CN113451159A - Novel QFN chip packaging process - Google Patents
Novel QFN chip packaging process Download PDFInfo
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- CN113451159A CN113451159A CN202110698448.5A CN202110698448A CN113451159A CN 113451159 A CN113451159 A CN 113451159A CN 202110698448 A CN202110698448 A CN 202110698448A CN 113451159 A CN113451159 A CN 113451159A
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- cutting
- sealing plate
- gluing
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- 238000012858 packaging process Methods 0.000 title claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims abstract description 72
- 230000007246 mechanism Effects 0.000 claims abstract description 70
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 43
- 238000003825 pressing Methods 0.000 claims abstract description 35
- 229910052751 metal Inorganic materials 0.000 claims abstract description 33
- 239000002184 metal Substances 0.000 claims abstract description 33
- 238000007599 discharging Methods 0.000 claims abstract description 31
- 239000004033 plastic Substances 0.000 claims abstract description 31
- 229920003023 plastic Polymers 0.000 claims abstract description 31
- 238000007789 sealing Methods 0.000 claims abstract description 29
- 238000004806 packaging method and process Methods 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 44
- 230000000903 blocking effect Effects 0.000 claims description 10
- 239000003292 glue Substances 0.000 claims description 6
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 5
- 239000000084 colloidal system Substances 0.000 claims description 5
- 238000000465 moulding Methods 0.000 claims description 5
- 229910052709 silver Inorganic materials 0.000 claims description 5
- 239000004332 silver Substances 0.000 claims description 5
- 239000007767 bonding agent Substances 0.000 claims description 3
- 230000006835 compression Effects 0.000 claims description 2
- 238000007906 compression Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 4
- 230000002035 prolonged effect Effects 0.000 abstract description 2
- 230000003068 static effect Effects 0.000 abstract description 2
- 238000001723 curing Methods 0.000 description 24
- 230000000694 effects Effects 0.000 description 5
- 238000005538 encapsulation Methods 0.000 description 5
- 230000009471 action Effects 0.000 description 3
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 238000010073 coating (rubber) Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/561—Batch processing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Containers And Plastic Fillers For Packaging (AREA)
Abstract
The invention discloses a novel QFN chip packaging process, which comprises the steps of pressing a chip frame structure, gluing a chip seat, curing a chip and cutting and curing a plastic sealing plate, and relates to the technical field of integrated circuit packaging, wherein a cutting mechanism is arranged on one side of a frame, the plastic sealing plate is firstly placed in a groove in a movable frame, a cutting cylinder driving shaft pushes the bottom end of a cutting knife rest to press the plastic sealing plate until the bottom end of the cutting knife rest enters the cutting groove, the plastic sealing plate is pressed by the cutting knife rest to enable the top surfaces of the plastic sealing plate and the chip to be attached, the plastic sealing plate is cut in a static pressure cutting mode, the situation that a metal frame is cut in the process of cutting a separating device by using a cutting knife can be avoided, the smoothness of the edge of a pin of a product is ensured, the service life of a blade can be effectively prolonged, and the translation of a discharging frame is driven by a translation track, the packaging process can be reduced, and the packaging efficiency of the chip is effectively improved.
Description
Technical Field
The invention relates to the technical field of integrated circuit packaging, in particular to a novel QFN chip packaging process.
Background
QFN is a quad or rectangular non-leaded package, wherein a large-area exposed bonding pad is arranged at the center of the bottom of the package for heat conduction, and a conductive bonding pad for realizing electrical connection is arranged around the periphery of the package surrounding the large bonding pad;
at present, when the QFN chip is packaged, a cutting knife is required to cut and separate devices, and the cutting knife can cut metal while cutting a plastic package material in the cutting process, so that the edge of a pin of a product is curled, the service life of a blade is shortened, and the quality of the product is influenced;
in order to solve the above problems, the present invention provides a novel QFN chip packaging process.
