CN113444500A - Heat-conducting wave-absorbing silicone grease and preparation method thereof - Google Patents

Heat-conducting wave-absorbing silicone grease and preparation method thereof Download PDF

Info

Publication number
CN113444500A
CN113444500A CN202110824404.2A CN202110824404A CN113444500A CN 113444500 A CN113444500 A CN 113444500A CN 202110824404 A CN202110824404 A CN 202110824404A CN 113444500 A CN113444500 A CN 113444500A
Authority
CN
China
Prior art keywords
heat
wave
conducting
absorbing
filler
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202110824404.2A
Other languages
Chinese (zh)
Other versions
CN113444500B (en
Inventor
李静
王喆
张贵恩
范晋锋
李炳章
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
CETC 33 Research Institute
Original Assignee
CETC 33 Research Institute
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by CETC 33 Research Institute filed Critical CETC 33 Research Institute
Priority to CN202110824404.2A priority Critical patent/CN113444500B/en
Publication of CN113444500A publication Critical patent/CN113444500A/en
Application granted granted Critical
Publication of CN113444500B publication Critical patent/CN113444500B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K5/00Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
    • C09K5/08Materials not undergoing a change of physical state when used
    • C09K5/14Solid materials, e.g. powdery or granular
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K9/00Screening of apparatus or components against electric or magnetic fields
    • H05K9/0073Shielding materials
    • H05K9/0081Electromagnetic shielding materials, e.g. EMI, RFI shielding

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Combustion & Propulsion (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Electromagnetism (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Lubricants (AREA)

Abstract

The invention relates to the technical field of preparation of heat-conducting wave-absorbing materials, and provides heat-conducting wave-absorbing silicone grease and a preparation method thereof, wherein the heat-conducting wave-absorbing silicone grease material comprises the following components in parts by weight: 50-100 parts of basic silicone oil, 200-500 parts of heat-conducting filler, 600-1000 parts of wave-absorbing filler and 20-50 parts of surface modifier and auxiliary agent, wherein the heat-conducting filler and the wave-absorbing filler are fully stirred under high-temperature vacuum, and then other components are treated by the same method, so that the uniform distribution of the heat-conducting filler and the wave-absorbing filler is ensured, the interface compatibility between the filler and a matrix is also ensured, and the heat-conducting and wave-absorbing functions of the heat-conducting wave-absorbing silicone grease are improved. The product is mainly applied to micro-gaps and irregular holes inside high-power components such as a CPU (central processing unit) and the like, and solves the problem of compatibility of heat management and wave absorption.

