning barrels in a criss-cross mode, inclined lifting ropes are arranged at the bottoms of the elastic net ropes in a funnel shape, the bottoms of the inclined lifting ropes are respectively and fixedly connected to the top end of a material discharging ring, buffer rings are uniformly arranged between the side walls of the inclined lifting ropes at the upper end of the material discharging ring in parallel, elastic cleaning strips are uniformly arranged between the inclined inner walls, the tail ends of the elastic cleaning strips are circularly suspended at the adjacent centers of the end openings of the buffer rings, a rotary adsorption piece adsorbs and fixes semiconductors conveyed by a conveying crawler belt and then lifts up, when the semiconductors rotate to the end opening of the cleaning cavity, the semiconductor is blocked by the end opening of the buffer rings, and slides to the upper end of the cleaning barrels along the material receiving inclined plate, it extrudes the clearance to change roller rotation drive clearance section of thick bamboo to the semiconductor, and the semiconductor is followed a clearance section of thick bamboo and is buffered on dropping to the elasticity net rope through the gap, drops to the buffering ring during the buffering from its gap on, receives the elasticity clearance strip on its inner wall to vibrate the clearance during the landing, further improves the clearance effect, avoids the dust on its outer wall to influence the efficiency of removing glue.
2. The invention provides a feeding system of a semiconductor packaging full-automatic degumming machine, wherein friction bulges are uniformly arranged on the outer wall of an elastic cleaning strip, the shape of the friction bulges is one of hemispherical shape, strip shape and wave shape, the adjacent friction bulges are arranged in a staggered way, a limiting cavity is arranged in the tail end of the elastic cleaning strip, an eccentric big ball is arranged in the limiting cavity, an eccentric small ball is arranged in the hollow cavity of the eccentric big ball, the eccentric big ball and the eccentric small ball are both in a local hollow structure, the hollow cavity of the eccentric big ball is in a ball structure, the diameter of the eccentric small ball is smaller than that of the hollow cavity of the eccentric big ball, when the elastic cleaning strip is impacted by a semiconductor, the eccentric big ball rolls in the limiting cavity in a non-directional manner, meanwhile, the eccentric small ball rolls in the hollow cavity in the eccentric big ball in a non-directional manner, and the non-directional rolling of the eccentric big ball and the eccentric small ball is utilized to intensify the vibration effect of the elastic cleaning strip, thereby make the protruding dust debris vibrations clearance effect on the semiconductor outer wall of strengthening of friction, convenient and practical.
3. The invention provides a feeding system of a full-automatic semiconductor packaging degumming machine, wherein a receiving material clamping seat is uniformly arranged at the upper end edge of a rotating table, a rotating rod is arranged between the inner walls of the two sides of a receiving groove of the receiving material clamping seat and is close to the bottom, a pressure-bearing plate and a limiting rod are respectively arranged on the outer walls of the two sides of the rotating rod, the limiting rod and the pressure-bearing plate are arranged in a V shape, the two ends of the rotating rod both penetrate through the side walls of the two ends of the receiving groove and extend to the outside, the tail end of the rotating rod is fixedly connected with a limiting disc, a metal plate is arranged on the side wall of the limiting disc at one end of the rotating rod through a supporting rod and can be adsorbed by magnetic materials, a timing control box is arranged on the side wall of the receiving material clamping seat at the same side of the metal plate, an electromagnet is arranged on the outer wall of one side close to the port of the receiving groove, the electromagnet is arranged corresponding to the metal plate, a fixing plate is arranged at the bottom of the timing control box at the lower end of the electromagnet, an elastic buffer component is arranged on one side of the fixing plate, semiconductor from the passageway landing of unloading after to connect the silo of connecing of material cassette, it is rotatory to be pushed down to drive the rotary rod by the semiconductor by the pressure board, make the terminal cooperation of upwards deflecting of rotary rod connect the fixed semiconductor of silo centre gripping, the electro-magnet adsorbs the metal sheet and fixes the rotary rod simultaneously, stability when guaranteeing semiconductor rotary transport, the metal sheet is rather than the separation after the electro-magnet regularly circular telegram is ended, elastic buffer part promotes the further separation of metal sheet and drives the rotary rod counter-rotation, it is fixed to make the gag lever post relieve the centre gripping of semiconductor, semiconductor slope is thrown to the degumming machine feed inlet from connecing the silo port afterwards, the centre gripping is stable for semiconductor transport, the problem that drops when can avoiding current centre gripping conveying equipment to carry.
