CN113447433A - Test fixture for metal layer binding force after chip manufacturing evaporation process - Google Patents
Test fixture for metal layer binding force after chip manufacturing evaporation process Download PDFInfo
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- CN113447433A CN113447433A CN202111024808.XA CN202111024808A CN113447433A CN 113447433 A CN113447433 A CN 113447433A CN 202111024808 A CN202111024808 A CN 202111024808A CN 113447433 A CN113447433 A CN 113447433A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N19/00—Investigating materials by mechanical methods
- G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/10—Measuring as part of the manufacturing process
- H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
Abstract
The invention relates to a test fixture for metal layer bonding force after chip manufacturing evaporation process, which comprises a blue film pasting mechanism for pasting a blue film, a wafer fixing mechanism for fixing a wafer, a wafer fixing disc and a blue film extrusion mechanism for extruding the blue film, a sliding part and an extrusion part, wherein the extrusion part is fixedly connected to the sliding part, a manipulator for tearing off the pasted blue film, and a central control unit connected with the blue film pasting mechanism, the wafer fixing mechanism, the blue film extrusion mechanism and the manipulator for controlling the device to operate. The waste of the wafer is avoided.
Description
Technical Field
The invention relates to the technical field of chip detection, in particular to a test fixture for metal layer bonding force after an evaporation process in chip manufacturing.
Background
Current discrete device chips typically employ multiple layers of metal as chip electrodes.
The metal layer technology on the market generally adopts an electron beam evaporation method, a sputtering method, an electrochemical plating method and a CVD method. Electron beam evaporation; sputtering; an electrochemical plating method; CVD methods are commonly used for the deposition of tungsten metal for integrated circuits.
In order to consider the cost and the relevant environmental regulations, the electron beam evaporation process is mostly adopted for protecting the device chip. Compared with the sputtering process, the energy of gas-phase metal reaching the surface of the wafer is smaller, the adhesion force of the metal film is relatively weaker, meanwhile, the ionization of the cavity in the sputtering process can clean the surface of the wafer, and the metal adhesion is also enhanced to a certain extent. Therefore, the risk of bonding failure of the metal layer in the electron beam evaporation process is relatively high, and the metal bonding force test is generally carried out in a matching way after the electron beam evaporation process is used.
In the prior art, a cutting method is usually adopted in the metal bonding force test, and the problems of direct scrapping of wafers and low detection precision caused by insufficient metal bonding force after the wafers are cut exist.
Disclosure of Invention
Therefore, the invention provides a test fixture for the metal layer bonding force after the chip manufacturing evaporation process, which is used for solving the problems that the wafer is directly scrapped and the detection precision is low due to insufficient metal bonding force after the wafer is cut in the prior art.
In order to achieve the above object, the present invention provides a testing fixture for metal layer bonding force after evaporation process in chip manufacturing, comprising,
the two sliding rails are arranged in parallel and used for loading the components in the test fixture;
the blue film pasting mechanism is a blue film fixing part used for loading blue films, the blue film fixing part is connected with one slide rail in a sliding manner, and a first driving motor is arranged in the blue film fixing part and used for driving the blue film pasting mechanism to move in the slide rail;
the wafer fixing mechanism is arranged between the two slide rails and used for fixing wafers, a plurality of wafer fixing discs are arranged in a single wafer fixing mechanism, and a plurality of vacuum suction holes used for sucking the wafers are respectively arranged in each wafer fixing disc;
the two ends of the blue film extrusion mechanism are respectively connected with the two slide rails and used for extruding the blue film, the blue film extrusion mechanism comprises a sliding part and an extrusion part, wherein the two ends of the sliding part are respectively connected with the two slide rails in a sliding way, and a second driving motor is arranged in the sliding part and used for driving the blue film extrusion mechanism to move in the slide rails; the extrusion part is arranged on the sliding part and is used for extruding the blue film;
the manipulator is arranged on the slide rail and is positioned on a slide rail different from the blue film pasting mechanism, and is used for tearing off the blue film pasted on the surface of the wafer fixing mechanism by the blue film extruding mechanism; the manipulator is connected with the slide rail in a sliding manner, and a tension sensor is arranged on the manipulator and used for detecting tearing tension of the manipulator when the manipulator tears the blue film; a third driving motor is arranged in the manipulator and used for driving the manipulator to move in the slide rail;
the central control unit is respectively connected with the blue film pasting mechanism, the wafer fixing mechanism, the blue film extrusion mechanism and the manipulator and is used for controlling a device to test the metal bonding force of the wafer;
the central control unit is preset with a standard tearing tension range F0, when the blue film pasting mechanism pastes a blue film on the surface of the wafer fixing mechanism and the blue film extruding mechanism finishes the extrusion of the blue film on the surface of the wafer fixing mechanism for a preset number of times, a test fixture tests the metal bonding force of the wafer in the wafer fixing disc, the central control unit controls the manipulator to pre-tear the blue film and controls the tension sensor to detect the actual tearing tension F of the manipulator during pre-tearing, after the detection is finished, the central control unit compares the actual tearing tension F with the parameters in the standard tearing tension range F0 preset by the central control unit and selects a corresponding adjusting mode according to the comparison result, if F belongs to F0, the central control unit judges that the tearing tension meets the standard and controls the manipulator to tear the blue film quickly to observe the state of the wafer, if the tearing tension does not meet the standard, the central control unit judges that the tearing tension does not meet the standard, calculates a tension difference value delta F, and after the calculation is finished, the central control unit adjusts the extrusion distance D0 or the extrusion times from the blue film extrusion mechanism to the wafer fixing mechanism according to the difference value.
