CN113412581A

CN113412581A - Signal processing system, signal processing module and terminal equipment

Info

Publication number: CN113412581A
Application number: CN201980052341.4A
Authority: CN
Inventors: 杜英强; 刘道明; 刘伟; 曾伟才; 阳美文
Original assignee: Huawei Technologies Co Ltd
Current assignee: Huawei Technologies Co Ltd
Priority date: 2019-12-31
Filing date: 2019-12-31
Publication date: 2021-09-17
Also published as: WO2021134617A1

Abstract

The application provides a signal processing system, signal processing module and terminal equipment can be applied to intelligent car networking field, and can improve the efficiency of product modularization production. The signal processing system comprises a main card module and an auxiliary card module, wherein the main card module comprises: the first radio frequency integrated circuit is used for supporting receiving and/or sending radio frequency signals corresponding to the first SIM; the first FEM is connected with the first radio frequency integrated circuit and comprises a radio frequency front-end device matched with the first radio frequency integrated circuit; the second radio frequency integrated circuit is used for supporting receiving and/or sending radio frequency signals corresponding to the second SIM; and the self-calibration circuit is connected with the second radio frequency integrated circuit and is used for calibrating a second FEM matched with the second radio frequency integrated circuit, the second FEM is arranged on the auxiliary card module, and the main card module and the auxiliary card module are modules capable of being mutually coupled or separated.

Description

Signal processing system, signal processing module and terminal equipment

Technical Field

The application relates to the field of circuits, in particular to a signal processing system, a signal processing module and a terminal device.

Background

Terminal devices in a communication network typically include mobile broadband (MBB) products (e.g., cell phones), vehicles, internet of things (IOT) devices, and so on. In the design of a module product of a terminal device, products of the same model often need to support versions such as single-card and double-card double-pass versions. The single-card system only supports one Subscriber Identity Module (SIM) for communication, and the dual-card bi-pass system can simultaneously support two SIMs for communication. The dual-card dual-pass version requires that a chip in the terminal device can support two sets of baseband processing protocols, and the terminal device further needs to include two corresponding sets of radio frequency circuits and antennas. In other words, the dual-card dual-pass system needs to add a set of radio frequency resources on the basis of the design of a single card.

In order to realize modular design and production, only one set of radio frequency integrated circuit board can be designed during product module design, and the circuit board comprises radio frequency circuits and radio frequency front-end circuits corresponding to the main card and the auxiliary card respectively. The circuit board can realize compatible design, so that a set of radio frequency devices is reduced on the basis of a double-card double-pass version of a single-card version. However, in this design mode, the single-card version requires the circuit board design of the dual-card dual-pass version, which results in a larger circuit board area of the single-card version and a larger constraint on the modular design of the product design. Therefore, how to be compatible with multiple versions such as single card, double card double pass and the like during product design brings great challenges to the design and development cycle of terminal equipment.

Disclosure of Invention

The application provides a signal processing system, a signal processing module and terminal equipment, which can improve the efficiency of product modularization production.

In a first aspect, a signal processing system is provided, which includes: main card module and vice card module, main card module includes: the first radio frequency integrated circuit is used for supporting receiving and/or sending a radio frequency signal corresponding to a first Subscriber Identity Module (SIM); a first front-end module FEM connected to the first RF integrated circuit, the first FEM including an RF front-end device matched to the first RF integrated circuit; the second radio frequency integrated circuit is used for supporting receiving and/or sending radio frequency signals corresponding to a second SIM; and the self-calibration circuit is connected with the second radio frequency integrated circuit and used for calibrating a second FEM matched with the second radio frequency integrated circuit, the second FEM is arranged on the secondary card module, and the main card module and the secondary card module are modules capable of being mutually coupled or separated.

In the embodiment of the application, only the circuit in the main card module can be calibrated on a production line (or before factory shipment) of a product, and the circuit in the auxiliary card module does not need to be calibrated. The main card module is provided with a self-calibration circuit, and the self-calibration circuit is used for calibrating a circuit in the auxiliary card module. If the main card module is applied to a dual-card bi-pass or multi-card multi-pass system, the auxiliary card module can be calibrated by using the self-calibration circuit after the main card module and the auxiliary card module are coupled and powered on in the subsequent product assembly process, so that the calibration process of the product is simplified, and the efficiency of product modular production is improved.

With reference to the first aspect, in a possible implementation manner, the main card module further includes: the calibration main interface is used for being mutually coupled with a calibration auxiliary interface in the auxiliary card module and is connected with the self-calibration circuit; the receiving main interface is used for being mutually coupled with a receiving auxiliary interface in the auxiliary card module and is used for being connected with a receiving link in the second radio frequency integrated circuit; and the transmitting main interface is used for being mutually coupled with the transmitting auxiliary interface in the auxiliary card module and is connected with a transmitting link in the second radio frequency integrated circuit.

With reference to the first aspect, in a possible implementation manner, the self-calibration circuit includes a multi-path selection unit, where the multi-path selection unit includes a plurality of input terminals and an output terminal, and the output terminal is used for being connected to a calibration main interface of the main card module; the plurality of inputs includes: the antenna input end is used for being connected with an antenna corresponding to the second SIM; wherein the multiplexing unit is configured to: and under the condition that the auxiliary card module works normally, the output end is switched to the antenna input end.

In the embodiment of the application, a multi-path selection unit is arranged in the self-calibration circuit, the multi-path selection unit comprises a plurality of input ends and an output end, and the multi-path selection unit can switch the output end of the multi-path selection unit to different input ends according to whether the auxiliary card module is calibrated or not. Therefore, the multi-path selection unit is arranged in the self-calibration circuit, the flexible switching of the auxiliary card module between the calibration mode and the working mode is realized, the calibration flow of the product is simplified, and the efficiency of product modularization production is improved.

With reference to the first aspect, in a possible implementation manner, the multiple input ends of the multi-path selecting unit further include: a reference signal input for receiving a reference signal from a transmit chain of the second radio frequency integrated circuit.

With reference to the first aspect, in one possible implementation manner, the second FEM includes: the receiving front-end circuit comprises a radio frequency front-end device matched with a receiving link in the second radio frequency integrated circuit, the input end of the receiving front-end circuit is connected with the calibration sub-interface, and the output end of the receiving front-end circuit is connected with the receiving sub-interface; the multiplexing unit is configured to: and under the condition of calibrating the receiving front-end circuit, switching the output end to the reference signal input end, wherein the receiving front-end circuit is used for receiving the reference signal and outputting a measuring signal of the receiving front-end circuit.

With reference to the first aspect, in a possible implementation manner, the receiving front-end circuit includes a first filter and a low-noise amplifier, an input end of the first filter is connected to an input end of the receiving front-end circuit, an output end of the first filter is connected to an input end of the low-noise filter, and an output end of the low-noise filter is connected to an output end of the receiving front-end circuit.

It should be noted that, the connection between the above-mentioned devices may refer to electrical connection, and the above-mentioned connected devices may be directly connected, or other electronic components, such as resistors, inductors, or capacitors, may be provided.

With reference to the first aspect, in a possible implementation manner, the multiple input ends of the multi-path selecting unit further include: and the grounding input end is used for being connected with the ground through a grounding resistor.

With reference to the first aspect, in one possible implementation manner, the second FEM includes: the transmitting front-end circuit comprises a radio frequency front-end device matched with a transmitting link in the second radio frequency integrated circuit, the input end of the transmitting front-end circuit is connected with the transmitting sub-interface, and the output end of the transmitting link circuit is connected with the calibrating sub-interface; the multiplexing unit is configured to: and under the condition of calibrating the transmitting front-end circuit, switching the output end to the grounding input end, wherein the transmitting front-end circuit is used for receiving a reference signal from the transmitting link and outputting a measuring signal of the transmitting front-end circuit, and the reference signal is a calibrated signal.

With reference to the first aspect, in a possible implementation manner, the self-calibration circuit further includes: a coupling circuit for sensing and outputting a measurement signal of the transmit front end circuit through a ground input of the multiplexing unit.

With reference to the first aspect, in a possible implementation manner, the coupling circuit includes a coupling inductor, the coupling inductor is configured to be coupled to a ground input end of the multiplexer unit, a first end of the coupling inductor is grounded, and a second end of the coupling inductor is configured to output a measurement signal of the transmitting front-end circuit, which is induced by the coupling inductor.

With reference to the first aspect, in a possible implementation manner, the transmission front-end circuit includes a power amplifier and a second filter, an input end of the power amplifier is connected to an input end of the transmission front-end circuit, an output end of the power amplifier is connected to an input end of the second filter, and an output end of the second filter is connected to an output end of the transmission front-end circuit.

