CN113386272B - Cutting device and method for laser chip - Google Patents
Cutting device and method for laser chip Download PDFInfo
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- CN113386272B CN113386272B CN202110532999.4A CN202110532999A CN113386272B CN 113386272 B CN113386272 B CN 113386272B CN 202110532999 A CN202110532999 A CN 202110532999A CN 113386272 B CN113386272 B CN 113386272B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0076—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for removing dust, e.g. by spraying liquids; for lubricating, cooling or cleaning tool or work
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
- Dicing (AREA)
Abstract
The invention discloses a cutting device and a method for a laser chip, wherein a wafer is placed on a workbench and is pressed, the outer edge of the wafer and the arc surface of a positioning block are abutted against each other, the wafer moves downwards along with the pressing of the wafer, the positioning block slides along the direction of a sliding groove after being stressed and further abuts against a telescopic rod, the telescopic rod contracts and compresses a first elastic piece, and the first elastic piece resets under the action of the self-restoring force of the first elastic piece after the outer edge of the wafer is clamped into a notch, so that the wafer is clamped and fixed, and then the cutting component is used for cutting, so that the chip is manufactured.
Description
Technical Field
The invention relates to the technical field of power device processing, in particular to a cutting device and a cutting method for a laser chip.
Background
At present, chips are generally manufactured in a full-page manner by mass production, and are generally processed into a wafer, and the wafer generally contains hundreds to thousands of chips with complete circuit systems, and in the manufacturing process of semiconductor chips, the chips need to be separated from the wafer, so a cutting device needs to be used, but the existing cutting device has poor use effect.
Disclosure of Invention
The invention aims to provide a cutting device and a cutting method for a laser chip, and aims to solve the technical problem that the cutting device in the prior art is poor in using effect.
In order to achieve the above object, in a first aspect, the invention provides a cutting device for a laser chip, which includes a base, a worktable, a first positioning assembly, a support frame, and a cutting assembly, wherein the worktable is disposed above the base, the worktable has a plurality of uniformly distributed sliding grooves, and each sliding groove is provided with the first positioning assembly therein;
every first location subassembly includes locating piece, slider, telescopic link and first elastic component, the slider with workstation sliding connection, and be located the inside of spout, the locating piece with slider fixed connection, and be located the top of slider, the terminal surface of locating piece has the cambered surface, be provided with the breach on the cambered surface, the one end of telescopic link with slider fixed connection, the other end of telescopic link with workstation fixed connection, just the telescopic link is located in the spout, first elastic component cover is established the outside of telescopic link, the support frame with base fixed connection, cutting assembly with support frame fixed connection, and be located the top of workstation.
The positioning block is further provided with a mounting groove and two symmetrically-arranged extension grooves, the two extension grooves are communicated with the mounting groove, the first positioning assembly further comprises a supporting block, a supporting lug and a second elastic piece, one end of the supporting block is arranged in the mounting groove in a sliding mode, the other end of the supporting block is provided with an inclined plane, each extension groove is internally provided with the supporting lug in a sliding mode, each supporting lug is fixedly connected with the supporting block, each extension groove is further internally provided with the second elastic piece, one end of each second elastic piece is fixedly connected with the supporting lug, and the other end of each second elastic piece is fixedly connected with the bottom of the corresponding extension groove.
The first positioning assembly further comprises a contact, and the contact is fixedly connected with the abutting block and is positioned at the bottom of the abutting block.
The cutting assembly comprises an adjusting seat plate and a cutting knife, the adjusting seat plate comprises a seat body, a transferring assembly and a transferring disc, the seat body is fixedly connected with the supporting frame, one end of the transferring assembly is fixedly connected with the seat body, the other end of the transferring assembly is fixedly connected with the transferring disc, the transferring assemblies are at least three groups, the number of the transferring assemblies in each group is two, and the two transferring assemblies are arranged in a splayed structure;
each transfer assembly comprises two mounting blocks, two rotating shafts, two movable rings and a pneumatic piece, the two mounting blocks are fixedly connected with the base body and the transfer disc respectively, the two rotating shafts penetrate through the corresponding mounting blocks respectively and are rotatably connected with the mounting blocks, two ends of each rotating shaft are fixedly connected with the movable rings respectively, the two movable rings are fixedly connected with two ends of the pneumatic piece respectively, and the cutting knife is arranged at the bottom of the transfer disc.
