CN113466655B - Test equipment and method for testing single board - Google Patents

Test equipment and method for testing single board Download PDF

Info

Publication number
CN113466655B
CN113466655B CN202010241838.5A CN202010241838A CN113466655B CN 113466655 B CN113466655 B CN 113466655B CN 202010241838 A CN202010241838 A CN 202010241838A CN 113466655 B CN113466655 B CN 113466655B
Authority
CN
China
Prior art keywords
test
testing
point
functional
processor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202010241838.5A
Other languages
Chinese (zh)
Other versions
CN113466655A (en
Inventor
董经纬
王杨
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Huawei Technologies Co Ltd
Original Assignee
Huawei Technologies Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Huawei Technologies Co Ltd filed Critical Huawei Technologies Co Ltd
Priority to CN202010241838.5A priority Critical patent/CN113466655B/en
Publication of CN113466655A publication Critical patent/CN113466655A/en
Application granted granted Critical
Publication of CN113466655B publication Critical patent/CN113466655B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2803—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP] by means of functional tests, e.g. logic-circuit-simulation or algorithms therefor
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806—Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28—Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801—Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/281—Specific types of tests or tests for a specific type of fault, e.g. thermal mapping, shorts testing

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Tests Of Electronic Circuits (AREA)

Abstract

The embodiment of the application discloses a test device and a test method for testing a single board, and belongs to the technical field of tests. The test equipment comprises a processor, a functional test component and a hardware test component, wherein: the function test component tests the function test item of the single board to be tested and sends the test result of the function test item to the processor; the hardware testing component tests the voltage at the testing point of the single board to be tested and sends the voltage at the testing point to the processor; the processor determines a fault circuit area according to the test result of the functional test item and the corresponding relation between the functional test item and the circuit area which is stored in advance; determining a fault test point according to the corresponding relation between the voltage at the test point and the pre-stored test point and the standard voltage; and determining the device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number. By adopting the method and the device, the first pass rate of module production can be improved, the module production period is shortened, and the module maintenance cost is saved.