Disclosure of Invention
Technical problem to be solved
In order to solve the problems, the invention provides a novel QFN chip packaging process.
(II) technical scheme
In order to achieve the purpose, the invention is realized by the following technical scheme: a novel QFN chip packaging process comprises the following steps:
the method comprises the following steps that firstly, a metal sheet is placed in a feeding mechanism, the metal sheet is placed in a feeding groove in a fixed frame, two material blocking plates in the feeding groove limit the metal sheet, then two electric push rod driving shafts push a feeding frame to extend out of the feeding groove until the feeding frame is translated to the position right above a discharging frame, two electromagnets are electrified to attract each other, the material blocking plates are collected into a movable groove, and the metal sheet in the feeding groove falls into the discharging groove;
step two, starting a material pressing mechanism, driving a material pressing cylinder driving shaft to push a material pressing plate to move downwards, pressing the metal sheet by a bump at the bottom of the material pressing plate, pressing the metal sheet into a chip frame structure, and bonding a chip seat in the chip frame structure through a bonding agent;
thirdly, a linear motor in the translation track drives the discharging mechanism to translate towards the right side until the discharging frame translates to the position right below the gluing mechanism, the gluing mechanism is started, a first servo electric cylinder driving shaft pushes the gluing frame to move downwards until a gluing head at the bottom of the gluing frame is in contact with the top surface of the chip base, a second servo electric cylinder driving shaft pushes a piston plate to move downwards, and glue in the cavity is coated on the top surface of the chip base through the gluing head;
fourthly, the feeding frame is translated to the position right below the curing mechanism by the linear motor, the chip is placed on the top surface of the chip seat, the curing mechanism is started, one end of a three-driving shaft of the servo electric cylinder pushes the curing frame to descend to the position above the chip, the ultraviolet lamp is started, ultraviolet curing is carried out between the chip seat and the chip, then the feeding frame is translated to the position below the gluing mechanism, and gluing treatment is carried out on the top surface of the chip;
and fifthly, the linear motor translates the material placing frame to be right below the cutting mechanism, the plastic sealing plate is placed in a groove in the movable frame, the movable frame translates to be above the material placing frame, the cutting cylinder driving shaft pushes the cutting tool rest to descend, the bottom end of the cutting tool rest exerts pressure on the plastic sealing plate until the bottom end of the cutting tool rest enters the cutting groove, the cutting tool rest exerts pressure on the plastic sealing plate to enable the plastic sealing plate to be attached to the top surface of the chip, finally the material placing frame translates to be below the curing mechanism, ultraviolet curing processing is conducted on the plastic sealing plate and the chip, and QFN chip packaging processing is completed.
Preferably, in the first step, the two electromagnets are controlled by a PLC (programmable logic controller) program, and the direction of the current led into the electromagnets is changed after the feeding frame is translated to the position right above the feeding frame.
Preferably, in the second step, the bumps at the bottom of the pressure plate are matched with the molding grooves, and the metal sheet is subjected to compression in the molding grooves to form the chip frame structure.
Preferably, in the third step, silver colloid is filled in the cavity, the temperature in the cavity is controlled to be 20-25 ℃, the humidity is 30-60% RH, and the top end of the gluing head is in threaded connection with the bottom of the gluing frame.
Preferably, in the fourth step, the curing temperature is 130-135 ℃, and the curing treatment time is 30-35 min.
Preferably, in the fifth step, the output pressure of the cutting cylinder driving shaft is 160-.
Preferably, feed mechanism is including being located the left mount of translation track, the silo of going up has been seted up to the inside of mount, and the inside slip of going up the silo is provided with the work or material rest, logical groove has been seted up to the inside of going up the work or material rest, and the equal activity in both sides that leads to the inslot wall is provided with the striker plate, the inside both sides of mount all are provided with electric putter, and the one end of two electric putter drive shafts respectively with the both sides fixed connection of last work or material rest, the movable groove with striker plate looks adaptation is all seted up to the both sides that lead to the inslot wall, and the sliding surface connection of the inner wall in movable groove and striker plate, the inside wall in movable groove is provided with the electro-magnet with one side symmetry of striker plate.
