CN113423244A - Preparation method and application of aluminum-based liquid cooling heat dissipation structure - Google Patents

Preparation method and application of aluminum-based liquid cooling heat dissipation structure Download PDF

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Publication number
CN113423244A
CN113423244A CN202110721502.3A CN202110721502A CN113423244A CN 113423244 A CN113423244 A CN 113423244A CN 202110721502 A CN202110721502 A CN 202110721502A CN 113423244 A CN113423244 A CN 113423244A
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aluminum
heat dissipation
liquid
dissipation structure
based liquid
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CN113423244B (en
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亓钧雷
刘柏深
闫耀天
曹健
冯吉才
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Harbin Institute of Technology
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Harbin Institute of Technology
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    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20218Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
    • H05K7/20272Accessories for moving fluid, for expanding fluid, for connecting fluid conduits, for distributing fluid, for removing gas or for preventing leakage, e.g. pumps, tanks or manifolds
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B22CASTING; POWDER METALLURGY
    • B22FWORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
    • B22F3/00Manufacture of workpieces or articles from metallic powder characterised by the manner of compacting or sintering; Apparatus specially adapted therefor ; Presses and furnaces
    • B22F3/12Both compacting and sintering
    • B22F3/14Both compacting and sintering simultaneously

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Powder Metallurgy (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

A preparation method and application of an aluminum-based liquid cooling heat dissipation structure relate to a preparation method and application of a heat dissipation structure. The invention aims to solve the problem that the traditional foam material is low in strength and easy to deform and crush under the working condition of high vibration impact. The preparation method comprises the following steps: firstly, preparing a foamed aluminum structure; and secondly, injecting the liquid-cooled substrate. The application comprises the following steps: the aluminum-based liquid-cooled heat dissipation structure is used for heat dissipation of an electronic circuit system or a battery system. The invention is used for the preparation and the application of the aluminum-based liquid cooling heat dissipation structure.

Description

Preparation method and application of aluminum-based liquid cooling heat dissipation structure
Technical Field
The invention relates to a preparation method and application of a heat dissipation structure.
Background
With the development of the times, people begin to pay more and more attention to the importance of light weight in the fields of aviation, aerospace, vehicles and the like at present. For example, in commercial airliners, the price of aviation fuel is more than ten times higher than that of the conventional automobile fuel, and a great amount of economic consumption can be saved by reducing the weight of each point. In the field of fighters, the weight reduction benefit can obviously improve the maneuvering performance and speed of the fighter, enhance the elastic capacity and further enhance the survival capability and the fighting capacity. The space field can increase the effective load and realize the further breakthrough of carrying capacity. In many structures in these fields, light materials are often used to increase the effective load, but simply changing the component configuration of the materials is often influenced by the mechanical properties of the materials, so that changing the material structure is a breakthrough in changing the current situation.
The foam structure has a porous structure, has lower density compared with the traditional alloy, has a plurality of excellent properties, can be used as a structural material and a functional material to be applied to the fields of aviation, aerospace, vehicles and the like, can bring huge weight reduction benefits, and adds a plurality of advantages brought by the porous structure of the foam structure. If the foam structure has good energy absorption performance and damping performance, the key parts can be protected from being damaged when the foam structure encounters strong impact.
With the continuous development of aerospace and electronic industries, task platforms show the trends of large task quantity, multiple target functions and larger power consumption and heat productivity, particularly, communication and electric control parts even contain a large number of pulse heat sources along with the increase of self integration level, and if the heat dissipation capacity of a heat dissipation unit is not enough to maintain the stability of temperature, parts are damaged due to overhigh temperature, so that the personal property safety is threatened. This puts higher demands on the heat dissipation performance of the whole heat dissipation module, and not only the heat transfer and dissipation, but also the uniformity of the heat dissipation structure.