Description

Test equipment and method for testing single board
Technical Field
The present application relates to the field of testing technologies, and in particular, to a testing apparatus and a testing method for testing a board.
Background
In the mass production of veneers, all the veneers produced may not be acceptable due to various possible factors of equipment and operators. Therefore, the processed veneer needs to be tested and then assembled.
In-circuit test (ICT) is a relatively common test means, and can test the quality of components mounted on a single board, for example, whether components such as capacitors, resistors, inductors, diodes, and triodes mounted on the single board are in a good state or not.
However, after the single board is qualified through the on-line test and assembled into the module, the situation that the single board cannot realize some functions still occurs, and at this time, the module needs to be disassembled for maintenance, resulting in low first pass rate of the module of the production equipment.
Disclosure of Invention
The embodiment of the application provides a testing device and a method for testing a single board, which can overcome the problems of the related technology, and the technical scheme is as follows:
in one aspect, a testing apparatus for testing a board is provided, where the testing apparatus includes a processor, a functional testing component, and a hardware testing component, where:
the processor is electrically connected with the function testing component and the hardware testing component respectively, and the single board to be tested is installed in the testing equipment;
the function testing component is used for testing the function testing items of the single board to be tested and sending the testing results of the function testing items to the processor;
the hardware testing component is used for testing the voltage at the testing point of the single board to be tested and sending the voltage at the testing point to the processor;
the processor is used for determining a fault circuit area according to the test result of the functional test item and the corresponding relation between the pre-stored functional test item and the circuit area; determining a fault test point according to the corresponding relation between the voltage at the test point and the pre-stored test point and the standard voltage; and determining the device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number.
The hardware testing component is used for measuring the voltage condition at the testing point, and correspondingly, the hardware testing component can comprise a hardware testing component which comprises a direct current testing unit and a direct current instrument unit.
Wherein, the test result of the functional test item may include a failure of the functional test item and a passing of the functional test item.
In some embodiments, after receiving the test result of the functional test item sent by the functional test component, the processor may determine a faulty circuit area and a normal circuit area according to the test result of each functional test item and the circuit area corresponding to the functional test item, for example, the circuit area corresponding to the failure of the functional test item is a faulty circuit area, and the circuit area corresponding to the passing of the functional test item is a normal circuit area.
In some examples, the processor may determine which test points have abnormal voltages and which test points have normal voltages according to the voltages at the test points sent by the hardware test component and a relationship between the pre-stored test points and the standard voltages, and may further determine which test points are fault test points and which test points are normal test points. For example, if the voltage at a certain test point is not consistent with the standard voltage corresponding to the test point, the test point is a fault test point, and if the voltage at the test point is consistent with the corresponding standard voltage, the test point is a normal test point.
In one possible implementation, the test points include all test points within the failure circuit region.
In some examples, if the test device performs a functional test before performing a hardware test, and the functional test determines that a faulty circuit area exists, the test points are all of the test points in the faulty circuit area.
In a possible implementation manner, the test points include all test points in the failure circuit area and all test points of the board to be tested that are not traversed by the functional test component.
In some examples, if the test device performs functional testing prior to hardware testing, and a faulty circuit area is determined during functional testing, the test points may include all test points within the faulty circuit area and all test points not traversed by the functional test component.
In a possible implementation manner, the test points include all test points of the board to be tested.
In some examples, if the test device performs a hardware test after performing a functional test, and there is no faulty circuit area in the functional test, the test points include all test points on the board to be tested. Or, if the test equipment performs the hardware test first and then performs the function test, the test points also include all the test points on the board to be tested.
In a possible implementation manner, the functional test component is configured to test a functional test item of the board to be tested when there is no fault test point after voltage tests are performed on all test points of the board to be tested, and send a test result of the functional test item to the processor.
In one example, if the test device performs the hardware test first and then performs the function test, and after the hardware test is completed, it is determined that no fault test point exists, then the test device performs the function test again to ensure that there is no failure condition of the function test item.
In a possible implementation manner, the board is a radio frequency board, the functional test component includes a radio frequency test unit and a radio frequency instrument unit, and the hardware test component includes a direct current test unit and a direct current instrument unit;
the processor is electrically connected with the radio frequency test unit, the radio frequency instrument unit, the direct current test unit and the direct current instrument unit respectively;
the radio frequency test unit is electrically connected with the radio frequency single board and the radio frequency instrument unit respectively, and the direct current test unit is electrically connected with the radio frequency single board and the direct current instrument unit respectively.
In an example, the board to be tested may be a radio frequency board, and the corresponding function testing component may include a radio frequency testing unit and a radio frequency instrument unit, so that the testing device may test functions of transmitting and receiving signals by the radio frequency board.
On the other hand, a method for testing a single board is also provided, and the method is applied to the test equipment, and the method includes:
the function test component tests the function test items of the single board to be tested and sends the test results of the function test items to the processor;
the processor determines a fault circuit area according to the test result of the functional test item and the corresponding relation between the functional test item and the circuit area which is stored in advance;
the hardware testing component tests the voltage at all testing points in the fault circuit area and sends the voltage at the testing points to the processor;
and the processor determines a fault test point according to the voltage at the test point and the corresponding relationship between the pre-stored test point and the standard voltage, and determines a device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number.
In one example, the functional test component performs one-by-one or multiple parallel tests on the functional test items of the board to be tested according to functional test software installed in the test device, and sends the test results of the functional test items to the processor. The test result may include a failure of the functional test item and a passing of the functional test item, and correspondingly, the processor may determine the faulty circuit area according to the test result of each functional test item and the corresponding relationship between the functional test item and the circuit area. For example, if the test result of the functional test item 2 is that the functional test item fails, the circuit area 2 corresponding to the functional test item 2 is a faulty circuit area. After the processor determines the faulty circuit area, the hardware testing component may be controlled to perform voltage testing on all test points within the faulty circuit area, and to send voltages at the respective test points to the processor.
After the processor receives the voltage at each test point, the received voltage can be compared with the standard voltage of the test point, and if the received voltage is consistent or close to consistent, the test point is a normal test point. And if the test points are not consistent, the test point is a fault test point.
After the processor determines the fault test point, the processor can determine the device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number, and further can locate the device with the fault. For example, table 3 shows a correspondence table between test points and device position numbers.
Therefore, the test equipment can not only lock the fault circuit area, but also locate which device has a fault, and further can pertinently maintain the device with the fault, so that the device with the fault can be quickly located in the single board test, the troubleshooting time can be shortened, and the maintenance efficiency can be improved.
In one possible implementation, the method further includes:
after the functional test component completes the test of all the functional test items of the single-sided single board, determining all the test points which are not traversed by the functional test component;
the hardware testing component tests voltages at all test points in the fault circuit area and sends the voltages at the test points to the processor, and the hardware testing component comprises:
the hardware testing component tests voltages at all test points within the fault circuit region, and tests voltages at all test points not traversed by the functional testing component, and sends the voltages at the test points to the processor.
For convenience of introduction, the test points traversed by the functional test item may be referred to as a first part of test points, the test points not traversed by the functional test item may be referred to as a second part of test points, and the first part of test points and the second part of test points form a test point set formed by all test points on the board to be tested.
In some applications, the voltage test may be performed on the first part of the test points first in the hardware test, and then the voltage test may be performed on the second part of the test points, or the voltage test may be performed on the first part of the test points and the second part of the test points in the hardware test.
