CN113411951B - Shielding structure of circuit board and electronic device with shielding structure - Google Patents
Shielding structure of circuit board and electronic device with shielding structure Download PDFInfo
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- CN113411951B CN113411951B CN202110546459.1A CN202110546459A CN113411951B CN 113411951 B CN113411951 B CN 113411951B CN 202110546459 A CN202110546459 A CN 202110546459A CN 113411951 B CN113411951 B CN 113411951B
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- circuit board
- insulating layer
- external
- shielding structure
- retaining wall
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
- H05K1/0224—Patterned shielding planes, ground planes or power planes
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- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention relates to the technical field of noise shielding, and discloses a shielding structure of a circuit board and an electronic device with the shielding structure, wherein the electronic device with the shielding structure comprises: the shielding structure comprises a shielding film and a grounding conducting piece which is electrically arranged on the circuit board; the shielding film comprises two insulating layers and a metal layer sandwiched between the two insulating layers to form a sandwich structure; the insulating layer is attached to the circuit board and provided with an opening, and the metal layer is exposed through the opening to form a conducting connection part, so that the shielding film can be electrically conducted to the grounding conducting connection piece through the exposed conducting connection part to be grounded. Therefore, the complete noise shielding effect and the effective noise grounding effect can be achieved.
Description
The invention is applied by division, the application number of the original application is 201811054115.3, and the application date is 2018, 9 and 11.
Technical Field
The present invention relates to the field of noise shielding technologies, and in particular, to a shielding structure of a circuit board and an electronic device having the shielding structure.
Background
In order to realize wireless transmission, the electronic device is equipped with a wireless radio frequency element, but since the circuit board in the electronic device has many signals with different frequencies, and these signals are noise to the wireless radio frequency element, the circuit board must be isolated from the ground.
The existing isolation structure comprises a metal retaining wall protruding out of the metal casing and a conductive retaining wall protruding out of the circuit board and corresponding to the metal retaining wall. The circuit board is arranged in the metal casing, so that the metal retaining wall and the guide retaining wall are mutually butted and conducted to jointly form the retaining wall assembly. The retaining wall component encloses the circuit board frame into a plurality of blocks, so that noise in each block is isolated and grounded to prevent the noise from flowing outwards, and further the influence on the radio frequency element is reduced.
However, since the housing has design limitations such as heat pipes or input/output ports, the metal wall with these designs must be broken to form a break, resulting in a defect that noise escapes from the break and cannot be completely isolated in the wall assembly.
Disclosure of Invention
The invention aims to provide a shielding structure of a circuit board and an electronic device with the shielding structure, which can completely shield and ground noise.
In order to achieve the above object, the present invention provides a shielding structure of a circuit board for shielding the circuit board, the shielding structure comprising: at least one grounding conducting piece, which is electrically arranged on the circuit board; and a shielding film comprising: a first insulating layer; the second insulating layer is attached to the circuit board, and at least one opening is formed in the second insulating layer corresponding to at least one grounding conducting connector; and the metal layer is spliced between the first insulating layer and the second insulating layer and is exposed through at least one opening to form at least one conducting connection part, wherein the shielding film is electrically connected with at least one grounding conducting piece through at least one conducting connection part to be grounded.
The present invention also provides an electronic device having a shielding structure, comprising: a housing; the circuit board is arranged in the shell; and a shielding structure, the shielding structure comprising: at least one grounding conducting piece, which is electrically arranged on the circuit board; and a shielding film comprising: a first insulating layer; the second insulating layer is attached to the circuit board, and at least one opening is formed in the second insulating layer corresponding to at least one grounding conducting connector; the metal layer is overlapped between the first insulating layer and the second insulating layer and is exposed through at least one opening to form at least one conducting connection part; the shielding film is electrically connected to at least one grounding conductive member through at least one conductive connection portion and is grounded.
The present invention also provides an electronic device having a shielding structure, comprising: a housing; the external retaining wall component is arranged on the casing corresponding to the retaining wall notch and is electrically connected with the casing in a conductive manner; the circuit board is arranged in the shell; and a shielding structure, the shielding structure comprising: at least one grounding conducting piece, which is electrically arranged on the circuit board; and a shielding film comprising: a first insulating layer; the second insulating layer is attached to the circuit board, and at least one opening is formed in the second insulating layer corresponding to at least one grounding conducting connector; the metal layer is overlapped between the first insulating layer and the second insulating layer and is exposed through at least one opening to form at least one conducting connection part; the shielding film is electrically connected to at least one grounding conductive member through at least one conductive connection portion and is grounded.
The invention has the beneficial effects that: compared with the prior art, the shielding structure of the circuit board disclosed by the invention can effectively and completely shield noise and ground the noise so as to reduce the influence on the radio frequency element.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings used in the description of the embodiments of the present invention will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the contents of the embodiments of the present invention and the drawings without creative efforts.
Fig. 1 is an exploded perspective view of an electronic device with a shielding structure according to an embodiment of the present invention.
Fig. 2 is a partial top view of fig. 1 after assembly.
Fig. 3 is a schematic cross-sectional view of a shielding film in an electronic device having a shielding structure according to an embodiment of the present invention.
Fig. 4 is a schematic cross-sectional view of a shielding structure and a circuit board in an electronic device with the shielding structure according to an embodiment of the present invention when contacts are conducted.
Fig. 5 is an exploded perspective view of an external retaining wall component in an electronic device with a shielding structure according to an embodiment of the present invention.
Fig. 6 is a perspective assembly view of fig. 5 from another perspective.
Fig. 7 is a schematic cross-sectional view of an external retaining wall assembly and a shielding film in an electronic device with a shielding structure according to an embodiment of the present invention before contact conduction.
Detailed Description
In order to make the technical problems solved, technical solutions adopted and technical effects achieved by the present invention clearer, the technical solutions of the embodiments of the present invention will be described in further detail below with reference to the accompanying drawings. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc., indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Wherein the terms "first position" and "second position" are two different positions.
In the description of the present invention, it should be noted that the terms "mounted," "connected," and "connected" are to be construed broadly and encompass, for example, both fixed and removable connections unless otherwise explicitly stated or limited; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
As shown in fig. 1 and fig. 2, the present invention provides a shielding structure of a circuit board and an electronic device having the shielding structure, wherein the electronic device having the shielding structure includes a housing 900, a circuit board 800 and a shielding structure 100. The inner surface of the metal chassis 900 is provided with a plurality of metal retaining walls 9, two surfaces (or any surface) of the circuit board 800 are provided with a plurality of conductive retaining walls 8, and each conductive retaining wall 8 disposed on one surface (not shown) of the circuit board 800 corresponds to each metal retaining wall 9, so that when the circuit board 800 is disposed in the chassis 900, each conductive retaining wall 8 on one surface of the circuit board 800 and each metal retaining wall 9 are abutted against each other and conducted to jointly form a retaining wall assembly (not shown), and the shielding structure 100 is used for shielding the circuit board 800.
As shown in fig. 1 to 4, the shielding structure 100 includes at least one grounding conductive member 1, a shielding film 2 and an external retaining wall component 3, the grounding conductive member 1 can be any elastic conductive member, and the grounding conductive member 1 in this embodiment includes a flexible metal sheet 11 and an elastic supporting body 12. The flexible metal sheet 11 is wrapped around the elastic supporting body 12 to form the grounding lead 1 having the elastic deformation function. The flexible metal sheet 11 can be any metal sheet, and the flexible metal sheet 11 is an aluminum sheet in this embodiment. The elastic support 12 can be any object having an elastic support function, such as a sponge, a foam, a spring, or a spring plate, and the elastic support 12 of the present embodiment is exemplified by a foam.
The grounding conducting piece 1 is electrically connected to the circuit board 800; specifically, the circuit board 800 is electrically configured with at least one board connecting portion 81, and the flexible metal sheet 11 of the ground connector 1 is soldered to the board connecting portion 81 to be electrically connected to each other. The number of the ground connecting members 1 may be one, or two or more, which is not limited in the present invention, and the number of the ground connecting members 1 is determined according to the requirement.
The shielding film 2 includes a first insulating layer 21, a second insulating layer 22, and a metal layer 23 laminated on each other. The metal layer 23 is stacked between the first insulating layer 21 and the second insulating layer 22, and the second insulating layer 22 is provided with a plurality of openings 221 corresponding to the grounding conductive connection members 1, so that the metal layer 23 can be exposed through the openings 221 to form a plurality of conductive connection portions 231. The size of the shielding film 2 is not limited in the present invention as long as it covers any one surface or a partial area of any one surface of the circuit board 800.
The shielding film 2 has a plurality of grooves G corresponding to the conductive barriers 8 on the circuit board 800, so that the conductive barriers 8 can be exposed through the grooves G, and are easily connected and conducted with the metal barriers 9.
The second insulating layer 22 of the shielding film 2 is attached to one surface of the circuit board 800 by a back adhesive or a double-sided adhesive (not shown), so that the conductive portions 231 are pressed against the ground conductive members 1 to electrically connect with each other. The present invention can also fix the shielding film 2 on the circuit board 800 by a plurality of screw elements (not shown), and attach the second insulating layer 22 of the shielding film 2 to one side of the circuit board 800 after the shielding film 2 is fixed on the circuit board 800. The shielding film 2 may be attached to only a partial area of one surface of the circuit board 800, instead of being attached to the entire surface of the one surface of the circuit board 800.
In this way, even if the metal retaining wall 9 on the housing 900 is broken, the noise from the circuit board 800 is still shielded in the shielding film 2, and the noise is grounded through the conductive portions 231 and the ground conductors 1 from the metal layer 23, so that the influence of the noise on the radio frequency device (not shown in the figure) disposed in the electronic apparatus with the shielding structure is reduced.
Preferably, the shielding film 2 may be a full-edge-sealed thin film structure, as shown in fig. 3, the areas of the first insulating layer 21 and the second insulating layer 22 are larger than the area of the metal layer 23, so that the first insulating layer 21 has a first periphery 212 protruding from the metal layer 23, the second insulating layer 22 has a second periphery 222 protruding from the metal layer 23, and the first periphery 212 and the second periphery 222 are adhered to each other, so that the metal layer 23 is completely covered in the first insulating layer 21 and the second insulating layer 22, thereby forming a full-edge-sealed thin film structure. In this way, even if the shielding film 2 has the metal layer 23, it never comes into contact with a nearby electronic component to cause a short circuit.
In other embodiments, the first periphery 212 and the second periphery 222 may not be adhered to each other and only protrude from the metal layer 23, and even if a nearby electronic component is erroneously contacted to the shielding film 2, only the first periphery 212 and the second periphery 222 protruding from the metal layer 23 are contacted, so that the short circuit effect is not caused.
It should be noted that the metal layer 23 may be any metal film having noise shielding and electrical conductivity, for example, the material of the metal layer 23 is selected from one of aluminum, silver and copper, and the metal layer 23 is exemplified as an aluminum foil in the present embodiment. The first insulating layer 21 and the second insulating layer 22 can be any insulating films having an insulating function, and the embodiment is described by taking a case that the first insulating layer 21 and the second insulating layer 22 are both Polyethylene terephthalate (PET) films, especially black opaque PET films. Furthermore, the thickness of the metal layer 23 is 0.1mm, and the thicknesses of the first insulating layer 21 and the second insulating layer 22 are both between 0.01mm and 0.03 mm.
In addition, as shown in fig. 1, in addition to the shielding film 2 attached to one surface of the circuit board 800, another shielding film 2a may be attached to the other surface or a partial region of the other surface of the circuit board 800, so that both surfaces of the circuit board 800 can be shielded. In other embodiments, the shielding films 2 and 2a are opened with an exposing opening corresponding to some electronic devices, and the inner edges of the first insulating layer 21 and the second insulating layer 22 corresponding to the exposing opening must also have a first periphery 212 and a second periphery 222 respectively protruding from the metal layer 23, so as to achieve the effect of preventing the metal layer 23 from short-circuiting other electronic devices.
As shown in fig. 1 and fig. 2, due to design constraints, the housing 900 may not be able to form the metal dam 9 and thus a larger dam notch 91 may be formed, so that noise leaks from the dam notch 91, especially near a Central Processing Unit (CPU) of the noise, and therefore, it is necessary to block the dam notch 91, and the embodiment will be described by taking an additional external dam component 3 as an example.
As shown in fig. 1, fig. 2, and fig. 5-fig. 7, the external retaining wall component 3 is disposed on the casing 900 corresponding to the retaining wall notch 91 to close the retaining wall notch 91, and the external retaining wall component 3 is electrically connected to the casing 900. The first insulating layer 21 of the shielding film 2 is formed with at least one external opening 211, so that the metal layer 23 can be exposed through the at least one external opening 211 to form at least one external conductive connection portion 232, and the shielding film 2 is electrically connected to the external retaining wall component 3 through the external conductive connection portion 232 and grounded.
Specifically, the housing 900 is provided with a plurality of metal fastening posts 92 protruding from the retaining wall 91. The external retaining wall assembly 3 includes an external circuit board 31 and a ground connecting wall 32. The external circuit board 31 is disposed in the casing 900 corresponding to the retaining wall notch 91 and electrically connected to the casing 900, the grounding conductive wall 32 is fixedly connected to the external circuit board 31 and electrically connected to the external circuit board 31, and the external conductive portion 232 of the shielding film 2 is electrically connected to the grounding conductive wall 32 for grounding.
The two sides of the external circuit board 31 are respectively provided with a plurality of external board surface connecting portions 312, and at least one external board surface connecting portion 312 is provided with at least one fixing hole 311. Therefore, when the external circuit board 31 is disposed on the housing 900, each metal fastening post 92 is inserted into each fastening hole 311, and then the fastening element F is fixedly connected to each metal fastening post 92, so that the metal fastening element F can contact and conduct with the external board surface conduction portion 312 around the fastening hole 311 after being fixedly connected to the metal fastening post 92.
In this way, the external board surface conduction parts 312 on the top surface of the external circuit board 31 and the external board surface conduction parts 312 on the bottom surface can be conducted with each other by the fixed connection of the metal fixing element F and the metal fixing posts 92, since the grounding conduction wall 32 with the electrical conduction function is just electrically bridged between the two external board surface conduction parts 312 on the top surface of the external circuit board 31, and the metal casing 900 is electrically contacted with the external board surface conduction parts 312 on the bottom surface of the external circuit board 31. Therefore, the shielding film 2 can be electrically connected to the ground conductive wall 32 through the external connection portion 232 and grounded.
The grounding conductive wall 32 with elastic deformation function of the present embodiment includes a flexible conductive outer layer 321 and an external elastic supporting body 322, the flexible conductive outer layer 321 surrounds or wraps the external elastic supporting body 322, and the grounding conductive wall 32 is fixed and electrically contacted to the external circuit board 31 by the flexible conductive outer layer 321. The flexible conductive outer layer 321 can be any outer layer with flexible conductive function, such as conductive cloth. The external elastic support 322 can be any object with elastic support function, such as sponge, foam, spring, or elastic sheet, and the embodiment is described by taking the external elastic support 322 as foam.
Experiments prove that when the shielding structure 100 of the present embodiment is not used, a plurality of spikes are evident; when the shielding film 2 of the present embodiment is used only but not grounded, some surge still occurs; when the shielding structure 100 of the present embodiment is used and grounded, there is no surge. Therefore, the shielding structure 100 of the present embodiment has the function of effectively shielding the noise and grounding the noise to conduct it thereto.
In summary, compared with the prior art, the shielding structure of the circuit board of the present embodiment has the following effects: the shielding structure 100 can effectively and completely shield and ground the noise to reduce the influence on the radio frequency device, thereby providing a noiseless or low-noise operating environment for the radio frequency device.
In addition, the invention has other effects: by the elastic deformation function of the grounding conduction member 1 and the grounding conduction wall 32, the soft conduction part 231 and the external conduction part 232 which do not belong to a hard plane can be ensured to be respectively electrically contacted with the grounding conduction member 1 and the grounding conduction wall 32. By externally connecting the retaining wall component 3, the retaining wall notch 91 on the casing 900 is closed by an external connection manner, so that the noise is completely shielded and grounded.
It is to be noted that the foregoing is only illustrative of the preferred embodiments of the present invention and the technical principles employed. It will be understood by those skilled in the art that the present invention is not limited to the particular embodiments described herein, but is capable of various obvious changes, rearrangements and substitutions as will now become apparent to those skilled in the art without departing from the scope of the invention. Therefore, although the present invention has been described in greater detail by the above embodiments, the present invention is not limited to the above embodiments, and may include other equivalent embodiments without departing from the spirit of the present invention, and the scope of the present invention is determined by the scope of the appended claims.
Claims (13)
1. A shielding structure of a circuit board for shielding the circuit board (800), comprising:
at least one grounding conducting piece (1) which is electrically configured on the circuit board (800); and
a shielding film (2), the shielding film (2) comprising:
a first insulating layer (21);
the second insulating layer (22) is attached to the circuit board (800), and at least one opening (221) is formed in the second insulating layer (22) corresponding to at least one grounding conducting piece (1);
a metal layer (23) stacked between the first insulating layer (21) and the second insulating layer (22), wherein the metal layer (23) is exposed through at least one opening (221) to form at least one conductive connection portion (231);
wherein, the shielding film (2) is electrically connected with at least one grounding conductive piece (1) by at least one conductive part (231) for grounding;
the areas of the first insulating layer (21) and the second insulating layer (22) are larger than the area of the metal layer (23), the first insulating layer (21) has a first periphery (212) protruding out of the metal layer (23), and the second insulating layer (22) has a second periphery (222) protruding out of the metal layer (23);
the first periphery (212) and the second periphery (222) are bonded to each other, and the metal layer (23) is completely wrapped in the first insulating layer (21) and the second insulating layer (22).
2. A shielding structure of a circuit board according to claim 1, characterized in that the first insulating layer (21) is a polyethylene terephthalate film.
3. A shielding structure of a circuit board according to claim 1, characterized in that the second insulating layer (22) is a polyethylene terephthalate film.
4. The circuit board shield structure of claim 1, wherein the metal layer (23) is made of one material selected from the group consisting of aluminum, silver and copper.
5. The shielding structure of the circuit board according to claim 1, wherein the ground lead (1) comprises an elastic supporting body (12) and a flexible metal sheet (11), the flexible metal sheet (11) surrounds the elastic supporting body (12) and is electrically connected to the circuit board (800).
6. The shielding structure of circuit board according to claim 5, wherein the elastic support (12) is a foam that is elastically supported in the flexible metal sheet (11).
7. A shielding structure of a circuit board according to claim 1, characterized in that the thickness of the metal layer (23) is 0.1mm.
8. A shielding structure for a circuit board according to claim 7, characterized in that the thickness of both the first insulating layer (21) and the second insulating layer (22) is between 0.01mm and 0.03 mm.
9. An electronic device having a shielding structure, comprising:
a housing (900);
a circuit board (800) disposed within the housing (900); and
a shielding structure (100) comprising:
at least one grounding conducting piece (1) which is electrically configured on the circuit board (800); and
a barrier film (2) comprising: a first insulating layer (21); the second insulating layer (22) is attached to the circuit board (800), and the second insulating layer (22) is provided with at least one opening (211) corresponding to at least one grounding conducting piece (1); a metal layer (23) stacked between the first insulating layer (21) and the second insulating layer (22), wherein the metal layer (23) is exposed through at least one opening (211) to form at least one conductive connection portion (231);
wherein, the shielding film (2) is electrically connected with at least one grounding conducting piece (1) by at least one conducting part (231) for grounding;
the casing (900) is a metal casing, at least one metal retaining wall (9) is arranged on the inner surface of the casing (900) in a protruding mode, at least one guide retaining wall (8) is arranged on one surface of the circuit board (800) in a protruding mode, at least one slot (G) is formed in the shielding film (2) corresponding to the at least one guide retaining wall (8), and the at least one guide retaining wall (8) is exposed through the at least one slot (G) and abuts against the at least one metal retaining wall (9) correspondingly.
10. The electronic device with a shielding structure according to claim 9, wherein the shielding structure (100) further comprises an external retaining wall element (3), the housing (900) has a retaining wall notch (91), the external retaining wall element (3) is disposed on the housing (900) corresponding to the retaining wall notch (91) and electrically connected to the housing (900), the first insulating layer (21) has at least one external opening (211), the metal layer (23) is exposed through the at least one external opening (211) to form at least one external conductive connection portion (232), and the shielding film (2) is electrically connected to the external retaining wall element (3) through the at least one external conductive connection portion (232) to be grounded.
11. The electronic device with a shielding structure according to claim 10, wherein the external retaining wall assembly (3) includes an external circuit board (31) and a ground connecting wall (32), the external circuit board (31) is disposed in the housing (900) corresponding to the retaining wall notch (91) and electrically connected to the housing (900), the ground connecting wall (32) is fixedly connected to the external circuit board (31) and electrically connected to the external circuit board (31), and the shielding film (2) is electrically connected to the ground connecting wall (32) through at least one external connecting portion (232).
12. The electronic device with shielding structure of claim 11, wherein the ground connecting wall (32) comprises an external elastic support (322) and a flexible connecting outer layer (321), the flexible connecting outer layer (321) surrounds the external elastic support (322), and the flexible connecting outer layer (321) is fixed and electrically contacted to the external circuit board (31).
13. An electronic device having a shielding structure, comprising:
a housing (900);
the external retaining wall component (3), the casing (900) has a retaining wall notch (91), the external retaining wall component (3) is arranged on the casing (900) corresponding to the retaining wall notch (91) and is electrically connected to the casing (900);
a circuit board (800) disposed within the housing (900); and
a shielding structure (100) comprising:
at least one grounding conducting piece (1) which is electrically configured on the circuit board (800); and
a barrier film (2) comprising: a first insulating layer (21); the second insulating layer (22) is attached to the circuit board (800), and the second insulating layer (22) is provided with at least one opening (211) corresponding to at least one grounding guide connector (1); a metal layer (23) stacked between the first insulating layer (21) and the second insulating layer (22), wherein the metal layer (23) is exposed through at least one opening (211) to form at least one conductive connection portion (231);
the shielding film (2) is electrically connected to at least one grounding conductive member (1) through at least one conductive portion (231) and is grounded.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110546459.1A CN113411951B (en) | 2018-09-11 | 2018-09-11 | Shielding structure of circuit board and electronic device with shielding structure |
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811054115.3A CN110891361A (en) | 2018-09-11 | 2018-09-11 | Shielding structure of circuit board and electronic device with same |
| CN202110546459.1A CN113411951B (en) | 2018-09-11 | 2018-09-11 | Shielding structure of circuit board and electronic device with shielding structure |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811054115.3A Division CN110891361A (en) | 2018-09-11 | 2018-09-11 | Shielding structure of circuit board and electronic device with same |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113411951A CN113411951A (en) | 2021-09-17 |
| CN113411951B true CN113411951B (en) | 2022-12-13 |
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Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811054115.3A Withdrawn CN110891361A (en) | 2018-09-11 | 2018-09-11 | Shielding structure of circuit board and electronic device with same |
| CN202110546459.1A Active CN113411951B (en) | 2018-09-11 | 2018-09-11 | Shielding structure of circuit board and electronic device with shielding structure |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811054115.3A Withdrawn CN110891361A (en) | 2018-09-11 | 2018-09-11 | Shielding structure of circuit board and electronic device with same |
Country Status (1)
| Country | Link |
|---|---|
| CN (2) | CN110891361A (en) |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0278372U (en) * | 1988-12-06 | 1990-06-15 | ||
| US6028775A (en) * | 1997-12-12 | 2000-02-22 | Nortel Networks Corporation | Assemblies of electronic devices and flexible containers thereof |
| CN103874402A (en) * | 2012-12-14 | 2014-06-18 | 友达光电股份有限公司 | Electronic device with electromagnetic interference shielding structure |
| KR102350393B1 (en) * | 2015-07-31 | 2022-01-14 | 엘지디스플레이 주식회사 | Electromagnetic wave shielding structure and display device having the same |
-
2018
- 2018-09-11 CN CN201811054115.3A patent/CN110891361A/en not_active Withdrawn
- 2018-09-11 CN CN202110546459.1A patent/CN113411951B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN113411951A (en) | 2021-09-17 |
| CN110891361A (en) | 2020-03-17 |
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