Description

Heat-conducting wave-absorbing silicone grease and preparation method thereof
Technical Field
The invention relates to the technical field of preparation of heat-conducting wave-absorbing materials, in particular to heat-conducting wave-absorbing silicone grease and a preparation method thereof.
Background
With the rapid development of high integration, miniaturization, multi-functionalization and high performance of 5G and electronic device equipment, the importance of materials required for electronic equipment to cope with high frequency environments is continuously increasing. For the development of electronic devices, it is a problem to enhance heat conduction and suppress electromagnetic wave conduction, which is a problem to be faced by the product manufacturing end.
At present, the gasket products with double functions of heat conduction and wave absorption appear in the market, and can be directly attached to an integrated circuit, a radiating fin or other heat conduction equipment, so that the problems of electromagnetic compatibility and heat management are solved. However, no heat-conducting wave-absorbing silicone grease product is reported at present, and the product is mainly applied to micro-gaps and irregular holes inside high-power components such as a CPU (central processing unit) and the like, so that the problem of compatibility of double functions of heat management and wave absorption is solved.
Disclosure of Invention
In order to overcome the defects in the prior art, the invention provides the heat conduction wave absorption silicone grease and the preparation method thereof, and the prepared heat conduction wave absorption silicone grease has the characteristics of high heat conductivity coefficient, stable electromagnetic wave absorption capacity and strong liquidity. The technical scheme adopted by the invention is as follows:
a heat-conducting wave-absorbing silicone grease comprises the following components in parts by weight:
50-100 parts of base silicone oil, 200-500 parts of heat-conducting filler, 600-1000 parts of wave-absorbing filler and 20-50 parts of surface modifier and auxiliary agent;
preferably, the base silicone oil is linear silicone oil, the viscosity at 25 ℃ is 100-1500 mPa & s, and the structural formula is as follows:
Figure BDA0003173086120000021
wherein m is polymerization degree, R is inactive alkyl, such as methyl, ethyl, propyl and isomers thereof, R groups can be the same or different, and m is a natural number larger than 1.
Preferably, the heat-conducting filler is formed by compounding one or more of aluminum oxide, zinc oxide, silicon oxide, calcium oxide, magnesium oxide, boron nitride and aluminum nitride, the average grain diameter of the heat-conducting filler is 30-70 mu m, and the structure of the heat-conducting filler is spherical, spheroidal or flaky.
Preferably, the wave-absorbing filler is one or two of carbonyl iron, iron-silicon-aluminum, iron powder, graphite powder, ferrite and silicon carbide, and is compounded, the average particle size of the wave-absorbing filler is 5-50 mu m, and the structure of the wave-absorbing filler is spherical, spheroidal or flaky.
Preferably, in the compounding process of the heat-conducting filler and the wave-absorbing filler, the average grain size of the wave-absorbing filler is 5-30 μm, the average grain size of the heat-conducting filler is 50-70 μm, and the heat-conducting filler and the wave-absorbing filler are mixed to form the bifunctional powder with the average grain size of 30-50 μm.
Preferably, the surface modifier is one of a silane coupling agent, an aluminate coupling agent or a titanate coupling agent, and the silane coupling agent is one of methyl methoxysilane, methyl triethoxysilane, vinyl trimethoxysilane, vinyl triethoxysilane, 3-aminopropyltriethoxysilane, 3-methacryloxypropyl trimethoxysilane or 3-glycidoxypropyltrimethoxysilane; the aluminate coupling agent is one of LK-AL18 and LK-AL181 aluminate coupling agents; the titanate coupling agent is one of LK-002, LK-105, LK-300 and LK-401 titanate coupling agents.
Preferably, the auxiliary agent is an anti-settling agent and an antioxidant, the anti-settling agent is one of fumed silica, bentonite or polyamide wax, and the antioxidant is one of antioxidant 1010 or antioxidant CA.
A preparation method of heat-conducting wave-absorbing silicone grease comprises the following steps:
s1, weighing the following raw materials in parts by weight: 50-100 parts of base silicone oil, 200-500 parts of heat-conducting filler, 600-1000 parts of wave-absorbing filler and 20-50 parts of surface modifier and auxiliary agent;
s2, stirring the heat-conducting filler, the wave-absorbing filler and the surface modifier weighed in the S1 under the conditions that the vacuum degree is-0.080 MPa to-0.130 MPa, the mixing temperature is 80 to 150 ℃, and the stirring speed is 80 to 130rpm, so that the materials are mixed into uniform powder;
s3, mixing the basic silicone oil and the auxiliary agent weighed in the S1 under the conditions that the vacuum degree is-0.080 MPa to-0.130 MPa, the mixing temperature is 50 ℃ to 100 ℃, and the stirring speed is 100 rpm to 160rpm to obtain uniform flowing liquid;
s4, adding the mixed powder in the S2 into the S3 fluid liquid, and continuously stirring the mixture until the mixture is uniform under the conditions that the vacuum degree is-0.080 MPa to-0.130 MPa, the mixing temperature is 80 to 150 ℃ and the stirring speed is 80 to 130rpm, thereby finally obtaining the heat-conducting wave-absorbing silicone grease.
Compared with the prior art, the invention has the beneficial effects that:
the heat-conducting wave-absorbing silicone grease is prepared by taking the basic silicone oil, the heat-conducting filler, the wave-absorbing filler surface modifier and the auxiliary agent as raw materials, the heat-conducting filler and the wave-absorbing filler are subjected to granularity matching, the heat-conducting and wave-absorbing double functions of the heat-conducting wave-absorbing silicone grease are effectively improved, the heat conductivity coefficient reaches 2.9W/m.K, and the reflectivity is less than or equal to-10 dB in the frequency range of 8-18 GHz.
Drawings
