CN113419403A - Aqueous photosensitive resin and photoresist dry film thereof - Google Patents
Aqueous photosensitive resin and photoresist dry film thereof Download PDFInfo
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- CN113419403A CN113419403A CN202110712446.7A CN202110712446A CN113419403A CN 113419403 A CN113419403 A CN 113419403A CN 202110712446 A CN202110712446 A CN 202110712446A CN 113419403 A CN113419403 A CN 113419403A
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F220/00—Copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical or a salt, anhydride ester, amide, imide or nitrile thereof
- C08F220/02—Monocarboxylic acids having less than ten carbon atoms; Derivatives thereof
- C08F220/10—Esters
- C08F220/12—Esters of monohydric alcohols or phenols
- C08F220/16—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms
- C08F220/18—Esters of monohydric alcohols or phenols of phenols or of alcohols containing two or more carbon atoms with acrylic or methacrylic acids
- C08F220/1802—C2-(meth)acrylate, e.g. ethyl (meth)acrylate
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/027—Non-macromolecular photopolymerisable compounds having carbon-to-carbon double bonds, e.g. ethylenic compounds
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- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Materials For Photolithography (AREA)
Abstract
The invention discloses a water-soluble acrylate photosensitive resin and a photoresist dry film thereof, wherein the photoresist dry film mainly comprises raw materials such as (1) water-soluble acrylic resin, (2) a photopolymerization compound, (3) a photoinitiator and (4) other additives. It can be used as photoresist coating for dry film photoresist, and can be finally used for producing electronic components of printed circuit board, etc. Wherein the water-soluble acrylic ester is synthesized by 2-ethyl acrylic acid, ethyl methacrylate, propyl methacrylate, butyl acrylate methyl, sec-butyl acrylate, isooctyl acrylate and the like according to a certain proportion. The photoresist dry film has excellent resolution, adhesive force performance and line size stability, and has wide application prospect in printed circuits and other electronic components.
Description
Technical Field
The present invention relates to a photosensitive resin composition and a dry film photoresist using the same, and more particularly, to a compound of a photosensitive resin having excellent resolution and water solubility and a dry film photoresist using the same.
Background
With the rapid development of science and technology and the popularization of environmental protection knowledge, the environmental protection consciousness of people is greatly enhanced. A large amount of organic solvents containing halogen exist in the production and use processes of the solvent type photoresist dry film, and organic matters are easy to continuously volatilize in the production and use processes of the organic solvents, so that the problem of VOCs emission is caused; meanwhile, the organic solvent cannot be automatically decomposed or reacted in the preparation and stripping processes of the dry film, and finally becomes liquid waste, so that the problem of waste water discharge is caused; finally, developed countries such as europe, america and japan strongly advocate halogen-free, and a large amount of halogen in organic solvents would greatly reduce the environmental grade of the product, which would prevent domestic dry photoresist films from entering the market for high-end products. Based on the above problems of the solvent-based dry photoresist film, the development of a new environment-friendly dry photoresist film is urgent.
Based on the above, the present invention provides a water-soluble dry film photoresist. The water-soluble photoresist dry film has the characteristics of full water solubility, convenient operation and extremely low harm to the external environment and workers; meanwhile, the water-soluble photoresist dry film can well overcome the problems of VOCs discharge and sewage discharge; in addition, the water-soluble photoresist dry film does not contain halogen or has extremely low halogen content, thereby being beneficial to the high-end of products; the water-soluble acrylic ester has the advantages of rich raw material sources, low production cost, simple operation equipment, easy performance adjustment and the like. The advantages are beneficial to breaking the western technical barriers of the domestic dry film products and realizing the high-end production of the domestic dry film.
Disclosure of Invention
The invention provides a water-soluble photoresist dry film, and the 005 is characterized in that water-soluble acrylic resin which is self-made in a laboratory is taken as film-forming resin, and a plurality of acrylate, photoinitiator and other various additives are added according to a certain proportion to prepare the water-soluble acrylate photoresist dry film. The photoresist dry film product has the advantages of high resolution, easy development, less scum and the like, effectively develops the research range of the water-based photoresist dry film, and lays a certain foundation for realizing the mass production of the water-soluble acrylate photoresist dry film.
Detailed description of the preferred embodiments
Detailed description of the preferred embodiment 1
Synthesis of water-soluble acrylic resin
In the present invention, the water-soluble acrylic resin is prepared by a laboratory.
