CN113439251A

CN113439251A - Method of manufacturing display module including sensor and electronic device including display module

Info

Publication number: CN113439251A
Application number: CN202080015124.0A
Authority: CN
Inventors: 具孝俊; 李奉宰; 金寿娫
Original assignee: Samsung Electronics Co Ltd
Current assignee: Samsung Electronics Co Ltd
Priority date: 2019-02-19
Filing date: 2020-02-18
Publication date: 2021-09-24
Also published as: KR20200101223A; WO2020171559A1; EP3913458A1; EP3913458A4; US20220210254A1

Abstract

An electronic device according to various embodiments may include: a housing; a display module including a first panel including a first surface, a second surface facing the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer disposed on the first surface of the first panel and forming one surface of the housing, and a second panel disposed on the second surface of the first panel; and a sensor coupled to the second surface of the first panel and forming a sensing region in the one surface of the housing. Various other embodiments are possible as determined by the description.

Description

Method of manufacturing display module including sensor and electronic device including display module

Technical Field

Various embodiments of the present disclosure relate to a display module including a sensor and a method of manufacturing the display module. In addition, various embodiments of the present disclosure relate to an electronic device including a display module.

Background

The electronic device may include a sensor for biometric information identification. For example, the electronic device may include a sensor for recognizing a fingerprint. The sensor for identifying the fingerprint may be visible from outside the electronic device. For example, a sensor for recognizing a fingerprint may be provided at a lower end of a display area on a front surface of a housing of the electronic device. As another example, a sensor for recognizing a fingerprint may be provided on a rear surface of a housing of the electronic device.

As the size of the display of the portable electronic device increases, the size of the area on the front surface of the electronic device that does not include the display may be relatively reduced. Therefore, research is being conducted to mount various sensors on the front surface of the electronic device while the display size is increased. For example, an attempt is being made to implement a large screen by disposing a fingerprint sensor of an electronic device on a display area of a display and reducing or removing a non-display area.

Disclosure of Invention

Technical problem

A sensor may be provided on the rear surface of the display module. The display module may include a cover plate attached to a rear surface of the display panel. A hole may be formed in at least a partial area of the cover plate so that the fingerprint sensor acquires a fingerprint input on the front surface of the display module at the rear surface of the display. In this case, a hole having a size larger than that of the sensor surface of the sensor may be formed due to the minimum space to be ensured and the interference in the process. When the sensor is installed, a gap may be formed between the sensor and the hole.

External light may be introduced into the display panel through the gap. The introduced external light may generate a photoelectric effect. When the display displays a low gray image, the display area corresponding to the gap may appear relatively bright compared to other portions of the display due to current leakage caused by the photoelectric effect. When the display displays a high gray image, the display area corresponding to the gap may appear relatively dark compared to other portions of the display due to current leakage caused by the photoelectric effect.

Technical scheme

An electronic device disclosed in the present disclosure includes: a housing; a display module including a first panel including a first surface, a second surface facing the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer disposed on the first surface of the first panel, and a second panel disposed on the second surface of the first panel; and a sensor disposed on the second surface of the first panel, wherein the display module includes an opening through the second panel and in which at least a portion of the sensor is disposed, the second panel comprising a first layer and a second layer, one surface of the first layer being coupled to the first panel, the second layer is coupled to the first layer on an opposite surface of the one surface of the first layer, the opening corresponds to a region where a first opening formed in the first layer and a second opening formed in the second layer overlap each other, the sensor includes a Flexible Printed Circuit Board (FPCB) extending from a mounting area of the sensor in a first direction, and the second opening includes a region corresponding to the first opening and a protrusion extending from the region corresponding to the first opening in the first direction.

A display device disclosed in the present disclosure includes: a first panel including a first surface, a second surface facing the first surface, and a plurality of pixels disposed between the first surface and the second surface; a cover layer disposed on the first surface of the first panel; a display module including a second panel disposed on the second surface of the first panel; and a sensor coupled to the second surface of the first panel, wherein, the display module includes an opening through at least a portion of the second panel and in which at least a portion of the sensor is disposed, the second panel comprising a first layer and a second layer, one surface of the first layer being coupled to the first panel, the second layer is coupled to the first layer on an opposite surface of the one surface of the first layer, the opening corresponds to a region where a first opening formed in the first layer and a second opening formed in the second layer overlap each other, the sensor includes a Flexible Printed Circuit Board (FPCB) extending from a mounting area of the sensor in a first direction, and the second opening includes a region corresponding to the first opening and an extension extending from the region corresponding to the first opening in the first direction.

Technical effects

According to various embodiments disclosed in the present disclosure, a hole for mounting a sensor, which is provided under a display, may be prevented from being visible from the outside of an electronic device.

In addition, various effects directly or indirectly determined by the present disclosure may be provided.

Drawings

Fig. 1 is a front perspective view of an electronic device according to an embodiment.

Fig. 2 is a rear perspective view of the electronic device of fig. 1.

Fig. 3 is an exploded perspective view of the electronic device of fig. 1.

Fig. 4 is a cross-sectional view illustrating a display of an electronic device according to an embodiment.

Fig. 5 is a diagram illustrating a layer structure of a second panel according to an embodiment.

Fig. 6 is a diagram illustrating formation of a first opening according to an embodiment.

Fig. 7 is a diagram illustrating formation of a second opening according to an embodiment.

Fig. 8 is a diagram illustrating a sensor mounting structure according to an embodiment.

Fig. 9 is a diagram illustrating formation of a first opening according to an embodiment.

Fig. 10 is a diagram illustrating formation of a second opening according to an embodiment.

Fig. 11 is a diagram illustrating a sensor mounting structure according to an embodiment.

Fig. 12 is a diagram illustrating an additional structure of a shielding member according to an embodiment.

Fig. 13 is a diagram illustrating an adhesive material pattern according to an embodiment.

Fig. 14 is a flowchart illustrating a sensor mounting method according to an embodiment.

Fig. 15 is a diagram illustrating a shape of an opening according to an embodiment.

In the description with reference to the drawings, the same or similar reference symbols may be used for the same or similar elements.

Detailed Description

Hereinafter, various embodiments of the present disclosure will be described with reference to the accompanying drawings. This, however, does not limit the disclosure to the specific embodiments, but it should be understood that the disclosure encompasses all modifications, equivalents, and alternatives to embodiments in accordance with the disclosure.

Fig. 1 is a front perspective view of an electronic device according to an embodiment. Fig. 2 is a rear perspective view of the electronic device of fig. 1.

Referring to fig. 1 and 2, an electronic device 100 according to an embodiment includes a case 110 having a first surface (or front surface) 110A, a second surface (or rear surface) 110B, and a side surface 110C surrounding a space between the first surface 110A and the second surface 110B.

In another embodiment (not shown), the housing 110 may be a structure that is finger-shaped to some of the first surface 110A, the second surface 110B, and the side surface 110C of fig. 1.

According to an embodiment, at least a portion of the first surface 110A may be formed from a substantially transparent front sheet 102 (e.g., a glass sheet or a polymer sheet including various coatings). The second surface 110B may be formed by a substantially opaque rear plate 111. The back plate 111 may be made of, for example, coated or colored glass, ceramic, polymer, metal (e.g., aluminum, stainless steel (STS), or magnesium), or a combination of at least two of the above materials. Side surface 110C may be coupled to front plate 102 and rear plate 111 and may be formed from a side frame structure (or "side member") 118 comprising metal and/or polymer.

In some embodiments, the back panel 111 and the side frame structure 118 may be integral with each other and comprise the same material (e.g., a metallic material such as aluminum).

In the illustrated embodiment, the front plate 102 may include two first regions 110D at both ends of each long edge of the front plate 102, the two first regions 110D being curved and extending seamlessly from the first surface 110A toward the rear plate 111.

In the illustrated embodiment (see fig. 2), the rear plate 111 includes two second regions 110E at both ends of each long edge, the two second regions 110E being bent from the second surface 110B toward the front plate 102 and extending seamlessly.

In some embodiments, the front plate 102 (or the rear plate 111) may include only one of the first regions 110D (or the second regions 110E). In another embodiment, the front plate 102 (or the rear plate 111) may not include a portion of the first region 110D (or the second region 110E).

In the above embodiment, when viewed from a side of the electronic device 100, the side bezel structure 118 may have a first thickness (or width) at a side (e.g., a short side) belonging to the first region 110D or the second region 110E as described above, and a second thickness smaller than the first thickness at a side (e.g., a long side) included in the first region 110D or the second region 110E.

According to an embodiment, the electronic device 100 includes at least one or more of the display 101, the

audio modules

103, 107, and 114, the

sensor modules

104, 116, and 119, the

camera modules

105, 112, and 113, the key input device 117, the light emitting element 106, and the

connector holes

108 and 109. In some embodiments, at least one of the components (e.g., key input device 117, sensor module 104, or light emitting element 106) may be omitted, or other components may be added, in electronic device 100.

The display 101 may be exposed, for example, through a corresponding portion of the front plate 102. In some embodiments, at least a portion of the display 101 may be exposed through the front plate 102 including the first surface 110A and the first region 110D of the side surface 110C.

In some embodiments, the edge of the display 101 may have substantially the same shape as the adjacent outer shape of the front plate 102. In another embodiment (not shown), the distance between the outer portion of the display 101 and the outer portion of the front plate 102 may be substantially the same in order to enlarge the area to which the display 101 is exposed.

In an embodiment, a surface of the housing 110 (or the front plate 102) may include a screen display area formed when the display 101 is visually exposed. For example, the screen display area may include a first surface 110A and a first area of side surfaces 110D.

In the illustrated embodiment, the

screen display areas

110A and 110D may include a sensing area 110F configured to acquire biometric information of the user. Here, it can be understood that the meaning of "the

screen display regions

110A and 110D include the sensing region 110F" means that at least a portion of the sensing region 110A overlaps with the

screen display regions

110A and 110D. That is, the sensing region 110F may mean a region capable of displaying visual information through the display 101 as with other regions of the

screen display regions

110A and 110D and additionally acquiring biometric information (e.g., a fingerprint) of the user.

In an embodiment, the

screen display areas

110A and 110D of the display 101 may include an area 110G to which the first camera module 105 (e.g., a punch-through camera) is visually exposed. At least a portion of the edge of the area to which the first camera device 105 is exposed may be surrounded by the

screen display areas

110A and 110D.

In another embodiment (not shown), a recess or opening is formed in a portion of the

screen display areas

110A and 110D of the display 101, and at least one or more of the audio module 114, the first sensor module 104, and the light emitting element 106 aligned with the recess or opening may be disposed on the portion of the

screen display areas

110A and 110D.

In another embodiment (not shown), at least one or more of the audio module 114, the

sensor modules

104, 116, and 119, and the light emitting elements 106 may be disposed on a rear surface of the

screen display areas

110A and 110D of the display 101.

In another embodiment (not shown), the display 101 may be coupled to or disposed adjacent to a touch sensing circuit, a pressure sensor capable of measuring touch intensity (pressure), and/or a digitizer that detects a magnetic field type stylus.

In some embodiments, at least a portion of the

sensor modules

104, 116, and 119 and/or at least a portion of the key input device 117 may be disposed on the side surface 110C (e.g., the first region 110D and/or the second region 110E).

The

audio modules

103, 107, and 114 may include a microphone aperture 103 and

speaker apertures

107 and 114. A microphone for capturing external sound may be disposed within the microphone hole 103, and in some embodiments, a plurality of microphones may be disposed within the microphone hole 303 in order to sense the direction of sound. The

speaker ports

107 and 114 may include an external speaker port 107 and a call receiver port 114. In some embodiments, the speaker holes 107 and 114 and the microphone hole 103 may be implemented as a single hole, or a speaker (e.g., a piezoelectric speaker) may be provided without the speaker holes 107 and 114.

The

sensor modules

104, 116, and 119 may generate electrical signals or data values corresponding to internal operating states or external environmental states of the electronic device 100. For example, the

sensor modules

104, 116, and 119 may include a first sensor module 104 (e.g., a proximity sensor) disposed on the first surface 110A of the housing 110, a second sensor module 116 (e.g., a TOF camera device) disposed on the second surface 110B of the housing 110, a third sensor module 119 (e.g., an HRM sensor) disposed on the second surface 110B of the housing 110, and/or a fourth sensor module (e.g., a sensor 190 of fig. 3) (e.g., a fingerprint sensor) coupled to the display 101.

In various embodiments, the second sensor module 116 may include a TOF camera device for measuring distance.

In various embodiments, at least a portion of the fourth sensor module (e.g., sensor 190 of fig. 3) may be disposed below the

screen display areas

110A and 110D. For example, the fourth sensor module may be disposed in a recess (e.g., recess 139 of fig. 3) formed in the rear surface of the display 101. That is, the fourth sensor module (e.g., the sensor 190 of fig. 3) is not exposed to the

screen display areas

110A and 110D, and the sensing area 110f may be formed on at least a portion of the

screen display areas

110A and 110D.

In some embodiments (not shown), fingerprint sensors may be disposed on the second surface 110B and the first surface 110A (e.g., the

screen display areas

110A and 110D) of the housing 110.

In various embodiments, the electronic device 100 may further include a sensor module, not shown, such as a gesture sensor, a gyroscope sensor, an atmospheric pressure sensor, a magnetic sensor, an acceleration sensor, a grip sensor, a color sensor, an IR (infrared) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and an illuminance sensor.

The

camera modules

105, 112, and 113 may include a first camera device 105 (e.g., a punch-through camera device) exposed to a first surface 110A of the electronic device 100 and a second camera device 112 and/or a flash 113 exposed to a second surface 110B.

In the illustrated embodiment, the first camera device 105 may be exposed through a portion of the screen display area 110D of the first surface 110A. For example, the first camera device 105 may be exposed to a partial area of the screen display area 110D through an opening (not shown) defined in a portion of the display 101.

In the illustrated embodiment, the second camera device 112 may include a plurality of camera devices (e.g., dual or triple cameras). However, the second camera apparatus 112 is not necessarily limited to including a plurality of camera apparatuses, and thus may include one camera apparatus.

The

camera devices

105 and 112 may include one or more lenses, image sensors, and/or image signal processors. The flash 113 may include, for example, a light emitting diode or a xenon lamp. In some embodiments, two or more lenses (an infrared camera, a wide-angle lens, and a telephoto lens) and an image sensor may be disposed on one surface of the electronic device 100.

The key input device 117 may be disposed on the side surface 110C of the housing 110. In another embodiment, the electronic device 100 may not include some or all of the key input devices 117 described above, and the key input devices 117 that are not included may be implemented in a different form on the display 101 as soft keys. In some embodiments, the key input device may include a sensor module (e.g., the sensor 190 of fig. 3) forming a sensing region 110F included in the

screen display regions

110A and 110D.

The light emitting element 106 may be disposed on, for example, the first surface 110A of the housing 110. The light emitting elements 106 may provide status information of the electronic device 100, for example in the form of light. In another embodiment, the light emitting element 106 may provide a light source that is, for example, closely related to the operation of the first camera device 105. The light emitting elements 106 may include, for example, LEDs, IR LEDs, and xenon lamps.

The connector holes 108 and 109 may include a first connector hole 108 and/or a second connector hole 109 (e.g., a headphone jack), the first connector hole 108 being capable of receiving a connector (e.g., a USB connector) for transmission and reception of power and/or data with an external electronic device, the second connector hole 109 being capable of receiving a connector for transmission and reception of audio signals with the external electronic device.

Fig. 3 is an exploded perspective view of the electronic device of fig. 1.

Referring to fig. 3, the electronic device 100 may include a side member 140, a first support member 142 (e.g., a stand), a front plate 120 and a display 130 (e.g., the display 101 of fig. 1), a printed circuit board 150, a battery 152, a second support member 160 (e.g., a rear case), an antenna 170, and a rear plate 180. In some embodiments, in the electronic device 100, at least one of the components (e.g., the first support member 142 or the second support member 160) may be omitted, or other components may be added. At least one of the components of the electronic device 100 may be the same as or similar to at least one of the components of the electronic device 100 of fig. 1 or 2, and thus, a repetitive description thereof will be omitted below.

The first support member 142 may be disposed within the electronic device 100 so as to be connected to the side member 140, or may be integrated with the side member 140. The first support member 142 may be made of, for example, a metallic material and/or a non-metallic (e.g., polymeric) material. The first support member 142 may have one surface to which the display 130 is coupled and the other surface to which the printed circuit board 150 is coupled. The processor, memory and/or interface may be mounted on a printed circuit board 150. The processor may include, for example, one or more of a central processing unit, an application processor, a graphics processing unit, an image signal processor, a sensor hub processor, or a communications processor.

The memory may include, for example, volatile memory or nonvolatile memory.

The interface may include, for example, a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, an SD card interface, and/or an audio interface. The interface may, for example, electrically or physically connect the electronic device 100 to an external electronic device, and may include a USB connector, an SD card/MMC connector, or an audio connector.

Battery 152 may be a device for powering at least one component of electronic device 100 and may include, for example, a non-rechargeable primary battery, a rechargeable secondary battery, or a fuel cell. At least a portion of the battery 152 may be disposed on, for example, substantially the same plane as the printed circuit board 150. The battery 152 may be integrally provided within the electronic device 100 or may be provided to be detachable from the electronic device 100.

The antenna 170 may be disposed between the rear plate 180 and the battery 152. The antenna 170 may include, for example, a Near Field Communication (NFC) antenna, a wireless charging antenna, and/or a Magnetic Secure Transport (MST) antenna. The antenna 170 may perform, for example, short-range communication with an external device, or may wirelessly transmit/receive power required for charging. In another embodiment, the antenna structure may be provided by a portion of the side member 140 and/or the first support member 142, or a combination thereof.

In the illustrated embodiment, the electronic device 100 may also include a sensor 190 coupled to the display 130. Sensor 190 may be disposed in a recess 139 (e.g., opening 225 of fig. 4) formed in a rear surface of display 130. The sensor 190 may form a sensing region (e.g., the sensing region 110F of fig. 1) on a portion of the first plate 120.

Fig. 4 is a sectional view illustrating the display module 200 of the electronic device 100 according to the embodiment. Fig. 4 is a sectional view taken along line a-a' of fig. 3.

For example, display module 200 may include

displays

210, 220, and 230 (e.g., display 130 of fig. 3) and sensor 240 (e.g., sensor 190 of fig. 3). As another example, display module 200 may include

displays

210, 220, and 230, and sensor 240 may be coupled to display module 200.

In the illustrated embodiment, the display module 200 may include a first panel 210 including a plurality of pixels 213, a cover layer 230 disposed on a first surface 211 (e.g., + z-axis direction) of the first panel 210, and a second panel 220 disposed on a second surface 212 (e.g., -z-axis direction) of the first panel 210. For example, the sensor 240 may be coupled to the first panel 210. The first panel 210 may be disposed between the second panel 220 and the cover layer 230.

In the illustrated embodiment, the first panel 210 may include a first surface 211 facing a first direction (e.g., + z-axis direction) and a second surface 212 facing a second direction (e.g., -z-axis direction) opposite the first direction. The first direction may be, for example, a direction toward a front surface of the electronic device 100 (e.g., a direction toward the first board 120 in fig. 3), and the second direction may be, for example, a direction toward a rear surface (e.g., a direction toward the second board 180 in fig. 3).

In the illustrated embodiment, the cover layer 230 may form at least a portion of a first board (e.g., the first board 120 of fig. 3), or at least a portion of the cover layer 230 may form a first surface (e.g., the first surface 110A of fig. 1) of a housing (e.g., the housing 110 of fig. 1) or a surface of the electronic device 100.

In various embodiments, the cover layer 230 may be formed to be transparent. The cover layer 230 may comprise a transparent material. In various embodiments, the cover layer 230 may be made of various materials. For example, the cover layer 230 may be made of glass or a polymer, such as Polyamide (PI) or polyethylene terephthalate (PET).

In various embodiments, the screen display region 201 may be formed on the cover layer 230 through the first panel 210 disposed in the second direction (e.g., -z-axis direction) of the cover layer 230. In addition, the sensing region 202 may be formed on the cover layer 230 by the sensor 240. For example, the sensing region 202 and the screen display region 201 may be formed to at least partially overlap each other.

In various embodiments, the sensor 240 may send/receive signals (e.g., light signals or ultrasonic signals). Signals may pass from the sensor 240 to the sensing region 202 to travel toward a portion of the user's body (e.g., a fingerprint of a finger), and signals reflected by that portion of the user's body may again pass through the sensing region 202 to travel to the sensor 240.

In the illustrated embodiment, the first panel 210 may include a pixel layer including a plurality of pixels 213. The pixel layer may form a screen display area 201 on a first plate (e.g., the first plate 120 of fig. 3) (or a front surface of the electronic device 100). In some embodiments, the first panel 210 may include a touch layer (not shown) including a plurality of touch sensors.

In the illustrated embodiment, the second panel 220 may include a buffer layer 221 for supporting the first panel 210 and a shielding layer 222 for shielding noise generated from the display module 200 from other electronic components (e.g., electronic components disposed on a printed circuit board). According to an embodiment, the shielding layer 222 may be a copper sheet (Cu sheet).

In various embodiments, the buffer layer 221 may include a layer for buffering an impact applied to the first panel 210. For example, the buffer layer 221 may include a light blocking layer (e.g., a black layer including an uneven pattern). For example, the light blocking layer may refer to a layer including a layer on which an uneven pattern (e.g., an embossed pattern) is formed and a black layer. The buffer layer 221 may include a buffer material for absorbing impact.

In some embodiments, the second panel 220 may further include a heat dissipation layer 223 for dissipating heat of the display module 200. In various embodiments, the heat spreading layer 223 may comprise a graphite material.

In various embodiments, the display module 200 may further include a Protective Film (PF) (not shown). For example, a protective film may be disposed between the first panel 210 and the second panel 220 to protect the first panel 210. As another example, the protective film may be included in the first panel 210.

In the second panel 220 illustrated in fig. 4, the buffer layer 221 may be disposed on the first panel 210, the shield layer 222 may be disposed on the buffer layer 221, and the heat dissipation layer 223 may be disposed on the shield layer 222, but is not limited thereto. For example, the second panel 220 disclosed in the present disclosure may be stacked in an order different from the

layers

221, 222, and 223 illustrated in fig. 4, or may further include additional layers, or may omit some layers.

In the illustrated embodiment, the display module 200 may include an opening 225 through the second panel 220. For example, the opening 225 may have a rectangular, square, circular, oval, or the like shape when the display module 200 is viewed in the + z-axis direction. As another example, the opening 225 may have a shape corresponding to a combination of various shapes. According to an embodiment, the opening 225 may pass through the second panel 220 when viewed in a second direction (e.g., -z-axis direction). For example, the second panel 220 may be directly exposed through the opening 225. As another example, the second surface 212 may be visually exposed through the opening 225 and a protective film (not shown). As another example, the protective film may be exposed through the opening 225. In this case, at least a portion of the sensor 240 may be disposed within the opening 225. For example, the size of the opening 225 may be larger than the size of the sensor 240 such that the inner wall 2252 is spaced apart from the side surface 243 of the sensor 240 that is mounted in at least a portion of the opening 225 by a predetermined interval d. The shape of the sensor 240 illustrated in fig. 4 is merely an example, and embodiments of the present disclosure are not limited thereto. For example, only a portion of the sensor 240 may be mounted in the opening 225 and the remaining portion of the sensor 240 may protrude from the opening 225. The size of the remaining portion of the sensor 240 protruding from the opening 225 may be larger than the size of the opening 225.

In the illustrated embodiment, the opening 225 can include a bottom surface 2251 and an inner wall 2252 that face each other. The bottom surface 2251 may include a portion of the second surface 212 of the first panel 210. The inner wall 2252 may include end faces of the plurality of layers (e.g., 221, 222, and 223) included in the second panel 220.

In the illustrated embodiment, the sensor 240 includes a first surface 241 disposed to face the first panel 210, a second surface 242 opposite the first surface 241, and a side surface 243 formed between the first surface 241 and the second surface 242.

In various embodiments, the sensor 240 may be inserted into the opening 225 such that the first surface 241 is attached to the bottom surface 2251 of the opening 225 and the side surface 243 is spaced apart from the inner wall 2252 of the opening 225 by a predetermined spacing d.

Hereinafter, the sensor 240 disclosed in various embodiments of the present disclosure may include an ultrasonic sensor. The ultrasound sensor may be configured to acquire biometric information of the user (e.g., a structure of a fingerprint) using ultrasound having a predetermined frequency. As the ultrasonic frequency increases, the resolution of the ultrasonic sensor may increase.

In various embodiments, the ultrasonic sensor may transmit ultrasonic waves toward a portion of the user's body adjacent to (e.g., in contact with) the sensing region 202 (sensing region 110F of fig. 1) formed on the cover layer 230, and may receive ultrasonic waves reflected by the portion of the user's body to obtain biometric information of the user. For example, the sensor 240 may be an ultrasonic fingerprint sensor for acquiring user fingerprint information, and the biometric information may correspond to a user fingerprint.

According to various embodiments, as described above with reference to fig. 4, a display module (e.g., display module 200 of fig. 4) may include a first panel (e.g., first panel 210 of fig. 4) including a plurality of light emitting elements and a second panel (e.g., second panel 220 of fig. 4) providing optical and/or electrical shielding for the first panel. In the following description, the second panel 220 may include a first layer 520 and a second layer 530.

According to an embodiment, the first layer 520 may mean at least one layer of the second panel 220 providing light shielding for the first panel 210. For example, the first layer 520 may be a black embossed layer. The first layer 520 may include an embossed pattern on at least one surface and may prevent light or moisture from being introduced into the first panel 210. The first layer 520 may include an adhesive layer 324, a black layer 323, and a polymer layer 322. For example, the polymer layer 322 may be made of PI or PET.

For example, the adhesive layer 324 may be a double-sided adhesive member that allows the first panel 210 and the second panel 220 to be adhered to each other. To prevent the formation of bubbles, the adhesive material may be applied in a non-uniform shape to the surface of the adhesive layer 324 facing the first panel 210 (e.g., the surface in the + z direction). An adhesive layer 324 may be disposed between the first panel 210 and the black layer 323.

For example, the black layer 323 may be disposed between the adhesive layer 324 and the polymer layer 322. The black layer 323 may be made of a black material (e.g., ink, etc.) to prevent external light from being introduced into the first panel 210 through the second panel 220.

For example, the polymer layer 322 can be a layer for maintaining a non-uniform pattern (e.g., an embossed pattern) of the first layer 520. The polymer layer 322 may be disposed between the black layer 323 and the second layer 530. The uneven pattern of the polymer layer 322 may prevent bubbles from being generated when attaching the first layer 520 and the second layer 530.

According to an embodiment, the second layer 530 may be a layer for electrical shielding and/or heat dissipation of the display module. For example, second layer 530 may include cushioning members 321 and a rear layer 531. The second layer 530 may be attached to the first layer 520 and an opposite surface of the first layer 520 to which the first panel 210 is attached.

For example, the buffer member 321 may be an impact absorbing member for absorbing impact. The first layer 520 and the buffer member 321 may constitute at least a portion of the buffer layer 221 of fig. 4. For example, the back layer 531 may correspond to the shielding layer 222 and/or the heat dissipation layer 223 of fig. 4.

Hereinafter, a mounting method of the sensor may be described based on the first layer 520 and the second layer 530. The configuration of the first layer 520 and the second layer 530 illustrated in fig. 5 is merely an example, and thus embodiments of the present disclosure are not limited thereto. For example, the first layer 520 may be a layer including at least a layer between the light shielding layer (e.g., the black layer 323) and the first panel 210.

After attaching to the first layer 520 and the second layer 530 of fig. 5, openings may be formed in at least some of the layers, and when a sensor (e.g., the sensor 240 of fig. 4) is attached to the back surface of the first panel 210 through the openings, the openings may have tolerances due to the thicknesses of the first layer 520 and the second layer 530. In addition, when the gap between the sensor 240 and the second layer 530 is too narrow, the electrical characteristics of the sensor 240 may be affected by the second layer 530 (e.g., the shielding layer 222). Hereinafter, a method for mounting the sensor 240 at the rear side of the first panel 210 may be described with reference to fig. 6 to 14.

Referring to reference

numerals

601 and 602 of fig. 6, according to an embodiment, a second opening 610 may be formed in the second layer 530. For example, the second opening 610 may be disposed at a lower end of the center of the second layer 530. The second opening 610 may include an area corresponding to a sensing area (e.g., sensing area 110f of fig. 1) of a first panel (e.g., first panel 210 of fig. 4). For example, the second opening 610 may be disposed to have at least a first offset on at least one surface of a mounting area of a sensor (e.g., the sensor 240 of fig. 4). As another example, the opening 610 may have substantially the same dimensions as the mounting area of the sensor 240.

Referring to reference numeral 603 of fig. 6, the first layer 520 may be attached to one surface of the second layer 530 according to an embodiment.

Referring to reference numeral 701 of fig. 7, according to an embodiment, after attaching to the first layer 520 and the second layer 530, a first opening 620 may be formed in the first layer 520. For example, the first opening 620 may be smaller than the second opening 610. The first opening 620 may be disposed to have at least a second offset on four surfaces of the mounting area of the sensor 240. The second offset may be less than the first offset of the second opening 610. For example, the first opening 620 may be formed by punching the first layer 520 through the second opening 610.

Referring to reference numeral 702 of fig. 7, according to an embodiment, after forming the first opening 620, the first panel 210 may be attached to the first layer 520. The sensor 240 may be attached to the first panel 210 through the first opening 620.

The formation methods of the second opening 610 and the first opening 620 described above with reference to fig. 6 and 7 are merely examples, and thus embodiments of the present disclosure are not limited thereto. According to an embodiment, after each of the second and

first openings

610 and 620 is formed, the first and

second layers

520 and 530 may be coupled to each other. For example, after the first layer 520 and the first panel 210 are coupled to each other, the second layer 530 and the first layer 520 may be coupled to each other. As another example, after first layer 520 and second layer 530 are coupled to one another, first layer 520 and first panel 210 may be coupled to one another. According to an embodiment, the second panel 220 may be coupled to the first panel 210 in a state where the sensor 240 is attached to the first panel 210. For example, the first panel 210 may further include a means (e.g., an air gap or a transparent material) for guiding a gap between the mounting area of the sensor 240 and the first opening 620.

Fig. 8 is a diagram illustrating a sensor mounting structure 801 according to an embodiment.

In fig. 8, a structure in which the sensor 240 is installed according to fig. 6 and 7 is illustrated. The sensor 240 may be indicated by a dashed line. For example, the sensor 240 may include a sensor part 810 and a Flexible Printed Circuit Board (FPCB) 820. Sensor portion 810 may be attached to first panel 210 by

adhesive dots

831, 832, 833, and 834. When infrared rays are irradiated to fix the sensor 240 to the first panel 210, the

adhesive dots

831, 832, 833 and 834 may be cured. Thereafter, the sensor 240 may be attached to the first panel 210 using an adhesive material (not shown) and a pressing process.

The first opening 620 may have an offset (e.g., a second offset) on at least a portion of four surfaces of the mounting area (e.g., the sensor portion 810) of the sensor 240, taking into account the

adhesive points

831, 832, 833, and 834 and the punching tolerance. In addition, the second opening 610 may have offsets (e.g., d1 and d2) on four surfaces of the first opening 620. For example, the offset d1 may be about 0.3 mm. For example, the offset d2 may be about 0.3 mm. The values of the offsets d1 and d2 described above are merely examples, and thus embodiments of the present disclosure are not limited thereto. As described above with reference to fig. 6 and 7, since the first opening 620 is formed through the second opening 610, only the first layer 520 may be formed by punching. For example, relatively accurate punching may be performed compared to punching the first layer 520 and the second layer 530 at the same time.

According to an embodiment, the second opening 610 may be formed to further include an offset on the slope of the first opening 620. For example, the second opening 610 also includes a third offset (e.g., about 0.3mm) relative to three surfaces of the first opening 620 and a fourth offset relative to the remaining one surface of the first opening 620. The fourth offset may be greater than the third offset. As illustrated in fig. 8, the second opening 610 may extend further to one side (e.g., -x-axis direction) when compared to the first opening 620. For example, the first opening 620 may be formed in the first layer 520 within the second opening 610, aligned with a center of a minor axis (e.g., y-axis) of the second opening 610, and aligned to be offset in the first direction from a center of a major axis (e.g., x-axis) of the second opening 610. For example, the first direction may be a direction (e.g., + x direction) opposite to a direction (e.g., -x direction) in which the FPCB820 extends from the sensor part 810. The above-described offset values are merely examples, and thus embodiments of the present disclosure are not limited thereto. For example, at least some of the values of the offsets described above may be different from the values of the remaining offsets.

Since the second opening 610 is larger than the first opening 620, a stepped portion affecting the x-axis of the FPCB820 may be formed in stages. On the other hand, when the first layer 520 and the second layer 530 are punched together to form the second opening 610, a stepped portion corresponding to the thickness of the first layer 520 and the second layer 530 may be applied to the FPCB 820. In this case, the FPCB820 may be bent due to the stepped portion. Accordingly, the stepped portion may be formed in stages to prevent the FPCB820 from being bent.

A first opening 620 relatively smaller than the second opening 610 may be formed in the first layer 520 to reduce a gap between a mounting area (e.g., the sensor portion 810) of the sensor 240 and the first opening 620. Since the first layer 520 has a light-shielding function, introduction of external light through the first opening 620 may be reduced. Since the gap is reduced, the external visibility of the sensor 240 may be reduced.

Examples in which the first opening 620 is formed in the second opening 610 have been described with reference to fig. 6 and 7, but embodiments of the present disclosure are not limited thereto. For example, as will be described later with reference to fig. 9 and 10, after the second opening 910 is formed, the second layer 530 and the first layer 520 are punched together to form the first opening 920. In this case, at least a portion of the first opening 920 and the second opening 910 may not overlap each other.

Referring to reference

numerals

901 and 902 of fig. 9, according to an embodiment, a second opening 910 may be formed in the second layer 530. For example, the second opening 910 may be provided to have an offset on one surface of a mounting area of a sensor (e.g., the sensor 240 of fig. 4). For example, the second opening 910 may be a region on which the FPCB of the sensor is to be mounted (e.g., an offset region formed on one surface of the sensor mounting region).

Referring to reference numeral 903 of fig. 9, according to an embodiment, after forming the second opening 910, the first layer 520 may be attached to one surface of the second layer 530.

Referring to reference numeral 1001 of fig. 10, according to an embodiment, after attaching the first and

second layers

520 and 530, a first opening 920 may be formed in the first and

second layers

520 and 530.

According to an embodiment, the first opening 920 may be larger than the second opening 910. For example, the long axis of the first opening 920 may be longer than the long axis of the second opening 910. For example, the minor axis of the first opening 920 may be longer than the minor axis of the second opening 910. For example, the major axis of the first opening 920 may be longer than the major axis of the second opening 910, and the minor axis of the first opening 920 may be longer than the minor axis of the second opening 910.

According to an embodiment, the first opening 920 may be formed to overlap a portion of the second opening 910. For example, the remaining area of the second opening 910 that does not overlap the first opening 920 may form a shielding area by the first layer 520. For example, the first opening 920 may be formed by punching a partial area of the first layer 520 corresponding to a portion of the second opening 910 and areas of the first layer 520 and the second layer 530 continuous with a portion of the second opening 910.

Referring to reference numeral 1002 of fig. 10, the first panel 210 may be attached to the first layer 520 after the first opening 920 is formed, according to an embodiment. The sensor 240 may be attached to the first panel 210 through the first opening 920.

The shapes of the second opening 910 and the first opening 920 described above with reference to fig. 10 are merely examples, and thus embodiments of the present disclosure are not limited thereto. For example, the second opening may have a square, oval or circular shape.

In fig. 11, a structure in which the sensor 240 is mounted according to fig. 9 and 10 is illustrated. The sensor 240 may be indicated by a dashed line. For example, the sensor 240 may include a sensor part 810 and a Flexible Printed Circuit Board (FPCB) 820. Sensor portion 810 may be attached to first panel 210 by

adhesive dots

The first opening 920 may have offsets (e.g., offsets d1 and d2) on four surfaces of a mounting area (e.g., the sensor part 810) of the sensor 240 in consideration of the

adhesive points

831, 832, 833 and 834 and a punching tolerance. For example, each of the offsets d1 and d2 may be about 0.7 mm.

According to an embodiment, the first layer 520 exposed through the first opening 920 may have a thick thickness in an x-y plane when compared to the FPCB 820. For example, the offset d3 of the first opening 920 with respect to one side of the FPCB820 may be about 0.7 mm.

Since the second opening 910 is formed to protrude from the first opening 920 in the extending direction of the FPCB820, a stepped portion in the x-axis affecting the FPCB820 may be formed in stages. The stepped portion may be formed in stages to prevent the FPCB820 from being bent. The FPCB820 can be prevented from being bent, and therefore, the offset of the first opening 920 with respect to the surface of the mounting region of the sensor (e.g., the sensor portion 810) in the extending direction of the FPCB820 can be reduced. Accordingly, a gap between the mounting region of the sensor 240 and the first opening 920 may be reduced. Since the first layer 520 has a light-shielding function, introduction of external light through the first opening 920 may be reduced. Since the gap is reduced, the external visibility of the sensor 240 may be reduced.

Since the second opening 910 is formed to protrude from the first opening 920 in the extending direction of the FPCB820, interference of the second layer 5300 with the FPCB82 can be reduced. For example, the electrical impact of the conductive layer of the second layer 530 (e.g., the shielding layer 222 of fig. 4) (e.g., a copper sheet) on the FPCB820 may be reduced.

In fig. 11, the first opening 920 is illustrated as protruding from a short axis of the second opening 910, but embodiments of the present disclosure are not limited thereto. For example, the second opening 910 may extendedly protrude from a long axis of the first opening 920. For example, the second opening 910 may extend in the + Y direction or the-Y direction from the long axis of the first opening 920.

Referring to fig. 12, according to an embodiment, a shielding member 1210 (e.g., a black tape) capable of covering at least a portion of the opening 225 (e.g., an opening region corresponding to a common region of the first opening (reference numeral 610 of fig. 6 or reference numeral 910 of fig. 9) and the second opening (reference numeral 620 of fig. 6 or reference numeral 920 of fig. 9)) may be added.

For example, as illustrated at reference numeral 1201, after the sensor 240 is installed, the shield member 1210 may be attached to the second layer 530 to cover the opening 225.

For example, as illustrated by reference numeral 1202, the shield member 1210 may be larger than at least the opening 225. When the shield member 1210 is used to block external light, the opening 225 may be formed by punching the first layer 520 and the second layer 530 at one time. The shape of the opening 225 of fig. 12 is merely an example, and thus, embodiments of the present disclosure are not limited thereto. For example, the shield member 1210 may be applied to the above-described type of opening described above with reference to fig. 6-11 on the same principle.

For example, as illustrated by reference numeral 1203, the shield member 1210 may be larger than at least the opening 225 (e.g., the first opening 620 of fig. 7). For example, the shield member 1210 may cover at least a portion of the second opening 610 of fig. 6. As another example, the shield member 1210 can extend to cover the entire second opening 610. As another example, the shield member 1210 may be formed to cover only the opening 225. In this case, the shielding member 1210 may be larger than the opening 225 and smaller than the second opening 610.

For example, as illustrated by reference numeral 1204, the shield member 1210 can be larger than at least the opening 225 (e.g., the first opening 920 of fig. 10). For example, the shield member 1210 may cover at least a portion of the second opening 910 of fig. 10. As another example, the shield member 1210 can extend to cover the entire second opening 910.

For example, as illustrated by reference numeral 1205, the shield member 1210 can be larger than at least the opening 225 (e.g., the first opening 620 of fig. 7). For example, the shield member 1210 may be larger than the opening 620 of fig. 7 and smaller than the second opening 610.

The shape of the shielding member 1210 illustrated in fig. 12 is merely an example, and embodiments of the present disclosure are not limited thereto. For example, the shielding member 1210 may have an annular shape formed to shield a gap between the opening 250 and the sensor 240. As another example, the shield member 1210 may be formed to shield only a portion of the opening 250.

As illustrated by reference numeral 1301, according to an embodiment, an adhesive material 1310 may be used to shield external light. For example, one opening 225 may be formed after the first layer 520 and the second layer 530 are bonded to each other. In this case, the adhesive material 1310 used to attach the sensor (e.g., sensor 240 of fig. 4) to the first panel 210 through the opening 225 may be applied in a specified pattern. For example, the adhesive material 1310 may be an impermeable adhesive material (e.g., black resin). An adhesive material 1310 may be applied over the entire opening 225 to prevent external light transmission.

Fig. 14 is a flow diagram illustrating a sensor mounting method 1400 according to an embodiment.

According to various embodiments, the sensor mounting method 1400 may include an operation (e.g., operation 1405) of forming a first opening (e.g., the first opening 620 of fig. 6 or the first opening 920 of fig. 9) in a second layer (e.g., the second layer 530 of fig. 5). For example, the first opening may be formed by punching the second layer in a prescribed shape.

According to various embodiments, the sensor mounting method 1400 may include an operation (e.g., operation 1410) of attaching a first layer (e.g., the first layer 520 of fig. 5) to a second layer.

According to various embodiments, the sensor installation method 1400 may include an operation (e.g., operation 1415) of forming a second opening (e.g., the second opening 610 of fig. 7 or the second opening 910 of fig. 10). For example, the second opening (e.g., the second opening 610 of fig. 7) may be formed by punching the first layer in a specified shape through the first opening. As another example, a second opening (e.g., second opening 910 of fig. 10) can be formed by punching the first and second layers in a specified shape.

According to various embodiments, the sensor mounting method 1400 may include an operation (e.g., operation 1420) of attaching a third layer (e.g., the first panel 210 of fig. 4) to the first layer. For example, the third layer may be attached to a second surface of the first layer that is opposite the first surface of the first layer to which the first and second layers of the first layer are bonded.

According to various embodiments, the sensor mounting method 1400 may include an operation (e.g., operation 1425) of attaching a sensor (e.g., the sensor 240 of fig. 4) on the third layer through the second opening. For example, the operation of attaching the sensor may include the operations of: applying a thermosetting resin to at least a portion within the second opening, attaching the sensor 240 to the thermosetting resin, injecting an ultraviolet curable adhesive into corners of the second portion of the sensor 240 (e.g., the sensor portion 810 of fig. 8), irradiating ultraviolet light to cure the adhesive, loading the display to which the sensor 240 is attached to allow the chamber pressure to increase in order to remove bubbles of the thermosetting resin, and unloading the display from the chamber to thermally cure the thermosetting resin.

According to an embodiment, the sensor mounting method 1400 may further include an operation of allowing a non-transmissive adhesive member (e.g., the shielding member 1210 of fig. 12) to adhere to the second layer 530 so as to cover the first opening.

The sensor mounting method 1400 described above with reference to fig. 14 is merely an example, and thus, embodiments of the present disclosure are not limited thereto. For example, operation 1415 may be performed before operation 1410. As another example, attaching the sensor (e.g., operation 1425) may be performed prior to attaching the third layer (e.g., operation 1420).

In fig. 15, the first layer 520 and the second layer 530 may include openings formed by the process of

reference numerals

901, 902, and 903 of fig. 9 and reference numeral 1001 of fig. 10. Referring to reference numeral 1500, the first layer 520 may include a third opening 1510 formed in the process of forming a second opening (e.g., the first opening 920 of fig. 10). The second layer 530 may include a fourth opening 1520 formed in the process of forming the second opening (e.g., the first opening 920 of fig. 10) and the first opening (e.g., the second opening of fig. 10).

Referring to reference numeral 1501, the second layer 530 may include a fourth opening 1520. For example, the fourth opening 1520 may include a major axis having a length of L1 and a minor axis having a length of S1. The fourth opening 1520 may include a protrusion 1525 extending to one side of the fourth opening 1520. For example, the protrusion 1525 may extend in a direction in which the FPCB of the sensor extends from the sensor when the sensor (e.g., the sensor 240 of fig. 4) is installed. For example, the protrusion may have a length L3 and a height S2. The remaining area of the fourth opening 1520 (the area having the length L2 and the height S1) excluding the protrusion 1525 may be larger than the mounting area of the sensor (e.g., the sensor section 810 of fig. 8).

For example, the second layer 530 may include a layer (e.g., a copper sheet) that provides electrical shielding. The protrusion 1525 may reduce electrical and physical interference of the sensor with respect to the FPCB when the sensor is mounted.

Referring to reference numeral 1502, the first layer 520 may include a third opening 1510. For example, the third opening 1510 may include a major axis having a length L2 and a minor axis having a length S1. Since the third opening 1510 does not include the protrusion 1525, a portion of the first layer 520 may be exposed through the protrusion 1525 of the second layer 530 after attaching the first layer 520 and the second layer 530. The third opening 1510 may correspond to an area on which a sensor is attached to a display panel (e.g., the first panel 210 of fig. 4).

According to various embodiments, an electronic device (e.g., electronic device 100 of fig. 1) may include a housing (e.g., housing 110 of fig. 1), a display module (e.g., display 101 of fig. 1), and a sensor (e.g., sensor 240 of fig. 4). The display module may include a first panel (e.g., the first panel 210 of fig. 4) including a first surface, a second surface opposite the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer (e.g., the cover layer 230 of fig. 4) disposed on the first surface of the first panel, and a second panel (e.g., the second panel 220 of fig. 4) disposed on the second surface of the first panel. The sensor may be coupled to the second surface of the first panel. For example, the sensor may form a sensing region (e.g., sensing region 110F of fig. 1) on one surface of the housing. The display module may include an opening (e.g., opening 225 of fig. 4) through the second panel and in which at least a portion of the sensor is disposed. The second panel may include a first layer (e.g., first layer 520 of fig. 5) coupled to the first panel on one surface thereof and a second layer (e.g., second layer 530 of fig. 5) coupled to the first layer on an opposite surface of the one surface of the first layer. The opening may correspond to a region where a first opening (e.g., the third opening 1510 of fig. 15) formed in the first layer and a second opening (e.g., the fourth opening 1520 of fig. 15) formed in the second layer overlap each other. The sensor may include a Flexible Printed Circuit Board (FPCB) (e.g., FPCB820 of fig. 8) extending in a first direction from a mounting area of the sensor. The second opening may include a region corresponding to the first opening and a protrusion (e.g., protrusion 1525 of fig. 15) extending from the region corresponding to the first opening in the first direction.

According to an embodiment, the second layer may comprise a conductive layer providing electrical shielding and the first layer may comprise a layer providing light shielding.

According to an embodiment, the first layer may include at least one of an adhesive layer (e.g., an adhesive layer 324 in fig. 5) for allowing the first layer to be adhered to the first panel, a black layer (e.g., a black layer 323 in fig. 5) providing light shielding, or a polymer layer (e.g., a polymer layer 322 in fig. 5) including an embossed pattern.

According to an embodiment, the second layer may include at least one of a buffer member (buffer member 321 in fig. 5) including a buffer material, a shield layer (e.g., shield layer 222 in fig. 4) providing an electrical shield, or a heat dissipation layer (e.g., heat dissipation layer 223 in fig. 4). For example, the shielding layer may correspond to a copper sheet.

According to an embodiment, the opening may be formed by coupling the first layer to the second layer after forming a third opening (e.g., the second opening 910 of fig. 9) including at least the area of the protrusion in the second layer to punch out an area (e.g., the first opening 920 of fig. 10) corresponding to the shape of the first opening. As another example, the opening may be formed by forming a second opening in the second layer and coupling the first layer to the second layer after forming the first opening in the first layer. For example, the opening may be larger than the mounting area of the sensor.

According to an embodiment, the electronic device may further include a processor, and the sensor may be electrically connected to the processor through the FPCB. The processor may be configured to acquire, by using the sensor, biometric information received by the sensor through the first panel.

According to an embodiment, the first panel may further include a protective film forming the second surface.

According to an embodiment, the second layer may include a third surface on which the second layer is coupled to the first layer and a fourth surface facing a direction opposite to the third surface. The display module may further include a shielding member (e.g., shielding member 1210 of fig. 12) attached to the fourth surface of the second layer, covering at least a portion of the first opening, and providing light shielding.

According to various embodiments, a display device (e.g., the display 101 of fig. 1) may include a first panel (e.g., the first panel 210 of fig. 4) including a first surface, a second surface opposite the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer (e.g., the cover layer 230 of fig. 4) disposed on the first surface of the first panel and forming one surface of a housing, and a second panel (e.g., the second panel 220 of fig. 4) disposed on the second surface of the first panel. The display device may include an opening (e.g., opening 225 of fig. 4) through at least a portion of the second panel and in which at least a portion of a sensor (e.g., sensor 240 of fig. 4) is disposed. The second panel may include a first layer coupled to the first panel at one surface thereof and a second layer coupled to the first layer on an opposite surface of the one surface of the first layer. The second panel may include a first layer (e.g., first layer 520 of fig. 5) coupled to the first panel on one surface thereof and a second layer (e.g., second layer 530 of fig. 5) coupled to the first layer on an opposite surface of the one surface of the first layer. The opening may correspond to a region where a first opening (e.g., the third opening 1510 of fig. 15) formed in the first layer and a second opening (e.g., the fourth opening 1520 of fig. 15) formed in the second layer overlap each other. The sensor may include a Flexible Printed Circuit Board (FPCB) (e.g., FPCB820 of fig. 8) extending in a first direction from a mounting area of the sensor. The second opening may include a region corresponding to the first opening and an extension (e.g., protrusion 1525 of fig. 15) extending from the region corresponding to the first opening in the first direction.

According to an embodiment, the opening may be formed by coupling the first layer to the second layer after forming a third opening (e.g., the second opening 910 of fig. 9) including at least a region of the extension in the second layer to punch out a region (e.g., the first opening 920 of fig. 10) corresponding to a shape of the first opening. The opening may be formed by forming a second opening in the second layer and coupling the first layer to the second layer after forming the first opening in the first layer. For example, the opening may be larger than the mounting area of the sensor.

According to an embodiment, the second layer may include a third surface of the second layer coupled to the first layer and a fourth surface facing a direction opposite to the third surface. The display module may further include a shielding member (e.g., shielding member 1210 of fig. 12) attached to the fourth surface of the second layer, covering the first opening, and providing light shielding. According to an embodiment, the first panel may further include a protective film forming the second surface.

According to an embodiment, the sensor may be configured to acquire biometric information (e.g., a fingerprint) based on the ultrasound. The sensor may be coupled to the first panel with an adhesive material (e.g., adhesive material 1310 of fig. 13) applied to the first panel through the opening.

Various embodiments of the present disclosure and terms used herein are not intended to limit the technology described in the present disclosure to specific embodiments, but should be understood to include various modifications, equivalents, and/or alternatives to the embodiments. In the description with reference to the drawings, like reference numerals may be used to refer to the same or like parts. Terms in the singular may include the plural unless indicated to the contrary. In the present disclosure, expressions such as "a or B", "at least one of a or/and B", "A, B or C", and "A, B and/or at least one of C" may include all possible combinations of the items listed together. Expressions such as "first", "second", "first" or "second" may modify corresponding components irrespective of order or importance and are only used to distinguish one component from another component, without limiting the components. When any (e.g., first) component is referred to as being "connected (functionally or communicatively)" or "connected" to another (e.g., second) component, any component may be directly connected to the other component or may be connected through the other component (e.g., third component).

In this disclosure, "adapted to or configured to" may mean, for example, "adapted to", "having. In some cases, the expression "a device configured" may mean that the device is "capable" of being used in conjunction with other devices or components. For example, the phrase "a processor configured (or configured to execute) A, B and C" may refer to, for example, a dedicated processor (e.g., an embedded processor) for performing the corresponding operations or a general-purpose processor (e.g., a CPU or an AP) for performing the corresponding operations by executing one or more programs stored in a storage device.

As used herein, the term "module" includes a unit of hardware, software, or firmware and may be used interchangeably with the above terms such as, for example, logic blocks, components, or circuits. A "module" may be an integrally formed component or a minimal unit or part of one or more functions. A "module" may be implemented, for example, mechanically or electrically, and may include an Application Specific Integrated Circuit (ASIC) chip, a Field Programmable Gate Array (FPGA), or a programmable logic device that performs certain operations and is known or to be developed.

At least a portion of the apparatus (e.g., modules thereof or functionality thereof) or methods (e.g., operations) according to various embodiments may be implemented as instructions stored in the form of program modules in a computer-readable storage medium. When the instructions are executed by the processor, the processor may perform functions corresponding to the instructions. The computer readable recording medium may include a hard disk, a floppy disk, a magnetic medium (e.g., a magnetic tape), an optical recording medium (e.g., a CD-ROM, a DVD, a magneto-optical medium (e.g., a floppy disk), an internal memory, etc.

According to various embodiments, each of the components (e.g., modules or programs) may comprise a single object or multiple objects. Here, some of the above-mentioned sub-components may be omitted, or other sub-components may also be included. Alternatively or in addition, some components (e.g., modules or programs) may be integrated into one object to perform the same or similar functions of each corresponding component prior to integration. Operations performed by modules, programs, or other components may, according to various embodiments, be performed serially, in parallel, repeatedly, or heuristically, or at least some of the operations may be performed in a different order, omitted, or added in a different order.

Claims

1. An electronic device, the electronic device comprising:

a housing;

a display module including a first panel including a first surface, a second surface facing the first surface, and a plurality of pixels disposed between the first surface and the second surface, a cover layer disposed on the first surface of the first panel, and a second panel disposed on the second surface of the first panel; and

a sensor disposed on the second surface of the first panel,

wherein the display module includes an opening through the second panel and in which at least a portion of the sensor is disposed,

wherein the second panel comprises a first layer coupled to the first panel on one surface thereof and a second layer coupled to the first layer on an opposite surface of the one surface of the first layer,

wherein the opening corresponds to a region where a first opening formed in the first layer and a second opening formed in the second layer overlap each other,

wherein the sensor includes a Flexible Printed Circuit Board (FPCB) extending from a mounting area of the sensor in a first direction, and

wherein the second opening includes a region corresponding to the first opening and a protrusion extending from the region corresponding to the first opening in the first direction.

2. The electronic device of claim 1, wherein the second layer comprises a conductive layer configured to provide electrical shielding, and

wherein the first layer comprises a layer configured to provide light shielding.

3. The electronic device of claim 2, wherein the first layer comprises at least one of an adhesive layer configured to adhere the first layer to the first panel, a black layer configured to provide light shielding, or a polymer layer comprising an embossed pattern.

4. The electronic device of claim 2, wherein the second layer comprises at least one of a buffer layer comprising a buffer material, a shielding layer configured to provide electrical shielding, or a heat dissipation layer.

5. The electronic device of claim 4, wherein the shielding layer corresponds to a copper sheet.

6. The electronic device according to claim 1, wherein the opening is formed by coupling the first layer to the second layer by punching an area corresponding to a shape of the first opening after forming a third opening including at least an area of the protrusion in the second layer.

7. The electronic device of claim 1, wherein the opening is formed by forming the second opening in the second layer and coupling the first layer to the second layer after forming the first opening in the first layer.

8. The electronic device of claim 1, further comprising a processor,

wherein the sensor is electrically connected to the processor through the FPCB, and

wherein the processor is configured to acquire, with the sensor, biometric information received by the sensor through the first panel.

9. The electronic device of claim 8, wherein the FPCB extends onto the second layer via the protrusion.

10. The electronic device of claim 1, wherein the second layer comprises a third surface coupled to the first layer and a fourth surface facing a direction opposite to a direction of the third surface, and

wherein the display module further comprises a shielding member attached to the fourth surface of the second layer, covering at least a portion of the first opening, and providing light shielding.

11. A display device, the display device comprising:

a first panel including a first surface, a second surface facing the first surface, and a plurality of pixels disposed between the first surface and the second surface;

a cover layer disposed on the first surface of the first panel;

a display module including a second panel disposed on the second surface of the first panel; and

a sensor coupled to the second surface of the first panel,

wherein the display module includes an opening through at least a portion of the second panel and in which at least a portion of the sensor is disposed,

wherein the second opening includes a region corresponding to the first opening and an extension extending from the region corresponding to the first opening in the first direction.

12. The display device of claim 11, wherein the second layer comprises a conductive layer configured to provide electrical shielding, and

wherein the first layer comprises a shielding layer configured to provide light shielding.

13. The display device of claim 12, wherein the first layer comprises at least one of an adhesive layer configured to adhere the first layer to the first panel, a black layer configured to provide light shielding, or a polymer layer comprising an embossed pattern.

14. The display device of claim 12, wherein the second layer comprises at least one of a buffer layer comprising a buffer material, a shielding layer configured to provide electrical shielding, or a heat dissipation layer.

15. The display device of claim 14, wherein the shielding layer corresponds to a copper sheet.