CN113458400A - Ti-Al3Ti intermetallic compound laminated composite board preparation method - Google Patents

Ti-Al3Ti intermetallic compound laminated composite board preparation method Download PDF

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CN113458400A
CN113458400A CN202110836162.9A CN202110836162A CN113458400A CN 113458400 A CN113458400 A CN 113458400A CN 202110836162 A CN202110836162 A CN 202110836162A CN 113458400 A CN113458400 A CN 113458400A
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plate
powder
mpa
temperature
alc
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CN113458400B (en
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原梅妮
梁广
王洪林
马健
王玺栋
魏泽源
苗雨中
任晓森
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North University of China
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00—Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12—Both compacting and sintering
    • B22F3/14—Both compacting and sintering simultaneously
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F5/00—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product
    • B22F5/006—Manufacture of workpieces or articles from metallic powder characterised by the special shape of the product of flat products, e.g. sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
    • B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
    • B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
    • B22F2007/042—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal characterised by the layer forming method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B22—CASTING; POWDER METALLURGY
    • B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F9/00—Making metallic powder or suspensions thereof
    • B22F9/02—Making metallic powder or suspensions thereof using physical processes
    • B22F9/04—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling
    • B22F2009/043—Making metallic powder or suspensions thereof using physical processes starting from solid material, e.g. by crushing, grinding or milling by ball milling

Abstract

The invention relates to a laminated composite board, in particular to Ti-Al3Ti intermetallic compound laminated composite board, in particular to Ti-Al3A method for preparing a Ti intermetallic compound laminated composite board. The invention aims to solve the problem of the existing Ti-Al3The problem of the mechanical property mutation of the Ti intermetallic compound laminated composite board at the interface thereof provides a new Ti-Al3A method for preparing a Ti intermetallic compound laminated composite board, which comprises the steps of mixing Ti with a solvent3AlC2Introduction of conventional Ti-Al3The interface layer of the Ti intermetallic compound laminated composite board is subjected to hot pressing sintering, Ti and Al are diffused mutually, and finally Ti and Al are formed on the interface layer3Ti is formed at the interface of Ti3AlC2/Al3The transition interface layer of the Ti phase solves the problem of abrupt change of the mechanical property at the interface, and the preparation process is simple and easy to implement and is suitable for commercial production.

