CN113432964A - Connecting piece, test equipment and test method of wafer - Google Patents

Connecting piece, test equipment and test method of wafer Download PDF

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Publication number
CN113432964A
CN113432964A CN202110730899.2A CN202110730899A CN113432964A CN 113432964 A CN113432964 A CN 113432964A CN 202110730899 A CN202110730899 A CN 202110730899A CN 113432964 A CN113432964 A CN 113432964A
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China
Prior art keywords
bearing surface
bearing
connecting piece
connector
sample
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CN202110730899.2A
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Chinese (zh)
Inventor
黄思杰
王超
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Yangtze Memory Technologies Co Ltd
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Yangtze Memory Technologies Co Ltd
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Priority to CN202110730899.2A priority Critical patent/CN113432964A/en
Publication of CN113432964A publication Critical patent/CN113432964A/en
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/02—Details
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N19/00—Investigating materials by mechanical methods
    • G01N19/04—Measuring adhesive force between materials, e.g. of sealing tape, of coating
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N3/00—Investigating strength properties of solid materials by application of mechanical stress
    • G01N3/08—Investigating strength properties of solid materials by application of mechanical stress by applying steady tensile or compressive forces

Abstract

The application discloses a connecting piece, a test device and a test method of a wafer, wherein the connecting piece comprises a connecting part and a mounting part, the connecting part comprises a plurality of bearing surfaces, each bearing surface can be used for bearing a sample to be tested, at least part of the mounting part is positioned between all the bearing surfaces, and the extending direction of the mounting part comprises a component parallel to any bearing surface. According to the design, the plurality of bearing surfaces are arranged on the connecting part of the connecting piece, each bearing surface can be used for being connected with a sample to be tested to be used for tensile stress testing, and compared with the situation that only one bearing surface is arranged on the connecting piece in the related technology to supply the sample to be tested to be connected to be used for the tensile stress testing, the plurality of bearing surfaces on the connecting part of the same connecting piece can be switched to be used after improvement, the times that the same connecting piece can be used for the tensile stress testing are increased, the consumable utilization rate of the connecting piece is improved, and the purpose of greatly reducing the production cost.

Description

Connecting piece, test equipment and test method of wafer
Technical Field
The application relates to the technical field of tension testing, in particular to a connecting piece, testing equipment and a testing method of a wafer.
Background
In order to improve the reliability of the sample to be tested, the tensile stress test can be performed on the bonding strength between the film layers of the sample to be tested, for example, the sample to be tested can be bonded and fixed on the connecting piece by using bonding glue, then the connecting piece is installed on the tensile stress test equipment, then the tensile stress test equipment is started, the tensile stress test equipment applies tensile force to the sample to be tested until different film layers of the sample to be tested are just separated, and the value measured by the tensile stress test equipment is the maximum tensile stress capable of being borne by the sample to be tested.
Because the connecting piece belongs to the consumable article in the tensile stress test, therefore, how to promote the consumptive material utilization ratio of connecting piece has become the problem that awaits a urgent need to solve.
Disclosure of Invention
The embodiment of the application provides a connecting piece, a testing device and a testing method of a wafer, which can effectively improve the utilization rate of consumables of the connecting piece so as to greatly reduce the production cost.
In a first aspect, an embodiment of the present application provides a connecting piece, configured to be connected to a sample to be tested, and configured to detect a tensile stress of the sample to be tested; the connecting piece comprises a connecting part and a mounting part, wherein the connecting part comprises a plurality of bearing surfaces, each bearing surface can be used for bearing a sample to be tested, at least part of the mounting part is positioned between all the bearing surfaces, and the extending direction of the mounting part comprises a component parallel to any bearing surface.
Based on the connecting piece of this application embodiment, set up a plurality of loading faces on the connecting portion of connecting piece, each loading face all can be used for being connected in order being used for the tensile stress test with the sample that awaits measuring, only set up a loading face on the connecting piece for the sample that awaits measuring in the correlation technique and connect in order being used for the tensile stress test, a plurality of loading faces on the connecting portion of same connecting piece can switch over the use after the improvement, the number of times that same connecting piece can be used to the tensile stress test has been increased, thereby promote the consumptive material utilization ratio of connecting piece, reach the purpose that reduces manufacturing cost by a wide margin.
In some of these embodiments, the mounting portion is a mounting hole that extends through the connection portion.
Based on above-mentioned embodiment, through designing the installation department into the mounting hole of through connection portion, the connecting piece can rotate for test equipment and adjust the bearing surface of being connected with the sample that awaits measuring to realize being connected between with test equipment through the mounting hole, reduced the switching degree of difficulty of the bearing surface of connection portion.
In some embodiments, the plurality of bearing surfaces are sequentially connected end to end on the connecting portion, or the connecting portion further includes a plurality of connecting surfaces, and the plurality of connecting surfaces and the plurality of bearing surfaces are sequentially connected in a staggered manner on the connecting portion.
Based on the embodiment, the arrangement mode of the bearing surfaces on the connecting part is designed to be sequentially connected end to end, so that the processing difficulty of processing the bearing surfaces on the connecting part of the connecting piece is reduced, and the bearing surfaces of the connecting part can be switched every time the connecting part rotates for a certain angle, so that the switching difficulty of the bearing surfaces of the connecting part is reduced; through designing into the mode of laying of a plurality of connection faces and a plurality of loading faces on connecting portion and in proper order the cross connection, the back is polished many times to the loading face that sets up in a staggered manner each other, and the connection face of connecting two adjacent loading faces on the connecting portion probably is polished completely, finally probably makes connecting portion polished into the condition that a plurality of loading faces connect gradually, can continue to utilize this connecting piece to connect the sample that awaits measuring this moment in order to be used for the tensile stress test, has further promoted the consumptive material utilization ratio of connecting piece to further reduction in production cost.
In some of these embodiments, the plurality of carrying surfaces comprises a first carrying surface and a second carrying surface, facing each other, and a third carrying surface and a fourth carrying surface, facing each other, each of which intersects the first carrying surface and the second carrying surface.
Based on the above embodiment, by arranging four bearing surfaces, namely the first bearing surface, the second bearing surface, the third bearing surface and the fourth bearing surface, on the connecting portion, the four bearing surfaces can be used for being connected with a sample to be tested, and each bearing surface can be used for at least one tensile stress test, so that one connecting piece can be used for at least four tensile stress tests, and the consumable utilization rate of the connecting piece is greatly improved, so that the production cost is greatly reduced.
In some embodiments, the first bearing surface and the second bearing surface are parallel to each other, the third bearing surface and the fourth bearing surface are parallel to each other, and the third bearing surface is perpendicular to the first bearing surface.
Based on the above embodiment, the first bearing surface and the second bearing surface which are oppositely arranged are designed to be parallel to each other, the third bearing surface and the fourth bearing surface are designed to be parallel to each other, and the third bearing surface is perpendicular to the first bearing surface, so that the connecting part is in a rectangular block structure, and the processing difficulty of the connecting part is further reduced.
In some embodiments, the distance between the first bearing surface and the second bearing surface is a1, and a1 satisfies the following conditional expression: a1 is more than or equal to 2.0 and less than or equal to 8.0 mm; and/or the distance between the third bearing surface and the fourth bearing surface is a2, and a2 satisfies the following conditional expression: a2 is more than or equal to 2.0 and less than or equal to 8.0 mm.
Based on the above embodiment, when the distance a1 between the first bearing surface and the second bearing surface and the distance a2 between the third bearing surface and the fourth bearing surface satisfy the above conditional expressions, the consumable utilization rate of the connector is optimized under the condition that the connecting part has a plurality of bearing surfaces, thereby greatly reducing the production cost; when the distance a1 between the first bearing surface and the second bearing surface and the distance a2 between the third bearing surface and the fourth bearing surface exceed the lower limit of the conditional expression, the distance a1 between the first bearing surface and the second bearing surface and the distance a2 between the third bearing surface and the fourth bearing surface are too small, although the connecting part has a plurality of bearing surfaces, the number of times that each bearing surface of the connecting part can be used for a tensile stress test is small, so that the consumable utilization rate of the connecting part is still low, and the production cost is not reduced; when the distance a1 between the first bearing surface and the second bearing surface and the distance a2 between the third bearing surface and the fourth bearing surface exceed the upper limit of the conditional expression, the distance a1 between the first bearing surface and the second bearing surface and the distance a2 between the third bearing surface and the fourth bearing surface are too large, although the connecting portion has a plurality of bearing surfaces and the number of times that each bearing surface of the connecting portion can be used for the tensile stress test is large, the size of each bearing surface of the connecting portion is too large to exceed the size of a sample to be tested, and waste of connecting member materials is caused.
