CN113451251A - High heat dissipation lead frame structure of heat dissipation channel - Google Patents
High heat dissipation lead frame structure of heat dissipation channel Download PDFInfo
- Publication number
- CN113451251A CN113451251A CN202110858284.8A CN202110858284A CN113451251A CN 113451251 A CN113451251 A CN 113451251A CN 202110858284 A CN202110858284 A CN 202110858284A CN 113451251 A CN113451251 A CN 113451251A
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- China
- Prior art keywords
- heat dissipation
- lead frame
- frame structure
- base island
- dissipation channel
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49541—Geometry of the lead-frame
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
- H01L23/49568—Lead-frames or other flat leads specifically adapted to facilitate heat dissipation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
The invention provides a high-heat-dissipation lead frame structure of a heat dissipation channel, wherein a plurality of independent pins are arranged at one end of the lead frame structure; the other end is provided with an inner pin and a wide pin, and the wide pin is connected with the radiating fin; the wide pin is provided with a first locking hole and a second locking hole; the invention can obviously shorten the distance between the chip and the inner pin, reduce the length of a bonding wire, reduce the resistance, inductance and parasitic capacitance of the IC chip, and reduce the resistive loss and the switching loss inside the IC chip.
Description
Technical Field
The invention relates to the technical field of IC manufacturing semiconductor packaging, in particular to a high-heat-dissipation lead frame structure with a heat dissipation channel.
Background
In the traditional packaging forms such as SOP, DIP and the like, most of the low-row-number lead frame structures designed for single carriers or double carriers can bear smaller currents, the effects of heat conduction and signal output cannot be well realized, and the application range of the low-row-number lead frame structures is greatly limited. The existing eHSOP (Small Outline Package with exposed thermal pad and Heat sink) lead frame structure in the market can not meet the requirements of high voltage isolation and high Heat dissipation of customer products.
Disclosure of Invention
Aiming at the problem that the lead frame structure in the prior art cannot meet the requirements of isolating high voltage and high heat dissipation, the invention provides the high heat dissipation lead frame structure with the heat dissipation channel, which has the advantages of simple structure, convenience in use, low failure rate, space saving, low cost and the like, can shorten the time of products on the market, reduces the investment risk, and has wide application value.
The invention is realized by the following technical scheme:
a high-heat-dissipation lead frame structure with a heat dissipation channel comprises a lead frame body; a plurality of lead frame structure unit groups with the same structure are horizontally arranged on the lead frame body; each lead frame structure unit group is horizontally provided with a first frame unit group and a second frame unit group which have the same structure; the first frame unit group comprises a plurality of frame units; each frame unit comprises two frame structures which are arranged on the same central line and have the same internal structure; one of the frame structures is arranged in a position rotated 180 degrees relative to the other frame structure;
one end of the frame structure is provided with a plurality of independent pins; the other end is provided with an inner pin and a wide pin; the wide pins are connected with the radiating fins; the wide pin is provided with a first locking hole and a second locking hole; and a second stress release groove is formed between the first locking hole and the second locking hole, so that the lead frame is subjected to concave molding under the condition that the size of the heat dissipation channel is enough.
Preferably, the structure of a plurality of independent inner pins is in a T shape, and locking holes are formed in the independent pins and the inner pins.
Preferably, the spacing between a plurality of the independent inner pins is 1.36 +/-0.025 mm.
Preferably, a base island is arranged on the frame structure, the edges of the base island are connected through a base island connecting rod, and the wide pin is connected to the base island.
Furthermore, a plurality of locking grooves are paved on the base island.
Furthermore, V-shaped grooves are further formed in the base island and distributed on the base island around the chip.
Furthermore, the depth of the V-shaped groove is 0.01-0.038 mm.
Preferably, the frame structures in the frame units are connected through the elongated process groove.
Preferably, the frame units are connected by IDF cross arrangement technology.
Preferably, the thickness of the lead frame material in the first and second sets of frame units is 0.203 mm.
Compared with the prior art, the invention has the following beneficial technical effects:
the invention provides a high-heat-dissipation lead frame structure of a heat dissipation channel, wherein a plurality of independent pins are arranged at one end of the lead frame structure; the other end is provided with an inner pin and a wide pin, and the wide pin is connected with the radiating fin; the wide pin is provided with a first locking hole and a second locking hole; the invention can obviously shorten the distance between the chip and the inner pin, reduce the length of a bonding wire, reduce the resistance, inductance and parasitic capacitance of the IC chip, and reduce the resistive loss and the switching loss inside the IC chip.
Furthermore, a plurality of the structures of the independent inner pins are in a T shape, and the plurality of independent pins and the inner pins are provided with locking holes, so that the bonding strength of the plastic package material and the inner pins is enhanced, the bad phenomenon that the plastic package body is not pulled out when the outer pins are molded is reduced, the plastic package body is prevented from being broken, and the product reliability is improved.