The method comprises the steps of dissolving 2-ethyl acrylic acid, ethyl methacrylate, propyl methacrylate and sec-butyl methacrylate in a certain amount of acetone according to the molar ratio of 1:1.05:1: 1.10.
And heating the mixture to a reflux temperature, and then dropwise adding a 2, 2' -azobis (isobutyronitrile) acetone solution with a corresponding mass fraction.
The molar ratio of 2, 2' -azobis (isobutyronitrile) to 2-ethacrylic acid described above was 1.05: 1.
And after the dropwise addition of the 2, 2' -azobis (isobutyronitrile) acetone solution is finished, carrying out reflux reaction for 5.5 hours.
Additional amounts of other initiators were then added.
The quantitative initiator is benzoyl peroxide.
The molar ratio of the quantitative benzoyl peroxide to the 2-ethyl acrylic acid is as follows: 0.35:1.
And after the benzoyl peroxide is dripped, continuing to react for 2 hours, and cooling to obtain the acrylic resin solution.
Preparation of dry film photoresist
The invention sequentially adds raw materials such as (1) acrylic resin, (2) a photopolymerization compound, (3) a photoinitiator and (4) other auxiliary agents according to a certain mass ratio.
The photoresist dry film comprises the following raw materials in percentage by mass: acrylic resin solution (55%), photopolymerizable compound (30%), (3) photoinitiator (1.5%) and other auxiliaries (13.5%).
The photopolymerization compound is any one or a combination of two or three of polyethylene glycol dimethacrylate, ethoxylated bisphenol A diacrylate and polyalkylene glycol di (meth) acrylate.
In this case, a combination of polyethylene glycol dimethacrylate and ethoxylated bisphenol A diacrylate was used in a 1:1 molar ratio.
The photoinitiator may be hexaarylbisimidazole compound and multifunctional thiol compound.
The hexaarylbisimidazoles of the invention may be 2- (o-chlorophenyl) -4, 5-diphenylimidazole dimer, 2-bis (2, 6-dichlorophenyl) -4, 5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4, 5-diphenylimidazole dimer and 2, 4, 5-triarylimidazole dimer, 2 ' -bis (o-bromophenyl) -4, 4 ', 5, 5 ' -tetrakis (p-iodophenyl) bisimidazole. Among them, 2-bis (2, 6-dichlorophenyl) -4, 5-diphenylimidazole dimer is preferable.
The polyfunctional thiol compound in the present invention may include: 1, 4-dimethylmercaptobenzene, trimethylolpropane trithiopropionate, pentaerythritol tetrathioglycolate, butanediol dithiopropionate, decanedithiol and pentaerythritol tetrathiopropionate. The invention preferably employs butanediol dithiopropionate.
In this case, the photoinitiator is a hexaarylbisimidazole compound and a multifunctional thiol compound in a molar ratio of 2: 1.
Other adjuvants in the present invention include diluents, and may also contain plasticizers, or leuco dyes or coloring substances, antioxidants, thermal polymerization inhibitors, defoamers, and flame retardants.
The above diluents may be alcohols such as: methanol, ethanol, propanol, ethylene glycol, cyclohexanol; may be ketones, such as: acetone, butanone, methyl isobutyl ketone; glycol ethers, such as: ethylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether. Benzenes, such as: benzene, toluene, xylene. Acetone, butanone and toluene are preferred.
The plasticizer in the invention can be: diheptyl phthalate, diallyl phthalate; triethylene glycol diacetate, benzenesulfonamide, n-butylbenzenesulfonamide, triphenyl phosphate. Triethylene glycol diacetate is preferred in the present invention.
Leuco dyes in the present invention refer to fluorane dyes; the coloring substance may be fuchsin, phthalocyanine green, auramine, parafuchsin (Paramagenta), crystal violet, methyl orange, victoria blue, malachite green, and diamond green. Victoria blue and diamond green are preferred in the present invention.
In the case, acetone is selected as a solvent, and after stirring for 1.5 hours, a 2 mu m microporous filter membrane is used for suction filtration to obtain a green solution.
The green solution was coated on a polyethylene terephthalate film using a coater.
And (3) placing the coated polyethylene terephthalate film in an oven at 80 ℃ and baking for 6 min. [032] And measuring the thickness of the photoresist dry film coating to be about 31 +/-2 mu m by using a film thickness gauge.
