CN113386080A - Electronic equipment disassembling device - Google Patents
Electronic equipment disassembling device Download PDFInfo
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- CN113386080A CN113386080A CN202010172740.9A CN202010172740A CN113386080A CN 113386080 A CN113386080 A CN 113386080A CN 202010172740 A CN202010172740 A CN 202010172740A CN 113386080 A CN113386080 A CN 113386080A
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- disassembled
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B25—HAND TOOLS; PORTABLE POWER-DRIVEN TOOLS; MANIPULATORS
- B25B—TOOLS OR BENCH DEVICES NOT OTHERWISE PROVIDED FOR, FOR FASTENING, CONNECTING, DISENGAGING OR HOLDING
- B25B27/00—Hand tools, specially adapted for fitting together or separating parts or objects whether or not involving some deformation, not otherwise provided for
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- Mechanical Engineering (AREA)
- Processing Of Solid Wastes (AREA)
Abstract
The application relates to an electronic equipment disassembling device which comprises a placing frame, a lifting mechanism and a cutting mechanism, wherein the placing frame is used for placing electronic equipment to be disassembled; the lifting mechanism comprises a support and a mounting rack, the support is connected with the mounting rack in a sliding mode, and the mounting rack is further far away from or close to the placing rack; the cutting mechanism comprises a driving assembly and a stay wire assembly, the driving assembly is connected with the mounting rack and drives the stay wire assembly to separate the electronic equipment to be disassembled from a disassembled piece bonded on the electronic equipment to be disassembled. Has the advantages that: this application can separate the piece by disassembling that bonding on waiting to disassemble electronic equipment and waiting to disassemble electronic equipment through the subassembly of acting as go-between, and then can solve the manual work and wait to disassemble electronic equipment and wait to disassemble bonding on the electronic equipment when disassembling the piece, make easily and disassemble the problem that the piece warp.
Description
Technical Field
The invention relates to the technical field of electronic equipment design, in particular to an electronic equipment disassembling device.
Background
In many industries, such as the electronic device manufacturing industry, a complete electronic device that can be used is composed of many parts, and the combination of every two parts can generally adopt welding, snap connection, adhesion, etc. For example, in the manufacturing process of a mobile phone, the connection between the mobile phone screen and the mobile phone is usually an adhesion manner, the mobile phone shell is generally sleeved outside the mobile phone to protect the mobile phone, and the battery inside the mobile phone and the battery compartment of the mobile phone are also generally adhered.
In the installation process of the electronic equipment, especially in the installation process of the battery in the battery compartment, because the battery and the battery compartment are generally fixed by adopting a double-faced adhesive tape, and the installed battery needs to be disassembled sometimes, the surface of the battery is easily damaged by pulling the double-faced adhesive tape in the process of disassembling the battery, for example, when the easy-to-pull adhesive tape is manually pulled and then the battery is separated from the battery compartment, because the direction and the strength of the hand pulling are difficult to determine, the surface of the battery is easily deformed, and the serious risk of battery leakage can be caused.
Disclosure of Invention
Therefore, it is necessary to provide a safe electronic device detaching apparatus for solving the problem that the electronic device is easily damaged in the process of detaching the component.
A disassembling device for electronic equipment comprises a placing rack, a lifting mechanism and a cutting mechanism, wherein the placing rack is used for placing electronic equipment to be disassembled; the lifting mechanism comprises a support and a mounting rack, the support is connected with the mounting rack in a sliding mode, and the mounting rack is further far away from or close to the placing rack; the cutting mechanism comprises a driving assembly and a stay wire assembly, the driving assembly is connected with the mounting rack and drives the stay wire assembly to separate the electronic equipment to be disassembled from a disassembled piece bonded on the electronic equipment to be disassembled.