The cutting device for the laser chip further comprises a supporting column, wherein the supporting column is fixedly connected with the workbench and is positioned above the workbench.
The number of the supporting columns is multiple, and the supporting columns are uniformly distributed on the workbench.
In a second aspect, the present invention further provides a cutting method using the above cutting apparatus for a laser chip, including the following steps:
placing a piece to be cut on a workbench, clamping the piece to be cut into the notch, and locking the piece by using a first positioning component;
then, cutting the piece to be cut by using a cutting knife, and adjusting the angle of the cutting knife by using an adjusting seat plate according to the processing requirement to process the piece into a chip meeting the specification;
and taking the chip off the workbench to perform the next production procedure.
The invention has the beneficial effects that: before the wafer is cut, the wafer is placed on the workbench and pressed, the outer edge of the wafer and the arc surface of the positioning block are abutted, the wafer moves downwards along with the pressing of the wafer, the positioning block slides in the direction of the sliding groove after being stressed and further abuts against the telescopic rod, the telescopic rod contracts, meanwhile, the first elastic piece compresses until the outer edge of the wafer is clamped into the notch, the first elastic piece resets under the action of self restoring force, the wafer is clamped and fixed, then the cutting assembly is used for cutting, and therefore chips are manufactured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a perspective view of a cutting apparatus for a laser chip of the present invention.
FIG. 2 is a schematic view of the construction of the actuator disk of the present invention.
Fig. 3 is a schematic structural diagram of a first positioning assembly of the present invention.
Fig. 4 is a side view of a first positioning assembly of the present invention.
Fig. 5 isbase:Sub>A cross-sectional view of thebase:Sub>A-base:Sub>A line structure of fig. 4 according to the present invention.
FIG. 6 is a front view of the first positioning assembly of the present invention.
Fig. 7 is a cross-sectional view of the B-B line structure of fig. 6 of the present invention.
Fig. 8 is a partial structural cross-sectional view at C of fig. 5 of the present invention.
Figure 9 is a schematic view of the cleaning assembly of the present invention.
Fig. 10 is a schematic view of the internal structure of the cleaning assembly of the present invention.
Fig. 11 is a cross-sectional view of the B-B line structure of fig. 9 of the present invention.
Fig. 12 is a partial structural schematic view of a cutting apparatus for a laser chip of the present invention.
Fig. 13 is a schematic structural view of a second positioning assembly of the present invention.
Fig. 14 is a partial structural cross-sectional view at a of fig. 13 of the present invention.
FIG. 15 is a schematic view of the second positioning assembly and adjustment assembly of the present invention in configuration when mated.
Fig. 16 is a front structural view of the second positioning assembly and the adjustment assembly of the present invention when mated.
Fig. 17 is a rear view of the second positioning assembly and the adjustment assembly of the present invention in engagement.
Fig. 18 is a flowchart of the steps of the dicing method for laser chips of the present invention.
1-base, 2-workbench, 3-first positioning component, 4-support frame, 5-cutting component, 6-sliding groove, 7-positioning block, 8-sliding block, 9-telescopic rod, 10-first elastic component, 11-cambered surface, 12-notch, 13-mounting groove, 14-extending groove, 15-abutting block, 16-supporting lug, 17-second elastic component, 18-inclined surface, 19-contact, 20-adjusting seat plate, 21-cutting knife, 22-seat body, 23-adjusting component, 24-adjusting disk, 25-mounting block, 26-rotating shaft, 27-movable ring, 28-pneumatic component, 29-supporting column, 30-annular groove, 31-cleaning component, 32-disk body, 33-first driving component, 34-first gear, 35-rotating component, 36-annular ring, 37-top seat, 38-connecting rod, 39-spray head, 40-rod body, 41-second gear, 42-notch, 43-second positioning component, 44-cross rod, 45-workbench, 46-pressing plate, 48-rotating block, 56-inner plate-top seat, 38-connecting rod, 39-spray head, 40-second gear, 42-notch, 43-second positioning component, 45-eccentric groove, 55-third eccentric groove, 40-third rotating component, 40-eccentric groove, 40-third positioning component, and third positioning component, 65-fourth insection, 66-sliding groove, 67-bottom plate, 68-moving groove.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative and intended to explain the present invention and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships illustrated in the drawings, and are used merely for convenience in describing the present invention and for simplicity in description, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention. Further, in the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
Referring to fig. 1 to 17, the invention provides a cutting device for a laser chip, which includes a base 1, a workbench 2, a first positioning assembly 3, a support frame 4 and a cutting assembly 5, wherein the workbench 2 is disposed above the base 1, the workbench 2 is provided with a plurality of sliding grooves 6 which are uniformly distributed, and each sliding groove 6 is internally provided with the first positioning assembly 3;
every first locating component 3 includes locating piece 7, slider 8, telescopic link 9 and first elastic component 10, slider 8 with 2 sliding connection of workstation, and be located the inside of spout 6, locating piece 7 with 8 fixed connection of slider, and be located 8's top of slider, a terminal surface of locating piece 7 has cambered surface 11, be provided with breach 12 on the cambered surface 11, the one end of telescopic link 9 with 8 fixed connection of slider, the other end of telescopic link 9 with 2 fixed connection of workstation, just telescopic link 9 is located in the spout 6, first elastic component 10 cover is established the outside of telescopic link 9, support frame 4 with 1 fixed connection of base, cutting assembly 5 with 4 fixed connection of support frame, and be located 2's top of workstation.