The foam materials mainly applied at present are mainly high-porosity foam carbon, foam copper and the like, and the foam carbon, foam metal and the like are adopted as heat dissipation media for electric control and battery equipment in enterprises of the United states, Europe and the like internationally. In actual use, the carbon structure material has the problems of fragility, difficult preparation and the like. The nickel foam and the copper foam materials with high porosity have the problems of high preparation cost, easy deformation of the structure in the face of working conditions such as bumping, vibration and the like. Therefore, in order to utilize the advantages of the foam material and avoid the problems, a foam material which is low in cost and can resist certain complicated working conditions needs to be found.
Disclosure of Invention
The invention provides a preparation method and application of an aluminum-based liquid-cooling heat dissipation structure, aiming at solving the problem that the traditional foam material is low in strength and easy to deform and crush under the high-vibration impact working condition.
A preparation method of an aluminum-based liquid cooling heat dissipation structure is carried out according to the following steps:
firstly, preparing a foamed aluminum structure:
adding a soldering flux, a particle reinforcing phase and a gas-forming agent into aluminum-based powder, and uniformly stirring to obtain prefabricated powder;
the mass ratio of the aluminum-based powder to the soldering flux is 1 (0.01-1); the mass ratio of the aluminum-based powder to the particle reinforced phase is 1 (0.01-1); the mass ratio of the aluminum-based powder to the gas-forming agent is 1 (0.01-1);
secondly, placing the prefabricated body powder into a hot-pressing sintering mold, and presintering for 5min to 10h under the conditions of protective gas atmosphere, temperature of 200 ℃ to 500 ℃ and pressure of less than 1GPa to obtain a presintering hot-pressing structure;
thirdly, under the conditions of protective gas atmosphere, temperature of 500-1500 ℃ and pressure of below 500MPa, carrying out hot-pressing sintering on the pre-sintered hot-pressed structure for 10 min-10 h to obtain sintered foamed aluminum;
removing the machining allowance of the sintered foamed aluminum, and washing to obtain the mesoporous foamed aluminum;
secondly, injecting a liquid-cooled substrate:
and one end of the mesoporous foamed aluminum is contacted with the liquid level of the cooling liquid, and the cooling liquid is injected and filled through the capillary phenomenon of the mesoporous foamed aluminum, so that the aluminum-based liquid-cooled heat dissipation structure is obtained.
An application of an aluminum-based liquid-cooled heat dissipation structure is disclosed, wherein the aluminum-based liquid-cooled heat dissipation structure is used for heat dissipation of an electronic circuit system or a battery system.
The invention has the beneficial effects that:
(1) the mesoporous foamed aluminum adopted by the method has certain mechanical strength, the high-porosity foamed material is difficult to cope with the working conditions of impact, short-time high load and the like, and the mesoporous open-cell foamed material has certain strength due to lower porosity and higher density, is not easy to deform in use, and has the advantages of being not easy to break and good in impact resistance compared with carbon materials and the like. The application range and the application condition are enlarged.
(2) The method supports a large-scale foam heat dissipation structure and can meet the actual production requirements of a certain scale. And because the prepared foamed aluminum structure is the mesoporous foamed aluminum with small porosity, compared with other foamed materials and traditional high-porosity structures, the mesoporous foamed aluminum material has the advantages that the preparation requirement is reduced, and the preparation period is shortened.
(3) The method of the invention provides a solution for liquid cooling, and simultaneously, because the liquid transmission mainly depends on capillary phenomenon, the cooling liquid is uniformly distributed and has better wettability, and because the foam structure has a large number of pore pipelines, a large amount of cooling agent can be carried, the risk of liquid leakage is reduced, and higher heat dissipation capability and safety performance are obtained.
(4) The method of the invention essentially utilizes the capillary phenomenon, when the pore space is small, the cooling liquid can be distributed at all positions of the foam material along the pore space due to the capillary phenomenon among the pores, and the average climbing speed can reach 1.6 mm/s. The foamed aluminum material not only has good heat dissipation capacity of metal, but also has the characteristic of uniform distribution of the coolant, and can realize heat exchange with large capacity and large area, so that the light weight of the heat dissipation module can be realized. Compare in traditional forced air cooling, water-cooling, often need a large amount of pipelines and fan to cooperate, the heat dissipation is inhomogeneous and occupy bulky problem, and foam structure heat dissipation module has then fine this point of avoidd. The module has good natural heat dissipation performance and takes heat dissipation capacity and module volume into consideration.