Description

Ti-Al3Ti intermetallic compound laminated composite board preparation method
Technical Field
The invention relates to a laminated composite board, in particular to Ti-Al3Ti intermetallic compound laminated composite board, in particular to Ti-Al3A method for preparing a Ti intermetallic compound laminated composite board.
Background
The intermetallic compound laminated composite plate is formed by alternately superposing ductile metal and brittle intermetallic compound. In the nineties of the last century, scientists in the United states developed Ti-Al3Ti intermetallic compound laminated composite plate, in which intermetallic compound Al is3Ti and a tough metal layer Ti are alternately laminated by the characteristics of high hardness, large modulus, small density and the like of Ti, the brittle-tough alternate laminated structure simulates shells 'organic-inorganic' in nature, and can better absorb impact kinetic energy due to unique failure modes such as crack deflection and layer-by-layer failure and the like of an interface when being impacted, so that the Ti and Al alternate laminated structure is widely applied to the fields of armor protection and industrial production, but also can be widely applied to the fields of armor protection and industrial production due to the fact that Ti and Al are also laminated by the ductile metal layer Ti alternately3The mechanical properties of Ti are greatly different, for example, the Vickers hardness of Ti is about 310HV, and Al3The Vickers hardness of Ti reaches 660HV to 750HV, and the Ti and Al3The abrupt change of the mechanical property at the Ti interface can easily cause the stress concentration at the interface, so that the laminated composite board has cracks at the interface, and finally the laminated composite board cracks at the interface.
Disclosure of Invention
The invention aims to solve the problem of the existing Ti-Al3The problem of the mechanical property mutation of the Ti intermetallic compound laminated composite board at the interface thereof provides a new Ti-Al3A method for preparing a Ti intermetallic compound laminated composite board.
The invention is realized by adopting the following technical scheme: Ti-Al3The preparation method of the Ti intermetallic compound laminated composite board comprises the following steps:
1) preparing Al and Ti which are mixed uniformly3AlC2Composite powder: putting Al powder with the granularity of 10 mu m into a high-energy ball mill for ball milling, wherein the ball-material ratio is 10:1, the rotating speed is 100-3AlC2Proportioning the powder, and mixing the proportioned Al powder with Ti3AlC2Putting the powder into a ball milling tank for ball milling for 8-15h, introducing argon gas for protection in the ball milling process, and adding 1% ethanol as a process control agent to form composite powder;
2) cleaning a Ti plate and an Al plate with acid and alkali: treating a Ti plate with the thickness of 0.5mm by using a hydrofluoric acid solution with the concentration of 5%, then taking out the Ti plate and cleaning the Ti plate by using clear water, then putting the Ti plate cleaned by the clear water into an ultrasonic cleaner for ultrasonic cleaning, and finally blowing the Ti plate cleaned by the ultrasonic cleaning by using a blower; treating an Al plate with the thickness of 0.5mm by using a sodium hydroxide solution with the concentration of 5%, taking out and cleaning the Al plate by using clear water, putting the Al plate cleaned by the clear water into an ultrasonic cleaner for ultrasonic cleaning, and finally blowing the Al plate cleaned by the ultrasonic cleaning by using a blower;
3) and (3) laminating and packaging: alternately laminating the Ti plate and the Al plate which are subjected to acid-base cleaning, laminating composite powder with the powder thickness of 0.1-0.15mm between the Ti plate and the Al plate, and ensuring that the outermost layer is the Ti plate so as to form a laminated plate, wherein the laminated plate is packaged by adopting a Ti foil with the thickness of 20 mu m so as to form a packaging body; (the thickness of the composite powder cannot be too thick or too thin, and too thick composite powder can cause too low hardness gradient and cannot exert Ti-Al3The Ti intermetallic compound laminated composite board is mechanically laminated by heterogeneous materialsThe advantages brought by the composite powder are that the composite powder is too thin to be layered and the interface hardness gradient cannot be effectively reduced)
4) Vacuum hot-pressing sintering: placing the packaging body in a vacuum hot-pressing sintering furnace, and then carrying out vacuum hot-pressing sintering on the packaging body according to the following steps:
Figure 101534DEST_PATH_IMAGE001
applying 20-30 MPa pressure to the obtained packaging body, raising the sintering temperature to 600 ℃ at the speed of 5-15 ℃/min, and keeping the temperature for 120 min, wherein the pressure during the heat preservation is 3-5 MPa (in the step, the Ti plate, Al powder in the composite powder and the Al plate begin to react to preform a transition interface layer Ti plate3AlC2/Al3Ti）；
Figure 118032DEST_PATH_IMAGE002