In this embodiment, the first elastic member 10 is a compression spring, the support frame 4 is configured to support the cutting assembly 5, before the wafer is cut, the wafer is placed on the worktable 2 and pressed, because the outer edge of the wafer abuts against the arc surface 11 of the positioning block 7, and the wafer moves downward along with the pressing of the wafer, the positioning block 7 slides along the direction of the chute 6 after being stressed, and then abuts against the telescopic rod 9, the telescopic rod 9 contracts, and the first elastic member 10 compresses until the outer edge of the wafer is clamped into the notch 12, and resets under the restoring force of the first elastic member 10 itself, so as to clamp and fix the wafer, and then the cutting assembly 5 is used to cut the wafer, so as to manufacture the chip.
Furthermore, the positioning block 7 further has a mounting groove 13 and two extending grooves 14 symmetrically arranged, and the two extending grooves 14 are all communicated with the mounting groove 13, the first positioning assembly 3 further includes a supporting block 15, a support lug 16 and a second elastic member 17, one end of the supporting block 15 is slidably arranged in the mounting groove 13, the other end of the supporting block 15 has an inclined surface 18, the support lug 16 is slidably arranged in each extending groove 14, each support lug 16 is fixedly connected with the supporting block 15, the second elastic member 17 is further arranged in each extending groove 14, one end of each second elastic member 17 is fixedly connected with the support lug 16, and the other end of each second elastic member 17 is fixedly connected with the bottom of the extending groove 14.
In this embodiment, the second elastic member 17 is a compression spring, and when the wafer is clamped into the notch 12, the outer edge of the wafer abuts against the inclined surface 18 of the abutting block 15, so as to abut against the abutting block 15 and slide upwards in the mounting groove 13, and simultaneously drive the support lug 16 to slide upwards in the corresponding extension groove 14, the second elastic member 17 is stretched after being stressed until the wafer is completely clamped into the notch 12, and the support lug 16 is driven to reset under the action of the restoring force of the second elastic member 17, so that the abutting block 15 resets, and the abutting block 15 presses the upper surface of the wafer, thereby further fixing the wafer in the cutting process, avoiding affecting the cutting precision, and improving the use effect of the cutting device for the laser chip.
Further, the first positioning assembly 3 further includes a contact 19, and the contact 19 is fixedly connected to the abutting block 15 and is located at the bottom of the abutting block 15.
In this embodiment, the contact 19 is provided to realize multi-point contact of the wafer, so that the wafer is pressed and held by the contact block 15 more firmly and is not easy to shake.
Further, the cutting assembly 5 comprises an adjusting seat plate 20 and a cutting knife 21, the adjusting seat plate 20 comprises a seat body 22, a transferring assembly 23 and a transferring disc 24, the seat body 22 is fixedly connected with the support frame 4, one end of the transferring assembly 23 is fixedly connected with the seat body 22, the other end of the transferring assembly 23 is fixedly connected with the transferring disc 24, the transferring assemblies 23 are at least three groups, the number of the transferring assemblies 23 in each group is two, and the two transferring assemblies 23 are arranged in a splayed structure;
each of the moving assemblies 23 includes two mounting blocks 25, two rotating shafts 26, two moving rings 27 and two moving members 28, the number of the mounting blocks 25 is two, the two mounting blocks 25 are respectively and fixedly connected to the base 22 and the moving plate 24, the number of the rotating shafts 26 is two, each of the rotating shafts 26 penetrates through the corresponding mounting block 25 and is rotatably connected to each of the mounting blocks 25, two ends of each of the rotating shafts 26 are respectively and fixedly connected to the moving rings 27, the two moving rings 27 are respectively and fixedly connected to two ends of the moving member 28, and the cutting knife 21 is disposed at the bottom of the moving plate 24.