Preferably, the cutting mechanism includes the cutting knife rest that is located the frame below, and the top of frame is provided with cuts the cylinder, and cuts the one end of cylinder drive shaft and run through frame and fixedly connected with activity post, and the top of cutting knife rest is provided with the spliced pole, the inside of spliced pole and the bottom sliding connection of activity post, and is provided with the spring between the bottom of activity post and the inside of spliced pole, and one side of frame inner wall slides and is provided with the adjustable shelf, and the inside of adjustable shelf is seted up flutedly.
(III) advantageous effects
The invention provides a novel QFN chip packaging process, which has the following beneficial effects compared with the prior art:
(1) the cutting mechanism is arranged on one side of the rack, the plastic sealing plate is firstly placed in a groove in the movable frame, the movable frame is translated to the upper side of the material placing frame, the cutting cylinder driving shaft pushes the cutting tool rest to descend, the bottom end of the cutting tool rest exerts pressure on the plastic sealing plate until the bottom end of the cutting tool rest enters the cutting groove, the cutting tool rest exerts pressure on the plastic sealing plate to enable the top surfaces of the plastic sealing plate and the chip to be attached, the plastic sealing plate is cut in a static pressure cutting mode, the situation that the metal frame is cut in the process of cutting a separating device by using a cutting tool can be avoided, the smoothness of the edge of a pin of a product is guaranteed, the service life of a blade can be effectively prolonged, the material placing frame is driven by the translation rail to translate on the base, the packaging process can be reduced, and the packaging efficiency of the chip is effectively improved;
(2) the feeding mechanism is arranged on one side of the translation track, the metal sheet is placed into the feeding mechanism, the metal sheet is arranged in a feeding groove in the fixed frame, two material baffle plates in the feeding groove limit the metal sheet, then two electric push rod driving shafts push the feeding frame to extend out of the feeding groove until the feeding frame is translated to be right above the discharging frame, the two electromagnets are electrified to attract each other, the striker plate is accommodated in the movable groove, the metal sheet in the feeding trough falls into the discharging trough, the feeding mechanism is adopted to realize the automatic feeding of the metal sheet, when the chip is packaged, only the metal sheet needs to be put into the feeding mechanism, after the last chip packaging processing is finished, the feeding frame automatically feeds the metal sheets into the discharging frame, so that the processing efficiency of the metal frame structure is effectively improved, and the packaging efficiency of the chip is improved;
(3) through mutually supporting between feed mechanism, swager structure, rubber coating mechanism, solidification mechanism and the cutting mechanism, accomplish the automatic encapsulation of chip and handle, compare in traditional a plurality of equipment and encapsulate the processing, adopt integration encapsulation equipment can reduce the area of encapsulation equipment, on the other hand also can improve the encapsulation efficiency of chip by a wide margin, improves the stability of chip in the packaging process, guarantees the encapsulation quality of chip, improves product quality.
