CN113430487A - Forming preparation method of NiAl-based alloy thin-wall component containing V element - Google Patents

Forming preparation method of NiAl-based alloy thin-wall component containing V element Download PDF

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CN113430487A
CN113430487A CN202110695246.5A CN202110695246A CN113430487A CN 113430487 A CN113430487 A CN 113430487A CN 202110695246 A CN202110695246 A CN 202110695246A CN 113430487 A CN113430487 A CN 113430487A
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layer
vacuum
nial
diffusion reaction
temperature
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CN113430487B (en
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苑世剑
王东君
刘钢
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Harbin Institute of Technology
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    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/28—Solid state diffusion of only metal elements or silicon into metallic material surfaces using solids, e.g. powders, pastes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • C—CHEMISTRY; METALLURGY
    • C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
    • C22C—ALLOYS
    • C22C19/00—Alloys based on nickel or cobalt
    • C22C19/03—Alloys based on nickel or cobalt based on nickel
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C10/00—Solid state diffusion of only metal elements or silicon into metallic material surfaces
    • C23C10/18—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions
    • C23C10/20—Solid state diffusion of only metal elements or silicon into metallic material surfaces using liquids, e.g. salt baths, liquid suspensions only one element being diffused
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/16—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon
    • C23C14/165—Metallic material, boron or silicon on metallic substrates or on substrates of boron or silicon by cathodic sputtering
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/718—Weight, e.g. weight per square meter

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  • Chemical Kinetics & Catalysis (AREA)
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Abstract

The invention provides a forming preparation method of a NiAl-based alloy thin-wall component containing a V element, belonging to the technical field of high-temperature alloy forming. The forming preparation method comprises the following steps: and (3) putting the laminated material comprising the Ni layer, the V layer and the Al layer into a mould to sequentially carry out vacuum thermoforming and vacuum diffusion reaction to obtain the NiAl-based alloy thin-wall component. In the vacuum diffusion reaction, Ni and Al react to generate a NiAl matrix, and metal V can be used for being dissolved into the NiAl matrix and forming an intermetallic compound strengthening phase with the NiAl matrix, so that the high-temperature strength of the NiAl-based alloy thin-wall component is improved.

Description

Forming preparation method of NiAl-based alloy thin-wall component containing V element
Technical Field
The invention relates to the technical field of high-temperature alloy forming, in particular to a forming preparation method of a NiAl-based alloy thin-wall component containing a V element.
Background
NiAl-based intermetallic compounds (NiAl-based alloys) are high-temperature resistant materials which have important application prospects and are researched and developed in recent years. The density of the NiAl-based alloy is 5.9g/cm32/3 which is the Ni-based high-temperature alloy, and the thermal conductivity is 4-8 times of that of the Ni-based high-temperature alloy. The NiAl-based alloy is applied to the fields of a new generation of hypersonic aircrafts and the like, can reduce weight, can enhance the active cooling performance and further improve the service temperature, and the service temperature is improved by 100-200 ℃ compared with that of the Ni-based superalloy. In addition, the NiAl-based alloy can still keep high enough creep resistance, oxidation resistance, flame retardant property and the like at 1100 ℃, so that the NiAl-based alloy is undoubtedly taken as a light high-temperature-resistant material with development prospect, and can replace a high-temperature alloy at the temperature range of 800-1100 ℃ to meet the requirements of new-generation equipment on high-performance thin-wall complex components.
Although NiAl-based alloys have many advantages, there is still a need to solve the problems of forming and workability in large-scale applications in the field of aerospace equipment and the like. This is mainly reflected in: (1) the complex thin-wall component of the NiAl-based alloy is difficult to form, and the room temperature plasticity of the NiAl-based alloy is low, thereby bringing about outstanding forming problems. (2) The high-temperature strength of the NiAl-based alloy needs to be further improved. Stress generated by the new generation of key components during working at 1000 ℃ can reach 100-150 MPa, and the tensile strength of the single-phase NiAl alloy at 1000 ℃ is lower than 100MPa, so that the high-temperature strength performance of the NiAl-based alloy components needs to be improved.