Raising the sintering temperature to 660 ℃ at the speed of 5 ℃/min, and preserving the temperature for 90 min, wherein the pressure during the heat preservation is 0.5-1 MPa;
Figure 537381DEST_PATH_IMAGE003
increasing the sintering temperature to 665 deg.C at a rate of 5 deg.C/min, and maintaining at 0.5 MPa for 210min (the Ti plate completely reacts with Al powder and Al plate in the composite powder to form Al)3A Ti layer);
Figure 92383DEST_PATH_IMAGE004
reducing the temperature to 550 ℃ at the speed of 5 ℃/min, and preserving the temperature for 180min, wherein the pressure is 0.5-1 MPa;
Figure 636497DEST_PATH_IMAGE005
reducing the temperature to 200 ℃ at the speed of 5 ℃/min, and keeping the pressure at 0.5-1 MPa;
Figure 253423DEST_PATH_IMAGE006
and closing a heating device of the vacuum hot-pressing sintering furnace, and cooling the packaging body along with the furnace to room temperature to finish the preparation, wherein the pressure during the cooling is 0.5-1 MPa.
Principle analysis:
1) between the Ti plate and the Al plate3AlC2The composite powder composed of the powder and the Al powder has the function of generating a transition interface layer Ti3AlC2/Al3And (3) Ti. In the preparation process of Ti3AlC2The powder is mixed and divided into Al powder, Ti plate and Ti3AlC2Al powder is directly contacted with the powder; in the whole preparation process, Ti3AlC2The powder does not react with Al powder in the Al plate, the Ti plate and the composite powder, and the Ti powder3AlC2Newly formed Al as a second phase3In the Ti layer, with respect to Al3The Ti layer plays a toughening role, namely a thin transition interface layer Ti is generated between the Ti plate and the Al plate3AlC2/Al3And (3) Ti. As the reaction proceeds, the Ti plate and the Al plate form Al3And a Ti layer. Transition boundary layer Ti3AlC2/Al3The Ti hardness is between the Ti hardness and the Al hardness3Between Ti hardness and Al plate3The Ti interface plays a transition role to avoid Ti and Al3The mechanical property of the Ti interface is suddenly changed, and the stress concentration is greatly relieved when the Ti interface is impacted;
2) according to the user to the Ti plate and Al3The requirements of the hardness gradient of the Ti interface are different, and Al powder and Ti powder in the composite powder can be adjusted during preparation3AlC2The ratio of the powder (adjusted in the ratio interval) and the thickness of the composite powder layer (adjusted in the thickness interval) are used for realizing the Ti plate and the Al plate with different sizes3The hardness gradient at the interface between Ti meets the requirements of different users by adopting the same preparation principle.
The beneficial effects produced by the invention are as follows: the preparation method is simple and easy to implement, and solves the problem of Ti-Al3The mechanical property of the Ti intermetallic compound laminated composite board is suddenly changed, and meanwhile, the Ti board and the Al board can be prepared according to the requirements of users3The intermetallic compound laminated composite board with different hardness gradient sizes at the Ti interface is widely applied to commercial production.
Drawings
FIG. 1 is a schematic view showing the distribution of a laminate before vacuum hot pressing sintering;
FIG. 2 shows Ti-Al3The final product of Ti intermetallic compound laminated composite plateIntention (points in the figure represent Ti3AlC2Powder);
FIG. 3 is a graph showing a hardness distribution in the vicinity of an interface of a laminated composite board (the horizontal axis represents hardness measurement points of the laminated composite board set in the thickness direction of the laminated composite board in order, the vertical axis represents hardness, and Ti-Al is shown in a circle3At the Ti interface).
In the figure: 1-Ti plate, 2-composite powder, 3-Al plate, 4-Al3Ti layer, 5-transition interface layer Ti3AlC2/Al3Ti。
Detailed Description
Ti-Al3The preparation method of the Ti intermetallic compound laminated composite board comprises the following steps:
1) preparing Al and Ti which are mixed uniformly3AlC2Composite powder 2: putting Al powder with the particle size of 10 mu m into a high-energy ball mill for ball milling, wherein the ball-material ratio is 10:1, the rotating speed is 100-200 r/min (such as 100 r/min, 130 r/min, 150 r/min, 165 r/min, 170 r/min, 186 r/min, 190 r/min and 200 r/min), the ball milling time is 8-15h (such as 8h,9h,10h,11h,12h,13h,14h and 15 h), and then the ball-milled Al powder and Ti powder with the particle size of 1 mu m are subjected to ball milling according to the mass ratio of 1:9-1:5 (such as 1:9, 1:8,1:7,1:6 and 1: 5)3AlC2Proportioning the powder, and mixing the proportioned Al powder with Ti3AlC2Putting the powder into a ball milling tank for ball milling for 8-15h (for example, the ball milling time is 8h,9h,10h,11h,12h,13h,14h and 15 h), introducing argon for protection in the ball milling process, and adding 1% ethanol as a process control agent to form composite powder;