Further, for the standard tearing tension range F0, F0 (Fmin, Fmax) is set, wherein Fmin is the minimum value of the standard tearing tension range, Fmax is the maximum value of the standard tearing tension range, when the central control unit compares the actual tearing tension F with the parameters in the standard tearing tension range F0 preset by the central control unit,
if F ∉ F0 is larger than F & ltmax & gt, the central control unit judges that the tearing tension does not meet the standard and calculates a tension difference value delta F, the set delta F = F-Fmax, and after the calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to reduce the extrusion times Y0, wherein Y0 represents the preset extrusion times;
the central control unit is further provided with a first tension difference delta F1, a second tension difference delta F2, a third tension difference delta F3, a first extrusion frequency adjusting coefficient alpha 1, a second extrusion frequency adjusting coefficient alpha 2, a third extrusion frequency adjusting coefficient alpha 3 and an extrusion frequency adjusting coefficient alpha 4, wherein delta F1 is smaller than delta F2 and smaller than delta F3, alpha 1 is smaller than alpha 2 and smaller than alpha 3 and smaller than alpha 4, and alpha 1+ alpha 2+ alpha 3+ alpha 4= 2;
if delta F is less than delta F1, the central control unit selects a first extrusion frequency adjusting coefficient alpha 1 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F is not less than delta F1 and less than delta F2, the central control unit selects a first extrusion frequency adjusting coefficient alpha 2 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F is not less than delta F2 and less than delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 3 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if the delta F is not less than the delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 4 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
when the central control unit selects and selects an ith extrusion time adjusting coefficient alpha i to adjust the extrusion times of the blue film extrusion mechanism aiming at the wafer fixing mechanism to corresponding values, i =1,2,3,4 is set, the central control unit records the adjusted extrusion times as Y, Y = Y0 multiplied by alpha i is set, and when the central control unit detects that the adjusted extrusion times Y is not an integer, the central control unit rounds downwards.
Further, the central control unit controls the manipulator to pre-tear the blue film and detects an actual tearing tension F, and after the detection is finished, the central control unit compares the actual tearing tension F with a standard tearing tension range F0;
if F ∉ F0 and F is less than Fmin, the central control unit judges that the tearing tension does not meet the standard, calculates the tension difference value delta F, sets delta F' = Fmin-F, and after calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to increase the extrusion times Y0, wherein Y0 represents the preset extrusion times;
if delta F' <deltaF 1, the central control unit selects a first extrusion frequency adjusting coefficient alpha 1 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F1 is more than or equal to delta F' <deltaF 2, the central control unit selects a first extrusion frequency adjusting coefficient alpha 2 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F2 is more than or equal to delta F' <deltaF 3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 3 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if the delta F' is not less than the delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 4 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
when the central control unit selects and selects an ith extrusion time adjusting coefficient alpha i to adjust the extrusion times of the blue film extrusion mechanism aiming at the wafer fixing mechanism to corresponding values, i =1,2,3,4 is set, the central control unit records the adjusted extrusion times as Y ', and sets Y = Y0 multiplied by alpha i, and when the central control unit detects that the adjusted extrusion times Y' are not integers, the central control unit rounds downwards.
Further, the central control unit is further provided with a maximum extrusion frequency value Ymax, when the central control unit determines that the extrusion frequency of the blue film extrusion mechanism to the wafer pasting mechanism needs to be adjusted to Y ', the central control unit compares the adjusted extrusion frequency Y ' with the maximum extrusion frequency value Ymax, if Y ' is greater than Ymax, the central control unit adjusts the extrusion frequency to Ymax and reduces the extrusion distance D0 of the blue film extrusion mechanism to the wafer pasting mechanism, and if Y ' is less than or equal to Ymax, the central control unit adjusts the extrusion frequency to Y '.
Further, when the central control unit judges that Y ' > Ymax, the central control unit calculates a difference value Delta Y of the extrusion times and selects a corresponding extrusion distance adjustment amount according to the difference value so as to reduce the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, and sets Delta Y ' = Y ' -Ymax;
the central control unit is further provided with a first extrusion frequency difference delta Y1, a second extrusion frequency difference delta Y2, a third extrusion frequency difference delta Y3, a first extrusion distance adjusting quantity delta D1, a second extrusion distance adjusting quantity delta D2, a third extrusion distance adjusting quantity delta D3 and a fourth extrusion distance adjusting quantity delta D4, wherein delta Y1 is smaller than delta Y2 is smaller than delta Y3, and delta D1 is smaller than delta D2 is smaller than delta D3 is smaller than delta D4;
if delta Y' <deltaY 1, the central control unit selects a first extrusion distance adjusting quantity delta D1 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y1 and less than delta Y2, the central control unit selects a first extrusion distance adjusting quantity delta D2 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y2 and less than delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D3 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y' is not less than the delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D4 to adjust the initial extrusion distance of the blue film extrusion mechanism;
and when the central control unit selects the ith extrusion distance adjustment amount to reduce the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, setting i =1,2,3 and 4, and setting D '= D0-delta Di by the central control unit recording the adjusted extrusion distance as D'.
Further, the central control unit is further provided with a minimum extrusion distance Dmin, when the central control unit finishes adjusting the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism to D ', if D' < Dmin, the central control unit judges that the blue film extrusion mechanism is damaged and sends out a warning signal, and if D '> is greater than or equal to Dmin, the central control unit adjusts the extrusion distance to D'.
