Disclosure of Invention
In view of the shortcomings of the prior art, it is an object of the present invention to provide a super stethoscope.
According to the present invention there is provided a super stethoscope comprising:
the flexible substrate is a flaky flexible substrate with high biocompatibility, and a sucker for adsorbing human skin is arranged on the lower surface of the flexible substrate;
the acoustic sensor is arranged on the sucker and used for collecting heartbeat sound or a cardiac state and providing basis for measuring heart rate and blood pressure;
an electrical sensor disposed on the suction cup for measuring heart rate, temperature and humidity and for measuring electrolyte concentration in sweat;
the optical sensor is arranged on the sucker and is used for collecting oxygen saturation, blood pressure, heart pulse and body temperature so as to assist the acoustic sensor and improve the accuracy of measuring heart rhythm and blood pressure;
a mechanical sensor disposed on the flexible substrate, the mechanical sensor for measuring a state of motion;
the controller acquires data signals collected by the acoustic sensor, the electric sensor, the optical sensor and the mechanical sensor, and sends the collected signals to the AI terminal, so that monitoring and early warning of vital sign parameters of a human body are realized.
Preferably, the upper surface of flexible substrate is equipped with flexible touch screen, flexible touch screen pass through control circuit with acoustic sensor the electric sensor the optical sensor mechanical sensor with the controller electricity links for control operation stethoscope mode, and show human-computer interaction's information data.
Preferably, the upper surface of the flexible substrate is provided with an antenna, and the antenna is used for absorbing wireless radio frequency energy for power supply and transmitting signals in a bidirectional and interactive mode.
Preferably, the antennas are annularly distributed on the periphery of the flexible touch screen.
Preferably, a metal thin film for preventing interference of electricity, magnetism, waves and light is arranged on the outer surface of the suction cup, and the metal thin film is positioned on the outer sides of the acoustic sensor, the electric sensor, the optical sensor and the mechanical sensor.
Preferably, the acoustic sensor includes a MEMS acoustic-electric conversion array chip and a doppler chip, wherein the MEMS acoustic-electric conversion array chip is used to collect the sound of the heartbeat, and the doppler chip is used to monitor the state of the heartbeat.
Preferably, the doppler chip adopts an array type directional positioning doppler chip to capture the motion state of the heart, so as to provide a basis for accurately measuring the heart rhythm and the blood pressure and provide an effective pathological basis for patients with the heart disease.
Preferably, the optical sensor comprises a passive photoelectric detection sensing chip and an active photoelectric detection sensing chip, and an isolation screen is arranged between the passive photoelectric detection sensing chip and the active photoelectric detection sensing chip, and the isolation screen is used for blocking light sources with different frequency bands emitted by the external and the active photoelectric detection sensing chip so as to avoid detection errors, wherein the passive photoelectric detection sensing chip detects the body temperature of the human body by absorbing infrared wavelengths emitted by the human body; the active photoelectric detection sensing chip detects the physical sign change of a human body by emitting spectrums with different wavelengths to enter the human epidermis and then detecting the change of the physical sign of the human body, and is used for monitoring the change of the blood pressure, the heart rate, the oxygen saturation amount and the blood sugar vital sign of the human body.
Preferably, the passive photoelectric detection sensing chip adopts an MEMS infrared energy spectrum catcher; the active photoelectric detection sensor chip adopts a photoelectric conversion sensor chip.
Preferably, a super stethoscope comprises: the energy acquisition and storage module is used for absorbing solar energy, temperature difference energy, respiratory energy and radio frequency energy in the environment and converting the acquired energy into electric energy for storage, provides a power supply for the controller and other components and realizes the wireless autonomous power supply function of the super stethoscope.
Compared with the prior art, the invention has at least one of the following beneficial effects:
the stethoscope disclosed by the invention is a wireless intelligent electronic stethoscope which is based on MEMS integration, adopts various sensors and multi-principle detection, is matched and complemented with each other, greatly improves the detection accuracy rate, avoids the defect of single detection, has the functions of information storage, energy storage, man-machine interaction, wireless power supply, continuous real-time monitoring, real-time early warning and the like, and can perform intelligent management through an AI terminal (artificial intelligent service terminal) in a network environment.