The beneficial effect of this application does: different from the situation of the prior art, the electronic equipment to be disassembled is placed through the placing frame, the lifting mechanism comprises a support and a mounting frame, the cutting mechanism comprises a driving assembly and a stay wire assembly, and the driving assembly is connected with the mounting frame; when the subassembly part of acting as go-between is located waiting to disassemble electronic equipment and waits to disassemble bonding on the electronic equipment by disassembling between the piece, the slip of drive assembly on the mounting bracket alright with drive the subassembly of acting as go-between and treat to disassemble electronic equipment and wait to disassemble bonding on the electronic equipment by disassembling the piece and separate, and then can solve the manual work and wait to disassemble electronic equipment and wait to disassemble bonding on the electronic equipment when disassembling the piece, by disassembling the problem that the piece is probably impaired.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings of the embodiments can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of an electronic device disassembling apparatus according to an embodiment of the present disclosure;
fig. 2 is a schematic structural view of a wire pulling assembly of the electronic device disassembling apparatus shown in fig. 1;
FIG. 3 is an enlarged schematic view of the structure shown at A in FIG. 2;
fig. 4 is a schematic structural diagram of a disassembling apparatus for electronic equipment according to another embodiment of the present application;
FIG. 5 is an exploded view of the cutting mechanism of the electronic device dismantling apparatus shown in FIG. 4;
FIG. 6 is an exploded view of the mounting bracket and cutting mechanism of FIG. 1;
fig. 7 is another schematic structural view of a wire pulling assembly of the electronic equipment detaching device shown in fig. 1;
figure 8 is a schematic structural view of the rack shown in figure 1;
fig. 9 is an exploded view of the lifting mechanism shown in fig. 1.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Referring to fig. 1, an embodiment of the present application provides an electronic device disassembling apparatus, which includes a rack 10, a lifting mechanism 20 and a cutting mechanism 30, wherein the rack 10 is used for placing an electronic device to be disassembled; the lifting mechanism 20 comprises a bracket 210 and a mounting rack 230, wherein the bracket 210 is slidably connected with the mounting rack 230 so as to enable the mounting rack 230 to be far away from or close to the placing rack 10; the cutting mechanism 30 includes a driving assembly 310 and a pulling wire assembly 330, the driving assembly 310 is connected to the mounting frame 230, and drives the pulling wire assembly 330 to separate the electronic device to be disassembled from the disassembled piece bonded to the electronic device to be disassembled. It can be understood that, through the above-mentioned operation, when the electronic equipment to be disassembled is placed on the placement frame 10, the driving component 310 can drive the part of the pull wire component 330 to be located between the piece to be disassembled that is bonded on the electronic equipment to be disassembled and the electronic equipment to be disassembled, and then the driving component 310 can move on the mounting frame 230, and drive the pull wire component 330 to separate the piece to be disassembled that is bonded on the electronic equipment to be disassembled and the electronic equipment to be disassembled.
Referring to fig. 2 and 3, the pull wire assembly 330 includes a pull wire 3310 and at least one dropper 3330, wherein two ends of the pull wire 3310 are respectively connected to the driving assembly 310; in the process that the driving assembly 310 slides along the mounting bracket 230, the driving assembly 310 drives the pull wire 3310 to separate the electronic device to be disassembled from the disassembled part bonded to the electronic device to be disassembled, and at least part of the pull wire assembly 330 is located between the electronic device to be disassembled and the disassembled part bonded to the electronic device to be disassembled; one end of the dropper 3330 is connected to the driving assembly 310, and the other end of the dropper 3330 extends to a position near the electronic device to be disassembled and a part to be disassembled bonded to the electronic device to be disassembled, so as to drop the sol solution to the position. When the subassembly 330 of acting as go-between needs to be waited to disassemble electronic equipment and wait to disassemble the electronic equipment on the bonding by disassembling the piece when separating, mounting bracket 230 can slide on support 210, and then slide to the bottom of acting as go-between 3310 and wait to disassemble electronic equipment and wait to disassemble on the electronic equipment bonding by disassembling a bonding clearance looks parallel and level, so that act as go-between 3310 can remove in this clearance, and then drive assembly 310 alright with drive part act as go-between 3310 and wait to disassemble electronic equipment on the bonding between the bonding clearance of waiting to disassemble the bonding by disassembling the piece of 3310 bottom, so alright with will wait to disassemble electronic equipment and wait to disassemble on the electronic equipment bonding by disassembling a separation.