The invention provides a preparation method and application of an aluminum-based liquid-cooling heat dissipation structure.
Drawings
FIG. 1 is a scanning electron micrograph of a mesoporous aluminum foam prepared according to step one of the example.
Detailed Description
The first embodiment is as follows: the preparation method of the aluminum-based liquid cooling heat dissipation structure in the embodiment is carried out according to the following steps:
firstly, preparing a foamed aluminum structure:
adding a soldering flux, a particle reinforcing phase and a gas-forming agent into aluminum-based powder, and uniformly stirring to obtain prefabricated powder;
the mass ratio of the aluminum-based powder to the soldering flux is 1 (0.01-1); the mass ratio of the aluminum-based powder to the particle reinforced phase is 1 (0.01-1); the mass ratio of the aluminum-based powder to the gas-forming agent is 1 (0.01-1);
secondly, placing the prefabricated body powder into a hot-pressing sintering mold, and presintering for 5min to 10h under the conditions of protective gas atmosphere, temperature of 200 ℃ to 500 ℃ and pressure of less than 1GPa to obtain a presintering hot-pressing structure;
thirdly, under the conditions of protective gas atmosphere, temperature of 500-1500 ℃ and pressure of below 500MPa, carrying out hot-pressing sintering on the pre-sintered hot-pressed structure for 10 min-10 h to obtain sintered foamed aluminum;
removing the machining allowance of the sintered foamed aluminum, and washing to obtain the mesoporous foamed aluminum;
secondly, injecting a liquid-cooled substrate:
and one end of the mesoporous foamed aluminum is contacted with the liquid level of the cooling liquid, and the cooling liquid is injected and filled through the capillary phenomenon of the mesoporous foamed aluminum, so that the aluminum-based liquid-cooled heat dissipation structure is obtained.
The heat dissipation module of the specific embodiment is designed as follows: according to the use requirement and the requirement of the foamed aluminum production equipment, the shape and the size of the heat dissipation module are reasonably designed. And the shape should not have structures such as hollow spaces and the like, and reduce the stacking structure, and the size should meet the requirements of the die and the preparation equipment.
The liquid-phase cooling liquid described in the specific embodiment does not include liquid cooling liquids of metals such as liquid sodium, sodium-potassium alloy and the like.
The beneficial effects of the embodiment are as follows:
(1) the mesoporous foamed aluminum adopted by the method has certain mechanical strength, the high-porosity foamed material is difficult to deal with working conditions such as impact, short-time high load and the like, and the mesoporous open-cell foamed material has certain strength due to low porosity and high density, is not easy to deform in use, and has the advantages of being not easy to break and good in impact resistance compared with carbon materials and the like. The application range and the application condition are enlarged.
(2) The method supports a large-scale foam heat dissipation structure, and can meet the actual production requirements of a certain scale. And because the prepared foamed aluminum structure is the mesoporous foamed aluminum with small porosity, compared with other foamed materials and traditional high-porosity structures, the mesoporous foamed aluminum material has the advantages that the preparation requirement is reduced, and the preparation period is shortened.
(3) The method of the embodiment provides a liquid cooling solution, and meanwhile, the liquid transmission mainly depends on capillary phenomenon, the cooling liquid is uniformly distributed, the wettability is good, and the foam structure is provided with a large number of pore pipelines, so that a large number of cooling agents can be borne, the risk of liquid leakage is reduced, and higher heat dissipation capacity and safety performance are obtained.
(4) The method of the embodiment essentially utilizes the capillary phenomenon, when the pore space is small, the cooling liquid can be distributed at all positions of the foam material along the pore space due to the capillary phenomenon among the pores, and the average climbing speed can reach 1.6 mm/s. The foamed aluminum material not only has good heat dissipation capacity of metal, but also has the characteristic of uniform distribution of the coolant, and can realize heat exchange with large capacity and large area, so that the light weight of the heat dissipation module can be realized. Compare in traditional forced air cooling, water-cooling, often need a large amount of pipelines and fan to cooperate, the heat dissipation is inhomogeneous and occupy bulky problem, and foam structure heat dissipation module has then fine this point of avoidd. The module has good natural heat dissipation performance and takes heat dissipation capacity and module volume into consideration.