Drawings
FIG. 1 is a schematic diagram of an integrated packaging apparatus structure according to the present invention;
FIG. 2 is a schematic view of the structure of the pressing mechanism and the discharging mechanism of the present invention;
FIG. 3 is a schematic view of the structure of the feeding mechanism of the present invention;
FIG. 4 is a top view of the loading frame structure of the present invention;
FIG. 5 is a cross-sectional view of the glue mechanism and curing mechanism configuration of the present invention;
FIG. 6 is a schematic view of a cutting mechanism according to the present invention;
in the figure: 10. a base; 20. a frame; 30. translating the rail; 40. a linear motor; 1. a discharging mechanism; 11. a material placing frame; 12. a discharging groove; 13. forming a groove; 14. cutting a groove; 2. a feeding mechanism; 21. a fixed mount; 22. a feeding trough; 23. a feeding frame; 24. a through groove; 25. a striker plate; 26. an electric push rod; 27. a movable groove; 28. an electromagnet; 3. a material pressing mechanism; 31. a material pressing cylinder; 32. a material pressing plate; 4. a gluing mechanism; 41. a gluing frame; 42. a first servo electric cylinder; 43. a chamber; 44. a piston plate; 45. a second servo electric cylinder; 46. gluing heads; 47. a rubber guide tube; 5. a curing mechanism; 51. curing the frame; 52. a third servo electric cylinder; 53. an ultraviolet lamp; 6. a cutting mechanism; 61. cutting the cutter frame; 62. a cutting cylinder; 63. a movable post; 64. connecting columns; 65. a spring; 66. a movable frame; 67. and (4) a groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-6, a novel QFN chip packaging process includes the following steps:
firstly, putting a metal sheet into a feeding mechanism 2, wherein the metal sheet is arranged in a feeding groove 22 in a fixed frame 21, two material blocking plates 25 in the feeding groove 22 limit the metal sheet, then two electric push rods 26 drive shafts push a feeding frame 23 to extend out of the feeding groove 22 until the feeding frame 23 is translated to the position right above a discharging frame 11, electrifying two electromagnets 28 to enable the two electromagnets 28 to attract each other, taking the material blocking plates 25 into a movable groove 27, and enabling the metal sheet in the feeding groove 22 to fall into the discharging groove 12;
step two, starting the pressing mechanism 3, driving a shaft of a pressing cylinder 31 to push a pressing plate 32 to move downwards, pressing the metal sheet by a bump at the bottom of the pressing plate 32, pressing the metal sheet into a chip frame structure, and bonding the chip seat in the chip frame structure through a bonding agent;
thirdly, the linear motor 40 in the translation track 30 drives the discharging mechanism 1 to translate towards the right side until the discharging frame 11 translates to the position right below the gluing mechanism 4, the gluing mechanism 4 is started, the first servo electric cylinder 42 drives the shaft to push the gluing frame 41 to move downwards until the gluing head 46 at the bottom of the gluing frame 41 is contacted with the top surface of the chip holder, the two second servo electric cylinders 45 drive the shaft to push the piston plate 44 to move downwards, and the glue material in the cavity 43 is coated on the top surface of the chip holder through the gluing head 46;
fourthly, the linear motor 40 translates the material placing frame 11 to be right below the curing mechanism 5, the chip is placed on the top surface of the chip seat, the curing mechanism 5 is started, one end of a driving shaft of the servo electric cylinder III 52 pushes the curing frame 51 to descend to the upper side of the chip, the ultraviolet lamp 53 is started, ultraviolet curing is carried out between the chip seat and the chip, then the material placing frame 11 is translated to be below the gluing mechanism 4, and gluing treatment is carried out on the top surface of the chip;
fifthly, the linear motor 40 translates the material placing frame 11 to be right below the cutting mechanism 6, the plastic sealing plate is placed in a groove 67 in the movable frame 66, the movable frame 66 translates to be above the material placing frame 11, the cutting cylinder 62 drives the cutting knife rest 61 to descend, the bottom end of the cutting knife rest 61 applies pressure to the plastic sealing plate until the bottom end of the cutting knife rest 61 enters the cutting groove 14, the cutting knife rest 61 applies pressure to the plastic sealing plate to enable the plastic sealing plate to be attached to the top surface of the chip, finally the material placing frame 11 translates to be below the curing mechanism 5, ultraviolet curing is conducted between the plastic sealing plate and the chip, and QFN chip packaging processing is completed.