Detailed Description
The present invention will be described in detail with reference to specific examples. The following examples will assist those skilled in the art in further understanding the invention, but are not intended to limit the invention in any way. It should be noted that variations and modifications can be made by persons skilled in the art without departing from the spirit of the invention. All falling within the scope of the present invention.
Referring to fig. 1, a schematic diagram of the operation principle of a super stethoscope according to a preferred embodiment of the present invention is shown, the super stethoscope including: flexible substrates, acoustic sensors, electrical sensors, optical sensors, mechanical sensors, and controllers.
Wherein, flexible substrate is the flexible substrate of the sheet structure that has high biocompatibility, and flexible substrate lower surface is equipped with the sucking disc that is used for adsorbing human skin.
The sound sensor is arranged on the sucker and used for collecting heartbeat sound or a cardiac state and providing basis for measuring heart rate and blood pressure.
The electric sensor is arranged on the sucker and used for measuring the heart rhythm, the temperature and the humidity and measuring the concentration of electrolytes in sweat.
The optical sensor is arranged on the sucker and used for collecting oxygen saturation, blood pressure, heart pulse and body temperature so as to assist the acoustic sensor and improve the accuracy of measuring heart rhythm and blood pressure.
The mechanical sensor is arranged on the flexible base material and used for measuring the motion state.
An intelligent sensing network is formed by an acoustic sensor, an electric sensor, an optical sensor and a mechanical sensor. The temperature can be measured by the optical sensor and the electric sensor, wherein the temperature measurement by the optical sensor does not need heat conduction and depends on the radiation principle; the electric sensor mainly utilizes thermal resistance and thermocouple temperature measurement, and the electric sensor needs to be in contact with the skin when measuring temperature. Complementary detection can be realized with photosensor, electric sensor dual sensor mode, not only can the weighted average, moreover because the mode of information acquisition is different, a certain physiological phenomenon can be more accurate reaction. The super stethoscope can be prepared by adopting an MEMS wafer-level integrated manufacturing method, and the volume of the super stethoscope can not be obviously changed even if the temperature is measured by adopting a double-sensor working mode.
Referring to fig. 1, the controller is arranged on the flexible substrate, acquires data signals collected by the acoustic sensor, the electric sensor, the optical sensor and the mechanical sensor, and sends the collected signals to an AI terminal (artificial intelligence service terminal) through the multifunctional information interaction platform, so that monitoring and early warning of vital sign parameters of a human body are realized. As a preferred mode, the controller utilizes the MCU to process information and utilizes the IC memory chip to store the information; and carrying out wireless information transmission by utilizing the Bluetooth chip.
The data signals collected by the acoustic sensor, the electric sensor, the optical sensor and the mechanical sensor realize non-contact physiological detection, and the AI terminal processes the collected data signals to judge whether the physiological activity state of the human body is normal. The heart rate is measured to judge the working state of the heart by detecting the electrophysiological working state of the heart, the heart rate is more accurate and effective than heart rate detection, the heart rate only detects the movement and immobility of the heart, and the heart rate can acquire how the heart moves; the temperature is collected for indirectly reflecting the motion state of the heart, when the body is infected, violently moves and the like, the heart can accelerate to beat so as to provide more blood for maintaining work needs, the body temperature can obviously rise when the heart beats at a high speed, and in addition, the body temperature can early warn high fever, blood boiling and other phenomena. The humidity is measured because 75% of human body is water, except for urination, sweat is another drainage way, if a large amount of water in the human body is lost, not only can various pathological phenomena be generated, but also electrolyte confusion of the human body can be caused, the sweat of the human body contains a large amount of electrolyte such as K, Na, and once the electrolyte is lost, a plurality of visceral organs of the human body cannot work normally.