In a possible implementation manner, before the functional test component tests a functional test item of a board to be tested and sends a test result of the functional test item to the processor, the method further includes:
acquiring a test point set of all test points in the single board to be tested;
the hardware testing component tests the voltages at all the testing points in the testing point set and sends the voltages at the testing points to the processor;
and the processor determines that no fault test point exists according to the voltage at the test point and the corresponding relation between the pre-stored test point and the standard voltage.
In an example, before the hardware testing component performs the hardware test on all the test points of the board to be tested, the processor needs to acquire all the test points on the board to be tested, and the test points form a test point set. After the processor acquires all the test points on the board to be tested, the processor can control the hardware test component to measure the voltage of each test point in the test point set, and send the voltage of each test point to the processor.
After obtaining the voltage at each test point, the processor may compare the voltage with the standard voltage corresponding to each test point shown in table 2, if the voltage at the test point does not coincide with the corresponding standard voltage, at least one fault test point exists in the test point set, then a device position number corresponding to the at least one fault test point is determined according to the test point and the device position number, and then the test is finished.
And if the voltage of each test point is consistent with the respective standard voltage, the fault test point does not exist in the test point set, the functional test is continuously executed, and the test result of each functional test item is sent to the processor.
And after the processor receives the test results of the functional test items, if all the test results are that the functional test items pass, the test is finished. If the test result includes at least one functional test item failure, the processor may determine a faulty circuit area corresponding to the functional test item failure according to a correspondence between the functional test item and the circuit area.
Next, the processor may control the hardware testing component to perform voltage testing on each test point in all the failure circuit areas, determine the voltage at each test point in all the failure circuit areas, and send the voltage at each test point in all the failure circuit areas to the processor.
After the processor receives the voltages at the test points in all the fault circuit areas, test points corresponding to the voltages inconsistent with the standard voltages can be screened from the received voltages according to the relationship between the test points and the standard voltages shown in table 2, and the test points are fault test points. Then, the processor may determine the device position number corresponding to each failed test point according to the correspondence between the test point and the device position number shown in table 3, and lock the device to the failed device.
In the embodiment of the application, the test equipment comprises a hardware test component and a functional test component, so that the test equipment can test the electrical property and the electrical connection relation of components on a single board, can test each functional test item of the single board, can find out existing faults and problems in time before the single board is assembled into a module, can reduce or even avoid the disassembly and assembly maintenance after the single board is assembled into the module, can improve the first pass rate of module production, shorten the production period of the module and save the maintenance cost of the module.
Drawings
Fig. 1 is a schematic structural diagram of a testing apparatus provided in an embodiment of the present application;
fig. 2 is a schematic flowchart of a process of testing a board to be tested by a testing device according to an embodiment of the present application;
fig. 3 is a schematic flowchart of a test device for testing a board to be tested according to an embodiment of the present application;
fig. 4 is a schematic flowchart of a process of testing a board to be tested by a testing device according to an embodiment of the present application;
fig. 5 is a schematic flowchart of a process of testing a board to be tested by a testing device according to an embodiment of the present application;
fig. 6 is a schematic flowchart of a process of testing a board to be tested by using a testing device according to an embodiment of the present application.
Detailed Description
The embodiment of the present application relates to a test device for testing a single board, where the single board may be a main control board, an interface board, or a service board in a communication device, for example, a radio frequency single board in a radio frequency module of the communication device.
In some applications, in a manufacturing process of a communication device, various components, such as a capacitor, a resistor, a diode, a transistor, and the like, are mounted on a Printed Circuit Board (PCB) by a mounting technique, and after the various components are mounted, a Printed Circuit Board (PCBA) can be obtained. Then, the assembled printed circuit board (may be referred to as a single board for short) may be tested by using the testing apparatus described in this embodiment, where the testing may include a functional test and a hardware test. After the test is qualified, the assembled printed circuit board and other components or single boards can be assembled together to form a module of the communication equipment, and finally, a plurality of modules are assembled into the communication equipment.
The hardware test is to test the electrical property and the electrical connection relation of the components on the board to detect whether the components on the board are in a good state. The function test is to test the function test items that the single board can execute, so as to detect whether the single board can normally execute the corresponding function.
In the stage of testing the single board, the more comprehensive the single board is tested, the higher the first pass rate of the module assembled by the single board, and the higher the first pass rate, the maintenance cost of the module can be reduced, the production cycle of the module can be shortened, the maintenance cost can be saved, and the like. The straight-through rate is the probability of passing through the assembly once and is an index for measuring the quality level of the production line.
The test equipment in the embodiment can be used for testing hardware of the single board and also can be used for testing functions of the single board, the test is comprehensive, and the first pass rate of module production can be improved.
The test equipment can comprise a processor, a function test part and a hardware test part, wherein the processor is electrically connected with the function test part and the hardware test part respectively, and the single board to be tested is installed in the test equipment.
The functional test component may be referred to as a functional test process during the test, and the hardware test component may be referred to as a hardware test process during the test.
In some applications, when the test equipment is used to test a single board, the single board to be tested may be installed in the test equipment, for example, a single board slot may be provided in the test equipment, and the single board to be tested may be inserted into the single board slot. Various test software may be installed in the test device, for example, functional test software for implementing functional test may be installed, and hardware test software for implementing hardware test may also be installed.
The functional test component may be configured to test a functional test item of the board to be tested, and send a test result of the functional test item to the processor, where the test result of the functional test item may include a functional test item failure and a functional test item passing.
The hardware testing component may be configured to test a voltage at a testing point of the board to be tested, and send the voltage at the testing point to the processor. Wherein the voltage may be a specific value or a range of values.
The test point may be a position having a physical meaning, such as an input point position, an output point position, a conversion point position, and the like, on the board to be tested, and a technician may select the test point on the board to be tested according to an actual need, which is not limited in this embodiment.
The test result of the functional test and the test result of the hardware test can be sent to the processor, and the processor can be used for determining a fault circuit area according to the test result of the functional test item and the corresponding relation between the functional test item and the circuit area which are stored in advance; the fault testing point is determined according to the voltage at the testing point and the corresponding relation between the pre-stored testing point and the standard voltage; the method can also be used for determining the device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number.
The device position number is a layout number of each device in the single board, and the device position number has uniqueness in the single board.
In the corresponding relationship between the functional test item and the circuit region, one functional test item may be implemented by one circuit region, or may be implemented by two or more circuit regions.
As described above, the test result of the functional test item may include a functional test item failure and a functional test item passing, and the functional test item failure may indicate that the circuit region corresponding to the functional test item is a faulty circuit region, where a faulty test point exists. The functional test item can indicate that the circuit area corresponding to the functional test item is a normal circuit area through the functional test item, and the voltage of the test point in the normal circuit area is consistent with or close to the standard voltage.
It can be seen that, after the processor receives the test results of the functional test items sent by the functional test component, the processor can determine a faulty circuit area and a normal circuit area according to the test result of each functional test item and the circuit area corresponding to the functional test item, for example, the circuit area corresponding to the functional test item failure is a faulty circuit area, and the circuit area corresponding to the functional test item passing is a normal circuit area.
The processor can determine which test points have abnormal voltages and which test points have normal voltages according to the voltages of the test points sent by the hardware test component and the relationship between the pre-stored test points and the standard voltages, and further can determine which test points are fault test points and which test points are normal test points. For example, if the voltage at a certain test point is not consistent with the standard voltage corresponding to the test point, the test point is a fault test point, and if the voltage at the test point is consistent with the corresponding standard voltage, the test point is a normal test point.