The novel QFN chip packaging process adopts an integrated packaging device for processing, the integrated packaging device comprises a base 10 and a frame 20, the top of the base 10 is fixedly connected with the bottom of the frame 20, a translation rail 30 is arranged at the top of the base 10, linear motors 40 are arranged on two sides of the inner wall of the translation rail 30 respectively, the two linear motors 40 slide on the two linear rails respectively, the two linear rails are arranged on two sides inside the translation rail 30 respectively, a discharging frame 11 is driven by the linear motors 40 to move conveniently, a discharging mechanism 1 is arranged inside the translation rail 30 in a sliding manner, two sides of the discharging mechanism 1 are fixedly connected with one side of the translation rail 30 respectively opposite to the two linear motors 40, a feeding mechanism 2 is arranged on the left side of the translation rail 30, a pressing mechanism 3 is arranged on the left side inside the frame 20, and a gluing mechanism 4 is arranged on one side of the pressing mechanism 3, a curing mechanism 5 is arranged on one side of the gluing mechanism 4, and a cutting mechanism 6 is arranged on the right side inside the rack 20;
the discharging mechanism 1 comprises a discharging frame 11 positioned in the translation track 30, a discharging groove 12 is formed in the discharging frame 11, a forming groove 13 is formed in the discharging groove 12, the forming groove 13 is positioned at the bottom of the inner wall of the discharging groove 12, the metal sheet is pressed and formed through the forming groove 13, and a cutting groove 14 is formed in the top of the discharging frame 11;
the feeding mechanism 2 comprises a fixed frame 21 positioned on the left side of a translation track 30, a feeding groove 22 is arranged inside the fixed frame 21, a feeding frame 23 is arranged inside the feeding groove 22 in a sliding manner, the feeding frame 23 is positioned inside the feeding groove 22 in a sliding manner, the feeding frame 23 is driven by two electric push rods 26 to slide inside the feeding groove 22, so that the feeding frame 23 is translated to the upper side of the discharging frame 11, a through groove 24 is arranged inside the feeding frame 23, material blocking plates 25 are movably arranged on two sides of the inner wall of the through groove 24, electric push rods 26 are arranged on two sides inside the fixed frame 21, one end of a driving shaft of each of the two electric push rods 26 is fixedly connected with two sides of the feeding frame 23, movable grooves 27 matched with the material blocking plates 25 are arranged on two sides of the inner wall of the through groove 24, the inner wall of each movable groove 27 is connected with the surface of the material blocking plate 25 in a sliding manner, electromagnets 28 are symmetrically arranged on the inner side walls of the movable grooves 27 and one sides of the material blocking plates 25, the arrangement of the electromagnet 28 is utilized to realize the automatic in-and-out of the striker plate 25 in the movable groove 27, so that the metal sheets in the feeding frame 23 automatically fall into the discharging frame 11;
the pressing mechanism 3 comprises a pressing cylinder 31 positioned on the left side of the top of the rack 20, one end of a driving shaft of the pressing cylinder 31 penetrates through the rack 20 and is fixedly connected with a pressing plate 32, a convex block matched with the forming groove 13 is arranged at the bottom of the pressing plate 32, the driving shaft of the pressing cylinder 31 is used for pushing the pressing plate 32 to move downwards, and the convex block at the bottom of the pressing plate 32 is matched with the forming groove 13 to complete the press forming of the chip frame structure;
