CN113418952A - Thermal stress testing method for thermal vacuum test - Google Patents
Thermal stress testing method for thermal vacuum test Download PDFInfo
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- CN113418952A CN113418952A CN202110760206.4A CN202110760206A CN113418952A CN 113418952 A CN113418952 A CN 113418952A CN 202110760206 A CN202110760206 A CN 202110760206A CN 113418952 A CN113418952 A CN 113418952A
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- 238000012360 testing method Methods 0.000 title claims abstract description 143
- 230000008646 thermal stress Effects 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000009662 stress testing Methods 0.000 title claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 8
- 230000008602 contraction Effects 0.000 claims description 4
- 238000012545 processing Methods 0.000 claims description 4
- 238000012986 modification Methods 0.000 description 4
- 230000004048 modification Effects 0.000 description 4
- 229910000838 Al alloy Inorganic materials 0.000 description 3
- 238000010998 test method Methods 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 230000006978 adaptation Effects 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 238000004458 analytical method Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N25/00—Investigating or analyzing materials by the use of thermal means
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
- G01L5/00—Apparatus for, or methods of, measuring force, work, mechanical power, or torque, specially adapted for specific purposes
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- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
The application provides a thermal stress testing method for a thermal vacuum test, which comprises the following steps: step 1: a strain gauge and a thermocouple are stuck at the position of a measured point of a measured piece, the strain gauge measures a strain value of the measured point, and the thermocouple measures the instant temperature of the measured point; step 2: selecting a test piece made of the same material as the tested piece, adhering a strain gauge and a thermocouple to the test piece, measuring the strain value of the test piece by the strain gauge, and measuring the instant temperature of the test piece by the thermocouple; and step 3: placing the tested piece and the test piece in a vacuum tank to keep the temperature of the test piece consistent with that of the tested piece; and 4, step 4: connecting a strain gauge and a thermocouple cable, wherein a measured point lead of a measured piece is connected with a test piece measured point lead for compensation in a collinear way; and 5: during the thermal vacuum test, observing the change condition of the test temperature, ensuring that the temperature of the test piece is consistent with the temperature of the tested piece, and recording the strain value and the corresponding temperature value of each working condition in real time; step 6: and calculating thermal stress data of the measured point of the measured piece under different temperature conditions according to the strain test data.
Description
Technical Field
The invention relates to the technical field of satellite structure stress testing, in particular to a thermal stress testing method for a thermal vacuum test.
Background
In satellite engineering, antenna products suitable for extremely low-temperature and high-temperature environments need to be developed. According to the analysis of thermal environment influence, the antenna is subjected to an extremely low temperature environment during the orbit, and due to the extremely large temperature change, the thermal stress caused by the thermal deformation difference among different material parts becomes very severe. During the ground test, on one hand, the structural thermal stress of the product under different temperature conditions is analyzed and calculated through simulation; in addition, in order to accurately evaluate and determine whether the product structure meets the on-orbit application requirement under the extreme temperature condition, a test is required to be carried out, and the thermal stress influence degree of the product is accurately evaluated.
Through investigation, various structural stress testing technologies under normal temperature environment are mature. The conventional test method mostly adopts a mode of directly sticking a strain gauge on a tested product, and can accurately measure the thermal stress of the product caused by external force. The test method for the thermal stress in the extreme temperature environment is less. In part of testing methods, the strain gauge which is directly suspended is adopted for compensation, the testing error of the strain gauge caused by the temperature change can be compensated, but the deformation of the product caused by normal expansion with heat and contraction with cold cannot be eliminated, and the stress testing result has larger error.
Disclosure of Invention
In order to overcome the defects in the prior art, the application provides a thermal stress testing method for a thermal vacuum test, which comprises the following steps:
step 1: a strain gauge and a thermocouple are stuck at the position of a measured point of a measured piece, the strain gauge measures a strain value of the measured point, and the thermocouple measures the instant temperature of the measured point;
step 2: selecting a test piece made of the same material as the tested piece, adhering a strain gauge and a thermocouple to the test piece, measuring the strain value of the test piece by the strain gauge, and measuring the instant temperature of the test piece by the thermocouple;
and step 3: the tested piece and the test piece are placed in a vacuum tank, and the test piece is placed near a measuring point of the tested piece, so that the temperature of the test piece is consistent with that of the tested piece;
and 4, step 4: connecting a strain gauge and a thermocouple cable, wherein a test point lead of the tested piece is connected with a test piece test point lead for compensation in a collinear manner, and test data of the test piece is compensated for test data of the test point of the tested piece;
and 5: during the thermal vacuum test, observing the change condition of the test temperature, ensuring that the temperature of the test piece is consistent with the temperature of the tested piece, and recording the strain value and the corresponding temperature value of each working condition in real time;
step 6: and (4) data processing, namely calculating thermal stress data of the tested point of the tested piece under different temperature conditions according to the strain test data.
In one possible implementation manner, the step 3 includes: the tested piece is fixed according to the real constraint state of the product, and the test piece is kept in a free placement state.