Further, the central control unit is further provided with a minimum extrusion frequency value Ymin, when the central control unit judges that the extrusion frequency of the blue film extrusion mechanism to the wafer pasting mechanism needs to be adjusted to Y, the central control unit compares the adjusted extrusion frequency Y with the minimum extrusion frequency value, if Y is less than Ymin, the central control unit adjusts the extrusion frequency to Ymin and increases the extrusion distance D0, and if Y 'is more than or equal to Ymin, the central control unit adjusts the extrusion frequency to Y'.
Further, when the central control unit judges that Y is less than Ymin and adjusts the extrusion times to Ymin, the central control unit calculates the extrusion time difference delta Y and selects the corresponding extrusion distance adjustment amount according to the difference to increase the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, and sets delta Y' = Ymin-Y;
if delta Y is less than delta Y1, the central control unit selects a first extrusion distance adjusting quantity delta D1 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y1 and less than delta Y2, the central control unit selects a first extrusion distance adjusting quantity delta D2 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y2 and less than delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D3 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is not less than or equal to the delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D4 to adjust the initial extrusion distance of the blue film extrusion mechanism;
and when the central control unit selects the ith extrusion distance adjustment amount to increase the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, the central control unit records the adjusted extrusion distance as D, and sets D = D0 +. DELTA.Di, i =1,2,3, 4.
Further, the central control unit is further provided with a maximum extrusion distance value Dmax, when the central control unit finishes adjusting the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism to D, if D is larger than Dmax, the central control unit judges that the size of the wafer fixing mechanism is too large and sends a replacement signal, and if D is smaller than or equal to Dmax, the central control unit adjusts the extrusion distance to a corresponding value.
Further, the central control unit is further provided with a maximum adjustment number N0, when the central control unit completes adjusting the extrusion number or the extrusion distance, the central control unit records the adjustment number as N, when the central control unit completes adjusting the extrusion number or the extrusion distance once, the central control unit records the adjustment number as N =1, when the central control unit completes adjusting the ith time, i =1,2,3,.. once, N is set, the central control unit sets N = i, and when the central control unit determines N = N0 and F ∉ F0, the central control unit re-determines the preset extrusion distance D0 or the preset extrusion number Y0.
Compared with the prior art, the invention has the advantages that the central control unit is preset with a standard tearing tension range F0, when the metal bonding force is tested, the central control unit controls the mechanical arm to pre-tear the blue film and detects the actual tearing tension F, after the detection is finished, the central control unit compares the actual tearing tension F with the standard tearing tension range F0, selects a corresponding adjusting mode according to the comparison result, compares the tearing tension, the pulling force of tearing can be accurately controlled, the accuracy of the metal bonding force test can be ensured, the detection precision is improved, meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, and the wafer with insufficient metal bonding force can be found in time and reworked, so that the waste of the wafer is effectively avoided.
Furthermore, the actual tension F is compared with the standard tearing tension range F0 through the central control unit, if F is larger than Fmax, the central control unit judges that the tearing tension does not meet the standard and calculates the tension difference value delta F, after the calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to reduce the extrusion times Y0, the tearing tension can be accurately controlled by reducing the extrusion times, the accuracy of the metal bonding force test can be ensured, the detection precision is improved, meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be further found in time and reworked, and meanwhile, the waste of the wafer is further avoided.
Furthermore, the actual tension F is compared with the standard tearing tension range F0 through the central control unit, if F is smaller than Fmin, the central control unit judges that the tearing tension does not meet the standard and calculates the tension difference value delta F', after the calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to increase the extrusion frequency Y0, and the tearing tension can be accurately controlled by increasing the extrusion frequency, so that the accuracy of the metal bonding force test can be ensured, the detection precision is improved, meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be further found in time and reworked, and meanwhile, the waste of the wafer is further avoided.
Furthermore, the central control unit is also provided with a maximum extrusion frequency value, when the central control unit completes the adjustment of the extrusion frequency value, the central control unit compares the adjusted extrusion frequency value with the maximum extrusion frequency value, the controlled tearing tension can be accurately set by setting the maximum extrusion frequency value, the accuracy of the metal bonding force test can be ensured by controlling the tearing tension, the detection precision is improved, meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be further found in time and reworked, and the waste of the wafer is further avoided.
Furthermore, when the central control unit judges that the extrusion times are adjusted to the maximum value, the central control unit calculates the difference value of the extrusion times and selects the corresponding extrusion distance adjustment amount according to the difference value to reduce the distance, the central control unit increases the tearing tension by reducing the extrusion distance, and can accurately control the tearing tension by increasing the tearing tension, so that the accuracy of the metal bonding force test can be ensured and the detection precision is improved.
Furthermore, the central control unit is further provided with an extrusion distance minimum value, when the central control unit completes the adjustment of the extrusion distance, the adjusted extrusion distance is compared with the extrusion distance minimum value by the central control unit, the control tearing tension can be accurately set by setting the extrusion distance minimum value, the accuracy of the metal bonding force test can be ensured by the control tearing tension, the detection precision is improved, meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be further found in time and reworked, and the waste of the wafer is further avoided.
Furthermore, the central control unit is also provided with the maximum adjusting times, the controlled tearing tension can be accurately controlled by setting the maximum adjusting times, the accuracy of the metal bonding force test can be ensured by controlling the tearing tension, the detection precision is improved, and meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be further found in time and reworked, and the waste of the wafer is further avoided.