In some of these embodiments, the spacing a1 between the first bearing surface and the second bearing surface is equal to 5mm, and the spacing a2 between the third bearing surface and the fourth bearing surface is equal to 5 mm.
Based on the above embodiment, the distance a1 between the first bearing surface and the second bearing surface and the distance a2 between the third bearing surface and the fourth bearing surface are reasonably arranged, so that when a1 is 5mm and a2 is 5mm, the times that each bearing surface on the connecting portion can be used for tensile stress are ensured to be more, and waste of connecting piece materials caused by the size of each bearing surface on the connecting portion can be avoided.
In some embodiments, the hole axis of the mounting hole is parallel to the first bearing surface, along a direction perpendicular to the first bearing surface, a distance between an outer tangent plane of the mounting hole parallel to and adjacent to the first bearing surface and the first bearing surface is c, and c satisfies the following conditional expression: c is more than or equal to 0.8mm and less than or equal to 3.2 mm.
Based on the embodiment, the distance c between the first bearing surface and the outer tangent surface of the mounting hole is reasonably set, and the larger the distance c is, the more times the first bearing surface can be used for the tensile stress test is, when the distance c between the first bearing surface and the outer tangent surface of the mounting hole meets the conditional expression, the more times the first bearing surface of the connecting part can be used for the tensile stress test can be effectively ensured, the consumable utilization rate of the connecting part is enabled to be optimal, and the production cost is greatly reduced; when the distance c between the first bearing surface and the circumscribed surface of the mounting hole exceeds the conditional lower limit, the first bearing surface of the connecting part can be used for the tensile stress test for a few times, so that the utilization rate of consumables of the connecting part is still low, and the production cost is not reduced; when the distance c between the first bearing surface and the circumscribed surface of the mounting hole exceeds the upper limit of the conditional expression, although the first bearing surface of the connecting part can be used for the tensile stress test for a plurality of times, the size of the first bearing surface of the connecting part is too large and far exceeds the size of a sample to be tested, so that the waste of the connecting piece material is caused.
In a second aspect, an embodiment of the present application provides a testing apparatus, which includes a fixture and a connecting member, where at least one of the connecting members is the above-mentioned connecting member, and is detachably connected to the fixture through an installation portion of the connecting member, respectively.
Based on the test equipment in the embodiment of the application, the test equipment with the connecting piece is provided, the connecting piece is provided with a plurality of bearing surfaces, is detachably connected to the clamp through the mounting part, and can realize the switching of the bearing surfaces connected with the sample to be tested through rotation, so that each bearing surface on the connecting part can be used for tensile stress test, the consumable utilization rate of the connecting piece is improved, and the aim of reducing the production cost is fulfilled; the connecting piece is detachably connected with the clamp of the test equipment, so that the scrapped connecting piece can be replaced conveniently, and the practicability of the test equipment is enhanced.
In some embodiments, the test equipment further comprises a connecting column, the mounting portion of the connecting piece is a mounting hole penetrating through the connecting portion, and the connecting column is in plug-in fit with the mounting hole of the connecting piece so as to realize relative fixation of the position between the connecting piece and the clamp.
Based on the embodiment, the relative fixation of the positions between the connecting piece and the clamp is realized through the insertion and connection matching of the connecting column and the mounting hole, and the difficulty in mounting and dismounting between the connecting piece and the clamp is greatly reduced.
In some embodiments, the fixture includes a chuck detachably connected to the testing device, the chuck includes two oppositely disposed clamping ends, each of the two clamping ends has an insertion hole, the connecting member is interposed between the two clamping ends, and the connecting column passes through each insertion hole of the two clamping ends and the mounting hole of the connecting portion.
Based on the above embodiment, the connecting piece is clamped between the two clamping ends of the chuck, the connecting column sequentially penetrates through the inserting hole in one clamping end of the chuck, and penetrates out of the inserting hole in the other clamping end of the chuck after passing through the mounting hole in the connecting piece, so that the connection stability between the connecting piece and the clamp is enhanced.
In some embodiments, the clamp comprises a first clamp and a second clamp, the first clamp and the second clamp are arranged oppositely, the connecting piece comprises a first connecting piece and a second connecting piece, the connecting column comprises a first connecting column and a second connecting column, the first connecting column is used for realizing the relative fixation of the position between the first connecting piece and the first clamp, and the second connecting column is used for realizing the relative fixation of the position between the second connecting piece and the second clamp; at least one of the bearing surfaces in the first connecting piece can be positioned on one side of the first connecting column, which is far away from the second connecting column, and at least one of the bearing surfaces in the second connecting piece can be positioned on one side of the second connecting column, which is far away from the first connecting column.
Based on the above embodiment, the sample to be tested is connected between the two mutually close bearing surfaces of the first connector and the second connector, the first connector is fixed on the first clamp through the first connecting column, the second connector is fixed on the second clamp through the second connecting column, because the first connector and the second connector both include a plurality of bearing surfaces, and the plurality of bearing surfaces are arranged around the hole axis of the mounting hole, after the first connector and the second connector are mounted, at least one of the plurality of bearing surfaces in the first connector is located on one side of the first connecting column away from the second connecting column, and similarly, at least one of the plurality of bearing surfaces in the second connector is located on one side of the second connecting column away from the first connecting column, thereby the first connector and the second connector can rotate around the direction of the hole axis of the respective mounting hole to realize the switching of different bearing surfaces, so as to supply other to await measuring the sample to connect, increased the number of times that same connecting piece can be used to the tensile stress test to promote the consumptive material utilization ratio of connecting piece, reach reduction in production cost's purpose by a wide margin.
In a third aspect, an embodiment of the present application provides a method for testing a wafer, where the method includes the following steps:
the tensile stress of the wafer sample is tested by any of the above-described test equipment.
Based on the wafer testing method in the embodiment of the application, compared with the prior art that the wafer sample is connected by adopting the same bearing surface of the same connecting piece, the times of the connecting piece for the tensile stress test are increased by switching the multiple bearing surfaces on the same connecting piece, so that the consumable material utilization rate of the connecting piece is greatly improved.
In some of these embodiments, the testing method further comprises the steps of:
removing the wafer sample from one of the bearing surfaces;
and connecting another wafer sample with another bearing surface in the bearing surfaces.
Based on the embodiment, the different bearing surfaces on the connecting piece are connected with the wafer sample for tensile stress testing, so that the tensile stress testing efficiency of the wafer sample is improved.
In some of these embodiments, the testing method further comprises the steps of:
removing the wafer sample from one of the plurality of carrying surfaces;
processing one bearing surface of the plurality of bearing surfaces from which the wafer samples are removed;
and connecting another wafer sample to one of the processed bearing surfaces.
Based on the above embodiment, the bearing surface subjected to the tensile stress test is processed to make the surface of the bearing surface smooth, so that another wafer sample can be connected with the same bearing surface on the connecting piece, that is, one bearing surface can be used for multiple tensile stress tests, thereby further improving the consumable material utilization rate of the connecting piece.
In some embodiments, the test equipment further includes a connection column, the fixture includes a chuck detachably connected to the test equipment, the chuck includes two oppositely arranged clamping ends, the two clamping ends are provided with insertion holes, and the test method further includes the following steps:
bonding two opposite surfaces of the wafer sample with the bearing surfaces of the two connecting pieces through viscose respectively;
clamping the connecting piece between the two clamping ends;
the connecting column penetrates through one of the inserting holes and penetrates out of the other inserting hole through the mounting part, so that the bearing surfaces adhered with the wafer samples are oppositely arranged;
and after the test is finished, the connecting column is pulled out of the inserting hole so as to detach the connecting piece from the clamp.