Aiming at the forming difficulty of the NiAl-based alloy thin-wall component, a reaction forming preparation method is proposed in recent years. Compared with the traditional method, the method utilizes the good ductility of the Ni foil and the Al foil, firstly obtains a formed member by laminating raw materials, and then enables the Ni foil and the Al foil to react under the coupling action of temperature and pressure to prepare the NiAl-based alloy. Nevertheless, the high temperature strength index of the formed thin-walled NiAl-based alloy component is not improved, and still is a technical bottleneck for restricting the large-scale application of the thin-walled NiAl-based alloy key component in the new generation of equipment.
Disclosure of Invention
The invention aims to provide a forming preparation method of a NiAl-based alloy thin-wall component containing a V element, which can improve the high-temperature strength of the NiAl-based alloy thin-wall component.
In order to achieve the above object, the present invention provides the following technical solutions:
the invention provides a forming preparation method of a NiAl-based alloy thin-wall component containing a V element, which comprises the following steps:
putting the laminated material comprising the Ni layer, the V layer and the Al layer into a mould to carry out vacuum thermoforming and vacuum diffusion reaction in sequence to obtain a NiAl-based alloy thin-wall component;
the vacuum diffusion reaction comprises: sequentially carrying out a first vacuum diffusion reaction, a second vacuum diffusion reaction and a third vacuum diffusion reaction; the temperature of the first vacuum diffusion reaction is 600-650 ℃, the pressure is 10-20 MPa, and the heat preservation and pressure maintaining time is 0.5-2 h; the temperature of the second vacuum diffusion reaction is 750-850 ℃, the pressure is not applied, and the heat preservation time is 0.1-1 h; the temperature of the third vacuum diffusion reaction is 1100-1300 ℃, the pressure is 30-50 MPa, and the heat preservation and pressure maintaining time is 1-3 h.
Preferably, the atomic percentage of Ni in the laminated material is 25-50%, the atomic percentage of Al is 25-49.9%, and the atomic percentage of V is 0.1-50%.
Preferably, the outer layer of the laminated material is a Ni layer.
Preferably, the thickness of each Ni layer is 20-200 μm independently, the thickness of each Al layer is 20-200 μm independently, and the thickness of each V layer is 1-200 μm independently.
Preferably, each Ni layer consists of a Ni foil; each Al layer consists of Al foil; when the thickness of the single V layer is more than 50 μm and less than or equal to 200 μm, the V layer is composed of V foil; when the thickness of the single-layer V layer is more than or equal to 1 mu m and less than 50 mu m, the V layer is a coating; when the thickness of the monolayer V layer is 50 μm, the V layer consists of a V foil or is a coating.
Preferably, when the V layer is a coating layer, the V layer is formed by coating metal V onto the surface of the Ni layer.
Preferably, the thickness of the NiAl-based alloy thin-wall component is 1-3 mm.
Preferably, the vacuum thermoforming conditions include: vacuum degree of 1.0X 10-3～5.0×10-3Pa, the temperature is 550-650 ℃, and the pressure is 10-50 MPa.
Preferably, the vacuum thermoforming method comprises hot-state press forming or hot-fluid pressure forming of a mold.
Preferably, the vacuum degree of the vacuum diffusion reaction is 1.0X 10-3～5.0×10-3Pa。
The invention provides a forming preparation method of a NiAl-based alloy thin-wall component containing a V element, which comprises the following steps: putting the laminated material comprising the Ni layer, the V layer and the Al layer into a mould to carry out vacuum thermoforming and vacuum diffusion reaction in sequence to obtain a NiAl-based alloy thin-wall component; the vacuum diffusion reaction comprises: sequentially carrying out a first vacuum diffusion reaction, a second vacuum diffusion reaction and a third vacuum diffusion reaction; the temperature of the first vacuum diffusion reaction is 600-650 ℃, the pressure is 10-20 MPa, and the heat preservation and pressure maintaining time is 0.5-2 h; the temperature of the second vacuum diffusion reaction is 750-850 ℃, the pressure is not applied, and the heat preservation time is 0.1-1 h; the temperature of the third vacuum diffusion reaction is 1100-1300 ℃, the pressure is 30-50 MPa, and the heat preservation and pressure maintaining time is 1-3 h. In the vacuum diffusion reaction, Ni and Al react to generate a NiAl matrix, and metal V can be dissolved into the NiAl matrix and can also form an intermetallic compound strengthening phase with the NiAl matrix, so that the high-temperature strength of the NiAl-based alloy thin-wall component is improved.