Drawings
Fig. 1 is a schematic structural diagram of a test fixture for metal layer bonding force after an evaporation process in chip manufacturing according to the present invention.
Reference numerals: the device comprises a 1-blue film pasting mechanism, a 2-wafer fixing mechanism, a 3-sliding rail, a 4-blue film extruding mechanism, a 5-mechanical arm and a 201-wafer fixing plate.
Detailed Description
In order that the objects and advantages of the invention will be more clearly understood, the invention is further described below with reference to examples; it should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Preferred embodiments of the present invention are described below with reference to the accompanying drawings. It should be understood by those skilled in the art that these embodiments are only for explaining the technical principle of the present invention, and do not limit the scope of the present invention.
It should be noted that in the description of the present invention, the terms of direction or positional relationship indicated by the terms "upper", "lower", "left", "right", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, which are only for convenience of description, and do not indicate or imply that the device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, it should be noted that, in the description of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
Referring to fig. 1, a schematic structural diagram of a testing fixture for metal layer bonding force after evaporation process in chip manufacturing according to an embodiment of the present invention includes,
the two slide rails 3 are arranged in parallel and used for loading components in the test fixture;
the blue film sticking mechanism 1 is a blue film fixing part for loading a blue film, the blue film fixing part is connected with one slide rail 3 in a sliding manner, and a first driving motor (not shown in the figure) is arranged in the blue film fixing part and used for driving the blue film sticking mechanism to move in the slide rail;
the wafer fixing mechanism 2 is arranged between the two slide rails and used for fixing wafers, a plurality of wafer fixing discs 201 are arranged in a single wafer fixing mechanism, and a plurality of vacuum suction holes used for sucking the wafers are respectively arranged in each wafer fixing disc 201;
the two ends of the blue film extrusion mechanism 4 are respectively connected with the two slide rails 3 and used for extruding the blue film, the blue film extrusion mechanism comprises a sliding part and an extrusion part, wherein the two ends of the sliding part are respectively connected with the two slide rails 3 in a sliding way, and a second driving motor (not shown in the figure) is arranged in the sliding part and used for driving the blue film extrusion mechanism to move in the slide rails; the extrusion part is arranged on the sliding part and is used for extruding the blue film;
the mechanical arm 5 is arranged on the slide rail and is positioned on the slide rail 3 different from the blue film pasting mechanism, and is used for tearing off the blue film pasted on the surface of the wafer fixing mechanism by the blue film extruding mechanism; the manipulator is connected with the slide rail in a sliding manner, and a tension sensor (not shown in the figure) is arranged on the manipulator and used for detecting the tearing tension of the manipulator when the manipulator tears the blue film; a third driving motor (not shown in the figure) is arranged in the manipulator and is used for driving the manipulator to move in the slide rail;
a central control unit (not shown in the figure) which is respectively connected with the blue film pasting mechanism, the wafer fixing mechanism, the blue film extrusion mechanism and the manipulator and is used for controlling a device to carry out metal bonding force test on the wafer;
the central control unit is preset with a standard tearing tension range F0, when the blue film pasting mechanism pastes a blue film on the surface of the wafer fixing mechanism and the blue film extruding mechanism finishes the extrusion of the blue film on the surface of the wafer fixing mechanism for a preset number of times, a test fixture tests the metal bonding force of the wafer in the wafer fixing disc, the central control unit controls the manipulator to pre-tear the blue film and controls the tension sensor to detect the actual tearing tension F of the manipulator during pre-tearing, after the detection is finished, the central control unit compares the actual tearing tension F with the parameters in the standard tearing tension range F0 preset by the central control unit and selects a corresponding adjusting mode according to the comparison result, if F belongs to F0, the central control unit judges that the tearing tension meets the standard and controls the manipulator to tear the blue film quickly to observe the state of the wafer, if the tearing tension does not meet the standard, the central control unit judges that the tearing tension does not meet the standard, calculates a tension difference value delta F, and after the calculation is finished, the central control unit adjusts the extrusion distance D0 or the extrusion times from the blue film extrusion mechanism to the wafer fixing mechanism according to the difference value.
Specifically, for the standard tearing tension range F0, F0 (Fmin, Fmax) is set, where Fmin is the minimum value of the standard tearing tension range, Fmax is the maximum value of the standard tearing tension range, when the central control unit compares the actual tearing tension F with the parameters in the standard tearing tension range F0 preset by the central control unit,
if F ∉ F0 is larger than F & ltmax & gt, the central control unit judges that the tearing tension does not meet the standard and calculates a tension difference value delta F, the set delta F = F-Fmax, and after the calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to reduce the extrusion times Y0, wherein Y0 represents the preset extrusion times;
the central control unit is further provided with a first tension difference delta F1, a second tension difference delta F2, a third tension difference delta F3, a first extrusion frequency adjusting coefficient alpha 1, a second extrusion frequency adjusting coefficient alpha 2, a third extrusion frequency adjusting coefficient alpha 3 and an extrusion frequency adjusting coefficient alpha 4, wherein delta F1 is smaller than delta F2 and smaller than delta F3, alpha 1 is smaller than alpha 2 and smaller than alpha 3 and smaller than alpha 4, and alpha 1+ alpha 2+ alpha 3+ alpha 4= 2;
if delta F is less than delta F1, the central control unit selects a first extrusion frequency adjusting coefficient alpha 1 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F is not less than delta F1 and less than delta F2, the central control unit selects a first extrusion frequency adjusting coefficient alpha 2 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F is not less than delta F2 and less than delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 3 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if the delta F is not less than the delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 4 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
when the central control unit selects and selects an ith extrusion time adjusting coefficient alpha i to adjust the extrusion times of the blue film extrusion mechanism aiming at the wafer fixing mechanism to corresponding values, i =1,2,3,4 is set, the central control unit records the adjusted extrusion times as Y, Y = Y0 multiplied by alpha i is set, and when the central control unit detects that the adjusted extrusion times Y is not an integer, the central control unit rounds downwards.
