CN113410676B

CN113410676B - Electrical connector

Info

Publication number: CN113410676B
Application number: CN202110517651.8A
Authority: CN
Inventors: 何志立; 张文昌
Original assignee: Zhongshan Yide Electronics Co ltd
Current assignee: Zhongshan Yide Electronics Co ltd
Priority date: 2021-05-12
Filing date: 2021-05-12
Publication date: 2022-09-16
Anticipated expiration: 2041-05-12
Also published as: CN113410676A

Abstract

The invention discloses an electrical connector, comprising at least one terminal assembly, wherein the terminal assembly comprises: an insulating block; a pair of signal terminals fixed on the insulating block, wherein surface type welding parts of the pair of signal terminals are arranged along a first direction, the surface type welding parts are provided with a welding surface facing a second direction, the second direction is vertical to the first direction, the welding surface is used for pre-fixing a solder ball before an electric connector is welded with a substrate, and each surface type welding part is welded on the surface of the substrate through the solder ball; and the shielding shell is provided with two jack-type tail parts which are electrically connected with the through hole of the substrate, and the two jack-type tail parts are respectively positioned on two sides of the pair of surface-type welding parts along the first direction. The invention can improve the coplanarity of the signal terminals, reduce the occupation of the signal terminals on the wiring space of the substrate and reduce the risk of tin cracking of the solder balls.

Description

Electrical connector

[ technical field ] A method for producing a semiconductor device

The present invention relates to an electrical connector, and more particularly, to an electrical connector in which solder balls soldered to surface-type soldering portions of signal terminals are not easily cracked.

[ background ] A method for producing a semiconductor device

A conventional electrical connector includes a plurality of pairs of signal terminals, and a soldering portion of each signal terminal is soldered on a surface of a circuit board by a solder ball. In the using process, the soldering portion of the signal terminal of the electrical connector may be rotated or shifted relative to the solder ball by an external acting force, for example, the electrical connector is subjected to a force of multiple plugging and unplugging operations or collides with other objects in the using process, so that the solder ball of the soldering portion of the signal terminal is easily cracked, the contact between the signal terminal and the circuit board is poor, and the signal transmission of the signal terminal of the electrical connector is further influenced.

Therefore, there is a need for a new electrical connector to overcome the above problems.

[ summary of the invention ]

The invention aims to provide an electric connector, wherein a surface type welding part of a signal terminal is welded on the surface of a substrate through a tin ball, so that the coplanarity of the signal terminal can be improved, and the occupation of the signal terminal on the wiring space of the substrate is reduced; the shielding shell is provided with two jack-type tails, so that the shielding shell can be stably connected with the substrate and is not easy to shake, the shielding shell covers the outer sides of the pair of signal terminals and the insulating block, and the two jack-type tails are respectively positioned on two sides of the pair of surface-type welding parts along a first direction, so that the shaking of the insulating block and the signal terminals is limited by the shielding shell, and further, the rotation or the deviation of the surface-type welding parts relative to the solder balls is reduced, and the risk of solder ball cracking is reduced.

In order to achieve the purpose, the invention adopts the following technical scheme: an electrical connector for electrically connecting to a substrate, comprising at least one terminal assembly, said terminal assembly comprising: an insulating block; a pair of signal terminals fixed to the insulating block, each of the signal terminals having a contact portion, a surface-type soldering portion and a connecting portion connected to the contact portion and the surface-type soldering portion, the surface-type soldering portions of the pair of signal terminals being arranged along a first direction, each of the surface-type soldering portions extending out of the insulating block and having a soldering surface facing a second direction perpendicular to the first direction, the soldering surface being used to pre-fix a solder ball before soldering the electrical connector to the substrate, each of the surface-type soldering portions being soldered to the surface of the substrate through the solder ball; and the shielding shell is coated on the outer sides of the pair of signal terminals and the insulating block and is provided with two jack type tail parts which are electrically connected with the through hole of the substrate, and the two jack type tail parts are respectively positioned on two sides of the pair of surface type welding parts along the first direction.

Further, the shield case has a first wall surface and a second wall surface which are opposed to each other in the second direction, a pair of the surface-type soldering portions is located between the first wall surface and the second wall surface, and the surface-type soldering portions are shifted in a direction opposite to the second direction with respect to a center line between the first wall surface and the second wall surface, wherein the solder balls are located between the soldering surface and the first wall surface before the electrical connector is soldered to the substrate.

Further, after the solder ball is pre-fixed on the soldering surface, two of the jack tail portions are aligned along the first direction, and projections of the jack tail portions and the solder ball in the first direction are overlapped.

Further, the thickness of the surface type welding portion in the second direction is smaller than the thickness of the connecting portion in the second direction.

Further, the shield case further has at least a pair of surface-type tails soldered to the surface of the substrate, the pair of surface-type tails being aligned along the first direction, and projections of the pair of surface-type soldered portions and the pair of surface-type tails in the second direction overlap.

Further, the shielding shell has two pairs of surface-type tails, and a pair of the surface-type welds are located between the two pairs of the surface-type tails along the second direction.

Further, the surface-type tail portion extends beyond the surface-type soldering portion toward the substrate.

Furthermore, the shielding shell has a first wall surface, a bottom of the first wall surface extends toward the substrate, and an air gap is formed between the bottom of the first wall surface and the insulating block.

Further, the bottom of the first wall surface bends and extends obliquely towards the second direction and extends towards the substrate, and before the electric connector is welded with the substrate, the solder balls are located between the welding surface and the bottom of the first wall surface.

Furthermore, the surface type welding part is also provided with three exposed surfaces, one of the exposed surfaces and the welding surface are oppositely arranged in the second direction, the other two exposed surfaces are oppositely arranged in the first direction, one end, adjacent to the base plate, of the insulating block is provided with a groove which is formed in a concave mode in the direction far away from the base plate, and the three exposed surfaces are exposed in the groove.

Compared with the prior art, the electric connector provided by the invention has the following beneficial effects: the surface type welding part of the signal terminal is welded on the surface of the substrate through a tin ball, so that the coplanarity of the signal terminal can be improved, and the wiring space of the substrate occupied by the signal terminal is reduced; the shielding shell is provided with two jack type tails, so that the shielding shell can be stably connected with the substrate and is not easy to shake, and because the shielding shell covers the outer sides of the signal terminals and the insulating block, the shielding shell can shield interference signals for the signal terminals, thereby improving the high-frequency performance of the electric connector; meanwhile, the shielding shell is provided with the two jack-type tails, so that the shielding shell is not easy to shake, the shaking of the insulating block and the signal terminal is limited by the shielding shell, the rotation or the deviation of the surface type welding part relative to the solder ball is reduced, and the risk of solder ball tin cracking is reduced; furthermore, because the solder ball is pre-fixed on the soldering surface along the second direction, most of the solder ball contacts the soldering surface along the second direction after being melted, therefore, the solder ball and the surface type soldering part have larger contact force in the second direction, and the solder ball and the surface type soldering part have weaker contact force in the first direction, so that the surface type soldering part and the solder ball are more easily staggered in the first direction after the surface type soldering part deviates or twists relative to the solder ball, so that the solder ball is more easily subjected to tin cracking along the first direction, but a pair of the surface type soldering parts of the invention are arranged along the first direction, two jack type tails are respectively positioned at two sides of a pair of the surface type soldering parts along the first direction, and the solder ball can be prevented from tin cracking in the first direction in which the tin cracking easily occurs, and solder ball tin cracking is avoided to the maximum extent, and normal signal transmission of the signal terminal is ensured. Therefore, the high-frequency performance and the mechanical performance of the electric connector can be effectively improved.

[ description of the drawings ]

Fig. 1 is a schematic perspective view illustrating a first connector and a first substrate of an embodiment of the invention when they are not connected;

fig. 2 is a schematic perspective view illustrating a second connector and a second substrate according to an embodiment of the invention when they are not connected;

fig. 3 is a schematic perspective view of a first connector, a first substrate, a second connector and a second substrate after connection is completed according to an embodiment of the invention;

FIG. 4 is a cross-sectional view of a first connector of an embodiment of the invention after being connected to a first substrate;

fig. 5 is an enlarged view of a portion C of fig. 4;

FIG. 6 is an exploded view of an electrical module according to an embodiment of the present invention;

FIG. 7 is a perspective view of an electrical module according to an embodiment of the present invention;

FIG. 8 is an exploded view of a first terminal assembly in accordance with embodiments of the present invention;

FIG. 9 is a perspective view of a first terminal assembly in accordance with embodiments of the present invention;

FIG. 10 is a perspective view of another perspective of a first terminal assembly in accordance with an embodiment of the present invention;

fig. 11 is a plan view of a first terminal assembly of the embodiment of the present invention viewed in a third direction;

fig. 12 is a cross-sectional view of a second connector according to an embodiment of the present invention after being connected to a second substrate;

fig. 13 is an exploded view of a second connector of an embodiment of the present invention;

figure 14 is a perspective view of a second terminal assembly in accordance with an embodiment of the present invention;

fig. 15 is a plan view of a second terminal assembly according to the embodiment of the present invention, viewed in a third direction.

Detailed description of the embodiments reference is made to the accompanying drawings in which:

[ detailed description ] A

For a better understanding of the objects, structure, features, and functions of the invention, reference should be made to the drawings and detailed description that follow.

Referring to fig. 1 to fig. 3, two electrical connectors according to an embodiment of the present invention are provided, and the two electrical connectors include a first connector 100 and a second connector 200. Both of the electrical connectors are electrically connected to a substrate, wherein the first connector 100 is electrically connected to a first substrate 7, and the second connector 200 is electrically connected to a second substrate 8. Each of the two electrical connectors has a corresponding terminal assembly, each of the terminal assemblies has an insulating block, a pair of signal terminals and a shield shell, each of the signal terminals has a contact portion, a surface-type soldering portion and a connecting portion connected to the contact portion and the surface-type soldering portion, and each of the shield shells has a socket-type tail portion and a surface-type tail portion connected to a corresponding substrate. Each of the surface-type welding portions has one welding surface and three exposed surfaces. The first substrate 7 and the second substrate 8 each have a through hole and a spacer.

Specifically, the terminal assembly of the first connector 100 is a first terminal assembly 22, the insulating block of the first terminal assembly 22 is a first insulating block 221, and the signal terminal of the first terminal assembly 22 is a first signal terminal 222; the contact portion, the connection portion and the surface type soldering portion of the first signal terminal 222 are respectively a first contact portion 2221, a first connection portion 2222 and a first surface type soldering portion 2223, the soldering surface of the first surface type soldering portion 2223 is a first surface type soldering surface, and the exposed surface of the first surface type soldering portion 2223 is a first exposed surface 22232; the shielding shell of the first terminal assembly 22 is a first shielding shell 223, the receptacle-type tail portion of the first shielding shell 223 is a first receptacle-type tail portion 2231, and the surface-type tail portion of the first shielding shell 223 is a first surface-type tail portion 2232. The terminal assembly of the second connector 200 is a second terminal assembly 6, the insulating block of the second terminal assembly 6 is a second insulating block 61, the signal terminal of the second terminal assembly 6 is a second signal terminal 62, the contact portion, the connection portion and the surface type welding portion of the second signal terminal 62 are a second contact portion 621, a second connection portion 622 and a second surface type welding portion 623 respectively, the welding surface of the second surface type welding portion 623 is a second surface type welding surface, and the exposed surface of the first surface type welding portion 2223 is a first exposed surface 22232; the shielding shell of the second terminal assembly 6 is a second shielding shell 63, the receptacle-type tail of the second shielding shell 63 is a second receptacle-type tail 631, and the surface-type tail of the second shielding shell 63 is a second surface-type tail 632. Specifically, the through hole of the first substrate 7 is a first through hole 71, the gasket of the first substrate 7 is a first gasket 72, the through hole of the second substrate 8 is a second through hole 81, and the gasket of the second substrate 8 is a second gasket 82. In this embodiment, after the first connector 100 and the second connector 200 are mated, the first contact portion 2221 is mated with the second contact portion 621, and the first shielding shell 223 is mated with the second shielding shell 63.

In order to facilitate understanding of the technical solution of the present invention, in the three-dimensional axes in fig. 1 and fig. 4 to fig. 11 of the specification, an X1 axis is defined as a first direction of the first connector 100, a Y1 axis is defined as a second direction of the first connector 100, a Z1 axis is defined as a third direction of the first connector 100, and an X1 axis, a Y1 axis and a Z1 axis are perpendicular to each other two by two. In the three-dimensional axes of fig. 2, 12 to 15 in the specification, an X2 axis is defined as a first direction of the second connector 200, a Z2 axis is defined as a second direction of the second connector 200, a Y2 axis is defined as a third direction of the second connector 200, and two of the X2 axis, the Y2 axis and the Z2 axis are perpendicular to each other. When the first connector 100 and the second connector 200 are mated, in fig. 3, the X1 axis is in the same direction as the X2 axis, the Y1 axis is in the same direction as the Y2 axis, and the Z1 axis is in the same direction as the Z2 axis.

Referring to fig. 1, fig. 3 and fig. 4, the first connector 100 according to an embodiment of the present invention includes a first insulating mating shell 1 and a plurality of electrical modules 2, wherein the first insulating mating shell 1 is mated with the second connector 200. The first insulation butting shell 1 has a receiving cavity (not shown), the plurality of electrical modules 2 are sequentially arranged along the first direction X1 and received in the receiving cavity, each electrical module 2 includes an insulation body 21, a plurality of first terminal assemblies 22 arranged on the insulation body 21 along the third direction Z1, and a shielding member 3 adjacent to one side of the insulation body 21, the insulation body 21 is provided with a plurality of receiving slots 211 arranged along the third direction Z1, and each receiving slot 211 correspondingly receives one first terminal assembly 22. In this embodiment, the shielding element 3 is fixed to the insulating body 21 and contacts the first shielding shells 223 of the first terminal assemblies 22 in the same electrical module 2. The first connector 100 further has a planar body 4 fixed to the insulating body 21 of the plurality of electrical modules 2, so as to provide a horizontal plane through the planar body 4 for a vacuum chuck (not shown) to suck and move to be soldered to the first substrate 7.

Referring to fig. 4 to 8, the first terminal assembly 22 includes the first insulating block 221, a pair of the first signal terminals 222 fixed to the first insulating block 221, and the first shielding shell 223 covering the pair of the first signal terminals 222 and the first insulating block 221. Each of the first signal terminals 222 has a first contact portion 2221, a first surface type soldering portion 2223 and a first connection portion 2222 connected to the first contact portion 2221 and the first surface type soldering portion 2223, the first surface type soldering portions 2223 of a pair of the first signal terminals 222 are arranged along the first direction X1, each of the first surface type soldering portions 2223 extends out of the first insulating block 221, each of the first surface type soldering portions 2223 has a first soldering surface 22231 facing the second direction Y1, the first soldering surface 22231 is used to pre-fix a solder ball 9 before the first connector 100 is soldered to the first substrate 7, each of the first surface type soldering portions 2223 is soldered to the surface of the first substrate 7 through the solder ball 9, in this embodiment, each of the first surface type soldering portions 2223 is soldered to the corresponding first substrate pad of the first substrate 7 through the solder ball 9. Specifically, the first soldering surface 22231 and the first insulating block 221 can clamp the solder ball 9 together to realize the pre-fixing of the solder ball 9; or, the first surface type soldering portion 2223 has a clamping function, and the first soldering surface 22231 clamps the solder ball 9 in advance, so as to pre-fix the solder ball 9; alternatively, the solder ball 9 may be pre-soldered on the first soldering surface 22231 to achieve pre-fixing of the solder ball 9, which is not limited herein. The first shielding shell 223 covers the outer sides of the pair of first signal terminals 222 and the first insulating block 221, the first shielding shell 223 has two first socket tails 2231, each first socket tail 2231 is configured to be electrically connected to a corresponding first through hole 71 of the first substrate 7, and the two first socket tails 2231 are respectively located on two sides of the pair of first surface type soldering portions 2223 along the first direction X1. Thereby, the first surface type soldering portion 2223 of the first signal terminal 222 is soldered to the surface of the first substrate 7 by the solder ball 9, which can improve the coplanarity of the first signal terminal 222 and reduce the wiring space of the first substrate 7 occupied by the first signal terminal 222; the first shielding shell 223 has two first socket type tails 2231, so that the first shielding shell 223 can be stably connected to the first substrate 7 without easily shaking, and since the first shielding shell 223 covers the outer sides of the pair of first signal terminals 222 and the first insulating block 221, the first shielding shell 223 can shield the first signal terminals 222 from interference signals, so as to improve the high-frequency performance of the first connector 100, and the first shielding shell 223 limits shaking of the first insulating block 221 and the first signal terminals 222, thereby reducing rotation or deviation of the first surface type welding portion 2223 relative to the solder ball 9, and further reducing the risk of tin cracking of the solder ball 9; further, since the first soldering surface 22231 pre-fixes the solder ball 9 along the second direction Y1, most of the solder ball 9 contacts the first soldering surface 22231 along the second direction Y2 after melting, so that the solder ball 9 and the first surface type soldering portion 2223 have a larger contact force in the second direction Y1, and the solder ball 9 and the first surface type soldering portion 2223 have a weaker contact force in the first direction X1, after the first surface type soldering portion 2223 is offset or twisted with respect to the solder ball 9, it is more easily staggered with respect to the solder ball 9 in the first direction X1, so that the solder ball 9 is more easily cracked along the first direction X1, while the pair of first surface type soldering portions 2223 of the present invention are arranged along the first direction X1, and two first socket type tail portions 2231 are respectively located on both sides of the pair of first surface type soldering portions 2223 along the first direction X1, the solder ball 9 can be prevented from being cracked in the first direction X1 in which the solder cracking is likely to occur, so that the solder cracking of the solder ball 9 is avoided to the maximum extent, and the normal signal transmission of the first signal terminal 222 is ensured. Further, the first surface type soldering portion 2223 has four surfaces including two oppositely disposed plate surfaces and two oppositely disposed material cutting thickness surfaces, the width of the plate surface is greater than the width of the material cutting thickness surface, in this embodiment, the first soldering surface 22231 is one of the plate surfaces, the width of the first soldering surface 22231 along the first direction X1 is the width of the plate surface, and the width of the material cutting thickness surface along the second direction Y1 is the width of the material cutting thickness surface, so that compared with the case where the first soldering surface 22231 is the material cutting thickness surface, this embodiment can increase the contact area between the solder ball 9 and the first soldering surface 22231, so that the solder ball 9 is more attached to the first soldering surface 22231, and the contact force between the solder ball 9 and the first surface type soldering portion 2223 in the second direction Y1 is greater, the risk of tin cracking of the solder balls 9 in the second direction Y1 is further reduced.

The first shield shell 223 improves both the high frequency performance and the mechanical performance of the first terminal assembly 22. It should be noted that, in this embodiment, the first connection portion 2222 is bent and extended, the first insulating block 221 covers the first connection portion 2222, and the first contact portion 2221 and the first surface-type welding portion 2223 extend out of the first insulating block 221. The thickness of the first surface type soldering portion 2223 in the second direction Y1 is smaller than the thickness of the first connecting portion 2222 in the second direction Y1, so that the first surface type soldering portion 2223 can make more room for the solder ball 9, further reducing the risk of the solder ball 9 contacting the first shielding shell 223. It should be noted that, in this embodiment, the first shielding case 223 is formed by assembling two U-shaped shielding bodies 2233, and the side surfaces of the two U-shaped shielding bodies 2233 jointly form the third wall A3 and the fourth wall a4 of the first shielding case 223; in other embodiments, the first shielding shell 223 may be a tubular structure or other structure formed integrally.

Referring to fig. 5, 10 and 11, the first shielding case 223 has a first wall a1 and a second wall a2 oppositely disposed in the second direction Y1, and a third wall A3 and a fourth wall a4 oppositely disposed in the first direction X1, a pair of the first surface type soldering portions 2223 is located between the first wall a1 and the second wall a2 of the first shielding case 223, and the solder balls 9 are located between the first soldering surface 22231 and the first wall a1 of the first shielding case 223 before the first connector 100 and the first substrate 7 are soldered. A center line between the first wall surface a1 and the second wall surface a2 of the first shield case 223 is defined as a first center line L1, and the first surface type welding portion 2223 is offset with respect to the first center line L1 toward a direction opposite to the second direction Y1. Thus, the first soldering surface 22231 can be relatively far from the first wall surface a1 of the first shielding shell 223, a larger space can be provided for the solder ball 9, the solder ball 9 can be prevented from contacting the first wall surface a1 of the first shielding shell 223, and the risk of short circuit of the first signal terminal 222 can be reduced.

Referring to fig. 4 to 5 and 10 to 11, after the solder balls 9 are pre-fixed on the first soldering surface 22231, the two first socket tail portions 2231 of the first shielding shell 223 are aligned along the first direction X1, and the projections of the first socket tail portions 2231 and the solder balls 9 in the first direction X1 overlap. Specifically, the first socket tail 2231 is aligned with a center line extending in the first direction X1 of the solder ball 9. Compared with the two first socket tails 2231 and the solder balls 9 which are completely staggered, the projections of the first socket tails 2231 and the solder balls 9 in the first direction X1 of the embodiment overlap, so that the soldering positions of the first socket tails 2231 and the solder balls 9 can be drawn closer, the fixing positions of the first socket tails 2231 and the first substrate 7 are closer to the soldering position of the solder balls 9, and the first shielding shell 223 can more effectively reduce the wobbling of the first signal terminal 222 and more effectively reduce the risk of solder cracking of the solder balls 9.

Referring to fig. 4 to 5 and 10 to 11, the first shielding shell 223 further has two pairs of first surface-type tails 2232 welded to the surface of the first substrate 7, specifically, each of the first surface-type tails 2232 is welded to a corresponding first pad 72 of the first substrate 7. Specifically, one pair of the first surface type tails 2232 is disposed on the bottom of the first wall a1 of the first shielding shell 223, and the other pair of the first surface type tails 2232 is disposed on the bottom of the second wall a2 of the first shielding shell 223. Each pair of the first surface-type tails 2232 is aligned along the first direction X1, and each pair of the surface-type welds is located between two pairs of the first surface-type tails 2232 of the first shield shell 223 along the second direction Y1. Accordingly, the first surface type tail portions 2232 can further increase the connection stability between the first shielding shell 223 and the first substrate 7, and compared with the first surface type tail portions 2232 on only one side of the pair of first surface type soldering portions 2223, the pair of first surface type tail portions 2232 on one side of the pair of first surface type soldering portions 2223 of the present invention is beneficial for solder to climb the gap between the pair of first surface type tail portions 2232 during soldering, so that the soldering between the first surface type tail portions 2232 and the first substrate 7 is more stable; compared with the case that the number of the first receptacle tails 2231 is further increased to increase the stability between the first shielding shell 223 and the first substrate 7, the addition of the first surface tails 2232 in this embodiment can also reduce the occupied wiring space inside the first substrate 7, and can make more wiring space for the first signal terminals 222. Further, each of the first-surface type welding portions 2223 overlaps the projection of the corresponding two first-surface type end portions 2232 in the second direction Y1, that is, the two first-surface type end portions 2232 are located on two sides of the corresponding one of the first-surface type welding portions 2223 along the second direction Y1. Therefore, each first surface type soldering portion 2223 is shielded by two corresponding first surface type tail portions 2232 in the second direction Y1, so that an interference signal can be shielded from the first surface type soldering portion 2223 in the second direction Y1, and signal interference received by the first surface type soldering portion 2223 of the first signal terminal 222 can be reduced. Further, the first surface type tail 2232 extends beyond the first surface type soldering portion 2223 toward the first substrate 7. Therefore, when the first surface type tail 2232 contacts the first substrate 7, the first surface type soldering portion 2223 can be lifted away from the first substrate 7, a certain distance is formed between the first surface type soldering portion 2223 and the first substrate 7, the distance can allow a certain error in the length of the first signal terminal 222, and after the solder ball 9 is melted, the solder ball 9 can be flexibly filled between the first surface type soldering portion 2223 and the first substrate 7, and the coplanarity of the first signal terminal 222 can be effectively improved. In the present embodiment, the first shielding shell 223 has two pairs of the first surface type tails 2232, whereby the two pairs of the first surface type tails 2232 and the two first receptacle type tails 2231 can be enclosed around a pair of the first surface type welds 2223 to provide overall shielding to the first surface type welds 2223; in other embodiments, the first shielding shell 223 may have only one pair of the first surface-type tails 2232, for example, only the first wall surface a1 or only the bottom of the second wall surface a2 of the first shielding shell 223 is provided with one pair of the first surface-type tails 2232, so that the first shielding shell 223 has two first card-inserting type tails 2231 and two first surface-type tails 2232, which can reduce the occupation of the first substrate 7 and further give way for more wiring space for the first signal terminals 222. For each electrical module 2, at least one pair of the first surface type tail portions 2232 between any two adjacent pairs of the first surface type welding portions 2223 in the plurality of first terminal assemblies 22 shields the first surface type welding portions 2223 from interfering signals along the second direction.

Referring to fig. 4 to 5, the bottom of the first shielding case 223 extends toward the first substrate 7, and an air gap 10 is formed between the bottom of one wall of the first shielding case 223 and the first insulating block 221. Therefore, the air gap 10 can provide a certain buffer space for the shaking of the first shielding shell 223, and when the first shielding shell 223 shakes, the risk that the first shielding shell 223 drives the first insulating block 221 and the first signal terminal 222 to shake is reduced, and the risk of tin cracking is further reduced. Specifically, in this embodiment, the air gap 10 is located between the first wall a1 of the first shielding shell 223 and the first insulating block 221, and at this time, the air gap 10 can reduce the risk of tin cracking when the first shielding shell 223 shakes along the second direction Y1; of course, in other embodiments, the second wall a2, the third wall A3 and the fourth wall a4 of the first shielding shell 223 may have an air gap 10 with the first insulating block 221, which is not limited herein.

Referring to fig. 4 to 5, the air gap 10 exists between the first wall a1 of the first shielding case 223 and the first insulating block 221, a bottom of the first wall a1 is bent and inclined to extend toward the second direction Y1 and extends toward the first substrate 7, and the solder balls 9 are located between the first wall a1 and the bottom of the first wall a1 before the first connector 100 is soldered to the first substrate 7. Thereby, the distance between the bottom of the first wall a1 and the solder ball 9 can be further increased, the first wall a1 is prevented from contacting the solder ball 9, and the first signal terminal 222 is prevented from being short-circuited; moreover, the air gap 10 exists between the first insulating block 221 and the first wall surface a1, which can allow a certain error in the inclination angle of the first wall surface a1, and ensure that the first insulating block 221 can be accommodated in the first shielding shell 223.

Referring to fig. 8 to 11, the first surface type welding portion 2223 includes the first welding surface 22231 and three first exposed surfaces 22232, one of the first exposed surfaces 22232 is disposed opposite to the first welding surface 22231 in the second direction Y1, the other two first exposed surfaces 22232 are disposed opposite to the first direction X1, one end of the first insulating block 221, which is adjacent to the first substrate 7, is provided with a first groove 2211 recessed in a direction away from the first substrate 7, and all three first exposed surfaces 22232 are exposed to the first groove 2211. Thus, the first surface type soldering portion 2223 is allowed to be elastically deformed in a direction opposite to the second direction Y1, which is advantageous for pre-fixing the solder ball 9, and the length of the first surface type soldering portion 2223 extending beyond the first insulating block 221 is increased to allow the first surface type soldering portion 2223 to have a certain elasticity, compared to the case where the first groove 2211 is not provided, whereas the first insulating block 221 of the present invention is provided with the first groove 2211, which allows the first surface type soldering portion 2223 to have a certain elasticity, even if the length of the first surface type soldering portion 2223 extending beyond the first insulating block 221 is short. Further, the first insulating block 221 is provided with three first bumps 2212 protruding toward the first substrate 7, the three first bumps 2212 are arranged at intervals along the first direction X1, wherein each of the first soldering surfaces 22231 and two adjacent first bumps 2212 fix the corresponding solder ball 9 together before the first connector 100 is soldered to the first substrate 7. Thus, the solder ball 9 can be pre-fixed better by the three-point contact fixing of the solder ball 9 by the first soldering surface 22231 and two adjacent first bumps 2212.

Referring to fig. 4, 5 and 8, the first insulation block 221 includes a first injection molding 2213 and a second injection molding 2214, the first injection molding 2213 is molded on the first connection portion 2222, and then the second injection molding 2214 is molded on the first injection molding 2213 and the first signal terminal 222. The first injection-molded part 2213 has a plurality of fixing portions by which a mold fixes the first signal terminal 222 and the first injection-molded part 2213 in position when the second injection-molded part 2214 is molded. Specifically, the plurality of fixing portions include a first fixing portion 22131 and a second fixing portion 22132, and when the second injection molding 2214 is molded, the first injection molding 2213 and the first signal terminal 222 are fixed in the up-down direction by the first fixing portion 22131, and the first injection molding 2213 and the first signal terminal 222 are fixed in the left-right direction by the second fixing portion 22132. It should be noted that, if the first insulating block 221 is formed by only one injection molding process, and the mold clamps the first signal terminal 222 for positioning, after the molding, the mold is removed, and the position where the first signal terminal 222 is clamped by the mold is exposed to the first insulating block 221, so that the media around the first connection portion 2222 are different, which may affect the impedance consistency of the first signal terminal 222. The second injection molding 2214 of the present invention does not need a mold to clamp the first signal terminal 222, and after the first insulating block 221 is completely molded, the first connection portion 2222 can be completely wrapped in an insulating material, and the media around the first connection portion 2222 are the same, which is favorable for the impedance consistency of the first connection portion 2222.

Referring to fig. 2, 12 and 13, the second connector 200 according to the embodiment of the invention includes a second insulative docking shell 5, a plurality of grounding bars 64, and a plurality of second terminal assemblies 6 fixed to the second insulative docking shell 5. The plurality of second terminal assemblies 6 are arranged in a plurality of rows along the second direction Z2, and the plurality of second terminal assemblies 6 in each row are arranged along the first direction X2. Each of the second terminal assemblies 6 includes the second insulating block 61, a pair of the second signal terminals 62 fixed to the second insulating block 61, and the second shielding shell 63 covering the second insulating block 61 and the pair of the second signal terminals 62. Each of the ground bars 64 extends along the first direction X2, and the plurality of second shielding shells 63 in each row simultaneously contact a corresponding one of the ground bars 64, so that the potentials of the plurality of second shielding shells 63 in the same row are equal, thereby improving the high-frequency performance of the second connector 200. The second connector 200 is connected to the second substrate 8 along a third direction Y2.

Referring to fig. 12 to 15, each of the second signal terminals 62 has a second contact portion 621, a second surface type soldering portion 623 and a second connection portion 622 connected to the second contact portion 621 and the second surface type soldering portion 623, the second surface type soldering portions 623 of a pair of the second signal terminals 62 are arranged along the first direction X2, each of the second surface type soldering portions 623 extends out of the second insulating block 61, each of the second surface type soldering portions 623 has a second soldering surface 6231 facing the second direction Z2, the second soldering surface 6231 is used to pre-fix a solder ball 9 before the second connector 200 is soldered to the second substrate 8, each of the second surface type soldering portions 623 is soldered to the surface of the second substrate 8 through the solder ball 9, in this embodiment, each of the second surface type soldering portions 623 is soldered to the corresponding second pad 82 of the second substrate 8 via the solder ball 9. The way of pre-fixing the solder ball 9 on the second soldering surface 6231 is the same as the way of pre-fixing the solder ball 9 on the first soldering surface 22231, and is not described herein again. The second shielding shell 63 covers the outer sides of the pair of second signal terminals 62 and the second insulating block 61, the second shielding shell 63 has two second jack tails 631, each second jack tail 631 is electrically connected to a corresponding second through hole 81 of the second substrate 8, and the two second jack tails 631 are respectively located at two sides of the pair of second surface type soldering portions 623 along the first direction X2. Thereby, the second surface type soldering portion 623 of the second signal terminal 62 is soldered to the surface of the second substrate 8 by the solder ball 9, which can improve the coplanarity of the second signal terminal 62 and reduce the wiring space of the second substrate 8 occupied by the second signal terminal 62; the second shielding shell 63 has two second socket tails 631, so that the second shielding shell 63 can be stably connected to the second substrate 8 without easily shaking, and since the second shielding shell 63 covers the outer sides of the pair of second signal terminals 62 and the second insulating block 61, the second shielding shell 63 can shield the second signal terminals 62 from interference signals, so as to improve the high-frequency performance of the second connector 200, and the second shielding shell 63 restricts the shaking of the second insulating block 61 and the second signal terminals 62, so as to reduce the rotation or offset of the second surface type welding portion 623 relative to the solder ball 9, and further reduce the risk of tin cracking of the solder ball 9; further, since the solder ball 9 is pre-fixed by the second soldering surface 6231 along the second direction Z2, most of the solder ball 9 contacts the second soldering surface 6231 along the second direction Z2 after melting, so that the solder ball 9 and the second surface type soldering portion 623 have a larger contact force in the second direction Z2, and the solder ball 9 and the second surface type soldering portion 623 have a weaker contact force in the first direction X2, after the second surface type soldering portion 623 is offset or twisted with respect to the solder ball 9, it is easier to be staggered with respect to the solder ball 9 in the first direction X2, so that the solder ball 9 is easier to be cracked by tin along the first direction X2, whereas a pair of the second surface type soldering portions 623 of the present invention are arranged along the first direction X2, and two second socket type tails are respectively located on two sides 623 of the pair of the second surface type soldering portions 623 along the first direction X2, the solder ball 9 can be prevented from being cracked in the first direction X2 in which the solder cracking is likely to occur, so that the solder ball 9 is prevented from being cracked to the maximum extent, and the normal signal transmission of the second signal terminal 62 is ensured. Thereby, the second shield shell 63 satisfies both the high-frequency performance and the mechanical performance of the second terminal assembly 6. Further, the second surface type soldering portion 623 has four surfaces, including two oppositely disposed board surfaces and two oppositely disposed cutting thickness surfaces, the width of the board surface is greater than the width of the cutting thickness surface, in this embodiment, the second soldering surface 6231 is one of the board surfaces, the width of the first soldering surface 6231 along the first direction X2 is the width of the board surface, and the width of the cutting thickness surface along the second direction Z2 is the width of the cutting thickness surface, so that compared with the case where the second soldering surface 6231 is the cutting thickness surface, this embodiment can increase the contact area between the solder ball 9 and the second soldering surface 6231, so that the solder ball 9 is more attached to the second soldering surface 6231, and the contact force between the solder ball 9 and the second surface type soldering portion 623 in the second direction Z2 is larger, the risk of tin cracking of the solder balls 9 in the second direction Z2 is further reduced.

Further, the thickness of the second surface type soldering portion 623 along the second direction Z2 is smaller than the thickness of the second connecting portion 622 along the second direction Z2, so that the second surface type soldering portion 623 can make more space for the solder ball 9, and the risk of the solder ball 9 contacting the second shielding shell 63 is further reduced.

Referring to fig. 12 to 15, the second shield case 63 has a first wall surface B1 and a second wall surface B2 oppositely disposed in the second direction Z2, and a third wall surface B3 and a fourth wall surface B4 oppositely disposed in the first direction X2, a pair of the second surface type soldering portions 623 are located between the first wall surface B1 and the second wall surface B2, and the solder balls 9 are located between the second soldering surface 6231 and the first wall surface B1 of the second shield case 63 before the second connector 200 and the second substrate 8 are soldered. A center line between the first wall surface B1 and the second wall surface B2 of the first shield case 223 is defined as a second center line L2, and the second surface type welding portion 623 is offset with respect to the second center line L2 toward a direction opposite to the second direction Z2. Thus, the second soldering surface 6231 can be relatively far away from the first wall surface B1 of the first shielding shell 223, so as to provide a larger space for the solder ball 9, prevent the solder ball 9 from contacting the first wall surface B1 of the second shielding shell 63, and reduce the risk of short circuit of the second signal terminal 62.

Referring to fig. 12 to 15, after the solder balls 9 are pre-fixed to the second soldering surface 6231, the two second socket tail portions 631 of the second shielding shell 63 are aligned along the first direction X2, and the projections of the second socket tail portions 631 and the solder balls 9 in the first direction X2 overlap. Specifically, the second socket tail 631 is aligned with a center line extending in the first direction X2 of the solder ball 9. Compared with the two second socket tails 631 and the solder balls 9 which are completely staggered, the projection of the second socket tails 631 and the solder balls 9 in the first direction X2 of the present embodiment is overlapped, so that the soldering positions of the second socket tails 631 and the solder balls 9 can be drawn closer, the fixing positions of the second socket tails 631 and the first substrate 7 are closer to the soldering position of the solder balls 9, and the second shielding shell 63 can more effectively reduce the wobbling of the second signal terminal 62 and the risk of solder ball 9 solder cracking.

Referring to fig. 2 and 12 to 15, the second shielding shell 63 further has two pairs of second surface type tails 632 welded to the surface of the second substrate 8, and specifically, each of the second surface type tails 632 is welded to the corresponding second pad 82 of the second substrate 8. Each pair of the second surface type tails 632 is aligned along the first direction X2, and each pair of the second surface type welds 623 is located between the two pairs of the second surface type tails 632 of the second shield shell 63 along the second direction Z2. Therefore, the second surface type tail 632 can further increase the connection stability between the second shielding shell 63 and the second substrate 8, and compared with only one second surface type tail 632 on one side of a pair of second surface type soldering portions 623, the second surface type tail 632 on one side of a pair of second surface type soldering portions 623 of the present invention is advantageous for solder to climb the gap between the pair of second surface type tail 632 during soldering, so that the soldering between the second surface type tail 632 and the second substrate 8 is more stable; compared with the method of further adding the second jack type tail 631 to increase the stability between the second shielding shell 63 and the second substrate 8, the second surface type tail 632 of this embodiment can also reduce the occupied wiring space inside the second substrate 8, and can make up more wiring space for the wiring of the second signal terminal 62. Further, each of the second-surface-type welding portions 623 overlaps with the corresponding two second-surface-type tail portions 632 in the second direction Z2, i.e., the two second-surface-type tail portions 632 are respectively located on two sides of a corresponding one of the second-surface-type welding portions 623 along the second direction Z2. Therefore, each of the second surface type soldering portions 623 is shielded by the corresponding two second surface type tail portions 632 in the second direction Z2, so that the second surface type soldering portions 623 can be shielded from interference signals in the second direction Z2, and signal interference received by the second surface type soldering portions 623 of the second signal terminals 62 can be reduced. Further, the second surface type tail portion 632 extends beyond the second surface type welding portion 623 toward the second substrate 8. Thus, when the second surface type tail portion 632 contacts the second substrate 8, the second surface type soldering portion 623 and the second substrate 8 have a certain distance therebetween, which allows a certain error in the length of the second signal terminal 62, and the solder ball 9 is melted, so that the solder ball 9 can be flexibly filled between the second surface type soldering portion 623 and the second substrate 8, thereby effectively improving the coplanarity of the second signal terminal 62. In other embodiments, an end of the second shielding shell 63 adjacent to the second substrate 8 may be disposed to extend obliquely along the second direction Z2 (not shown in the second connector 200), and an air gap (not shown in the second connector 200) may be disposed between the second shielding shell 63 and the second insulating block 61, which is not limited herein.

Referring to fig. 14 and 15, the second surface type welding portion 623 includes the second welding surface 6231 and three second exposed surfaces 6232, one of the second exposed surfaces 6232 and the second welding surface 6231 are disposed opposite to each other in the second direction Z2, the other two second exposed surfaces 6232 are disposed opposite to each other in the first direction X2, one end of the second insulating block 61 adjacent to the second substrate 8 is provided with a second groove 611 recessed in a direction away from the second substrate 8, and all three second exposed surfaces 6232 are exposed to the second groove 611. Thus, the second surface type soldering portion 623 allows a certain elastic deformation in the direction opposite to the second direction Z2, which is advantageous for pre-fixing the solder ball 9, and the second surface type soldering portion 623 can be made elastic by increasing the length of the second surface type soldering portion 623 extending beyond the second insulating block 61 compared to the case where the second groove 611 is not provided, whereas the second insulating block 61 of the present invention is provided with the second groove 611, which can make the second surface type soldering portion 623 elastic even if the length of the second surface type soldering portion 623 extending beyond the second insulating block 61 is short. Further, the second insulating block 61 is provided with three second bumps 612 protruding toward the second substrate 8, the three second bumps 612 are arranged at intervals along the first direction X2, wherein each of the second soldering surfaces 6231 and two adjacent second bumps 612 jointly fix the corresponding solder ball 9 before the second connector 200 is soldered to the second substrate 8. Thus, the solder ball 9 can be pre-fixed better by the second soldering surface 6231 and two adjacent second bumps 612 to fix the solder ball 9 in three-point contact.

In summary, the electrical connector provided by the invention has the following beneficial effects:

1. the surface type welding part of the signal terminal is welded on the surface of the substrate through a tin ball, so that the coplanarity of the signal terminal can be improved, and the wiring space of the substrate occupied by the signal terminal is reduced; the shielding shell is provided with two jack-type tails, so that the shielding shell can be stably connected with the substrate and is not easy to shake, and because the shielding shell covers the outer sides of the signal terminals and the insulating block, the shielding shell can shield interference signals for the signal terminals, and the high-frequency performance of the electric connector is improved; meanwhile, the two jack-type tails are respectively positioned on two sides of the pair of surface-type welding parts along the first direction, so that the shaking of the insulating block and the signal terminal is limited by the shielding shell, the rotation or the deviation of the surface-type welding parts relative to the solder balls is further reduced, the risk of solder ball tin cracking is further reduced, and the normal signal transmission of the signal terminal is ensured. Therefore, the invention can effectively improve the high-frequency performance and the mechanical performance of the electric connector.

2. The surface type welding part is deviated towards the direction opposite to the second direction relative to the central line between the first wall surface and the second wall surface, so that the welding surface can be relatively far away from the first wall surface of the shielding shell, a larger space can be provided for the solder ball, the solder ball is prevented from contacting the first wall surface of the shielding shell, and the risk of short circuit of the signal terminal is reduced.

3. The projection of the jack tail part and the projection of the solder ball in the first direction are overlapped, the welding position of the jack tail part and the solder ball can be drawn close, the fixing position of the jack tail part and the substrate is closer to the welding position of the solder ball, the shielding shell can effectively reduce the shaking of the signal terminal, and the risk of solder ball tin cracking is effectively reduced. Further, the thickness of the surface type welding part along the second direction is smaller than that of the connecting part along the second direction, so that more space can be made for the solder balls by the surface type welding part, and the risk that the solder balls contact the shielding shell is further reduced.

4. The surface type tail part extends towards the substrate and exceeds the surface type welding part, so that the surface type welding part can be lifted away from the substrate when the surface type tail part is contacted with the substrate, a certain distance is formed between the surface type welding part and the substrate, the distance can allow a certain error to exist in the length of the signal terminal, and after the solder ball is melted, the solder ball can be flexibly filled between the surface type welding part and the substrate, and the coplanarity of the signal terminal can be effectively improved.

5. The three exposed surfaces of the surface type welding part are exposed in the groove of the insulating block, so that the surface type welding part can be allowed to generate certain elastic deformation in the direction opposite to the second direction, and the solder ball can be fixed in advance.

The above detailed description is only for the purpose of illustrating the preferred embodiments of the present invention, and not for the purpose of limiting the scope of the present invention, therefore, all technical changes that can be made by applying the present specification and the drawings are included in the scope of the present invention.

Claims

1. An electrical connector for electrically connecting to a substrate, comprising a plurality of terminal assemblies, the terminal assemblies comprising:

an insulating block;

a pair of signal terminals fixed to the insulating block, each of the signal terminals having a contact portion, a surface-type soldering portion and a connecting portion connected to the contact portion and the surface-type soldering portion, the surface-type soldering portions of the pair of signal terminals being arranged along a first direction, each of the surface-type soldering portions extending out of the insulating block and having a soldering surface facing a second direction perpendicular to the first direction, the soldering surface being used to pre-fix a solder ball before soldering the electrical connector to the substrate, each of the surface-type soldering portions being soldered to the surface of the substrate through the solder ball;

the shielding shell is coated on the outer sides of the signal terminals and the insulating block and provided with two jack-type tail parts which are electrically connected with the through hole of the substrate, and the two jack-type tail parts are respectively positioned on two sides of the surface-type welding part along the first direction, wherein the welding surface is a plate surface of the surface-type welding part, and the plate surface of the jack-type tail part faces the first direction;

the electric connector also comprises an insulating butt joint shell, wherein the insulating butt joint shell is provided with a plurality of accommodating grooves, and each accommodating groove correspondingly accommodates one terminal assembly; alternatively, the first and second electrodes may be,

the electric connector further comprises an insulating butt joint shell and a plurality of electric modules, wherein the insulating butt joint shell is provided with an accommodating cavity, the electric modules are sequentially arranged in the first direction and accommodated in the accommodating cavity, each electric module comprises an insulating body, the insulating body is provided with a plurality of accommodating grooves which are arranged in a third direction perpendicular to the first direction and the second direction, and each accommodating groove correspondingly accommodates one terminal assembly.

2. The electrical connector of claim 1, wherein the shield case has a first wall surface and a second wall surface which are oppositely disposed in the second direction, a pair of the surface-type soldering portions is located between the first wall surface and the second wall surface, the surface-type soldering portions are offset in a direction opposite to the second direction with respect to a center line between the first wall surface and the second wall surface, and wherein the solder ball is located between the soldering surface and the first wall surface before the electrical connector is soldered to the substrate.

3. The electrical connector of claim 1, wherein two of said socket tail portions are aligned along said first direction after said solder ball is pre-fixed to said soldering surface, and projections of said socket tail portions and said solder ball in said first direction overlap.

4. The electrical connector according to claim 1, wherein a thickness of the surface type soldering part in the second direction is smaller than a thickness of the connection part in the second direction.

5. The electrical connector of claim 1, wherein the shield case further has at least a pair of surface-type tails soldered to the surface of the substrate, the pair of surface-type tails being aligned along the first direction, projections of the pair of surface-type soldered portions and the pair of surface-type tails in the second direction overlapping.

6. The electrical connector of claim 5, wherein said shield shell has two pairs of surface-type tails, and a pair of said surface-type solder portions is located between the two pairs of said surface-type tails along said second direction.

7. The electrical connector of claim 5, wherein the surface-type tail extends beyond the surface-type solder portion toward the substrate.

8. The electrical connector of claim 1, wherein each of the receiving slots has an opening facing in the first direction for a corresponding one of the terminal assemblies to be assembled in the receiving slot along the first direction, the shield shell has a first wall, a bottom of the first wall extends toward the substrate, and an air gap is formed between the bottom of the first wall and the insulation block.

9. The electrical connector of claim 8, wherein the bottom of the first wall is bent toward the second direction and extends obliquely toward the substrate, and the solder balls are located between the soldering surface and the bottom of the first wall before the electrical connector is soldered to the substrate;

the shielding shell is formed by assembling two U-shaped shielding bodies in opposite directions, and the first wall surface is arranged on one of the U-shaped shielding bodies.

10. The electrical connector of claim 1, wherein the surface-type soldering portion further has three exposed surfaces, one of the exposed surfaces is opposite to the soldering surface in the second direction, the other two exposed surfaces are opposite to each other in the first direction, a groove recessed in a direction away from the substrate is formed at an end of the insulating block adjacent to the substrate, and all three exposed surfaces are exposed in the groove.