According to the invention, the V layer is adopted instead of doping V into the Ni layer and the Al layer, so that the good forming performance of the Ni layer and the Al layer can be ensured.
In addition, the melting point of the metal V is 1890 ℃, and the metal V is suitable for being used under the high-temperature condition of 1000-1100 ℃; the density of the metal V is similar to that of the NiAl alloy (the density of V is 6.1 g/cm)3The density of the NiAl alloy is 5.9g/cm3) And V can not obviously improve the density of single-phase NiAl, so that the material still has the characteristic of light weight.
Drawings
FIG. 1 is a scanning electron micrograph of a Ni foil coated with a V layer on one surface thereof;
FIG. 2 is a scanning electron micrograph of a NiAl-V alloy sheet according to example 1;
fig. 3 is a stress-strain curve of tensile test at 1000 c for the sheets prepared in example 1, example 2 and comparative example 1.
Detailed Description
The invention provides a forming preparation method of a NiAl-based alloy thin-wall component containing a V element, which comprises the following steps:
putting the laminated material comprising the Ni layer, the V layer and the Al layer into a mould to carry out vacuum thermoforming and vacuum diffusion reaction in sequence to obtain a NiAl-based alloy thin-wall component; the vacuum diffusion reaction comprises: sequentially carrying out a first vacuum diffusion reaction, a second vacuum diffusion reaction and a third vacuum diffusion reaction; the temperature of the first vacuum diffusion reaction is 600-650 ℃, the pressure is 10-20 MPa, and the heat preservation and pressure maintaining time is 0.5-2 h; the temperature of the second vacuum diffusion reaction is 750-850 ℃, the pressure is not applied, and the heat preservation time is 0.1-1 h; the temperature of the third vacuum diffusion reaction is 1100-1300 ℃, the pressure is 30-50 MPa, and the heat preservation and pressure maintaining time is 1-3 h.
In the invention, the thickness of each Ni layer is preferably 20-200 μm independently, more preferably 40-160 μm, and further preferably 50-120 μm; the thickness of each Al layer is preferably 20-200 μm independently, more preferably 40-160 μm, and further preferably 50-120 μm; the thickness of each V layer is preferably 1-200 μm, more preferably 1-150 μm, and even more preferably 20-100 μm. In the present invention, the thickness of each Ni layer is preferably the same, the thickness of each Al layer is preferably the same, and the thickness of each V layer is preferably the same. In the examples of the present invention, the thickness of each Ni layer was 55 μm, the thickness of each Al layer was 100 μm, and the thickness of each V layer was 1.93 μm; or the thickness of each Ni layer is 60 μm, the thickness of each Al layer is 100 μm, and the thickness of each V layer is 100 μm
As a preferable aspect, in the present invention, each Ni layer is composed of Ni foil; each Al layer consists of Al foil; when the thickness of the single V layer is more than 50 μm and less than or equal to 200 μm, the V layer is composed of V foil; when the thickness of the single-layer V layer is more than or equal to 1 mu m and less than 50 mu m, the V layer is a coating; when the thickness of the monolayer V layer is 50 μm, the V layer consists of a V foil or is a coating.
In the present invention, when the Ni layer, the Al layer, and the V layer are each composed of a foil, the preparation of the laminate preferably includes: the Ni foil, Al foil, and V foil were alternately laminated to obtain a laminate.
In the present invention, when the Ni layer and the Al layer are composed of foil, and the V layer is a coating layer, the preparation of the laminate preferably includes: coating metal V on the surface of one side or two sides of the Ni foil to form a V layer; and alternately laminating the Ni foil coated with the V layer and the Al foil to obtain the laminated material. According to the invention, metal V is coated on the surface of the Ni foil, but not on the surface of the Al foil, because the melting point of Ni is high, the damage to the Ni foil in the coating process can be prevented.
In the present invention, the plating method preferably includes: electroplating, spraying, vapor deposition or magnetron sputtering. The invention has no special requirements on the specific implementation modes of electroplating, spraying, vapor deposition or magnetron sputtering, and the implementation modes known in the field can ensure that a V layer with the required thickness is obtained. In the embodiment of the invention, the adopted coating mode is magnetron sputtering; the target material adopted by the magnetron sputtering is a V target, the diameter of the V target is 76mm, the power of the magnetron sputtering is 200W, and the sputtering vacuum degree is 5 multiplied by 10-4Pa, sputtering temperature of 60 ℃ and sputtering time of 1h, and the thickness of the obtained V layer is 1.93 μm.