Drawings
FIG. 1 is a schematic view of the overall structure of a feeding system of a full-automatic semiconductor packaging degumming machine according to the present invention;
FIG. 2 is an enlarged schematic structural view of a part A of the loading system of the full-automatic semiconductor package degumming machine of the present invention;
FIG. 3 is a cross-sectional view of a cleaning box of the feeding system of the full-automatic semiconductor package degumming machine according to the present invention;
FIG. 4 is a schematic structural view of a buffer cleaning member of the feeding system of the full-automatic semiconductor package degumming machine according to the present invention;
FIG. 5 is a cross-sectional view of an elastic cleaning strip of the feeding system of the full-automatic semiconductor package degumming machine according to the present invention;
FIG. 6 is a schematic view of a rotary adsorption member of the feeding system of the full-automatic semiconductor package de-gluing machine of the present invention;
FIG. 7 is a schematic view of a feeding assembly of the feeding system of the full-automatic semiconductor package degumming machine according to the present invention;
FIG. 8 is a schematic structural view of a material receiving cassette of the loading system of the full-automatic semiconductor packaging degumming machine according to the present invention;
fig. 9 is an enlarged schematic structural diagram of a loading system of a full-automatic semiconductor packaging degumming machine in fig. 8 at the position B.
In the figure: 1. a support plate; 2. a supporting seat; 3. cleaning the box; 4. an invaginated mounting platform; 5. a support frame; 6. a conveying crawler; 7. a rotary adsorbing member; 71. a rotating shaft; 72. a turntable; 73. vacuumizing the adsorption seat; 74. an adsorption hole; 8. cleaning the cavity; 9. a material receiving sloping plate; 91. mounting grooves; 92. rotating the roller; 93. cleaning the cylinder; 94. cleaning cotton blocks; 10. a buffer cleaning member; 101. an elastic net rope; 102. an inclined lifting rope; 103. a discharge ring; 104. a buffer ring; 105. elastic cleaning strips; 1051. a friction projection; 1052. a limiting cavity; 1053. an eccentric large ball; 1054. an eccentric pellet; 11. a discharge passage; 12. a feeding assembly; 121. a support table; 122. a rotating table; 123. a material receiving clamping seat; 1231. rotating the rod; 1232. a pressure receiving plate; 1233. a limiting rod; 1234. a limiting disc; 1235. a support bar; 1236. a metal plate; 1237. a timing control box; 1238. an electromagnet; 1239. a fixing plate; 12310. an elastic buffer member; 13. a dust collection cover; 14. a cavity; 15. a dust collection fan; 16. a dust exhaust pipe.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, 2 and 3, the loading system of the full-automatic semiconductor packaging degumming machine comprises a supporting plate 1 and a supporting seat 2 arranged on one side of the upper end of the supporting plate 1, a cleaning box 3 is arranged on the top of the supporting seat 2, an invagination mounting platform 4 is arranged on one side of the top of the cleaning box 3, supporting frames 5 are arranged on two sides of the upper end of a bottom plate of the invagination mounting platform 4, a conveying crawler 6 is arranged between the side walls of the supporting frames 5, the conveying crawler 6 extends to the outside of the invagination mounting platform 4, a rotary adsorption piece 7 is arranged between the inner walls of two sides of the invagination mounting platform 4 on the top of the cleaning box and is used for adsorbing semiconductors conveyed by the upper end of the transfer conveying crawler 6, a cleaning cavity 8 is arranged inside one side of the cleaning box 3 far away from the invagination mounting platform 4, a top port of the cleaning cavity 8 is arranged close to the invagination mounting platform 4, a material receiving sloping plate 9 is arranged on the inner wall of the top port of the cleaning cavity 8, connect and be provided with buffering clearance piece 10 between the adjacent clearance chamber 8 inner walls of department of material swash plate 9 lower extreme, and clearance chamber 8 bottom is provided with discharge passage 11, and the material subassembly 12 is thrown to 1 upper ends of backup pad of discharge passage 11 bottom.