Dry film performance test of photoresist
In the invention, before the film is pasted on the copper-clad plate, the copper-clad plate needs to be pretreated by a plate grinding machine so as to ensure that the copper-clad plate is clean and flat.
After the copper-clad plate is processed, an automatic film sticking machine is adopted for sticking the film, the temperature is 110 ℃, and the film sticking speed is 1.5 m/s.
The UV light curing machine is adopted for processing, the lamp source is a 5 kW high-pressure mercury lamp, and the wavelength is 365 nm.
1.5% sodium carbonate solution is used as developing solution, the developing temperature is 32 ℃, and the pressure is 2.5 kg/cm2. The development time was 45S. Wherein unexposed acrylic esters and acrylic resin react with the weak alkaline sodium carbonate solution to generate substances which are easy to dissolve in water.
The solidified film layer is treated by using 4 to 6 percent potassium hydroxide solution to saponify and dissolve the film layer, and then the film is removed.
The demoulding temperature is 45-55 ℃, and the demoulding pressure is 2.0-2.5 kg/cm2. The stripping process involves an acid-base reaction and a saponification reaction.
Experiments on the Dry film-related Properties of photoresists
Adhesion test
The adhesion test used an RP-4 test pattern (L/S = n/400).
Hardness test
The hardness test is carried out according to GB/T1730-1993, and a coating swing rod is measured by a swing rod hardness tester.
Resolution evaluation
At an exposure intensity of 10mJ/cm2The photosensitive dry film laminated by the above method was subjected to laser exposure for patterning, followed by developing the dry film, and the minimum size of the remaining adhesion/resolution (line and space) pattern was evaluated. Resolution evaluation (line and space) was performed using test patterns provided by aobao technologies.
The resolution levels are classified into three levels of "A", "B", and "C", wherein the "A" level standard is an evaluation capable of reproducing thin lines smaller than 50 μm, the "B" level standard is an evaluation capable of reproducing thin lines between 50 μm and 100 μm, and the "C" level standard represents an evaluation incapable of reproducing thin lines of 100 μm or more.
In the above-described resolution evaluation, a criterion capable of reproducing a thin line is that no waveform and no deflection occur in a line and a space after development.
The final dry film is named as 1 by adopting the preparation method and the process of the case#And (3) drying the film.
1 above#The dry film has resolution rating of "A", adhesion of 20 μm, hardness of 0.125, and good dimensional stability of circuit.
Detailed description of the preferred embodiment 2
Synthesis of water-soluble acrylic resin
In the present invention, the water-soluble acrylic resin is prepared by a laboratory.
The invention dissolves 2-ethyl acrylic acid, ethyl methacrylate, propyl methacrylate and butyl acrylate in a certain amount of butanone according to the molar ratio of 1:1.05:1: 1.10.
And heating the mixture to a reflux temperature, and dropwise adding azodiisoheptonitrile butanone solution with the corresponding mass fraction.
The molar ratio of the azobisisoheptonitrile to 2-ethacrylic acid is 1.05: 1.
After the dropwise addition of the azodiisoheptanonitrile butanone solution, the reflux reaction is carried out for 5 hours.
Additional amounts of other initiators were then added.
The quantitative initiator is cumene hydroperoxide.
The molar ratio of the quantitative cumene hydroperoxide to the 2-ethyl acrylic acid is as follows: 0.40:1.
After the cumene hydroperoxide is dripped, the reaction is continued for 2 hours, and the acrylic resin solution is obtained after cooling.
Preparation of dry film photoresist
The invention sequentially adds raw materials such as (1) acrylic resin, (2) a photopolymerization compound, (3) a photoinitiator and (4) other auxiliary agents according to a certain mass ratio.
The photoresist dry film comprises the following raw materials in percentage by mass: acrylic resin (60%), photopolymerizable compound (28.5%), (3) photoinitiator (1.5%), and other auxiliaries (10%).
The photopolymerization compound is any one or a combination of two or three of polyethylene glycol dimethacrylate, ethoxylated bisphenol A diacrylate and polyalkylene glycol di (meth) acrylate.
In this case, a combination of polyethylene glycol dimethacrylate and polyalkylene glycol di (meth) acrylate was used in a molar ratio of 1:1.
The photoinitiator may be hexaarylbisimidazole compound and multifunctional thiol compound.