FIG. 1 is a schematic diagram of the internal structure of a heat-conducting wave-absorbing silicone grease product;
FIG. 2 is a linear fitting curve of thermal resistance-thickness of heat-conducting wave-absorbing silicone grease;
Detailed Description
The technical solutions in the embodiments of the present invention are clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Example 1:
the embodiment provides heat-conducting wave-absorbing silicone grease which comprises the following components in parts by weight:
50g of basic silicone oil, 260g of heat conducting filler, 700g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
wherein the base silicone oil is
Figure BDA0003173086120000041
I.e. R ═ CH3,m=30;
The heat conducting filler consists of 210g of alumina with the average particle size of 50-70 mu m and 50g of aluminum nitride with the average particle size of 40-50 mu m;
the wave-absorbing filler consists of 350g of carbonyl iron with the average particle size of 10-30 mu m and 350g of ferrum-silicon-aluminum with the average particle size of 30-40 mu m;
the surface modifier is vinyl trimethoxy silane;
the anti-settling agent is fumed silica;
the antioxidant is antioxidant 1010;
the preparation method of the heat-conducting wave-absorbing silicone grease comprises the following steps:
s1, weighing the following raw materials, by weight, 50g of basic silicone oil, 260g of heat conducting filler, 700g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
s2, placing the heat-conducting filler, the wave-absorbing filler and the surface modifier weighed in the step S1 into a double-planet stirrer, and mixing the materials uniformly under the conditions that the vacuum degree is-0.085 MPa, the temperature is 90 ℃ and the rotating speed is 120 rpm;
s3, placing the basic silicone oil and the auxiliary agent weighed in the S1 into a double-planet stirrer, and stirring to obtain uniform liquid under the conditions that the vacuum degree is-0.095 MPa, the temperature is 50 ℃ and the rotating speed is 150 rpm;
s4, adding the S2 uniformly mixed powder into the uniform liquid obtained in the S3, and mixing under the conditions that the vacuum degree is-0.098 MPa, the temperature is 90 ℃ and the rotating speed is 120rpm to obtain the heat-conducting wave-absorbing silicone grease.
Through tests, the heat conductivity coefficient of the heat-conducting wave-absorbing silicone grease is 2.8W/m.K, and the reflectivity in the frequency range of 8-18 GHz is less than or equal to-10 dB.
Example 2:
the embodiment provides heat-conducting wave-absorbing silicone grease which comprises the following components in parts by weight:
50g of basic silicone oil, 265g of heat conducting filler, 700g of wave absorbing filler, 20g of surface modifier, 7g of anti-settling agent and 3g of antioxidant;
wherein the base silicone oil is
Figure BDA0003173086120000051
I.e., R ═ Et, m ═ 25;
the heat conducting filler consists of 200g of alumina with the average grain diameter of 60-70 mu m and 65g of boron nitride with the average grain diameter of 40-50 mu m;
the wave-absorbing filler consists of 350g of carbonyl iron with the average particle size of 10-30 mu m and 350g of ferrum-silicon-aluminum with the average particle size of 30-40 mu m;
the surface modifier is vinyl triethoxysilane;
the anti-settling agent is bentonite;
the antioxidant is antioxidant 1010;
the preparation method of the heat-conducting wave-absorbing silicone grease comprises the following steps:
s1, weighing the following components in parts by weight, 700g of wave-absorbing filler, 20g of surface modifier, 7g of anti-settling agent and 3g of antioxidant;
s2, placing the heat-conducting filler, the wave-absorbing filler and the surface modifier weighed in the S1 into a double-planet stirrer, and mixing the materials uniformly under the conditions that the vacuum degree is-0.095 MPa, the temperature is 100 ℃ and the rotating speed is 120 rpm;
s3, placing the basic silicone oil and the auxiliary agent weighed in the S1 into a double-planet stirrer, and stirring to obtain uniform liquid under the conditions that the vacuum degree is-0.095 MPa, the temperature is 50 ℃ and the rotating speed is 150 rpm;
s4, adding the S2 uniformly mixed powder into S3, and mixing at 90 ℃ and 120rpm under the vacuum degree of-0.095 MPa to obtain the heat-conducting wave-absorbing silicone grease.
Through tests, the heat conductivity coefficient of the heat-conducting wave-absorbing silicone grease is 2.9W/m.K, and the reflectivity in the frequency range of 8-18 GHz is less than or equal to-10 dB.
Example 3:
the embodiment provides heat-conducting wave-absorbing silicone grease which comprises the following components in parts by weight:
50g of basic silicone oil, 260g of heat conducting filler, 705g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
wherein the base silicone oil is
Figure BDA0003173086120000061
Namely, R ═ CH3, m ═ 30;
the heat conducting filler consists of 200g of alumina with the average grain diameter of 60-70 mu m and 60g of boron nitride with the average grain diameter of 40-50 mu m;
the wave-absorbing filler consists of 355g of ferrite with the average grain diameter of 10-30 mu m and 350g of sendust with the average grain diameter of 30-40 mu m;
the surface modifier is 3-aminopropyl triethoxysilane;
the anti-settling agent is bentonite;
the antioxidant is antioxidant CA;
the preparation method of the heat-conducting wave-absorbing silicone grease comprises the following steps:
s1, weighing the following raw materials, by weight, 50g of basic silicone oil, 260g of heat conducting filler, 705g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
s2, placing the heat-conducting filler, the wave-absorbing filler and the surface modifier weighed in the S1 into a double-planet stirrer, and mixing the materials uniformly under the conditions that the vacuum degree is-0.095 MPa, the temperature is 100 ℃ and the rotating speed is 120 rpm;
s3, placing the basic silicone oil and the auxiliary agent weighed in the S1 into a double-planet stirrer, and stirring to obtain uniform liquid under the conditions that the vacuum degree is-0.095 MPa, the temperature is 50 ℃ and the rotating speed is 150 rpm;