Specifically, the actual pulling force F is compared with the standard pulling force range F0 through the central control unit, if F is larger than Fmax, the central control unit judges that the pulling force does not meet the standard and calculates the pulling force difference value delta F, after the calculation is completed, the central control unit selects a corresponding adjusting coefficient according to the difference value to reduce the extrusion times Y0, the pulling force can be accurately controlled by reducing the extrusion times, the accuracy of the metal bonding force test can be ensured, the detection precision is improved, meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be found in time and reworked, and the waste of the wafer is avoided.
Specifically, the central control unit controls the manipulator to pre-tear the blue film and detects an actual tearing tension F, and after the detection is finished, the central control unit compares the actual tearing tension F with a standard tearing tension range F0;
if F ∉ F0 and F is less than Fmin, the central control unit judges that the tearing tension does not meet the standard, calculates the tension difference value delta F, sets delta F' = Fmin-F, and after calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to increase the extrusion times Y0, wherein Y0 represents the preset extrusion times;
if delta F' <deltaF 1, the central control unit selects a first extrusion frequency adjusting coefficient alpha 1 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F1 is more than or equal to delta F' <deltaF 2, the central control unit selects a first extrusion frequency adjusting coefficient alpha 2 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F2 is more than or equal to delta F' <deltaF 3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 3 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if the delta F' is not less than the delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 4 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
when the central control unit selects and selects an ith extrusion time adjusting coefficient alpha i to adjust the extrusion times of the blue film extrusion mechanism aiming at the wafer fixing mechanism to corresponding values, i =1,2,3,4 is set, the central control unit records the adjusted extrusion times as Y ', and sets Y = Y0 multiplied by alpha i, and when the central control unit detects that the adjusted extrusion times Y' are not integers, the central control unit rounds downwards.
Specifically, the actual pulling force F is compared with the standard pulling force range F0 through the central control unit, if F is smaller than Fmin, the central control unit judges that the pulling force does not meet the standard and calculates the pulling force difference value delta F', after calculation is completed, the central control unit selects a corresponding adjusting coefficient according to the difference value to increase the extrusion frequency Y0, the pulling force can be accurately controlled through increasing the extrusion frequency, the accuracy of metal bonding force testing can be guaranteed, the detection precision is improved, meanwhile, by using the testing jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be found in time and reworked, and the waste of the wafer is avoided.
Specifically, the central control unit is further provided with a maximum extrusion number value Ymax, when the central control unit judges that the extrusion number of the blue film extrusion mechanism to the wafer pasting mechanism needs to be adjusted to Y ', the central control unit compares the adjusted extrusion number Y ' with the maximum extrusion number value Ymax, if Y ' is greater than Ymax, the central control unit adjusts the extrusion number to Ymax and reduces the extrusion distance D0 of the blue film extrusion mechanism to the wafer pasting mechanism, and if Y ' is less than or equal to Ymax, the central control unit adjusts the extrusion number to Y '.
Particularly, well accuse unit still is provided with the extrusion number of times maximum value, works as well accuse unit accomplishes the regulation back to the extrusion number of times, well accuse unit is compared the extrusion number of times after adjusting with the extrusion number of times maximum value, through setting up the biggest extrusion number of times, can be accurate tear the pulling force to the accuse, through tearing the pulling force to the accuse, can guarantee the accuracy of metal cohesion test, improved detection precision, simultaneously, through using the test smelting tool that provides of the invention, need not to cut the wafer, can in time discover the wafer that metal cohesion is not enough and do over again, avoided the waste of wafer.
Specifically, when the central control unit judges that Y ' = Ymax, the central control unit calculates a difference value Delta Y of extrusion times and selects a corresponding extrusion distance adjustment amount according to the difference value to reduce the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, and sets Delta Y ' = Y ' -Ymax;
the central control unit is further provided with a first extrusion frequency difference delta Y1, a second extrusion frequency difference delta Y2, a third extrusion frequency difference delta Y3, a first extrusion distance adjusting quantity delta D1, a second extrusion distance adjusting quantity delta D2, a third extrusion distance adjusting quantity delta D3 and a fourth extrusion distance adjusting quantity delta D4, wherein delta Y1 is smaller than delta Y2 is smaller than delta Y3, and delta D1 is smaller than delta D2 is smaller than delta D3 is smaller than delta D4;
if delta Y' <deltaY 1, the central control unit selects a first extrusion distance adjusting quantity delta D1 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y1 and less than delta Y2, the central control unit selects a first extrusion distance adjusting quantity delta D2 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y2 and less than delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D3 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y' is not less than the delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D4 to adjust the initial extrusion distance of the blue film extrusion mechanism;
and when the central control unit selects the ith extrusion distance adjustment amount to reduce the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, setting i =1,2,3 and 4, and setting D '= D0-delta Di by the central control unit recording the adjusted extrusion distance as D'.