With reference to the first aspect, in one possible implementation manner, the reference signal includes at least one of the following reference signals: a low-band reference signal, a medium-high band reference signal and a super high band reference signal.

With reference to the first aspect, in a possible implementation manner, the main card module further includes a baseband subsystem, where the baseband subsystem is respectively connected to the first radio frequency integrated circuit and the second radio frequency integrated circuit, and the baseband subsystem is configured to process a baseband signal.

Optionally, when the main card module does not include the baseband subsystem, the main card module may further include a baseband interface, the baseband interface is connected to the first rf integrated circuit and the second rf integrated circuit, and the main card module may be connected to the baseband subsystem through the baseband interface.

In a second aspect, a signal processing module is provided, which includes: a master card module, the master card module comprising: the first radio frequency integrated circuit is used for supporting receiving and/or sending a radio frequency signal corresponding to a first Subscriber Identity Module (SIM); a first front-end module FEM connected to the first RF integrated circuit, the first FEM including an RF front-end device matched to the first RF integrated circuit; the second radio frequency integrated circuit is used for supporting receiving and/or sending radio frequency signals corresponding to a second SIM; and the self-calibration circuit is connected with the second radio frequency integrated circuit and used for calibrating a second FEM matched with the second radio frequency integrated circuit, the second FEM is arranged on the secondary card module, and the main card module and the secondary card module are modules capable of being mutually coupled or separated.

Alternatively, the signal processing module may refer to a product for modular design and production, for example, one signal processing module may refer to one product module, and one signal processing module may be disposed on one integrated circuit board.

In the embodiment of the present application, a separate signal processing module may be provided, and the signal processing module includes a main card module, and the main card module may be coupled with or separated from the sub card module. Only the circuit in the main card module is calibrated on a production line (or before leaving the factory) of the product, and the circuit in the auxiliary card module is not required to be calibrated. The main card module is provided with a self-calibration circuit, and the self-calibration circuit is used for calibrating a circuit in the auxiliary card module. If the main card module is applied to a dual-card bi-pass or multi-card multi-pass system, the auxiliary card module can be calibrated by using the self-calibration circuit after the main card module and the auxiliary card module are coupled and powered on in the subsequent product assembly process, so that the calibration process of the product is simplified, and the efficiency of product modular production is improved.

With reference to the second aspect, in a possible implementation manner, the main card module further includes: the calibration main interface is used for being mutually coupled with a calibration auxiliary interface in the auxiliary card module and is connected with the self-calibration circuit; the receiving main interface is used for being mutually coupled with a receiving auxiliary interface in the auxiliary card module and is used for being connected with a receiving link in the second radio frequency integrated circuit; and the transmitting main interface is used for being mutually coupled with the transmitting auxiliary interface in the auxiliary card module and is connected with a transmitting link in the second radio frequency integrated circuit.

With reference to the second aspect, in a possible implementation manner, the self-calibration circuit includes a multiplexing unit, where the multiplexing unit includes a plurality of input terminals and an output terminal, and the output terminal is used for being connected to the calibration main interface of the main card module; the plurality of inputs includes: the antenna input end is used for being connected with an antenna corresponding to the second SIM; wherein the multiplexing unit is configured to: and under the condition that the auxiliary card module works normally, the output end is switched to the antenna input end.

With reference to the second aspect, in a possible implementation manner, the multiple input terminals of the multiplexing unit further include: a reference signal input for receiving a reference signal from a transmit chain of the second radio frequency integrated circuit.

With reference to the second aspect, in one possible implementation manner, the second FEM includes: the receiving front-end circuit comprises a radio frequency front-end device matched with a receiving link in the second radio frequency integrated circuit, the input end of the receiving front-end circuit is connected with the calibration sub-interface, and the output end of the receiving front-end circuit is connected with the receiving sub-interface; the multiplexing unit is configured to: and under the condition of calibrating the receiving front-end circuit, switching the output end to the reference signal input end, wherein the receiving front-end circuit is used for receiving the reference signal and outputting a measuring signal of the receiving front-end circuit.

With reference to the second aspect, in a possible implementation manner, the receiving front-end circuit includes a first filter and a low-noise amplifier, an input end of the first filter is connected to an input end of the receiving front-end circuit, an output end of the first filter is connected to an input end of the low-noise filter, and an output end of the low-noise filter is connected to an output end of the receiving front-end circuit.

With reference to the second aspect, in a possible implementation manner, the multiple input terminals of the multiplexing unit further include: and the grounding input end is used for being connected with the ground through a grounding resistor.

With reference to the second aspect, in one possible implementation manner, the second FEM includes: the transmitting front-end circuit comprises a radio frequency front-end device matched with a transmitting link in the second radio frequency integrated circuit, the input end of the transmitting front-end circuit is connected with the transmitting sub-interface, and the output end of the transmitting link circuit is connected with the calibrating sub-interface; the multiplexing unit is configured to: and under the condition of calibrating the transmitting front-end circuit, switching the output end to the grounding input end, wherein the transmitting front-end circuit is used for receiving a reference signal from the transmitting link and outputting a measuring signal of the transmitting front-end circuit, and the reference signal is a calibrated signal.

With reference to the second aspect, in one possible implementation manner, the self-calibration circuit further includes: and the coupling circuit is used for sensing and outputting the measurement signal of the transmitting front-end circuit passing through the grounding input end of the multi-path selection unit.

With reference to the second aspect, in a possible implementation manner, the coupling circuit includes a coupling inductor, the coupling inductor is configured to be coupled to a ground input end of the multiplexing unit, a first end of the coupling inductor is grounded, and a second end of the coupling inductor is configured to output a measurement signal of the transmitting front-end circuit, which is induced by the coupling inductor.

With reference to the second aspect, in a possible implementation manner, the transmission front-end circuit includes a power amplifier and a second filter, an input end of the power amplifier is connected to an input end of the transmission front-end circuit, an output end of the power amplifier is connected to an input end of the second filter, and an output end of the second filter is connected to an output end of the transmission front-end circuit.

With reference to the second aspect, in one possible implementation manner, the reference signal includes at least one of the following reference signals: a low-band reference signal, a medium-high band reference signal and a super high band reference signal.

In a third aspect, a signal processing module is provided, which includes: a secondary card module, the secondary card module comprising: a second front-end module FEM, the second FEM including a radio frequency front-end device matched with a second radio frequency integrated circuit, the second radio frequency integrated circuit being disposed on the main card module, the main card module and the auxiliary card module being modules capable of being coupled or separated from each other; and the calibration secondary interface is used for being connected with a calibration main interface in the main card module, the calibration main interface is used for being connected with a self-calibration circuit in the main card module, and the self-calibration circuit is used for calibrating the second FEM.

In the embodiment of the present application, a separate signal processing module may be provided, and the signal processing module includes a sub card module, and the sub card module may be coupled with or separated from the main card module. Only the circuit in the main card module is calibrated on a production line (or before leaving the factory) of the product, and the circuit in the auxiliary card module is not required to be calibrated. The main card module is provided with a self-calibration circuit, and the self-calibration circuit is used for calibrating a circuit in the auxiliary card module. If the main card module is applied to a dual-card bi-pass or multi-card multi-pass system, the auxiliary card module can be calibrated by using the self-calibration circuit after the main card module and the auxiliary card module are coupled and powered on in the subsequent product assembly process, so that the calibration process of the product is simplified, and the efficiency of product modular production is improved.

With reference to the third aspect, in a possible implementation manner, the secondary card module further includes: the receiving auxiliary interface is used for being mutually coupled with a receiving main interface in the auxiliary card module, and the receiving main interface is used for being connected with a receiving link in the second radio frequency integrated circuit; and the transmitting auxiliary interface is used for being mutually coupled with a transmitting main interface in the auxiliary card module, and the transmitting main interface is used for being connected with a transmitting link in the second radio frequency integrated circuit.

With reference to the third aspect, in one possible implementation manner, the second FEM includes: and the receiving front-end circuit comprises a radio frequency front-end device matched with a receiving link in the second radio frequency integrated circuit, the input end of the receiving front-end circuit is connected with the calibration sub-interface, and the output end of the receiving front-end circuit is connected with the receiving sub-interface.

With reference to the third aspect, in a possible implementation manner, the receiving front-end circuit includes a first filter and a low-noise amplifier, an input end of the first filter is connected to an input end of the receiving front-end circuit, an output end of the first filter is connected to an input end of the low-noise filter, and an output end of the low-noise filter is connected to an output end of the receiving front-end circuit.