s4, adding the S2 uniformly mixed powder into S3, and mixing at 90 ℃ and 120rpm under the vacuum degree of-0.095 MPa to obtain the heat-conducting wave-absorbing silicone grease.
Through tests, the heat conductivity coefficient of the heat-conducting wave-absorbing silicone grease is 2.8W/m.K, and the reflectivity in the frequency range of 8-18 GHz is less than or equal to-10 dB.
Comparative example 1: the comparative example 1 explores the influence of the heat-conducting filler and the wave-absorbing filler with similar particle sizes on the heat conductivity coefficient of the product.
The comparative example provides heat-conducting wave-absorbing silicone grease which comprises the following components in parts by weight:
50g of basic silicone oil, 260g of heat conducting filler, 700g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
wherein the base silicone oil is
Figure BDA0003173086120000071
Namely, R ═ CH3, m ═ 30;
the heat conducting filler consists of 210g of alumina with the average grain diameter of 10-30 mu m and 50g of aluminum nitride with the average grain diameter of 20-40 mu m;
the wave-absorbing filler consists of 350g of carbonyl iron with the average particle size of 10-30 mu m and 350g of ferrum-silicon-aluminum with the average particle size of 30-40 mu m;
the surface modifier is vinyl trimethoxy silane;
the anti-settling agent is fumed silica;
the antioxidant is antioxidant 1010;
the preparation method of the heat-conducting wave-absorbing silicone grease comprises the following steps:
s1, weighing the following raw materials, by weight, 50g of basic silicone oil, 260g of heat conducting filler, 700g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
s2, placing the heat-conducting filler, the wave-absorbing filler and the surface modifier weighed in the step S1 into a double-planet stirrer, and mixing the materials uniformly under the conditions that the vacuum degree is-0.085 MPa, the temperature is 90 ℃ and the rotating speed is 120 rpm;
s3, placing the basic silicone oil and the auxiliary agent weighed in the S1 into a double-planet stirrer, and stirring to obtain uniform liquid under the conditions that the vacuum degree is-0.095 MPa, the temperature is 50 ℃ and the rotating speed is 150 rpm;
s4, adding the S2 uniformly mixed powder into S3, and mixing at 90 ℃ and 120rpm under the vacuum degree of-0.098 MPa to obtain the heat-conducting wave-absorbing silicone grease.
Through tests, the heat conductivity coefficient of the heat-conducting wave-absorbing silicone grease is 2.3W/m.K, and the reflectivity in the frequency range of 8-18 GHz is less than or equal to-10 dB.
By comparing the properties of the heat-conducting wave-absorbing silicone grease obtained in the comparative example 1 and the examples 1 to 3, the heat-conducting property of the heat-conducting wave-absorbing silicone grease can be improved by performing granularity matching on the heat-conducting filler and the wave-absorbing filler.
Comparative example 2: comparative example 2 investigates the effect of mixing at room temperature on the heat conductivity and wave absorption properties of the product;
the comparative example provides heat-conducting wave-absorbing silicone grease which comprises the following components in parts by weight:
50g of basic silicone oil, 265g of heat conducting filler, 700g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
wherein the base silicone oil is
Figure BDA0003173086120000081
I.e., R ═ CH3, m ═ 25;
the heat conducting filler consists of 200g of alumina with the average grain diameter of 60-70 mu m and 65g of boron nitride with the average grain diameter of 40-50 mu m;
the wave-absorbing filler consists of 350g of carbonyl iron with the average particle size of 10-30 mu m and 350g of ferrum-silicon-aluminum with the average particle size of 30-40 mu m;
the surface modifier is vinyl triethoxysilane;
the anti-settling agent is bentonite;
the antioxidant is antioxidant 1010;
the preparation method of the heat-conducting wave-absorbing silicone grease comprises the following steps:
s1, weighing the following raw materials, by weight, 50g of base silicone oil, 265g of heat conducting filler, 700g of wave absorbing filler, 20g of surface modifier, 5g of anti-settling agent and 3g of antioxidant;
s2, placing the heat-conducting filler, the wave-absorbing filler and the surface modifier weighed in the step S1 into a double-planet stirrer, and mixing the materials uniformly at normal temperature under the conditions that the vacuum degree is-0.095 MPa and the rotating speed is 120 rpm;
s3, placing the basic silicone oil and the auxiliary agent weighed in the S1 into a double-planet stirrer, and stirring at normal temperature to obtain uniform liquid, wherein the vacuum degree is-0.095 MPa and the rotating speed is 150 rpm;
s4, adding the S2 uniformly mixed powder into S3, and mixing at normal temperature under the vacuum degree of-0.095 MPa and the rotating speed of 120rpm to obtain the heat-conducting wave-absorbing silicone grease;
through tests, the heat conductivity coefficient of the heat-conducting wave-absorbing silicone grease is 2.3W/m.K, and the reflectivity in the frequency range of 8-18 GHz is less than or equal to-7 dB.
By comparing the performances of the heat-conducting wave-absorbing silicone grease obtained in the comparative example 2 and the examples 1 to 3, the performances of the heat-conducting wave-absorbing silicone grease obtained in the processes of S2, S3 and S4, namely mixing the heat-conducting filler/wave-absorbing filler/surface modifier, the basic silicone oil/auxiliary agent and the mixed powder/fluid liquid at high temperature, can be obtained, which is beneficial to improving the interface fusion of the filler and the matrix, and further improves the heat-conducting performance and the wave-absorbing performance of the heat-conducting wave-absorbing silicone grease.
Although only the preferred embodiments of the present invention have been described in detail, the present invention is not limited to the above embodiments, and various changes can be made without departing from the spirit of the present invention within the knowledge of those skilled in the art, and all changes are encompassed in the scope of the present invention.