Particularly, when the central control unit judges that the extrusion times are adjusted to the maximum value, the central control unit calculates the difference value of the extrusion times and selects the corresponding extrusion distance adjustment amount according to the difference value so as to reduce the distance, the central control unit increases the tearing tension by reducing the extrusion distance, the tearing tension can be accurately controlled by increasing the tearing tension, the accuracy of the metal bonding force test can be ensured by controlling the tearing tension, the detection precision is improved, meanwhile, by using the test jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be found in time and reworked, and the waste of the wafer is avoided.
Specifically, the central control unit is further provided with a minimum extrusion distance Dmin, when the central control unit completes adjustment of the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism to D ', if D' < Dmin, the central control unit judges that the blue film extrusion mechanism is damaged and sends out a warning signal, and if D '≧ Dmin, the central control unit adjusts the extrusion distance to D'.
Particularly, well accuse unit still is provided with the extrusion distance minimum, works as well accuse unit accomplishes the regulation back to the extrusion distance, well accuse unit is compared extrusion distance after will adjusting and is extruded the distance minimum, through setting up extrusion distance minimum, can be accurate tear the pulling force to the accuse, through tearing the pulling force to the accuse, can guarantee the accuracy of metal cohesion test, improved detection precision, simultaneously, through using the test smelting tool that provides of the invention, need not to cut the wafer, can in time discover the wafer that metal cohesion is not enough and do over again, avoided the waste of wafer.
Specifically, the central control unit is further provided with a minimum extrusion frequency value Ymin, when the central control unit judges that the extrusion frequency of the blue film extrusion mechanism to the wafer pasting mechanism needs to be adjusted to Y, the central control unit compares the adjusted extrusion frequency Y with the minimum extrusion frequency value, if Y is smaller than Ymin, the central control unit adjusts the extrusion frequency to Ymin and increases the extrusion distance D0 of the blue film extrusion mechanism to the wafer pasting mechanism, and if Y 'is larger than or equal to Ymin, the central control unit adjusts the extrusion frequency to Y'.
Specifically, when the central control unit judges that Y is less than Ymin and adjusts the extrusion times to Ymin, the central control unit calculates an extrusion time difference value delta Y and selects a corresponding extrusion distance adjustment amount according to the difference value so as to increase the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, and delta Y' = Ymin-Y is set;
if delta Y is less than delta Y1, the central control unit selects a first extrusion distance adjusting quantity delta D1 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y1 and less than delta Y2, the central control unit selects a first extrusion distance adjusting quantity delta D2 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y2 and less than delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D3 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is not less than or equal to the delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D4 to adjust the initial extrusion distance of the blue film extrusion mechanism;
and when the central control unit selects the ith extrusion distance adjustment amount to increase the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, the central control unit records the adjusted extrusion distance as D, and sets D = D0 +. DELTA.Di, i =1,2,3, 4.
Specifically, the central control unit is further provided with a maximum extrusion distance value Dmax, when the central control unit finishes adjusting the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism to D, if D is larger than Dmax, the central control unit judges that the size of the wafer fixing mechanism is too large and sends a replacement signal, and if D is smaller than or equal to Dmax, the central control unit adjusts the extrusion distance to a corresponding value.
Specifically, the central control unit is further provided with a maximum adjustment number N0, when the central control unit completes adjustment of the pressing number or the pressing distance of the blue film pressing mechanism, the central control unit records the adjustment number as N, when the central control unit completes one adjustment of the pressing number or the pressing distance, the central control unit records the adjustment number as N =1, when the central control unit completes the ith adjustment, i =1,2,3,.
Particularly, the central control unit is further provided with the maximum adjusting times, the controlled tearing tension can be accurately set through the maximum adjusting times, the accuracy of metal bonding force testing can be guaranteed through the controlled tearing tension, the detection precision is improved, meanwhile, by using the testing jig provided by the invention, the wafer does not need to be cut, the wafer with insufficient metal bonding force can be found in time and reworked, and the waste of the wafer is avoided.
Specifically, when metal bonding force detection is carried out, a wafer to be detected is placed on the wafer fixing mechanism 2, the central control unit is used for fixing the wafer through the vacuum suction holes, after fixing is completed, the central control unit starts the first driving motor to drive the blue film pasting mechanism 2 to slide in the sliding rail 3 to paste the blue film on the wafer fixing mechanism, after pasting is completed, the central control unit starts the second driving motor to drive the blue film extruding mechanism to slide in the sliding rail 3 to extrude the blue film, and after extruding is completed, the central control unit drives the mechanical arm to slide in the sliding rail 3 to tear the blue film and observe the state of the wafer to judge whether the wafer meets the detection standard or not.