The hexaarylbisimidazoles of the invention may be 2- (o-chlorophenyl) -4, 5-diphenylimidazole dimer, 2-bis (2, 6-dichlorophenyl) -4, 5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4, 5-diphenylimidazole dimer and 2, 4, 5-triarylimidazole dimer, 2 ' -bis (o-bromophenyl) -4, 4 ', 5, 5 ' -tetrakis (p-iodophenyl) bisimidazole. Among them, 2-bis (2, 6-dichlorophenyl) -4, 5-diphenylimidazole dimer is preferable.
The polyfunctional thiol compound in the present invention may include: 1, 4-dimethylmercaptobenzene, trimethylolpropane trithiopropionate, pentaerythritol tetrathioglycolate, butanediol dithiopropionate, decanedithiol and pentaerythritol tetrathiopropionate. Butanediol dithiopropionate is preferably used.
In this case, the photoinitiator is a hexaarylbisimidazole compound and a polyfunctional thiol compound, and the molar ratio of the hexaarylbisimidazole compound to the polyfunctional thiol compound is 2: 1.
Other adjuvants in the present invention include diluents, and may also contain plasticizers, or leuco dyes or coloring substances, antioxidants, thermal polymerization inhibitors, defoamers, and flame retardants.
The above diluents may be alcohols such as: methanol, ethanol, propanol, ethylene glycol, cyclohexanol; may be ketones, such as: acetone, butanone, methyl isobutyl ketone; glycol ethers, such as: ethylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether. Benzenes, such as: benzene, toluene, xylene. Acetone, butanone and toluene are preferred.
The plasticizer in the invention can be: diheptyl phthalate, diallyl phthalate; triethylene glycol diacetate, benzenesulfonamide, n-butylbenzenesulfonamide, triphenyl phosphate. Triethylene glycol diacetate is preferred in the present invention.
Leuco dyes in the present invention refer to fluorane dyes; the coloring substance may be fuchsin, phthalocyanine green, auramine, parafuchsin (Paramagenta), crystal violet, methyl orange, victoria blue, malachite green, and diamond green.
Butanone is selected as a solvent in the case, and after stirring for 1.5 hours, a 2 mu m microporous filter membrane is utilized for suction filtration to obtain a green solution.
The green solution was coated on a polyethylene terephthalate film using a coater.
And (3) placing the coated polyethylene terephthalate film in an oven at 80 ℃ and baking for 6 min. [077] And measuring the thickness of the dry film coating of the photoresist to be about 30 +/-3 mu m by using a film thickness gauge.
Dry film performance test of photoresist
In the invention, before the film is pasted on the copper-clad plate, the copper-clad plate needs to be pretreated by a plate grinding machine so as to ensure that the copper-clad plate is clean and flat.
After the copper-clad plate is processed, an automatic film sticking machine is adopted for sticking the film, the temperature is 120 ℃, and the film sticking speed is 1.5 m/s.
The UV light curing machine is adopted for processing, the lamp source is a 5 kW high-pressure mercury lamp, and the wavelength is 365 nm.
1.5% sodium carbonate solution is used as developing solution, the developing temperature is 32 ℃, and the pressure is 2.5 kg/cm2. The development time was 45S. Wherein unexposed acrylic esters and acrylic resin react with the weak alkaline sodium carbonate solution to generate substances which are easy to dissolve in water.
And (3) treating the solidified membrane layer by using a 4-6% sodium hydroxide solution to saponify and dissolve the membrane layer, and demoulding.
The demoulding temperature is 45-55 ℃, and the demoulding pressure is 2.0-2.5 kg/cm2. The stripping process involves acid-base reaction and saponification reactionShould be used.
The final dry film is named as 2 by adopting the preparation method and the process of the case#And (3) drying the film.
Above 2#The dry film has resolution rating of "A", adhesion of 20 μm, hardness of 0.136, and good dimensional stability of circuit.
Detailed description of the preferred embodiment 3
Synthesis of water-soluble acrylic resin
In the present invention, the water-soluble acrylic resin is prepared by a laboratory.
The invention dissolves 2-ethyl acrylic acid, ethyl methacrylate, propyl methacrylate and isooctyl acrylate in a certain amount of butanone according to the molar ratio of 1:1.05:1: 1.10.
And heating the mixture to a reflux temperature, and then dropwise adding a 2, 2' -azobis (isobutyronitrile) acetone solution with a corresponding mass fraction.
The molar ratio of 2, 2' -azobis (isobutyronitrile) to 2-ethacrylic acid described above was 1.05: 1.