2) cleaning a Ti plate and an Al plate with acid and alkali: treating a Ti plate 1 with the thickness of 0.5mm by using a hydrofluoric acid solution with the concentration of 5%, then taking out and cleaning the Ti plate 1 by using clean water, then putting the Ti plate 1 cleaned by using the clean water into an ultrasonic cleaner for ultrasonic cleaning, and finally blowing the Ti plate 1 cleaned by using an air blower for drying; treating an Al plate 3 with the thickness of 0.5mm by using a sodium hydroxide solution with the concentration of 5%, then taking out and cleaning the Al plate 3 by using clean water, then putting the Al plate 3 cleaned by using the clean water into an ultrasonic cleaner for ultrasonic cleaning, and finally blowing the Al plate 3 cleaned by using a blower for drying;
3) and (3) laminating and packaging: alternately laminating the Ti plate 1 and the Al plate 3 which are cleaned by acid and alkali, laminating composite powder 2 with the powder thickness of 0.1-0.15mm (such as 0.1mm, 0.11 mm, 0.12 mm, 0.13 mm, 0.14 mm and 0.15 mm) between the Ti plate 1 and the Al plate 3, and ensuring that the outermost layer is the Ti plate 1 so as to form a laminated plate, and packaging the laminated plate by adopting a Ti foil with the thickness of 20 mu m so as to form a packaging body; (the thickness of the composite powder 2 should not be too thick nor too thin, and too thick composite powder would result in too low a hardness gradient and failure to develop Ti-Al3The Ti intermetallic compound laminated composite board has the advantages of mechanical property brought by the lamination of heterogeneous materials, the composite powder is too thin and difficult to laminate, and simultaneously, the gradient hardness of the final interface is still large)
4) Vacuum hot-pressing sintering: placing the packaging body in a vacuum hot-pressing sintering furnace, and then carrying out vacuum hot-pressing sintering on the packaging body according to the following steps:
Figure 792858DEST_PATH_IMAGE001
applying a pressure of 20-30 MPa (e.g. 20 MPa, 21 MPa, 23 MPa, 25MPa, 27 MPa, 30 MPa) to the obtained package, increasing the sintering temperature to 600 ℃ at a rate of 5-15 ℃/min (e.g. 5 ℃/min, 7 ℃/min, 9 ℃/min, 10 ℃/min, 12 ℃/min, 15 ℃/min), and maintaining the temperature for 120 min at a pressure of 3-5 MPa (e.g. 3 MPa, 3.8 MPa, 4 MPa, 4.1 MPa, 4.5 MPa, 5 MPa) (in this step, the Ti plate 1 and the Al powder and the Al plate 3 in the composite powder 2 begin to react to form a transition interface layer Ti3AlC2/Al3Ti 5）；
Figure 407510DEST_PATH_IMAGE002
Increasing the sintering temperature to 660 deg.C at a rate of 5 deg.C/min, and maintaining at 0.5-1MPa (such as 0.5 MPa, 0.6MPa, 0.7 MPa, 0.9MPa, and 1 MPa) for 90 min;
Figure 579865DEST_PATH_IMAGE003
increasing the sintering temperature to 665 deg.C at a rate of 5 deg.C/min, maintaining the temperature for 210min, and pressingThe force is 0.5 MPa (the Ti plate 1 and the Al powder in the composite powder 2 and the Al plate 3 are completely reacted to form Al3A Ti layer);
Figure 390695DEST_PATH_IMAGE004
reducing the temperature to 550 deg.C at a rate of 5 deg.C/min, and maintaining at 0.5-1MPa (such as 0.5 MPa, 0.7 MPa, 0.8 MPa, 0.9MPa, and 1 MPa) for 180 min;
Figure 597686DEST_PATH_IMAGE005
reducing the temperature to 200 deg.C at a rate of 5 deg.C/min, and maintaining the pressure at 0.5-1MPa (such as 0.5 MPa, 0.7 MPa, 0.8 MPa, 0.9MPa, and 1 MPa);
Figure 901016DEST_PATH_IMAGE006
and closing a heating device of the vacuum hot-pressing sintering furnace, and cooling the packaging body along with the furnace to room temperature to finish the preparation, wherein the pressure during the cooling is 0.5-1MPa (for example, 0.5 MPa, 0.7 MPa, 0.8 MPa, 0.9MPa and 1 MPa).
Principle analysis: 1) between Ti and Al plates3AlC2The composite powder composed of the powder and the Al powder has the function of generating a transition interface layer Ti3AlC2/Al3And (5) Ti. In the preparation process of Ti3AlC2The powder is mixed and divided into Al powder, Ti plate and Ti3AlC2Al powder is directly contacted with the powder; note that in the whole preparation process, Ti3AlC2The powder does not react with Al powder in the Al plate, the Ti plate and the composite powder, and the Ti powder3AlC2Newly formed Al as a second phase3In the Ti layer, with respect to Al3The Ti layer plays a toughening role, namely a thin transition interface layer Ti is generated between the Ti plate and the Al plate3AlC2/Al3And (5) Ti. As the reaction proceeds, the Ti plate and the Al plate form Al3And a Ti layer. Transition boundary layer Ti3AlC2/Al3The Ti 5 hardness is between the Ti hardness and the Al hardness3Between Ti hardness and Al plate3The Ti interface plays a transition role to avoid Ti and Al3The mechanical property of the Ti interface is suddenly changed, and the stress concentration is greatly relieved when the Ti interface is impacted；
2) According to the user to the Ti plate 1 and Al3The requirements of the hardness gradient at the interface of the Ti layer 4 are different, so that the Al powder and the Ti powder in the composite powder can be adjusted during preparation3AlC2The ratio of the powder (adjusted in the ratio interval) and the thickness of the composite powder layer (adjusted in the thickness interval) are used for realizing the Ti plate 1 and the Al plate with different sizes3The hardness gradient at the interface between the Ti layers 4 meets the requirements of different users by adopting the same preparation principle.