The inclined upper end of the material receiving inclined plate 9 is lower than the port height of the cleaning cavity 8, the top of the inclined lower end of the material receiving inclined plate 9 is provided with a mounting groove 91 in a penetrating manner, rotating rollers 92 are uniformly arranged between the inner walls of the two sides of the mounting groove 91, a cleaning barrel 93 is arranged on the outer wall of each rotating roller 92, cleaning cotton blocks 94 are uniformly arranged on the outer wall of each cleaning barrel 93, and the adjacent cleaning cotton blocks 94 are arranged in a staggered manner; the inner wall of the cleaning cavity 8 on one side of the buffering cleaning piece 10 is provided with a dust hood 13, a connecting pipe of the dust hood 13 penetrates through the side wall of the cleaning cavity 8 and extends to a cavity 14 inside the cleaning box 3, the tail end of the connecting pipe is connected with the input end of a dust collection fan 15, the dust collection fan 15 is arranged at the upper end of a bottom plate of the cavity 14 and is arranged below the sunken mounting platform 4, the output end of the dust collection fan 15 is connected with one end of a dust exhaust pipe 16, and the other end of the dust exhaust pipe 16 penetrates through the side wall of the cavity 14 and extends to the outside of the cleaning box 3.
Referring to fig. 3 and 4, the buffer cleaning member 10 includes elastic net ropes 101 uniformly and criss-cross arranged between the inner walls of the cleaning chamber 8, the elastic net ropes 101 are separated from each other, inclined lifting ropes 102 are uniformly arranged at the bottoms of the elastic net ropes 101 in a funnel shape, the bottoms of the inclined lifting ropes 102 are respectively and fixedly connected to the top ends of the material discharging rings 103, buffer rings 104 are uniformly arranged between the side walls of the inclined lifting ropes 102 at the upper ends of the material discharging rings 103 in parallel, the buffer rings 104 are in funnel shapes, elastic cleaning strips 105 are uniformly arranged at intervals between the inclined inner walls, and the tail ends of the elastic cleaning strips 105 are annularly suspended at the adjacent centers of the ports of the buffer rings 104.
Referring to fig. 4 and 5, the elastic cleaning strip 105 is a member made of an elastic plastic material, friction protrusions 1051 are uniformly arranged on the outer wall of the elastic cleaning strip 105, a limit cavity 1052 is arranged inside the end of the elastic cleaning strip 105, an eccentric large ball 1053 is placed inside the limit cavity 1052, eccentric small balls 1054 are placed inside the hollow cavity of the eccentric large ball 1053, the eccentric large ball 1053 and the eccentric small ball 1054 are both partially hollow structures, the friction protrusions 1051 are shaped as one of a hemisphere, a strip or a wave, the adjacent friction protrusions 1051 are staggered in height, the hollow cavity of the eccentric large ball 1053 is a ball structure, the diameter of the eccentric small ball 1054 is smaller than the hollow cavity diameter of the eccentric large ball 1053, when the elastic cleaning strip 105 is impacted by a semiconductor, the eccentric large ball 1053 rolls unidirectionally in the limit cavity 1052, and the eccentric small balls 1054 rolls unidirectionally in the hollow cavity of the eccentric large ball 1053, the vibration effect of the elastic cleaning strip 105 is intensified by the non-directional rolling of the eccentric large ball 1053 and the eccentric small ball 1054, so that the friction bulge 1051 is promoted to enhance the vibration cleaning effect on dust and sundries on the outer wall of the semiconductor.
Referring to fig. 1 and 6, the rotary adsorbing member 7 includes a rotating shaft 71 disposed between inner walls of the recessed mounting platform 4, a rotating plate 72 is fixedly sleeved on an outer wall of the rotating shaft 71, the rotating plate 72 is suspended at an upper end of the conveying track 6, and evacuation adsorbing seats 73 are uniformly disposed on an outer wall of an arc surface of the rotating plate 72 at intervals, the evacuation adsorbing seats 73 are of a hollow structure, an evacuation device is disposed on an outer wall of one side thereof, the evacuation adsorbing seats 73 are disposed close to an upper end surface of the conveying track 6, and an adsorbing hole 74 is disposed on an outer wall of one side of the evacuation adsorbing seats 73 away from a fixed end and used for adsorbing and fixing a semiconductor, the evacuation adsorbing seats 73 adsorb and fix the semiconductor conveyed by the conveying track 6 through the adsorbing hole 74 and lift up, and block the semiconductor along a wall by a port thereof when rotating to a port of the cleaning cavity 8, and slide to an upper end of the cleaning barrel 93 along the material receiving sloping plate 9.