Based on the above embodiment, bond the wafer sample from two relative bearing surfaces of wafer sample through two connecting pieces, and be fixed in two chucks of two anchor clamps through two spliced poles with two connecting pieces one-to-one, every spliced pole is pegged graft with the spliced eye of the exposed core of the chuck that corresponds and the mounting hole of connecting piece and is cooperated, realize every connecting piece and correspond the installation between the chuck, and realize every connecting piece and correspond the dismantlement between the chuck through drawing out the spliced pole, easy operation convenient and fast.
According to the connecting piece, the test equipment and the test method of the wafer based on the embodiment of the application, the connecting part of the connecting piece is provided with the plurality of bearing surfaces, each bearing surface can be used for being connected with a sample to be tested so as to be used for tensile stress test, and compared with the prior art that only one bearing surface is arranged on the connecting piece for connecting the sample to be tested so as to be used for tensile stress test, the improved connecting piece has the advantages that the plurality of bearing surfaces on the connecting part of the same connecting piece can be switched for use, the times that the same connecting piece can be used for tensile stress test are increased, the consumable utilization rate of the connecting piece is improved, and the purpose of greatly reducing the production cost is achieved.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a schematic structural diagram of a wafer sample before a tensile stress test;
FIG. 2 is a schematic view of a prior art connector before grinding;
FIG. 3 is a cross-sectional view of a sample of a prior art connector-bonded wafer prior to polishing;
FIG. 4 is a schematic structural diagram of a wafer sample in failure;
FIG. 5 is a schematic view showing a structure of a connection member of the related art after polishing;
FIG. 6 is a cross-sectional view of a polished connector-bonded wafer sample of the related art;
FIG. 7 is a schematic view of a connector according to an embodiment of the present application, wherein the mounting portion is a mounting hole;
FIG. 8 is a schematic view of a connector according to an embodiment of the present disclosure, wherein the mounting portion is a post;
fig. 9 is a schematic structural view illustrating a bearing surface on a connecting portion sequentially connected end to end in an embodiment of the present application;
fig. 10 is a schematic structural view illustrating a bearing surface and a connecting surface of a connecting portion being sequentially connected in a staggered manner according to an embodiment of the present application;
FIG. 11 is a cross-sectional view of a connector coupled to a sample before polishing in one embodiment of the present application;
FIG. 12 is a cross-sectional view of a connection piece being polished to connect to a sample under test in one embodiment of the present application;
FIG. 13 is an exploded view of a testing device according to an embodiment of the present application;
FIG. 14 is a schematic structural view of a connection post inserted into an insertion hole of a clamping end according to an embodiment of the present application;
FIG. 15 is a cross-sectional view of a sample to be tested bonded to a carrying surface of a connecting member via a bonding layer according to an embodiment of the present disclosure;
FIG. 16 is a schematic view of a connector configured to be mounted on a fixture for testing tensile stress of a sample according to an embodiment of the present application;
FIG. 17 is a flow chart of a method for testing a wafer according to an embodiment of the present application;
FIG. 18 is a flow chart of a method for testing a wafer according to another embodiment of the present application;
FIG. 19 is a flow chart of a method for testing a wafer according to yet another embodiment of the present application;
FIG. 20 is a flowchart illustrating a method for testing a wafer according to yet another embodiment of the present application.
Reference numerals:
10. a connecting member; 11. a bearing part; 101. a first surface; 12. a connecting portion; 102. a through hole; 20. bonding the adhesive layer; 30. a wafer sample; 31. a first film layer; 32. a second film layer;
100. a connecting member; 100a, a first connecting piece; 100b, a second connecting piece; 110. a connecting portion; 111. a bearing surface; 1111. a first bearing surface; 1112. a second bearing surface; 1113. a third bearing surface; 1114. a fourth bearing surface; 112. a connecting surface; 120. an installation part; m, arrangement direction; 200. connecting the adhesive layer; 300. a sample to be tested; 400. testing equipment; 410. a clamp; 410a, a first clamp; 410b, a second clamp; 411. a chuck; 4111. a clamping end; 41111. inserting holes; 420. connecting columns; 420a, a first connecting column; 420b, a second connecting column.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.
In order to improve the reliability of the sample to be tested, the tensile stress test can be carried out on the bonding strength between the film layers of the sample to be tested, the sample to be tested can be firstly bonded and fixed on the connecting piece 10 by using the bonding glue layer 20, then the connecting piece 10 is arranged on the tensile stress test equipment, then the tensile stress test equipment is started, the tensile stress test equipment applies tensile force to the sample to be tested until different film layers of the sample to be tested are just separated, and the value measured by the tensile stress test equipment at the moment is the maximum tensile stress which can be borne by the sample to be tested.
The inventor of the present application found in research that after a tensile stress test of a sample to be tested is completed, the connecting member 10 needs to be polished to remove the adhesive layer 20 adhered to the connecting member 10, and since the thickness of the connecting member 10 is reduced after polishing, the number of times that the connecting member 10 is allowed to be polished is limited, that is, the number of times that the connecting member 10 is used is limited. Therefore, how to increase the utilization rate of the consumables of the connector 10 has become an urgent problem to be solved.
For example, there are certain specific application scenarios: in the processes of wafer production, packaging and use, complex stress states can be encountered, such as residual stress, thermal stress in the thermal processing production process, shearing force in the chemical mechanical polishing process, impact force on the edge of a wafer in the scribing process and bending stress in the silicon substrate thinning process, and the acting forces can influence the film structure in the wafer, so that the reliability of a chip is finally influenced.
In order to improve the reliability of the chip, a tensile stress test is performed on the bonding strength between the film layers of the wafer sample 30 in advance, and at present, a method for quantitatively measuring the bonding strength between the film layers is a double cantilever beam experiment (DCB).
Referring to fig. 1, fig. 1 is a schematic structural diagram of a wafer sample before a tensile stress test is performed.
The wafer sample 30 may include a first film 31 and a second film 32 stacked on each other, and under an external force, the first film 31 and the second film 32 in the wafer sample 30 are separated from each other, where the external force is a maximum tensile stress that can be borne by the films of the wafer sample 30.
In order to improve the accuracy of the measurement results, the wafer sample 30 is typically cut to a standard size (e.g., 60 × 3 × 1.5 mm).
Referring to fig. 2 to 3, fig. 2 is a schematic diagram illustrating a structure of a connector before polishing in the related art, and fig. 3 is a cross-sectional view illustrating a connection of the connector to a wafer sample before polishing in the related art.
Before the tensile stress test is performed, two connectors 10 are respectively bonded and fixed on two opposite surfaces of the wafer sample 30 and near the ends of the wafer sample 30 by using an adhesive layer 20 (e.g., an AB adhesive layer).
The connecting member 10 includes a bearing portion 11 and a connecting portion 12, the bearing portion 11 is a rectangular block structure, specifically, a length dimension (L) of the bearing portion 11 may be 4mm, a width dimension (D) of the bearing portion 11 may be 2.53mm, and a height dimension (H) of the bearing portion 11 may be 4 mm.
The connecting portion 12 is vertically connected to one side of the bearing portion 11 along the width direction of the bearing portion 11, and the connecting portion 12 is provided with a through hole 102 along the length direction of the bearing portion.
The carrier 11 has a first surface 101 for carrying the wafer sample 30, and the first surface 101 is a surface of the carrier 11 opposite to the connecting portion 12.
As shown in fig. 3-4, fig. 4 is a schematic structural diagram of a wafer sample when it fails.
After the two connectors 10 are bonded to the wafer sample 30, the connectors 10 are mounted on a tensile stress testing apparatus (not shown in the drawings) through the through holes 102 on the connecting portions 12, and then the tensile stress testing apparatus is started, the tensile stress testing apparatus applies a tensile force to the wafer sample 30 and acts on an end portion (shown as F in fig. 3) of the wafer sample 30 until the bonded surfaces of the wafer sample 30 and the connectors 10 are deformed in a direction away from each other until the first film 31 of the wafer sample 30 is separated from the second film 32 of the wafer sample 30 (shown in fig. 4), and a value measured by the tensile stress testing apparatus is a maximum tensile stress that can be borne by each film of the wafer sample 30, and a detector can determine a bonding strength between the films of the wafer 30 to be detected according to the tensile stress value.