Further, be equipped with the base island on the frame construction, the border of base island is passed through the connection of base island connecting rod, wide pin is connected on the base island, the heat conduction passageway can be formed better in the design of being connected of pin and base island, reduce device calorific capacity, it is low to have the inefficiency, save space, advantages such as with low costs, and can shorten the time of selling on the market of product, reduce the investment risk, wide using value has, it is more favorable to giving off of the chip during operation heat that generates heat to link to each other to form the heat conduction passageway with the base island with wide pin, make the chip can work under the temperature of relative low, improve the product reliability.
Furthermore, still be equipped with a plurality of locking grooves and V type groove on the base island, V type groove distributes around the chip and sets up on the base island, plays the effect of keeping apart gluey, and locking groove and V type groove improve plastic envelope material and base island bonding strength, improve product reliability, and the form that fin and base island link to each other when the base island exposes has greatly promoted product heat dispersion.
Drawings
FIG. 1 is a schematic structural view of a multi-row lead frame body according to the present invention;
FIG. 2 is an enlarged view of portion A of FIG. 1;
FIG. 3 is a schematic structural diagram of a multi-row lead frame unit according to the present invention;
fig. 4 is a schematic diagram of a lead-out structure of a multi-row lead frame unit according to the present invention.
In the figure: 1-a lead frame body; 2-a first set of frame elements; 3-a second set of frame elements; 4-a frame unit; 5-a frame structure; 6-fabrication holes; 7-a first stress relief groove; 8-a second stress relief groove; 9-circular frame anti-reverse hole; 10-elliptical frame anti-reverse hole; 11-a technological long groove; 12-base island; 13-independent pins; 14-inner pins; 15-wide pins; 16-a first locking hole; 17-a second locking hole; 18-a base island link; 19-locking groove; 20-V type groove.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The invention is described in further detail below with reference to the accompanying drawings:
referring to fig. 1 and 2, in an embodiment of the present invention, a lead frame structure with a high heat dissipation capacity of a heat dissipation channel is provided, which has the advantages of simple structure, convenient use, low failure rate, space saving, low cost, etc., and can shorten the time to market of a product, reduce the investment risk, and have a wide application value.
Specifically, the high-heat-dissipation lead frame structure with the heat dissipation channel comprises a lead frame body 1; a plurality of lead frame structure unit groups with the same structure are horizontally arranged on the lead frame body 1; each lead frame structure unit group is horizontally provided with a first frame unit group 2 and a second frame unit group 3 which have the same structure; the first frame unit group 2 comprises a plurality of frame units 4; each frame unit 4 comprises two frame structures 5 which are arranged on the same central line and have the same internal structure; one of the frame structures 5 is positioned 180 deg. rotated with respect to the other frame structure 5, as shown in fig. 3;
as shown in fig. 4, one end of the frame structure 5 is provided with a plurality of independent pins 13; the other end is provided with an inner pin 14 and a wide pin 15; the wide pins 15 are connected with the radiating fins; the wide pin 15 is provided with a first locking hole 16 and a second locking hole 17; and a second stress relief groove 8 is formed between the first locking hole 16 and the second locking hole 17, so that the concave forming of the lead frame is realized under the condition that the size of the heat dissipation channel is enough.
Specifically, the plurality of independent inner pins 13 are all in a T shape, and locking holes are formed in the plurality of independent pins 13 and the inner pins 14; the bonding strength of the plastic package material and the inner pins is enhanced, the bad phenomenon that the plastic package body is not pulled out when the outer pins are molded is reduced, the plastic package body is prevented from being broken, and the product reliability is improved.
Specifically, the frame structure 5 is provided with the base island 12, the edge of the base island 12 is connected through the base island connecting rod 18, the wide pin 15 is connected to the base island 12, the connection design of the pin and the base island 12 can better form a heat conduction channel, the heat productivity of the device is reduced, the heat dissipation device has the advantages of low failure rate, space saving, low cost and the like, the time for marketing a product can be shortened, the investment risk is reduced, the heat dissipation device has wide application value, the heat conduction channel formed by connecting the wide pin and the base island 12 is more beneficial to the heat dissipation of the chip during working, the chip can work at relatively low temperature, and the reliability of the product is improved.
Specifically, the base island 12 is further provided with a plurality of locking grooves 19 and V-shaped grooves 20, and the V-shaped grooves 20 are distributed around the chip on the base island 12; the locking grooves 19 and the V-shaped grooves 20 improve the bonding strength of the plastic package material and the base island, improve the reliability of products, and greatly improve the heat dissipation performance of the products due to the mode that the radiating fins are connected with the base island while the base island is exposed.
Specifically, the frame structures 5 in the frame units 4 are connected through the elongated process groove 11; the frame units 4 are connected by the IDF cross arrangement technology.
The lead frame adopts a matrix design, so that the utilization rate of the frame copper material is improved.