Referring to fig. 1, 7, 8 and 9, the feeding assembly 12 includes a supporting platform 121 connected to the supporting plate 1, a rotating platform 122 is disposed on the top of the supporting platform 121, the supporting platform 121 is a hollow structure and is internally provided with a driving motor, the top output end of the driving motor is connected to the middle of the lower end of the rotating platform 122, the same material receiving clamping seats 123 are uniformly arranged at intervals on the upper end edge of the rotating platform 122, a material receiving groove is disposed on one side of the material receiving clamping seat 123 close to the edge of the rotating platform 122, and the material receiving groove is disposed corresponding to the bottom port of the discharging channel 11 and is used for clamping and feeding the plate-type semiconductor.
A rotating rod 1231 is arranged between the inner walls of the two sides of the receiving groove of the receiving clamp seat 123 near the bottom, a pressed plate 1232 is arranged in the middle of the outer wall of one side of the rotating rod 1231, a limiting rod 1233 is uniformly and fixedly connected to the outer wall of the other side of the receiving groove, a V-shaped arrangement is formed between the limiting rod 1233 and the pressed plate 1232, both ends of the rotating rod 1231 penetrate through the side walls of the two ends of the receiving groove and extend to the outside of the receiving groove, a limiting disc 1234 is fixedly connected to the tail end of the rotating rod 1231, the limiting disc 1234 is arranged to be attached to the side wall of the receiving clamp seat 123, a supporting rod 1235 is fixedly connected to the side wall of the limiting disc 1234, the supporting rod 1235 is arranged in parallel to the limiting rod 1233, a metal plate 1236 is fixedly connected to the tail end of the supporting rod 1235, the metal plate 1236 can be adsorbed by magnetic materials, a timing control box 1237 is arranged on the side wall of the receiving clamp seat 123 at the same side of the metal plate 1236, the timing control box 1237 is arranged on the side wall of the receiving groove 123, and an electromagnet 1238 is arranged on the side of the receiving groove port of the timing control box 1237 near the receiving groove, the electromagnet 1238 is disposed corresponding to the metal plate 1236, the fixing plate 1239 is disposed at the bottom of the timing control box 1237 at the lower end of the electromagnet 1238, and the elastic buffer member 12310 is disposed at one side of the fixing plate 1239.
The working principle is as follows: the rotary adsorption piece 7 adsorbs and fixes the semiconductor conveyed by the conveying crawler 6 and lifts up, when the semiconductor rotates to the port of the cleaning cavity 8, the semiconductor is blocked by the port along the wall and falls off, the semiconductor slides to the upper end of the cleaning barrel 93 along the material receiving sloping plate 9, the roller 92 rotationally drives the cleaning barrel 93 to extrude and clean the semiconductor, then the semiconductor is buffered by the cleaning barrel 93 and falls onto the elastic net rope 101 through the gap, the semiconductor falls onto the buffer ring 104 from the gap during buffering, the semiconductor is cleaned by the elastic cleaning strip 105 on the inner wall during sliding, when the elastic cleaning strip 105 is impacted by the semiconductor, the eccentric big ball 1053 rolls in the limit cavity 1052 in a non-directional manner, meanwhile, the eccentric small ball 1054 rolls in the hollow cavity in the eccentric big ball 1053 in a non-directional manner, the effect of the elastic cleaning strip 105 is intensified by the non-directional rolling of the eccentric big ball 1053 and the eccentric small ball 1054, so that the friction bulge 1051 vibrates to intensify the effect of cleaning dust and sundries on the outer wall of the semiconductor, the semiconductor drops to connect the silo that connects of material cassette 123 after 11 landing from the passageway of unloading, it is rotatory to be pressed the drive rotary rod 1231 that board 1232 receives the semiconductor to push down, make the terminal cooperation of upwards deflecting of rotary rod 1231 connect the fixed semiconductor of silo centre gripping, electromagnet 1238 adsorbs metal sheet 1236 and fixes rotary rod 1231 simultaneously, stability when guaranteeing the semiconductor rotary conveying, metal sheet 1236 separates rather than after electromagnet 1238 regularly circular telegram is ended, elastic buffer part 12310 promotes metal sheet 1236 and further separates and drive rotary rod 1231 reverse rotation, it is fixed to make gag lever post 1233 remove the centre gripping of semiconductor, semiconductor slope is followed the silo port of connecing and is thrown to the degumming machine feed inlet afterwards, the centre gripping is stable for semiconductor transport, the problem that drops when can avoiding current centre gripping conveying equipment to carry.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (10)