After the processor determines the fault test point, the processor can further locate the fault device position number corresponding to the fault test point according to the corresponding relation between the test point and the device position number.
In some applications, the test equipment may perform a function test on the board first, and then perform a hardware test on the board according to a test result of the function test. For example, the functional test component may first test each functional test item of the board to be tested, and the processor determines a faulty circuit area corresponding to the failure of the functional test item according to the test result of each functional test item and the corresponding relationship between the functional test item and the circuit area; then, the hardware testing component can test all the testing points in the fault circuit area to obtain the voltages of the testing points; the processor can determine the fault test point according to the voltages of all test points in the fault circuit region and the corresponding relation between the test point and the standard voltage; and then, the processor can determine the device position number corresponding to the fault test point according to the corresponding relation between the test point and the device position number.
In some applications, the test equipment may also perform a hardware test on the board first, and then perform a function test on the board according to a test result of the hardware test. For example, the hardware testing component tests the voltages at all the test points of the single board, and if the voltages at all the test points are determined to meet the requirements according to the voltages of all the test points and the corresponding relationship between the test points and the standard voltage, and no fault test point exists, the functional test can be performed again. In the functional test, if a fault circuit area is tested, the hardware test is carried out on the test point in the fault circuit area, so that the device position number corresponding to the fault test point is detected.
The processor of the test equipment can pre-store the sequence of the function test and the hardware test, or the test equipment has the function of selecting the sequence, and a tester can select whether to perform the function test or the hardware test first.
Wherein, in the hardware test, the test point has at least the following several conditions:
in the first case, when the test device performs the functional test first and then performs the hardware test, and the functional test item fails in the functional test, in the hardware test, the test points may include all the test points in the failure circuit region.
In the second case, because some test points in the board may not be tested by the functional test item to determine whether the test points are faulty test points, correspondingly, the test equipment performs the hardware test after performing the functional test, and when the functional test item fails in the functional test, in the hardware test, the test points not only include the test points in the faulty circuit area, but also include all the test points of the board to be tested that are not traversed by the functional test component. For example, if a single board has a Light Emitting Diode (LED) lamp, a circuit area where the LED lamp is located cannot be screened by a functional test for whether a fault exists, and a hardware test is required to screen whether the fault exists.
In the third case, when the test device performs the function test first and then performs the hardware test, and there is no failure of the function test item in the function test, in the hardware test, the test points include all the test points in the board to be tested, that is, the test points include all the test points in all the circuit regions of the board.
And in the fourth case, the test equipment is subjected to a hardware test and then a function test, wherein in the hardware test, the test points comprise all the test points in the single board.
In some applications, the board may be a radio frequency board, and accordingly, as shown in fig. 1, where an arrow in fig. 1 indicates a signal transmission direction, the functional test component may include a radio frequency test unit and a radio frequency instrument unit, and the hardware test component may include a direct current test unit and a direct current instrument unit. The processor is electrically connected with the radio frequency test unit, the radio frequency instrument unit, the direct current test unit and the direct current instrument unit respectively; the radio frequency test unit is respectively electrically connected with the radio frequency single board and the radio frequency instrument unit, and the direct current test unit is respectively electrically connected with the radio frequency single board and the direct current instrument unit.
The radio frequency testing unit is used for realizing the connection between the single board to be tested and the processor, and may include a radio frequency signal connection unit, a radio frequency switch matrix unit, a radio frequency single board shielding unit, and the like, and may be used for realizing the switching of signal channels, the shielding of signals, the shielding of external signals, and the like.
The radio frequency instrument unit may include a radio frequency spectrometer and a radio frequency signal source, where the radio frequency spectrometer is configured to receive a signal sent by a board to be tested, and send the received signal to the processor. The radio frequency signal source is used for exciting the single board to be tested to generate signals. The radio frequency instrument unit can complete the function test of the transmitting channel and the function test of the receiving channel of the single board to be tested.
For example, when testing the transmission channel function of the board to be tested, the radio frequency signal source of the radio frequency instrument unit may excite the board to be tested to generate a signal, and send the generated signal to the radio frequency spectrometer, the radio frequency spectrometer sends the received signal to the processor, and the processor determines the quality of the signal generated by the board to be tested, the stability of the carrier, and the like, so as to complete the test of the transmission channel function. When testing the receiving channel function of the single board to be tested, the radio frequency spectrometer of the radio frequency instrument unit can receive the signal received by the single board to be tested and send the signal to the processor, and the processor judges the quality of the signal received by the single board to be tested, the stability of the carrier wave and the like, so as to complete the testing of the receiving channel function.
The direct current test unit and the direct current instrument unit of the hardware test component are used for testing the voltage of a point to be tested, and the direct current test unit can comprise a direct current probe unit and is used for completing connection between the test point on the radio frequency single board and the direct current instrument unit.
The direct current instrument unit can comprise a voltage tester, a constant current source, a program control power supply and the like and is used for measuring the voltage at a test point.
In some examples, the dc probe units may be fixed or movable, and if the dc probe units are fixed, the number of the dc probe units is multiple, so that each test point corresponds to one dc probe unit. If the dc probe unit is movable, the number of the dc probe units may be one or more, and the dc test unit further includes a dc probe position adjustment unit, so that the dc probe unit can be driven by the dc probe position adjustment unit to move, wherein the moving direction of the dc probe unit may be along the x axis, or along the y axis, and the like.
The movable direct current probe unit can move between test points in a circuit area and also can move across the circuit area, and the movement between the test points on the whole single board to be tested is not limited by the moving mode of the direct current probe unit.
In the embodiment of the application, the test equipment comprises a hardware test component and a functional test component, so that the test equipment can test the electrical property and the electrical connection relation of components on a single board, can test each functional test item of the single board, can find out the existing fault problem in time before the single board is assembled into a module, can reduce or even avoid the disassembly and assembly maintenance after the single board is assembled into the module, further can improve the first pass rate of module production, shorten the module production period and save the module maintenance cost.
The embodiment of the present application further provides a method for testing a single board, where the method may be applied to the above-mentioned testing device, and fig. 2 is a schematic flow diagram of the method.
In step 201, the functional test component tests the functional test item of the board to be tested, and sends the test result of the functional test item to the processor.
In one example, the functional test component performs one-by-one or multiple parallel tests on the functional test items of the board to be tested according to functional test software installed in the test device, and sends the test results of the functional test items to the processor.
For example, the board to be tested may be a radio frequency board, the function testing component may include a radio frequency testing unit and a radio frequency instrument unit, in the function test, the radio frequency board and the radio frequency testing unit are pressed together, the radio frequency testing unit performs a function test on the radio frequency board and sends a test result to the radio frequency instrument unit, and the radio frequency instrument unit sends the test result to the processor.
In step 202, the processor determines a faulty circuit area according to the test result of the functional test item and the corresponding relationship between the functional test item and the circuit area stored in advance.
In one example, the processor may obtain a pre-stored correspondence between the functional test item and the circuit region, for example, as shown in table 1, a correspondence table between the functional test item and the circuit region.
TABLE 1 correspondence of functional test items to circuit regions
Figure BDA0002432826350000081
As described above, the functional test item may be implemented by one circuit region, or may be implemented by two or more circuit regions, for example, in table 1, the functional test item 1 is implemented by the circuit region 1, the functional test item 2 is implemented by the circuit region 2, and the functional test item 3 is implemented by the circuit region 1 and the circuit region 3.
In one example, the test result may include a failure of the functional test item and a passing of the functional test item, and accordingly, the processor may determine the faulty circuit area according to the test result of each functional test item and the corresponding relationship between the functional test item and the circuit area. For example, if the test result of the functional test item 2 is that the functional test item fails, the circuit area 2 corresponding to the functional test item 2 is a faulty circuit area.