After the tensile stress test of the wafer sample 30 is completed, the wafer sample 30 needs to be removed from the connecting member 10, and the first surface 101 of the bearing part 11 needs to be polished to remove the adhesive layer 20 adhered on the bearing part 11, so that the first surface 101 of the bearing part 11 is smooth to prepare for another wafer sample 30 to be adhesively fixed on the first surface 101 of the bearing part 11 by the adhesive layer 20 again next time.
As shown in fig. 5 to 6, fig. 5 is a schematic view illustrating a structure of a ground connector in the related art, and fig. 6 is a cross-sectional view illustrating a connection of the ground connector to a wafer sample in the related art.
The bearing part 11 is reduced by 1.36mm along the large size in the width direction after being polished for each time, the number of times of polishing of the bearing part 11 is about 6 times based on the connecting piece 10 with the structural shape, namely the number of times of tensile stress test of the connecting piece 10 with the structural shape is about 7 times, namely, the thickness of the bearing part 11 after being polished is gradually reduced to limit the number of polishing times of the connecting piece 10, so that the consumable utilization rate of the connecting piece 10 is low. Therefore, how to increase the utilization rate of the consumables of the connector 10 has become an urgent problem to be solved.
It should be noted that the sample to be tested may be, but is not limited to, the wafer sample 30, the sample to be tested may be all samples that need to be subjected to a tensile stress test, the adhesive layer 20 may be, but is not limited to, the AB adhesive layer, and the adhesive layer 20 may be all adhesive layers that can achieve a fixed connection between the sample to be tested and the connecting member 10.
In order to solve the above technical problems, please refer to fig. 7 to 12, a first aspect of the present application provides a connector 100, which can effectively improve the utilization rate of consumables of the connector 100, so as to greatly reduce the production cost.
The connecting member 100 is used for connecting with a sample 300 to be tested and detecting a tensile stress of the sample 300 to be tested, the connecting member 100 includes a connecting portion 110 and a mounting portion 120, the connecting portion 110 includes a plurality of bearing surfaces 111, each bearing surface 111 can be used for bearing the sample 300 to be tested, the mounting portion 120 is at least partially located between all the bearing surfaces 111, and an extending direction of the mounting portion 120 includes a component parallel to any one of the bearing surfaces 111.
Based on the connector 100 of the embodiment of the application, the connecting portion 110 of the connector 100 is provided with the plurality of bearing surfaces 111, each bearing surface 111 can be used for being connected with the sample 300 to be tested for the tensile stress test, and compared with the related art in which only one bearing surface (i.e., the first surface 101) is provided on the connector 10 for the sample 300 to be tested to be connected for the tensile stress test, the improved connector 100 has the advantages that the plurality of bearing surfaces 111 on the connecting portion 110 can be switched for use, so that the number of times that the same connector 100 can be used for the tensile stress test is increased, the consumable utilization rate of the connector 100 is improved, and the purpose of greatly reducing the production cost is achieved.
Referring to fig. 7 to 8, fig. 7 is a schematic structural view illustrating a mounting portion of a connector in an embodiment of the present application as a mounting hole, and fig. 8 is a schematic structural view illustrating the mounting portion of the connector in an embodiment of the present application as a stud.
The connector 100 includes a connecting portion 110 and a mounting portion 120.
The connecting portion 110 serves as a component of the connecting member 100 for supporting the sample 300 to be tested, the connecting member 100 includes a plurality of (two or more) supporting surfaces 111, each supporting surface 111 can be used for supporting the sample 300 to be tested, that is, the supporting surface 111 is a surface of the connecting portion 110 for connecting with the sample 300 to be tested, the sample 300 to be tested can be fixedly connected with the supporting surface 111 of the connecting portion 110 through the connecting adhesive layer 200, specifically, the connecting adhesive layer 200 can be, but is not limited to, an AB adhesive. It should be noted that the specific shape of the supporting surface 111 is not limited herein, for example, the supporting surface 111 may be a regular polygon or an irregular polygon.
The mounting portion 120 serves as a connecting structure of the connecting member 100 for connecting with a testing apparatus (described below), the mounting portion 120 is at least partially located between all the bearing surfaces 111, and the extending direction of the mounting portion 120 includes a component parallel to any one of the bearing surfaces 111, i.e. the extending direction of the mounting portion 120 is not perpendicular to any one of the bearing surfaces 111 of the connecting portion 110.
It is understood that the mounting portion 120 serves as a connecting structure for connecting with the testing equipment in the connecting member 100, and the specific structure of the mounting portion 120 and the specific connecting manner of the mounting portion 120 and the testing equipment can be, but are not limited to, the following several possible embodiments.
As shown in fig. 7, for example, in an embodiment, the mounting portion 120 is a mounting hole penetrating through the connecting portion 110, when the mounting portion 120 is completely located between all the bearing surfaces 111, the connecting member 100 is connected to the testing equipment through the mounting hole, specifically, the mounting hole is a circular hole, and a hole axis of the mounting hole may coincide with a central line of the connecting portion 110, the testing equipment has a mounting position matched with the connecting member 100 and is connected to the connecting member 100 through the mounting hole, and it should be noted that, when the mounting portion 120 is a mounting hole penetrating through the connecting portion 110, the "extending direction" is an extending direction of the mounting hole. In this design, the mounting portion 120 is designed to be a mounting hole penetrating through the connecting portion 110, the connecting member 100 can rotate relative to the testing equipment to adjust the bearing surface 111 connected to the sample 300 to be tested, and the connecting with the testing equipment is realized through the mounting hole, so that the switching difficulty of the bearing surface 111 of the connecting portion 110 is reduced.
As shown in fig. 8, for example, in an embodiment, the mounting portion 120 is a convex pillar penetrating the connecting portion 110, and two ends of the mounting portion 120 extend to the outside of the connecting portion 110, at this time, a portion of the mounting portion 120 penetrating the connecting portion 110 is located between all the bearing surfaces 111, the connecting member 100 is connected to the testing apparatus through two ends of the convex pillar, specifically, the cross section of the convex pillar is circular, the testing apparatus has a mounting position matching with the connecting member 100, and is connected to the connecting member 100 through an end of the convex pillar, and it should be noted that, when the mounting portion 120 is the convex pillar penetrating the connecting portion 110, the "extending direction" is an axial direction of the convex pillar. In the design, the mounting portion 120 is designed to be a convex column, the connecting member 100 can rotate relative to the testing equipment to adjust the bearing surface 111 connected with the sample 300 to be tested, and the convex column is used for realizing connection with the testing equipment, so that the switching difficulty of the bearing surface 111 of the connecting portion 110 is also reduced.
In order to reduce the overall processing difficulty of the connector 100, in some embodiments, the connecting portion 110 and the mounting portion 120 are integrally formed, for example, when the mounting portion 120 is a mounting hole penetrating the connecting portion 110 or a convex pillar penetrating the connecting portion 110, the connecting portion 110 and the mounting portion 120 may be integrally formed by injection molding through a mold, and the connecting portion 110 and the mounting portion 120 may also be integrally formed by 3D printing.
Considering that the manufacturing cost of the single connecting member 100 is determined to a certain extent by the material for preparing the connecting member 100, in order to reduce the manufacturing cost of the single connecting member 100 and ensure the supporting strength of the connecting member 100 on the sample 300 to be tested, in some embodiments, the material of the connecting portion 110 is one or an alloy of any one of aluminum, magnesium and titanium. In the design, the material of the connecting part 110 is designed to be one or any alloy of aluminum, magnesium and titanium, so that the supporting strength of the connecting part 100 on the sample 300 to be tested can be ensured, and the materials such as aluminum, magnesium and titanium are cheap, so that the production cost of the connecting part 100 is further reduced.
Fig. 9-10 show a schematic structural view of a connection portion of the present application when a bearing surface on the connection portion is sequentially connected end to end, fig. 10 shows a schematic structural view of a connection portion of the present application when a bearing surface and a connection surface are sequentially connected in a staggered manner, fig. 11 shows a cross-sectional view of a connection portion of the present application after polishing connected to a sample to be tested, and fig. 12 shows a cross-sectional view of a connection portion of the present application after polishing connected to a sample to be tested.