The super stethoscope integrates sound, light, mechanical and electrical technologies based on MEMS multi-element integration, integrates the sound, light, mechanical and electrical technologies, integrates the sound, light, mechanical and electrical inductors in a microsystem manner by means of a flexible electronic manufacturing technology, adopts four sensing units of sound, light, mechanical and electrical to share information, works in cooperation, compensates each other, and greatly improves the detection precision. The super stethoscope has the functions of detecting abnormal noise, electrolytes, blood oxygen saturation, heart rhythm, electrocardio, blood pressure, body temperature and sweat of the lung of a human body. In addition, the system is also provided with a human-computer interaction module, an information processor, a wireless intelligent power supply module and the like, and has the capabilities of remote wireless power supply, remote information interaction, continuous real-time monitoring and artificial intelligent analysis of AI terminal data. The electrophysiological detection of the super stethoscope mainly comprises an MEMS electrode functional special-shaped electrode array, wherein a plurality of groups of special-shaped electrodes are made of different functional materials, have the capabilities of measuring heart rhythm, measuring temperature and humidity and measuring the concentration of electrolytes in sweat, and can transmit collected data signals to an AI terminal; meanwhile, the MCU compares the acquired data, and when the comparison exceeds the allowable range value of the vital sign parameter model of the human body, the MCU starts an early warning program to remind the person, and calls for help through wireless transmission to give an alarm through the remote AI terminal. The super stethoscope has a patch type overall structure, and the volume of the super stethoscope is only the size of a matchbox.
In some other preferred embodiments, the flexible touch screen is disposed on the upper surface of the flexible substrate, and the flexible touch screen is electrically connected to the acoustic sensor, the electrical sensor, the optical sensor, the mechanical sensor and the controller through the control circuit, and is used for selecting the working mode of the stethoscope, performing human-computer interaction and displaying information data.
In some other preferred embodiments, the upper surface of the flexible substrate is provided with an antenna, and the antenna is used for absorbing wireless radio frequency energy for power supply and transmitting signals in a bidirectional and interactive mode. The antenna is annularly distributed on the periphery of the flexible touch screen. The antenna comprises a plurality of concentric annular antennas with sequentially increased outer diameters.
In other preferred embodiments, the outer surface of the sucker is provided with a metal film for preventing electric, magnetic, wave and optical interference, and the metal film is positioned outside the acoustic sensor, the electric sensor, the optical sensor and the mechanical sensor.
In other preferred embodiments, a flexible touch screen is arranged above the flexible film antenna layer and used for selecting a working model of the stethoscope, interacting man-machine and displaying information data.
In some other preferred embodiments, the acoustic sensor includes a MEMS acousto-electric conversion array chip and a doppler chip. The MEMS acousto-electric conversion array chip can realize ultra-wideband audio acquisition, can better acquire more subtle abnormal noise of the lung, simultaneously captures the dynamic motion state of the heart by adopting the Doppler principle, and is also provided with a secondary echo acquisition system. Different from the theory of operation of ordinary stethoscope mechanical type sound collection and conveying, wireless intelligent electron stethoscope adopts MEMS acoustoelectric conversion array chip, not only can widen acquisition frequency, high frequency sound wave and low frequency sound wave that ordinary stethoscope can not gather, but also the Doppler chip of array orientation location has been adopted, the motion state of accurate seizure heart to provide the basis of accurate measurement rhythm of the heart and blood pressure, can provide effectual pathology basis for the heart disease patient simultaneously.
The optical sensor comprises a passive photoelectric detection sensing chip and an active photoelectric detection sensing chip, and an isolation screen is arranged between the passive photoelectric detection sensing chip and the active photoelectric detection sensing chip and used for blocking light sources with different frequency bands (wavelengths) emitted by the external (light sources with different wavelengths in the environment) and the active photoelectric detection sensing chip so as to avoid generating detection errors. The passive photoelectric detection sensing chip adopts an MEMS infrared energy spectrum catcher; the passive photoelectric detection sensing chip detects the body temperature of a human body by absorbing infrared wavelength emitted by the human body; the active photoelectric detection sensor chip adopts a photoelectric conversion sensor chip. The active photoelectric detection sensing chip detects the physical sign change of a human body by emitting the spectrums with different wavelengths to enter the epidermis of the human body and then detecting the change of the vital signs of the human body, so that the change of the blood pressure, the heart rate, the oxygen saturation and the blood sugar of the human body can be monitored and used as an auxiliary reference of an acoustic measurement method to improve the accuracy of the blood pressure and the heart rate.
In other partially preferred embodiments, the photoelectric conversion sensor chip comprises four types of light emitting diodes (red, yellow, blue and green) and photodiodes; each LED emits light with different wavelengths of 50-980nm, and the red, yellow, blue and green LEDs are distributed on the periphery of the photodiode in an annular manner.
The four light emitting diodes are respectively a 50nm-980nm green light frequency scanning LED, a 50nm-980nm yellow light frequency scanning LED, a 50nm-980nm red light frequency scanning LED and a 50nm-980nm blue light frequency scanning LED, and an annular isolation belt is arranged on a light layer of the photodiode.
Working principle of the optical sensor: high-sensitivity photodiodes and four types of red, yellow, blue and green LED frequency scanning light-emitting diodes (with different wavelengths of 50-980nm emission). Optically isolated from the emitter by an opaque optical baffle. The working principle is that light is irradiated into the skin, blood and surrounding tissue will absorb different amounts of light, respectively, and the non-absorbed light is reflected back to the detector. By using the measured values of the absorption amount measured at different wavelengths, the physiological characteristic parameters such as pulse rate and blood oxygen saturation can be determined. For example: the blood oxygen saturation is calculated from the different absorbances of blood for red light (660nm) and infrared light (940 nm). The quality of the measurement depends strongly on the achievable signal-to-noise ratio and the linearity of the photodetector.
The optical sensor is born by a photoelectric conversion sensor chip (similar to SFH7060), blood oxygen saturation, heart rate and blood pressure are calculated by modeling transmission and reflectivity of energy spectrums with different frequencies and different wavelengths (such as red light, yellow light, blue light and green light) after a human body is subjected to frequency scanning (the wavelength is 50-980 nm) according to a correlation law, and the optical sensor is used as an acoustic method to provide auxiliary reference so as to improve the accuracy of the blood pressure and the heart rate. The infrared temperature measurement adopts an MEMS infrared spectrum catcher, the common temperature measurement adopts a thermal resistor or thermocouple mode, a layer of good heat conducting medium material is needed for heat conduction during temperature measurement, the heat balance of a sensor after temperature measurement needs balance time of several to dozens of minutes, and inaccurate temperature measurement can be caused if the sensor is not well contacted. The infrared energy spectrum frequency sweeping and capturing mode is adopted, the thermal motion energy level of the molecules of the human body is captured to judge the body temperature of the human body, therefore, a heat conduction medium is not needed, a heat balance process is not needed, the rapid and effective characteristics are achieved, the measurement speed is extremely high due to the fact that thermoelectric conversion is adopted in the part, and the measurement efficiency is greatly improved.
In other preferred embodiments, the electrical sensor comprises an MEMS electrode functional irregular electrode array, and the MEMS electrode functional irregular electrode array is formed by arranging a plurality of groups of irregular electrodes made of different functional materials in an array, and has the capability of measuring heart rate, measuring temperature, measuring humidity, and measuring the concentration of electrolytes in sweat.
In other preferred embodiments, the mechanical sensor is an MEMS electronic gyro chip, which is mainly used to detect the motion state of the human body.
In some other preferred embodiments, the super stethoscope further comprises an energy collection and storage module, wherein the energy collection and storage module is used for collecting and storing solar energy, temperature difference energy, respiratory energy and radio frequency energy in the environment; the output end of the energy acquisition and storage module is connected with the input end of the information processor to provide electric energy for the information processor. The super stethoscope realizes wireless self-energy supply.
Super stethoscope adopts wireless two-way interactive mode and cell-phone, AI terminal to carry out interdynamic, and the temperature sensing sensor of wireless intelligent electron stethoscope, integrative integrated intelligent analysis and processing (MCU) + Bluetooth (BLE) module, energy module of low-power consumption, modules such as wireless power supply energy received energy collection and energy storage module, information interaction all integrate on high biocompatible flexible substrate through integrated flexible electron manufacturing technology is received a little to the non-silicon.