1. Full-automatic bale splitter feeding system of semiconductor package, including backup pad (1) and set up in supporting seat (2) of backup pad (1) upper end one side, supporting seat (2) top is provided with clearance case (3), its characterized in that: an invagination mounting platform (4) is arranged on one side of the top of the cleaning box (3), support frames (5) are arranged on two sides of the upper end of a bottom plate of the invagination mounting platform (4), a conveying crawler (6) is arranged between the side walls of the support frames (5), the conveying crawler (6) extends to the outside of the invagination mounting platform (4), a rotary adsorption part (7) is arranged between the inner walls of two sides of the invagination mounting platform (4) on the top of the cleaning box and is used for adsorbing semiconductors conveyed on the upper end of the conveying crawler (6), a cleaning cavity (8) is arranged in one side of the cleaning box (3) far away from the invagination mounting platform (4), a top port of the cleaning cavity (8) is arranged close to the invagination mounting platform (4), an inclined plate material receiving (9) is obliquely arranged on the inner wall of the top port of the cleaning cavity (8), a buffer cleaning part (10) is arranged between the inner walls of the cleaning cavities (8) adjacent to the lower end of the material receiving inclined plate (9), a discharge channel (11) is arranged at the bottom of the cleaning cavity (8), and a feeding assembly (12) is arranged at the upper end of a supporting plate (1) at the bottom of the discharge channel (11);
buffering clearance spare (10) including even vertically and horizontally staggered arrangement in the elastic net rope (101) between clearance chamber (8) inner wall, separate each other between elastic net rope (101), and the bottom of elastic net rope (101) is the infundibulate and evenly is provided with oblique lifting rope (102), the bottom of oblique lifting rope (102) is fixed connection respectively in the top of blowing ring (103), and evenly be provided with buffering ring (104) side by side between oblique lifting rope (102) lateral wall of blowing ring (103) upper end, buffering ring (104) are the infundibulate structure, it is provided with elasticity clearance strip (105) at even interval between the slope inner wall, elasticity clearance strip (105) end is the annular and suspends the adjacent department in buffering ring (104) port center.
2. The loading system of the semiconductor packaging full-automatic glue removing machine according to claim 1, characterized in that: rotatory absorption piece (7) are including setting up pivot (71) between invagination mounting platform (4) inner wall, it has connect carousel (72) to fix the cover on the outer wall of pivot (71), carousel (72) suspension is in the upper end of conveying track (6), and even interval is provided with evacuation adsorption seat (73) on the cambered surface outer wall of carousel (72), evacuation adsorption seat (73) are hollow structure, be provided with evacuation equipment on its one side outer wall, evacuation adsorption seat (73) are pressed close to conveying track (6) up end and are set up, and evacuation adsorption seat (73) keep away from and are provided with on the one side outer wall of stiff end and adsorb hole (74), it is used for adsorbing fixed semiconductor.
3. The loading system of the semiconductor packaging full-automatic glue removing machine according to claim 1, characterized in that: connect the slope upper end of material swash plate (9) to set up highly to be less than clearance chamber (8) port height, connect the slope lower extreme top of material swash plate (9) to run through and seted up mounting groove (91), evenly be provided with between the both sides inner wall of mounting groove (91) and change roller (92), be provided with on the outer wall of change roller (92) a clearance section of thick bamboo (93), evenly be provided with the cotton piece of clearance (94) on the outer wall of a clearance section of thick bamboo (93), adjacent clearance cotton piece (94) crisscross setting.
4. The loading system of the semiconductor packaging full-automatic glue removing machine according to claim 1, characterized in that: be provided with dust cage (13) on the clearance chamber (8) inner wall of buffering clearance piece (10) one side, the connecting pipe of dust cage (13) runs through clearance chamber (8) lateral wall and extends to in clearance incasement portion's (3) cavity (14), its end is connected with the input of dust absorption fan (15), dust absorption fan (15) set up in cavity (14) bottom plate upper end, and set up in the below of sunken mounting platform (4), the output of dust absorption fan (15) is connected with the one end of dust exhaust pipe (16), the other end of dust exhaust pipe (16) runs through cavity (14) lateral wall and extends to the outside of clearance incasement (3).
5. The loading system of the semiconductor packaging full-automatic glue removing machine according to claim 4, characterized in that: elastic cleaning strip (105) is the component that elastic plastic material made, evenly is provided with friction protrusion (1051) on the outer wall of elastic cleaning strip (105), and the terminal inside of elastic cleaning strip (105) is provided with spacing chamber (1052), eccentric big ball (1053) have been placed to the inside of spacing chamber (1052), eccentric bobble (1054) have been placed to the cavity intracavity portion of eccentric big ball (1053), and eccentric big ball (1053) and eccentric bobble (1054) are local hollow structure.
6. The loading system of the semiconductor packaging full-automatic glue removing machine according to claim 5, characterized in that: the friction bulges (1051) are in one of a hemispherical shape, a strip shape or a wave shape, the adjacent friction bulges (1051) are arranged in a staggered way, the hollow cavity of the eccentric big ball (1053) is in a spherical structure, and the diameter of the eccentric small ball (1054) is smaller than that of the hollow cavity of the eccentric big ball (1053).
7. The loading system of the semiconductor packaging full-automatic glue removing machine according to claim 1, characterized in that: throw material subassembly (12) and include brace table (121) that are connected with backup pad (1), the top of brace table (121) is provided with revolving stage (122), brace table (121) are hollow structure, its inside is provided with driving motor, driving motor top output is connected in revolving stage (122) lower extreme middle part department, the even interval in upper end border department of revolving stage (122) is provided with the same and connects material cassette (123), it connects material cassette (123) to be close to revolving stage (122) border one side and is provided with and connects the silo, it corresponds discharge passage (11) bottom port setting to connect the silo, it is used for the joint to put in the semi-conductor of board type.
8. The semiconductor package full-automatic glue remover feeding system according to claim 7, wherein: connect material connect silo both sides inner wall of material cassette (123) to be close to bottom department and be provided with rotary rod (1231), one side outer wall middle part department of rotary rod (1231) is provided with receives board (1232), even fixedly connected with gag lever post (1233) on its opposite side outer wall, be the setting of V style of calligraphy between gag lever post (1233) and receive board (1232), and rotary rod (1231) both ends all run through and connect silo both ends lateral wall and extend to its outside, its terminal fixedly connected with spacing dish (1234), spacing dish (1234) laminating connects material cassette (123) lateral wall to set up.
9. The semiconductor package full-automatic glue remover feeding system according to claim 8, wherein: fixedly connected with bracing piece (1235) on spacing dish (1234) lateral wall of rotary rod (1231) one end, bracing piece (1235) are on a parallel with gag lever post (1233) and set up, and terminal fixedly connected with metal sheet (1236) of bracing piece (1235), and metal sheet (1236) can be adsorbed by magnetic material.
10. The semiconductor package full-automatic stripper feeding system of claim 9, wherein: the timing control box (1237) is arranged on the side wall of the material receiving clamping seat (123) on the same side of the metal plate (1236), the timing control box (1237) is arranged on the side wall of the material receiving clamping seat (123) on the upper end of the limiting disc (1234), an electromagnet (1238) is arranged on the outer wall of one side, close to the material receiving groove port, of the timing control box (1237), the electromagnet (1238) is arranged corresponding to the metal plate (1236), a fixing plate (1239) is arranged at the bottom of the timing control box (1237) at the lower end of the electromagnet (1238), and an elastic buffering part (12310) is arranged on one side of the fixing plate (1239).
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| CN202111047933.2A CN113477583B (en) | 2021-09-08 | 2021-09-08 | Feeding system of full-automatic degumming machine for semiconductor packaging |
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| CN202111047933.2A CN113477583B (en) | 2021-09-08 | 2021-09-08 | Feeding system of full-automatic degumming machine for semiconductor packaging |
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| CN113477583B CN113477583B (en) | 2021-11-19 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114102724A (en) * | 2021-10-18 | 2022-03-01 | 江门市奔力达电路有限公司 | Drill bit cleaning plate and device thereof |
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| US4483435A (en) * | 1978-01-24 | 1984-11-20 | New England Machinery, Inc. | Bottle conveying and cleaning apparatus |
| CN201632453U (en) * | 2010-01-13 | 2010-11-17 | 薛伯承 | Deduster of semiconductor element |
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| CN114102724A (en) * | 2021-10-18 | 2022-03-01 | 江门市奔力达电路有限公司 | Drill bit cleaning plate and device thereof |
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| CN113477583B (en) | 2021-11-19 |
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