It is understood that the arrangement of the bearing surfaces 111 on the connecting portion 110 can be, but is not limited to, the following several possible embodiments.
As shown in fig. 9, for example, in one embodiment, a plurality of bearing surfaces 111 are connected end to end in sequence on the connecting portion 110. In this design, the arrangement of the bearing surfaces 111 on the connecting portion 110 is designed to be sequentially connected end to end, so that the difficulty in processing the bearing surfaces 111 on the connecting portion 110 of the connecting member 100 is reduced, and the bearing surfaces 111 of the connecting portion 110 can be switched when the connecting portion 110 rotates by a certain angle, thereby reducing the difficulty in switching the bearing surfaces 111 of the connecting portion 110.
As shown in fig. 10, for example, in an embodiment, the connection portion 110 further includes a plurality of connection surfaces 112, and the connection surfaces 112 and the bearing surfaces 111 are sequentially connected on the connection portion 110 in a staggered manner, that is, each bearing surface 111 has two connection surfaces 112. In the design, the connection surfaces 112 and the bearing surfaces 111 are designed to be sequentially connected in a staggered manner on the connection part 110, after the bearing surfaces 111 arranged in a staggered manner are polished for multiple times, the connection surfaces 112 connecting the two adjacent bearing surfaces 111 on the connection part 110 can be completely polished, and finally the connection part 110 can be polished to be sequentially connected with the bearing surfaces 111, so that the connection part 110 can be continuously utilized to connect the sample 300 to be tested for tensile stress test, the consumable utilization rate of the connection part 100 is further improved, and the production cost is further reduced.
Further, when a plurality of bearing surfaces 111 are connected end to end on the connection portion 110 in sequence, considering that the number of bearing surfaces 111 determines the consumable utilization rate of the connection member 100 to some extent, for example, the more the number of bearing surfaces 111 on the connection portion 110 is, the higher the consumable utilization rate of the connection member 100 may be, while ensuring that the production cost of a single connection member 100 is substantially unchanged. In order to improve the consumable utilization of the connector 100, as shown in fig. 9, in one embodiment, the plurality of supporting surfaces 111 includes a first supporting surface 1111 and a second supporting surface 1112 facing each other, and a third supporting surface 1113 and a fourth supporting surface 1114 facing each other, each of the third supporting surface 1113 and the fourth supporting surface 1114 intersects with the first supporting surface 1111 and the second supporting surface 1112, that is, the four supporting surfaces 111 are sequentially connected end to form a connector 110 similar to a "tetrahedron" structure. In this design, by disposing four bearing surfaces 111, that is, the first bearing surface 1111, the second bearing surface 1112, the third bearing surface 1113 and the fourth bearing surface 1114, on the connecting portion 110, the four bearing surfaces 111 can be used for connecting with the sample 300 to be tested, and each bearing surface 111 can be used for at least one tensile stress test, so that one connecting member 100 can be used for at least four tensile stress tests, thereby greatly improving the utilization rate of consumables of the connecting member 100 to greatly reduce the production cost.
Of course, as shown in fig. 7-8, in an embodiment, the number of the bearing surfaces 111 on the connection portion 110 may also be eight, the eight bearing surfaces 111 are sequentially connected end to form the connection portion 110 having an "octahedral" structure, and each bearing surface 111 may be polished at least once, that is, the connection member 100 of the structure may be used for performing at least eight tensile stress tests on the sample 300 to be tested.
Further, when the plurality of bearing surfaces 111 include the first bearing surface 1111, the second bearing surface 1112, the third bearing surface 1113 and the fourth bearing surface 1114, the processing difficulty of the connection portion 110 is determined to a certain extent considering an included angle between two adjacent bearing surfaces 111, for example, the smaller the included angle between two adjacent bearing surfaces 111 is, the greater the processing difficulty of the connection portion 110 may be. To reduce the processing difficulty of the connection portion 110, as shown in fig. 9, in an embodiment, the first supporting surface 1111 and the second supporting surface 1112 are parallel to each other, the third supporting surface 1113 and the fourth supporting surface 1114 are parallel to each other, and the third supporting surface 1113 is perpendicular to the first supporting surface 1111, that is, in the plane of the arrangement direction M of the supporting surface 111, the cross-section formed by the first supporting surface 1111, the second supporting surface 1112, the third supporting surface 1113 and the fourth supporting surface 1114 is a square. In this design, the first bearing surface 1111 and the second bearing surface 1112 facing each other are designed to be parallel to each other, the third bearing surface 1113 and the fourth bearing surface 1114 are designed to be parallel to each other, and the third bearing surface 1113 is perpendicular to the first bearing surface 1111, so that the connection portion 110 has a rectangular block structure, thereby further reducing the processing difficulty of the connection portion 110.
Of course, in an embodiment, an included angle between the first supporting surface 1111 and the third supporting surface 1113 is an acute angle, and specifically, the acute angle may be 60 degrees, that is, in a plane of the arrangement direction M of the supporting surface 111, the first supporting surface 1111, the second supporting surface 1112, the third supporting surface 1113 and the fourth supporting surface 1114 define a cross section as a parallelogram.
As shown in fig. 9, it can be understood that the dimension of the bearing surface 111 of the connection portion 110 also determines the consumable utilization rate of the connection component 100 to some extent, for example, the larger the dimension of the bearing surface 111 of the connection portion 110 is, the lower the consumable utilization rate of the connection component 100 may be. To further improve the utilization rate of consumables of the connector 100 while ensuring that the production cost of the single connector 100 is substantially unchanged, in some embodiments, the distance between the first bearing surface 1111 and the second bearing surface 1112 is a1, and a1 satisfies the following conditional expression: 2.0-8.0 mm of a1, and/or a distance a2 between the third bearing surface 1113 and the fourth bearing surface 1114, and a2 satisfies the following conditional expression: a2 is more than or equal to 2.0 and less than or equal to 8.0 mm. For example, the value of the distance a1 may specifically be 3mm, 5mm, or 7mm, etc., the value of the distance a2 may specifically be 2mm, 3mm, 4mm, 5mm, 6mm, or 7mm, etc., and the value of the distance a1 and the value of the distance a2 may or may not be equal. In this design, when the distance a1 between the first bearing surface 1111 and the second bearing surface 1112 and the distance a2 between the third bearing surface 1113 and the fourth bearing surface 1114 satisfy the above conditional expressions, the consumable utilization of the connector 100 is optimized under the condition that the connecting portion 110 has a plurality of bearing surfaces 111, thereby greatly reducing the production cost; when the distance a1 between the first bearing surface 1111 and the second bearing surface 1112 and the distance a2 between the third bearing surface 1113 and the fourth bearing surface 1114 exceed the lower limit of the above conditional expression, the distance a1 between the first bearing surface 1111 and the second bearing surface 1112 and the distance a2 between the third bearing surface 1113 and the fourth bearing surface 1114 are too small, and although the connection portion 110 has a plurality of bearing surfaces 111, the number of times that each bearing surface 111 of the connection portion 110 can be used for a tensile stress test is small, which results in a low consumable material utilization rate of the connection portion 110, thereby being not favorable for reducing the production cost; when the distance a1 between the first bearing surface 1111 and the second bearing surface 1112 and the distance a2 between the third bearing surface 1113 and the fourth bearing surface 1114 exceed the upper limit of the above conditional expression, the distance a1 between the first bearing surface 1111 and the second bearing surface 1112 and the distance a2 between the third bearing surface 1113 and the fourth bearing surface 1114 are too large, although the connection portion 110 has a plurality of bearing surfaces 111 and the number of times that each bearing surface 111 of the connection portion 110 can be used for the tensile stress test is large, the size of each bearing surface 111 of the connection portion 110 is too large to exceed the size of the sample 300 to be tested, which results in the waste of the material of the connection portion 100.