In the invention, the number of the plurality of independent inner pins 13 is 6, the distance between the 6 independent inner pins 13 is preferably 1.36 +/-0.025 mm, the thickness of the lead frame material in the first frame unit group 2 and the second frame unit group 3 is preferably 0.203mm, and the depth of the V-shaped groove 20 is 0.01-0.038 mm.
The lead frame structure can obviously shorten the distance between the chip and the inner pin, reduce the length of a bonding wire, reduce the resistance, the inductance and the parasitic capacitance of the IC chip, reduce the resistive loss and the switching loss in the IC chip, better form a heat conduction channel by the connection design of the pin and the base island, reduce the heat productivity of a device, has the advantages of low failure rate, space saving, low cost and the like, can shorten the time of the product on the market, reduces the investment risk, and has wide application value.
The invention discloses a high-reliability multi-row (6-row) matrix lead frame with optimized packaging design, and relates to a single-carrier lead frame, wherein a locking groove 19 is formed in the edge of a carrier, a V-shaped groove 20 is formed in the edge of the carrier, and a locking hole is formed in the joint of a pin and the carrier. The frame is suitable for packaging with high reliability and high heat dissipation requirements.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the embodiments of the invention without departing from the spirit and scope of the invention, which is to be covered by the claims.
Claims (10)
1. A high heat dissipation lead frame structure of a heat dissipation channel is characterized by comprising a lead frame body (1); a plurality of lead frame structure unit groups with the same structure are horizontally arranged on the lead frame body (1); a first frame unit group (2) and a second frame unit group (3) which have the same structure are horizontally arranged on each lead frame structure unit group; the first frame unit group (2) comprises a plurality of frame units (4); each frame unit (4) comprises two frame structures (5) which are arranged on the same central line and have the same internal structure; one of the frame structures (5) is arranged in a position rotated by 180 degrees relative to the other frame structure (5);
one end of the frame structure (5) is provided with a plurality of independent pins (13); the other end is provided with an inner pin (14) and a wide pin (15); the wide pins (15) are connected with the radiating fins; the wide pin (15) is provided with a first locking hole (16) and a second locking hole (17); a second stress release groove (8) is formed between the first locking hole (16) and the second locking hole (17), so that the concave forming of the lead frame is realized under the condition that the size of the heat dissipation channel is enough.
2. The lead frame structure with high heat dissipation performance and heat dissipation channel as recited in claim 1, wherein the plurality of independent inner leads (13) are all T-shaped, and locking holes are formed on the plurality of independent inner leads (13) and the plurality of inner leads (14).
3. The heat dissipation channel high heat dissipation lead frame structure according to claim 1, wherein the pitch between a plurality of the individual inner leads (13) is 1.36 ± 0.025 mm.
4. The heat dissipation channel high heat dissipation lead frame structure according to claim 1, wherein the frame structure (5) is provided with a base island (12), edges of the base island (12) are connected through a base island connecting rod (18), and the wide pin (15) is connected on the base island (12).
5. The heat dissipation channel high heat dissipation lead frame structure according to claim 4, wherein a plurality of locking grooves (19) are laid on the base island (12).
6. The lead frame structure with high heat dissipation performance and heat dissipation channel according to claim 4, wherein the base island (12) is further provided with V-shaped grooves (20), and the V-shaped grooves (20) are distributed around the chip on the base island (12).
7. The lead frame structure with high heat dissipation performance and heat dissipation channel as recited in claim 6, wherein the depth of the V-shaped groove (20) is 0.01-0.038 mm.
8. The lead frame structure with high heat dissipation performance and heat dissipation channel as recited in claim 1, wherein the frame structures (5) in the frame units (4) are connected through an elongated processing groove (11).
9. The lead frame structure with high heat dissipation performance and heat dissipation channel as recited in claim 1, wherein the frame units (4) are connected by IDF cross-type arrangement technology.
10. The lead frame structure with high heat dissipation capacity of heat dissipation channel according to claim 1, wherein the thickness of the lead frame material in the first frame unit group (2) and the second frame unit group (3) is 0.203 mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110858284.8A CN113451251A (en) | 2021-07-28 | 2021-07-28 | High heat dissipation lead frame structure of heat dissipation channel |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110858284.8A CN113451251A (en) | 2021-07-28 | 2021-07-28 | High heat dissipation lead frame structure of heat dissipation channel |
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| Publication Number | Publication Date |
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| CN113451251A true CN113451251A (en) | 2021-09-28 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202110858284.8A Pending CN113451251A (en) | 2021-07-28 | 2021-07-28 | High heat dissipation lead frame structure of heat dissipation channel |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116613131A (en) * | 2023-06-02 | 2023-08-18 | 上海类比半导体技术有限公司 | Integrated circuit package frame |
-
2021
- 2021-07-28 CN CN202110858284.8A patent/CN113451251A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116613131A (en) * | 2023-06-02 | 2023-08-18 | 上海类比半导体技术有限公司 | Integrated circuit package frame |
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