the gluing mechanism 4 comprises a gluing frame 41 positioned below the frame 20, a first servo electric cylinder 42 is arranged at the bottom of the frame 20, one end of a driving shaft of the first servo electric cylinder 42 is fixedly connected with the top of the gluing frame 41, a cavity 43 is arranged inside the gluing frame 41, a piston plate 44 is arranged inside the cavity 43 in a sliding mode, two servo electric cylinders 45 are arranged on two sides of the top of the gluing frame 41, one ends of driving shafts of the two servo electric cylinders 45 are respectively and fixedly connected with two sides of the top of the piston plate 44, a gluing head 46 communicated with the inside of the cavity 43 is arranged at the bottom of the gluing frame 41, a glue guide pipe 47 is arranged at the top of the frame 20, the melted silver colloid is sent into the cavity 43 through the glue guide pipe 47 and a hose, the silver colloid in the cavity 43 is pushed into the gluing head 46 through the piston plate 44, finally the silver colloid is evenly smeared on the surface of the chip base through the gluing head 46, and then ultraviolet light is emitted by an ultraviolet lamp 53 in the curing mechanism 5, ultraviolet light is utilized to carry out photocuring treatment between the chip and the chip holder, so that the rapid curing treatment between the chip holder and the chip is realized, and the bottom end of the rubber guide tube 47 is communicated with the inside of the cavity 43 through a hose;
the curing mechanism 5 comprises a curing frame 51 positioned below the rack 20, a third servo electric cylinder 52 is arranged at the bottom of the rack 20, one end of a driving shaft of the third servo electric cylinder 52 is fixedly connected with the top of the curing frame 51, an ultraviolet lamp 53 is arranged inside the curing frame 51, and the working temperature of the ultraviolet lamp 53 is set to be 130-135 ℃;
the cutting mechanism 6 comprises a cutting knife rest 61 positioned below the frame 20, the bottom end of the cutting knife rest 61 is firstly contacted with the top surface of the plastic sealing plate, then the bottom end of the cutting knife rest 61 is inserted into the cutting groove 14 to finish the cutting treatment of the plastic sealing plate, and after the cutting knife rest 61 is matched with the cutting groove 14, the damage to a chip frame structure caused by the cutting knife rest 61 in the cutting process can be effectively avoided, the quality of a product is ensured, the top of the frame 20 is provided with a cutting cylinder 62, one end of a driving shaft of the cutting cylinder 62 penetrates through the frame 20 and is fixedly connected with a movable column 63, the top of the cutting knife rest 61 is provided with a connecting column 64, the inside of the connecting column 64 is in sliding connection with the bottom end of the movable column 63, a spring 65 is arranged between the bottom end of the movable column 63 and the inside of the connecting column 64, and the movable column 63 is used for buffering, when avoiding cutting knife rest 61 and the contact of moulding shrouding, the too big plastics shrouding fracture that arouses of rigidity power, one side of frame 20 inner wall slides and is provided with adjustable shelf 66, and the inside of adjustable shelf 66 is seted up recess 67.
And those not described in detail in this specification are well within the skill of those in the art.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. A novel QFN chip packaging process is characterized in that: the method comprises the following steps:
the method comprises the steps that firstly, a metal sheet is placed into a feeding mechanism (2), the metal sheet is placed into a feeding groove (22) in a fixing frame (21), two material blocking plates (25) in the feeding groove (22) limit the metal sheet, then a driving shaft of two electric push rods (26) pushes a feeding frame (23) to extend out of the feeding groove (22) until the feeding frame (23) moves to the position right above a discharging frame (11), two electromagnets (28) are electrified, the two electromagnets (28) attract each other, the material blocking plates (25) are collected into a movable groove (27), and the metal sheet in the feeding groove (22) falls into a discharging groove (12);
step two, starting a material pressing mechanism (3), driving a driving shaft of a material pressing cylinder (31) to push a material pressing plate (32) to move downwards, pressing the metal sheet by a bump at the bottom of the material pressing plate (32), pressing the metal sheet into a chip frame structure, and bonding a chip base in the chip frame structure through a bonding agent;
thirdly, a linear motor (40) in the translation track (30) drives the discharging mechanism (1) to translate towards the right side until the discharging frame (11) translates to the position right below the gluing mechanism (4), the gluing mechanism (4) is started, a first servo electric cylinder (42) driving shaft pushes the gluing frame (41) to move downwards until a gluing head (46) at the bottom of the gluing frame (41) is contacted with the top surface of the chip seat, two second servo electric cylinders (45) driving shafts push a piston plate (44) to move downwards, and glue materials in the cavity (43) are coated on the top surface of the chip seat through the gluing head (46);
