CN113414956A - Continuous extrusion forming equipment for semiconductor chip packaging low-temperature welding wire - Google Patents

Continuous extrusion forming equipment for semiconductor chip packaging low-temperature welding wire Download PDF

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Publication number
CN113414956A
CN113414956A CN202110536650.8A CN202110536650A CN113414956A CN 113414956 A CN113414956 A CN 113414956A CN 202110536650 A CN202110536650 A CN 202110536650A CN 113414956 A CN113414956 A CN 113414956A
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CN
China
Prior art keywords
fixed
extrusion
semiconductor chip
feeding pipe
pipe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110536650.8A
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Chinese (zh)
Inventor
阎勇峰
王明
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shanghai Wangde Industrial Co ltd
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Shanghai Wangde Industrial Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Shanghai Wangde Industrial Co ltd filed Critical Shanghai Wangde Industrial Co ltd
Priority to CN202110536650.8A priority Critical patent/CN113414956A/en
Publication of CN113414956A publication Critical patent/CN113414956A/en
Pending legal-status Critical Current

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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/03Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor characterised by the shape of the extruded material at extrusion
    • B29C48/05Filamentary, e.g. strands
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/27Cleaning; Purging; Avoiding contamination
    • B29C48/2715Cleaning; Purging; Avoiding contamination of plasticising units
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C48/00Extrusion moulding, i.e. expressing the moulding material through a die or nozzle which imparts the desired form; Apparatus therefor
    • B29C48/25Component parts, details or accessories; Auxiliary operations
    • B29C48/92Measuring, controlling or regulating
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814Conductive parts
    • H01L21/4885Wire-like parts or pins
    • H01L21/4896Mechanical treatment, e.g. cutting, bending

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Extrusion Moulding Of Plastics Or The Like (AREA)

Abstract

The invention discloses continuous extrusion forming equipment for packaging a low-temperature welding wire by using a semiconductor chip, which belongs to the technical field of continuous extrusion forming equipment and comprises a bottom plate, wherein an extrusion barrel is arranged above the bottom plate, a feeding pipe is rotationally connected in the extrusion barrel, a spiral extrusion paddle is fixedly connected to the outer side of the feeding pipe, one end of the feeding pipe extends to the outer side of the extrusion barrel and is connected with a rotary joint, and the other end of the rotary joint is connected with a water injection straight pipe; through the setting of the mechanism that opens and shuts, can make things convenient for every stifled post all to break away from in the limbers that corresponds, make every limbers all be linked together with the inside of conveying pipe, at this moment, its water injection straight tube is connected to the outside water delivery equipment of accessible to with in the clear water input to the conveying pipe, and spout from a plurality of limbers, and the rotation of cooperation conveying pipe, can carry out quick comprehensive washing to the inside of recipient, it is convenient to bring when clearing up the recipient inside for people.