In the present invention, the outer layer of the laminate is preferably a Ni layer. Because the melting point and the strength of Ni are higher, the Ni layer is used as the outer layer of the laminated material, and the function of protecting the internal material can be achieved in the vacuum hot forming process.
The invention has no special requirement on the lamination sequence of the interlayer of the laminated material, can be randomly arranged, and preferably adjacent Ni layers and Al layers are in direct contact or separated by a V layer. In the vacuum diffusion reaction process, the Al layer with low melting point can be diffused into the Ni layer and/or the V layer at first, and only the Ni layer and the V layer are left to react, so that the lamination sequence has little influence on the performance of the NiAl-based alloy thin-wall component.
The invention has no special requirements on the number of the Ni layer, the Al layer and the V layer in the laminated material, and is determined according to the total thickness of the laminated material, the thickness of each layer and the atomic percentage content of Ni, Al and V in the laminated material.
In the invention, the atomic percentage of Ni in the laminated material is preferably 25-50%, the atomic percentage of Al is preferably 25-49.9%, and the atomic percentage of V is preferably 0.1-50%. In the embodiment of the invention, the atomic percent of Ni, Al and V in the laminated material is 36%, 35% and 29%; or the atomic percentage of Ni is 49.6%, the atomic percentage of Al is 49.7%, and the atomic percentage of V is 0.7%. The invention can ensure to obtain the NiAl-based alloy by controlling the atomic percentage content of Ni, Al and V in the laminated material.
The present invention has no particular requirement on the total thickness of the laminated material, and is preferably determined according to the reduction amount of vacuum thermoforming and the thickness of the NiAl-based alloy thin-walled member. The total thickness of the laminate material is the reduction by vacuum thermoforming plus the thickness of the NiAl-based alloy thin-walled member. In the invention, the thickness of the NiAl-based alloy thin-wall component is preferably 1-3 mm, and more preferably 1.5-2.5 mm. The amount of thinning in the vacuum thermoforming is not particularly limited in the present invention, and may be any amount known in the art.
In the present invention, as a further preferable mode, when the number of the Ni layers is n, n is not less than 2 and n is an integer; the number of the Al layers is n or n-1, the number of the V layers is m, m is larger than or equal to 1 and smaller than or equal to 2n-2, and m is an integer.
After the laminated material is obtained, the laminated material is placed in a die to sequentially carry out vacuum thermal forming and vacuum diffusion reaction, and the NiAl-based alloy thin-wall component is obtained.
The invention has no special requirements on the size and the shape of the die and is determined according to the size and the shape of the target NiAl-based alloy thin-wall component.
In the present invention, the vacuum thermoforming conditions preferably include: vacuum degree of 1.0X 10-3～5.0×10- 3Pa, temperature of 550-650 deg.C, pressure10 to 50 MPa; the degree of vacuum is more preferably 2.0X 10-3～4.0×10- 3Pa, the temperature is more preferably 600-640 ℃, and the pressure is more preferably 17-23 MPa. The time for the vacuum thermoforming is not particularly required in the present invention, and a person skilled in the art can select an appropriate forming time according to the shape of the member and the forming method, which is well known in the art. In the embodiment of the present invention, when the forming member is a plate material and is formed by vacuum hot pressing, the forming time is only a few seconds, which is negligible.
The temperature is preferably raised from room temperature to the temperature of vacuum thermoforming, and the rate of raising the temperature is not particularly required in the invention, and the rate of raising the temperature is well known in the art. In an embodiment of the present invention, the rate of temperature rise is 10 ℃/min.
In the present invention, the vacuum thermoforming method preferably includes hot press forming or hot fluid pressure forming of a mold.
In the present invention, the hot press forming of the mold preferably comprises vacuum hot pressing, vacuum current heated pressing or hot isostatic pressing; the invention has no special requirements on the specific implementation process of the vacuum hot pressing, the vacuum current heating pressing or the hot isostatic pressing, and the implementation process well known in the field can be adopted. In the embodiment of the invention, vacuum hot pressing is adopted; the vacuum degree of the vacuum hot pressing is 2.0 multiplied by 10-3Pa, the temperature of the vacuum hot pressing is 640 ℃, the pressure is 15MPa, and the pressing time is only a few seconds and can be ignored.