fourthly, the linear motor (40) translates the material placing frame (11) to be right below the curing mechanism (5), the chip is placed on the top surface of the chip seat, the curing mechanism (5) is started, one end of a driving shaft of the servo electric cylinder III (52) pushes the curing frame (51) to descend to the upper side of the chip, the ultraviolet lamp (53) is started, ultraviolet curing is carried out between the chip seat and the chip, then the material placing frame (11) is translated to be below the gluing mechanism (4), and gluing treatment is carried out on the top surface of the chip;
translating the material placing frame (11) to be under the cutting mechanism (6) by the linear motor (40), placing the plastic sealing plate into a groove (67) in the movable frame (66), translating the movable frame (66) to be above the material placing frame (11), pushing the cutting tool rest (61) to descend by a cutting cylinder (62) driving shaft, pressing the plastic sealing plate by the bottom end of the cutting tool rest (61) until the bottom end of the cutting tool rest (61) enters the cutting groove (14), pressing the plastic sealing plate by the cutting tool rest (61) to enable the plastic sealing plate to be attached to the top surface of the chip, translating the material placing frame (11) to be under the curing mechanism (5), and performing ultraviolet curing treatment between the plastic sealing plate and the chip to complete QFN chip packaging treatment.
2. The novel QFN chip packaging process of claim 1, wherein: in the first step, the two electromagnets (28) are controlled through PLC programming, and after the feeding frame (23) is translated to the position right above the feeding frame (11), the direction of current introduced into the electromagnets (28) is changed.
3. The novel QFN chip packaging process of claim 1, wherein: in the second step, the bumps at the bottom of the pressure plate (32) are matched with the molding grooves (13), and the metal sheet is subjected to compression in the molding grooves (13) to form a chip frame structure.
4. The novel QFN chip packaging process of claim 1, wherein: in the third step, silver colloid is filled in the cavity (43), the temperature in the cavity (43) is controlled at 20-25 ℃, the humidity is 30-60% RH, and the top end of the gluing head (46) is in threaded connection with the bottom of the gluing frame (41).
5. The novel QFN chip packaging process of claim 1, wherein: in the fourth step, the curing temperature is 130-135 ℃, and the curing treatment time is 30-35 min.
6. The novel QFN chip packaging process of claim 1, wherein: in the fifth step, the output pressure of the driving shaft of the cutting cylinder (62) is 160-180N, the curing temperature of the plastic sealing plate is 150-165 ℃, and the curing treatment time is 40-50 min.
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| CN202110698448.5A CN113451159B (en) | 2021-06-23 | 2021-06-23 | Novel QFN chip packaging process |
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| CN202110698448.5A CN113451159B (en) | 2021-06-23 | 2021-06-23 | Novel QFN chip packaging process |
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| CN113451159B CN113451159B (en) | 2022-07-12 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115083956A (en) * | 2022-05-20 | 2022-09-20 | 江苏爱矽半导体科技有限公司 | High-precision chip mounting method and device |
| CN117133697A (en) * | 2023-10-23 | 2023-11-28 | 江苏新智达新能源设备有限公司 | Assembly welding packaging production line and packaging process for discrete device DFN packaging |
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| CN115083956B (en) * | 2022-05-20 | 2023-05-26 | 江苏爱矽半导体科技有限公司 | High-precision chip loading method and equipment |
| CN117133697A (en) * | 2023-10-23 | 2023-11-28 | 江苏新智达新能源设备有限公司 | Assembly welding packaging production line and packaging process for discrete device DFN packaging |
| CN117133697B (en) * | 2023-10-23 | 2024-01-23 | 江苏新智达新能源设备有限公司 | Assembly welding packaging production line and packaging process for discrete device DFN packaging |
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| CN113451159B (en) | 2022-07-12 |
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