So far, the technical solutions of the present invention have been described in connection with the preferred embodiments shown in the drawings, but it is easily understood by those skilled in the art that the scope of the present invention is obviously not limited to these specific embodiments. Equivalent changes or substitutions of related technical features can be made by those skilled in the art without departing from the principle of the invention, and the technical scheme after the changes or substitutions can fall into the protection scope of the invention.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention; various modifications and alterations to this invention will become apparent to those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a test fixture that is used for metal level cohesion behind chip manufacturing evaporation process which characterized in that includes:
the two sliding rails are arranged in parallel and used for loading the components in the test fixture;
the blue film pasting mechanism is a blue film fixing part used for loading blue films, the blue film fixing part is connected with one slide rail in a sliding manner, and a first driving motor is arranged in the blue film fixing part and used for driving the blue film pasting mechanism to move in the slide rail;
the wafer fixing mechanism is arranged between the two slide rails and used for fixing wafers, a plurality of wafer fixing discs are arranged in a single wafer fixing mechanism, and a plurality of vacuum suction holes used for sucking the wafers are respectively arranged in each wafer fixing disc;
the two ends of the blue film extrusion mechanism are respectively connected with the two slide rails and used for extruding the blue film, the blue film extrusion mechanism comprises a sliding part and an extrusion part, wherein the two ends of the sliding part are respectively connected with the two slide rails in a sliding way, and a second driving motor is arranged in the sliding part and used for driving the blue film extrusion mechanism to move in the slide rails; the extrusion part is arranged on the sliding part and is used for extruding the blue film;
the manipulator is arranged on the slide rail and is positioned on a slide rail different from the blue film pasting mechanism, and is used for tearing off the blue film pasted on the surface of the wafer fixing mechanism by the blue film extruding mechanism; the manipulator is connected with the slide rail in a sliding manner, and a tension sensor is arranged on the manipulator and used for detecting tearing tension of the manipulator when the manipulator tears the blue film; a third driving motor is arranged in the manipulator and used for driving the manipulator to move in the slide rail;
the central control unit is respectively connected with the blue film pasting mechanism, the wafer fixing mechanism, the blue film extrusion mechanism and the manipulator and is used for controlling a device to test the metal bonding force of the wafer;
the central control unit is preset with a standard tearing tension range F0, when the blue film pasting mechanism pastes a blue film on the surface of the wafer fixing mechanism and the blue film extruding mechanism finishes the extrusion of the blue film on the surface of the wafer fixing mechanism for a preset number of times, a test fixture tests the metal bonding force of the wafer in the wafer fixing disc, the central control unit controls the manipulator to pre-tear the blue film and controls the tension sensor to detect the actual tearing tension F of the manipulator during pre-tearing, after the detection is finished, the central control unit compares the actual tearing tension F with the parameters in the standard tearing tension range F0 preset by the central control unit and selects a corresponding adjusting mode according to the comparison result, if F belongs to F0, the central control unit judges that the tearing tension meets the standard and controls the manipulator to tear the blue film quickly to observe the state of the wafer, if the tearing tension does not meet the standard, the central control unit judges that the tearing tension does not meet the standard, calculates a tension difference value delta F, and after the calculation is finished, the central control unit adjusts the extrusion distance D0 or the extrusion times from the blue film extrusion mechanism to the wafer fixing mechanism according to the difference value.
2. The testing fixture for bonding force of metal layer after evaporation process in chip manufacturing according to claim 1, wherein F0 (Fmin, Fmax) is set for the standard tearing tension range F0, wherein Fmin is the minimum value of the standard tearing tension range, Fmax is the maximum value of the standard tearing tension range, when the central control unit compares the actual tearing tension F with the parameters in the standard tearing tension range F0 preset by the central control unit,
if F ∉ F0 is larger than F & ltmax & gt, the central control unit judges that the tearing tension does not meet the standard and calculates a tension difference value delta F, the set delta F = F-Fmax, and after the calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to reduce the extrusion times Y0, wherein Y0 represents the preset extrusion times;
the central control unit is further provided with a first tension difference delta F1, a second tension difference delta F2, a third tension difference delta F3, a first extrusion frequency adjusting coefficient alpha 1, a second extrusion frequency adjusting coefficient alpha 2, a third extrusion frequency adjusting coefficient alpha 3 and an extrusion frequency adjusting coefficient alpha 4, wherein delta F1 is smaller than delta F2 and smaller than delta F3, alpha 1 is smaller than alpha 2 and smaller than alpha 3 and smaller than alpha 4, and alpha 1+ alpha 2+ alpha 3+ alpha 4= 2;
if delta F is less than delta F1, the central control unit selects a first extrusion frequency adjusting coefficient alpha 1 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F is not less than delta F1 and less than delta F2, the central control unit selects a first extrusion frequency adjusting coefficient alpha 2 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F is not less than delta F2 and less than delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 3 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if the delta F is not less than the delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 4 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
when the central control unit selects and selects an ith extrusion time adjusting coefficient alpha i to adjust the extrusion times of the blue film extrusion mechanism aiming at the wafer fixing mechanism to corresponding values, i =1,2,3,4 is set, the central control unit records the adjusted extrusion times as Y, Y = Y0 multiplied by alpha i is set, and when the central control unit detects that the adjusted extrusion times Y is not an integer, the central control unit rounds downwards.
3. The jig for testing the bonding force of the metal layer after the chip manufacturing evaporation process as claimed in claim 2, wherein the central control unit controls the manipulator to pre-tear the blue film and detect an actual tearing tension F, and after the detection is completed, the central control unit compares the actual tearing tension F with a standard tearing tension range F0;
if F ∉ F0 and F is less than Fmin, the central control unit judges that the tearing tension does not meet the standard, calculates the tension difference value delta F, sets delta F' = Fmin-F, and after calculation is finished, the central control unit selects a corresponding adjusting coefficient according to the difference value to increase the extrusion times Y0, wherein Y0 represents the preset extrusion times;
if delta F' <deltaF 1, the central control unit selects a first extrusion frequency adjusting coefficient alpha 1 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F1 is more than or equal to delta F' <deltaF 2, the central control unit selects a first extrusion frequency adjusting coefficient alpha 2 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if delta F2 is more than or equal to delta F' <deltaF 3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 3 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
if the delta F' is not less than the delta F3, the central control unit selects a first extrusion frequency adjusting coefficient alpha 4 to adjust the extrusion frequency of the blue film extrusion mechanism aiming at the wafer fixing mechanism to a corresponding value;
when the central control unit selects and selects an ith extrusion time adjusting coefficient alpha i to adjust the extrusion times of the blue film extrusion mechanism aiming at the wafer fixing mechanism to corresponding values, i =1,2,3,4 is set, the central control unit records the adjusted extrusion times as Y ', and sets Y = Y0 multiplied by alpha i, and when the central control unit detects that the adjusted extrusion times Y' are not integers, the central control unit rounds downwards.
4. The tool of claim 3, wherein the central control unit further has a maximum squeezing time Ymax, and when the central control unit determines that the squeezing time of the blue film squeezing mechanism on the wafer pasting mechanism needs to be adjusted to Y ', the central control unit compares the adjusted squeezing time Y ' with the maximum squeezing time Ymax, if Y ' is greater than Ymax, the central control unit adjusts the squeezing time to Ymax and decreases the squeezing distance D0 of the blue film squeezing mechanism on the wafer pasting mechanism, and if Y ' is less than or equal to Ymax, the central control unit adjusts the squeezing time to Y '.
5. The tool of claim 4, wherein when the central control unit determines that Y ' > Ymax, the central control unit calculates a difference Δ Y between extrusion times and selects a corresponding extrusion distance adjustment amount according to the difference to reduce the extrusion distance of the blue film extrusion mechanism to the wafer bonding mechanism, and sets Δ Y ' = Y ' -Ymax;
the central control unit is further provided with a first extrusion frequency difference delta Y1, a second extrusion frequency difference delta Y2, a third extrusion frequency difference delta Y3, a first extrusion distance adjusting quantity delta D1, a second extrusion distance adjusting quantity delta D2, a third extrusion distance adjusting quantity delta D3 and a fourth extrusion distance adjusting quantity delta D4, wherein delta Y1 is smaller than delta Y2 is smaller than delta Y3, and delta D1 is smaller than delta D2 is smaller than delta D3 is smaller than delta D4;
if delta Y' <deltaY 1, the central control unit selects a first extrusion distance adjusting quantity delta D1 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y1 and less than delta Y2, the central control unit selects a first extrusion distance adjusting quantity delta D2 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y2 and less than delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D3 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y' is not less than the delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D4 to adjust the initial extrusion distance of the blue film extrusion mechanism;
and when the central control unit selects the ith extrusion distance adjustment amount to reduce the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, setting i =1,2,3 and 4, and setting D '= D0-delta Di by the central control unit recording the adjusted extrusion distance as D'.
6. The testing jig for the bonding force of the metal layer after the evaporation process in chip manufacturing according to claim 5, wherein the central control unit is further provided with a minimum extrusion distance Dmin, when the central control unit completes the adjustment of the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism to D ', if D' < Dmin, the central control unit determines that the blue film extrusion mechanism is damaged and sends out a warning signal, and if D '≧ Dmin, the central control unit adjusts the extrusion distance to D'.
7. The fixture according to claim 6, wherein the central control unit further has a minimum extrusion time Ymin, and when the central control unit determines that the extrusion time of the blue film extrusion mechanism on the wafer bonding mechanism needs to be adjusted to Y, the central control unit compares the adjusted extrusion time Y with the minimum extrusion time, and if Y is less than Ymin, the central control unit adjusts the extrusion time to Ymin and increases the extrusion distance D0 of the blue film extrusion mechanism on the wafer bonding mechanism, and if Y 'is greater than or equal to Ymin, the central control unit adjusts the extrusion time to Y'.
8. The tool of claim 4, wherein when the central control unit determines that Y is less than Ymin and adjusts the extrusion times to Ymin, the central control unit calculates a difference Δ Y between the extrusion times and selects a corresponding extrusion distance adjustment amount according to the difference to increase the extrusion distance of the blue film extrusion mechanism to the wafer bonding mechanism, and sets Δ Y' = Ymin-Y;
if delta Y is less than delta Y1, the central control unit selects a first extrusion distance adjusting quantity delta D1 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y1 and less than delta Y2, the central control unit selects a first extrusion distance adjusting quantity delta D2 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is more than or equal to delta Y2 and less than delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D3 to adjust the initial extrusion distance of the blue film extrusion mechanism;
if the delta Y is not less than or equal to the delta Y3, the central control unit selects a first extrusion distance adjusting quantity delta D4 to adjust the initial extrusion distance of the blue film extrusion mechanism;
and when the central control unit selects the ith extrusion distance adjustment amount to increase the extrusion distance of the blue film extrusion mechanism to the wafer pasting mechanism, the central control unit records the adjusted extrusion distance as D, and sets D = D0 +. DELTA.Di, i =1,2,3, 4.
9. The tool of claim 8, wherein the central control unit further has a maximum extrusion distance value Dmax, and when the central control unit completes adjustment of the extrusion distance of the blue film extrusion mechanism to the wafer bonding mechanism to D, if D is greater than Dmax, the central control unit determines that the size of the wafer fixing mechanism is too large and sends a replacement signal, and if D is less than or equal to Dmax, the central control unit adjusts the extrusion distance to a corresponding value.
10. The testing jig for the bonding force of the metal layer after the evaporation process in chip manufacturing according to claim 9, wherein the central control unit further has a maximum adjustment number N0, when the central control unit completes the adjustment of the extrusion number or the extrusion distance of the blue film extrusion mechanism, the central control unit records the adjustment number as N, when the central control unit completes one adjustment of the extrusion number or the extrusion distance, the central control unit records the adjustment number as N =1, when the central control unit completes the jth adjustment, j =1,2,3,.
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