Description

Continuous extrusion forming equipment for semiconductor chip packaging low-temperature welding wire
Technical Field
The invention belongs to the technical field of continuous extrusion forming equipment, and particularly relates to continuous extrusion forming equipment for a semiconductor chip packaging low-temperature welding wire.
Background
When the low-temperature welding wire is processed, the low-temperature welding wire needs to be extruded and formed, and in the practical processing process, extrusion equipment is generally adopted to complete continuous extrusion work.
At present, the height of equipment for continuously extruding low-temperature welding wires can not be adjusted, different production requirements can not be met, the application range is small, the extrusion container can not be cleaned simultaneously, inconvenience is brought to cleaning inside the extrusion container, and certain defects exist.
Disclosure of Invention
The present invention is directed to a continuous extrusion molding apparatus for semiconductor chip package low temperature bonding wires, which solves the above problems of the prior art.
In order to achieve the purpose, the invention provides the following technical scheme: a continuous extrusion forming device for packaging low-temperature welding wires for semiconductor chips comprises a base plate, an extrusion cylinder is arranged above the base plate, a feeding pipe is rotationally connected in the extrusion cylinder, a spiral extrusion paddle is fixedly connected to the outer side of the feeding pipe, one end of the feeding pipe extends to the outer side of the extrusion cylinder, and be connected with rotary joint, rotary joint's the other end is connected with the water injection straight tube, the outside rigid coupling of water injection straight tube has L type backup pad, be equipped with the gear of rigid coupling in the conveying pipe outside between rotary joint and the recipient, the below meshing of gear one is connected with gear two, the outside at the recipient is fixed to L type backup pad, be fixed with driving motor on the lateral wall towards rotary joint in the L type backup pad, driving motor's output shaft links to each other with the installation shaft hole of gear two, be connected with lift adjustment mechanism between bottom plate and the recipient, install the mechanism that opens and shuts in the conveying pipe.
Preferably, lift adjustment mechanism is including fixing two symmetrical fixed outer poles on the bottom plate top, and flexible inner chamber has all been seted up to fixed outer pole, and the equal sliding connection in flexible inner chamber has flexible interior pole, and equal screw drive is connected with the screw rod on the flexible interior pole, and the screw rod is all rotated and is connected on the fixed outer pole that corresponds.
Preferably, all seted up the cavity on the fixed outer pole, the bottom of screw rod all extends to in the cavity that corresponds to the rigid coupling has bevel gear one, and one side of bevel gear one all meshes and is connected with bevel gear two, is equipped with the double-shaft motor who fixes on the bottom plate top between two fixed outer poles, and two output shafts of double-shaft motor extend respectively to in the cavity that corresponds to link to each other with bevel gear two's installation shaft hole.
Preferably, the opening and closing mechanism comprises two symmetrical cross rods movably connected in the feeding pipe, and a plurality of blocking columns are fixed on one side wall of each cross rod, which is back to the feeding pipe, at equal intervals.
Preferably, the outer side of each blocking column is movably sleeved with a spring, one end of each spring is fixed on the corresponding side wall of the corresponding cross rod, the other end of each spring is connected with the inner wall of the feeding pipe, and the feeding pipe is provided with a water through hole matched with the blocking column.
Preferably, the both sides of horizontal pole all are equipped with the montant of fixing in the pay-off pipe, all are fixed with miniature electric telescopic handle on two montants towards a lateral wall of horizontal pole, and miniature electric telescopic handle's flexible end all is fixed with three hornblocks, and three equal swing joint of hornblock are between two horizontal poles, and the inclined plane with three hornblock matched with has all been seted up at the both ends of horizontal pole.
Compared with the prior art, the spraying device with the dust removal effect provided by the invention at least has the following beneficial effects:
(1) through the setting of lift adjustment mechanism, can adjust the height of recipient, satisfy the user demand of different production conditions, application range is wide.
(2) Through the setting of the mechanism that opens and shuts, can make things convenient for every stifled post all to break away from in the limbers that corresponds, make every limbers all be linked together with the inside of conveying pipe, at this moment, its water injection straight tube is connected to the outside water delivery equipment of accessible to with in the clear water input to the conveying pipe, and spout from a plurality of limbers, and the rotation of cooperation conveying pipe, can carry out quick comprehensive washing to the inside of recipient, it is convenient to bring when clearing up the recipient inside for people.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of the feeding tube of the present invention with a cut-away interior;
fig. 3 is an enlarged schematic view of the structure of the present invention at a.
In the figure: 1. a base plate; 2. an extrusion cylinder; 21. a feed pipe; 22. a screw extrusion paddle; 23. a rotary joint; 24. a first gear; 25. a second gear; 26. a drive motor; 3. a lifting adjusting mechanism; 301. fixing the outer rod; 302. a telescopic inner rod; 303. a screw; 304. a first bevel gear; 305. a second bevel gear; 306. a double-shaft motor; 4. an opening and closing mechanism; 401. a cross bar; 402. plugging the column; 403. a spring; 404. a water through hole; 405. a vertical rod; 406. a miniature electric telescopic rod; 407. and (5) a triangular block.
Detailed Description
The present invention will be further described with reference to the following examples.
The following examples are intended to illustrate the invention but are not intended to limit the scope of the invention. The conditions in the embodiments can be further adjusted according to specific conditions, and simple modifications of the method of the present invention based on the concept of the present invention are within the scope of the claimed invention.