Claims (9)

1. The heat-conducting wave-absorbing silicone grease is characterized by comprising the following components in parts by weight:
50-100 parts of base silicone oil, 200-500 parts of heat-conducting filler, 600-1000 parts of wave-absorbing filler and 20-50 parts of surface modifier and auxiliary agent;
the basic silicone oil is linear silicone oil, the viscosity at 25 ℃ is 100-1500 mPa & s, and the structural formula is as follows:
Figure FDA0003173086110000011
wherein m is polymerization degree, R is inactive alkyl, R groups can be same or different, and m is a natural number larger than 1.
2. The heat-conducting wave-absorbing silicone grease as claimed in claim 1, wherein the heat-conducting filler is one or more of aluminum oxide, zinc oxide, silicon oxide, calcium oxide, magnesium oxide, boron nitride and aluminum nitride.
3. The heat-conducting wave-absorbing silicone grease as claimed in claim 1, wherein the average particle size of the heat-conducting filler is 30-70 μm, and the structure is spherical, spheroidal or flaky.
4. The heat-conducting wave-absorbing silicone grease as claimed in claim 1, wherein the wave-absorbing filler is one or two of carbonyl iron, sendust, iron powder, graphite powder, ferrite and silicon carbide.
5. The heat-conducting wave-absorbing silicone grease as claimed in claim 1 or 4, wherein the wave-absorbing filler has an average particle size of 5-50 μm and a spherical, spheroidal or sheet structure.
6. The heat-conducting wave-absorbing silicone grease as claimed in claim 1, wherein in the compounding process of the heat-conducting filler and the wave-absorbing filler, the average particle size of the wave-absorbing filler is 5-30 μm, the average particle size of the heat-conducting filler is 50-70 μm, and the heat-conducting filler and the wave-absorbing filler are mixed to form the bifunctional powder with the average particle size of 30-50 μm.
7. The heat-conducting wave-absorbing silicone grease as claimed in claim 1, wherein the surface modifier is one of a silane coupling agent, an aluminate coupling agent or a titanate coupling agent, the silane coupling agent is one of methylmethoxysilane, methyltriethoxysilane, vinyltrimethoxysilane, vinyltriethoxysilane, 3-aminopropyltriethoxysilane, 3-methacryloxypropyltrimethoxysilane or 3-glycidoxypropyltrimethoxysilane, and the aluminate coupling agent is one of LK-AL18 and LK-AL181 aluminate coupling agent; the titanate coupling agent is one of LK-002, LK-105, LK-300 and LK-401 titanate coupling agents.
8. The heat-conducting wave-absorbing silicone grease as claimed in claim 1, wherein the auxiliary agent is an anti-settling agent and an antioxidant, the anti-settling agent is one of fumed silica, bentonite or polyamide wax, and the antioxidant is one of antioxidant 1010 or antioxidant CA.
9. A preparation method of heat-conducting wave-absorbing silicone grease is characterized by comprising the following steps:
s1, weighing the following raw materials in parts by weight: 50-100 parts of base silicone oil, 200-500 parts of heat-conducting filler, 600-1000 parts of wave-absorbing filler and 20-50 parts of surface modifier and auxiliary agent;
s2, stirring the heat-conducting filler, the wave-absorbing filler and the surface modifier weighed in the S1 under the conditions that the vacuum degree is-0.080 MPa to-0.130 MPa, the mixing temperature is 80 to 150 ℃, and the stirring speed is 80 to 130rpm, so that the materials are mixed into uniform powder;
s3, mixing the basic silicone oil and the auxiliary agent weighed in the S1 under the conditions that the vacuum degree is-0.080 MPa to-0.130 MPa, the mixing temperature is 50 ℃ to 100 ℃, and the stirring speed is 100 rpm to 160rpm to obtain uniform flowing liquid;
s4, adding the mixed powder in the S2 into the S3 fluid liquid, and continuously stirring the mixture until the mixture is uniform under the conditions that the vacuum degree is-0.080 MPa to-0.130 MPa, the mixing temperature is 80 to 150 ℃ and the stirring speed is 80 to 130rpm, thereby finally obtaining the heat-conducting wave-absorbing silicone grease.
CN202110824404.2A 2021-07-21 2021-07-21 Heat-conducting wave-absorbing silicone grease and preparation method thereof Active CN113444500B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110824404.2A CN113444500B (en) 2021-07-21 2021-07-21 Heat-conducting wave-absorbing silicone grease and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110824404.2A CN113444500B (en) 2021-07-21 2021-07-21 Heat-conducting wave-absorbing silicone grease and preparation method thereof

