CN113473794A - Heat dissipation module and electronic device - Google Patents
Heat dissipation module and electronic device Download PDFInfo
- Publication number
- CN113473794A CN113473794A CN202010511557.7A CN202010511557A CN113473794A CN 113473794 A CN113473794 A CN 113473794A CN 202010511557 A CN202010511557 A CN 202010511557A CN 113473794 A CN113473794 A CN 113473794A
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- heat dissipation
- heat
- fan
- electronic device
- slot
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 190
- 230000005855 radiation Effects 0.000 abstract description 32
- 238000010438 heat treatment Methods 0.000 abstract description 5
- 238000013461 design Methods 0.000 description 3
- 238000012423 maintenance Methods 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention provides a heat dissipation module which is suitable for an electronic device. The heat dissipation module comprises a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is arranged in the shell of the electronic device and is provided with a heat dissipation part, wherein a heat dissipation flow channel is formed between the heat dissipation part and the shell. The heat radiation fan is adjacent to the heat radiation part, wherein the heat radiation fan or the heat radiation structure is provided with an airflow guide part, the airflow guide part is provided with a slot, the slot is connected with the heat radiation flow channel, the heat radiation fan is suitable for providing heat radiation airflow, and the airflow guide part is suitable for guiding partial heat radiation airflow to pass through the slot and then pass through the heat radiation flow channel along the direction which is not parallel to the air outlet direction of the heat radiation fan. The heat dissipation module has good heat dissipation efficiency for the heating component in the electronic device and the shell of the electronic device.
Description
Technical Field
The present disclosure relates to heat dissipation modules and electronic devices, and particularly to a heat dissipation module with a heat dissipation fan and an electronic device.
Background
With the rapid advance of technology in recent years, the operating speed of electronic devices (such as computers) has been increased, and the amount of heat generated by heat generating components inside the electronic devices has also been increased. In order to prevent the electronic device from overheating and causing temporary or permanent failure, it is important to dissipate heat generated by the heat generating components inside the electronic device. In addition, the heat generated by the heat generating component may be transferred to the housing of the electronic device, which may cause the housing temperature to be too high, and therefore some housings of the electronic device also need to be cooled. Therefore, how to improve the heat dissipation efficiency of the heat dissipation module to the heat generating component inside the electronic device and the housing of the electronic device is an important issue in the design of the heat dissipation module.
Disclosure of Invention
The invention aims at a heat dissipation module, which has good heat dissipation efficiency for a heating component inside an electronic device and a shell of the electronic device.
The invention is directed to an electronic device, and a heat dissipation module of the electronic device has good heat dissipation efficiency for a heating component inside the electronic device and a shell of the electronic device.
According to the embodiment of the invention, the heat dissipation module is suitable for the electronic device. The heat dissipation module comprises a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is arranged in the shell of the electronic device and is provided with a heat dissipation part, wherein a heat dissipation flow channel is formed between the heat dissipation part and the shell. The heat radiation fan is adjacent to the heat radiation part, wherein the heat radiation fan or the heat radiation structure is provided with an airflow guide part, the airflow guide part is provided with a slot, the slot is connected with the heat radiation flow channel, the heat radiation fan is suitable for providing heat radiation airflow, and the airflow guide part is suitable for guiding partial heat radiation airflow to pass through the slot and then pass through the heat radiation flow channel along the direction which is not parallel to the air outlet direction of the heat radiation fan.
According to an embodiment of the invention, an electronic device comprises a shell and a heat dissipation module. The heat dissipation module comprises a heat dissipation structure and a heat dissipation fan. The heat dissipation structure is arranged in the shell and is provided with a heat dissipation part, wherein a heat dissipation flow channel is formed between the heat dissipation part and the shell. The heat radiation fan is adjacent to the heat radiation part, wherein the heat radiation fan or the heat radiation structure is provided with an airflow guide part, the airflow guide part is provided with a slot, the slot is connected with the heat radiation flow channel, the heat radiation fan is suitable for providing heat radiation airflow, and the airflow guide part is suitable for guiding partial heat radiation airflow to pass through the slot and then pass through the heat radiation flow channel along the direction which is not parallel to the air outlet direction of the heat radiation fan.
In the embodiment of the invention, one end of the shell of the heat radiation fan is provided with a folded wall to form an airflow guiding part, the folded wall is inclined to the air outlet direction of the heat radiation fan, and the open slot is formed on the folded wall.