In step 203, the hardware testing component tests the voltages at all test points within the failure circuit area and sends the voltages at the test points to the processor.
In one example, after the processor determines the faulty circuit area, the hardware testing component may be controlled to perform voltage testing on all test points within the faulty circuit area and to send the voltage at each test point to the processor.
For example, the hardware testing component may include a dc testing unit and a dc meter unit, where the dc testing unit includes a dc probe unit and a dc probe position adjusting unit, so that the dc probe unit moves to a testing point in the fault circuit area to perform voltage measurement under the driving of the dc probe position adjusting unit, and the dc meter unit may send the voltage at the testing point to the processor.
In step 204, the processor determines a fault test point according to the voltage at the test point and the corresponding relationship between the pre-stored test point and the standard voltage, and determines a device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number.
In an example, the processor may obtain a pre-stored correspondence between the test point and the standard voltage, where the standard voltage may also be replaced by a standard resistance value, or may store a correspondence table between the test point and the standard voltage and the standard resistance, respectively, for example, as shown in table 2, the correspondence table between the test point and the standard voltage and the standard resistance, respectively.
TABLE 2 table of the corresponding relationship between the test points and the standard voltage and standard resistance
Figure BDA0002432826350000091
In this way, after the processor receives the voltage at each test point, the received voltage can be compared with the standard voltage of the test point, and if the received voltage is consistent or close to consistent, the test point is a normal test point. And if the test points are inconsistent, the test points are fault test points. Since the presence of the faulty circuit area has been confirmed in the functional test, the faulty test point exists in the faulty circuit area.
After the processor determines the fault test point, the processor can determine the device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number, and further can locate the device with the fault. For example, table 3 shows a correspondence table between test points and device position numbers.
TABLE 3 table of correspondence between test points and device location numbers
Test point Device position number
1
2
……
Therefore, the test equipment can not only lock the fault circuit area, but also position which device has a fault, and further can maintain the device with the fault in a targeted manner, so that the device with the fault can be quickly positioned in the single board test, the troubleshooting time can be shortened, and the maintenance efficiency can be improved.
After step 201, in step 202', the processor determines that there is no faulty circuit area according to the test result of the functional test item and the pre-stored correspondence between the functional test item and the circuit area, as shown in fig. 3, and then goes to step 205.
In step 205, the processor obtains a test point set composed of all test points of the board to be tested.
The test point set is a set formed by all test points on a single-side single board.
In step 206, the hardware test component tests the voltages at all test points within the set of test points and sends the voltages at the test points to the processor.
In one example, a hardware test component performs voltage measurements on all test points within a set of test points and issues voltages at each test point to a processor.
In step 207, the processor determines a fault test point according to the voltage at the test point and the corresponding relationship between the pre-stored test point and the standard voltage.
In one example, if no failed test point exists, the test is ended. If there is a failed test point, go to step 208.
In step 208, the device location number corresponding to the failed test point is determined according to the pre-stored correspondence between the test point and the device location number.
In an example, after determining that a fault test point exists, the processor may determine a device location number corresponding to the fault test point according to a correspondence between the test point and the device location number shown in table 3, and then locate the device with the fault.
In some applications, when the functional test is performed on the board to be tested, some test points may be omitted, for example, some test points may not be able to detect whether a fault occurs through the functional test item, so after the functional test is completed, the processor may obtain a test point set formed by all the test points on the board to be tested, determine all the test points which are not traversed by the functional test component by comparing the test points included in the circuit area corresponding to the functional test item which has been completed, and then perform a hardware test on the test points.
For convenience of introduction, the test points traversed by the functional test item may be referred to as a first part of test points, the test points not traversed by the functional test item may be referred to as a second part of test points, and the first part of test points and the second part of test points form a test point set formed by all test points on the board to be tested.
In some applications, the voltage test may be performed on the first part of the test points first in the hardware test, and then the voltage test may be performed on the second part of the test points, or the voltage test may be performed on the first part of the test points and the second part of the test points in the hardware test.
For the first case, after the processor completes the function test on all the function test items, all the fault circuit areas on the board to be tested can be determined, and all the test points in the fault circuit areas form fault test points in the first part of test points. Then, the processor can perform hardware test on the fault test points in the first part of test points, and the voltages at the fault test points in the first part of test points are respectively sent to the processor. Then, the processor may obtain all test points, that is, the test point set, on the board to be tested, and may obtain the second part of the test points according to the test point set and the first part of the test points. And then, performing hardware test on the second part of test points, and respectively sending the voltages at the second part of test points to the processor, wherein the second part of test points may or may not have fault test points, and are in an unknown uncertain condition.
In the second case, after the processor performs the function test on all the function test items, all the faulty circuit areas on the board to be tested may be determined, and all the test points in the faulty circuit areas constitute the faulty test points in the first part of test points. Then, the processor may obtain all test points, that is, the test point set, on the board to be tested, and may obtain the second part of the test points according to the test point set and the first part of the test points. And then, the processor can control the hardware testing component to perform hardware testing on the fault testing points and the second part of testing points in the first part of testing points, and the voltages at the fault testing points and the second part of testing points in the first part of testing points are respectively sent to the processor.
In this embodiment, the hardware test of the fault test point in the first part of test points and the hardware test sequence of the second part of test points are not limited, and the hardware test may be performed separately or may be performed collectively.
As described above, when the test equipment tests the single board, the function test may be performed first, and then the hardware test may be performed, or the hardware test may be performed first, and then the function test may be performed. The above process is to perform the function test on the board to be tested, and then perform the hardware test according to the test result of the function test, and the process of performing the hardware test first and then performing the function test will be described as follows.
Fig. 4 is a schematic flow chart showing a hardware test and a functional test.
In step 401, the processor obtains a test point set of all test points in the board to be tested.
In an example, before the hardware testing component performs the hardware testing on all the test points of the board to be tested, the processor needs to first acquire all the test points on the board to be tested, and the test points form a test point set.
In step 402, the hardware test component tests the voltages at all test points within the set of test points and sends the voltages at the test points to the processor.
In an example, after the processor acquires all the test points on the board to be tested, the processor may control the hardware test component to measure the voltage of each test point in the test point set, and send the voltage of each test point to the processor.
In step 403, the processor determines that no fault test point exists according to the voltage at the test point and the pre-stored correspondence between the test point and the standard voltage.
In an example, after obtaining the voltage at each test point, the processor may compare the voltage with the standard voltage corresponding to each test point shown in table 2, if the voltage at each test point is consistent with the respective standard voltage, then no fault test point exists in the test point set, and then step 404 is performed, and if the voltage at the test point is not consistent with the corresponding standard voltage, then at least one fault test point exists in the test point set, then a device position number corresponding to the at least one fault test point is determined according to the test point and the device position number, and then the test is ended.
In step 404, the functional test component tests the functional test item of the board to be tested, and sends the test result of the functional test item to the processor.
In one example, the test device completes the hardware test, and if no fault test point exists in the test, the functional test is continuously executed, and the test result of each functional test item is sent to the processor.
In step 405, the processor determines a faulty circuit area according to the test result of the functional test item and the pre-stored correspondence between the functional test item and the circuit area.
In one example, after the processor receives the test results of the functional test items, if all the test results are functional test items, the test is ended. If the test result includes at least one functional test item failure, the processor may determine a faulty circuit area corresponding to the functional test item failure according to a correspondence between the functional test item and the circuit area.