And after the dropwise addition of the 2, 2' -azobis (isobutyronitrile) butanone solution is finished, carrying out reflux reaction for 5 hours.
Additional amounts of other initiators were then added.
The quantitative initiator is tert-butyl hydroperoxide.
The molar ratio of the above-mentioned quantitative tert-butyl hydroperoxide to 2-ethylacrylic acid is: 0.4:1.
And (3) continuously reacting for 2 h after the tert-butyl hydroperoxide is dripped, and cooling to obtain the acrylic resin solution.
Preparation of dry film photoresist
The invention adds acrylic resin solution, (2) photopolymerization compound, (3) photoinitiator and (4) other auxiliary agent in turn according to a certain mass ratio.
The photoresist dry film comprises the following raw materials in percentage by mass: acrylic resin solution (65%), photopolymerizable compound (25%), (3) photoinitiator (1.5%), and other auxiliaries (8.5%).
The photopolymerization compound is any one or a combination of two or three of polyethylene glycol dimethacrylate, ethoxylated bisphenol A diacrylate and polyalkylene glycol di (meth) acrylate.
In this case, a combination of ethoxylated bisphenol A diacrylate and polyalkylene glycol di (meth) acrylate was used in a 1:1 molar ratio.
The photoinitiator may be hexaarylbisimidazole compound and multifunctional thiol compound.
The hexaarylbisimidazoles of the invention may be 2- (o-chlorophenyl) -4, 5-diphenylimidazole dimer, 2-bis (2, 6-dichlorophenyl) -4, 5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4, 5-diphenylimidazole dimer and 2, 4, 5-triarylimidazole dimer, 2 ' -bis (o-bromophenyl) -4, 4 ', 5, 5 ' -tetrakis (p-iodophenyl) bisimidazole. Among them, 2-bis (2, 6-dichlorophenyl) -4, 5-diphenylimidazole dimer is preferable.
The polyfunctional thiol compound in the present invention may include: 1, 4-dimethylmercaptobenzene, trimethylolpropane trithiopropionate, pentaerythritol tetrathioglycolate, butanediol dithiopropionate, decanedithiol and pentaerythritol tetrathiopropionate. Butanediol dithiopropionate is preferably used.
In this case, the photoinitiator is a hexaarylbisimidazole compound and a polyfunctional thiol compound, and the molar ratio of the hexaarylbisimidazole compound to the polyfunctional thiol compound is 2: 1.
Other adjuvants in the present invention include diluents, and may also contain plasticizers, or leuco dyes or coloring substances, antioxidants, thermal polymerization inhibitors, defoamers, and flame retardants.
The above diluents may be alcohols such as: methanol, ethanol, propanol, ethylene glycol, cyclohexanol; may be ketones, such as: acetone, butanone, methyl isobutyl ketone; glycol ethers, such as: ethylene glycol monomethyl ether, propylene glycol monoethyl ether, diethylene glycol dimethyl ether. Benzenes, such as: benzene, toluene, xylene. Acetone, butanone and toluene are preferred.
The plasticizer in the invention can be: diheptyl phthalate, diallyl phthalate; triethylene glycol diacetate, benzenesulfonamide, n-butylbenzenesulfonamide, triphenyl phosphate. Triethylene glycol diacetate is preferred in the present invention.
Leuco dyes in the present invention refer to fluorane dyes; the coloring substance may be fuchsin, phthalocyanine green, auramine, parafuchsin (Paramagenta), crystal violet, methyl orange, victoria blue, malachite green, and diamond green.
In the case, acetone is selected as a solvent, and after stirring for 1.5 hours, a 2 mu m microporous filter membrane is used for suction filtration to obtain a green solution.
The green solution was coated on a polyethylene terephthalate film using a coater.
And (3) placing the coated polyethylene terephthalate film in a 90 ℃ oven, and baking for 5 min. [077] And measuring the thickness of the photoresist dry film coating to be about 32 +/-3 mu m by using a film thickness gauge.
Dry film performance test of photoresist
In the invention, before the film is pasted on the copper-clad plate, the copper-clad plate needs to be pretreated by a plate grinding machine so as to ensure that the copper-clad plate is clean and flat.
After the copper-clad plate is processed, an automatic film sticking machine is adopted for sticking the film, the temperature is 100 ℃, and the film sticking speed is 2.5 m/s.