In one possible implementation, the step 5 includes: the difference between the temperature of the test piece and the temperature of the tested piece is not more than 10 ℃.
In one possible implementation, the working temperature of the strain gauge and the thermocouple can meet the requirement of the extreme temperature environment of the thermal vacuum test.
In one possible implementation mode, the measured member measuring points correspond to the test piece measuring points one by one, and the number of the test piece measuring points with the same number is selected according to the number of the measured member measuring points.
In one possible implementation manner, the test strip is placed near the tested piece, and the test strip is fixed in a manner that the free expansion and contraction of the test strip are not affected.
Due to the application of the technical scheme, compared with the prior art, the invention has the following beneficial effects: when a product is subjected to a thermal vacuum test, a test piece made of the same material is placed at a measured point, and under the condition of ensuring that the test temperature is consistent, the strain of the measured point is compensated through the strain of the test piece, so that the purpose of measuring the thermal stress caused by thermal deformation of the measured point is achieved. By the testing method, the size of the thermal stress of the product caused by thermal deformation in different temperature environments can be accurately measured.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Embodiments of the invention are further described below with reference to the accompanying drawings:
drawings
Embodiments of the invention are further described below with reference to the accompanying drawings:
FIG. 1 is a flow chart of a thermal stress testing method of a thermal vacuum test according to the present invention;
FIG. 2 shows a thermal stress test condition of a thermal vacuum test product according to the present invention;
fig. 3 is a real-time strain gauge curve during a thermal vacuum test of a strain gauge according to an exemplary embodiment of the present invention.
Reference numerals:
1-measured piece measuring point, 2-test piece, 3-measured piece strain gauge, 4-test piece strain gauge, 5-measured point thermocouple and 6-test piece thermocouple.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that it would be obvious to those skilled in the art that various changes and modifications can be made without departing from the spirit of the invention. All falling within the scope of the present invention.
The present invention is further described in detail below with reference to fig. 1 to 3.
Fig. 1 is a flowchart of a thermal stress testing method for a thermal vacuum test according to an embodiment of the present invention. The method provided by the application mainly comprises the following steps:
s1: a strain gauge and a thermocouple are stuck at the position of a measured point of a measured piece, the strain gauge measures a strain value of the measured point, and the thermocouple measures the instant temperature of the measured point;
s2: selecting a test piece made of the same material as the tested piece, adhering a strain gauge and a thermocouple to the test piece, measuring the strain value of the test piece by the strain gauge, and measuring the instant temperature of the test piece by the thermocouple;
s3: the tested piece and the test piece are placed in a vacuum tank, and the test piece is placed near a measuring point of the tested piece, so that the temperature of the test piece is consistent with that of the tested piece;
s4: connecting a strain gauge and a thermocouple cable, wherein a test point lead of the tested piece is connected with a test piece test point lead for compensation in a collinear manner, and test data of the test piece is compensated for test data of the test point of the tested piece;
s5: during the thermal vacuum test, observing the change condition of the test temperature, ensuring that the temperature of the test piece is consistent with the temperature of the tested piece, and recording the strain value and the corresponding temperature value of each working condition in real time;
s6: and (4) data processing, namely calculating thermal stress data of the tested point of the tested piece under different temperature conditions according to the strain test data.
FIG. 2 is a diagram illustrating a specific thermal stress test state of a product according to an embodiment of the present invention. The figure shows the real constraint state of a test product, wherein the material of a measured point 1 of a measured piece is aluminum alloy and is constrained and fixed by 4 carbon fiber material supporting rods uniformly distributed around the measured point. The test piece 2 is made of the same aluminum alloy material, is placed near the measured point 1 of the measured piece and is wound and fixed on the measured piece by using a 3M transparent adhesive tape, the test piece 2 is in direct contact with the measured piece, and the temperature can be kept at the same level during a thermal vacuum test.
As shown in the figure, three test piece strain gauges 3 and 4 are bonded around a test piece measuring point, a thermocouple 5 is bonded around the test piece measuring point, and a thermocouple 6 is bonded to the test piece.
In one embodiment, prior to the thermal vacuum test, the product test piece and the strain gage and thermocouple on the test piece are first inspected to ensure proper operation. Then the product and the test piece are placed in a vacuum tank, the test piece is placed near a measuring point of a measured piece of the product, the measured piece is fixed according to the real constraint state of the product, and the test piece is kept in a free placement state.
Preferably, the fixing manner of the test piece should not affect the free expansion and contraction of the test piece in principle, so as to ensure that the error of the test result due to the fixing reason is not caused.
Preferably, the gauge type with the working temperature capable of meeting the requirement of the extreme temperature environment of the thermal vacuum test is selected for the strain gauge and the thermocouple.
In one embodiment, the strain gauge is connected to the thermocouple wire after the product and test strip are placed. The lead of the measuring point of the tested piece is connected with the lead of the measuring point of the test piece for compensation in a collinear way, and the test piece test data is used for compensating the test data of the measuring point of the tested piece. During the thermal vacuum test, the change condition of the test temperature is observed, the temperature of the test piece is ensured to be consistent with the temperature of the tested piece, and the general difference is not more than 10 ℃. And recording the strain value and the corresponding temperature value of each working condition in the test process.
