CN113473695A - Flexible circuit module and display panel - Google Patents
Flexible circuit module and display panel Download PDFInfo
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- CN113473695A CN113473695A CN202110733022.9A CN202110733022A CN113473695A CN 113473695 A CN113473695 A CN 113473695A CN 202110733022 A CN202110733022 A CN 202110733022A CN 113473695 A CN113473695 A CN 113473695A
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- circuit board
- flexible circuit
- electromagnetic shielding
- shielding layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
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- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H05K1/0281—Reinforcement details thereof
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/144—Stacked arrangements of planar printed circuit boards
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The application discloses flexible circuit module and display panel includes: the flexible circuit board comprises a main circuit board and a functional circuit board, wherein the main circuit board and the functional circuit board are at least partially overlapped to form a thin area and a thick area with a thickness difference; and the electromagnetic shielding layer is laminated with the flexible circuit board and at least exposes the thick area in the bending part. The flexible circuit board provided by the application can avoid generating the circuit board warpage caused by bending stress concentration on the premise of ensuring the electromagnetic shielding effect.
Description
Technical Field
The application relates to the technical field of electronic devices, in particular to a flexible circuit module and a display panel.
Background
A Flexible Printed Circuit (FPC) is a Flexible Circuit board manufactured using a polyimide or polyester film as a base material, and is widely used in the field of display panels due to its advantages of high wiring density, light weight, thin thickness, and good bending property. In recent years, the requirements of display panels On screen occupation ratio are becoming more and more strict, in order to improve screen occupation ratio and realize a narrow frame in the existing display panels using flexible circuit boards, COF (Chip On Film) processes are often used, which have higher and higher requirements On multifunctional composite performance of the flexible circuit boards, and the flexible circuit boards with multifunctional composite performance have various problems caused by different thicknesses.
Disclosure of Invention
In view of this, the present disclosure provides a flexible circuit module with multiple functions and better bending performance.
In a first aspect, an embodiment of the present application provides a flexible circuit module, which includes: the flexible circuit board is provided with a wiring part, a bending part and a binding part which are distributed in sequence in the length direction of the flexible circuit board, the flexible circuit board comprises a main circuit board and a functional circuit board, and the main circuit board and the functional circuit board are at least partially overlapped to form a thin area and a thick area with thickness difference; and the electromagnetic shielding layer is laminated with the flexible circuit board and at least exposes the thick area of the bending part.
According to the foregoing embodiments of the first aspect of the present application, the main circuit board includes a first surface and a second surface that are opposite to each other, the functional circuit board is disposed on the second surface, the first surface is provided with a first binding pin, the functional circuit board includes a third surface and a fourth surface that are opposite to each other, the functional circuit board is opposite to the second surface through the third surface, and the third surface is provided with a second binding pin; the binding part comprises a first sub-binding part and a second sub-binding part, the first sub-binding part is positioned on the main circuit board, the first binding pin is arranged on the first sub-binding part, the second sub-binding part is positioned on the functional circuit board, and the second binding pin is arranged on the second sub-binding part; preferably, the electromagnetic shielding layer covers partial areas of the fourth surface and the second surface that are not covered by the functional circuit board, and both the first sub-binding portion and the second sub-binding portion are not covered by the electromagnetic shielding layer and are exposed outside the electromagnetic shielding layer.
According to any one of the foregoing embodiments of the first aspect of the present application, the electromagnetic shielding layer includes a main covering portion, and a first portion and a second portion that are connected to the main covering portion and adjacently distributed, the first portion and the second portion are adjacently disposed through the crack stop groove, the main covering portion covers the wiring portion, the first portion extends from the main covering portion to an edge of the thick region of the flexible circuit board adjacent to the wiring portion, and the second portion extends from the main covering portion to cover the thin region of the flexible circuit board.
According to any one of the preceding embodiments of the first aspect of the present application, an orthographic projection of the crack stop groove on the flexible circuit board is distributed near the thick region in the thin region, and the minimum distance between the crack stop groove and the thick region is greater than or equal to 1.5mm, and the depth of the crack stop groove from the opening to the groove bottom is greater than or equal to 1 mm.