Specifically, when the connecting portion 110 includes the first supporting surface 1111, the second supporting surface 1112, the third supporting surface 1113 and the fourth supporting surface 1114, in an embodiment, a distance a1 between the first supporting surface 1111 and the second supporting surface 1112 is equal to 5mm, and a distance a2 between the third supporting surface 1113 and the fourth supporting surface 1114 is equal to 5 mm. In this design, by reasonably setting the distance a1 between the first bearing surface 1111 and the second bearing surface 1112 and the distance a2 between the third bearing surface 1113 and the fourth bearing surface 1114, when a1 is 5mm and a2 is 5mm, it is ensured that not only are the times that each bearing surface 111 on the connecting portion 110 can be used for tensile stress increased, but also the waste of the material of the connecting portion 100 due to the size of each bearing surface 111 on the connecting portion 110 is avoided.
When the mounting portion 120 is a mounting hole penetrating through the connecting portion 110, considering that the distance between each of the bearing surfaces 111 on the connecting portion 110 and the outer tangent surface of the mounting hole also determines the number of times the connector 100 can be ground, for example, the larger the distance between the bearing surface 111 and the outer tangent surface of the mounting hole is, the more times the connector 100 can be ground is, i.e., the higher the consumable utilization rate of the connector 100 is. To increase the number of times that the connector 100 can be polished to increase the consumable utilization of the connector 100, as shown in fig. 11, in some embodiments, the hole axis of the mounting hole is parallel to the first supporting surface 1111, and along the direction perpendicular to the first supporting surface 1111, the distance between the external tangent plane of the mounting hole parallel to and adjacent to the first supporting surface 1111 and the first supporting surface 1111 is c (i.e. the difference between the distance between the hole axis of the mounting hole and the first supporting surface 1111 and the hole radius of the mounting hole is c), and c satisfies the following conditional expression: c is more than or equal to 0.8mm and less than or equal to 3.2 mm. For example, the distance c may be 1.5mm, 2.2mm, or 2.9 mm. In the design, the distance c between the first bearing surface 1111 and the circumscribed surface of the mounting hole is reasonably set, and the larger the distance c is, the more times the first bearing surface 1111 can be used for the tensile stress test is, when the distance c between the first bearing surface 1111 and the circumscribed surface of the mounting hole meets the conditional expression, the more times the first bearing surface 1111 of the connecting part 110 can be used for the tensile stress test can be effectively ensured, the consumable utilization rate of the connecting part 100 is enabled to be optimal, and the production cost is greatly reduced; when the distance c between the first bearing surface 1111 and the outer tangent surface of the mounting hole exceeds the lower limit of the conditional expression, the number of times that the first bearing surface 1111 of the connecting part 110 can be used for the tensile stress test is small, so that the utilization rate of consumables of the connecting part 100 is still low, and the reduction of the production cost is not facilitated; when the distance c between the first bearing surface 1111 and the outer tangent surface of the mounting hole exceeds the upper limit of the conditional expression, although the first bearing surface 1111 of the connection portion 110 may be used for the tensile stress test for a large number of times, the size of the first bearing surface 1111 of the connection portion 110 is too large to exceed the size of the sample 300 to be tested, which results in the waste of material of the connection member 100.
Specifically, in one embodiment, the distance c between the outer section of the mounting hole parallel to and adjacent to the first bearing surface 1111 and the first bearing surface 1111 is 1.8 mm. In this design, through the value of reasonable setting interval c for when c is 1.8mm, can effectively guarantee that each bearing surface 111 on connecting portion 110 can be used to the number of times of tensile stress more.
Referring to fig. 13-16, a second aspect of the present application provides a testing apparatus 400 capable of testing the tensile stress of a sample 300 to be tested by using the connector 100, and greatly reducing the utilization rate of consumables of the connector 100.
Fig. 13-14 are schematic exploded structural views of a testing apparatus in an embodiment of the present application, fig. 14 is a schematic structural view of a connection column inserted into a plug hole of a clamping end in an embodiment of the present application, fig. 15 is a cross-sectional view of a sample to be tested bonded to a bearing surface of a connection piece through a connection adhesive layer in an embodiment of the present application, and fig. 16 is a schematic structural view of a connection piece mounted on a clamp to test a tensile stress of the sample to be tested in an embodiment of the present application.
The testing apparatus 400 includes a fixture 410 and the connection members 100, wherein at least one of the connection members 100 is the connection member 100, and is detachably connected to the fixture 410 through the mounting portion 120 of the connection member 100.
Based on the testing apparatus 400 in the embodiment of the present application, the testing apparatus 400 having the connecting member 100 is provided, the connecting member 100 has a plurality of bearing surfaces 111, and is detachably connected to the fixture 410 through the mounting portion 120, and can be rotated to switch the bearing surfaces 111 connected to the sample 300 to be tested, so that each bearing surface 111 on the connecting portion 110 can be used for a tensile stress test, thereby improving the utilization rate of consumables of the connecting member 100 and achieving the purpose of reducing the production cost; the detachable connection between the connector 100 and the clamp 410 of the testing device 400 facilitates the replacement of the rejected connector 100, enhancing the utility of the testing device 400.
The number of the connecting elements 100 may be one or a plurality (two or more), when the number of the connecting elements 100 is one, the connecting elements 100 are the connecting elements 100 having the plurality of bearing surfaces 111, when the number of the connecting elements 100 is a plurality, at least one of the connecting elements 100 in the plurality of connecting elements 100 is the connecting element 100 having the plurality of bearing surfaces 111, and the rest of the connecting elements 100 may be the connecting elements 100 in the related art.
The number of the clamps 410 may be one or more, and of course, one clamp 410 is used to connect to the same connector 100 regardless of the number of the clamps 410.
Considering that there may be many intermediate connection structures for implementing the detachable connection between the connector 100 and the fixture 410, for example, the connector 100 and the fixture 410 may implement the detachable connection therebetween through a certain clamping structure, in order to adapt to the detachable connection between the connector 100 and the fixture 410 when detecting a large number of samples 300 to be tested, in some embodiments, the testing apparatus 400 further includes a connection column 420, the installation portion 120 of the connector 100 is an installation hole penetrating through the connection portion 110, the connection column 420 is in inserting fit with the installation hole of the connector 100, so as to implement the relative fixation between the connector 100 and the fixture 410, that is, the connector 100 implements the detachable connection with the fixture 410 through the inserting and pulling fit of the connection column 420 and the installation hole. In the design, the connection column 420 is matched with the mounting hole in a plugging manner, so that the relative fixation of the positions of the connecting piece 100 and the clamp 410 is realized, and the difficulty in mounting and dismounting between the connecting piece 100 and the clamp 410 is greatly reduced.
As shown in fig. 13-14, it is understood that the clip 410 corresponds to a carrier for carrying the connector 100, and the specific structure of the clip 410 may be different for different structural shapes of the connector 100, such as different sizes of the clip 410. In some embodiments, the fixture 410 includes a clamping head 411 detachably connected to the testing apparatus 400, the clamping head 411 includes opposite clamping ends 4111, each of the two clamping ends 4111 is provided with an insertion hole 41111, the connecting member 100 is interposed between the two clamping ends 4111, the connecting column 420 passes through each insertion hole 41111 of the two clamping ends 4111 and the mounting hole of the connecting portion 110, that is, the connecting member 100 is interposed between the two clamping ends 4111 of the clamping head 411, such that the mounting hole of the connecting member 100 is interposed between the two insertion holes 41111 of the two clamping ends 4111, and the hole axis of the mounting hole is collinear with the hole axis of the insertion hole 41111, and the connecting column 420 sequentially passes through the insertion hole 41111 of one clamping end 4111 and passes through the mounting hole on the connecting member 100 and then passes through the insertion hole 41111 of the other clamping end 4111. Specifically, spliced eye 41111 on holder 4111 is the round hole, and the hole cross sectional area of spliced eye 41111 of holder 4111 equals the hole cross sectional area of the mounting hole of connecting piece 100, the material of spliced pole 420 can be resin or rubber, can adopt interference fit's mode to realize the relative fixation in position between connecting piece 100 and chuck 411 between spliced eye 41111 on spliced pole 420 and holder 4111 and the mounting hole on connecting piece 100, and realize installation and dismantlement between connecting piece 100 and chuck 411 through the mode of plug spliced pole 420. This design enhances the stability of the connection between the connector 100 and the clamp 410.