With reference to the third aspect, in one possible implementation manner, the second FEM includes: and the transmitting front-end circuit comprises a radio frequency front-end device matched with a transmitting link in the second radio frequency integrated circuit, the input end of the transmitting front-end circuit is connected with the transmitting sub-interface, and the output end of the transmitting link circuit is connected with the calibrating sub-interface.

With reference to the third aspect, in a possible implementation manner, the transmission front-end circuit includes a power amplifier and a second filter, an input end of the power amplifier is connected to an input end of the transmission front-end circuit, an output end of the power amplifier is connected to an input end of the second filter, and an output end of the second filter is connected to an output end of the transmission front-end circuit.

In a fourth aspect, a terminal device is provided, where the terminal device includes the signal processing system in the first aspect or any one of the possible implementation manners of the first aspect.

In a fifth aspect, a terminal device is provided, where the terminal device includes the signal processing module described in the second aspect or any one of the possible implementation manners of the second aspect.

A sixth aspect provides an integrated circuit board, on which the signal processing module described in the second aspect or any one of the possible implementation manners of the second aspect is disposed.

In a seventh aspect, an integrated circuit board is provided, where the signal processing module in any one of the possible implementation manners of the third aspect or the third aspect is disposed on the integrated circuit board.

Drawings

Fig. 1 is a schematic structural diagram of a wireless communication system according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a terminal device 100 according to an embodiment of the present application.

Fig. 3 is a schematic structural diagram of a signal processing system 300 according to an embodiment of the present application.

Fig. 4 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 5 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 6 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 7 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 8 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 9 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 10 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 11 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Fig. 12 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application.

Detailed Description

The technical solution in the present application will be described below with reference to the accompanying drawings.

Terminal equipment in the embodiments of the present application may refer to user equipment, access terminals, subscriber units, subscriber stations, mobile stations, remote terminals, mobile devices, user terminals, wireless communication devices, user agents, or user devices. The terminal device may also be a cellular phone, a cordless phone, a Session Initiation Protocol (SIP) phone, a Wireless Local Loop (WLL) station, a Personal Digital Assistant (PDA), a handheld device having wireless communication capability, a computing device or other processing device connected to a wireless modem, a vehicle-mounted device (e.g., a vehicle-mounted communication module), a vehicle-mounted system, an IOT terminal, etc.

Wearable devices, terminal devices in a future 5G network or terminal devices in a Public Land Mobile Network (PLMN) for future evolution, which is not limited in this embodiment of the present application.

The network device in this embodiment may be a device for communicating with a terminal device, where the network device may be an evolved node b (eNB) or an eNodeB in an LTE system, and may also be a wireless controller in a Cloud Radio Access Network (CRAN) scenario, or the network device may be a relay station, an access point, a vehicle-mounted device, a wearable device, a network device in a future 5G network, a network device in a future evolved PLMN network, or the like, and the embodiment of the present application is not limited.

Fig. 1 is a schematic structural diagram of a wireless communication system according to an embodiment of the present disclosure. As shown in fig. 1, the wireless communication system includes a terminal device and a network device. Depending on the transmission direction, the transmission link from the terminal device to the network device is denoted as Uplink (UL), and the transmission link from the network device to the terminal device is denoted as Downlink (DL). Similarly, data transmission in the uplink may be abbreviated as uplink data transmission or uplink transmission, and data transmission in the downlink may be abbreviated as downlink data transmission or downlink transmission.

In the wireless communication system, the network device may provide communication coverage for a particular geographic area through an integrated or external antenna device. One or more terminal devices located within the communication coverage of the network device may each have access to the network device. One network device may manage one or more cells (cells). Each cell has an identity, also referred to as a cell identity (cell ID). From the perspective of radio resources, one cell is a combination of downlink radio resources and (optionally) uplink radio resources paired therewith.

In the wireless communication system, the terminal device and the network device support one or more of the same RAT, for example, RAT of 5G NR, 4G LTE, or future evolution system. Specifically, the terminal device and the network device use the same air interface parameters, coding schemes, modulation schemes, and the like, and communicate with each other based on radio resources specified by the system.

It should be understood that fig. 1 is merely an example, and describes an application environment of the terminal device according to the embodiment of the present application. The terminal device in the embodiment of the present application may also be applied to other fields, for example, the field of intelligent networked vehicle (ICV), the field of intelligent driving (intelligent driving), the field of intelligent vehicle (automobile), the field of automatic driving, the field of internet driving (network driving), the field of intelligent internet driving (intelligent network driving), the field of in-vehicle network (in-vehicle network), the field of vehicle cloud communication (car-to-cloud communication), the field of vehicle communication (vehicle communication), and the like.

Fig. 2 is a schematic structural diagram of a terminal device 100 according to an embodiment of the present application. The terminal device 100 may be suitable for use in the application environment described in fig. 1 or other portions of the embodiments of the present application. For convenience of explanation, fig. 2 shows only the main components of the terminal device 100. As shown in fig. 2, the terminal device 100 includes a processing system 220, a storage system 230, a signal processing system 300, an Antenna (ANT), and an input-output device 240.

The signal processing system 300 is mainly used for converting baseband signals and radio frequency signals and processing radio frequency signals. Together, the signal processing system 300 and the antenna, which may also be referred to as a transceiver, are primarily used for transceiving radio frequency signals in the form of electromagnetic waves.

The processing system 220 may be used as a main control system or a main computing system of the terminal device 100, and is configured to run a main operating system and an application program, manage software and hardware resources of the entire terminal device 100, control the entire terminal device, execute a software program, process data of the software program, and provide a user operation interface for a user. The processing system 220 is also used to process communication protocols as well as communication data.

The processing system 220 may include one or more processors. The plurality of processors may be a plurality of processors of the same type or may comprise a combination of processors of multiple types. In the present application, the processor may be a general-purpose processor or a processor designed for a specific field. For example, the processor may be a central processing unit (central processing unit,

a CPU), a Digital Signal Processor (DSP), or a Micro Control Unit (MCU). The processor may also be a Graphics Processing Unit (GPU), an image signal processing unit (ISP), an Audio Signal Processor (ASP), and an AI processor specifically designed for Artificial Intelligence (AI) applications. AI processors include, but are not limited to, neural Network Processing Units (NPUs), Tensor Processing Units (TPUs), and processors known as AI engines.

The storage system 230 is primarily used to store software programs and data, and the storage system 230 may include memory and/or storage. Additionally, one or more caches may also be included in processing system 220, respectively. In a specific implementation, the memory can be divided into a volatile memory (NVM) and a non-volatile memory (NVM). Volatile memory refers to memory in which data stored therein is lost when power supply is interrupted. Currently, volatile memory is mainly Random Access Memory (RAM), including Static RAM (SRAM) and Dynamic RAM (DRAM). A nonvolatile memory is a memory in which data stored inside is not lost even if power supply is interrupted. Common non-volatile memories include Read Only Memories (ROMs), optical disks, magnetic disks, and various memories based on flash memory technology, etc. Generally, the memory and cache may be volatile memory, and the mass storage may be non-volatile memory, such as flash memory.

The input/output device 240 is mainly used for receiving data input by a user and outputting data to the user, such as a touch screen, a display screen, a keyboard lamp, and the like.

Fig. 3 is a schematic structural diagram of a signal processing system 300 according to an embodiment of the present application. The working principle of the signal processing system 300 will be described below with reference to fig. 3.

In fig. 3, ANT _1 denotes a first antenna, ANT _ N denotes an nth antenna, and N is a positive integer greater than 1. Tx denotes a transmit path, Rx denotes a receive path, MRX denotes a feedback receive path, and different numbers denote different paths. Each path may represent a signal processing channel. Here, HB denotes a high frequency, LB denotes a low frequency, and both denote relatively high and low frequencies. BB denotes baseband. It should be understood that the labels and components in fig. 3 are for illustrative purposes only, as only one possible implementation, and that other implementations are also encompassed by the present embodiments. For example, a terminal device may include more or fewer paths, including more or fewer components.

In fig. 3, a Radio Frequency Integrated Circuit (RFIC) and a front-end module (FEM) may jointly form a radio frequency subsystem 340. The RF subsystem 340 may be divided into a radio frequency receive path (RF receive path) and a radio frequency transmit path (RF transmit path) according to the receiving or transmitting path of the signal. The rf receive channel may receive an rf signal via an antenna, process (e.g., amplify, filter, and downconvert) the rf signal to obtain a baseband signal, and deliver the baseband signal to the baseband subsystem 330. The rf transmit path may receive the baseband signal from the baseband subsystem 330, process (e.g., upconvert, amplify, and filter) the baseband signal to obtain an rf signal, and finally radiate the rf signal into space via an antenna. The radio frequency integrated circuit may be referred to as a radio frequency transceiver circuit, a radio frequency processing chip, or a radio frequency chip.

In particular, the rf subsystem 340 may include antenna switches, antenna tuners, Low Noise Amplifiers (LNAs), Power Amplifiers (PAs), mixers (mixers), Local Oscillators (LOs), filters (filters), and other electronic devices that may be integrated into one or more chips as desired. The radio frequency integrated circuit may be referred to as a radio frequency processing chip or a radio frequency chip. The FEM may also be a separate chip. The radio frequency chip is sometimes also referred to as a receiver, transmitter, or transceiver. As technology evolves, antennas may sometimes also be considered part of the rf subsystem 340 and may be integrated into the chip of the rf subsystem 340. The antenna, the FEM and the rf chip may all be manufactured and sold separately. Of course, the rf subsystem 340 may also be implemented with different devices or integrated in different ways based on power consumption and performance requirements. For example, some devices belonging to the FEM are integrated into a radio frequency chip, and even the antenna and the FEM are integrated into a radio frequency chip, which may also be referred to as a radio frequency antenna module or an antenna module.

Similar to the rf subsystem 340 primarily performing rf signal processing, the baseband subsystem 330 primarily performs processing of baseband signals, as the name implies. The baseband subsystem 330 may extract useful information or data bits from the baseband signal or convert the information or data bits into a baseband signal to be transmitted. These information or data bits may be data representing user data or control information such as voice, text, video, etc. For example, the baseband subsystem 330 may perform signal processing operations such as modulation and demodulation, encoding and decoding. The baseband signal processing operations are also not exactly the same for different radio access technologies, such as 5G NR and 4G LTE.

In addition, since the rf signal is usually an analog signal, the signal processed by the baseband subsystem 330 is mainly a digital signal, and an analog-to-digital conversion device is also required in the terminal equipment. In the embodiment of the present application, the analog-to-digital conversion device may be disposed in the baseband subsystem 330, and may also be disposed in the rf subsystem 340. The analog-to-digital conversion device includes an analog-to-digital converter (ADC) that converts an analog signal into a digital signal, and a digital-to-analog converter (DAC) that converts a digital signal into an analog signal.

The baseband subsystem 330 may include one or more processors. In addition, the baseband subsystem 330 may also include one or more Hardware Accelerators (HACs). The hardware accelerator can be used for specially finishing sub-functions with large processing overhead, such as assembly and analysis of data packets (data packets), encryption and decryption of the data packets, and the like. These sub-functions may also be implemented using general-purpose processors, but for performance or cost considerations, it may be more appropriate to use hardware accelerators. In a specific implementation, the hardware accelerator is mainly implemented by an Application Specific Integrated Circuit (ASIC). Of course, one or more relatively simple processors, such as MCUs, may also be included in the hardware accelerator.

In the embodiment of the present application, the baseband subsystem 330 and the rf subsystem 340 may jointly form the signal processing system 300, so as to provide a wireless communication function for the terminal device. Alternatively, the signal processing system 300 may include only the rf subsystem 340. In general, the baseband subsystem 330 is responsible for managing the software and hardware resources of the communication subsystem, and may configure the operating parameters of the rf subsystem 340. The processor of the baseband subsystem 330 may run a sub-operating system of the signal processing system, which may be an embedded operating system or a real-time operating system (real-time operating system), such as a VxWorks operating system or a QuRT system of the general company.

The baseband subsystem 330 may be integrated into one or more chips, which may be referred to as baseband processing chips or baseband chips. The baseband subsystem 330 may be implemented as a stand-alone chip, which may be referred to as a modem (modem) or modem chip. The baseband subsystem 330 may be manufactured and sold in units of modem chips. modem chips are also sometimes referred to as baseband processors or mobile processors. In addition, the baseband subsystem 330 may also be further integrated into a larger chip, manufactured and sold in units of larger chips. This larger chip may be referred to as a system-on-chip, system-on-a-chip or system-on-a-chip (SoC), or simply as an SoC chip. The software components of the baseband subsystem 330 may be built in the hardware components of the chip before the chip leaves factory, or may be imported into the hardware components of the chip from other nonvolatile memories after the chip leaves factory, or may be downloaded and updated in an online manner through a network. In addition, the baseband subsystem 330 may further include one or more buffers. Generally, a cache may be selected for volatile memory.

The embodiment of the application is based on the idea of modular design, the specifications of single-card and double-card bi-pass are appropriately decoupled, the signal processing system is provided, the modular design of a radio frequency subsystem can be realized, and meanwhile, the signal processing system is compatible with a single-card system, a double-card bi-pass system or a multi-card multi-pass system, so that the efficiency of modular production is improved.

Fig. 4 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. The signal circuit system 300 in the embodiment of the present application can be applied to the terminal device 100 in fig. 2. The signal processing system 300 is configured to receive and/or transmit a radio frequency signal corresponding to the SIM. The signal processing system 300 includes a main card module 310. Further, the signal processing system 300 may further include one or more sub-card modules 320. The main card module 310 and the sub card module 320 may be coupled to or separated from each other. If the terminal device is a single card system, only the main card module 310 may be disposed in the signal processing system 300. If the terminal device supports a dual-card dual-pass system, the signal processing system 300 may include a main card module 310 and a sub card module 320. If the terminal device supports a multi-card and multi-communication system, the signal processing system may include a main card module 310 and a plurality of sub-card modules 320.

Alternatively, interfaces may be respectively disposed on the main card module 310 and the sub card module 320, and the main card module 310 and the sub card module 320 may be coupled to each other through the interfaces.

The main card module 310 is configured to support transceiving of radio frequency signals corresponding to the first SIM, and the one or more sub-card modules 320 are configured to support transceiving of radio frequency signals corresponding to other SIMs except the first SIM. For example, each secondary card module is used for supporting the transceiving of radio frequency signals corresponding to one SIM. The first SIM may also be referred to as a primary card, and the other SIMs may also be referred to as secondary cards. As an example, for the in-vehicle field, the primary card module may be used to support a SIM provided by a user, and the secondary card module may be used to support a SIM matching the identity of the vehicle, which may also be referred to as a car factory card.

Optionally, the SIM may be a virtual module or a physical module. The physical module may refer to a physical SIM card, the virtual module may include an embedded SIM (eSIM) card, and the eSIM refers to a software module that can directly embed a SIM in a chip of the terminal device, rather than being added to the terminal device as a separate removable component.

Fig. 5 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. The baseband subsystem 330 is disposed in the main card module 310 in fig. 5 (a). The baseband subsystem 330 is not included in the main card module 310 of fig. 5 (b). As shown in (a) and (b) of fig. 5, the baseband subsystem 330 may be included in the main card module 310, or the baseband subsystem 330 may not be included. In the case that the baseband subsystem 330 is not included, a baseband interface (not shown) may be provided on the main card module 310. The host card module may be configured to interface with the baseband subsystem 330 via a baseband interface to facilitate communication and/or signaling between the baseband subsystem 330 and the radio frequency integrated circuits (311, 13). Inside the main card module 310, the baseband interface is connected to the first rf integrated circuit 311 and the second rf integrated circuit 313.

In fig. 5, the signal processing system 300 is illustrated as including a sub-card module 320. It should be understood that, with suitable modifications, the solution of fig. 5 may also be applied in scenarios in which the signal processing system 300 comprises a plurality of secondary card modules 320. For example, in a multi-card multi-pass system, the signal processing system includes a main card module 310 and a plurality of sub-card modules 320. The main card module 310 may include a first rf integrated circuit 311, a plurality of second rf integrated circuits 313, and a plurality of self-calibration circuits 315. The plurality of second rf integrated circuits 313, the plurality of self-calibration circuits 315, and the plurality of sub-card modules 320 correspond one-to-one. Each self-calibration circuit 315 is connected to its corresponding second rf ic 313 and is used to calibrate its corresponding sub-card module 320.

As shown in fig. 5, the main card module 310 includes a first rf integrated circuit 311, a first front-end module (FEM) 312, a second rf integrated circuit 313, and a self-calibration circuit 315. Optionally, the signal processing system 300 may further include a baseband subsystem 330. Secondary card module 320 includes second FEM 314.

The functions and structures of the first rf integrated circuit 311 and the second rf integrated circuit 313 are the same as or similar to those of the RFIC in fig. 3, the functions and structures of the first FEM 312 and the second FEM 314 are the same as or similar to those of the FEM in fig. 3, and the functions of the baseband subsystem 330 are the same as or similar to those of the baseband subsystem 330 in fig. 3, which is not repeated herein.

The first rf integrated circuit 311 is configured to support receiving and/or transmitting rf signals corresponding to the first SIM. The first FEM 312 is connected to the first rf integrated circuit 311, and the first FEM 312 includes rf front-end devices matched to the first rf integrated circuit 311. The first rf integrated circuit 311 and the first FEM 312 are commonly part of the rf subsystem corresponding to the first SIM.

Optionally, the first rf integrated circuit 311 includes a receiving link and a transmitting link, and the first FEM 312 includes a receiving front-end circuit and a transmitting front-end circuit. The receiving link and the receiving front-end circuit form a radio frequency receiving channel corresponding to the first SIM. And the transmitting link and the transmitting front-end circuit form a radio frequency transmitting channel corresponding to the first SIM.

In some examples, a PA, LNA, and filter may be included in the first FEM 312. Alternatively, the filter may be a duplex filter.

The second rf integrated circuit 313 is configured to support receiving and/or transmitting rf signals corresponding to the second SIM. Second FEM 314 includes rf front-end devices that are matched to second rf integrated circuit 313. The second rf ic 313 and the second FEM 314 are commonly part of the rf subsystem corresponding to the second SIM.

Optionally, the second rf integrated circuit 313 includes a receiving link and a transmitting link, and the second FEM 314 includes a receiving front-end circuit and a transmitting front-end circuit. And the receiving link and the receiving front-end circuit form a radio frequency receiving channel corresponding to the second SIM. And the transmitting link and the transmitting front-end circuit form a radio frequency transmitting channel corresponding to the second SIM. The second rf integrated circuit 313 and the second FEM 314 may be coupled to each other through an interface between the main card module 310 and the sub card module 320.

A self-calibration circuit 315 is connected to the second rf integrated circuit 313, the self-calibration circuit 315 being used to calibrate the second FEM 314 matched to the second rf integrated circuit 313.

In some examples, the main card module 310 is further provided with a baseband subsystem 330, the baseband subsystem 330 is respectively connected to the first rf integrated circuit 311 and the second rf integrated circuit 313, and the baseband subsystem 330 may further communicate with a main processor (e.g., the processing system 220 in fig. 2) in the terminal device to control the first rf integrated circuit 311 and/or the second rf integrated circuit 313 to perform corresponding operations according to instructions sent by the main processor.

Fig. 6 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. In the main card module 310 in fig. 6, the first rf integrated circuit 311 and the second FEM 312 are omitted for simplicity. As shown in fig. 6, the main card module 310 and the sub card module 320 may be connected via an interface. In some examples, the master card module 310 includes a calibration master interface a1, a transmit master interface a2, and a receive master interface A3. The sub-card module 320 includes a calibration sub-interface B1, a transmission sub-interface B2, and a reception sub-interface B3.

In some examples, the calibration primary interface a1 is used to couple with the calibration secondary interface B1, and the calibration primary interface a1 is connected to the self-calibration circuit 315 in the primary card module 310, and the calibration secondary interface B1 is used to connect to the second FEM 314 in the secondary card module 320. For example, the calibration sub-interface B1 may be connected to the reception front-end circuit and the transmission front-end circuit in the second FEM.

In some examples, the receiving main interface A3 is used to couple with the receiving sub-interface B3, the receiving main interface A3 is connected to the receiving link in the second rf ic 313, and the receiving sub-interface B3 is used to connect with the receiving front-end circuit in the second FEM 314 in the sub-card module 320.

In other words, the receiving front-end circuit in the second FEM 314 and the receiving link in the second rf integrated circuit 313 are matched with each other and are components in the rf receiving channel corresponding to the second SIM. The rf receive channel may receive an rf signal via an antenna, process the rf signal to obtain a baseband signal, and transmit the baseband signal to the baseband subsystem 330.

In some examples, the transmitting main interface a2 is used to couple with the transmitting sub-interface B2, the transmitting main interface a2 is connected to the transmitting link in the second rf ic 313, and the receiving sub-interface B3 is used to connect with the transmitting front-end circuit in the second FEM 314 in the sub-card module 320.

In other words, the transmitting front-end circuit in the second FEM 314 and the transmitting link in the second rf integrated circuit 313 are matched with each other and are components of the rf transmitting channel corresponding to the second SIM. The rf transmit channel may receive baseband signals from the baseband subsystem 330, process the baseband signals to obtain rf signals, and transmit the rf signals through an antenna.

Optionally, a plurality of rf subsystems corresponding to the second SIM may be included in the signal processing system 300. In other words, the second rf integrated circuit 313 may include a plurality of receiving chains and a plurality of transmitting chains, and the second FEM 314 in the sub-card module 320 may also include a plurality of receiving front-end circuits and a plurality of transmitting front-end circuits. Accordingly, the main card module 310 and the sub card module 320 may also be provided with a plurality of calibration main/sub interfaces (a1/B1), a plurality of reception main/sub interfaces (A3/B3), and a plurality of transmission main/sub interfaces (a2/B2), respectively.

For example, the plurality of transmission links correspond to the plurality of transmission main interfaces a2 one to one, the plurality of reception links correspond to the plurality of reception main interfaces A3 one to one, the plurality of transmission front-end circuits correspond to the plurality of transmission sub-interfaces B2 one to one, and the plurality of reception front-end circuits correspond to the plurality of reception sub-interfaces B3 one to one. The plurality of transmitting chains + receiving chains are in one-to-one correspondence with the plurality of calibration main interfaces a1, and the plurality of receiving front-end circuits + transmitting front-end circuits are in one-to-one correspondence with the plurality of calibration sub-interfaces B1.

Fig. 7 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. As shown in fig. 7, the self-calibration circuit 315 includes a multiplexer unit 350. It should be noted that, if the second SIM corresponds to a plurality of rf subsystems, the self-calibration circuit 315 may include a plurality of multiplexing units 350, and the plurality of multiplexing units 350 correspond to the plurality of rf subsystems one to one. Each rf subsystem includes a rf transmit channel and a receive channel. The self-calibration circuit 315 including a multiplexer unit 350 will be described as an example.

As shown in fig. 7, the multiplexing unit 350 includes a plurality of inputs C1-C3 and an output D connected to the calibration master interface a1 of the master card module 310.

The inputs of the multiplexing unit 350 include, but are not limited to, the following terminals:

A. antenna input C1.

The antenna end is used for being connected with an antenna corresponding to the second SIM, and the antenna corresponding to the second SIM can also be called as a secondary card antenna.

B. Reference signal input terminal C2.

The reference signal input is for receiving a reference signal from the transmit chain of the second rf integrated circuit 313.

Alternatively, the circuitry in the main card module 310 may be calibrated on-line, hereinafter the calibration of the main card module on-line is referred to as initial calibration, and the calibration of the sub-card module after coupling with the main card module during subsequent product assembly is referred to as self-calibration of the sub-card module. Thus, the second rf integrated circuit 313 is a circuit that has been initially calibrated. In some examples, on the production line of the main card module 310, the second rf integrated circuit 313 in the main card module 310 may be calibrated by an external meter, and the electrical parameters of the second rf integrated circuit 313 are configured according to the calibration result.

Alternatively, the reference signal may be a signal for initially calibrating the second rf integrated circuit 313. The reference signals may include signals of different frequency bands and/or different powers.

Optionally, the multiplexing unit 350 may include one or more reference signal inputs C2. Different reference signal inputs C2 are used to output reference signals of different frequency bands. For example, the reference signal may include at least one of: a low-band reference signal, a medium-high band reference signal and a super high band reference signal.

C. Input terminal C3 is connected to ground.

The ground input C3 is used to connect to ground through a ground resistor.

The operation principle of the multiplexer unit 350 is as follows:

i) in case the sub-card module 320 is operating normally, the multiplexing unit 350 may switch the output terminal D to the antenna input terminal C1. In this case, the second rf integrated circuit 313, the second FEM 314, and the antenna are connected to each other, and normal transmission and reception of rf signals can be performed.

ii) in case of a need to calibrate the receiving front-end circuitry in the sub-card module 320, the multiplexing unit 350 may switch the output D to the reference signal input C2. In this case, the receiving front-end circuit may receive the reference signal through the calibration sub-interface B1 and output a measurement signal of the receiving front-end circuit through the receiving sub-interface B3. Alternatively, in the case where a plurality of reference signal input terminals C2 are included, the multiplexing unit 350 may sequentially switch the output terminal D to different reference signal input terminals C2, so that the receiving front-end circuit receives reference signals of different frequency bands and outputs measurement signals in different frequency bands.

Optionally, the receiving front-end circuit comprises an rf front-end device matched to the receiving chain in the second rf integrated circuit 313, an input of the receiving front-end circuit is connected to the calibration sub-interface B1, and an output of the receiving front-end circuit is connected to the receiving sub-interface B3.

Optionally, as shown in fig. 7, in some examples, the transmission front-end circuit includes a power amplifier and a second filter, an input of the power amplifier is connected to an input of the transmission front-end circuit, an output of the power amplifier is connected to an input of the second filter, and an output of the second filter is connected to an output of the transmission front-end circuit.

The filter in fig. 7 is a duplex filter. The filter may be applied to both the transmit front-end circuit and the receive front-end circuit. The second filter described above can be understood as a part of the duplex filter in fig. 7.

As can be seen from fig. 7, after receiving the reference signal output by the transmission link, the receiving front-end circuit may output the measurement signal of the receiving front-end circuit to the receiving link in the main card module 310 through the receiving sub-interface B3. After receiving the measurement signal of the receiving front-end circuit, the receiving link in the main card module 310 may continue to output the measurement signal after passing through the receiving link to the upper calibration processing module, so that the upper calibration processing module calibrates the electrical parameter of the receiving front-end circuit based on the received signal. Specifically, since the reference signal is a signal that has been calibrated before the main card module 310 leaves the factory, the reference signal may be considered as a standard signal. Therefore, the calibration processing module can compare the reference signal with the measurement signal passing through the receiving link and calibrate the electrical parameters of the receiving front-end circuit according to the comparison result. The calibration processing module may be located in the second rf ic 313, or may be located in the baseband subsystem 330 of the main card module 310. Or may be located in other types of processors.

iii) in case of a need to calibrate the transmit front-end circuitry in the sub-card module 320, the multiplexing unit 350 may switch the output D to the ground input C3, where the transmit front-end circuitry receives the reference signal from the transmit chain through the transmit sub-interface B2 and outputs the measurement signal of the transmit front-end circuitry through the calibration sub-interface B1. Optionally, the reference signals may include reference signals of different frequency bands, and the transmission link may sequentially send the reference signals of different frequency bands to the transmission front-end circuit, so as to obtain measurement signals of the transmission front-end circuit in different frequency bands.

Optionally, the transmit front-end circuit includes a radio frequency front-end device matched with a transmit chain in the second radio frequency integrated circuit 313, an input end of the transmit front-end circuit is connected to the transmit sub-interface B2, and an output end of the transmit chain circuit is connected to the calibration sub-interface B1.

Optionally, as shown in fig. 7, in some examples, the receiving front-end circuit includes a first filter and a low noise amplifier, an input of the first filter is connected to an input of the receiving front-end circuit, an output of the first filter is connected to an input of the low noise filter, and an output of the low noise filter is connected to an output of the receiving front-end circuit.

The filter in fig. 7 is a duplex filter. The filter may be applied to both the transmit front-end circuit and the receive front-end circuit. The first filter described above can be understood as a part of the duplex filter in fig. 7.

Optionally, as shown in fig. 7, the self-calibration circuit 315 further includes: a coupling circuit 360, said coupling circuit 360 being configured to sense a measurement signal of said transmitting front-end circuit passing through a ground input terminal C3 of said multiplexing unit 350 and output the sensed signal. In some examples, the coupling circuit 360 includes a coupling inductor, the coupling inductor is configured to be coupled to the ground input terminal C3 of the multiplexing unit 350, a first terminal of the coupling inductor is grounded, and a second terminal of the coupling inductor is configured to output the measurement signal of the transmitting front-end circuit induced by the coupling inductor. As an example, the coupling inductor may be connected to ground through a ground resistor.

In other words, as can be seen from fig. 7, after the transmitting front-end circuit receives the reference signal from the transmitting link, the measurement signal of the transmitting front-end circuit can be output to the self-calibration circuit 315 through the calibration sub-interface B1 and the calibration main interface a 1. The coupling circuit 360 in the self-calibration circuit 315 may sense and output the measurement signal of the transmit front-end circuit described above.

As shown in fig. 7, in some examples, the main card module 310 further includes a measurement receiving circuit therein for receiving a measurement signal of the transmission front-end circuit from the coupling circuit. Alternatively, the measurement receiving circuit may be disposed in the second rf integrated circuit 313, or may be disposed in other circuit modules in the main card module 310. After receiving the measurement signal of the transmitting front-end circuit, the measurement receiving circuit may continue to output the measurement signal to the upper calibration processing module, so that the upper calibration processing module calibrates the electrical parameter of the transmitting front-end circuit based on the received signal. The calibration processing module may be located in the second rf integrated circuit 313, or may be located in the baseband subsystem 330 in the main card module 310. Or may be located in other types of processors.

Optionally, the measurement receiving circuitry in the master card module 310 may also be calibrated at the time of initial calibration. In some examples, on the production line of the main card module 310, the measurement receiving circuit may be calibrated by an external meter, and an electrical parameter of the measurement receiving circuit may be configured according to the calibration result. In particular, the electrical parameters of the measurement receiving circuit may be calibrated for the case where the measurement receiving circuit is receiving reference signals in different frequency bands and/or different frequencies.

In the solution of the embodiment of the present application, before a product leaves a factory, only the radio frequency circuit in the main card module 310 may be calibrated, and the circuit in the sub card module 320 does not need to be calibrated. For example, only the first rf integrated circuit 311, the first FEM 312, and the second rf integrated circuit 313 are calibrated. Wherein the main card module 310 can calibrate the second rf ic 313 using an external meter. In a later device assembly process, if the main card module 310 and the sub-card module 320 are coupled to each other, the second FEM in the sub-card module 320 may be self-calibrated by using the self-calibration circuit 315 in the main card module 310 under the condition that the main card module 310 and the sub-card module 320 are powered on. That is, the sub-card module 320 may be calibrated when the device is assembled after the factory shipment, so that the mode production of the main card module 310 and the sub-card module 320 may be realized, and the self-calibration of the sub-card module 320 after the factory shipment may be realized.

In addition, information of the reference signal for initial calibration may be stored in the main card module 310 to facilitate calibration of the circuit in the sub-card module 320 using the reference signal.

Fig. 8 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. As shown in fig. 8, the signal processing system 300 is described by taking two transmit chains (TX1, TX2) and two receive chains (RX1, RX2) as an example in the second rf integrated circuit 313.

As shown in FIG. 8, the self-calibration circuit includes two multiplexing units (350-1, 350-2). The multiplexing unit 350-1 corresponds to the first transmission link TX1 and the first reception link RX 1. The multiplexing unit 350-2 corresponds to the second transmit chain TX2, the second receive chain RX 2. Also included in the main card module 310 is a measurement receiving circuit MRX. The multiplexer 350-1 corresponds to the calibration master interface A1-1, and the multiplexer 350-2 corresponds to the calibration master interface A1-2. The first transmit link TX1 corresponds to the transmit master interface a 2-1. The first receive link RX1 corresponds to the receive primary interface A3-1 and the second receive link RX2 corresponds to the receive primary interface A3-2. The interfaces on the sub-card module correspond to the interfaces on the main card module one to one, and are not described herein for brevity. In addition, for clarity of illustration, the transmission front-end circuit and corresponding interface corresponding to the second transmission link TX2 are omitted in fig. 8.

As shown in fig. 8, the inputs of the multiplexing unit 350-1 include an antenna input, a ground input, and three reference signal inputs. The three reference signal input ends are respectively used for receiving reference signals CAL _ LB, CAL _ MHB and CAL _ UHB. The signal processing method includes that CAL _ LB, CAL _ MHB and CAL _ UHB are used for representing a low-frequency band reference signal, a medium-high band reference signal and a super-high band reference signal respectively.

In an initial calibration phase, the main card module may perform calibration based on the reference signals CAL _ LB, CAL _ MHB, and CAL _ UHB, and store information of the corresponding electrical parameters and the reference signals. Optionally, the reference signal will also be used for self-calibration of the secondary card module.

In the initial calibration stage, the main card module may also calibrate the measurement receiving circuit MRX based on the reference signals CAL _ LB, CAL _ MHB, and CAL _ UHB, and store information of corresponding electrical parameters and reference signals.

Fig. 9 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. Fig. 9 shows a scenario for self-calibrating the receive front-end circuitry in the secondary card module 320. As shown in fig. 9, the multiplexing units (350-1, 350-2) sequentially switch the output terminals to three reference signal input terminals, and the transmission links (TX1, TX2) output reference signals CAL _ LB, CAL _ MHB, or CAL _ UHB of different frequency bands through the reference signal input terminals. The receiving front-end circuit in the sub-card module 320 receives the reference signal CAL _ LB, CAL _ MHB, or CAL _ UHB from the transmission link TX1 through the receiving sub-interface (B1-1, B1-2). The receiving link (RX1, RX2) in the main card module 310 may continue to output the measurement signal after passing through the receiving link (RX1, RX2) to the calibration processing module at the upper layer after receiving the measurement signal of the receiving front-end circuit, so that the calibration processing module at the upper layer calibrates the electrical parameter of the receiving front-end circuit based on the received signal.

Fig. 10 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. Fig. 10 shows a scenario for self-calibration of the transmit front-end circuitry in the sub-card module 320, as shown in fig. 10, with the multiplexer unit 350-1 switching the output to the ground input. The transmitting front-end circuit receives the reference signals CAL _ LB, CAL _ MHB or CAL _ UHB output by the transmitting link TX1 through the transmitting sub-interface B2-1, and sends the measuring signals of the transmitting front-end circuit to the output end of the multi-path selection unit 350-1 through the calibrating sub-interface B1-1. And a coupling circuit in the self-calibration circuit senses and outputs a measurement signal of the transmitting front-end circuit, and a measurement receiving circuit MRX receives the measurement signal. After receiving the measurement signal of the transmitting front-end circuit, the measurement receiving circuit MRX may continue to output the measurement signal to the upper calibration processing module, so that the upper calibration processing module calibrates the electrical parameter of the transmitting front-end circuit based on the received signal.

Alternatively, the transmission link TX1 may send reference signals of different frequency bands to the transmission front-end circuit through the transmission sub-interface a 2-1. For example, the reference signals may include, but are not limited to, reference signals CAL _ LB, CAL _ MHB, or CAL _ UHB.

Fig. 11 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. Fig. 11 shows a scenario in which the signal processing system 300 is in normal operation, i.e. the signal processing system 300 is in traffic mode. As shown in fig. 11, in traffic mode, the multiplexing units (350-1, 350-2) switch the outputs to the antenna inputs. The signal processing system 300 may perform normal transceiving operation of the radio frequency signal based on the electrical parameter after the sub-card module performs self-calibration.

Fig. 12 is a schematic structural diagram of a signal processing system 300 according to yet another embodiment of the present application. Fig. 12 is a schematic diagram showing a configuration in which the signal processing system 300 is applied to a single card system. As shown in fig. 12, in the case of being applied to the one-card system, only the main card module 310 is included in the signal processing system 300.

In this embodiment of the present application, on a main card module production line, calibration of a transmitter and a receiver may be performed on a radio frequency circuit corresponding to a first SIM in a main card module, and initial calibration may be performed on a second radio frequency integrated circuit 313, and information of an electrical parameter and a reference signal after calibration may be stored, so as to implement self calibration of a sub card module in a subsequent product assembly process. On the production line of the sub-card module, the sub-card module may not be calibrated.

In some examples, for a signal processing system supporting a single card system, only the main card module may be packaged during product assembly of the signal processing system, and the signal processing system may perform normal transceiving operation of radio frequency signals after being powered on.

In some examples, for a signal processing system supporting a dual-card dual-pass or multi-card multi-pass specification, the primary card module and the secondary card module may be packaged during product assembly of the signal processing system. After the primary power-on, the main card module can complete the self-calibration of the auxiliary card module through the self-calibration circuit, and after the self-calibration of the auxiliary card module is completed, the normal receiving and transmitting operation of the radio frequency signal is carried out.

In the embodiment of the application, the main card module and the auxiliary card module in the signal processing system adopt a modular design, so that the production and the assembly of products are facilitated. In addition, after the main card module and the auxiliary card module are coupled with each other and powered on, the auxiliary card module can realize self calibration based on the main card module, and the auxiliary card module does not need to be calibrated on a factory front line additionally, so that the production efficiency of products is improved.

Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the implementation. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working processes of the above-described systems, apparatuses and units may refer to the corresponding processes in the foregoing method embodiments, and are not described herein again.

In the several embodiments provided in the present application, it should be understood that the disclosed system, apparatus and method may be implemented in other ways. For example, the above-described apparatus embodiments are merely illustrative, and for example, the division of the units is only one logical division, and other divisions may be realized in practice, for example, a plurality of units or components may be combined or integrated into another system, or some features may be omitted, or not executed. In addition, the shown or discussed mutual coupling or direct coupling or communication connection may be an indirect coupling or communication connection through some interfaces, devices or units, and may be in an electrical, mechanical or other form.

The units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units can be selected according to actual needs to achieve the purpose of the solution of the embodiment.

In addition, functional units in the embodiments of the present application may be integrated into one processing unit, or each unit may exist alone physically, or two or more units are integrated into one unit.

The functions, if implemented in the form of software functional units and sold or used as a stand-alone product, may be stored in a computer readable storage medium. Based on such understanding, the technical solution of the present application or portions thereof that substantially contribute to the prior art may be embodied in the form of a software product stored in a storage medium and including instructions for causing a computer device (which may be a personal computer, a server, or a network device) to execute all or part of the steps of the method according to the embodiments of the present application. And the aforementioned storage medium includes: various media capable of storing program codes, such as a usb disk, a removable hard disk, a read-only memory (ROM), a Random Access Memory (RAM), a magnetic disk, or an optical disk.

The above description is only for the specific embodiments of the present application, but the scope of the present application is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present application, and shall be covered by the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

A signal processing system, comprising: main card module and vice card module, main card module includes:

the first radio frequency integrated circuit is used for supporting receiving and/or sending a radio frequency signal corresponding to a first Subscriber Identity Module (SIM);

a first front-end module FEM connected to the first RF integrated circuit, the first FEM including an RF front-end device matched to the first RF integrated circuit;

the second radio frequency integrated circuit is used for supporting receiving and/or sending radio frequency signals corresponding to a second SIM;

and the self-calibration circuit is connected with the second radio frequency integrated circuit and used for calibrating a second FEM matched with the second radio frequency integrated circuit, the second FEM is arranged on the secondary card module, and the main card module and the secondary card module are modules capable of being mutually coupled or separated.
The system of claim 1, wherein the master card module further comprises:

the calibration main interface is used for being mutually coupled with a calibration auxiliary interface in the auxiliary card module and is connected with the self-calibration circuit;

the receiving main interface is used for being mutually coupled with a receiving auxiliary interface in the auxiliary card module and is used for being connected with a receiving link in the second radio frequency integrated circuit;

and the transmitting main interface is used for being mutually coupled with the transmitting auxiliary interface in the auxiliary card module and is connected with a transmitting link in the second radio frequency integrated circuit.
The system of claim 2, wherein the self-calibration circuit comprises a multiplexing unit including a plurality of inputs and an output for connection to a calibration host interface of the host card module;

the plurality of inputs includes: the antenna input end is used for being connected with an antenna corresponding to the second SIM;

wherein the multiplexing unit is configured to: and under the condition that the auxiliary card module works normally, the output end is switched to the antenna input end.
The system of claim 3, wherein the plurality of inputs of the multiplexing unit further comprises:

a reference signal input for receiving a reference signal from a transmit chain of the second radio frequency integrated circuit.
The system of claim 4, wherein the second FEM comprises:

the receiving front-end circuit comprises a radio frequency front-end device matched with a receiving link in the second radio frequency integrated circuit, the input end of the receiving front-end circuit is connected with the calibration sub-interface, and the output end of the receiving front-end circuit is connected with the receiving sub-interface;

the multiplexing unit is configured to: and under the condition of calibrating the receiving front-end circuit, switching the output end to the reference signal input end, wherein the receiving front-end circuit is used for receiving the reference signal and outputting a measuring signal of the receiving front-end circuit.
The system of claim 5, wherein the receive front-end circuit comprises a first filter and a low noise amplifier, an input of the first filter being coupled to an input of the receive front-end circuit, an output of the first filter being coupled to an input of the low noise filter, an output of the low noise filter being coupled to an output of the receive front-end circuit.
The system of any of claims 3 to 6, wherein the plurality of inputs of the multiplexing unit further comprises:

and the grounding input end is used for being connected with the ground through a grounding resistor.
The system of claim 7, wherein the second FEM comprises:

the transmitting front-end circuit comprises a radio frequency front-end device matched with a transmitting link in the second radio frequency integrated circuit, the input end of the transmitting front-end circuit is connected with the transmitting sub-interface, and the output end of the transmitting link circuit is connected with the calibrating sub-interface;

the multiplexing unit is configured to: and under the condition of calibrating the transmitting front-end circuit, switching the output end to the grounding input end, wherein the transmitting front-end circuit is used for receiving a reference signal from the transmitting link and outputting a measuring signal of the transmitting front-end circuit, and the reference signal is a calibrated signal.
The system of claim 8, wherein the self-calibration circuit further comprises:

and the coupling circuit is used for sensing and outputting the measurement signal of the transmitting front-end circuit passing through the grounding input end of the multi-path selection unit.
The system of claim 9, wherein the coupling circuit comprises a coupling inductor, the coupling inductor is configured to couple with a ground input of the multiplexing unit, a first terminal of the coupling inductor is grounded, and a second terminal of the coupling inductor is configured to output a measurement signal of the transmitting front-end circuit induced by the coupling inductor.
The system of any of claims 8 to 10, wherein the transmit front-end circuit comprises a power amplifier and a second filter, an input of the power amplifier being connected to an input of the transmit front-end circuit, an output of the power amplifier being connected to an input of the second filter, an output of the second filter being connected to an output of the transmit front-end circuit.
The system of any one of claims 8 to 11, wherein the reference signals comprise at least one of: a low-band reference signal, a medium-high band reference signal and a super high band reference signal.
The system of any one of claims 1 to 12, wherein the master card module further comprises a baseband subsystem, the baseband subsystem being coupled to the first and second rf ics, respectively, the baseband subsystem being configured to process baseband signals.
A signal processing module, comprising: a master card module, the master card module comprising:

the first radio frequency integrated circuit is used for supporting receiving and/or sending a radio frequency signal corresponding to a first Subscriber Identity Module (SIM);

a first front-end module FEM connected to the first RF integrated circuit, the first FEM including an RF front-end device matched to the first RF integrated circuit;

the second radio frequency integrated circuit is used for supporting receiving and/or sending radio frequency signals corresponding to a second SIM;

and the self-calibration circuit is connected with the second radio frequency integrated circuit and used for calibrating a second FEM matched with the second radio frequency integrated circuit, the second FEM is arranged on the secondary card module, and the main card module and the secondary card module are modules capable of being mutually coupled or separated.
The module of claim 14, wherein the master card module further comprises:

the calibration main interface is used for being mutually coupled with a calibration auxiliary interface in the auxiliary card module and is connected with the self-calibration circuit;

the receiving main interface is used for being mutually coupled with a receiving auxiliary interface in the auxiliary card module and is used for being connected with a receiving link in the second radio frequency integrated circuit;

and the transmitting main interface is used for being mutually coupled with the transmitting auxiliary interface in the auxiliary card module and is connected with a transmitting link in the second radio frequency integrated circuit.
The module of claim 15, wherein the self-calibration circuit comprises a multiplexing unit including a plurality of inputs and an output for connection to a calibration host interface of the host card module;

the plurality of inputs includes: the antenna input end is used for being connected with an antenna corresponding to the second SIM;

wherein the multiplexing unit is configured to: and under the condition that the auxiliary card module works normally, the output end is switched to the antenna input end.
The module of claim 16, wherein the plurality of inputs of the multiplexing unit further comprises:

a reference signal input for receiving a reference signal from a transmit chain of the second radio frequency integrated circuit.
The module of claim 17, wherein the second FEM comprises:

the receiving front-end circuit comprises a radio frequency front-end device matched with a receiving link in the second radio frequency integrated circuit, the input end of the receiving front-end circuit is connected with the calibration sub-interface, and the output end of the receiving front-end circuit is connected with the receiving sub-interface;

the multiplexing unit is configured to: and under the condition of calibrating the receiving front-end circuit, switching the output end to the reference signal input end, wherein the receiving front-end circuit is used for receiving the reference signal and outputting a measuring signal of the receiving front-end circuit.
The module of claim 18, wherein the receive front-end circuit comprises a first filter and a low noise amplifier, an input of the first filter being coupled to an input of the receive front-end circuit, an output of the first filter being coupled to an input of the low noise filter, an output of the low noise filter being coupled to an output of the receive front-end circuit.
The module of any of claims 16 to 19, wherein the plurality of inputs of the multiplexing unit further comprises:

and the grounding input end is used for being connected with the ground through a grounding resistor.
The module of claim 20, wherein the second FEM comprises:

the transmitting front-end circuit comprises a radio frequency front-end device matched with a transmitting link in the second radio frequency integrated circuit, the input end of the transmitting front-end circuit is connected with the transmitting sub-interface, and the output end of the transmitting link circuit is connected with the calibrating sub-interface;

the multiplexing unit is configured to: and under the condition of calibrating the transmitting front-end circuit, switching the output end to the grounding input end, wherein the transmitting front-end circuit is used for receiving a reference signal from the transmitting link and outputting a measuring signal of the transmitting front-end circuit, and the reference signal is a calibrated signal.
The module of claim 21, wherein the self-calibration circuit further comprises:

and the coupling circuit is used for sensing and outputting the measurement signal of the transmitting front-end circuit passing through the grounding input end of the multi-path selection unit.
The module of claim 22, wherein the coupling circuit comprises a coupling inductor, the coupling inductor is configured to couple with a ground input terminal of the multiplexing unit, a first terminal of the coupling inductor is grounded, and a second terminal of the coupling inductor is configured to output a measurement signal of the transmitting front-end circuit induced by the coupling inductor.
The module of any of claims 21 to 23, wherein the transmit front-end circuit comprises a power amplifier and a second filter, an input of the power amplifier being connected to an input of the transmit front-end circuit, an output of the power amplifier being connected to an input of the second filter, an output of the second filter being connected to an output of the transmit front-end circuit.
[ correction 29.04.2020 according to rules 91 ] the module according to any one of claims 21 to 24, characterized in that the reference signals comprise at least one of the following reference signals: a low-band reference signal, a medium-high band reference signal and a super high band reference signal.
The module according to any of claims 14 to 25, wherein the master card module further comprises a baseband subsystem, the baseband subsystem being connected to the first rf ic and the second rf ic, respectively, the baseband subsystem being configured to process baseband signals.
A signal processing module, comprising: a secondary card module, the secondary card module comprising:

a second front-end module FEM, the second FEM including a radio frequency front-end device matched with a second radio frequency integrated circuit, the second radio frequency integrated circuit being disposed on the main card module, the main card module and the auxiliary card module being modules capable of being coupled or separated from each other;

and the calibration secondary interface is used for being connected with a calibration main interface in the main card module, the calibration main interface is used for being connected with a self-calibration circuit in the main card module, and the self-calibration circuit is used for calibrating the second FEM.
The module of claim 27, wherein said secondary card module further comprises:

the receiving auxiliary interface is used for being mutually coupled with a receiving main interface in the auxiliary card module, and the receiving main interface is used for being connected with a receiving link in the second radio frequency integrated circuit;

and the transmitting auxiliary interface is used for being mutually coupled with a transmitting main interface in the auxiliary card module, and the transmitting main interface is used for being connected with a transmitting link in the second radio frequency integrated circuit.
The module of claim 28, wherein the second FEM comprises:

and the receiving front-end circuit comprises a radio frequency front-end device matched with a receiving link in the second radio frequency integrated circuit, the input end of the receiving front-end circuit is connected with the calibration sub-interface, and the output end of the receiving front-end circuit is connected with the receiving sub-interface.
The module of claim 29, wherein the receive front-end circuit comprises a first filter and a low noise amplifier, an input of the first filter being coupled to an input of the receive front-end circuit, an output of the first filter being coupled to an input of the low noise filter, an output of the low noise filter being coupled to an output of the receive front-end circuit.
The module of any of claims 28-30, wherein the second FEM comprises:

and the transmitting front-end circuit comprises a radio frequency front-end device matched with a transmitting link in the second radio frequency integrated circuit, the input end of the transmitting front-end circuit is connected with the transmitting sub-interface, and the output end of the transmitting link circuit is connected with the calibrating sub-interface.
The module of claim 31, wherein the transmit front-end circuit comprises a power amplifier and a second filter, an input of the power amplifier being coupled to an input of the transmit front-end circuit, an output of the power amplifier being coupled to an input of the second filter, an output of the second filter being coupled to an output of the transmit front-end circuit.
A terminal device, characterized in that it comprises a signal processing system according to any one of claims 1 to 13.
A terminal device, characterized in that it comprises a signal processing module according to any one of claims 14 to 26.
An integrated circuit board, characterized in that the integrated circuit board is provided with a signal processing module according to any one of claims 14 to 26.
An integrated circuit board, characterized in that the integrated circuit board is provided with a signal processing module according to any one of claims 27 to 32.