In step 406, the hardware testing component tests the voltages at all test points within the failure circuit area and sends the voltages at the test points to the processor.
In one example, the processor may control the hardware testing component to perform a voltage test on each test point within all of the fail circuit regions, determine a voltage at each test point within all of the fail circuit regions, and send the voltage at each test point within all of the fail circuit regions to the processor.
In step 407, the processor determines a fault test point according to the voltage at the test point and the corresponding relationship between the pre-stored test point and the standard voltage, and determines a device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number.
In an example, after the processor receives the voltages at the test points in all the fault circuit regions, test points corresponding to voltages inconsistent with the standard voltage may be screened from the received voltages according to the relationship between the test points and the standard voltage shown in table 2, and these test points are fault test points. Then, the processor may determine the device position number corresponding to each failed test point according to the correspondence between the test point and the device position number shown in table 3, and lock the device to the failed device.
Therefore, the test equipment can perform the function test first and then perform the hardware test, or perform the hardware test first and then perform the function test, and a test sequence technician can write the test sequence into the processor in advance, or the test equipment has function keys in a selected sequence.
Based on the above, when testing a single board, the testing device may execute the procedure shown in fig. 5. And (2) judging whether to perform the function test in step 1, if so, starting the function test, and performing step 2 to perform the function test on the function test item of the single board to be tested. And (3) after the functional test is finished, judging whether a functional test failure item exists, if so, performing step 4, and determining a fault circuit area according to the relation between the functional test item and the circuit area. In order to avoid the omission of the test points, correspondingly, step 5 is performed to obtain the test point set, and determine the test points which are not traversed by the function test, and then the hardware test is started. In step 6, the test points in the fault circuit area and the test points which are not traversed by the function test are subjected to hardware test. In step 7, the fault test point is determined according to the relation table of the test point and the standard voltage, then in step 8, the device position number corresponding to the fault test point is determined according to the relation table of the test point and the device position number, and after the device is positioned, the test is finished.
And judging whether a functional test item fails in the step 3, if not, performing a hardware test, after the corresponding step 3, turning to a step 9 to obtain a test point set, in a step 10, performing a hardware test on each test point in the test point set, after the hardware test is completed, performing a step 11 to judge whether a fault test point exists, if not, finishing the test, and if the fault test point exists, turning to a step 8, determining a device position number corresponding to the fault test point according to a relation table of the test point and the device position number, and after the device is positioned, finishing the test.
Firstly, function testing is carried out, if hardware testing is carried out firstly in the step 1, the hardware testing is started, the step 12 is carried out after the step 1, the test point set is obtained, and in the step 13, the hardware testing is carried out on each test point in the test point set. After the hardware test is completed, step 14 is performed to determine whether a fault test point exists, if not, a function test is performed, and step 15 is performed to perform a function test on the function item of the board to be tested. After the functional test is completed, step 16 is performed to determine whether there is a failure of the functional test item, and if not, the test is ended.
If there is a failure of the functional test item in step 16, the process proceeds to step 17, where a faulty circuit area is determined according to the relationship table of the functional test item and the circuit area, and then a hardware test is started. In step 18, a hardware test is performed on each test point in the fault circuit area, in step 19, the fault test point is determined according to the relation table of the test point and the standard voltage, then, in step 20, the device position number corresponding to the fault test point is determined according to the relation table of the test point and the device position number, and after the device is positioned, the test is finished.
According to the process, the test equipment not only comprises the hardware test component for testing the electrical relation of the components on the single board to be tested, but also comprises the functional test component for testing the functions of the functional test items of the single board to be tested. Therefore, the fault problem can be found in time before the single plates are assembled into the modules, the disassembly and the maintenance after the modules are assembled can be reduced or even avoided, the first pass rate of module production can be improved, the module production period is shortened, and the module maintenance cost is saved.
And if the veneer to be tested has a fault test point, the test equipment is used for testing the veneer to be tested, so that the position number of the device can be positioned on the veneer to be tested, and the device with the fault can be locked.
In addition, after the test equipment finishes testing, the test result can be displayed through the display equipment, for example, whether a fault test point exists or not and whether a functional test item fails or not can be displayed, and if the fault test point exists, the position number and the voltage of a device corresponding to the fault test point can be displayed.
In an application, a single board to be tested may be taken as a radio frequency single board for example, and a flow of the test equipment for testing the radio frequency single board is described, as shown in fig. 6, which is a schematic flow chart.
And step 31, judging whether to perform the function test first, if so, performing the function test, and turning to step 32 to connect the radio frequency test unit and load function test software to perform the function test on the function test item. After the functional test is completed, step 33 is performed to determine whether the functional test item fails, and if so, the step 34 is performed to determine the faulty circuit area according to the functional test item and circuit area relation table. In order to avoid the omission of the test points, correspondingly, step 35 is performed to obtain a test point set, determine the test points which are not traversed by the functional test, and then start the hardware test. In the hardware test, step 36 is performed to disconnect the rf test unit, connect the dc test unit, and load the hardware test software. In step 37, the test points within the faulty circuit area and the test points not traversed by the functional test are subjected to a hardware test. After the hardware testing is completed, in step 38, the fault test point is determined according to the relationship table between the test point and the standard voltage. Then, in step 39, the device location number corresponding to the failure test point is determined according to the relation table of the test point and the device location number. The test is then ended.
And if it is determined in step 33 that no functional test item fails, starting a hardware test, proceeding to step 40, obtaining a test point set, then in step 41, disconnecting the radio frequency test unit, connecting the direct current test unit and loading hardware test software, continuing to step 42, performing a hardware test on each test point in the test point set, after the hardware test is completed, performing step 43, determining whether a faulty test point exists, and if not, ending the test. If the fault test point exists, the step 39 is carried out, and the device position number corresponding to the fault test point is determined according to the relation table of the test point and the device position number. The test is then ended.
If the function test is not performed first in step 31, the hardware test is performed first, and after step 31, the process goes to step 44 to obtain the test point set, in step 45, the dc test unit is connected and the hardware test software is loaded, and in step 46, the hardware test is performed on the test points in the test point set. After the hardware test is completed, step 47 is performed to determine whether a fault test point exists, if not, the functional test is started, step 48 is performed to disconnect the direct current test unit, connect the radio frequency test unit and load the functional test software for the functional test. After the functional test is completed, step 49 is performed to determine whether there is a failure of the functional test item, and if there is no failure of the functional test item, the test is ended.
If there is a failure of the functional test item in step 49, step 50 is performed to determine a faulty circuit area according to the relationship table between the functional test item and the circuit area, and then the hardware test is started. Then, in step 51, the rf test unit is disconnected, the dc test unit is connected, and the hardware test software is loaded, and in step 52, the hardware test is performed on the test point in the failure circuit area. Then, in step 53, the fault test point is determined according to the relation table of the test point and the standard voltage, and then, in step 54, the device position number corresponding to the fault test point is determined according to the relation table of the test point and the device position number. After that, the test is ended.
If the fault test point exists in step 47, the process goes to step 54 to determine the device location number corresponding to the fault test point according to the relationship table of the test point and the device location number. After that, the test is ended.
In the embodiment of the application, the test equipment comprises a hardware test component and a functional test component, so that the test equipment can test the electrical property and the electrical connection relation of components on a single board, can test each functional test item of the single board, can find out the existing fault problem in time before the single board is assembled into a module, can reduce or even avoid the disassembly and assembly maintenance after the single board is assembled into the module, further can improve the first pass rate of module production, shorten the module production period and save the module maintenance cost.
The above description is only one embodiment of the present application and should not be taken as limiting the present application, and any modifications, equivalents, improvements, etc. made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (5)