According to any one of the foregoing embodiments of the first aspect of the present application, the second portion of the electromagnetic shielding layer is provided with a plurality of through holes in the region of the bending portion, the through holes are disposed adjacent to the crack arrest groove in the width direction of the flexible circuit board, the through holes are arranged at equal intervals in the width direction, the hole pitch between adjacent through holes is greater than or equal to 2mm, and the hole diameter of each through hole is greater than or equal to 1 mm.
According to any of the preceding embodiments of the first aspect of the present application, the thickness of the electromagnetic shielding layer is less than or equal to the difference in thickness between the thin region and the thick region.
According to any of the preceding embodiments of the first aspect of the present application, the electromagnetic shielding layer comprises one or more of a conductive cloth, an aluminum foil, a copper foil, and a wave-absorbing material.
According to any of the foregoing embodiments of the first aspect of the present application, the electromagnetic shielding layer has at least one adhesion fixing portion, and the adhesion fixing portion is provided to extend a preset distance from an edge of the main covering portion in a direction away from the main covering portion; the bonding fixing part is arranged on the edge of the main covering part parallel to the length direction of the flexible circuit board and/or the edge of one side of the main covering part far away from the bonding part; a protective film is attached to the surface of one side of the bonding fixing part close to the flexible circuit board.
In a second aspect, based on the same inventive concept, embodiments of the present application provide a display panel, which includes the flexible circuit module according to the embodiments of the first aspect.
According to the foregoing embodiment of the second aspect of the present application, the display panel includes an array substrate and a touch sensing layer, which are stacked, the array substrate is bound to the main circuit board, and the touch sensing layer is bound to the functional circuit board.
According to the flexible circuit module and the display panel provided by the embodiment of the application, on one hand, the electromagnetic shielding layer selectively covers partial areas in the bending area of the flexible circuit board, so that the stress generated by bending the partial areas with larger thickness can be dispersed in a larger area, and the flexible circuit board is prevented from warping at the positions.
Drawings
Other features, objects, and advantages of the present application will become apparent from the following detailed description of non-limiting embodiments thereof, when read in conjunction with the accompanying drawings, in which like reference characters designate the same or similar parts throughout the figures thereof, and which are not to scale.
Fig. 1 is a schematic structural diagram of a flexible circuit module according to an embodiment of the present disclosure;
FIG. 2 is a schematic diagram of a flexible circuit board of the flexible circuit module shown in FIG. 1;
fig. 3 is a schematic top view of an electromagnetic shielding layer of the flexible circuit module shown in fig. 1;
fig. 4 is a schematic bottom view of an electromagnetic shielding layer of the flexible circuit module shown in fig. 1;
FIG. 5 is an enlarged view of region P of FIG. 3;
FIG. 6 is a further enlarged view of region P of FIG. 3;
FIG. 7 is another enlarged view of region P of FIG. 3;
FIG. 8 is an enlarged view of region Q of FIG. 3;
fig. 9 is a schematic structural diagram of a display panel according to an embodiment of the present application.
In the figure:
10-a flexible circuit module; 100-a display panel;
11-a flexible circuit board; 12-an electromagnetic shielding layer;
111-main circuit board; 112-a functional circuit board; 113-a wiring section; 114-a bending section; 115-a binding portion;
1141-thick bending part; 1142-a thin bent portion; 1151-a first sub-binding portion; 1152-a second sub-binding portion;
121-a main covering part; 122-a first portion; 123-a second portion; 124-a crack stop groove; 125-through holes; 126-adhesive fixation; 127-a protective film;
101-an array substrate; 102-a touch sensing layer;
1011-bond pad.
Detailed Description
Features and exemplary embodiments of various aspects of the present application will be described in detail below, and in order to make objects, technical solutions and advantages of the present application more apparent, the present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application. It will be apparent to one skilled in the art that the present application may be practiced without some of these specific details. The following description of the embodiments is merely intended to provide a better understanding of the present application by illustrating examples thereof.
It should be noted that the terms "comprises," "comprising," or any other variation thereof in the description and claims of this application and the above-described drawings are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with the present application. Rather, they are merely examples of apparatus and methods consistent with certain aspects of the present application, as detailed in the appended claims.
It will be understood that when a layer, region or layer is referred to as being "on" or "over" another layer, region or layer in describing the structure of the component, it can be directly on the other layer, region or layer or intervening layers or regions may also be present. Also, if the component is turned over, one layer or region may be "under" or "beneath" another layer or region.
It should be understood that although the terms first and second may be used to describe partial regions of the electromagnetic shielding layer in the embodiments of the present application, the regions should not be limited to these terms, and these terms are only used to distinguish these regions from each other. For example, a first portion may also be referred to as a second portion, and similarly, a second portion may also be referred to as a first portion, without departing from the scope of embodiments herein.
Furthermore, the described features, structures, or characteristics may be combined in any suitable manner in one or more embodiments.
Referring to fig. 1 to 4 together, fig. 1 is a schematic structural diagram of a flexible circuit module according to an embodiment of the present application, fig. 2 is a schematic structural diagram of a flexible circuit board according to an embodiment of the present application, fig. 3 is a schematic structural diagram of a top view of an electromagnetic shielding layer according to an embodiment of the present application, and fig. 4 is a schematic structural diagram of a bottom view of the electromagnetic shielding layer according to an embodiment of the present application. The flexible circuit module 10 provided by the embodiment of the application comprises a flexible circuit board 11 and an electromagnetic shielding layer 12, wherein the flexible circuit board 11 is provided with a wiring part 113, a bending part 114 and a binding part 115 which are distributed in sequence in the length direction of the flexible circuit board 11, the flexible circuit board 11 comprises a main circuit board 111 and a functional circuit board 112, and the main circuit board 111 and the functional circuit board 112 are at least partially overlapped to form a thick area and a thin area with thickness difference. The electromagnetic shielding layer 12 is stacked with the flexible circuit board 11 and at least exposes the thick region in the bending portion 114.
The partially thick area included in the bending portion 114 is a thick bending portion 1141, the partially thin area included in the bending portion 114 is a thin bending portion 1142, and the electromagnetic shielding layer 12 covers the wiring portion 113 and the thin bending portion 1142 and exposes the binding portion 115 and the thick bending portion 1141.
The flexible circuit board 11 includes a main circuit board 111 and a functional circuit board 112 that are at least partially overlapped, the overlap forming a thick area, and the portion of the main circuit board 111 that is not covered by the functional circuit board 112 constituting a thin area. It is understood that in some alternative embodiments, the main circuit board 111 and the functional circuit board 112 may be two separate circuit boards, and the side surface of the main circuit board 111 adjacent to the functional circuit board 112 is provided with a connection area. The functional circuit board 111 is at least partially arranged on top of the main circuit board 112 and the functional circuit board 112 is electrically connected to the main circuit board 112 via the connection region. The main circuit board 111 and the functional circuit board 112 are adjacent branch circuit boards extending from the same main body in the length direction of the flexible circuit board 11. In other optional embodiments, the main circuit board 111 and the functional circuit board 112 are the same multi-film circuit board, the film layers constituting the functional circuit board 112 and the film layers constituting the main circuit board 111 are sequentially stacked, and the height difference between the thick region and the thin region of the flexible circuit board 11 is the thickness of the film layers constituting the functional circuit board 112.
It is understood that the number of the functional circuit boards 112 may be one or more, the plurality of functional circuit boards 112 collectively form a thick region, and the portion of the main circuit board 111 that does not overlap with any of the plurality of functional circuit boards 112 forms a thin region. Referring to fig. 2, the flexible circuit board 11 includes a functional circuit board 112 for illustration, and the specific number of the functional circuit boards 112 is not particularly limited and can be selected according to the requirement.
When the flexible circuit module 10 is bent, the thick region needs a larger bending radius, and a larger bending stress is generated. Electromagnetic shield among the prior art generally is whole layer full coverage setting, buckles the back this moment, because the bending zone is whole to be covered by electromagnetic shield, the surplus of bending in thick district is restricted by electromagnetic shield and can't obtain effectual release, and the surplus of bending concentrates on the root formation dead fold in the bending zone, and then causes the flexible circuit board to damage the fracture, still will lead to flexible circuit board warpage, the unable level and smooth laminating of apron simultaneously, forms the laminating bubble that influences the display effect.