In the present invention, the hot fluid pressure forming preferably includes hot solid particulate medium pressure forming or hot gaseous medium pressure forming. The implementation process of the hot solid particle medium pressure forming or the hot gas medium pressure forming has no special requirement, and the implementation process known in the field can be adopted. The present invention preferably selects a suitable vacuum thermoforming method according to the shape of the mold, which is common knowledge in the art and will not be described herein.
The invention obtains the thin-wall component with the target shape through the vacuum hot forming.
After the vacuum hot-press forming is completed, the component is subjected to vacuum diffusion reaction to obtain the NiAl-based alloy thin-wall component.
In the present invention, the vacuum diffusion reaction includes: sequentially carrying out a first vacuum diffusion reaction, a second vacuum diffusion reaction and a third vacuum diffusion reaction; the temperature of the first vacuum diffusion reaction is 600-650 ℃, the pressure is 10-20 MPa, and the heat preservation and pressure maintaining time is 0.5-2 h; the temperature of the second vacuum diffusion reaction is 750-850 ℃, the pressure is not applied, and the heat preservation time is 0.1-1 h; the temperature of the third vacuum diffusion reaction is 1100-1300 ℃, the pressure is 30-50 MPa, and the heat preservation and pressure maintaining time is 1-3 h.
Preferably, in the invention, the temperature of the first vacuum diffusion reaction is 610-640 ℃, the pressure is 12-18 MPa, and the heat preservation and pressure maintaining time is 1.0-1.5 h; the temperature of the second vacuum diffusion reaction is 770-830 ℃, and the heat preservation time is 0.3-0.6 h; the temperature of the third vacuum diffusion reaction is 1150-1250 ℃, the pressure is 35-45 MPa, and the heat preservation and pressure maintaining time is 1.5-2.5 h.
In the present invention, the temperature of the first vacuum diffusion reaction is preferably equal to or higher than the temperature of the vacuum thermoforming, and in the present invention, it is preferable that the temperature is directly raised from the temperature of the vacuum thermoforming or kept constant to the temperature of the first vacuum diffusion reaction, then the temperature is first raised from the temperature of the first vacuum diffusion reaction to the temperature of the second vacuum diffusion reaction, and then the temperature is second raised from the temperature of the second vacuum diffusion reaction to the temperature of the third vacuum diffusion reaction. The invention has no special requirement on the speed of the first temperature rise and the second temperature rise; in the embodiment of the invention, the first temperature rise rate is 10 ℃/min, and the second temperature rise rate is 15 ℃/min.
In the present invention, the degree of vacuum of the vacuum diffusion reaction is preferably 1.0X 10-3～5.0×10-3Pa, more preferably 2.0X 10-3～4.0×10-3Pa, more preferably 2.5X 10-3～3.5×10-3Pa，
Because the melting point of Al is lower, the invention adopts a sectional diffusion reaction mode to prevent liquid splashing or outflow caused by Al melting due to direct high temperature. In a low-temperature diffusion stage (namely 600-650 ℃), all solid Al diffuses into the Ni layer and/or the V layer, then along with the rise of temperature, liquid-solid diffusion reaction or solid-phase diffusion reaction occurs among Ni, Al and V, Ni and Al react to generate a NiAl matrix, metal V can enter the NiAl matrix in a solid solution mode, and an intermetallic compound strengthening phase can also be formed with the NiAl matrix, so that the high-temperature strength of the NiAl-based alloy thin-wall component is improved.
The following will explain the forming and manufacturing method of the thin-walled NiAl-based alloy member containing V element provided by the present invention in detail with reference to the examples, but they should not be construed as limiting the scope of the present invention.
Example 1
(1) A Ni foil with the thickness of 55 mu m and the size of 100mm multiplied by 100mm is selected, and a V layer is coated on the surface of one side of the Ni foil by adopting a magnetron sputtering method. The diameter of the adopted V target is 76mm, the sputtering power is 200W, and the sputtering vacuum degree is 5 multiplied by 10-4Pa, the sputtering temperature is 60 ℃, and the sputtering time is 1 h. FIG. 1 is a scanning electron micrograph of a Ni foil coated with a V layer on one surface, and it can be seen from FIG. 1 that the average thickness of the V layer is 1.93. mu.m.
(2) Alternately stacking Ni foils with V-layer coated on the surface and Al foils, and alternately stacking for 12 cycles according to the sequence of Ni-V-Al, wherein the last layer is the Ni foil with the V-layer coated on the surface, and the Ni side faces outwards to obtain a laminated material; wherein the thickness of the Al foil is 100 mu m; the thickness of each layer of Ni foil is the same, and the thickness of each layer of Al foil and the thickness of each layer of V plating layer are also the same; 13 layers of Ni foil and 12 layers of Al foil were used for the V-layer-coated Ni foil.
(3) According to the size of the final plate, the size of an inner cavity of the die is designed to be 100.3mm multiplied by 100.3mm, and the depth of the inner cavity of the die is 10 mm; the cross section of the upper and lower indenters is 100.2mm multiplied by 100.2mm, and the height of the indenter is 15 mm. Molding the laminated material by vacuum hot pressing method with vacuum degree of 2.0 × 10-3Pa, heating from room temperature to 640 ℃ at a heating rate of 10 ℃/min, pressing at 640 ℃ and 15MPa, directly carrying out vacuum diffusion reaction after forming, and adopting liquid-solid diffusion reaction, wherein the specific parameters are as follows: the degree of vacuum was 2.0X 10-3Pa, firstly, processing for 1h at 640 ℃ and 15MPa pressure, and then unloading the pressure; ② from 10 DEG CThe temperature rise rate of/min is increased from 640 ℃ to 800 ℃, and the liquid-solid reaction is carried out for 0.5h under the condition of 800 ℃ and no pressure; thirdly, the temperature is raised from 800 ℃ to 1200 ℃ at the heating rate of 15 ℃/min, the treatment is carried out for 2h at the pressure of 1200 ℃ and 40MPa, the pressure is unloaded, the die is opened after the furnace temperature is cooled to the room temperature, and the part is taken out, so that the NiAl-V alloy plate with the thickness of 1.7mm is obtained, wherein the atomic percentage content of V is 0.7%, the atomic percentage content of Ni is 49.6%, and the atomic percentage content of Al is 49.7%.
The microstructure of the NiAl-V alloy sheet of example 1 was observed by a scanning electron microscope, as shown in FIG. 2. It can be seen that: the average grain size of the NiAl alloy is 20-30 mu m, part of V elements enter the NiAl phase in a solid solution mode, and a small amount of V precipitated phases are distributed at the grain boundary of the NiAl phase.
Example 2
(1) Ni foil with thickness of 60 μm and size of 50mm × 50mm, Al foil with thickness of 100 μm and size of 50mm × 50mm, and V foil with thickness of 100 μm and size of 50mm × 50mm are selected.
(2) Alternately stacking the foils for 8 cycles according to the sequence of Ni-Al-V, and finally, taking two layers from inside to outside as Al foil and Ni foil; 9 layers of Ni foil, 9 layers of Al foil and 8 layers of V foil are used, and the total thickness of the foil raw materials is 2.24 mm.
(3) According to the size of the final plate, the size of an inner cavity of the die is designed to be 50.3mm multiplied by 50.3mm, and the depth of the inner cavity of the die is 10 mm; the cross section of the upper and lower pressure heads is 50.2mm multiplied by 50.2mm, and the height of the pressure head is 15 mm. Molding the laminated material by vacuum hot pressing with a vacuum degree of 1.0 × 10-3Pa, heating from room temperature to 640 ℃ at a heating rate of 10 ℃/min, pressing at 640 ℃ and 15MPa, directly carrying out vacuum diffusion reaction after forming, and adopting liquid-solid diffusion reaction, wherein the specific parameters are as follows: vacuum degree of 1.0X 10-3Pa, firstly, processing for 1h at 640 ℃ and 15MPa pressure, and then unloading the pressure; heating from 640 ℃ to 800 ℃ at a heating rate of 10 ℃/min, and carrying out liquid-solid reaction for 0.5h at 800 ℃ under a pressure-free condition; thirdly, raising the temperature from 800 ℃ to 1250 ℃ at a temperature raising rate of 15 ℃/min, processing for 2h at the temperature of 1250 ℃ and under the pressure of 40MPa, unloading the pressure, opening the die after the furnace temperature is cooled to room temperature, taking out the part to obtain the NiAl-V alloy plate with the thickness of 1.9mm, wherein the atomic percentage content of V is 29 percent,the atomic percentage of Ni is 36%, and the atomic percentage of Al is 35%.
Comparative example 1
The difference from example 1 was that the same Ni foil (13 layers) and Al foil (12 layers) were used, the V layer was not added, and the laminate was press-molded by a vacuum hot-pressing method in a degree of vacuum of 2.0X 10-3Pa, preparing the single-phase NiAl alloy plate. The preparation conditions are as follows: firstly, heating from room temperature to 640 ℃ at a heating rate of 10 ℃/min, and treating for 4 hours at 640 ℃ and 15 MPa; ② raising the temperature from 640 ℃ to 1200 ℃ at a heating rate of 10 ℃/min, and processing for 1h at 1200 ℃ and under a pressure of 25MPa to obtain the NiAl alloy plate.
The sheets prepared in example 1, example 2 and comparative example 1 were subjected to a high temperature tensile test at 1000 c and the stress-strain curves obtained are shown in fig. 3. As can be seen from FIG. 3, at 1000 ℃, the engineering strain of the three plates exceeds 20%, which meets the requirements of actual engineering; while the tensile strength of the NiAl-V alloy plates prepared in the examples 1 and 2 is increased to 144.3MPa and 201.7MPa from 76.1MPa of the single-phase NiAl alloy plate prepared in the comparative example 1, which are respectively increased by 90% and 165%.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, various modifications and decorations can be made without departing from the principle of the present invention, and these modifications and decorations should also be regarded as the protection scope of the present invention.

Claims (10)

1. A forming preparation method of a NiAl-based alloy thin-wall component containing V elements is characterized by comprising the following steps:
putting the laminated material comprising the Ni layer, the V layer and the Al layer into a mould to carry out vacuum thermoforming and vacuum diffusion reaction in sequence to obtain a NiAl-based alloy thin-wall component;
the vacuum diffusion reaction comprises: sequentially carrying out a first vacuum diffusion reaction, a second vacuum diffusion reaction and a third vacuum diffusion reaction; the temperature of the first vacuum diffusion reaction is 600-650 ℃, the pressure is 10-20 MPa, and the heat preservation and pressure maintaining time is 0.5-2 h; the temperature of the second vacuum diffusion reaction is 750-850 ℃, the pressure is not applied, and the heat preservation time is 0.1-1 h; the temperature of the third vacuum diffusion reaction is 1100-1300 ℃, the pressure is 30-50 MPa, and the heat preservation and pressure maintaining time is 1-3 h.
2. The forming preparation method according to claim 1, wherein the atomic percent of Ni, Al and V in the laminated material is 25 to 50%, 25 to 49.9% and 0.1 to 50%, respectively.
3. The form preparation method of claim 1, wherein the outer layer of the laminate material is a Ni layer.
4. The forming preparation method according to any one of claims 1 to 3, wherein the thickness of each Ni layer is independently 20 to 200 μm, the thickness of each Al layer is independently 20 to 200 μm, and the thickness of each V layer is independently 1 to 200 μm.
5. The form preparation method of claim 4, wherein each Ni layer consists of a Ni foil; each Al layer consists of Al foil; when the thickness of the single V layer is more than 50 μm and less than or equal to 200 μm, the V layer is composed of V foil; when the thickness of the single-layer V layer is more than or equal to 1 mu m and less than 50 mu m, the V layer is a coating; when the thickness of the monolayer V layer is 50 μm, the V layer consists of a V foil or is a coating.
6. The formation preparation method according to claim 5, wherein when the V layer is a coating layer, the V layer is formed by coating metal V onto the surface of the Ni layer.
7. The forming preparation method according to claim 1, wherein the NiAl-based alloy thin-walled member has a thickness of 1 to 3 mm.
8. The shape preparation method according to claim 1, wherein the conditions of the vacuum thermoforming include: vacuum degree of 1.0X 10-3～5.0×10-3Pa, the temperature is 550-650 ℃, and the pressure is 10-50 MPa.
9. The forming preparation method according to claim 1 or 8, wherein the vacuum thermoforming method comprises mold hot press forming or hot fluid pressure forming.
10. The forming preparation method according to claim 1, wherein the degree of vacuum of the vacuum diffusion reaction is 1.0 x 10-3～5.0×10-3Pa。
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