The super stethoscope can be prepared by adopting an MEMS + IC wafer-level three-dimensional integrated manufacturing method, and comprises the following steps:
1. IC design, MEMS, IC process flow sheet, wafer-level MEMS + IC system three-dimensional integration, chip-level integrated system assembly and device flexible packaging.
2. And (5) developing and debugging software.
3. And (5) product inspection.
The process flow of the wafer-level three-dimensional integrated manufacturing is as follows:
firstly, preparing a chip inner through hole with the diameter of 1-3 mu m on a device wafer which is finished with a manufacturing process and tested by using a dry etching (DRIE) process, passivating the through hole, then manufacturing a multi-level dielectric layer, and then finishing deep silicon grooving etching. High conformal CVD deposition O for lateral via isolation3TEOS-oxide layer, the metallization of the through holes inside the chip is to deposit a tungsten metal layer by MOCVD (MOCVD-TiN is used as a barrier layer), and the metal plugs are formed by etching the back surface. The lateral electrical connection of the tungsten filled chip internal via and the device topmost metal layer is formed using standard aluminum metallization processes.
After these process steps are completed, the devices are wafer level tested and selected. The final step performed on the top wafer of standard thickness is full mask copper plating. And then temporarily adhering the uppermost wafer to a processing wafer, and then carrying out highly uniform thinning processing on the uppermost wafer by using high-precision grinding, wet chemical spin-coating etching and a final chemical mechanical planarization processing technology until the tungsten filling through hole is exposed from the back. In order to deposit a dielectric layer for electrical isolation and to enable connection to tungsten filled chip internal vias, copper/tin electroplating techniques are used that penetrate the resist mask. Thus its surface is completely covered by the solder metal material, the isolation trenches are used to form electrical contacts in the copper/tin layer, and the remaining areas not used for electrical connection can be used as simulation zones for future stack mechanical balancing. Finally, copper is used as the material of the solder metal system to perform the plating treatment of the lowest wafer through the resist mask.
After singulation, the selected good chips are matched to the substrate being processed and placed on the lowest wafer using a chip-wafer bonding apparatus with high efficiency and high alignment accuracy (10 μm). Both mechanical bonding and electrical contacting of the transfer chip are achieved in a one-step process using solid-liquid interdiffusion (SLID) bonding techniques.
During the bonding process, when pressure is applied when the temperature reaches 300 ℃, liquid tin interdiffuses with copper, and finally an intermetallic compound (IMC) Cu3Sn is formed. The epsilon phase formed is thermodynamically stable and has a melting point above 600 ℃. With the proper film thickness, the tin is consumed and solidifies completely within a few minutes, leaving copper on both sides.
And finally, realizing the integration of the planes and 3D of various sub-chips (namely an acoustic sensor, an electric sensor, a light sensor, a mechanical sensor and a controller which are arranged on a flexible substrate) on the wafer by utilizing the aluminum wiring to interconnect the tungsten-filled ICV and the metallization layer of the uppermost device and to interconnect the CuSn metal system and the metallization layer of the lowermost device, thereby finishing the wafer-level three-dimensional manufacturing of the mother chip.
The method adopts a wafer-level three-dimensional integration technology to modularize and integrate the sub-chips prepared by different basic processes such as MEMS and CMOS in the chip again to form a multifunctional mother chip, thereby realizing the optimal organic combination of the chips adopting special different basic processes, namely, an acoustic sensor, an electric sensor, an optical sensor, a mechanical sensor and a controller can simultaneously flow in parallel on a plurality of IC process lines, and then the flowing sub-chips (bare chips) are integrated through the wafer-level three-dimensional integration manufacturing technology to form a composite mother chip with various functions. The design and layout of the functional devices of the mother chip are determined according to the specific performance of the functional daughter chip, and the overall design and wiring still follow the basic concept of IC design.
The foregoing description of specific embodiments of the present invention has been presented. It is to be understood that the present invention is not limited to the specific embodiments described above, and that various changes and modifications may be made by one skilled in the art within the scope of the appended claims without departing from the spirit of the invention.