In this embodiment, the pneumatic members 28 are cylinders, the cutting blade 21 is configured to cut a wafer, when the angle of the cutting blade 21 needs to be adjusted, the pneumatic members 28 can be controlled to operate, and no matter any pneumatic member 28 on each of the actuating assemblies 23 is extended, the movable ring 27 connected to the output end of the respective pneumatic member 28 can rotate around the rotating shaft 26, so as to change the inclination angle and direction of the actuating plate 24, thereby adjusting the angle of the cutting blade 21, and thus adjusting the angle of the cutting blade 21 is more flexible.
Further, the cutting device for the laser chip further comprises a support column 29, the support column 29 is fixedly connected with the workbench 2 and located above the workbench 2, the support columns 29 are multiple in number, and the support columns 29 are uniformly distributed on the workbench 2.
In this embodiment, a plurality of support columns 29 are arranged to better support the wafer during cutting, so that the wafer is more stable during cutting, the cutting precision is prevented from being affected, and the use effect of the cutting device for the laser chip is improved.
Further, the inside of the adjusting disc 24 is a cavity structure, the bottom of the adjusting disc 24 is provided with an annular groove 30, the cutting device for the laser chip further includes a cleaning component 31, the cleaning component 31 is disposed inside the adjusting disc 24, the cleaning component 31 includes a disc body 32, a first driving member 33, a first gear 34, three rotating members 35, an annular ring 36, a top seat 37, a connecting rod 38 and a nozzle 39, the first driving member 33 is fixedly connected to the disc body 32 and located at a center of the disc body 32, the first gear 34 is disposed at an output end of the first driving member 33, the three rotating members 35 are circumferentially distributed on the disc body 32, each rotating member 35 includes a rod body 40 and a second gear 41, one end of the second rod body 40 is fixedly connected to the disc body 32, the other end of the rod body 40 is rotatably connected to the second gear 41, each second gear 41 is engaged to the first gear 34, an inner surface wall of the annular ring 36 is engaged to each second gear 41, the top seat 37 is fixedly connected to the annular ring 36, the connecting rod 36 is connected to the bottom of the top seat 38, and the other end of the nozzle 39 is connected to the fixed to the connecting rod 36, and the nozzle 39 is connected to one side of the bottom of the cutting blade 21.
In this embodiment, the water inlet end of the nozzle 39 is connected to one end of a transmission pipe, the other end of the transmission pipe is connected to a pump body, the pump body is placed in the water tank, waste chips are generated during the cutting process of the cutting knife 21, at this time, the first gear 34 is driven to rotate by the first driving part 33, the first gear 34 rotates, the three second gears 41 are all meshed with the first gear 34, and further, the three gears are driven to rotate, and the inner surface wall of the annular ring 36 is meshed with each second gear 41, so that the annular ring 36 rotates to make a circular motion, and further, the top base 37 is driven to rotate, the connecting rod 38 and the nozzle 39 make a circular motion along with the cutting knife 21, water in the water tank is pumped by the pump body and is transmitted to the nozzle 39 through the transmission pipe, the nozzle 39 washes waste chips generated during the cutting of the cutting knife 21 from different angles, and compared with a single-angle spray washing mode, the waste chips can be better washed in an all-directional manner, and the quality of the cut chips is not affected.
Further, the worktable 2 further has a plurality of slots 42, the cutting apparatus for laser chips further includes a second positioning assembly 43 disposed in each of the slots 42, each of the second positioning assemblies 43 includes a cross bar 44, a block 45, a pressing plate 46, a support 47, a second driving member 48, a rotary disk 49, a nose 50 and a rotary ring 51, the cross bar 44 is disposed in the slot 42, the block 45 is fixedly connected to the cross bar 44 and is located at a middle portion of the cross bar 44, the pressing plate 46 is slidably connected to the block 45 and is sleeved outside the block 45, the side wall of the pressing plate 46 has a first insection 52, the support 47 is fixedly connected to the pressing plate 46 and is located above the pressing plate 46, the second driving member 48 is disposed at one side of the pressing plate 46, an output end of the second driving member 48 is fixedly connected to the rotary disk 49, the outer edge of the rotary disk 49 is provided with the nose 50, an inner side wall of the rotary ring 51 has a plurality of circumferentially distributed recesses 53, each recess 53 is adapted to the second insection 54, and the rotary ring has a second insection 54 engaged with the second insection 52.
In this embodiment, after the first positioning assembly 3 performs position limitation on the wafer, the rotation of the second driving member 48 drives the rotating disc 49 to rotate, the nose 50 rotates accordingly, the nose 50 is adapted to the next notch 53, and the rotation of the rotating ring 51 is realized by repeating the cycle, and as the rotating ring 51 rotates, since the second insections 54 are engaged with the first insections 52, the pressing plate 46 moves downward, and the support head 47 is driven to move downward, so that the support head 47 abuts against the upper end surface of the wafer, thereby further fixing the wafer, and the wafer is kept stable during the cutting process, and the cutting accuracy is not affected. In order to ensure the stability of the rotating ring 51, a clearance fit may be provided on both sides of the rotating ring 51 without affecting the rotation of the rotating ring 51.
Further, a through groove 55 is provided on one side wall of each notch 42, a receiving groove communicating with the through groove 55 is further provided inside the worktable 2, the cutting apparatus for laser chips further includes an adjusting assembly 56, the adjusting assembly 56 includes an inner plate 57, a shaft pin 58, a vertical plate 59, an arc-shaped sheet 60, a disc 61, a third driving member 62 and an eccentric column 63, the second driving member 48 and the cross bar 44 both penetrate through the through groove 55 and are fixedly connected with the inner plate 57, the inner plate 57 is located in the receiving groove, the inner plate 57 is slidably connected in the receiving groove, a third insection 64 is provided at a top end of the inner plate 57, the shaft pin 58 is fixedly connected with an inner side wall of the receiving groove, the vertical plate 59 is rotatably connected with the shaft pin 58, the arc-shaped sheet 60 is fixedly connected with the vertical plate 59 and is located below the vertical plate 59, the arc-shaped sheet 59 has a groove 66, the arc-shaped sheet 60 has a fourth insection 65, the fourth insection 65 is engaged with the third insection, the third insection 62 is fixedly connected with an output end of the eccentric column 63, and is connected with an output end of the eccentric column 61.
In this embodiment, the third driving member 62 rotates to drive the disc 61 to rotate, so that the eccentric column 63 also rotates, while the eccentric column 63 rotates circumferentially, the eccentric column 63 can reciprocate in the sliding groove 66, and then drive the vertical plate 59 to swing, so as to drive the arc piece 60 to swing, and as the fourth insections 65 are engaged with the third insections 64, the inner plate 57 is driven to reciprocate along with the swing of the arc piece 60, and as the second driving member 48 and the cross bar 44 both penetrate through the through groove 55 and are fixedly connected with the inner plate 57, the second driving member 48 and the cross bar 44 are driven to move, so as to adjust the position of the second positioning assembly 43, so as to adapt to the fixing of more wafers with different diameters, and the application range is wider.
Further, the adjusting assembly 56 further comprises a bottom plate 67, the bottom plate 67 is fixedly connected with the inner side wall of the receiving groove, the top end of the receiving groove is provided with a moving groove 68, and the inner plate 57 and the moving groove 68 are matched with each other.
In the present embodiment, the bottom plate 67 serves to support the inner plate 57 so that the inner plate 57 can smoothly slide in the moving groove 68.
Referring to fig. 18, the present invention further provides a cutting method using the cutting apparatus for a laser chip described above, including the following steps:
s1: placing a to-be-cut piece on the workbench 2, clamping the to-be-cut piece to the notch 12, and locking the to-be-cut piece by using the first positioning assembly 3;
s2: then, cutting the piece to be cut by using a cutting knife 21, and adjusting the angle of the cutting knife 21 by using an adjusting seat plate 20 according to the processing requirement to process the piece into a chip meeting the specification;
s3: the chip is removed from the table 2 and the next production process is performed.
In this embodiment, the specific definition of a cutting method using the cutting device for laser chips can be referred to the definition of a cutting device for laser chips above, and will not be described herein again.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (5)
1. A cutting device for laser chips is characterized in that,
the cutting machine comprises a base, a workbench, a first positioning assembly, a support frame and a cutting assembly, wherein the workbench is arranged above the base, a plurality of uniformly distributed sliding grooves are formed in the workbench, and the first positioning assembly is arranged in each sliding groove;
each first positioning assembly comprises a positioning block, a sliding block, a telescopic rod and a first elastic piece, the sliding block is connected with the workbench in a sliding mode and is located inside the sliding groove, the positioning block is fixedly connected with the sliding block and is located above the sliding block, one end face of the positioning block is provided with a cambered surface, a notch is formed in the cambered surface, one end of the telescopic rod is fixedly connected with the sliding block, the other end of the telescopic rod is fixedly connected with the workbench, the telescopic rod is located in the sliding groove, the first elastic piece is sleeved outside the telescopic rod, the supporting frame is fixedly connected with the base, and the cutting assembly is fixedly connected with the supporting frame and is located above the workbench;
the positioning block is further provided with a mounting groove and two symmetrically-arranged extension grooves, the two extension grooves are communicated with the mounting groove, the first positioning assembly further comprises a supporting block, a supporting lug and a second elastic piece, one end of the supporting block is arranged in the mounting groove in a sliding mode, the other end of the supporting block is provided with an inclined plane, the supporting lug is arranged in each extension groove in a sliding mode, each supporting lug is fixedly connected with the supporting block, the second elastic piece is arranged in each extension groove, one end of each second elastic piece is fixedly connected with the supporting lug, and the other end of each second elastic piece is fixedly connected with the bottom of the extension groove;
the first positioning component also comprises a contact which is fixedly connected with the abutting block and is positioned at the bottom of the abutting block.
2. The dicing apparatus for laser chips according to claim 1,
the cutting assembly comprises an adjusting seat plate and a cutting knife, the adjusting seat plate comprises a seat body, a transferring assembly and a transferring disc, the seat body is fixedly connected with the supporting frame, one end of the transferring assembly is fixedly connected with the seat body, the other end of the transferring assembly is fixedly connected with the transferring disc, the transferring assemblies are at least three groups, the number of the transferring assemblies in each group is two, and the two transferring assemblies are arranged in a splayed structure;
each transfer assembly comprises two mounting blocks, two rotating shafts, two movable rings and a pneumatic piece, the two mounting blocks are fixedly connected with the base body and the transfer disc respectively, the two rotating shafts penetrate through the corresponding mounting blocks respectively and are rotatably connected with the mounting blocks, two ends of each rotating shaft are fixedly connected with the movable rings respectively, the two movable rings are fixedly connected with two ends of the pneumatic piece respectively, and the cutting knife is arranged at the bottom of the transfer disc.
3. The dicing apparatus for laser chips according to claim 2,
the cutting device for the laser chip further comprises a supporting column, wherein the supporting column is fixedly connected with the workbench and is positioned above the workbench.
4. The dicing apparatus for laser chips according to claim 3,
the quantity of support column is a plurality of, a plurality of support column evenly distributed on the workstation.
5. The dicing method using the dicing apparatus for a laser chip according to claim 4, characterized by comprising the steps of:
placing a piece to be cut on a workbench, clamping the piece to be cut into the notch, and locking the piece by using a first positioning component;
then, cutting the piece to be cut by using a cutting knife, and adjusting the angle of the cutting knife by using an adjusting seat plate according to the processing requirement to process the piece into a chip meeting the specification;
and taking the chip off the workbench to perform the next production procedure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110532999.4A CN113386272B (en) | 2021-05-17 | 2021-05-17 | Cutting device and method for laser chip |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110532999.4A CN113386272B (en) | 2021-05-17 | 2021-05-17 | Cutting device and method for laser chip |
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| CN113386272A CN113386272A (en) | 2021-09-14 |
| CN113386272B true CN113386272B (en) | 2023-03-24 |
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| CN118163255B (en) * | 2024-05-16 | 2024-07-16 | 安徽旭腾微电子设备有限公司 | Wafer positioning and cutting device based on four-tube vertical furnace processing |
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| Publication number | Priority date | Publication date | Assignee | Title |
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