Publications (2)

Publication Number Publication Date
CN113444500A true CN113444500A (en) 2021-09-28
CN113444500B CN113444500B (en) 2022-04-12

Family

ID=77816939

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110824404.2A Active CN113444500B (en) 2021-07-21 2021-07-21 Heat-conducting wave-absorbing silicone grease and preparation method thereof

Country Status (1)

Country Link
CN (1) CN113444500B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114605706A (en) * 2022-03-16 2022-06-10 深圳市锦昊辉实业发展有限公司 Heat-conducting powder and preparation method thereof

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030008969A1 (en) * 2001-06-15 2003-01-09 Kouya Takahashi Heat-radiating electromagnetic wave absorber
TW201043905A (en) * 2009-06-09 2010-12-16 Hon Hai Prec Ind Co Ltd Wave absorption and heat dissipation material
CN105647191A (en) * 2016-04-01 2016-06-08 平湖阿莱德实业有限公司 Flexible heat conduction interface material with wave absorbing function and preparation method thereof
CN108641373A (en) * 2018-05-16 2018-10-12 浙江禾为新材料科技有限公司 A kind of high band heat conduction suction wave insulating materials
CN109438987A (en) * 2018-10-31 2019-03-08 深圳联腾达科技有限公司 High thermal-conductive silicone grease and preparation method thereof
CN110730607A (en) * 2019-10-16 2020-01-24 深圳市飞鸿达科技有限公司 Heat-conducting wave-absorbing insulating sheet with high heat-conducting performance and preparation method thereof
CN112980398A (en) * 2021-02-24 2021-06-18 天津泽希新材料有限公司 High-thermal-conductivity wave-absorbing silica gel gasket and preparation method thereof