1. A test device for testing a single board, the test device comprising a processor, a functional test component and a hardware test component, wherein:
the processor is respectively electrically connected with the function test part and the hardware test part, and the single board to be tested is installed in the test equipment;
the function testing component is used for testing the function testing items of the single board to be tested and sending the testing results of the function testing items to the processor;
the hardware testing component is configured to test a voltage at a testing point of the board to be tested, and send the voltage at the testing point to the processor, where the testing point includes: all test points in the fault circuit area and test points which are not traversed by the functional test component of the single board to be tested and are determined by comparing all test points of the single board to be tested with the test points contained in the circuit area corresponding to the functional test items which are tested;
the processor is used for determining a fault circuit area according to the test result of the functional test item and the corresponding relation between the functional test item and the circuit area which is stored in advance; determining a fault test point according to the corresponding relation between the voltage at the test point and the pre-stored test point and the standard voltage; and determining the device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number.
2. The test apparatus of claim 1, wherein the test results of the functional test items include a functional test item failure and a functional test item pass.
3. The test equipment according to any one of claims 1 to 2, wherein the board is a radio frequency board, the functional test component includes a radio frequency test unit and a radio frequency instrument unit, and the hardware test component includes a direct current test unit and a direct current instrument unit;
the processor is electrically connected with the radio frequency test unit, the radio frequency instrument unit, the direct current test unit and the direct current instrument unit respectively;
the radio frequency test unit is electrically connected with the radio frequency single board and the radio frequency instrument unit respectively, and the direct current test unit is electrically connected with the radio frequency single board and the direct current instrument unit respectively.
4. A method for testing a board, wherein the method is applied to the testing apparatus of any one of claims 1 to 3, and the method comprises:
the function test component tests the function test items of the single board to be tested and sends the test results of the function test items to the processor;
the processor determines a fault circuit area according to the test result of the functional test item and the corresponding relation between the functional test item and the circuit area which is stored in advance;
the hardware testing component tests the voltage of the testing point and sends the voltage of the testing point to the processor;
and the processor determines a fault test point according to the voltage at the test point and the corresponding relationship between the pre-stored test point and the standard voltage, and determines a device position number corresponding to the fault test point according to the corresponding relationship between the pre-stored test point and the device position number.
5. The method of claim 4, further comprising:
after the functional test component completes the test of all the functional test items of the single board to be tested, determining the test points of the single board to be tested, which are not traversed by the functional test component, by comparing all the test points of the single board to be tested with the test points contained in the circuit area corresponding to the tested functional test items;
the hardware testing component tests the voltage at the test point and sends the voltage at the test point to the processor, including:
the hardware testing component tests voltages at all test points within the fault circuit region, tests voltages at the test points not traversed by the functional testing component, and sends the voltages at the test points to the processor.
CN202010241838.5A 2020-03-31 2020-03-31 Test equipment and method for testing single board Active CN113466655B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202010241838.5A CN113466655B (en) 2020-03-31 2020-03-31 Test equipment and method for testing single board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202010241838.5A CN113466655B (en) 2020-03-31 2020-03-31 Test equipment and method for testing single board