The second embodiment is as follows: the first difference between the present embodiment and the specific embodiment is: the grain diameter of the aluminum-based powder in the first step is 10 meshes-1000 meshes; the aluminum-based powder in the first step is Al powder or Al-Si alloy powder; in the first step, the soldering flux is KBr or QJ 201; in the first stepThe particle reinforced phase is SiC or TiO2Or AlN; the gas-making agent in the first step is TiH2Or CaCO3. The rest is the same as the first embodiment.
The third concrete implementation mode: this embodiment is different from the first or second embodiment in that: the atmosphere of the protective gas in the first step and the third step is vacuum, air, high-purity Ar gas and Ar/H2And (4) mixing the gases. The other is the same as in the first or second embodiment.
The fourth concrete implementation mode: the difference between this embodiment mode and one of the first to third embodiment modes is: the mesoporous foamed aluminum in the first step is open-cell foamed aluminum with the pore diameter of 1-100 mu m. The others are the same as in the first or third embodiment.
The fifth concrete implementation mode: the difference between this embodiment and one of the first to fourth embodiments is: the cooling liquid in the second step is water, water-based cooling liquid, alcohol-type cooling liquid, glycerol-type cooling liquid or glycol-type cooling liquid. The rest is the same as the first to fourth embodiments.
The sixth specific implementation mode: the difference between this embodiment and one of the first to fifth embodiments is: the aluminum-based liquid cooling heat dissipation structure in the second step is a cubic straight plate-shaped structure; and the size of the aluminum-based liquid cooling heat dissipation structure in the second step is 20mm multiplied by 5 mm. The rest is the same as the first to fifth embodiments.
The seventh embodiment: in the application of the aluminum-based liquid-cooled heat dissipation structure of the present embodiment, the aluminum-based liquid-cooled heat dissipation structure is used for heat dissipation of an electronic circuit system or a battery system.
The specific implementation mode is eight: the seventh embodiment is different from the seventh embodiment in that: the application method of the aluminum-based liquid cooling heat dissipation structure comprises the following steps:
firstly, installation:
placing the aluminum-based liquid-cooled heat dissipation structure in an open mold to obtain an assembled mold, and fixing the open side of the assembled mold on a material to be dissipated, so that the aluminum-based liquid-cooled heat dissipation structure is tightly attached to the material to be dissipated for heat dissipation;
II, replacing the cooling liquid:
utilize adsorbing material and aluminium base liquid cooling heat radiation structure one end to contact for the coolant liquid adsorbs on the adsorbing material, obtains the heat radiation structure after the absorption, then contacts heat radiation structure one end after will adsorbing with the coolant liquid level, realizes the injection filling of coolant liquid through mesopore foamed aluminum capillary phenomenon. The rest is the same as the seventh embodiment.
Detailed description of the preferred embodimentsa mold material is cut to the appropriate size and should have a high melting point so that it does not deform when heated.
The specific implementation mode is to arrange the prepared heat dissipation module on the required equipment.
If the aluminum-based liquid-cooled heat dissipation structure is not tightly attached to the material to be dissipated, bonding the aluminum-based liquid-cooled heat dissipation structure and the material to be dissipated by using an adhesive; the adhesive is 502 glue, silicone grease, silver glue or heat-resistant glue.
The specific implementation method nine: this embodiment differs from the seventh or eighth embodiment in that: the material of the die in the step one is aluminum alloy. The others are the same as the seventh or eighth embodiments.
The detailed implementation mode is ten: the present embodiment differs from one of the seventh to ninth embodiments in that: and the adsorbing material in the second step is silica gel or macromolecular water-absorbent resin. The others are the same as those of the seventh to ninth embodiments.
The following examples were used to demonstrate the beneficial effects of the present invention:
the first embodiment is as follows:
a preparation method of an aluminum-based liquid cooling heat dissipation structure is carried out according to the following steps:
firstly, preparing a foamed aluminum structure:
adding a soldering flux, a particle reinforcing phase and a gas-forming agent into aluminum-based powder, and uniformly stirring to obtain prefabricated powder;
the mass ratio of the aluminum-based powder to the soldering flux is 1: 0.05; the mass ratio of the aluminum-based powder to the particle reinforced phase is 1: 0.05; the mass ratio of the aluminum-based powder to the gas-forming agent is 1: 0.01;
secondly, placing the prefabricated body powder into a hot-pressing sintering mold, and presintering for 30min under the conditions of protective gas atmosphere, temperature of 400 ℃ and pressure of 900MPa to obtain a presintering hot-pressing structure;
thirdly, under the conditions of protective gas atmosphere, temperature of 640 ℃ and pressure of 100MPa, carrying out hot-pressing sintering on the pre-sintered hot-pressing structure for 2 hours to obtain sintered foamed aluminum;
removing the machining allowance of the sintered foamed aluminum, and washing to obtain the mesoporous foamed aluminum;
secondly, injecting a liquid-cooled substrate:
and one end of the mesoporous foamed aluminum is contacted with the liquid level of the cooling liquid, and the cooling liquid is injected and filled through the capillary phenomenon of the mesoporous foamed aluminum, so that the aluminum-based liquid-cooled heat dissipation structure is obtained.
The grain diameter of the aluminum-based powder in the first step is 100 meshes; the aluminum-based powder in the first step is Al powder; in the first step, the soldering flux is QJ 201; the particle reinforced phase in the first step is SiC; in the first step, the gas-making agent is TiH2
The atmosphere of the protective gas in the first step and the third step is high-purity Ar gas.
The mesoporous foamed aluminum in the first step is open-cell foamed aluminum with the pore diameter of 20 mu m.
And the cooling liquid in the second step is absolute ethyl alcohol.
And in the second step, the aluminum-based liquid cooling heat dissipation structure is a hexahedral straight plate.
And the size of the aluminum-based liquid cooling heat dissipation structure in the second step is 20mm multiplied by 5 mm.
The application method of the aluminum-based liquid cooling heat dissipation structure comprises the following steps:
firstly, installation:
placing the aluminum-based liquid-cooled heat dissipation structure in a mold with an opening at one side to obtain an assembled mold, and fixing the open side of the assembled mold on a material to be dissipated, so that the aluminum-based liquid-cooled heat dissipation structure is tightly attached to the material to be dissipated for heat dissipation;
II, replacing the cooling liquid:
utilize adsorbing material and aluminium base liquid cooling heat radiation structure one end to contact for the coolant liquid adsorbs on the adsorbing material, obtains the heat radiation structure after the absorption, then contacts heat radiation structure one end after will adsorbing with the coolant liquid level, realizes the injection filling of coolant liquid through mesopore foamed aluminum capillary phenomenon.
The material of the die in the first step is aluminum alloy; the material to be radiated is an electric control chip;
and the adsorbing material in the second step is sodium polyacrylate.
If the aluminum-based liquid-cooled heat dissipation structure is not tightly attached to the material to be dissipated, bonding the aluminum-based liquid-cooled heat dissipation structure and the material to be dissipated by using an adhesive; the adhesive is silicone grease.
FIG. 1 is a scanning electron micrograph of a mesoporous aluminum foam prepared according to step one of the example; as can be seen, the pore space between the aluminum powder particles is about 20 μm, which falls into the range of mesopores.
When the anhydrous ethanol climbing experiment is carried out on the mesoporous aluminum foam prepared in the first embodiment, the average climbing speed reaches 1.6mm/s, the climbing speed can represent the replacement rate of the cooling liquid, and the high rate indicates that the liquid phase replacement rate is high and the thermal cycle efficiency is high.

Claims (10)

1. The preparation method of the aluminum-based liquid cooling heat dissipation structure is characterized by comprising the following steps of:
firstly, preparing a foamed aluminum structure:
adding a soldering flux, a particle reinforcing phase and a gas-forming agent into aluminum-based powder, and uniformly stirring to obtain prefabricated powder;
the mass ratio of the aluminum-based powder to the soldering flux is 1 (0.01-1); the mass ratio of the aluminum-based powder to the particle reinforced phase is 1 (0.01-1); the mass ratio of the aluminum-based powder to the gas-forming agent is 1 (0.01-1);
secondly, placing the prefabricated body powder into a hot-pressing sintering mold, and presintering for 5min to 10h under the conditions of protective gas atmosphere, temperature of 200 ℃ to 500 ℃ and pressure of less than 1GPa to obtain a presintering hot-pressing structure;
thirdly, under the conditions of protective gas atmosphere, temperature of 500-1500 ℃ and pressure of below 500MPa, carrying out hot-pressing sintering on the pre-sintered hot-pressed structure for 10 min-10 h to obtain sintered foamed aluminum;
removing the machining allowance of the sintered foamed aluminum, and washing to obtain the mesoporous foamed aluminum;
secondly, injecting a liquid-cooled substrate:
and one end of the mesoporous foamed aluminum is contacted with the liquid level of the cooling liquid, and the cooling liquid is injected and filled through the capillary phenomenon of the mesoporous foamed aluminum, so that the aluminum-based liquid-cooled heat dissipation structure is obtained.
2. The method for preparing an aluminum-based liquid-cooled heat dissipation structure as recited in claim 1, wherein in step one, the particle size of the aluminum-based powder is 10-1000 meshes; the aluminum-based powder in the first step is Al powder or Al-Si alloy powder; in the first step, the soldering flux is KBr or QJ 201; the particle reinforced phase in the first step is SiC or TiO2Or AlN; the gas-making agent in the first step is TiH2Or CaCO3
3. The method for preparing an aluminum-based liquid-cooled heat dissipation structure as recited in claim 1, wherein the protective gas atmosphere in the first and third steps is vacuum, air, high-purity Ar gas and Ar/H2And (4) mixing the gases.
4. The method for preparing an aluminum-based liquid-cooled heat dissipation structure as recited in claim 1, wherein the mesoporous aluminum foam in the first step (iv) is an open-cell aluminum foam having a pore diameter of 1 μm to 100 μm.
5. The method according to claim 1, wherein the coolant in the second step is water, water-based coolant, alcohol-based coolant, glycerol-based coolant, or glycol-based coolant.
6. The method according to claim 1, wherein the aluminum-based liquid-cooled heat dissipation structure in the second step is a cubic straight plate structure; and the size of the aluminum-based liquid cooling heat dissipation structure in the second step is 20mm multiplied by 5 mm.
7. Use of an aluminium based liquid cooled heat dissipating structure prepared according to claim 1, wherein the aluminium based liquid cooled heat dissipating structure is used for heat dissipation of electronic circuit systems or battery systems.
8. The application of the aluminum-based liquid-cooled heat dissipation structure as recited in claim 7, wherein the application method of the aluminum-based liquid-cooled heat dissipation structure is as follows:
firstly, installation:
placing the aluminum-based liquid-cooled heat dissipation structure in an open mold to obtain an assembled mold, and fixing the open side of the assembled mold on a material to be dissipated, so that the aluminum-based liquid-cooled heat dissipation structure is tightly attached to the material to be dissipated for heat dissipation;
II, replacing the cooling liquid:
utilize adsorbing material and aluminium base liquid cooling heat radiation structure one end to contact for the coolant liquid adsorbs on the adsorbing material, obtains the heat radiation structure after the absorption, then contacts heat radiation structure one end after will adsorbing with the coolant liquid level, realizes the injection filling of coolant liquid through mesopore foamed aluminum capillary phenomenon.
9. The use of the aluminum-based liquid-cooled heat dissipation structure as recited in claim 8, wherein the mold in the first step is made of aluminum alloy.
10. The application of the aluminum-based liquid-cooled heat dissipation structure as recited in claim 8, wherein the adsorbing material in the second step is silica gel or polymer water-absorbent resin.
CN202110721502.3A 2021-06-28 2021-06-28 Preparation method and application of aluminum-based liquid cooling heat dissipation structure Active CN113423244B (en)

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