Referring to fig. 1-3, the present invention provides a continuous extrusion molding apparatus for packaging low temperature solder wire for semiconductor chip, comprising a bottom plate 1, an extrusion cylinder 2, a feeding pipe 21, a spiral extrusion paddle 22, a rotary joint 23, a first gear 24, a second gear 25, a driving motor 26, a lifting adjusting mechanism 3, a fixed outer rod 301, a telescopic inner rod 302, a screw rod 303, a first bevel gear 304, a second bevel gear 305, a double-shaft motor 306, an opening and closing mechanism 4, a cross rod 401, a blocking column 402, a spring 403, a water through hole 404, a vertical rod 405, a micro electric telescopic rod 406 and a triangular block 407, wherein the extrusion cylinder 2 is installed above the bottom plate 1, the extrusion cylinder 2 is rotatably connected with the feeding pipe 21, the spiral extrusion paddle 22 is fixedly connected to the outer side of the feeding pipe 21, one end of the feeding pipe 21 extends to the outer side of the extrusion cylinder 2 and is connected with the rotary joint 23, the other end of the rotary joint 23 is connected with a straight water injection pipe, the outside rigid coupling of water injection straight tube has L type backup pad, be equipped with the gear 24 of rigid coupling in the conveying pipe 21 outside between rotary joint 23 and the recipient 2, the meshing of the below of gear 24 is connected with gear two 25, L type backup pad is fixed in the outside of recipient 2, be fixed with driving motor 26 on the L type backup pad towards a lateral wall of rotary joint 23, the output shaft of driving motor 26 links to each other with the installation shaft hole of gear two 25, the outside of recipient 2 still the rigid coupling has prior art's heating device, the die head is still installed to the one end of keeping away from driving motor 26 on the recipient 2 in addition, the last extrusion hole of having seted up of die head, be convenient for the continuous extrusion moulding of material, this department is prior art, not shown in the figure, rotary joint 23 is rotary joint 23 of prior art, can search on hundred degrees.
A lifting adjusting mechanism 3 is connected between the bottom plate 1 and the extrusion container 2, the lifting adjusting mechanism 3 comprises two symmetrical fixed outer rods 301 fixed at the top end of the bottom plate 1, telescopic inner cavities are all formed in the fixed outer rods 301, telescopic inner rods 302 are all connected in the telescopic inner cavities in a sliding manner, screw rods 303 are all connected on the telescopic inner rods 302 in a spiral transmission manner, the screw rods 303 are all rotatably connected on the corresponding fixed outer rods 301, cavities are all formed in the fixed outer rods 301, the bottom ends of the screw rods 303 all extend into the corresponding cavities, a first bevel gear 304 is fixedly connected, one side of the first bevel gear 304 is engaged with a second bevel gear 305, a double-shaft motor 306 fixed at the top end of the bottom plate 1 is arranged between the two fixed outer rods 301, two output shafts of the double-shaft motor 306 respectively extend into corresponding cavities, and is connected with the mounting shaft hole of the second bevel gear 305, and the thread directions of the two screw rods 303 are opposite.
Install opening and shutting mechanism 4 in conveying pipe 21, opening and shutting mechanism 4 includes two symmetrical horizontal poles 401 of swing joint in conveying pipe 21, impartial distance is fixed with a plurality of stifled posts 402 on two horizontal poles 401 lateral wall dorsad mutually, the equal movable sleeve in outside of stifled post 402 is equipped with spring 403, the one end of spring 403 is all fixed on the horizontal pole 401 lateral wall that corresponds, the other end all links to each other with conveying pipe 21's inner wall, still all set up on conveying pipe 21 with stifled post 402 matched with limbers 404, horizontal pole 401's both sides all are equipped with the montant 405 of fixing in conveying pipe 21, all be fixed with miniature electric telescopic handle 406 on two montants 405 towards a lateral wall of horizontal pole 401, the flexible end of miniature electric telescopic handle 406 all is fixed with three hornblocks 407, the equal swing joint of three hornblocks 407 is between two horizontal poles 401, the inclined plane with three hornblocks 407 matched with has all been seted up at horizontal pole 401's both ends, stifled post 402 all is provided with the swing joint department of corresponding limbers 404 and is provided with the sealing washer.
The working principle is as follows: the materials are poured into a hopper arranged on one side of the top end of an extrusion barrel 2, a driving motor 26 is started, a second gear 25 is rotated and is driven to rotate by a feeding pipe 21 connected with a first gear 24, a spiral extrusion paddle 22 on the feeding pipe 21 extrudes the materials, and a heating device in the prior art on the extrusion barrel 2 is matched, so that the materials are rapidly and continuously extruded and molded from a mold at one end of the extrusion barrel 2, two bevel gears 305 are rotated and are driven to rotate by a corresponding bevel gear 304 by starting a double-shaft motor 306, so that the two screw rods 303 rotate in different directions, the rotating directions of threads on the two screw rods 303 are opposite, the height of the extrusion barrel 2 can be adjusted to the required height, different requirements under the production condition are met, when the interior of the extrusion barrel 2 needs to be cleaned, two micro electric telescopic rods 406 can be started, and contract, and drive two triangle blocks 407 and remove in opposite directions, then make two horizontal poles 401 under the reverse action of a plurality of springs 403, make every stifled post 402 all break away from in the limbers 404 that corresponds, make every limbers 404 all be linked together with the inside of conveying pipe 21, at this moment, its water injection straight tube is connected to the outside water delivery equipment of accessible, and input the clear water to conveying pipe 21 in, and spout from a plurality of limbers 404, and cooperate the rotation of conveying pipe 21, can carry out quick comprehensive washing to the inside of recipient 2, bring the convenience when clearing up recipient 2 inside for people.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.

Claims (6)

1. A continuous extrusion forming equipment for semiconductor chip package low temperature welding wire, includes bottom plate (1), its characterized in that: an extrusion barrel (2) is installed above the bottom plate (1), a feeding pipe (21) is rotationally connected in the extrusion barrel (2), a spiral extrusion paddle (22) is fixedly connected to the outer side of the feeding pipe (21), one end of the feeding pipe (21) extends to the outer side of the extrusion barrel (2) and is connected with a rotary joint (23), a water injection straight pipe is connected to the other end of the rotary joint (23), an L-shaped supporting plate is fixedly connected to the outer side of the water injection straight pipe, a first gear (24) fixedly connected to the outer side of the feeding pipe (21) is arranged between the rotary joint (23) and the extrusion barrel (2), a second gear (25) is meshed and connected to the lower portion of the first gear (24), the L-shaped supporting plate is fixed to the outer side of the extrusion barrel (2), a driving motor (26) is fixed to one side wall of the rotary joint (23) on the L-shaped supporting plate, and an output shaft of the driving motor (26) is connected with an installation shaft hole of the second gear (25), a lifting adjusting mechanism (3) is connected between the bottom plate (1) and the extrusion cylinder (2), and an opening and closing mechanism (4) is installed in the feeding pipe (21).
2. The continuous extrusion molding apparatus for semiconductor chip package low temperature bonding wire according to claim 1, wherein: lifting adjusting mechanism (3) are including fixing two symmetrical fixed outer poles (301) on bottom plate (1) top, and flexible inner chamber has all been seted up to fixed outer pole (301), and equal sliding connection has flexible interior pole (302) in the flexible inner chamber, and equal screw drive is connected with screw rod (303) on flexible interior pole (302), and screw rod (303) all rotate to be connected on the fixed outer pole (301) that corresponds.
3. The continuous extrusion molding apparatus for semiconductor chip package low temperature bonding wire according to claim 2, wherein: the cavity has all been seted up on fixed outer pole (301), the bottom of screw rod (303) all extends to in the cavity that corresponds to the rigid coupling has bevel gear (304), one side of bevel gear (304) all meshes and is connected with bevel gear two (305), be equipped with between two fixed outer poles (301) and fix in double-shaft motor (306) on bottom plate (1) top, two output shafts of double-shaft motor (306) extend to respectively in the cavity that corresponds, and link to each other with the installation shaft hole of bevel gear two (305).
4. The continuous extrusion molding apparatus for semiconductor chip package low temperature bonding wire according to claim 1, wherein: the opening and closing mechanism (4) comprises two symmetrical cross rods (401) movably connected in the feeding pipe (21), and a plurality of blocking columns (402) are fixed on one side wall of each of the two cross rods (401) opposite to each other at equal intervals.
5. The continuous extrusion molding apparatus for semiconductor chip package low temperature bonding wire according to claim 4, wherein: the outside of stifled post (402) all is the movable sleeve to be equipped with spring (403), and the one end of spring (403) all is fixed on horizontal pole (401) lateral wall that corresponds, and the other end all links to each other with the inner wall of conveying pipe (21), still all sets up on conveying pipe (21) with stifled post (402) matched with limbers (404).
6. The continuous extrusion molding apparatus for semiconductor chip package low temperature bonding wire according to claim 4, wherein: the both sides of horizontal pole (401) all are equipped with montant (405) of fixing in conveying pipe (21), all are fixed with miniature electric telescopic handle (406) on two montants (405) on the lateral wall towards horizontal pole (401), and the flexible end of miniature electric telescopic handle (406) all is fixed with three hornblocks (407), and three hornblock (407) equal swing joint are between two horizontal poles (401), and the inclined plane with three hornblock (407) matched with has all been seted up at the both ends of horizontal pole (401).
CN202110536650.8A 2021-05-17 2021-05-17 Continuous extrusion forming equipment for semiconductor chip packaging low-temperature welding wire Pending CN113414956A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110536650.8A CN113414956A (en) 2021-05-17 2021-05-17 Continuous extrusion forming equipment for semiconductor chip packaging low-temperature welding wire

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110536650.8A CN113414956A (en) 2021-05-17 2021-05-17 Continuous extrusion forming equipment for semiconductor chip packaging low-temperature welding wire

Publications (1)

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CN113414956A true CN113414956A (en) 2021-09-21

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116141633A (en) * 2023-03-21 2023-05-23 黄山贝诺科技有限公司 System and method for preparing functionalized polyolefin for PPR composite pipe

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006223945A (en) * 2005-02-15 2006-08-31 Nishida Marine Boiler Co Ltd Washing nozzle
CN108528401A (en) * 2018-01-22 2018-09-14 四川大学 Driving chassis is rinsed to mitigate the method for city haze
CN208816092U (en) * 2018-10-12 2019-05-03 陈涛 A kind of oil extraction in oil field tube cleaning arrangement
CN210157649U (en) * 2019-07-02 2020-03-20 长江大学 Fertilizer injection unit for agricultural production
CN111921994A (en) * 2020-08-30 2020-11-13 单振忠 Pipe fitting cleaning device and pipe fitting cleaning process
CN112677931A (en) * 2019-12-17 2021-04-20 玉环县兴发动力有限公司 Cleaning device for automobile headlamp equipment

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006223945A (en) * 2005-02-15 2006-08-31 Nishida Marine Boiler Co Ltd Washing nozzle
CN108528401A (en) * 2018-01-22 2018-09-14 四川大学 Driving chassis is rinsed to mitigate the method for city haze
CN208816092U (en) * 2018-10-12 2019-05-03 陈涛 A kind of oil extraction in oil field tube cleaning arrangement
CN210157649U (en) * 2019-07-02 2020-03-20 长江大学 Fertilizer injection unit for agricultural production
CN112677931A (en) * 2019-12-17 2021-04-20 玉环县兴发动力有限公司 Cleaning device for automobile headlamp equipment
CN111921994A (en) * 2020-08-30 2020-11-13 单振忠 Pipe fitting cleaning device and pipe fitting cleaning process

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN116141633A (en) * 2023-03-21 2023-05-23 黄山贝诺科技有限公司 System and method for preparing functionalized polyolefin for PPR composite pipe
CN116141633B (en) * 2023-03-21 2023-08-04 黄山贝诺科技有限公司 System and method for preparing functionalized polyolefin for PPR composite pipe

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Effective date of abandoning: 20230714