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20030008969A1 (en) * 2001-06-15 2003-01-09 Kouya Takahashi Heat-radiating electromagnetic wave absorber
TW201043905A (en) * 2009-06-09 2010-12-16 Hon Hai Prec Ind Co Ltd Wave absorption and heat dissipation material
CN105647191A (en) * 2016-04-01 2016-06-08 平湖阿莱德实业有限公司 Flexible heat conduction interface material with wave absorbing function and preparation method thereof
CN108641373A (en) * 2018-05-16 2018-10-12 浙江禾为新材料科技有限公司 A kind of high band heat conduction suction wave insulating materials
CN109438987A (en) * 2018-10-31 2019-03-08 深圳联腾达科技有限公司 High thermal-conductive silicone grease and preparation method thereof
CN110730607A (en) * 2019-10-16 2020-01-24 深圳市飞鸿达科技有限公司 Heat-conducting wave-absorbing insulating sheet with high heat-conducting performance and preparation method thereof
CN112980398A (en) * 2021-02-24 2021-06-18 天津泽希新材料有限公司 High-thermal-conductivity wave-absorbing silica gel gasket and preparation method thereof

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
汪旭文: "基于氧化铝/羰基铁粉的复合贴片吸波与导热特性分析", 《磁性材料及器件》 *
贾琨: "导热吸波材料的研究进展及未来发展方向", 《材料导报》 *

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114605706A (en) * 2022-03-16 2022-06-10 深圳市锦昊辉实业发展有限公司 Heat-conducting powder and preparation method thereof
CN114605706B (en) * 2022-03-16 2023-11-10 深圳市锦昊辉实业发展有限公司 Heat-conducting powder and preparation method thereof

Also Published As

Publication number Publication date
CN113444500B (en) 2022-04-12

Similar Documents

Publication Publication Date Title
EP3172734B1 (en) Thermal interface material with mixed aspect ratio particle dispersions
CN111534016B (en) Electronic packaging material with heat conduction and electromagnetic shielding performance and preparation method thereof
KR100745692B1 (en) Composition for complex sheet with thermal dissipation, emi shielding and absorption, and products manufactured therefrom
CN113444500B (en) Heat-conducting wave-absorbing silicone grease and preparation method thereof
CN106398226A (en) Heat-conducting silica gel and preparation method thereof
CN108276773B (en) Heat-conducting wave-absorbing material and preparation method thereof
JP2002368480A (en) Electromagnetic wave suppressor sheet
TW201943034A (en) Semiconductor device
CN112980398A (en) High-thermal-conductivity wave-absorbing silica gel gasket and preparation method thereof
CN108624056A (en) A kind of High thermal-conductive silicone grease boundary material and preparation method thereof
CN107207950B (en) Thermally conductive electromagnetic interference (EMI) absorbers with silicon carbide
CN112552688B (en) High-thermal-conductivity organic silicon gel sheet and preparation method thereof
CN106916450A (en) A kind of electromagnetic wave absorption thermally conductive composition and electromagnetic wave absorption heat-conducting pad
CN108003841A (en) Waveguide hot material and its preparation method and application is inhaled in a kind of phase transformation
CN115011125A (en) High-thermal-conductivity antioxidant wave-absorbing silicone rubber composite material and preparation method thereof
CN114752221A (en) Insulating high-heat-conductivity flexible silica gel gasket and preparation method thereof
CN105542469A (en) Electromagnetic shielding heat conducting composition and electromagnetic shielding heat conducting gasket
CN112063150A (en) High-thermal-conductivity low-thermal-resistance high-heat-dissipation heat-conduction silica gel and preparation method thereof
JP2010183033A (en) Composition for electromagnetic wave suppression and heat dissipation, and method for manufacturing the composition for electromagnetic wave suppression
CN111944498A (en) Heat-conducting gel with ultralow oil extraction amount and high flow rate performance and preparation method thereof
CN114106564B (en) Oriented heat conduction gel, preparation method and application thereof
CN111826132A (en) High-thermal-conductivity composite gel and preparation method thereof
CN110746782A (en) High-performance wave-absorbing heat-conducting silica gel gasket convenient for die cutting and laminating and preparation method thereof
CN114605836A (en) High-performance silicon oil-based flexible heat-conducting gasket and preparation method thereof
CN115895269B (en) Heat-conducting gel and preparation method and application thereof

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant