CN113433446A - Three-temperature test system and control method - Google Patents
Three-temperature test system and control method Download PDFInfo
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- CN113433446A CN113433446A CN202110559021.7A CN202110559021A CN113433446A CN 113433446 A CN113433446 A CN 113433446A CN 202110559021 A CN202110559021 A CN 202110559021A CN 113433446 A CN113433446 A CN 113433446A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2868—Complete testing stations; systems; procedures; software aspects
- G01R31/287—Procedures; Software aspects
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Abstract
The invention discloses a three-temperature test system and a control method, wherein a control module sends a temperature switching instruction to a heat flow module, the heat flow module can realize automatic switching of temperature, the whole temperature switching and chip testing process can be automatically realized as long as a test starting instruction is input until the test is finished, the whole process is quick and convenient, manual follow-up and processing are not needed in the middle, the test speed is greatly improved, the time and the labor are saved, and the labor cost is reduced; the heat flow module adopts a heat flow cover, so that rapid high-low temperature cycle switching can be provided, and the requirement of rapid test is met; the built-in Magnum2 test system of tester can carry out comparatively comprehensive function detection to the chip, satisfies chip test requirement.
Description
Technical Field
The invention relates to the technical field of chip reliability testing, in particular to a three-temperature testing system and a control method.
Background
The chip is praised as the core of grain and manufacture in industry, and the chip is not available in various industries. Due to the difference of the chip application environments, the reliability test of the chip is very necessary. The three-temperature test of the chip refers to the functional test of the chip at three temperatures of high temperature, normal temperature and low temperature. The conventional practice of a general chip three-temperature test is as follows: 1. setting a temperature on the thermal flow device; 2. starting a test program for testing after the temperature of the heat flow equipment is stable; 3. setting another temperature after the test; 4. starting a test program for testing after the temperature is stable; and circulating the steps and carrying out temperature test. However, the conventional method has the following disadvantages: the efficiency is low, every time a temperature is tested, the temperature is required to be manually switched and started, the whole testing process needs personnel to follow and process, time and labor are wasted, the labor cost is high, and automatic testing cannot be realized.
Therefore, the prior art still needs to be improved and developed.
Disclosure of Invention
The invention aims to provide a three-temperature test system and a control method, and aims to solve the problems that the existing three-temperature test needs manual temperature switching and starting, the whole process needs follow-up and processing by personnel, time and labor are wasted, and the labor cost is high.
The technical scheme of the invention is as follows: this technical scheme provides a three temperature test system, includes:
the heat flow module is used for providing different test temperatures for the chips to be tested;
the tester is used for performing functional test on the chips to be tested at different test temperatures;
the control module is used for controlling the automatic operation of the heat flow module and the testing machine;
when the chip to be tested needs to be switched to different temperatures for testing, the control module sends a control signal to control the heat flow module to automatically switch the temperatures.
In the technical scheme, the control module sends the temperature switching instruction to the heat flow module, the heat flow module can realize automatic switching of the temperature, the whole temperature switching and the chip testing process can be automatically realized as long as a test starting instruction is input, the whole temperature switching and the chip testing process are completed until the test is completed, manual follow-up and processing are not needed in the middle, the testing speed is greatly improved, the time and the labor are saved, and the labor cost is reduced.
Further, the heat flow module adopts a heat flow cover.
Further, the tester is internally provided with a Magnum2 test system.
Further, the control module adopts a PC.
Furthermore, the heat flow module and the control module are in communication connection by adopting a communication interface bus.
Furthermore, a GPIB interface is arranged on the heat flow module, a GPIB interface is arranged on the control module, and the heat flow module and the control module are in communication connection by adopting a universal interface bus.
Further, the control module is in communication connection with the tester through a local area network.
Further, the control module is in communication connection with the tester through the Ethernet.
The technical scheme also provides a control method of the three-temperature test system, which specifically comprises the following steps:
s1: starting a test according to the test instruction;
s2: the control module sends a switching temperature instruction to the heat flow module;
s3: the heat flow module switches the temperature according to the switching temperature instruction and feeds back the temperature switching state to the control module;
s4: after the heat flow module finishes switching the temperature, a temperature switching finishing signal is fed back to the control module;
s5: the control module sends a test starting signal to the test machine, and the test machine performs function test on the chip to be tested at a set temperature;
s6: and circularly executing S2 to S5 until the functional test of the chip to be tested at different temperatures is completed.
Further, before step S1, the following process is also included: debugging a test program in the tester; different test temperatures are preset on the heat flow module.
According to the technical scheme, the control module sends the temperature switching instruction to the heat flow module to control the heat flow module to automatically realize temperature switching, and after the temperature switching is finished, the control module sends the test starting instruction to the test machine to control the test machine to automatically perform function test on the chip, so that the whole process is rapid and convenient, and manual follow-up and processing are not needed; the heat flow module adopts a heat flow cover, so that rapid high-low temperature cycle switching can be provided, and the requirement of rapid test is met; the built-in Magnum2 test system of tester can carry out comparatively comprehensive function detection to the chip, satisfies chip test requirement.
Drawings
FIG. 1 is a schematic diagram of a three-temperature testing system according to the present invention.
FIG. 2 is a flow chart illustrating the steps of a control method of the three-temperature test system according to the present invention.
Reference numerals:
a heat flow module 1; a testing machine 2; and a control module 3.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures. Meanwhile, in the description of the present application, the terms "first", "second", and the like are used only for distinguishing the description, and are not to be construed as indicating or implying relative importance.
As shown in fig. 1, a three-temperature test system includes:
the heat flow module 1 is used for providing different test temperatures for the chips to be tested;
the tester 2 is used for performing functional tests on the chips to be tested at different test temperatures;
the control module 3 is used for controlling the automatic operation of the heat flow module 1 and the testing machine 2;
when the chip to be tested needs to switch different temperatures for testing, the control module 3 sends a control signal to control the heat flow module 1 to automatically switch the temperatures.
In some embodiments, the thermal flow module 1 employs a thermal flow cover, and during testing, the chip to be tested is placed in the thermal flow cover, so that the chip to be tested is tested at different testing temperatures. The heat flux cover can provide rapid high-low temperature cycle switching, and meets the requirement of rapid test.
In some embodiments, the tester 2 has a Magnum2 test system built in (Magnum II test system is an automatic memory test system manufactured by terradyne corporation, shanghai). The Magnum II test system has a powerful algorithm module APG (Algorithmic Pattern Generator), and can generate various test programs, namely test patterns, such as a checkerboard test program, an anti-checkerboard test program, a full-space full-1 test, a full-space full-0 test, a read-write cumulative number test, a read-write random number test, a diagonal test and the like.
In some embodiments, the control module 3 may be implemented by using various modules with control functions according to actual needs. In this embodiment, in order to reduce the test cost, the control module 3 employs a PC (personal computer).
In some embodiments, the thermal flow module 1 and the control module 3 are communicatively connected by a communication interface bus (e.g., a serial communication interface bus). In this embodiment, a GPIB Interface is provided on the thermal current module 1, a GPIB Interface is provided on the control module 3, the thermal current module 1 and the control module 3 are communicatively connected by using a General Purpose Interface Bus (i.e., GPIB, General-Purpose Interface Bus), and GPIB improves the transmission rate and the total number of devices supported at the same time compared with the serial port control.
In some embodiments, the control module 3 is communicatively coupled to the tester 2 via a local area network. In this embodiment, the control module 3 is in communication connection with the tester 2 through an ethernet. The advantages of ethernet are numerous: the compatibility is good, and the method has wide technical support; easy to connect to the Internet; the cost is low; great sustainable development potential, high communication rate, and the like.
As shown in fig. 2, a control method of the three-temperature test system described above specifically includes the following steps:
s1: starting a test according to the test instruction;
s2: the control module 3 sends a switching temperature instruction to the heat flow module 1;
s3: the heat flow module 1 switches the temperature according to the switching temperature instruction; and feeds back the temperature switching state to the control module 3;
s4: after the heat flow module 1 finishes temperature switching, a temperature switching finishing signal is fed back to the control module 3;
s5: the control module 3 sends a test starting signal to the test machine 2, and the test machine 2 performs function test on the chip to be tested at a set temperature;
s6: and circularly executing S2 to S5 until the functional test of the chip to be tested at different temperatures is completed.
In some embodiments, to ensure the testing is performed successfully, before step S1, the following process is further included: debugging a test program in the tester 2; different test temperatures are predefined on the thermal flow module 1.
The three-temperature test system has the following specific operation process: debugging a chip test program in the tester 2; presetting three test temperatures of high temperature, normal temperature and low temperature to be tested on the heat flow cover 1; the control module 3 is communicated with the tester 2 through Ethernet, and the control module 3 is communicated with the heat flow cover 1 through GPIB; after testing a temperature, the control module 3 will send a wait command to the testing machine 2 through the ethernet, so that the testing machine 2 suspends the test; a switching temperature instruction is sent to the heat flow cover 1 through the GPIB, and the heat flow cover 1 feeds back a busy signal to the control module 3 through the GPIB; and (3) sending a 'ready' signal to the control module 3 again by the heat flow cover 1 until the temperature switching is completed, sending a 'start' signal to the testing machine 2 by the Ethernet after the control module 3 receives the 'ready' signal, starting the functional test of the chip by the testing machine 2, and repeating the steps to complete the automatic temperature switching and realize the automatic test.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus and method may be implemented in other ways. The above-described embodiments of the apparatus are merely illustrative, and for example, the division of the units is only one logical division, and there may be other divisions when actually implemented, and for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection of devices or units through some communication interfaces, and may be in an electrical, mechanical or other form.
In addition, units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.
Furthermore, the functional modules in the embodiments of the present application may be integrated together to form an independent part, or each module may exist separately, or two or more modules may be integrated to form an independent part.
In this document, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
The above description is only an example of the present application and is not intended to limit the scope of the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A three-temperature test system, comprising:
the heat flow module is used for providing different test temperatures for the chips to be tested;
the tester is used for performing functional test on the chips to be tested at different test temperatures;
the control module is used for controlling the automatic operation of the heat flow module and the testing machine;
when the chip to be tested needs to be switched to different temperatures for testing, the control module sends a control signal to control the heat flow module to automatically switch the temperatures.
2. The three-temperature test system according to claim 1, wherein the thermal flow module employs a thermal flow hood.
3. The three-temperature testing system according to claim 1, wherein the tester has a Magnum2 testing system built in.
4. The three-temperature test system according to claim 1, wherein the control module is a PC.
5. The three-temperature test system according to claim 1, wherein the heat flow module and the control module are communicatively connected by a communication interface bus.
6. The three-temperature test system according to claim 5, wherein a GPIB interface is provided on the heat flow module, a GPIB interface is provided on the control module, and the heat flow module and the control module are communicatively connected by a general purpose interface bus.
7. The three-temperature test system according to claim 1, wherein the control module is communicatively coupled to the tester via a local area network.
8. The three-temperature test system according to claim 7, wherein the control module is communicatively coupled to the tester via an ethernet network.
9. A method for controlling a three-temperature test system according to any one of claims 1 to 8, comprising the steps of:
s1: starting a test according to the test instruction;
s2: the control module sends a switching temperature instruction to the heat flow module;
s3: the heat flow module switches the temperature according to the switching temperature instruction and feeds back the temperature switching state to the control module;
s4: after the heat flow module finishes switching the temperature, a temperature switching finishing signal is fed back to the control module;
s5: the control module sends a test starting signal to the test machine, and the test machine performs function test on the chip to be tested at a set temperature;
s6: and circularly executing S2 to S5 until the functional test of the chip to be tested at different temperatures is completed.
10. The control method of a three-temperature test system according to claim 9, further comprising, before step S1, the steps of: debugging a test program in the tester; different test temperatures are preset on the heat flow module.
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| CN202110559021.7A CN113433446A (en) | 2021-05-21 | 2021-05-21 | Three-temperature test system and control method |
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| CN202110559021.7A CN113433446A (en) | 2021-05-21 | 2021-05-21 | Three-temperature test system and control method |
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| CN117825917A (en) * | 2023-12-25 | 2024-04-05 | 芯洲科技(北京)股份有限公司 | Chip three-temperature test method, device, equipment and storage medium |
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