Claims (1)

1. Ti-Al3The preparation method of the Ti intermetallic compound laminated composite board is characterized by comprising the following steps:
1) preparing Al and Ti which are mixed uniformly3AlC2Composite powder (2): putting Al powder with the granularity of 10 mu m into a high-energy ball mill for ball milling, wherein the ball-material ratio is 10:1, the rotating speed is 100-3AlC2Proportioning the powder, and mixing the proportioned Al powder with Ti3AlC2Putting the powder into a ball milling tank for ball milling for 8-15h, introducing argon gas for protection in the ball milling process, and adding 1% ethanol as a process control agent to form composite powder (2);
2) acid-base cleaning of a Ti plate (1) and an Al plate (3): treating a Ti plate (1) with the thickness of 0.5mm by using a hydrofluoric acid solution with the concentration of 5%, taking out the Ti plate and cleaning the Ti plate by using clean water, putting the Ti plate (1) cleaned by the clean water into an ultrasonic cleaner for ultrasonic cleaning, and finally blowing the Ti plate (1) cleaned by the ultrasonic cleaning by using a blower; treating an Al plate (3) with the thickness of 0.5mm by using a sodium hydroxide solution with the concentration of 5%, taking out and cleaning the Al plate by using clear water, putting the Al plate (3) cleaned by the clear water into an ultrasonic cleaner for ultrasonic cleaning, and finally blowing the Al plate (3) cleaned by the ultrasonic cleaning by using a blower;
3) and (3) laminating and packaging: alternately laminating the Ti plate (1) and the Al plate (3) which are subjected to acid-base cleaning, laminating composite powder (2) with the powder thickness of 0.1-0.15mm between the Ti plate (1) and the Al plate (3), and ensuring that the outermost layer is the Ti plate (1) so as to form a laminated plate, wherein the laminated plate is packaged by adopting Ti foil with the thickness of 20 mu m so as to form a packaging body;
4) vacuum hot-pressing sintering: placing the packaging body in a vacuum hot-pressing sintering furnace, and then carrying out vacuum hot-pressing sintering on the packaging body according to the following steps:
Figure 967360DEST_PATH_IMAGE001
applying 20-30 MPa pressure to the obtained packaging body, raising the sintering temperature to 600 ℃ at the speed of 5-15 ℃/min, and preserving the temperature for 120 min, wherein the pressure during the heat preservation is 3-5 MPa;
Figure 129351DEST_PATH_IMAGE002
raising the sintering temperature to 660 ℃ at the speed of 5 ℃/min, and preserving the temperature for 90 min, wherein the pressure during the heat preservation is 0.5-1 MPa;
Figure 908957DEST_PATH_IMAGE003
increasing the sintering temperature to 665 ℃ at the speed of 5 ℃/min, and keeping the temperature for 210min at the pressure of 0.5 MPa;
Figure 865411DEST_PATH_IMAGE004
reducing the temperature to 550 ℃ at the speed of 5 ℃/min, and preserving the temperature for 180min, wherein the pressure is 0.5-1 MPa;
Figure 12359DEST_PATH_IMAGE005
reducing the temperature to 200 ℃ at the speed of 5 ℃/min and keeping the pressure at 0.5-1 MPa;
Figure 961729DEST_PATH_IMAGE006
and closing a heating device of the vacuum hot-pressing sintering furnace, and cooling the packaging body along with the furnace to room temperature to finish the preparation, wherein the pressure during the cooling is 0.5-1 MPa.
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CN114101681A (en) * 2021-11-18 2022-03-01 中国航发北京航空材料研究院 Method for preparing metal laminated composite plate by using contact reaction
CN115322797A (en) * 2022-07-22 2022-11-11 中北大学 Composite phase-change flame-retardant material with heat management performance and electromagnetic shielding function, and preparation method and application thereof

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CN108909084A (en) * 2018-06-04 2018-11-30 中北大学 It is a kind of that Ti-Al is prepared using heat absorption semi-solid-state reaction3The method of Ti-Al laminated composite materials
CN108893638A (en) * 2018-07-25 2018-11-27 北京交通大学 A kind of endogenous TiC x-Ni3 (Al, Ti)/Ni base gradient composite material and its hot pressing method for preparing
CN110216291A (en) * 2019-06-24 2019-09-10 中北大学 Titanium packaging ceramic/Al3Ti-Al-TC4Bionical laminated composite materials and preparation method thereof
CN110280769A (en) * 2019-07-25 2019-09-27 中北大学 A kind of cylinder is staggeredly stacked the Ti-Ti of structure2AlC/TiAl3Laminated composite materials and preparation method thereof
CN110756982A (en) * 2019-11-13 2020-02-07 大连理工大学 Amorphous alloy/metal micro-laminated composite material and preparation method thereof

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CN114101681A (en) * 2021-11-18 2022-03-01 中国航发北京航空材料研究院 Method for preparing metal laminated composite plate by using contact reaction
CN115322797A (en) * 2022-07-22 2022-11-11 中北大学 Composite phase-change flame-retardant material with heat management performance and electromagnetic shielding function, and preparation method and application thereof
CN115322797B (en) * 2022-07-22 2023-06-02 中北大学 Composite phase-change flame-retardant material with heat management performance and electromagnetic shielding function, and preparation method and application thereof

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