The electromagnetic shielding layer 12 provided by the embodiment of the application is arranged in a manner that the bending region with the thickness difference only covers the thin region, so that the concentrated stress generated by bending the thick region can be effectively released.
Referring to fig. 2, in some optional embodiments, the main circuit board 111 includes a first surface and a second surface opposite to each other, the functional circuit board 112 is disposed on the second surface, and the first surface is disposed with a first bonding pin; the functional circuit board 112 includes a third surface and a fourth surface opposite to each other, wherein the third surface is opposite to the second surface of the main circuit board 111, and the third surface is provided with a second binding pin. The binding part 115 includes a first sub-binding part 1151 and a second sub-binding part 1152, the first sub-binding part 1151 is located on the main circuit board 111, and the first binding pin is disposed on the first sub-binding part 1151; the second sub-binding portion 1152 is located at the functional circuit board 112 and the second binding pin is disposed at the second sub-binding portion 1152. Optionally, the electromagnetic shielding layer 12 covers the fourth surface and a partial area of the second surface not covered by the functional circuit board 112, and the binding portion 115 is not covered by the electromagnetic shielding layer 12 and is exposed outside.
It can be understood that the flexible circuit board 11 has the wiring portion 113, the bending portion 114 and the binding portion 115 arranged in succession in the longitudinal direction thereof, and the bending portion 114 includes a thick bending portion 1141 formed by overlapping the main circuit board 111 and the functional circuit board 112 and a thin bending portion 1142 formed by not overlapping them. The electromagnetic shielding layer 12 entirely covers the wiring portion 113 and the thin bent portion 1142 located at the bent portion 114, i.e., the thick bent portion 1141 is not covered with the electromagnetic shielding layer 12. At this time, the stress generated by bending the flexible circuit board can be dispersed and distributed in the complete area of the thick bending part 1141, thereby effectively avoiding the problem of warping of the flexible circuit board caused by the concentration of bending stress. Illustratively, the width of the thick bent portion 1141 of the flexible circuit board 11 in the embodiment of the present application is about 2.5mm to 3.5mm, and the bending margin of the functional circuit board 112 is about 0.3mm to 0.6 mm. When designing the functional circuit board 112, if the length of the functional circuit board 112 is designed to be flat and the two ends of the functional circuit board are respectively and exactly corresponding to the connection area between the display module to be connected and the main circuit board 111, the functional circuit board 112 is too tight after being bent, and the binding portion 115 is damaged or loosened by a pulling action force, so that when designing the length of the functional circuit board 112, a bending margin of 0.3mm to 0.6mm is usually added, so that the functional circuit board has a margin without the pulling action force after being bent. Since the electromagnetic shielding layer 12 covers only the thin bent portion 1142 and does not cover the thick bent portion 1141 in the bent portion 114, the bending margin of the thick bent portion 1141 that is not limited by the electromagnetic shielding layer 12 can be buffered and dispersed in a large range, and can be freely released in the region of the bent portion 114, thereby avoiding the flexible circuit board 11 from warping due to the stress concentration that cannot be released.
The surface of one side of the electromagnetic shielding layer 12 close to the flexible circuit board 11 is provided with the adhesive, and the electromagnetic shielding layer 12 is adhered and fixed on the surface of the flexible circuit board 11 in use, so that the operation is simple and convenient, and the shielding failure caused by dislocation or deformation of the electromagnetic shielding layer 12 can be effectively avoided.
Illustratively, a driving chip and a corresponding driving trace are disposed on the flexible circuit board 11, and the electromagnetic shielding layer 12 covers the driving chip and the driving trace on the flexible circuit board 11, so as to shield electromagnetic interference. Meanwhile, in some optional embodiments, the flexible circuit board 11 has a ground trace, the electromagnetic shielding layer 12 is electrically connected to the ground trace of the flexible circuit board 11, and charges accumulated in the flexible circuit board 11 due to friction or electric leakage and the like can be conducted to the electromagnetic shielding layer 12 to be released, so that the flexible circuit board can be grounded to prevent static electricity.
In some alternative embodiments, the thickness of electromagnetic shield layer 12 is less than or equal to the difference in thickness between the thin and thick regions. That is, the thickness of the electromagnetic shielding layer 12 should be less than or equal to the thickness of the functional circuit board 112, so as to avoid affecting the bending portion 114 of the flexible circuit board 11, and if the electromagnetic shielding layer 12 is too thick, the thin bending portion 1142 will generate the same stress concentration problem as the thick bending portion 1141, and then the cover plate attachment bubble is formed in the region adjacent to the thin bending portion 1142. The thickness of electromagnetic shield layer 12 may be the same throughout to facilitate processing and improve the efficiency of manufacturing flexible circuit module 10. Meanwhile, the electromagnetic shield layer 12 may also have a different thickness in a region covering the thin bent region 1142 from a region covering the wiring portion 113. Namely, a thicker electromagnetic shielding layer 12 is arranged in a partial region covering the wiring part 113 to ensure good electromagnetic shielding effect; meanwhile, a thinner electromagnetic shielding layer 12 is disposed in a partial region covering the thin bending region 1142 to avoid the problem of bending stress concentration. Therefore, the thickness of the electromagnetic shielding layer 12 is calculated according to the requirements of materials and electrostatic protection, the electromagnetic shielding effect is guaranteed, and the thickness can be reduced as much as possible on the premise that the electromagnetic shielding layer can be kept intact in the production and use processes, so that the influence on bending of the flexible circuit board is reduced, and meanwhile, the whole thickness of the flexible circuit module 10 is correspondingly reduced. This is not particularly limited in this application.
In some alternative embodiments, electromagnetic shield 12 includes one or more of a conductive cloth, a copper foil, an aluminum foil, and a wave-absorbing material. Optionally, the electromagnetic shielding layer 12 may be a conductive cloth, which is a conductive fiber cloth with metal characteristics and using a fiber cloth as a base material and forming a metal coating by electroplating. The conductive cloth has high conductivity, excellent corrosion resistance, good bending durability, flexibility and electromagnetic shielding effect, is easy to process and punch, and is suitable for occasions needing coating type electrostatic shielding. The specific material of the electromagnetic shielding layer 12 is not specifically limited, and can be selected according to the process requirements.
In some alternative embodiments, the electromagnetic shielding layer 12 includes a main covering portion 121, and a first portion 122 and a second portion 123 connected to the main covering portion 121 and distributed adjacently, the first portion 122 and the second portion 123 are disposed adjacently through a crack stop groove 124, the main covering portion 121 covers the wiring portion 113, the first portion 122 extends from the main covering portion 121 to an edge of the thick bending portion 1141 of the flexible circuit board 11 adjacent to the wiring portion 113, and the second portion 123 extends from the main covering portion 121 to cover the thin bending portion 1142 in the bending portion 114 of the flexible circuit board 11. An edge of the first portion 122 and an edge of the thick bending portion 1141 adjacent to the wiring portion 113 may have a certain distance therebetween, and the distance may be less than or equal to 0.65mm
In some alternative embodiments, an edge of the first portion 122 overlaps an edge of the thick bending portion 1141 adjacent to the wiring portion 113, that is, the first portion 122 extends from the main covering portion 121 to be flush with the edge of the wiring portion 113. The bending portion 114 extends a long distance in the length direction of the flexible circuit board 11, and after the flexible circuit board 11 is bent, the flexible circuit board 11 in the edge area of the portion of the bending portion 114 close to the wiring portion 113 is almost flat and has no bending radian. Thus, the first portion 122 of the electromagnetic shielding layer 12 may extend to the edge of the bending portion 114 adjacent to the wiring portion 113, thereby providing the best electromagnetic shielding effect while preventing the bending stress from being concentrated.
A crack stop groove 124 is disposed between the first portion 122 and the second portion 123 of the electromagnetic shielding layer 12, and the crack stop groove 124 penetrates the electromagnetic shielding layer 12 in the thickness direction of the flexible circuit module 10. The opening of the crack stop groove 124 is disposed at the edge of the electromagnetic shielding layer 12 near the binding portion 115, and extends from the edge to the inside of the electromagnetic shielding layer 12, and the extending direction of the crack stop groove 124 may be perpendicular to the edge or at a certain angle. The crack-stopping groove 124 can enlarge the range in which the first part 122 and the second part 123 of the electromagnetic shielding layer 12 move independently from each other, so as to prevent the electromagnetic shielding layer 12 from being attached freely due to the fact that the second part 123 adhered to the thin bending part 1142 and the first part 122 adhered to the functional circuit board are pulled mutually; meanwhile, the crack stop groove 124 can prevent the electromagnetic shielding layer 12 between the first portion 122 and the second portion 123 from being cracked and affecting the shielding effect due to the main circuit board 111 and the functional circuit board 112 being subjected to forces in different directions.
Referring to fig. 5 to 7, fig. 5 to 7 are various enlarged views of a region P in fig. 3. In some optional embodiments, the electromagnetic shielding layer 12 is provided with a crack stopper 124, an orthographic projection of the crack stopper 124 on the flexible circuit board 11 is located in a partial area of the thin area close to the thick area, and a minimum distance between the crack stopper 124 and the thick area is greater than or equal to 1.5 mm. The extending depth of the crack-stopping groove 124 from the opening to the groove bottom is more than or equal to 1 mm.
In the width direction of the flexible circuit board 11, a certain distance is provided between the crack arrest groove 124 and the thick bending portion 1141 for preventing the main circuit board 111 and the functional circuit board 112 from being dragged. The depth of the anti-crack groove 124 is required to be a certain depth, and the anti-crack groove 124 loses its original function due to too shallow depth, so the depth of the anti-crack groove 124 is greater than or equal to 1 mm. The deeper the anti-crack groove 124 is, the larger the range of the mutually independent movement provided for the first portion 122 and the second portion 123 is, but the too deep the anti-crack groove 124 will cause the shielding effect of the electromagnetic shielding layer 12 to be weakened, so that a balance should be achieved between the movement range and the shielding effect, and the design is made according to the use requirement, which is not specifically limited in the present application.
Illustratively, the crack stopper groove 124 may be a U-shaped groove, a square groove, a circular groove, a wave-shaped groove, or the like, and preferably, the crack stopper groove 124 is a U-shaped groove. The U-shaped groove is simple and convenient to position and process, and has a good effect of preventing excessive tearing. The specific shape of the crack arrest groove 124 is not particularly limited, and can be selected according to the process and the requirement.
Referring to fig. 8, fig. 8 is an enlarged view of a region Q. In some alternative embodiments, a plurality of through holes 125 are disposed in the second portion 123 of the electromagnetic shielding layer 12 in a partial area covering the thin area 1242, and the through holes 125 extend along the width direction of the flexible circuit board 11 and are adjacent to the crack stopper 124. The hole spacing between two adjacent through holes 125 is greater than or equal to 2mm, and the aperture of the through hole 125 is greater than or equal to 1mm, so that a better stress releasing effect can be achieved.
The through holes 125 may be one or more of circular holes, elliptical holes, square holes, and kidney-shaped holes, the shapes of the through holes 125 may be the same or different, and the through holes 125 may be distributed at equal intervals or at unequal intervals in the width direction of the flexible circuit board 11, which is not limited in this application.
Illustratively, the through holes 125 have the same shape and size and are arranged at equal intervals in the width direction of the flexible circuit board 11, and the through holes 125 can be manufactured by the same process, so that the manufacturing process is simplified and the production efficiency is improved. Or, the hole pitches of the through holes 125 are not equal, and the hole pitches are determined by the bending stress at the positions, that is, the hole pitches of the through holes 125 are properly reduced in the partial region with larger bending stress, and the distribution density of the through holes 125 is increased, so as to avoid the flexible circuit board 11 from being damaged or broken; the hole pitch of the through holes 125 is properly increased in the partial region with smaller bending stress, and the distribution density of the through holes 125 is reduced to simplify the manufacturing process and reduce the cost. The shape of the through-hole 125 can be adjusted accordingly based on the same process principle. Therefore, the bending stress on the thin bending part 1142 of the flexible circuit board 11 can be uniformly and stably released, and an optimal stress release effect is achieved, so that the reliability of the product is improved.
In some alternative embodiments, the electromagnetic shielding layer 12 has at least one adhesive fixing portion 126, and the adhesive fixing portion 126 is disposed to extend from an edge of the main covering portion 121 to a direction away from the main covering portion 121 by a preset distance; the adhesive fixing portion 126 is provided at an edge of the main cover portion 121 parallel to the length direction of the flexible circuit board 11 and/or an edge of one side of the main cover portion 121 distant from the binding portion 115; a protective film 127 is attached to one surface of the adhesive fixing portion 126 near the flexible circuit board 11.
The bonding fixing portion 126 is a partial region of the electromagnetic shielding layer extending outward and not overlapping with the flexible circuit board 11, and is used for bonding and fixing the flexible circuit module 20 at a predetermined position on the back side of the screen after the flexible circuit module 10 is bent. In the process of manufacturing the flexible circuit module 10, a protective film 127 is bonded to the surface of the bonding fixing portion on the side close to the flexible circuit board 11. The protection film 127 can protect the adhesive glue on the surface of the adhesive fixing part 126 in the processing operation engineering, and can avoid the adhesion of the adhesive glue caused by the influence of dust or impurities on the adhesive glue, so that the adhesive is not firm, and meanwhile, the adhesion of the adhesive fixing part 126 and production line equipment or a storage platform in the production operation process can be prevented from being adhered to cause production line operation obstruction, so that the product reliability and the production safety can be improved. The protective film 127 needs to be removed before the flexible circuit module 10 is adhered to the back side of the panel, so that the adhesion fixing portion is adhered to the back side of the panel.
For example, the adhesive fixing portion 126 may be rectangular, circular, triangular, etc., and the shape and size of the adhesive fixing portion are not particularly limited. Preferably, the bonding fixing portion 126 is disposed in an axisymmetric manner about a symmetry axis of the electromagnetic shielding layer 12, which is parallel to the length direction of the flexible circuit board 11, so that the flexible circuit module 10 can form a stable and balanced stressed structure after being bonded and fixed, and the flexible circuit module 10 is prevented from being bonded and deformed and loosened when being impacted by an external force, thereby affecting the display effect.
The present application further provides a display panel 100 including the flexible circuit module 10 provided in the present application. Referring to fig. 9, fig. 9 is a schematic structural diagram of a display panel according to an embodiment of the present application. Fig. 9 provides a display panel 100 including the flexible circuit module 10 according to any of the above embodiments of the present application.
Illustratively, the display panel 100 includes an array substrate 101 and a touch sensing layer 102, the array substrate 101 includes a touch connection area and a main connection area, the touch connection area is provided with a plurality of binding pads 1011, the trace of the touch sensing layer 102 is electrically connected to the plurality of binding pads 1011, and meanwhile, the binding portion of the functional circuit board 112 is bound to the binding pads 1011. That is, the functional circuit board 112 may be a touch flexible circuit board, and connects the touch sensing layer 102 with a touch chip disposed on the wiring portion 113, thereby implementing a touch function of the display panel. The functional circuit board 112 may be a flexible circuit board for connecting other components, and the functional circuit board 112 may include a plurality of flexible circuit boards connected to different functional components, which is not particularly limited in the present application. The display panel provided by the embodiment of the application has the beneficial effects of the flexible circuit module provided by the embodiment of the application, and specific descriptions of the flexible circuit module in the above embodiments can be specifically referred to, and the description of the embodiment is omitted here.
It is to be understood that both the foregoing description and the following detailed description are exemplary and explanatory only and are not restrictive of the application, as various changes and modifications may be effected therein by those skilled in the art without departing from the spirit and scope of the application. Thus, if such modifications and variations of the present application fall within the scope of the claims of the present application and their equivalents, the present application is intended to include such modifications and variations as well.
Claims (10)
1. A flexible circuit module, comprising:
the flexible circuit board is provided with a wiring part, a bending part and a binding part which are distributed in sequence in the length direction of the flexible circuit board, the flexible circuit board comprises a main circuit board and a functional circuit board, and the main circuit board and the functional circuit board are at least partially overlapped to form a thin area and a thick area with thickness difference;
and the electromagnetic shielding layer is laminated with the flexible circuit board, and at least the thick area of the bending part is exposed.
2. The flexible circuit module of claim 1, wherein the main circuit board includes first and second opposing surfaces, the functional circuit board being disposed on the second surface, the first surface being provided with a first bonding pin, the functional circuit board including third and fourth opposing surfaces, the functional circuit board being opposite the second surface through the third surface, the third surface being provided with a second bonding pin;
the binding part comprises a first sub-binding part and a second sub-binding part, the first sub-binding part is positioned on the main circuit board, the first binding pin is arranged on the first sub-binding part, the second sub-binding part is positioned on the functional circuit board, and the second binding pin is arranged on the second sub-binding part;
preferably, the electromagnetic shielding layer covers the fourth surface and the second surface are not covered by the partial area that the functional circuit board covers, just the first sub-binding portion and the second sub-binding portion are not covered by the electromagnetic shielding layer, expose outside the electromagnetic shielding layer.
3. The flexible circuit module of claim 1, wherein the electromagnetic shielding layer comprises a main covering portion, a first portion and a second portion connected to the main covering portion and adjacently disposed, the first portion and the second portion are adjacently disposed through a crack stop groove, the main covering portion covers the wiring portion, the first portion extends from the main covering portion to an edge of the thick region of the flexible circuit board adjacent to the wiring portion, and the second portion extends from the main covering portion to cover the thin region of the flexible circuit board.
4. The flexible circuit module of claim 3, wherein an orthographic projection of the crack stop grooves on the flexible circuit board is distributed on the thin region and close to the thick region, and the minimum distance between the crack stop grooves and the thick region is greater than or equal to 1.5 mm.
5. The flexible circuit module of claim 3, wherein the depth of the crack stop groove from the opening to the bottom of the groove is greater than or equal to 1 mm.
6. The flexible circuit module of claim 3, wherein the second portion of the electromagnetic shielding layer is provided with a plurality of through holes in the region of the bending portion;
preferably, the through holes are arranged adjacent to the crack arrest grooves in the width direction of the flexible circuit board;
preferably, the through holes are arranged at equal intervals along the width direction, the hole distance between every two adjacent through holes is larger than or equal to 2mm, and the hole diameter of each through hole is larger than or equal to 1 mm.
7. The flexible circuit module of claim 1, wherein the electromagnetic shielding layer has a thickness that is less than or equal to a difference in thickness between the thin region and the thick region.
8. The flexible circuit module of claim 1, wherein the electromagnetic shield layer comprises one or more of a conductive cloth, an aluminum foil, a copper foil, and a wave-absorbing material.
9. The flexible circuit module of claim 1, wherein the electromagnetic shielding layer has at least one adhesive fixing portion, the adhesive fixing portion being disposed to extend a predetermined distance from an edge of the main covering portion in a direction away from the main covering portion;
preferably, the adhesive fixing part is arranged on an edge of the main covering part parallel to the length direction of the flexible circuit board and/or one side edge of the main covering part far away from the binding part;
preferably, a protective film is attached to a surface of the adhesive fixing portion on a side close to the flexible circuit board.
10. A display panel comprising the flexible circuit module according to any one of claims 1 to 9;
preferably, the display panel includes an array substrate and a touch sensing layer, which are stacked, the array substrate is bound to the main circuit board, and the touch sensing layer is bound to the functional circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110733022.9A CN113473695B (en) | 2021-06-29 | 2021-06-29 | Flexible circuit module and display panel |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110733022.9A CN113473695B (en) | 2021-06-29 | 2021-06-29 | Flexible circuit module and display panel |
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| CN113473695A true CN113473695A (en) | 2021-10-01 |
| CN113473695B CN113473695B (en) | 2022-09-30 |
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| CN114035704A (en) * | 2021-11-05 | 2022-02-11 | 业成科技（成都）有限公司 | Circuit board structure, backlight module, display module and touch display module |
| CN114170917A (en) * | 2022-01-12 | 2022-03-11 | 昆山国显光电有限公司 | Display module and display device |
| CN115003012A (en) * | 2022-06-13 | 2022-09-02 | 京东方科技集团股份有限公司 | Flexible circuit board and display device |
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|---|---|
| CN113473695B (en) | 2022-09-30 |
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