The UV light curing machine is adopted for processing, the lamp source is a 5 kW high-pressure mercury lamp, and the wavelength is 365 nm.
1.5% sodium carbonate solution is used as developing solution, the developing temperature is 32 ℃, and the pressure is 2.5 kg/cm2. The development time was 45S. Wherein unexposed acrylic esters and acrylic resin react with the weak alkaline sodium carbonate solution to generate substances which are easy to dissolve in water.
And (3) treating the solidified membrane layer by using a 4-6% sodium hydroxide solution to saponify and dissolve the membrane layer, and demoulding.
The demoulding temperature is 45-55 ℃, and the demoulding pressure is 2.0-2.5 kg/cm2. The stripping process involves an acid-base reaction and a saponification reaction.
The final dry film is named as 3 by adopting the preparation method and the process of the case#And (3) drying the film.
Above 3#The dry film has a resolution rating of "A", an adhesion of 25 μm, a hardness of 0.145, and good dimensional stability of wiring.
Claims (7)
1. A dry film photoresist composition comprising a water soluble acrylate resin consisting essentially of: water-soluble acrylic resin, a photopolymerization compound, a photoinitiator and other auxiliary agents.
2. The water-soluble acrylate resin photoresist dry film composition according to claim 1, characterized in that the (1) water-soluble acrylic acid is obtained by polymerization or copolymerization of the following monomers, including: 2-ethyl acrylic acid, ethyl methacrylate, propyl methacrylate, butyl acrylate, sec-butyl methacrylate, isooctyl acrylate, and the like.
3. The water-soluble acrylate resin photoresist dry film composition according to claim 1, characterized in that (2) the photopolymerizable compound is any one or a combination of two or three of polyethylene glycol dimethacrylate, ethoxylated bisphenol a diacrylate and polyalkylene glycol di (meth) acrylate.
4. The composition for a dry film photoresist of a water-soluble acrylate resin according to claim 1 characterized in that (3) the photoinitiator is a hexaarylbisimidazole based compound and a multifunctional thiol compound, wherein the molar ratio of the hexaarylbisimidazole based compound to the multifunctional thiol compound is 2: 1.
5. The water-soluble acrylate resin photoresist dry film composition according to claim 4, characterized in that (3) the hexaarylbisimidazole-containing compound in the photoinitiator may be 2- (o-chlorophenyl) -4, 5-diphenylimidazole dimer, 2-bis (2, 6-dichlorophenyl) -4, 5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4, 5-diphenylimidazole dimer and 2, 4, 5-triarylimidazole dimer, 2 ' -bis (o-bromophenyl) -4, 4 ', 5, 5 ' -tetrakis (p-iodophenyl) diimidazole;
the polyfunctional thiol compound contains: 1, 4-dimethylmercaptobenzene, trimethylolpropane trithiopropionate, pentaerythritol tetrathioglycolate, butanediol dithiopropionate, decanedithiol and pentaerythritol tetrathiopropionate.
6. The water-soluble acrylate resin photoresist dry film composition according to claim 1, characterized in that (4) other auxiliary agents include a diluent, and also a plasticizer, and further a leuco dye or coloring matter, an antioxidant, a thermal polymerization inhibitor, a defoaming agent, a flame retardant, and the like may be added.
7. The water soluble acrylate resin photoresist dry film of claim 1 for laser scanning exposure.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113741147A (en) * | 2021-09-22 | 2021-12-03 | 深圳惠美亚科技有限公司 | Photoresist with high resolution and excellent adhesion |
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| CN1301993A (en) * | 1999-12-30 | 2001-07-04 | 奇美实业股份有限公司 | Photosensitive resin composition |
| CN1878798A (en) * | 2003-11-12 | 2006-12-13 | 昭和电工株式会社 | Curable polymer compound |
| US20050258406A1 (en) * | 2004-05-13 | 2005-11-24 | Showa Denko K.K. | Black resist composition for color filter |
| CN106604912A (en) * | 2014-08-29 | 2017-04-26 | 巴斯夫欧洲公司 | Oxime sulfonate derivatives |
| CN111752100A (en) * | 2019-03-29 | 2020-10-09 | 常州强力电子新材料股份有限公司 | Photosensitive resin composition containing bisimidazole photoinitiator, application thereof, color filter and image display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113741147A (en) * | 2021-09-22 | 2021-12-03 | 深圳惠美亚科技有限公司 | Photoresist with high resolution and excellent adhesion |
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