As shown in fig. 15-16, in particular, in one embodiment, the fixture 410 includes a first fixture 410a and a second fixture 410b, the first fixture 410a and the second fixture 410b are disposed opposite to each other, the connector 100 includes a first connector 100a and a second connector 100b, the connection columns 420 include a first connection column 420a and a second connection column 420b, the first connection column 420a is used for achieving relative fixing of the position between the first connector 100a and the first fixture 410a, the second connection column 420b is used for achieving relative fixing of the position between the second connector 100b and the second fixture 410b, wherein at least one of the bearing surfaces 111 of the first connector 100a can be located on a side of the first connection column 420a away from the second connection column 420b, at least one of the bearing surfaces 111 of the second connector 100b can be located on a side of the second connection column 420b away from the first connection column 420a, that is, before the next tensile stress test, another sample 300 to be tested may be connected to the bearing surface 111 of the first connecting post 420a on the side away from the second connecting post 420b in the first connecting member 100a during the previous tensile stress test, and the another sample 300 to be tested may be connected to the bearing surface 111 of the second connecting post 420b on the side away from the first connecting post 420a in the second connecting member 100b during the previous tensile stress test, so as to realize switching between different bearing surfaces 111 of the same connecting member 100 and the sample 300 to be tested. In this design, the sample 300 to be tested is connected between the two adjacent bearing surfaces 111 of the first connector 100a and the second connector 100b, the first connector 100a is fixed on the first fixture 410a through the first connecting post 420a, the second connector 100b is fixed on the second fixture 410b through the second connecting post 420b, because the first connector 100a and the second connector 100b both include a plurality of bearing surfaces 111 and the plurality of bearing surfaces 111 are arranged around the hole axis of the mounting hole, so that after the first connector 100a and the second connector 100b are mounted, at least one of the plurality of bearing surfaces 111 in the first connector 100a is located on the side of the first connecting post 420a away from the second connecting post 420b, similarly, at least one of the plurality of bearing surfaces 111 in the second connector 100b is located on the side of the second connecting post 420b away from the first connecting post 420a, therefore, the first connecting piece 100a and the second connecting piece 100b can rotate around the hole axes of the respective mounting holes in the directions to realize the switching of different bearing surfaces 111, so that other samples 300 to be tested can be connected conveniently, the times that the same connecting piece 100 can be used for the tensile stress test are increased, the consumable utilization rate of the connecting piece 100 is improved, and the purpose of greatly reducing the production cost is achieved.
Referring to fig. 17-20, a third aspect of the present application provides a wafer testing method, by which the maximum tensile stress that can be borne by each wafer sample can be measured. Of course, it is understood that the wafer test method is only one test method for testing the tensile stress of a wafer sample.
Fig. 17 is a flowchart illustrating a method for testing a wafer according to an embodiment of the present invention.
The testing method of the wafer can comprise the following steps: and S220.
In step S220, the tensile stress of the wafer sample is tested by the testing apparatus 400.
Specifically, in step S220, after the testing apparatus 400 is started, the testing apparatus 400 applies a pulling force to the wafer sample from two sides of the wafer sample, the pulling force acts on a connection portion between the connection member 100 and the wafer sample, and the pulling force is perpendicular to a surface of the wafer sample and directed away from the wafer sample.
In the design, compared to the related art in which the same bearing surface 111 of the same connector 100 is used to connect the wafer sample, the number of times of the connector 100 for the tensile stress test is increased by switching the multiple bearing surfaces 111 on the same connector 100, so as to greatly improve the consumable material utilization rate of the connector 100.
Fig. 18 is a flowchart of a wafer testing method according to another embodiment of the present invention, as shown in fig. 18.
Of course, the test method may further include the steps of: s340 and S360.
In step S340, the wafer sample is removed from one of the plurality of carrying surfaces 111.
In step S360, another wafer sample is connected to another carrying surface 111 of the plurality of carrying surfaces 111.
In the design, different bearing surfaces 111 on the connecting piece 100 are connected with the wafer sample for tensile stress testing, so that the tensile stress testing efficiency of the wafer sample is improved.
In particular, the term "one of the plurality of bearing surfaces" is to be understood herein as the bearing surface 111 on the connector 100 for connection to the wafer sample during the last or last several tensile stress tests.
In step S340, the bonding adhesive layer 200 (described above) between the wafer sample and the connector 100 may be melted by thermal melting, so as to remove the wafer sample after the tensile stress test from the carrying surface 111 of the connector 100.
In step S360, the wafer sample is connected to the carrying surface 111 of the connector 100 different from the last tensile stress test, that is, the carrying surface 111 of the connector 100 is replaced to connect to another wafer sample for the tensile stress test.
Fig. 19 is a flowchart illustrating a method for testing a wafer according to another embodiment of the present invention, as shown in fig. 19.
It can be understood that, after the tensile stress of the wafer sample is tested, in order to ensure the normal testing of other wafer samples, the wafer sample after the testing needs to be detached from the connector 100, and in order to facilitate that the same carrying surface 111 of the same connector 100 can be used for the tensile stress testing of the wafer sample for multiple times, so as to further improve the consumable utilization rate of the connector 100, the testing method may further include the following steps: s440, S460, and S480.
In step S440, the wafer sample is removed from one of the plurality of carrying surfaces 111.
In step S460, one of the plurality of carrying surfaces 111 from which the wafer sample is removed is processed.
In step S480, another wafer sample is connected to one of the processed carrying surfaces 111.
In the design, the bearing surface 111 subjected to the tensile stress test is processed to make the surface of the bearing surface 111 smooth, so that another wafer sample can be connected with the same bearing surface 111 on the connecting member 100, that is, one bearing surface 111 can be used for multiple tensile stress tests, so as to further improve the consumable material utilization rate of the connecting member 100.
In particular, the term "one of the plurality of bearing surfaces" is to be understood herein as the bearing surface 111 on the connector 100 for connection to the wafer sample during the last or last several tensile stress tests.
In step S440, the adhesive layer 200 (described above) between the wafer sample and the connector 100 may be melted by thermal melting, so as to remove the wafer sample after the tensile stress test from the carrying surface 111 of the connector 100.
In step S460, the bearing surface 111 connected to the wafer sample may be processed immediately after the tensile stress test is completed, or the bearing surface 111 connected to the wafer sample may be processed before the next tensile stress test, where the specific step is not limited to processing the bearing surface 111 connected to the wafer sample before, as long as the normal test on the tensile stress of the wafer sample is not affected.
In step S460, the supporting surface 111 connected to the wafer sample may be processed by polishing, so that the adhesive layer adhered to the supporting surface 111 is polished off, thereby making the supporting surface 111 smooth for connecting to another wafer sample.
In step S480, another (new) wafer sample is connected to the carrying surface 111 of the connector 100 that is the same as the last tensile stress test, that is, the carrying surface 111 of the connector 100 is not replaced to be connected to another wafer sample and used for the tensile stress test, and the tensile stress test may be the next round of test immediately after the last round of tensile stress test, or may be the next round of test after several rounds of tensile stress test from the last round of tensile stress test.
Fig. 20 is a flowchart illustrating a method for testing a wafer according to still another embodiment of the present invention, as shown in fig. 20.
It can be understood that, for the whole process of testing the tensile stress of the wafer sample, the operation procedures of mounting the wafer sample and the connector 100, mounting the connector 100 and the fixture 410, and dismounting the connector 100 and the fixture 410 are also considered, the testing apparatus 400 further includes a connection column 420, the fixture 410 includes a collet 411 detachably connected to the testing apparatus 400, the collet 411 includes two oppositely disposed clamping ends 4111, and the two clamping ends 4111 are provided with insertion holes 41111, and the testing method further includes the following steps:
in step S510, two opposite surfaces of the wafer sample are respectively bonded to the carrying surfaces 111 of the two connectors 100 by adhesives.
In step S520, the connecting member 100 is clamped between the two clamping ends 4111.
In step S530, the connection post 420 passes through one of the insertion holes 41111 and passes through the mounting portion 120 to pass through the other insertion hole 41111, so that the carrying surfaces 111 adhered with the wafer samples are oppositely disposed.
In step S550, after the test is completed, the connection post 420 is pulled out of the insertion hole 41111, so as to detach the connector 100 from the fixture 410.