Preferably, the measured points of the tested piece correspond to the measured points of the test piece one by one. And selecting the same number of test piece measuring points according to the number of the measured test piece measuring points.
In one embodiment, data processing is performed after the thermal vacuum test is completed. And calculating thermal stress data of the tested point of the product under different temperature conditions according to the test data of the strain gauge. FIG. 3 shows a real-time test curve of the strain gauge at a certain path of the tested piece during the thermal vacuum test. According to the result of the test curve data, the maximum micro strain 1735.93 is obtained, the corresponding extreme low temperature is-145 ℃, and the maximum stress reaches 124.9MPa when the tested product is at the extreme low temperature according to the calculation of the elastic modulus of the aluminum alloy. In accordance with design expectations.
The inventive concept is explained in detail herein using specific examples, which are given only to aid in understanding the core concepts of the invention. It should be understood that any obvious modifications, equivalents and other improvements made by those skilled in the art without departing from the spirit of the present invention are included in the scope of the present invention.
Other embodiments of the present application will be apparent to those skilled in the art from consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of the invention following, in general, the principles of the application and including such departures from the present disclosure as come within known or customary practice within the art to which the invention pertains. It is intended that the specification and examples be considered as exemplary only, with a true scope and spirit of the application being indicated by the following claims.
It will be understood that the present application is not limited to the precise arrangements described above and shown in the drawings and that various modifications and changes may be made without departing from the scope thereof. The scope of the application is limited only by the appended claims.
It should be understood that reference to "a plurality" herein means two or more. "and/or" describes the association relationship of the associated objects, meaning that there may be three relationships, e.g., a and/or B, which may mean: a exists alone, A and B exist simultaneously, and B exists alone. The character "/" generally indicates that the former and latter associated objects are in an "or" relationship.
It will be understood by those skilled in the art that all or part of the steps for implementing the above embodiments may be implemented by hardware, or may be implemented by a program instructing relevant hardware, where the program may be stored in a computer-readable storage medium, and the above-mentioned storage medium may be a read-only memory, a magnetic disk or an optical disk, etc.
The above description is only exemplary of the present application and should not be taken as limiting the present application, as any modification, equivalent replacement, or improvement made within the spirit and principle of the present application should be included in the protection scope of the present application.
Claims (6)
1. A thermal stress testing method for a thermal vacuum test is characterized by comprising the following steps:
step 1: a strain gauge and a thermocouple are stuck at the position of a measured point of a measured piece, the strain gauge measures a strain value of the measured point, and the thermocouple measures the instant temperature of the measured point;
step 2: selecting a test piece made of the same material as the tested piece, adhering a strain gauge and a thermocouple to the test piece, measuring the strain value of the test piece by the strain gauge, and measuring the instant temperature of the test piece by the thermocouple;
and step 3: the tested piece and the test piece are placed in a vacuum tank, and the test piece is placed near a measuring point of the tested piece, so that the temperature of the test piece is consistent with that of the tested piece;
and 4, step 4: connecting a strain gauge and a thermocouple cable, wherein a test point lead of the tested piece is connected with a test piece test point lead for compensation in a collinear manner, and test data of the test piece is compensated for test data of the test point of the tested piece;
and 5: during the thermal vacuum test, observing the change condition of the test temperature, ensuring that the temperature of the test piece is consistent with the temperature of the tested piece, and recording the strain value and the corresponding temperature value of each working condition in real time;
step 6: and (4) data processing, namely calculating thermal stress data of the tested point of the tested piece under different temperature conditions according to the strain test data.
2. The thermal stress testing method for the thermal vacuum test according to claim 1, wherein the step 3 comprises: the tested piece is fixed according to the real constraint state of the product, and the test piece is kept in a free placement state.
3. The thermal stress testing method of the thermal vacuum test according to claim 1, wherein the step 5 comprises: the difference between the temperature of the test piece and the temperature of the tested piece is not more than 10 ℃.
4. The method for testing thermal stress of thermal vacuum test according to claim 1, wherein the working temperature of the strain gauge and the thermocouple is capable of meeting the requirement of extreme temperature environment of the thermal vacuum test.
5. The method according to claim 1, wherein the measured points correspond to the test pieces one by one, and the same number of test pieces are selected according to the number of the measured points.
6. The method according to claim 1, wherein the test strip is placed near the tested piece in a manner that does not affect free thermal expansion and contraction of the test strip.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110760206.4A CN113418952A (en) | 2021-07-05 | 2021-07-05 | Thermal stress testing method for thermal vacuum test |
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| CN202110760206.4A CN113418952A (en) | 2021-07-05 | 2021-07-05 | Thermal stress testing method for thermal vacuum test |
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|---|---|---|---|---|
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2021
- 2021-07-05 CN CN202110760206.4A patent/CN113418952A/en active Pending
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