In an embodiment of the invention, the slot is formed in the housing of the heat dissipation fan, the housing has a tongue portion adjacent to the slot to form the airflow guiding portion, and the tongue portion is inclined to the air outlet direction of the heat dissipation fan.
In an embodiment of the present invention, the heat dissipation part includes heat dissipation fins.
In an embodiment of the invention, the heat dissipation module includes a heat pipe, wherein the heat pipe is disposed on the heat dissipation portion.
In an embodiment of the invention, the heat dissipation structure has an extension part to form the airflow guiding part, the extension part has a slot, and the heat dissipation fan is detachably assembled on the extension part and covers the slot.
In an embodiment of the invention, the heat dissipation structure has a contact portion, the contact portion contacts a heat generating component of the electronic device, and the extension portion is connected to the contact portion.
In an embodiment of the invention, the heat dissipation structure has a flow guiding portion, the flow guiding portion is formed on the extension portion, the heat dissipation fan includes a fan blade structure, and a pressurizing flow channel is formed between the flow guiding portion and the fan blade structure.
In an embodiment of the present invention, the extension portion has a plurality of studs, and the heat dissipation fan is detachably screwed to the studs.
In view of the above, in the heat dissipation module of the present invention, the heat dissipation fan or the heat dissipation structure has the airflow guiding portion, and the airflow guiding portion has the slot, so that the heat dissipation airflow generated by the heat dissipation fan can flow to the heat dissipation flow channel between the heat dissipation portion and the housing through the slot, so as to improve the heat dissipation efficiency of the heat dissipation portion by the heat dissipation fan, and the heat dissipation fan can dissipate heat from the housing, thereby effectively reducing the temperature of the housing. In addition, the heat dissipation fan can be configured to be detachably assembled on the extension part of the heat dissipation structure, so that the replacement and maintenance of the heat dissipation fan are more convenient.
Drawings
FIG. 1 is a partial perspective view of an electronic device according to an embodiment of the invention;
fig. 2 is a perspective view of a portion of the components of the heat dissipation module of fig. 1;
FIG. 3 is a partial schematic view of the electronic device of FIG. 1;
fig. 4 is a partial component top view of the heat dissipation module of fig. 1;
FIG. 5 is a partial schematic view of an electronic device according to another embodiment of the invention;
fig. 6 is a partial component top view of the heat dissipation module of fig. 5;
FIG. 7 is a partial schematic view of an electronic device according to another embodiment of the invention;
fig. 8 is a partial schematic view of an electronic device according to another embodiment of the invention.
Detailed Description
Reference will now be made in detail to exemplary embodiments of the invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings and the description to refer to the same or like parts.
Fig. 1 is a partial perspective view of an electronic device according to an embodiment of the invention. Referring to fig. 1, an electronic device 100 of the present embodiment includes a housing 110 and a heat dissipation module 120. The electronic device 100 is, for example, a notebook computer, and the housing 110 is, for example, a host housing of the notebook computer, and for clarity of the drawing, the housing 110 in fig. 1 is only shown as being discharged out of a bottom shell thereof. The heat dissipation module 120 is disposed on the housing 110 and configured to dissipate heat generated by the heat generating components 130 and 140 in the housing 110, wherein the heat generating components 130 and 140 are, for example, a central processing unit of a notebook computer or other types of processing chips. In other embodiments, the electronic device 100 may be other types of devices, and the invention is not limited thereto.
Fig. 2 is a perspective view of a part of components of the heat dissipation module of fig. 1. Fig. 3 is a partial schematic view of the electronic device of fig. 1. Referring to fig. 1 to fig. 3, the heat dissipation module 120 includes a heat dissipation structure 122 and a heat dissipation fan 124. The heat dissipation structure 122 is disposed in the housing 110 and has a heat dissipation portion 122a and an extension portion 122b, and the heat dissipation portion 122a and the extension portion 122b are connected to each other by, for example, integral molding. The heat dissipation portions 122a are, for example, heat dissipation fins. The heat dissipation fan 124 is detachably assembled to the extending portion 122b and adjacent to the heat dissipation portion 122a, and is used for generating a heat dissipation airflow F1 to the heat dissipation portion 122 a.
A heat dissipation flow channel 110a is formed between the heat dissipation portion 122a and the housing 110. The extension portion 122b forms an airflow guiding portion and has a slot S1, the heat dissipation fan 124 covers the slot S1 of the extension portion 122b, and the slot S1 connects the heat dissipation flow channel 110a between the heat dissipation portion 122a and the housing 110. The heat dissipation fan 124 provides a partial heat dissipation airflow F2, which passes through the slot S1 and then through the heat dissipation flow channel 110a along a direction non-parallel to (shown as perpendicular to) the air-out direction (the direction of the heat dissipation airflow F1) of the heat dissipation fan 124 by the guidance of the airflow guiding part. Since the heat dissipating fan 124 not only generates the heat dissipating airflow F1 to flow toward the heat dissipating portion 122a, but also generates the heat dissipating airflow F2 to flow to the heat dissipating flow channel 110a between the heat dissipating portion 122a and the housing 110 through the slot S1, the heat dissipating efficiency of the heat dissipating portion 122a by the heat dissipating fan 124 can be improved, and the heat dissipating fan 124 can dissipate heat from the housing 110, thereby effectively reducing the temperature of the housing 110. In addition, the heat dissipation fan 124 is detachably assembled to the extension portion 122b of the heat dissipation structure 122, so that the heat dissipation fan 124 is more convenient to replace and maintain.
In the present embodiment, the extension portion 122b of the heat dissipating structure 122 has a plurality of studs P (two are shown), and the heat dissipating fan 124 is detachably screwed to the studs P. In other embodiments, the heat dissipation fan 124 may be assembled to the extension portion 122b of the heat dissipation structure 122 by other suitable methods, which is not limited in the present invention.
The heat dissipation module 120 dissipates heat generated by the heat generating components 130 and 140 in detail. The heat dissipation module 120 includes a heat pipe 126, and the heat pipe 126 is disposed on the heat dissipation portion 122a of the heat dissipation structure 122 and extends to the heat generating elements 130 and 140. The heat generated by the heat generating element 130 and the heat generated by the heat generating element 140 are transferred to the heat dissipating portion 122a of the heat dissipating structure 122 through the heat pipe 126, so as to be dissipated at the heat dissipating portion 122a by the heat dissipating airflow F1 generated by the heat dissipating fan 124. In addition, the heat dissipation structure 122 of the present embodiment has a contact portion 122d, the contact portion 122d contacts the heat generating component 130, and the extension portion 122b is connected to the contact portion 122 d. Therefore, the heat generated by the heat generating element 130 can be transmitted to the heat dissipating portion 122a through the heat pipe 126, and can be further transmitted to the heat dissipating portion 122a through the contact portion 122d and the extending portion 122b, so as to improve the heat dissipating efficiency of the heat dissipating module 120 on the heat generating element 130.
Fig. 4 is a partial component top view of the heat dissipation module of fig. 1. Referring to fig. 2 and 4, the heat dissipation structure 122 of the present embodiment has a flow guiding portion 122c, and the flow guiding portion 122c is formed on the extension portion 122 b. A pressurizing flow channel 124b is formed between the flow guiding portion 122c and the fan blade structure 124a of the heat dissipating fan 124, for pressurizing the heat dissipating airflow generated by the fan blade structure 124 a. Therefore, the heat dissipation fan 124 itself does not need to have a flow guiding portion, thereby increasing the flexibility of the heat dissipation module 120 design.
Fig. 5 is a partial schematic view of an electronic device according to another embodiment of the invention. Fig. 6 is a partial component top view of the heat dissipation module of fig. 5. The embodiment of fig. 5 and 6 is different from the embodiment of fig. 1 to 4 in that, in the embodiment of fig. 5 and 6, one end of the casing 124c of the heat dissipation fan 124 has a folded wall 124c1 to form the airflow guiding portion. At least a portion of the folded wall 124c1 is inclined to the air outlet direction of the heat dissipating fan 124 (the direction of the heat dissipating airflow F1), and the slot S2 is formed on the folded wall 124c 1. The heat dissipating airflow F2 can pass through the slot S2 and then through the heat dissipating flow channel 110a along a direction that is not parallel to (shown as being oblique to) the air-out direction (the direction of the heat dissipating airflow F1) of the heat dissipating fan 124 by the guiding of the folded wall 124c 1. In the present embodiment, the inclination angle of the folded wall 124c1 relative to the air outlet direction of the heat dissipation fan 124 is, for example, 0 to 90 degrees, and preferably 60 degrees.
Fig. 7 is a partial schematic view of an electronic device according to another embodiment of the invention. The embodiment of fig. 7 differs from the embodiment of fig. 5 in that the folded wall 124c1 of fig. 7 and the slot S2 thereon are formed on the top side of the housing 124c, while the folded wall 124c1 of fig. 5 and the slot S2 thereon are formed on the bottom side of the housing 124 c.
Fig. 8 is a partial schematic view of an electronic device according to another embodiment of the invention. The embodiment of fig. 8 is different from the embodiment of fig. 1 to 4 in that, in the embodiment of fig. 8, a slot S3 is formed in the case 124c of the heat dissipation fan 124. The casing 124c has a tongue 124c2 adjacent to the slot S3 to form the air flow guiding portion, and the tongue 124c2 is inclined to the air outlet direction of the heat dissipating fan 124 (the direction of the heat dissipating air flow F1). The heat dissipating airflow F2 can pass through the slot S3 and then through the heat dissipating flow channel 110a along a direction that is not parallel to (shown as oblique to) the air-out direction (the direction of the heat dissipating airflow F1) of the heat dissipating fan 124 by the guidance of the tongue portion 124c 2. In the present embodiment, slot S3 and tongue 124c2 may be formed on the bottom side of housing 124c, while in other embodiments slot S3 and tongue 124c2 may be formed on the top side of housing 124 c. In the present embodiment, the inclination angle of the tongue portion 124c2 with respect to the air outlet direction of the heat dissipating fan 124 is, for example, 0 to 90 degrees, and preferably 60 degrees.
In summary, in the heat dissipation module of the present invention, the heat dissipation fan or the heat dissipation structure has the airflow guiding portion, and the airflow guiding portion has the slot, so that the heat dissipation airflow generated by the heat dissipation fan can flow to the heat dissipation flow channel between the heat dissipation portion and the housing through the slot, so as to enhance the heat dissipation efficiency of the heat dissipation portion by the heat dissipation fan, and the heat dissipation fan can dissipate heat from the housing, thereby effectively reducing the temperature of the housing. In addition, the heat dissipation fan can be configured to be detachably assembled on the extension part of the heat dissipation structure, so that the replacement and maintenance of the heat dissipation fan are more convenient. In addition, the contact part of the heat dissipation structure is connected with the extension part of the heat dissipation structure, so that heat generated by the heating component at the contact part can be transferred to the heat dissipation part of the heat dissipation structure through the heat pipe, and can be transferred to the heat dissipation part through the contact part and the extension part, and the heat dissipation efficiency of the heat dissipation module on the heating component is improved. Furthermore, the extension part of the heat dissipation structure is provided with the flow guide part for pressurizing the heat dissipation airflow, so that the heat dissipation fan does not need to be provided with the flow guide part, and the flexibility of the design of the heat dissipation module is improved.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (18)
1. A heat dissipation module for an electronic device, comprising:
the heat dissipation structure is arranged in a shell of the electronic device and is provided with a heat dissipation part, wherein a heat dissipation flow channel is formed between the heat dissipation part and the shell; and
and the heat dissipation fan is adjacent to the heat dissipation part, the heat dissipation fan or the heat dissipation structure is provided with an airflow guide part, the airflow guide part is provided with a slot, the slot is connected with the heat dissipation flow channel, the heat dissipation fan is suitable for providing heat dissipation airflow, and the airflow guide part is suitable for guiding part of the heat dissipation airflow to pass through the slot and then pass through the heat dissipation flow channel along the direction which is not parallel to the air outlet direction of the heat dissipation fan.
2. The heat dissipation module of claim 1, wherein one end of the housing of the heat dissipation fan has a folded wall to form the airflow guiding portion, the folded wall is inclined to the air outlet direction of the heat dissipation fan, and the slot is formed in the folded wall.
3. The heat dissipating module of claim 1, wherein the slot is formed in a housing of the heat dissipating fan, the housing having a tongue adjacent to the slot to form the airflow guide, the tongue being oblique to the air outlet direction of the heat dissipating fan.
4. The heat dissipation module of claim 1, wherein the heat dissipation portion comprises heat dissipation fins.
5. The heat dissipation module of claim 1, comprising a heat pipe, wherein the heat pipe is disposed over the heat dissipation portion.
6. The heat dissipation module of claim 1, wherein the heat dissipation structure has an extension portion to form the airflow guide portion, the extension portion has the slot, and the heat dissipation fan is detachably assembled to the extension portion and covers the slot.
7. The heat dissipation module of claim 6, wherein the heat dissipation structure has a contact portion that contacts a heat generating component of the electronic device, and the extension portion is connected to the contact portion.
8. The heat dissipating module of claim 6, wherein the heat dissipating structure has a flow guiding portion formed on the extending portion, the heat dissipating fan includes a blade structure, and a pressurizing flow channel is formed between the flow guiding portion and the blade structure.
9. The heat dissipating module of claim 6, wherein the extension has a plurality of studs thereon, and the heat dissipating fan is detachably screwed to the plurality of studs.
10. An electronic device, comprising:
a housing; and
a heat dissipation module, comprising:
the heat dissipation structure is arranged in a shell of the electronic device and is provided with a heat dissipation part, wherein a heat dissipation flow channel is formed between the heat dissipation part and the shell; and
and the heat dissipation fan is adjacent to the heat dissipation part, the heat dissipation fan or the heat dissipation structure is provided with an airflow guide part, the airflow guide part is provided with a slot, the slot is connected with the heat dissipation flow channel, the heat dissipation fan is suitable for providing heat dissipation airflow, and the airflow guide part is suitable for guiding part of the heat dissipation airflow to pass through the slot and then pass through the heat dissipation flow channel along the direction which is not parallel to the air outlet direction of the heat dissipation fan.
11. The electronic device of claim 10, wherein an end of the housing of the heat dissipation fan has a folded wall to form the airflow guiding portion, the folded wall is inclined to the air outlet direction of the heat dissipation fan, and the slot is formed in the folded wall.
12. The electronic device of claim 10, wherein the slot is formed in a housing of the heat dissipation fan, the housing having a tongue portion adjacent to the slot to form the airflow guide portion, the tongue portion being oblique to the air-out direction of the heat dissipation fan.
13. The electronic device of claim 10, wherein the heat sink portion comprises heat fins.
14. The electronic device of claim 10, wherein the heat dissipation module comprises a heat pipe, and the heat pipe is disposed on the heat dissipation portion.
15. The electronic device of claim 10, wherein the heat dissipation structure has an extension portion to form the airflow guiding portion, the extension portion has the slot, and the heat dissipation fan is detachably assembled to the extension portion and covers the slot.
16. The electronic device of claim 15, wherein the heat dissipation structure has a contact portion that contacts a heat generating component of the electronic device, and the extension portion is connected to the contact portion.
17. The electronic device of claim 15, wherein the heat dissipation structure has a flow guiding portion, the flow guiding portion is formed on the extension portion, the heat dissipation fan includes a fan blade structure, and a pressure-increasing channel is formed between the flow guiding portion and the fan blade structure.
18. The electronic device of claim 15, wherein the extension portion has a plurality of studs thereon, and the heat dissipation fan is detachably screwed to the plurality of studs.
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US202063001557P | 2020-03-30 | 2020-03-30 | |
| US63/001,557 | 2020-03-30 | ||
| US16/843,898 US11839050B2 (en) | 2017-08-17 | 2020-04-09 | Heat dissipation module and electronic device |
| US16/843,898 | 2020-04-09 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113473794A true CN113473794A (en) | 2021-10-01 |
Family
ID=77868162
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010511557.7A Pending CN113473794A (en) | 2020-03-30 | 2020-06-08 | Heat dissipation module and electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN113473794A (en) |
| TW (1) | TWI815016B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080010012A (en) * | 2006-07-25 | 2008-01-30 | 엘지전자 주식회사 | A cooling unit for portable computer |
| TW201407314A (en) * | 2012-08-03 | 2014-02-16 | Acer Inc | Electronic device and heat dissipation module |
| US20140092557A1 (en) * | 2012-09-28 | 2014-04-03 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipating module |
| CN109413934A (en) * | 2017-08-17 | 2019-03-01 | 仁宝电脑工业股份有限公司 | Radiating module and electronic device |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI546457B (en) * | 2010-12-01 | 2016-08-21 | 鴻準精密工業股份有限公司 | Heat dissipation device and centrifugal fan thereof |
-
2020
- 2020-05-27 TW TW109117644A patent/TWI815016B/en active
- 2020-06-08 CN CN202010511557.7A patent/CN113473794A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20080010012A (en) * | 2006-07-25 | 2008-01-30 | 엘지전자 주식회사 | A cooling unit for portable computer |
| TW201407314A (en) * | 2012-08-03 | 2014-02-16 | Acer Inc | Electronic device and heat dissipation module |
| US20140092557A1 (en) * | 2012-09-28 | 2014-04-03 | Hon Hai Precision Industry Co., Ltd. | Electronic device with heat dissipating module |
| CN109413934A (en) * | 2017-08-17 | 2019-03-01 | 仁宝电脑工业股份有限公司 | Radiating module and electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWI815016B (en) | 2023-09-11 |
| TW202136703A (en) | 2021-10-01 |
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