Publications (2)

Publication Number Publication Date
CN113466655A CN113466655A (en) 2021-10-01
CN113466655B true CN113466655B (en) 2023-04-07

Family

ID=77865200

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202010241838.5A Active CN113466655B (en) 2020-03-31 2020-03-31 Test equipment and method for testing single board

Country Status (1)

Country Link
CN (1) CN113466655B (en)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN115389904A (en) * 2022-07-12 2022-11-25 浙江众合科技股份有限公司 Automatic testing system and method for single board of heterogeneous processor in rail transit

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101989936B (en) * 2010-11-01 2014-06-11 中兴通讯股份有限公司 Test method and system of single plate fault
CN102435938B (en) * 2011-10-28 2013-08-07 中国电子科技集团公司第三十八研究所 Function-based digital circuit failure detecting and positioning system and method
CN202929167U (en) * 2012-09-25 2013-05-08 西门子工厂自动化工程有限公司 Testing device for diagnosing and testing circuit board in electric drive device
CN103364709B (en) * 2013-05-30 2016-02-17 环鸿电子（昆山）有限公司 A kind of function test system of actual load circuit board and method
CN104730504B (en) * 2015-04-07 2017-08-04 四川九洲空管科技有限责任公司 A kind of test system and its method of testing towards secondary radar inquiry system
CN106771984A (en) * 2017-02-20 2017-05-31 华东师范大学 A kind of high speed circuit board intelligent test device

Also Published As

Publication number Publication date
CN113466655A (en) 2021-10-01

Similar Documents

Publication Publication Date Title
US7472321B2 (en) Test apparatus for mixed-signal semiconductor device
CN110910800B (en) Source driver
US7281181B2 (en) Systems, methods and computer programs for calibrating an automated circuit test system
CN113466655B (en) Test equipment and method for testing single board
US7372288B2 (en) Test apparatus for testing multiple electronic devices
US9632133B2 (en) Circuit board testing system
US7106081B2 (en) Parallel calibration system for a test device
US20150212186A1 (en) Method of calibrating and operating testing system
US7609072B2 (en) Processing tantalum capacitors on assembled PWAs to yield low failure rate
KR101499851B1 (en) System for testing integrity of burn-in boards for various burn-in tests
US12007423B2 (en) Portable nodal impedance analyser
US5252914A (en) Method of constructing and testing a circuit board designed for early diagnostics
US5404584A (en) Printed circuit board having modularized circuit functions designed for early diagnostics
US20210072273A1 (en) Fan circuit test system and test method without the need to install a fan
JPWO2008072639A1 (en) Test apparatus, test method, and connection part
KR101950423B1 (en) Squib circuit checking system and controlling method thereof
US20070186131A1 (en) Low cost imbedded load board diagnostic test fixture
US8269517B2 (en) Handler and method for testing the same
KR20100082153A (en) Semiconductor device test system
KR100257160B1 (en) Burn-in test board
KR100353897B1 (en) Automatic test apparatus of wireless device and control method thereof
JP4061533B2 (en) IC tester
US6949941B2 (en) Manual tester for testing device and method thereof
RU2784384C2 (en) Automated system for control and diagnostics of replaceable elements of radio-electronic equipment
GB2251081A (en) Testing electronic circuits

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant