CN113471131A - Chip positioning suction head - Google Patents

Chip positioning suction head Download PDF

Info

Publication number
CN113471131A
CN113471131A CN202110791109.1A CN202110791109A CN113471131A CN 113471131 A CN113471131 A CN 113471131A CN 202110791109 A CN202110791109 A CN 202110791109A CN 113471131 A CN113471131 A CN 113471131A
Authority
CN
China
Prior art keywords
mounting
chip
hollow column
plate
shaping
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110791109.1A
Other languages
Chinese (zh)
Inventor
蔡桂洪
廖俊杰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shenzhen Yanmade Technology Co ltd
Original Assignee
Shenzhen Yanmade Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shenzhen Yanmade Technology Co ltd filed Critical Shenzhen Yanmade Technology Co ltd
Priority to CN202110791109.1A priority Critical patent/CN113471131A/en
Publication of CN113471131A publication Critical patent/CN113471131A/en
Pending legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6838Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manipulator (AREA)

Abstract

The invention provides a chip positioning suction head which comprises a hollow column, a first mounting plate, a second mounting plate, a third mounting part, a fourth mounting part, a suction nozzle and a power part, wherein the hollow column is arranged on the first mounting plate; four shaping claws, four cam blocks and four translation blocks; when power component drove third installed part and fourth installed part and descends, the plastic claw was stretched out by first mounting panel bottom, and the cam piece of fourth installed part moves down for the translation piece promotes plastic claw to suction nozzle department horizontal migration. The chip positioning suction head provided by the invention can be fixed on a manipulator of processing detection equipment through the second mounting plate to realize adsorption and shaping of a chip, negative pressure adsorption of the chip is realized through the suction nozzle at the bottom of the hollow column, meanwhile, the shaping claw arranged on the third mounting part is used for shaping and positioning the chip on the suction nozzle, and the limiting structure arranged on the first mounting plate at the bottom of the hollow column can control the shaping claw to keep a certain gap with the chip in a furled state.

Description

Chip positioning suction head
Technical Field
The invention relates to the technical field of semiconductor automatic processing and testing equipment, in particular to a chip positioning suction head.
Background
In a chip package test apparatus, a tray is adapted to carry important parts of a chip, and a pin die is an important part for testing a chip. However, the groove for carrying the chip on the tray has a large size and width, and the chip has a certain displacement space in the groove of the tray. The pin die is a part for testing the chip with high precision, so that the size space for placing the chip on the pin die is small, the chip needs to be positioned with high precision, and when the chip is placed in the slot of the pin die, the clearance between the chip and the pin die is small.
In the existing chip automatic processing and testing equipment, most of the automatic loading and unloading operations for the chips are that a suction head of a manipulator extends into a material groove of a material tray to take out the chips and then carries the chips to a needle mold groove of a needle mold. And the manipulator is matched with the suction head, so that the material moving requirement that the chip is conveyed from a material tray with low positioning precision to a needle die with high precision in the feeding process cannot be met. In order to meet the requirement of high-precision discharging, the manipulator is matched with the gas claw to perform the material moving operation of the chip on some existing equipment, the gas claw can only move in the horizontal direction, the fixing and the material moving of the chip are realized through the relative movement of two pairs of gas claws, the gas claw cannot stretch into a needle mold groove of a needle mold to be taken out in the material moving process of the chip, other components are needed to realize when the needle mold is used for blanking, the chip is clamped through the gas claw, in order to ensure the stability of the chip during material moving, the acting force applied to the chip on the gas claw is overlarge, and the appearance of the chip is easily damaged. Therefore, in the existing chip loading and unloading device, the requirements for chip loading and unloading cannot be met simultaneously in a suction head adsorption mode or a pneumatic claw clamping mode.
Disclosure of Invention
The invention aims to solve the defects that the automatic feeding and discharging operation of chips in the existing chip automatic processing test equipment cannot meet the requirement of high-precision discharging of a needle die in a suction head adsorption mode, cannot take the chips out of the needle die in a pneumatic claw clamping mode and is easy to damage the appearance of the chips, and provides a chip positioning suction head.
The technical scheme adopted by the invention for solving the technical problems is as follows: a chip positioning suction head comprising: the device comprises a hollow column, a first mounting plate fixed at the bottom of the hollow column, a suction nozzle arranged at the bottom of the hollow column and extending out of the bottom surface of the first mounting plate, a second mounting plate, a third mounting piece and a fourth mounting piece which are movably connected with the hollow column, and a power part fixed on the second mounting plate and used for driving the third mounting piece and the fourth mounting piece to vertically descend; the third mounting piece is movably connected with four shaping claws arranged around the hollow column, the fourth mounting piece is fixedly provided with four cam blocks arranged around the hollow column, four translation blocks are arranged inside the first mounting plate, one end of each translation block is abutted against the cam block, and the other end of each translation block is movably connected with the shaping claws; when the power component drives the third mounting part and the fourth mounting part to descend, the shaping claw on the third mounting part extends out of the bottom of the first mounting plate, and the cam block of the fourth mounting part moves downwards, so that the translation block pushes the shaping claw to move horizontally towards the suction nozzle.
Further, the bottom of well hollow column is provided with four stoppers that are used for restricting the vertical descending distance of third installed part, the stopper of well hollow column with first mounting panel fixed connection.
Further, the bottom of first mounting panel is provided with four sliding trays, the translation piece set up in the sliding tray, the translation piece include U font base plate, set up in a pair of bearing of U font base plate one end, set up in pivot on a pair of bearing and set up in a pair of fixed axle of the U font base plate other end.
Specifically, a pair of first springs is arranged between each translation block and the sliding groove, and the first springs push the translation blocks to the cam blocks.
Further, the fourth installed part is including the fourth vertical board that is vertical setting and the fourth annular plate that is the level setting, the inside formation of fourth annular plate can supply the cavity post with the fourth through-hole that the third installed part wore to establish, the vertical board of fourth is fixed in through the third guide rail the right flank of cavity post.
Specifically, the inboard of fourth ring plate encircles the cavity post is provided with four and supplies the fixed fourth mounting hole of cam piece, the cam piece is fixed in on the fourth mounting hole.
Specifically, be provided with the curved profile face on the cam piece, the curved profile face is including being the first vertical face of vertical setting and by first vertical face upwards just to the first arc surface of suction nozzle one side extension.
Further, the third installed part is including the third vertical board that is vertical setting and the third annular plate that is the level setting, the inside formation of third annular plate can supply the third through-hole that the cavity post wore to establish, the vertical board of third is fixed in through the second guide rail the left surface of cavity post.
Specifically, the outer side of the third annular plate surrounds the hollow column and is provided with four third mounting grooves for the movable connection of the shaping claw, and the top of the shaping claw is embedded in the third mounting grooves through a mounting shaft.
Specifically, the reshaping claw comprises a connecting section fixedly connected with the third mounting part and a reshaping section capable of being contacted with the side edge of the chip.
The chip positioning suction head provided by the invention has the beneficial effects that: including setting up the suction nozzle on the cavity post, second mounting panel and plastic claw, the absorption and the plastic of chip are realized on the manipulator of processing check out test set are fixed in with whole chip location suction head device to this second mounting panel of accessible, this chip location suction head can realize adsorbing the negative pressure of chip through the suction nozzle of cavity toe portion, the chip on the suction nozzle is carried out the plastic location to the plastic claw that sets up on the third installed part that utilizes the cavity post simultaneously, and be provided with limit structure on the first mounting panel of this cavity toe portion and can control the plastic claw under the folded state and still keep certain clearance between the chip, this clearance less than or equal to needle mould and the clearance between the chip.
Drawings
FIG. 1 is a schematic perspective view of a chip positioning tip according to the present invention;
FIG. 2 is a schematic perspective exploded view of a chip positioning tip according to the present invention;
FIG. 3 is a bottom view of a chip positioning tip provided by the present invention;
FIG. 4 is a schematic perspective view of a hollow column and drive components of a chip positioning tip according to the present invention;
FIG. 5 is an enlarged view of a portion of FIG. 2 at A;
FIG. 6 is an enlarged view of a portion of FIG. 2 at B;
FIG. 7 is a schematic perspective view of a cam block of a chip positioning tip according to the present invention;
FIG. 8 is a schematic perspective view of a shaping jaw of a chip positioning tip according to the present invention;
FIG. 9 is a full cross-sectional view of an initial state of a chip positioning tip provided by the present invention;
FIG. 10 is a full cross-sectional view of the reforming claw of a chip positioning suction head provided by the present invention as it is extended;
FIG. 11 is a full sectional view of the shaping jaw of a chip positioning suction head provided by the present invention;
fig. 12 is a partial enlarged view at C in fig. 11.
In the figure: 100-chip positioning suction head;
10-hollow column, 11-column body, 12-limited block, 13-left side, 14-right side,
15-rear side, 16-first limit column, 17-vacuum channel;
21-first mounting plate, 211-first through hole, 212-second through hole, 213-first mounting groove,
214-sliding groove, 2141-outer side surface, 2142-inner side surface, 215-first spring,
216-first cover plate, 22-translation block, 221-U-shaped base plate, 222-bearing,
223-rotating shaft, 224-fixed shaft, 225-opening, 226-flat plate and 227-guide column;
30-suction nozzle, 31-sealing ring, 32-adsorption part and 321-vacuum adsorption port;
41-second mounting plate, 411-horizontal plate, 4111-first gas pipe joint,
4112-second gas pipe joint, 4113-mounting part, 42-guide rail connecting block,
421-a second spring, 422-a second limit block and 43-a first guide rail;
51-third mount, 511-third vertical plate, 512-third annular plate,
5121-third through hole, 5122-third mounting groove, 513-side connecting block, 5131-spring mounting hole,
5132 bottom surface of side connecting block, 52 shaping claw, 521 connecting segment, 5211 first mounting hole,
5212-second mounting hole, 522-shaping section, 5221-correcting block, 53-second guide rail and 54-mounting shaft;
61-fourth mounting piece, 611-fourth vertical plate, 612-fourth annular plate, 6121-fourth through hole,
6122-fourth mounting hole, 6123-third mounting hole, 6124-fifth mounting hole, 6125-positioning groove, 62-cam block, 621-upper mounting section, 6211-fourth connecting hole, 6212-positioning strip,
622-lower mounting section, 6221-vertical rod, 6222-curved profile surface, 6222 a-first vertical surface,
6222 b-first arc face, 63-third guide rail, 64-return spring;
70-power component, 71-driving cylinder, 711-driving rod, 72-first driving block,
721, seventh mounting hole, 73, second driving block, 731, third spring, 732, eighth mounting hole,
733-mounting limit groove, 7331-lower bottom surface of seventh mounting groove;
80-gap, 90-chip, L1-chip width, L2-width of the swaging jaw when collapsed.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Referring to fig. 1-12, a chip positioning tip 100 is provided according to the present invention. The chip positioning suction head 100 provided by the invention can be applied to various chip 90 processing and/or testing equipment. The chip positioning suction head 100, after being fixedly connected to a robot in a processing and/or testing apparatus, can be used for automated loading and unloading operations for the chip 90. The chip positioning suction head 100 provided by the invention can effectively control the feeding and discharging precision and the feeding posture of the chip 90, and ensure the accurate positioning of the chip 90 from the charging tray to the high-precision dies such as a needle die and the like. Meanwhile, the chip positioning suction head 100 can not apply much pressure to the chip 90 no matter in the negative pressure adsorption of the chip 90 or the shaping process of the chip 90 in the feeding and discharging process of the chip 90, so that the chip 90 is prevented from being extruded, and the risk of damage to shaping parts in the feeding and discharging process of the chip 90 is reduced. The chip positioning suction head 100 provided by the invention can directly adsorb the chip 90 and then place the chip into a needle mold groove for chip testing, keep the chip 90 adsorbed on the chip positioning suction head 100 all the time for testing, and directly take out and discharge the chip 90 from the needle mold after the chip 90 is tested. In the process of testing the chip, the chip positioning suction head 100 can control the bottom surface of the chip 90 adsorbed by the chip positioning suction head 100 and the bottom surface of the needle mold groove of the needle mold to keep a certain gap, so that the chip 90 is prevented from being damaged due to the fact that the chip positioning suction head 100 is pressed down to abut against the chip 90 excessively.
Fig. 1 is a schematic perspective view of a chip positioning suction head 100 according to the present invention. The chip positioning suction head 100 has a compact internal structure, all parts are skillfully designed and matched with each other, and the overall appearance size is only 50mmX50mm while the chip positioning suction head has double functions of adsorption and shaping. This chip positioning suction head 100 can perform a shaping operation on the chip 90 when the chip 90 is fed from a low accuracy to a high accuracy on the premise of ensuring the chip 90 to be adsorbed. And only when chip 90 need be rectified, stretch out the shaping part by its bottom and carry out the plastic to the adsorbed chip 90 on the suction nozzle 30, after accomplishing the plastic, this shaping part resets to the top of suction nozzle 30 to guarantee that shaping part can not produce the interference at the material loading of chip 90 and unloading in-process, guarantee that suction nozzle 30 can stretch into mould inslot of high accuracy such as silo, needle mould groove and get the material.
Further, as shown in fig. 1, the chip positioning suction head 100 provided by the present invention comprises a hollow column 10, a first mounting plate 21 fixed to the bottom of the hollow column 10, a suction nozzle 30 disposed at the bottom of the hollow column 10 and extending from the bottom surface of the first mounting plate 21, a second mounting plate 41 movably connected to the hollow column 10, a third mounting member 51 and a fourth mounting member 61, and a power member 70 fixed to the second mounting plate 41 for driving the third mounting member 51 and the fourth mounting member 61 to vertically descend. The second mounting plate 41 is disposed on the top of the hollow column 10, the third mounting member 51 is movably connected to the left side 13 of the hollow column 10, and the fourth mounting member 61 is movably connected to the right side 14 of the hollow column 10.
As shown in fig. 4, the hollow column 10 has a rectangular cross-section and is a column structure, the hollow column 10 and the first mounting plate 21 fixed to the bottom of the hollow column 10 are perpendicular to each other, and the hollow column 10 and the first mounting plate 21 are always fixed to each other during the relative movement of other components of the chip positioning suction head 100. The left side 13 of the hollow column 10 is provided with a third mounting member 51, the third mounting member 51 is movably connected to the hollow column 10, and the horizontal portion of the third mounting member 51 is sleeved on the outer circumferential surface of the hollow column 10, and when the power member 70 drives the third mounting member 51 to vertically descend, the third mounting member 51 moves towards the first mounting plate 21. Similarly, a fourth mounting element 61 is disposed on the right side 14 of the hollow column 10, the fourth mounting element 61 is movably connected to the hollow column 10, and the horizontal portion of the fourth mounting element 61 is sleeved on the outer circumferential surfaces of the hollow column 10 and the third mounting element 51, and when the power member 70 drives the fourth mounting element 61 to vertically descend, the fourth mounting element 61 moves towards the first mounting plate 21. And the third mounting member 51 is limited by the hollow column 10, so that the downward moving distance of the third mounting member is less than that of the fourth mounting member 61.
As shown in FIG. 2, the second mounting plate 41 of the chip positioning suction head 100 of the present invention comprises a horizontal plate 411 disposed parallel to the first mounting plate 21, a first vertical plate 412 disposed on the left side of the horizontal plate 411 to cover the outer side of the third mounting member 51, and a second vertical plate 413 disposed on the rear side of the horizontal plate 411. Be provided with on the horizontal plate 411 of this second mounting panel 41 can with manipulator fixed connection's installation department 4113, this installation department 4113 can be connection structure such as threaded connection hole, joint interface, can realize through this installation department 4113 that whole chip location suction head 100 and chip processing or check out test set's fixed connection to by the horizontal vertical migration of the whole chip location suction head 100 of this equipment drive.
As shown in fig. 9, the second mounting plate 41 is movably connected to the hollow column 10 by a second vertical plate 413 on the rear side. As shown in fig. 2, a rail attachment block 42 is provided on the rear side 15 of the hollow column 10, and the rail attachment block 42 is fixed to the rear side 15 of the hollow column 10. The rail connecting block 42 is movably connected with the second mounting plate 41 through a first rail 43. The first guide rail 43 is disposed between the rail connecting block 42 and the second vertical plate 413 of the second mounting plate 41 such that the second mounting plate 41 can be vertically lifted and lowered with respect to the hollow column 10 in the direction in which the first guide rail 43 is disposed. The second mounting plate 41 and the hollow column 10 are connected with each other by the first guide rail 43, so that a certain elastic adjusting space is formed between the second mounting plate 41 and the hollow column 10, and the heights of the suction nozzles 30 of different chip positioning suction heads 100 on the same manipulator can be adjusted by the elastic adjusting space, so that the suction nozzles 30 of different chip positioning suction heads 100 on the same manipulator can be always on the same horizontal plane.
Specifically, the center of the horizontal plate 411 of the second mounting plate 41 is provided with a first air pipe port 4111 and a second air pipe port 4112 adjacent to the first air pipe port 4111, the first air pipe port 4111 is communicated with a vacuum generator on the outside and with a vacuum channel 17 inside the hollow column 10 on the inside, so as to provide a vacuum suction chip 90 for the suction nozzle 30 fixed to the bottom of the hollow column 10. The outside of the second cylinder port 4112 located on the side adjacent to the first gas pipe joint 4111 is also communicated with the compressed gas pipe, and the inside is communicated with the power component 70 fixed on the second mounting plate 41, so as to provide assistance to the power component 70.
Specifically, as shown in fig. 2, the upper surface of the rail connecting block 42 is provided with a second spring 421. The top end of the second spring 421 disposed on the guide rail connecting block 42 abuts against the bottom surface of the horizontal plate 411 of the second mounting plate 41, and the bottom end of the second spring 421 abuts against the top surface of the guide rail connecting block 42. The second spring 421 is provided such that there is a certain elastic gap between the second mounting plate 41 and the hollow post 10. Meanwhile, the second limit block 422 is further disposed on the rail connecting block 42, and the second limit block 422 ensures that the second mounting plate 41 and the hollow column 10 can always keep a reasonable safety distance, thereby ensuring the safety of the power component 70 fixed on the second mounting plate 41 and the hollow column 10.
Further, as shown in fig. 2, the hollow column 10 of the chip positioning suction head 100 of the present invention is a rectangular column structure, and a set of shaping components are respectively disposed around four sides of the rectangular cross section of the hollow column 10, and a total of four sets of shaping components are disposed around the hollow column 10. Each set of shaping components can be accommodated in the first mounting plate 21 in an initial state, and only when shaping is needed, the shaping components extend downwards from the bottom surface of the first mounting plate 21 to shape the chip 90 adsorbed on the suction nozzle 30. After the shaping is completed, each of the shaping assemblies is returned to the interior of the first mounting plate 21. Each set of swaging assemblies includes a swaging jaw 52, a cam block 62, and a translation block 22. The shaping claw 52 can realize lifting in the vertical direction and relative translation in the horizontal direction on the chip positioning suction head 100, the lifting in the vertical direction of the shaping claw 52 is driven by the third mounting piece 51 fixedly connected with the shaping claw 52, and the relative translation in the horizontal direction of the shaping claw 52 is driven by the translation block 22 abutted with the shaping claw 52. The cam block 62 can be vertically lifted on the chip positioning suction head 100, and the lifting of the cam block 62 in the vertical direction is driven by the fourth mounting piece 61 fixedly connected with the cam block. The translation block 22 can realize the relative translation in the horizontal direction on the chip positioning suction head 100, and the translation block 22 is driven by the lifting and falling of the cam block 62 which is abutted against the translation block in the vertical direction to realize the translation in the horizontal direction. The cam block 62 and the translation block 22 both serve the shaping blocks 52 to achieve the shaping requirements of the four shaping blocks 52 to be folded and unfolded around the suction nozzle 30.
Specifically, four reshaping claws 52 are movably connected to the third mounting member 51 and are arranged around the hollow column 10, the third mounting member 51 is arranged around the hollow column 10, and mounting positions for movably connecting the four reshaping claws 52 are respectively arranged on the third mounting member 51 along four different sides of the hollow column 10. The shaping claws 52 can move in a pairwise manner or move back to back in the mounting positions of the third mounting part 51, and meanwhile, when the third mounting part 51 vertically moves up and down relative to the hollow column 10, the four shaping claws 52 movably connected to the third mounting part can be driven to synchronously move up and down in the vertical direction.
Be fixed with four cam piece 62 that encircle the setting of cavity post 10 on this fourth installed part 61, this fourth installed part 61 encircles cavity post 10 and the setting of third installed part 51, is provided with four fixed positions that are used for fixed cam piece 62 along four different sides of cavity post 10 on this fourth installed part 61, and when this fourth installed part 61 was for the vertical lift of cavity post 10, can drive four cam piece 62 and the synchronous vertical lift of fourth installed part 61 that are fixed in it.
The first mounting plate 21 is internally provided with four translation blocks 22. The four translation blocks 22 are arranged opposite to each other two by two. A shaping claw 52 and a cam block 62 are arranged above each translation block 22, and each translation block 22 is assembled with one shaping claw 52 and one cam block 62, so that the translation of the translation block 22 is driven by the lifting of the cam block 62, and the horizontal movement of the shaping claw 52 is driven by the translation of the translation block 22.
Specifically, as shown in fig. 6, a perspective structure diagram of a set of shaping components is shown. Each of the sets of truing assemblies provided in a chip positioning tip 100 of the present invention includes a translation block 22, a truing jaw 52 and a cam block 62. One end of the translation block 22 can abut against the cam block 62, and the other end of the translation block 22 is movably connected with the shaping claw 52. The cam block 62 is provided with a curved profile surface 6222 which is in contact with the translation block 22, and the curved profile surface 6222 is provided with a curved profile designed according to the structural action requirement, so that the translation block 22 can be driven by the curved profile surface 6222 to horizontally move the translation block 22 along the installation direction of the sliding groove 214 in the process of lifting the cam block 62. After the translation block 22 is movably connected with the shaping claw 52, the relative translation of the translation block 22 will drive the shaping claw 52 to move relatively.
Further, as shown in fig. 4, in the chip positioning suction head 100 of the present invention, the power unit 70 is a driving cylinder 71 fixed to the second mounting plate 41. The top of the driving cylinder 71 is connected to the second air pipe port 4112 on the second mounting plate 41, and the driving rod 711 at the bottom of the driving cylinder 71 is fixedly connected to the fourth mounting member 61 through the first driving block 72. The first driving block 72 has a groove in the middle, and the driving rod 711 of the driving cylinder 71 is pushed to the upper surface of the groove by gas after the driving cylinder 71 is ventilated, thereby playing a role of pushing the first driving block 72. The first driving block 72 is provided with seventh mounting holes 721 at both sides of the driving rod 711, respectively. The seventh mounting hole 721 is used to fixedly connect the fourth mounting member 61, so that the driving cylinder 71 drives the fourth mounting member 61 to move vertically and downwardly.
Meanwhile, as shown in fig. 1, the power unit 70 further includes a second driving block 73 disposed at a side of the first driving block 72, and both the second driving block 73 and the first driving block 72 are fixed to the fourth mounting member 61. As shown in fig. 2, the second driving block 73 is provided with an eighth mounting hole 732 fixedly connected to the fourth mounting member 61, and the second driving block 73 is fixed to the fourth mounting member 61 on the side close to the third mounting member 51 by a locking member such as a screw through the eighth mounting hole 732. The second driving block 73 is provided with a seventh mounting groove 733 at a side facing the third mounting member 51. Correspondingly, a side connecting block 513 which can extend into the seventh mounting groove 733 is provided at a side of the third mounting member 51 adjacent to the second driving block 73. In an initial state, the side connection block 513 of the third mounting member 51 is inserted into the seventh mounting groove 733 of the second driving block 73, and the bottom surface 5132 of the side connection block 513 is abutted to the lower bottom surface 7331 of the seventh mounting groove 733 of the second driving block 73. Meanwhile, a spring mounting hole 5131 is provided on the side connection block 513 of the third mounting member 51, and a corresponding spring mounting hole (not shown) is also provided on the upper top surface in the seventh mounting groove 733 of the second driving block 73. A third spring 731 is provided between the second driving block 73 and the third mounting member 51, a bottom surface of the third spring 731 abuts against a bottom of the spring mounting hole 5131 of the third mounting member 51, and a top surface of the third spring 731 abuts against a top surface of the spring mounting hole of the second driving block 73. The third mounting member 51 is always elastically pressed against the lower bottom surface 7331 of the second driving block 73 by the third spring 731. That is, the second driving block 73 is fixed to the fourth mounting member 61, and the elastic connection between the second driving block 73 and the third mounting member 51 is achieved by the mutual engagement between the seventh mounting groove 733 provided on the second driving block 73 and the side connecting block 513 of the third mounting member 51, and the cooperation of the third spring 731.
When the driving cylinder 71 in the power component 70 drives the first driving block 72 downwards to move downwards, the first driving block 72 drives the fourth mounting member 61 fixed thereon to move downwards, and when the fourth mounting member 61 moves downwards, the second driving block 73 positioned thereon is synchronously driven to move downwards, and the third mounting member 51 is synchronously driven to move downwards by the second driving block 73. The power component 70 realizes the synchronous descending of the third mounting piece 51 and the fourth mounting piece 61 driven simultaneously through the mutual matching among the driving air cylinder 71, the first driving block 72 and the second driving block 73.
The second driving block 73 and the third mounting element 51 in the power component 70 provided by the invention are elastically connected, so that an elastic compression space is arranged between the third mounting element 51 and the second driving block 73 in the vertical direction, and the elastic compression space provides a compression space for the power component 70 to continuously drive the fourth mounting element 61 to continuously move downwards after the third mounting element 51 stops moving downwards. That is, the elastic connection between the second driving block 73 and the third mounting element 51 of the power component 70 provided by the present invention can realize that the driving cylinder 71 drives the third mounting element 51 and the fourth mounting element 61 to move downwards synchronously, and when the third mounting element 51 stops moving downwards under the action of the stopper, the driving cylinder 71 can also continuously push the fourth mounting element 61 to move downwards to the limit working position.
Further, in the practical operation of the chip positioning suction head 100 provided by the present invention, when the power unit 70 drives the third mounting member 51 and the fourth mounting member 61 to descend, the shaping claw 52 on the third mounting member 51 extends from the bottom of the first mounting plate 21, and the cam block 62 of the fourth mounting member 61 moves downward, so that the translation block 22 pushes the shaping claw 52 to move horizontally towards the suction nozzle 30. The power unit 70 provided by the present invention drives the third mount 51 and the fourth mount 61 downward in two different stages, which respectively achieve the vertical downward movement and the horizontal translation of the reforming claw 52.
The tip of the suction nozzle 30 in the chip positioning suction head 100 provided by the present invention is always in a state of being protruded from the bottom surface of the first mounting plate 21. The suction nozzle 30 can extend into a trough containing the chips 90 to suck the chips 90 in the feeding and discharging processes from the extended part of the bottom surface of the first mounting plate 21, or the chips 90 can be placed into the needle mold trough of the needle mold in the state that the chips 90 are on the suction nozzle 30.
In the initial state, the entire chip positioning suction head 100 is in the state shown in fig. 9, and the shaping claw 52 and the cam block 62 are always located inside the first mounting plate 21. As the power member 70 is driven downward, the first stage of downward driving of the power member 70 is entered. The first stage is that the third mounting part 51 and the fourth mounting part 61 move downwards synchronously, at this time, the shaping claw 52 extends vertically downwards, the cam block 62 moves vertically downwards, and the translation block 22 is supported by the cam block 62 and is always in a stagnation state. At the end of the first stage, the entire chip positioning tip 100 is shown in FIG. 10. At this time, the third attachment member 51 moves downward to the stopper 12 of the hollow column 10, and abuts against the stopper 12. The reforming claw 52 protrudes from the bottom surface of the first mounting plate 21 with the reforming claw 52 at the maximum stroke in the vertical direction.
Then, the power unit 70 continues to drive downward, and enters a second stage where the power unit 70 drives downward. The second stage is that the third mounting part 51 stops moving downwards in a limited way, and the power part 70 continuously pushes the fourth mounting part 61 to move downwards. At this time, the shaping claw 52 is no longer moved downward, but the cam block 62 continues to move downward, and the abutting surface of the cam block 62 is inclined toward the suction nozzle 30 side at this time, so that the translation block 22 is urged to move horizontally toward the suction nozzle 30 side, and the shaping claw 52 is urged to move horizontally toward the suction nozzle 30. In the second stage, as the fourth mounting member 61 continues to move downward, the shaping claw 52 is urged to be folded toward the suction nozzle 30, so that the shaping process of the chip 90 sucked on the suction nozzle 30 by the shaping claw 52 is realized. At the end of the second stage, the entire chip positioning tip 100 is shown in FIG. 11. At this time, the four shaping claws 52 around the chip 90 are all folded toward the chip 90, so as to shape the chip 90.
As shown in fig. 12, at the end of the second stage, after the four shaping claws 52 are relatively closed, the width between the two shaping claws 52 is L2, and the width of the chip 90 sucked on the suction nozzle 30 is L1. At this time, the width L2 between the two opposing reforming claws 52 reaches a minimum value. The minimum value of the width L2 is always larger than the width L1 of the chip 90, so that a certain gap 80 can be generated between the shaping claw 52 and the chip 90, and the gap 80 is smaller than or equal to the gap which can be generated between the pin die slot and the chip 90 when the chip 90 enters the pin die. The difference between the minimum value of the width L2 between the two shaping claws 52 and the width of the chip 90 is the gap 80 generated between the shaping claw 52 and the chip 90, and the gap 80 can ensure that the shaping claw 52 does not generate extrusion force on the chip 90 in the shaping process on the premise of ensuring the feeding and discharging precision of the chip 90, thereby avoiding the damage of shaping to the chip 90.
Specifically, as shown in fig. 2, the first mounting plate 21 is provided at the center thereof with a first through hole 211 through which the suction nozzle 30 passes. The first through hole 211 formed in the first mounting plate 21 is rectangular and allows the suction nozzle 30 to pass through. As shown in fig. 3 and 9, the top of the suction nozzle 30 is fixedly connected with the bottom of the hollow column 10, and the suction nozzle 30 communicates with the vacuum passage 17 in the hollow column 10, where the sealing ring 31 is provided. The suction nozzle 30 has a suction portion 32 attached to the chip 90 at the bottom, and the suction portion 32 is provided with a vacuum suction port 321. The shape of the suction portion 32 is determined by the outline of the chip 90. The number of vacuum suction ports 321 provided in the suction portion 32 is determined by the size of the chip 90 and actual requirements. In the present embodiment, the suction portion 32 of the bottom of the suction nozzle 30 has a rectangular bar-shaped structure, and two vacuum suction ports 321 are uniformly arranged along the length direction thereof. The upper surface of the chip 90 is bonded to the bottom surface of the suction portion 32. In the present embodiment, the suction nozzle 30 has only the suction portion 32 protruding from the first mounting plate 21 regardless of whether the shaping member of the chip positioning suction head 100 is in the shaping state or the non-shaping state.
The first mounting plate 21 is further provided with four second through holes 212 which are communicated with the first through holes 211 and through which the cam blocks 62 and the shaping claws 52 can pass. The four second through holes 212 are arranged opposite to each other two by two and are respectively located at the centers of the four sides of the first through hole 211. The second through hole 212 is a rectangular elongated through hole and is communicated with the first through hole 211 at a side close to the center of the first mounting plate 21. The second through hole 212 allows both the reforming claw 52 and the cam block 62 of a reforming assembly to pass through. Cam block 62 mounted to fourth mount 61 and swaging jaw 52 mounted to third mount 51 extend through second through-hole 212 into translation block 22 of first mounting plate 21.
Further, as shown in fig. 4, the bottom of the hollow column 10 in the chip positioning suction head 100 provided by the present invention is provided with four limiting blocks 12 for limiting the vertical descending distance of the third mounting member 51, and the limiting blocks 12 are fixedly connected with the first mounting plate 21. The stopper 12 is a mounting block extending upward and all around from the bottom surface of the hollow column 10. The upper surface of the first mounting plate 21 is provided with four first mounting grooves 213, and the first mounting grooves 213 and the limiting blocks 12 on the hollow column 10 are arranged in a one-to-one correspondence manner. The first mounting grooves 213 and the second through holes 212 are alternately disposed on the first mounting plate 21. The first mounting plate 21 is fixedly connected with the hollow column 10 through the stopper 12, so that the first mounting plate 21 and the hollow column 10 are always integrated, and when the power component 70 drives the third mounting part 51 and the fourth mounting part 61 to move downwards, the first mounting plate 21 and the hollow column 10 are always integrated. The stopper 12 not only serves to fix the first mounting plate 21, but also serves to limit the vertical downward movement of the third mounting member 51. When the third mounting member 51 moves vertically downward to the upper surface of the stopper 12, the third mounting member 51 cannot move downward by being abutted by the stopper 12.
Further, the bottom of the first mounting plate 21 of the chip positioning suction head 100 provided by the present invention is provided with four sliding grooves 214 communicated with the first through holes 211, the translation blocks 22 are arranged in the sliding grooves 214, and the translation blocks 22 are arranged in one-to-one correspondence with the sliding grooves 214. The slide groove 214 is provided on the bottom surface of the first mounting plate 21. After the translation block 22, the truing jaws 52 and the cam block 62 are assembled, the truing assembly is secured within the first mounting plate 21 by four first cover plates 216, as shown in fig. 3. The four first cover plates 216 enclose the bottom surface of the first mounting plate 21, and form an opening in the middle thereof, through which the suction nozzle 30 is extended. And, the four first cover plates 216 are also provided with notches through which the shaping claws 52 and the cam blocks 62 can extend. The translation block 22 slides horizontally in the direction in which the slide groove 214 is provided. The four sliding grooves 214 are arranged opposite to each other two by two. As shown in fig. 9, each sliding groove 214 is provided with an inner side 2142 on a side close to the suction nozzle 30 and an outer side 2141 on a side far from the suction nozzle 30. Translation block 22 may move horizontally between lateral side 2141 and medial side 2142. In the initial state, the translation block 22 has a gap with both the inner side surface 2142 and the outer side surface 2141. As shown in fig. 11, in the collapsed reforming state of the reforming claw 52, the reforming claw 52 is mounted on the translation block 22, and the side surface of the reforming claw 52 is attached to the inner side surface 2142, thereby limiting the horizontal movement of the reforming assembly. The minimum value of the width L2 of the two reforming claws 52 when they are relatively closed can be adjusted by the positional setting of the slide groove 214. Therefore, the sliding groove 214 functions to limit the horizontal movement distance of the translation block 22.
Specifically, the present invention provides a structure of the translation block 22 disposed in the first mounting plate 21 as shown in fig. 5. The translation block 22 comprises a U-shaped base 221, a pair of bearings 222 arranged at one end of the U-shaped base 221, a rotating shaft 223 arranged on the pair of bearings 222, and a pair of fixed shafts 224 arranged at the other end of the U-shaped base 221, wherein an opening 225 for the cam block 62 and the shaping claw 52 to pass through is formed on the U-shaped base 221, the cam block 62 passes through the opening 225 and is arranged between the fixed shafts 224 and the rotating shaft 223, and the translation block 22 is fixed in the opening 225 through the pair of fixed shafts 224. The side of the U-shaped base 221 of the translation block 22 having the opening 225 is mounted toward the suction nozzle 30. As shown in fig. 6, one end of the U-shaped base 221 without the opening 225 is used to abut against the cam block 62 of the fourth mounting member 61, and two bearings 222 are provided at the end of the U-shaped base 221 without the opening 225, and the two bearings 222 are connected by one rotating shaft 223 so that the rotating shaft 223 can rotate relative to the U-shaped base 221. When the cam block 62 is continuously moved downward while abutting against the rotation shaft 223, the rotation shaft 223 is always abutted against the curved profile surface 6222 of the cam block 62. As shown in fig. 5, one end of the U-shaped base 221 of the translation block 22 having the opening 225 is used for movably connecting with the shaping claw 52 on the third mounting member 51, and a pair of fixing shafts 224 are disposed at the end of the U-shaped base 221 having the opening 225, when the shaping claw 52 passes through the opening 225 of the U-shaped base 221 from top to bottom, the pair of fixing shafts 224 pass through the shaping claw 52, so that the fixing shafts 224 limit the horizontal movement of the shaping claw 52 and the translation block 22, so that only the up-and-down relative movement between the shaping claw 52 and the translation block 22 can be realized, and further, the shaping claw 52 is driven to move horizontally when the translation block 22 translates.
Specifically, a pair of first springs 215 are disposed between each translation block 22 and the sliding slot 214, the first springs 215 urging the translation blocks 22 against the cam block 62. As shown in fig. 5, the translation block 22 further includes a pair of flat plates 226 extending from the U-shaped base plate 221 to two sides, a guide column 227 for the first spring 215 to pass through is disposed on the flat plates 226, and the guide column 227 is sleeved with the pair of first springs 215. The first spring 215 is disposed between the outer side surface 2141 of the sliding groove 214 and the translation block 22. That is, the first spring 215 is sleeved on the guiding column 227, and one end of the first spring abuts against the flat plate 226 of the translation block 22, and the other end abuts against the outer side surface 2141 of the sliding groove 214. The first spring 215 is always in a compressed state, so that the first spring 215 provides a pushing force for the translation block 22 to move towards the suction nozzle 30. In the initial state, as shown in fig. 9, since the cam block 52 of the fourth mounting part 61 is inserted into the opening 225 of the translation block 22, the first spring 215 pushes the rotation shaft 223 of the translation block 22 to abut against the cam block 62, and at this time, a certain horizontal distance is kept between the inner side surface 2142 and the outer side surface 2242 of the translation block 22 and the sliding groove 214. When the cam block 62 moves downward to the limit position, as shown in fig. 11, the horizontal pushing force continuously provided by the first spring 215 to the translation block 22 causes the translation block 22 to translate toward one side of the suction nozzle 30 with the downward movement of the cam block 62, and finally abut against the inner side surface 2142 of the sliding groove 214.
Further, as shown in fig. 2, the fourth mounting part 61 of the chip positioning suction head 100 provided by the present invention includes a fourth vertical plate 611 disposed vertically and a fourth horizontal plate 612 disposed horizontally, a fourth through hole 6121 for the hollow column 10 and the third mounting part 51 to pass through is formed inside the fourth horizontal plate 612, and the fourth vertical plate 611 is fixed to the right side surface 14 of the hollow column 10 through the third guide rail 63. The fourth annular plate 612 of the fourth mounting element 61 is disposed outside of the hollow column 10 and the third mounting element 51. The fourth mounting part 61 is used for fixing the cam block 62 and driving the cam block 62 to move vertically downward by the power part 70. The fourth mount 61 is vertically lifted and lowered along the installation direction of the third guide rail 63.
As shown in fig. 1 and 2, a pair of return springs 64 are also disposed between the fourth mounting member 61 and the first mounting plate 21. The vertical descending of the fourth mount 61 relative to the hollow column 10 is driven by the power unit 70 to move downward, and the vertical ascending return of the fourth mount 61 relative to the hollow column 10 is provided by a pair of return springs 64. The return spring 64 is disposed on the upper surface of the first mounting plate 21 and the lower surface of the fourth annular plate 612. When the driving rod 711 of the driving cylinder 71 of the power component 70 drives the second driving block 72 to return upwards, the pair of return springs 64 provide an upward pushing force for the fourth mounting part 61, so that the fourth mounting part 61 is urged to return. As shown in fig. 4, the hollow column 10 is further provided with a first limiting column 16 for limiting the upward movement position of the fourth mounting element 61, and when the first annular plate 612 of the fourth mounting element 61 moves upward and abuts against the first limiting column 16, the fourth mounting element 61 stops moving upward. When the fourth mounting element 61 is reset upwards along with the pair of reset springs 64, the second driving block 73 fixed on the fourth mounting element 61 will drive the third mounting element 51 to move upwards and complete the reset along with the fourth mounting element 61. During the resetting of the third mount 51 and the fourth mount 61, the claw 52 is first spread out to the outside of the suction nozzle 30 and then restored upward to the inside of the first mount plate 21 to return to the initial state.
Specifically, as shown in fig. 2, four fourth mounting holes 6122 for fixing the cam block 62 are formed around the hollow column 10 on the inner side of the fourth annular plate 612, and the top of the cam block 62 is fixed to the fourth mounting holes 6122, so as to achieve a fixed connection with the fourth mounting member 61.
Specifically, as shown in fig. 7, a schematic perspective view of the cam block 62 provided in the present invention is shown. The cam block 62 includes an upper mounting section 621 fixed with the fourth mounting member 61 and a lower mounting section 622 extending into the first mounting plate 21. The upper mounting section 621 is provided with a fourth connecting hole 6211 abutting against the fourth mounting hole 6122 of the fourth mounting member 61, the upper mounting section 621 is further provided with a positioning bar 6212, and correspondingly, a positioning groove 6125 matched with the positioning bar 6212 is arranged between the fourth mounting holes 6122 of the fourth annular plate 612. When the cam block 62 is fixed to the fourth mounting member 61, the positioning bar 6212 of the mounting section 621 of the cam block 62 is first inserted into the positioning slot 6125 of the fourth annular plate 612, and then the cam block 62 is fixed to the fourth annular plate 612 by the locking member. And the lower mounting section 622 of the cam block 62 extends into the first mounting plate 61 and engages the translation block 22. The lower mounting section 622 comprises a vertical rod 6221 inserted into the opening 225 of the translation block 22, the vertical rod 6221 being provided with a curvilinear profile 6222 on the side facing the rotation axis 223 of the translation block 22.
As shown in fig. 7, the cam block 22 of the present invention is provided with a curved profile surface 6222, and the curved profile surface 6222 includes a first vertical surface 6222a vertically arranged and connected to the bottom surface of the vertical rod 6221, and a first circular arc surface 6222b upwardly extended from the first vertical surface 6222a toward the side of the suction nozzle 30. The two-stage design of the first vertical surface 6222a and the first circular arc surface 6222b of the curved profile surface 6222 enables the four mounting element 41 to form the two different stages in the descending process. The first stage is a stage in which the first vertical surface 6222a is in contact with the translation block 22, and in the first stage, the first vertical surface 6222a is not inclined in the horizontal direction all the time during the descending process of the cam block 62, so that the translation block 22 does not move horizontally with the descending of the cam block 62. The second stage is a stage in which the first circular arc surface 6222b is in contact with the translation block 22, and in the second stage, the first circular arc surface 6222b is inclined toward the side having the suction nozzle 30 as the cam block 62 descends, and thus is translated toward the side of the suction nozzle 30 along the translation block 22 by the urging force of the first spring 215 and the guide of the first circular arc surface 6222 b.
Further, as shown in fig. 2, the third mounting member 51 of the chip positioning suction head 100 provided by the present invention comprises a third vertical plate 511 disposed vertically and a third annular plate 512 disposed horizontally, wherein a third through hole 5121 for the hollow column 10 to pass through is formed inside the third annular plate 512, and the third vertical plate 511 is fixed to the left side surface 13 of the hollow column 10 through the second guide rail 53. The third mount 51 is disposed between the hollow column 10 and the fourth mount 61. The third annular plate 512 of the third mounting member 51 is sleeved outside the hollow column 10 and inside the fourth annular plate 612 of the fourth mounting member 61, and the third annular plate 512 is used for movably connecting the shaping claw 52 and driving the shaping claw 52 to move vertically and downwardly under the driving of the power member 70. The third mount 51 is vertically lifted and lowered along the installation direction of the second rail 53.
As shown in fig. 2, four third mounting grooves 5122 for movably coupling the reforming claws 52 are formed around the hollow column 10 on the outer side of the third ring plate 512, the tops of the reforming claws 52 are fitted into the third mounting grooves 5122 by means of the mounting shafts 54, and the reforming claws 52 can be horizontally moved in the direction approaching or separating from the suction nozzle 30 along the direction in which the third mounting grooves 5122 are provided. The mounting shafts 54 are inserted into the tops of the shaping claws 52 and are disposed inside the third mounting grooves 5122, and the third mounting grooves 5122 extend from the outer side surface of the third annular plate 512 toward the center of the third annular plate 512, so as to provide a sliding space for the shaping claws 52 to move the mounting shafts 54 toward the suction nozzles 30.
Specifically, as shown in fig. 8, a schematic perspective view of a shaping claw 52 according to the present invention is provided. The claw shaper 52 provided by the present invention comprises a connecting section 521 fixedly connected with the third mounting member 51 and a shaping section 522 contactable with a side edge of the chip. The top of the connecting section 521 of the connecting end 521 is provided with a first mounting hole 5211 through which the mounting shaft 54 can pass, and the first mounting hole 5211 is a circular through hole through which the mounting shaft 54 can be inserted. The mounting shaft 54 is inserted into the first mounting hole 5211 and into the third mounting groove 5122 of the third mounting member 51, and the mounting shaft 54 is horizontally moved in the third mounting groove 5122 in accordance with the horizontal movement of the claw shaper 52. The connecting end 521 of the claw 52 is not only movably connected to the third mounting element 51, but also to the translation block 22. Therefore, the connecting end 521 is further provided with a second mounting hole 5212 for the pair of fixing shafts 224 to pass through, when the shaping claw 52 passes through the opening 225 of the translation block 22, the pair of fixing shafts 224 of the translation block 22 passes through the second mounting hole 5212, so that the movable connection between the shaping claw 52 and the translation block 22 is realized. The second mounting hole 5212 is an elongated waist hole such that a pair of fixed shafts 224 define the relative movement between the reforming claw 52 and the translation block 22 in the horizontal direction while allowing the reforming claw 52 to be relatively moved in the vertical direction with respect to the translation block 22. And the shaping segment 522 of the shaping claw 52 is a part that can protrude from the bottom of the first mounting plate 21 for shaping by contacting with the side of the chip 90. The shaping section 522 of the shaping claw 52 provided by the present invention is at least one correction block 5221 extending from the bottom of the connection section 521 toward the side of the suction nozzle 30. The shaping claw 52 shown in fig. 8 is provided with two correction blocks 5221. The number of the correction blocks 5221 provided on the shaping claw 52 is determined by the structure of the chip 90. If the side of the chip 90 is longer, the number of the calibration blocks 5221 disposed on the shaping section 522 is correspondingly increased. In the present embodiment, the chip 90 has a rectangular structure with long sides and short sides. As shown in fig. 8, the shaping claws 52 provided on both sides of the long side of the chip 90 are provided with two correction blocks 5221 on the shaping claws 52. As shown in fig. 2, only one correction block 5221 is provided on the shaping claws 52 provided on both sides of the short side of the chip 90. When the four shaping claws 52 of the third mounting part 51 are used for shaping, the four shaping claws 52 are arranged in pairs and are folded towards the suction nozzle 30 at the same time, so that the shaping of the chip 90 on the suction nozzle 30 is realized.
The invention provides a chip positioning suction head 100, which comprises a suction nozzle 30, a second mounting plate 41 and a shaping claw 52 which are arranged on a hollow column 10, wherein the whole chip positioning suction head 100 can be fixed on a mechanical arm of processing and detecting equipment through the second mounting plate 41 to realize the adsorption and shaping of a chip, the chip positioning suction head 100 can realize the negative pressure adsorption of the chip through the suction nozzle 30 at the bottom of the hollow column 10, meanwhile, the shaping claw 52 arranged on a third mounting part 51 of the hollow column 10 is used for shaping and positioning the chip on the suction nozzle 30, and a limiting structure is arranged on a first mounting plate 21 at the bottom of the hollow column 10 to control the shaping claw 52 to keep a certain gap between the shaping claw 52 and the chip under a folding state, wherein the gap is smaller than or equal to the gap between a needle mold and the chip.
The present invention is not limited to the above preferred embodiments, and any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention should be included in the protection scope of the present invention.

Claims (10)

1. A chip positioning suction head, comprising:
the device comprises a hollow column, a first mounting plate fixed at the bottom of the hollow column, a suction nozzle arranged at the bottom of the hollow column and extending out of the bottom surface of the first mounting plate, a second mounting plate, a third mounting piece and a fourth mounting piece which are movably connected with the hollow column, and a power part fixed on the second mounting plate and used for driving the third mounting piece and the fourth mounting piece to vertically descend;
the third mounting piece is movably connected with four shaping claws arranged around the hollow column, the fourth mounting piece is fixedly provided with four cam blocks arranged around the hollow column, four translation blocks are arranged inside the first mounting plate, one end of each translation block is abutted against the cam block, and the other end of each translation block is movably connected with the shaping claws;
when the power component drives the third mounting part and the fourth mounting part to descend, the shaping claw on the third mounting part extends out of the bottom of the first mounting plate, and the cam block of the fourth mounting part moves downwards, so that the translation block pushes the shaping claw to move horizontally towards the suction nozzle.
2. The chip positioning suction head of claim 1, wherein the bottom of the hollow column is provided with four stoppers for limiting the vertical descending distance of the third mounting member, and the stoppers of the hollow column are fixedly connected with the first mounting plate.
3. The chip positioning suction head of claim 1, wherein the bottom of the first mounting plate is provided with four sliding grooves, the translation block is arranged in the sliding grooves, and the translation block comprises a U-shaped base plate, a pair of bearings arranged at one end of the U-shaped base plate, a rotating shaft arranged on the bearings, and a pair of fixing shafts arranged at the other end of the U-shaped base plate.
4. A chip positioning nozzle as claimed in claim 3 wherein a pair of first springs are provided between each said translating block and said slide slot, said first springs urging said translating block against said cam block.
5. The chip positioning suction head of claim 1, wherein the fourth mounting member comprises a fourth vertical plate and a fourth horizontal plate, the fourth vertical plate is vertically arranged, a fourth through hole is formed in the fourth horizontal plate, the hollow column and the third mounting member can penetrate through the fourth through hole, and the fourth vertical plate is fixed on the right side surface of the hollow column through a third guide rail.
6. The chip positioning suction head of claim 5, wherein the inner side of the fourth annular plate is provided with four fourth mounting holes around the hollow column, the four fourth mounting holes being used for fixing the cam block, and the cam block is fixed on the fourth mounting holes.
7. The chip positioning suction head of claim 5, wherein the cam block is provided with a curved profile surface, and the curved profile surface comprises a first vertical surface which is vertically arranged and a first arc surface which is upward from the first vertical surface and extends to one side of the suction nozzle.
8. The chip positioning suction head of claim 1, wherein the third mounting member comprises a third vertical plate and a third annular plate, the third vertical plate is vertically arranged, the third annular plate is horizontally arranged, a third through hole is formed in the third annular plate, the third through hole can be used for the hollow column to penetrate through, and the third vertical plate is fixed on the left side surface of the hollow column through a second guide rail.
9. The chip positioning suction head of claim 8, wherein the outer side of the third annular plate is provided with four third mounting grooves around the hollow column for the flexible connection of the shaping claw, and the top of the shaping claw is embedded in the third mounting grooves through a mounting shaft.
10. The chip positioning tip of claim 8, wherein said swaging claw includes an attachment section fixedly attached to said third mounting member and a swaging section contactable with a side edge of said chip.
CN202110791109.1A 2021-07-13 2021-07-13 Chip positioning suction head Pending CN113471131A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110791109.1A CN113471131A (en) 2021-07-13 2021-07-13 Chip positioning suction head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110791109.1A CN113471131A (en) 2021-07-13 2021-07-13 Chip positioning suction head

Publications (1)

Publication Number Publication Date
CN113471131A true CN113471131A (en) 2021-10-01

Family

ID=77880048

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110791109.1A Pending CN113471131A (en) 2021-07-13 2021-07-13 Chip positioning suction head

Country Status (1)

Country Link
CN (1) CN113471131A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361089A (en) * 2021-12-31 2022-04-15 颀中科技(苏州)有限公司 A get mark mechanism for chip heat dissipation pastes
CN115038259A (en) * 2022-08-10 2022-09-09 江苏津芯集成电路技术有限公司 Intelligent installation system for single chip microcomputer chip

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114361089A (en) * 2021-12-31 2022-04-15 颀中科技(苏州)有限公司 A get mark mechanism for chip heat dissipation pastes
CN114361089B (en) * 2021-12-31 2023-06-06 颀中科技(苏州)有限公司 A get mark mechanism for chip heat dissipation subsides
CN115038259A (en) * 2022-08-10 2022-09-09 江苏津芯集成电路技术有限公司 Intelligent installation system for single chip microcomputer chip
CN115038259B (en) * 2022-08-10 2022-10-28 江苏津芯集成电路技术有限公司 Intelligent installation system for single chip microcomputer chip

Similar Documents

Publication Publication Date Title
CN113471131A (en) Chip positioning suction head
CN113539872B (en) Semiconductor element translation type testing, coding and taping integrated machine
CN111422041B (en) Automobile glass accessory bonding equipment
CN214097122U (en) Workbench glass cover plate device and optical detection equipment
CN112333997A (en) Chip mounting device
CN115452058B (en) Automatic detecting mechanism for micro element
CN109454433A (en) A kind of press-loading apparatus and production line
CN215680642U (en) Chip positioning suction head
CN218601677U (en) Full-automatic LED exposure machine of big mesa
CN115625506B (en) Micro part assembling device and method integrating dispensing and locking
CN114918592B (en) Seam welder
CN213497274U (en) Top cap laser welding tool positioning device
CN111935970B (en) Mounting mechanism for tiny components on complex product
CN112518134A (en) Jig and laser marking equipment
CN220946873U (en) Accurate automatic leather frame pressurize mechanism
CN220975775U (en) Replacement apparatus
CN216781753U (en) A telecontrol equipment for pressfitting multimode test fixture
CN215707727U (en) Chip dyestripping and sweep a yard device
CN114530755B (en) Distance-adjusting transfer device for tube seat for semiconductor laser and use method
CN217543722U (en) Centering mechanism for detecting automobile central control box
CN214235718U (en) Bending machine capable of bending for multiple times
CN213591145U (en) Detection device
CN114852624B (en) Automatic wire feeding device and production line thereof
CN220190099U (en) Conversion plug buckle equipment and test equipment
CN110871226A (en) Pre-binding device

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination