CN113408120B - Marking position setting method and device - Google Patents
Marking position setting method and device Download PDFInfo
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- CN113408120B CN113408120B CN202110643901.2A CN202110643901A CN113408120B CN 113408120 B CN113408120 B CN 113408120B CN 202110643901 A CN202110643901 A CN 202110643901A CN 113408120 B CN113408120 B CN 113408120B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/20—Design optimisation, verification or simulation
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F30/00—Computer-aided design [CAD]
- G06F30/10—Geometric CAD
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- G—PHYSICS
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- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2111/00—Details relating to CAD techniques
- G06F2111/04—Constraint-based CAD
Abstract
The application provides a marking position setting method and device, wherein the marking position setting method comprises the following steps: determining a first candidate mark region on a preset substrate according to the position parameters of the film forming region, determining a second candidate mark region in the first candidate mark region according to the position parameters of the occupied object, determining the mark position parameters in the second candidate mark region based on the coordinate constraint parameters, and determining the set positions of the marks according to the mark position parameters. According to the method, the candidate mark area is determined according to the film forming area position parameter and the occupied object position parameter, and the mark setting position is determined in the candidate mark area according to the coordinate constraint parameter.
Description
Technical Field
The present disclosure relates to the field of automated design, and in particular, to a method and apparatus for setting a marker position.
Background
The mask plate is an indispensable tool in the manufacturing process of electronic devices such as a display panel, and exposure or vapor positioning deposition by using the mask plate is an important means in the manufacturing process of the display panel. In the using process of the mask plate, the mask plate is required to be positioned through various marks. At present, a designer manually sets a marking position according to a design rule and personal experience, and the method has higher experience requirements and great dependence on the designer, has higher labor cost and time cost, and has poorer design consistency and accuracy.
Therefore, the existing method for manually designing the mask plate mark has the technical problems of high cost and poor accuracy.
Disclosure of Invention
The application provides a marking position setting method and device, which are used for solving the technical problems of high cost and poor accuracy in the existing method for manually designing mask plate marking.
The application provides a marking position setting method, which comprises the following steps:
acquiring a film forming area position parameter;
determining a first candidate mark region on a preset substrate according to the position parameters of the film forming region;
acquiring an occupant position parameter;
determining a second candidate marker region within the first candidate marker region according to the occupant location parameter;
acquiring coordinate constraint parameters;
determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter;
and determining the set position of the mark according to the mark position parameter.
In the marking position setting method of the present application, the step of acquiring the position parameter of the film forming region includes:
acquiring edge dimension parameters of the preset substrate;
acquiring the size parameters of the edge guarantee area;
and determining the position parameter of the film forming area according to the edge dimension parameter of the preset substrate and the dimension parameter of the edge guarantee area.
In the marking position setting method of the present application, the step of acquiring the position parameter of the occupant includes:
detecting a marker occupancy within the first candidate marker region;
calculating position data of the marker occupancy within the first candidate marker region;
an occupant location parameter is determined from the location data of the marker occupant within the first candidate marker region.
In the marking position setting method of the present application, the step of acquiring the position parameter of the occupant includes:
detecting a device occupancy within the first candidate tag region;
calculating position data of the device occupancy within the first candidate marker region;
an occupant location parameter is determined from the device occupant location data within the first candidate marker region.
In the marker position setting method of the present application, the step of determining a second candidate marker region within the first candidate marker region according to the occupant position parameter includes:
determining an occupied area of the occupied object according to the occupied object position parameter;
and removing the occupied area of the occupied object from the first candidate mark area to obtain the second candidate mark area.
In the marking position setting method of the present application, the coordinate constraint parameter includes a lateral coordinate constraint parameter, and the step of determining the marking position parameter in the second candidate marking area based on the coordinate constraint parameter includes:
determining the transverse coordinates of the marks according to the transverse coordinate constraint parameters;
and determining the marker position parameter according to the transverse coordinates of the marker.
In the marking position setting method of the present application, the coordinate constraint parameter further includes a longitudinal coordinate constraint parameter, and the step of determining the marking position parameter in the second candidate marking area based on the coordinate constraint parameter further includes:
determining the longitudinal coordinates of the mark according to the longitudinal coordinate constraint parameters;
and determining the position parameter of the mark according to the transverse coordinate and the longitudinal coordinate.
In the marking position setting method of the present application, the coordinate constraint parameter includes a bi-directional coordinate constraint parameter, and the step of determining a marking position parameter in the second candidate marking area based on the coordinate constraint parameter further includes:
determining the transverse coordinates of the mark and the longitudinal coordinates of the mark according to the bidirectional coordinate constraint parameters;
and determining the mark position parameter according to the transverse coordinates of the mark and the longitudinal coordinates of the mark.
In the marking position setting method of the present application, the step of obtaining the coordinate constraint parameter further includes:
acquiring a mark quantity parameter and a coordinate range parameter;
the step of determining marker position parameters within the second candidate marker region based on the coordinate constraint parameters includes:
the marker location parameter is determined within the second candidate marker region based on the coordinate constraint parameter, the marker quantity parameter, and the coordinate range parameter.
The present application also provides a marker position setting device, which includes:
the first acquisition module is used for acquiring the position parameters of the film forming area;
a first determining module, configured to determine a first candidate mark area on a preset substrate according to the film forming area position parameter;
the second acquisition module is used for acquiring the position parameters of the occupied objects;
a second determining module, configured to determine a second candidate marker region within the first candidate marker region according to the occupant location parameter;
the third acquisition module is used for acquiring the coordinate constraint parameters;
a third determining module, configured to determine a marker position parameter in the second candidate marker region based on the coordinate constraint parameter;
and the fourth determining module is used for determining the set position of the mark according to the mark position parameter.
The beneficial effects of this application are: the application provides a marking position setting method and device, wherein the marking position setting method comprises the following steps: acquiring a film forming area position parameter; determining a first candidate mark region on a preset substrate according to the position parameters of the film forming region; acquiring an occupant position parameter; determining a second candidate marker region within the first candidate marker region according to the occupant location parameter; acquiring coordinate constraint parameters; determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter; and determining the set position of the mark according to the mark position parameter. According to the method, the candidate mark area is determined through the film forming area position parameter and the occupied object position parameter, and the mark setting position is determined in the candidate mark area according to the coordinate constraint parameter.
Drawings
Technical solutions and other advantageous effects of the present application will be made apparent from the following detailed description of specific embodiments of the present application with reference to the accompanying drawings.
Fig. 1 is a flowchart of an application scenario of a marker position setting method provided in an embodiment of the present application.
Fig. 2 is a flowchart of a method for setting a marker position according to an embodiment of the present application.
Fig. 3 is a schematic diagram of a mark layout set by the mark position setting method provided in the present application.
Fig. 4 is a schematic structural diagram of a marking position setting device according to an embodiment of the present application.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the present application. All other embodiments, which can be made by those skilled in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
The embodiment of the application provides a marking position setting method and device, wherein the marking position setting method comprises the following steps: acquiring a film forming area position parameter; determining a first candidate mark region on a preset substrate according to the position parameters of the film forming region; acquiring an occupant position parameter; determining a second candidate marker region within the first candidate marker region according to the occupant location parameter; acquiring coordinate constraint parameters; determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter; and determining the set position of the mark according to the mark position parameter. According to the method and the device for determining the mark position, the candidate mark region is determined through the position parameters of the film forming region and the position parameters of the occupied object, the mark setting position is determined in the candidate mark region according to the coordinate constraint parameters, the mark position is set conveniently through automation, the accuracy of designing the mask plate mark is improved, and the production cost is reduced.
Referring to fig. 1, fig. 1 is a flowchart of an application scenario of a marking position setting method according to an embodiment of the present application. The typesetting design of the mask plate needs to be carried out through the following steps: typesetting; placing a fixed mark; wiring arrangement; placing the non-fixed marks; interference judgment; performing exposure test analysis; and finishing typesetting of the mask. Wherein, typesetting refers to: the size characteristics and the structural element characteristics of the mask plate are determined. The fixed mark placement means: and determining marks of fixed positions to be set on the mask plate, and manually setting the positions of the fixed marks. The routing arrangement means: and laying test wires, functional wires and the like required by the mask plate on the mask plate. The non-fixed mark placement means: the mask plate is required to be set with marks designed according to factors such as specific size and requirements, and the mark position setting method provided by the embodiment of the application aims at placing the non-fixed marks. The interference judgment means: interference judgment is carried out on the fixed marks, the wiring and the non-fixed marks which are also placed, and whether interference exists between the fixed marks, the wiring and the non-fixed marks is determined; and if the interference condition exists, returning to carry out the placement of the fixed marks again. Exposure test analysis refers to: performing functional tests of the test wiring and the functional wiring, performing exposure tests, and judging whether problems exist; if there is a problem, returning to the step of carrying out the running line arrangement again. Finally, finishing typesetting design of the mask plate.
Referring to fig. 2, fig. 2 is a flowchart of a method for setting a marker position according to an embodiment of the present application. The marking position setting method provided by the embodiment of the application comprises the following steps:
step S101, obtaining the position parameters of the film forming area.
Specifically, the step of obtaining the position parameter of the film forming area includes: acquiring edge dimension parameters of the preset substrate; acquiring the size parameters of the edge guarantee area; and determining the position parameter of the film forming area according to the edge dimension parameter of the preset substrate and the dimension parameter of the edge guarantee area.
For example, the edge dimension parameters of the preset substrate are obtained as follows: 100 mm long and 80 mm wide; the size parameters of the obtained edge guarantee area are as follows: 15 mm from the edge; determining the position parameters of a film forming area according to the edge size parameters of the preset substrate and the size parameters of the edge guarantee area, wherein the position parameters are as follows: the size of the film forming area is 85 mm long and 65 mm wide, a coordinate system is established in the film forming area, and the size data of the edge of the film forming area are calibrated to obtain the position parameters of the film forming area.
For another example, set Enclosure to glass parameters: for defining placement of the marks in the film forming region, the distance of the film forming region from the edge of the substrate may be set to 15 mm.
Step S102, determining a first candidate mark area on a preset substrate according to the film forming area position parameters.
Specifically, the position parameter of the film forming area is determined as a first candidate mark area corresponding to the film forming area on the preset substrate, wherein the first candidate mark area is an effective area for setting a mark position.
Step S103, acquiring the position parameters of the occupied objects.
In particular, the occupancy includes a marker occupancy and a device occupancy. The marker occupancy means: the marks already present in the first candidate mark area, such as by manually set fixed marks or the like. The device occupancy means: the traces, electronic components, etc. already present in the first candidate mark area, such as the test traces and functional traces, already set.
The step of acquiring the position parameter of the occupancy comprises the following steps: detecting a marker occupancy within the first candidate marker region; calculating position data of the marker occupancy within the first candidate marker region; an occupant location parameter is determined from the location data of the marker occupant within the first candidate marker region.
For example, the Forbidden Area parameter is set: the method is used for selecting the forbidden zone layer and is mainly used for preventing the interference between the newly-arranged mark and the mark in the forbidden zone.
Further, the step of obtaining the occupant location parameter further includes: detecting a device occupancy within the first candidate tag region; calculating position data of the device occupancy within the first candidate marker region; an occupant location parameter is determined from the device occupant location data within the first candidate marker region.
For example, a block Layer parameter is set: the method is used for selecting an obstacle layer and is mainly used for preventing the newly arranged mark from interfering with obstacles, such as test wires, functional wires and the like.
Step S104, determining a second candidate mark area in the first candidate mark area according to the occupation object position parameter.
Specifically, the step of determining a second candidate marker region within the first candidate marker region according to the occupant location parameter includes: determining an occupied area of the occupied object according to the occupied object position parameter; and removing the occupied area of the occupied object from the first candidate mark area to obtain the second candidate mark area.
Step S105, acquiring coordinate constraint parameters.
Specifically, the coordinate constraint parameters include at least one of a lateral coordinate constraint parameter, a longitudinal coordinate constraint parameter, and a bi-directional coordinate constraint parameter.
Optionally, the step of obtaining the coordinate constraint parameter further includes: the number of marks parameter and the coordinate range parameter are obtained. Wherein the number of marks parameter refers to a parameter defining the number of marks, and the coordinate range parameter refers to a parameter defining a coordinate value range.
For example, the parameters for the coordinate range may be: a Max X Distance parameter for defining an X coordinate Distance maximum for all of the current markers; a Max Y Distance parameter for defining a Y coordinate Distance maximum for all of the current markers; a Min X Distance parameter for defining the minimum X coordinate Distance for all the markers currently; a Min Y Distance parameter, which is used to define the Y-coordinate Distance minimum of all Marks currently.
And step S106, determining a marker position parameter in the second candidate marker region based on the coordinate constraint parameter.
The coordinate constraint parameters include lateral coordinate constraint parameters, and the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameters includes: determining the transverse coordinates of the marks according to the transverse coordinate constraint parameters; and determining the marker position parameter according to the transverse coordinates of the marker.
For example, the X-coordinate constraint parameter is set to By Left & Right Sides Of Mask-column (Unshared), i.e. defining the newly set mark must be arranged in two symmetrical columns within the second candidate mark area, i.e. defining the lateral coordinates of the newly set mark. Setting X: the number of newly set marks is defined by the location On columns.
Further, the coordinate constraint parameter further includes a longitudinal coordinate constraint parameter, and the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter further includes: determining the longitudinal coordinates of the mark according to the longitudinal coordinate constraint parameters; and determining the position parameter of the mark according to the transverse coordinate and the longitudinal coordinate.
For example, a Y-coordinate constraint parameter Matrix On Y Distance Series is set, that is, a Y-direction mark pitch that must be maintained for each new mark column is required. Setting Y: locate On m Rows, i.e., defines the number of newly set tags in each column.
Further, the coordinate constraint parameter includes a bi-directional coordinate constraint parameter, and the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter further includes: determining the transverse coordinates of the mark and the longitudinal coordinates of the mark according to the bidirectional coordinate constraint parameters; and determining the mark position parameter according to the transverse coordinates of the mark and the longitudinal coordinates of the mark.
For example, XY Around Center Of Glass is set, i.e., a mark is required to be set at or near the center point in the candidate mark region. Setting XY: by Corner Of Panel, i.e. the center of each marking area must be defined with a marking. XY, coordinates, is set, i.e. the coordinate system in which the current mark is located is specified. XY By Lens' Center Line is set, i.e., a setting of a mark within a certain range of a specific prism is specified. Setting XY Mark Placing By Scopes, i.e., setting a mark in a specified X, Y coordinate area, can define a plurality of areas, one area setting one mark. XY Matrix On n Cols & m Rows is set, i.e., all the newly set marks are required to form a Matrix form of n Rows and m columns. Setting XY Mirror X, i.e. defining all the marks present, must form a symmetrical layout about the X axis. Setting XY, mirror Y, i.e. defining that all Marks at present must form a symmetrical layout about the Y-axis.
Step S107, determining the set position of the mark according to the mark position parameter.
Specifically, the specific setting position of the mark is determined in the second candidate mark area according to the mark specific position data determined in the above steps, so that the mark is set.
The above-described marker position setting method will be described with reference to specific embodiments:
referring to fig. 3, fig. 3 is a schematic diagram of a mark layout set by the mark position setting method provided in the present application.
First, size data of a preset substrate is determined: the preset substrate is symmetrical along the X axis and the Y axis respectively, and has a symmetry center O, and the preset substrate boundary data is 425 mm in the X direction and 700 mm in the Y direction.
Then, the size (20 mm) of the edge guard region was removed to obtain size data of the film formation region.
Then, specific positions of the marks are set in the film forming region according to the coordinate constraint parameters (this embodiment is illustrated by the number of occupied objects in the film forming region being 0), which are specifically as follows:
all marks keep central symmetry with a symmetry center O;
x1 is equal to X2, L is less than or equal to 746 millimeters;
y (+) and Y (-) are all less than or equal to 640 mm, and Y (+) and Y (-) may be unequal;
the marks are arranged in 3 rows and 2 columns, and the arrangement layout is symmetrical about the X-axis and the Y-axis, respectively.
In summary, the method for setting the mark position provided in the embodiment of the present application determines the candidate mark region through the film forming region position parameter and the occupied object position parameter, and determines the mark setting position in the candidate mark region according to the coordinate constraint parameter, so that the setting of the mark position is conveniently performed through automation, which is favorable for improving the accuracy of designing the mask plate mark, and reducing the production cost.
The embodiment of the application further provides a marking position setting device, referring to fig. 4, the marking position setting device includes: a first acquisition module 401, a first determination module 402, a second acquisition module 403, a second determination module 404, a third acquisition module 405, a third determination module 406, and a fourth determination module 407.
The first obtaining module 401 is configured to obtain a film forming area position parameter; the first determining module 402 is configured to determine a first candidate mark area on a preset substrate according to the film forming area position parameter; the second obtaining module 403 is configured to obtain an occupant location parameter; the second determining module 404 is configured to determine a second candidate marker region within the first candidate marker region according to the occupant location parameter; the third obtaining module 405 is configured to obtain a coordinate constraint parameter; the third determining module 406 is configured to determine a marker location parameter in the second candidate marker region based on the coordinate constraint parameter; the fourth determining module 407 is configured to determine a set position of the marker according to the marker position parameter.
The first obtaining module 401 is further configured to obtain an edge dimension parameter of the preset substrate, and is configured to obtain a dimension parameter of an edge guarantee area, and determine the position parameter of the film forming area according to the edge dimension parameter of the preset substrate and the dimension parameter of the edge guarantee area.
The second acquisition module 403 is configured to detect a marker occupancy within the first candidate marker region, to calculate position data of the marker occupancy within the first candidate marker region, and to determine an occupancy position parameter based on the position data of the marker occupancy within the first candidate marker region.
The second acquisition module 403 is further configured to detect a device occupant in the first candidate marker region, to calculate position data of the device occupant in the first candidate marker region, and to determine an occupant position parameter based on the position data of the device occupant in the first candidate marker region.
The second determining module 404 is configured to determine a occupation area of an occupant according to the occupant location parameter, and further configured to remove the occupation area of the occupant from the first candidate marker area, to obtain the second candidate marker area.
The third determining module 406 is configured to determine the lateral coordinates of the mark according to the lateral coordinate constraint parameter, and determine the mark position parameter according to the lateral coordinates of the mark.
The third determining module 406 is further configured to determine a longitudinal coordinate of the mark according to the longitudinal coordinate constraint parameter, and determine a position parameter of the mark according to the lateral coordinate and the longitudinal coordinate.
The third determining module 406 is further configured to determine a lateral coordinate of a marker and a longitudinal coordinate of the marker according to the bi-directional coordinate constraint parameter, and determine the marker position parameter according to the lateral coordinate of the marker and the longitudinal coordinate of the marker.
The third obtaining module 405 is further configured to obtain a number of marks parameter and a coordinate range parameter. The third determining module 406 is further configured to determine the marker location parameter within the second candidate marker region based on the coordinate constraint parameter, the marker quantity parameter, and the coordinate range parameter.
It should be noted that, although the present application discloses the above embodiments, the above embodiments are not intended to limit the present application, and those skilled in the art may make various changes and modifications without departing from the spirit and scope of the present application, so that the scope of the present application is defined by the claims.
Claims (9)
1. The marking position setting method is characterized by being used for determining the setting position of the mask plate marking, and comprises the following steps:
acquiring a film forming area position parameter;
determining a first candidate mark region on a preset substrate according to the position parameters of the film forming region;
acquiring an occupant position parameter;
determining a second candidate marker region within the first candidate marker region according to the occupant location parameter;
acquiring coordinate constraint parameters;
determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter;
determining the set position of the mark according to the mark position parameter;
wherein the step of determining the first candidate mark region on the preset substrate according to the film forming region position parameter comprises the following steps: determining the position parameter of the film forming area on a preset substrate corresponding to the film forming area as a first candidate mark area; determining a second candidate marker region within the first candidate marker region according to the occupant location parameter, comprising: determining an occupied area of the occupied object according to the occupied object position parameter; and removing the occupied area of the occupied object from the first candidate mark area to obtain the second candidate mark area.
2. The method of setting a mark position according to claim 1, wherein the step of acquiring the film formation region positional parameter comprises:
acquiring edge dimension parameters of the preset substrate;
acquiring the size parameters of the edge guarantee area;
and determining the position parameter of the film forming area according to the edge dimension parameter of the preset substrate and the dimension parameter of the edge guarantee area.
3. The marker position setting method according to claim 1, wherein the step of acquiring the occupant position parameter includes:
detecting a marker occupancy within the first candidate marker region;
calculating position data of the marker occupancy within the first candidate marker region;
an occupant location parameter is determined from the location data of the marker occupant within the first candidate marker region.
4. The marker position setting method according to claim 1, wherein the step of acquiring the occupant position parameter includes:
detecting a device occupancy within the first candidate tag region;
calculating position data of the device occupancy within the first candidate marker region;
an occupant location parameter is determined from the device occupant location data within the first candidate marker region.
5. The marker position setting method according to claim 1, wherein the coordinate constraint parameter includes a lateral coordinate constraint parameter, and the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter includes:
determining the transverse coordinates of the marks according to the transverse coordinate constraint parameters;
and determining the marker position parameter according to the transverse coordinates of the marker.
6. The marker position setting method according to claim 5, wherein the coordinate constraint parameter further includes a longitudinal coordinate constraint parameter, and the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter further includes:
determining the longitudinal coordinates of the mark according to the longitudinal coordinate constraint parameters;
and determining the position parameter of the mark according to the transverse coordinate and the longitudinal coordinate.
7. The marker position setting method according to claim 1, wherein the coordinate constraint parameter includes a bi-directional coordinate constraint parameter, and the step of determining a marker position parameter within the second candidate marker region based on the coordinate constraint parameter further includes:
determining the transverse coordinates of the mark and the longitudinal coordinates of the mark according to the bidirectional coordinate constraint parameters;
and determining the mark position parameter according to the transverse coordinates of the mark and the longitudinal coordinates of the mark.
8. The marker position setting method according to claim 1, wherein the step of acquiring the coordinate constraint parameter further comprises:
acquiring a mark quantity parameter and a coordinate range parameter;
the step of determining marker position parameters within the second candidate marker region based on the coordinate constraint parameters includes:
the marker location parameter is determined within the second candidate marker region based on the coordinate constraint parameter, the marker quantity parameter, and the coordinate range parameter.
9. A mark position setting device for determining a set position of a mark of a mask, the mark position setting device comprising:
the first acquisition module is used for acquiring the position parameters of the film forming area;
a first determining module, configured to determine a first candidate mark area on a preset substrate according to the film forming area position parameter;
the second acquisition module is used for acquiring the position parameters of the occupied objects;
a second determining module, configured to determine a second candidate marker region within the first candidate marker region according to the occupant location parameter;
the third acquisition module is used for acquiring the coordinate constraint parameters;
a third determining module, configured to determine a marker position parameter in the second candidate marker region based on the coordinate constraint parameter;
a fourth determining module, configured to determine a setting position of the marker according to the marker position parameter;
the first determining module is specifically configured to determine a film forming area corresponding to the film forming area on the preset substrate as a first candidate mark area; the second determining module is specifically configured to determine an occupied area of the occupant according to the occupant position parameter; and removing the occupied area of the occupied object from the first candidate mark area to obtain the second candidate mark area.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102866576A (en) * | 2012-08-27 | 2013-01-09 | 京东方科技集团股份有限公司 | Mask plate group and method for determining alignment precision range by using mask plate group |
| CN206282833U (en) * | 2016-12-28 | 2017-06-27 | 上海天马微电子有限公司 | A kind of mask plate alignment system |
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| CN103885231B (en) * | 2014-03-11 | 2016-04-20 | 京东方科技集团股份有限公司 | Display panel labelling apparatus and display panel labeling method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102866576A (en) * | 2012-08-27 | 2013-01-09 | 京东方科技集团股份有限公司 | Mask plate group and method for determining alignment precision range by using mask plate group |
| CN206282833U (en) * | 2016-12-28 | 2017-06-27 | 上海天马微电子有限公司 | A kind of mask plate alignment system |
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