In the design, the wafer sample is bonded from two opposite bearing surfaces 111 of the wafer sample through two connecting pieces 100, the two connecting pieces 100 are fixed on two chucks 411 of two clamps 410 in a one-to-one correspondence manner through two connecting columns 420, each connecting column 420 is in splicing fit with a splicing hole 41111 of a clamping end 4111 of the corresponding chuck 411 and a mounting hole of the connecting piece 100, the installation between each connecting piece 100 and the corresponding chuck 411 is realized, the detachment between each connecting piece 100 and the corresponding chuck 411 is realized by pulling out the connecting column 420, and the operation is simple, convenient and rapid.
Specifically, in step S510, an AB glue layer is coated on one of the bearing surfaces 111 of the two connection members 100, and then two opposite surfaces of the wafer sample are respectively bonded to the bearing surfaces 111 of the two connection members 100 coated with the AB glue layer.
In step S520, the two connecting members 100 are clamped between the two clamping heads 411 of the two clamps 410, that is, each connecting member 100 is clamped between the two clamping ends 4111 of the corresponding clamping head 411, so that the hole axis of the mounting hole of each connecting member 100 and the hole axis of the inserting hole 41111 of the corresponding two clamping ends 4111 are located on the same straight line.
In step S530, the two connecting elements 100 are fixed on the two chucks 411 of the two jigs 410 through the two connecting posts 420 in a one-to-one correspondence manner, that is, each connecting post 420 is in inserting fit with the inserting hole 41111 of the clamping end 4111 of the corresponding chuck 411 and the mounting hole of the connecting element 100, so as to realize the mounting between each connecting element 100 and the corresponding chuck 411, so that after the two connecting elements 100 are fixed on the corresponding two jigs 410, the carrying surfaces 111 of the two connecting elements 100 on which the wafer samples are adhered are oppositely disposed.
In step S550, the two connection posts 420 are pulled out of the insertion holes 41111 of the corresponding clamping ends 4111 and the mounting holes of the connector 100, and the two connectors 100 are removed from the corresponding two collets 411, so as to detach the connector 100 from the clamp 410.
It should be noted that, obviously, the steps S510 and S520 are to realize the installation between the connector 100 and the fixture 510, and the steps S530 and S550 are to realize the detachment between the connector 100 and the fixture 410, so the steps S510 and S520 should be disposed before the steps S530 and S550.
The same or similar reference numerals in the drawings of the present embodiment correspond to the same or similar components; in the description of the present application, it is to be understood that if there is an orientation or positional relationship indicated by the terms "upper", "lower", "left", "right", etc. based on the orientation or positional relationship shown in the drawings, it is only for convenience of description and simplification of description, but it is not intended to indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and therefore, the terms describing the positional relationship in the drawings are only for illustrative purposes and are not to be construed as limitations of the present patent, and specific meanings of the above terms may be understood by those skilled in the art according to specific situations.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.

Claims (16)

1. A connector for connection with a sample to be tested and for detecting the tensile stress of the sample to be tested, the connector comprising:
the connecting part comprises a plurality of bearing surfaces, and each bearing surface can be used for bearing the sample to be tested; and
the installation part is at least partially located between all bearing surfaces, and the extending direction of the installation part comprises a component parallel to any one of the bearing surfaces.
2. The connector of claim 1,
the installation part is a mounting hole penetrating through the connecting part.
3. The connector of claim 1,
the bearing surfaces are sequentially connected end to end on the connecting part; or
The connecting part further comprises a plurality of connecting surfaces, and the connecting surfaces and the bearing surfaces are sequentially connected on the connecting part in a staggered manner.
4. The connector of claim 1,
the plurality of carrying surfaces comprises a first carrying surface and a second carrying surface facing each other, and a third carrying surface and a fourth carrying surface facing each other, each of the third carrying surface and the fourth carrying surface intersecting the first carrying surface and the second carrying surface.
5. The connector of claim 4,
the first bearing surface and the second bearing surface are parallel to each other, the third bearing surface and the fourth bearing surface are parallel to each other, and the third bearing surface is perpendicular to the first bearing surface.
6. The connector of claim 5,
the distance between the first bearing surface and the second bearing surface is a1, and a1 satisfies the following conditional expression: a1 is more than or equal to 2.0 and less than or equal to 8.0 mm; and/or
The distance between the third bearing surface and the fourth bearing surface is a2, and a2 satisfies the following conditional expression: a2 is more than or equal to 2.0 and less than or equal to 8.0 mm.
7. The connector of claim 6,
the spacing a1 between the first bearing surface and the second bearing surface is equal to 5 mm;
the spacing a2 between the third bearing surface and the fourth bearing surface is equal to 5 mm.
8. The connector of claim 4,
the hole axis of the mounting hole is parallel to the first bearing surface, along the direction perpendicular to the first bearing surface, the distance between a circumscribed surface, which is parallel to the mounting hole and is adjacent to the first bearing surface, and the first bearing surface is c, and c satisfies the conditional expression: c is more than or equal to 0.8mm and less than or equal to 3.2 mm.
9. A test apparatus, comprising:
a clamp; and
connecting pieces, at least one of which is the connecting piece of any one of claims 1 to 8 and is detachably connected to the jig through the mounting portions of the connecting pieces, respectively.
10. The test apparatus of claim 9,
the test equipment still includes the spliced pole, the connecting piece the installation department is for running through the mounting hole of connecting portion, the spliced pole with the connecting piece the cooperation of pegging graft of mounting hole is in order to realize the connecting piece with the relative fixation of position between the anchor clamps.
11. The test apparatus of claim 10,
the fixture comprises a chuck detachably connected with the test equipment, the chuck comprises two oppositely arranged clamping ends, each of the two clamping ends is provided with an insertion hole, the connecting piece is arranged between the two clamping ends, and the connecting column penetrates through each of the two clamping ends, the insertion holes and the mounting holes of the connecting parts.
12. The test apparatus of claim 10,
the clamp comprises a first clamp and a second clamp, and the first clamp and the second clamp are oppositely arranged;
the connecting piece comprises a first connecting piece and a second connecting piece;
the connecting columns comprise a first connecting column and a second connecting column, the first connecting column is used for realizing the relative fixation of the position between the first connecting piece and the first clamp, and the second connecting column is used for realizing the relative fixation of the position between the second connecting piece and the second clamp;
at least one of the bearing surfaces of the first connecting piece can be positioned on one side of the first connecting column, which is far away from the second connecting column, and at least one of the bearing surfaces of the second connecting piece can be positioned on one side of the second connecting column, which is far away from the first connecting column.
13. A method for testing a wafer is characterized by comprising the following steps:
the tensile stress of the wafer sample is tested by the testing apparatus of any one of claims 9-12.
14. The test method of claim 13, further comprising the steps of:
removing the wafer sample from one of the bearing surfaces;
and connecting another wafer sample with another bearing surface in the bearing surfaces.
15. The test method of claim 13, further comprising the steps of:
removing the wafer sample from one of the plurality of carrying surfaces;
processing one bearing surface of the plurality of bearing surfaces from which the wafer sample is removed;
and connecting the other wafer sample to one of the processed bearing surfaces.
16. The method of claim 13, wherein the testing device further comprises a connecting post, the fixture comprises a collet detachably connected to the testing device, the collet comprises two oppositely disposed clamping ends, and the two clamping ends are provided with insertion holes, the method further comprising the steps of:
bonding two opposite surfaces of the wafer sample with the bearing surfaces of the two connectors through adhesives respectively;
clamping the connecting piece between the two clamping ends;
the connecting column penetrates through one of the inserting holes and penetrates out of the other inserting hole through the mounting part, so that the bearing surfaces bonded with the wafer samples are oppositely arranged;
and after the test is finished, the connecting column is drawn out of the inserting hole so as to detach the connecting piece from the clamp.
CN202110730899.2A 2021-06-29 2021-06-29 Connecting piece, test equipment and test method of wafer Pending CN113432964A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114136881A (en) * 2021-11-29 2022-03-04 胜科纳米(苏州)股份有限公司 Method for testing metal packaging bonding force of capacitive square fingerprint sensor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114136881A (en) * 2021-11-29 2022-03-04 胜科纳米(苏州)股份有限公司 Method for testing metal packaging bonding force of capacitive square fingerprint sensor

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