In an embodiment of the present application, the wire 3310 is made of metal, so that the wire 3310 is not easily deformed during movement.
Referring to fig. 4 and 5, in an embodiment of the present application, when the electronic device to be disassembled is a mobile phone 380, and the piece to be disassembled bonded to the electronic device is a battery 390 of the mobile phone 380, the battery 390 and the battery 390 compartment of the mobile phone 380 are fixed by a double-sided adhesive tape, and in the process of disassembling the battery 390, the double-sided adhesive tape is dissolved by alcohol, that is, the sol solution used at this time is alcohol. When the pull wire 3310 moves along the bonding gap between the battery 390 and the battery 390, the alcohol drops between the battery 390 and the mounting gap between the battery 390 and the battery 390 along the direction that the dropper 3330 moves toward the pull wire 3310, and along with the movement of the pull wire 3310, the pull wire 3310 touches the double-sided adhesive tape and cuts the double-sided adhesive tape in the moving direction of the pull wire 3310, so that the double-sided adhesive tape through which the pull wire 3310 passes is separated and a gap is generated, and the alcohol enters the gap and dissolves the double-sided adhesive tape. So set up, when acting as go-between 3310 in the in-process of cutting the double faced adhesive tape, the alcohol can reduce the resistance that the cutting double faced adhesive tape received when acting as go-between 3310 moves between battery 390 storehouse and battery 390, has increased the area of contact of alcohol and double faced adhesive tape moreover to can make alcohol dissolve the double faced adhesive tape better, so that act as go-between 3310 to going on of the separation work in battery 390 and battery 390 storehouse.
In other embodiments, the electronic device to be disassembled may also be a tablet or a computer, and the disassembled piece may also be a display screen, etc. The sol solution is used to dissolve the adhesive 370, so the sol solution may be determined according to the adhesive 370 between the electronic device to be disassembled and the disassembled piece adhered to the electronic device to be disassembled, for example, acetone, acetic acid, xylene, etc. may be selected as the sol agent, and will not be described herein.
Referring to fig. 1 and 6, the driving assembly 310 includes a connecting rod 3110, a first sliding block 3130 and a first driving member 3150, the pull wire 3310 and the dropper 3330 are respectively connected to the connecting rod 3110, and the connecting rod 3110 is connected to the first sliding block 3130. One end of the first driving member 3150 is connected to the first sliding block 3130 for driving the first sliding block 3130 to slide on the mounting frame 230. When the first driving member 3150 drives the first sliding block 3130 to move on the mounting block 230, the connecting rod 3110 connected to the first sliding block 3130 also moves, and the pull wire 3310 and the dropper 3330 are respectively connected to the connecting rod 3110. Therefore, the first driving member 3150 can control the movement of the pull wire 3310 and the dropper 3330, so that the electronic device to be disassembled can be separated from the disassembled part of the electronic device to be disassembled.
The mounting frame 230 is provided with a slide rail 2310, and the first sliding block 3130 is provided with a sliding groove 3132 adapted to the slide rail 2310. The connecting rod 3110 includes a first connecting rod 3112 and a second connecting rod 3114, and both ends of the wire 3310 are connected to the first connecting rod 3112 and the second connecting rod 3114, respectively. The dropper 3330 is connected to at least one of the first connection lever 3112 or the second connection lever 3114. When the first driving member 3150 drives the first sliding block 3130, the sliding groove 3132 on the first sliding block 3130 may be engaged with the sliding rail 2310 disposed on the mounting bracket 230 and slide on the sliding rail 2310, in the sliding process, the first connecting rod 3112 and the second connecting rod 3114 respectively drive the pull wire 3310 to move, and the dropper 3330 may also drop the sol solution toward the moving direction of the pull wire 3310 at a side close to the pull wire 3310, so that the pull wire 3310 at the bottom is always dissolved by the sol solution in the moving process, and the pull wire 3310 is in a state of being stained with the sol solution when contacting the bonding material 370 between the electronic device to be disassembled and the disassembled piece bonded on the electronic device to be disassembled, and the sol solution helps to dissolve the bonding material 370, so as to better separate the electronic device to be disassembled from the disassembled piece bonded on the electronic device to be disassembled.
In an embodiment of the present application, the first connecting rod 3112 and the second connecting rod 3114 are disposed oppositely, and the distance between the first connecting rod 3112 and the second connecting rod 3114 corresponds to the size of the component to be disassembled, i.e. after the pull wire 3310 is connected to the first connecting rod 3112 and the second connecting rod 3114 respectively, the distance between the pull wires 3310 is larger than the distance between the component to be disassembled in the moving direction of the pull wire 3310, so that the left and right ends of the pull wire 3310 can be located at the two opposite sides of the component to be disassembled, so as to ensure that at least part of the pull wire 3310 can smoothly pass through the electronic device to be disassembled and the gap between the component to be disassembled bonded on the electronic device to be disassembled. In the using process of the pull wire 3310, the first driving member 3150 drives the connecting rod 3110 to move to the starting end of the movement of the pull wire 3310, that is, to the state when the detached part bonded to the electronic device to be detached and the electronic device to be detached is not separated, and then the first driving member 3150 can drive the pull wire 3310 to respectively detach the electronic device and the detached part bonded to the electronic device to be detached, and then reach the terminal position to complete the separation.
In an embodiment of the present application, a hook 3116 is disposed at one end of the first connecting rod 3112 and the second connecting rod 3114 close to the rack 10, and the pull wire 3310 is connected to the first connecting rod 3112 and the second connecting rod 3114 by being wound around the hook 3116. It is understood that, in other embodiments, the end of the pull wire 3310 connected to the first connecting rod 3112 and the second connecting rod 3114 may be connected in other manners, such as directly welding and fixing the end of the pull wire 3310 connected to the first connecting rod 3112 and the second connecting rod 3114, which is not limited herein.
In other embodiments, the pull wire 3310 may be embedded in the electronic device to be disassembled and the starting end between the disassembled parts bonded to the electronic device to be disassembled, and when the pull wire 3310 needs to be disassembled, the two ends of the pull wire 3310 exposed are respectively connected to the first connecting rod 3112 and the second connecting rod 3114, so as to pull the pull wire 3310 to move to the terminal position, thereby completing the separation work.
Referring to fig. 7, in an embodiment of the present invention, two dripping pipes 3330 are provided and are respectively connected to the first connecting rod 3112 and the second connecting rod 3114, that is, when the pull wire 3310 moves between the electronic device to be disassembled and the disassembled part of the electronic device to be disassembled, the sol solution dripped by the dripping pipes 3330 can act on both opposite sides of the disassembled part, so that the sol solution can be more fully contacted with the electronic device to be disassembled and the adhesive 370 between the disassembled parts of the electronic device to be disassembled, thereby increasing the dissolving efficiency. In other embodiments, one dropper 3330 may be selected and connected to any one of the first connection bar 3112 or the second connection bar 3114. The number of the dropping pipes 3330 is determined according to the position of the adhesive 370 between the electronic device to be disassembled and the disassembled piece of the electronic device to be disassembled, and if the preset position of the adhesive 370 to be dissolved is known in advance, the dropping pipes 3330 may be connected to the connecting rod 3110 near the adhesive 370, which is not described herein.
The distance between the dropper 3330 and the pull wire 3310 is gradually reduced in a direction away from the connecting frame so that the liquid flowing out of the dropper 3330 is brought into contact with the pull wire 3310. That is, the direction of the sol solution dripped from the dropper 3330 faces the moving direction of the stay wire 3310, so that the sol solution can better contact with the electronic equipment to be disassembled and the sol solution between the disassembled parts adhered to the electronic equipment to be disassembled during the moving process of the stay wire 3310.
Referring to fig. 1 and 8, the cutting mechanism 30 further includes an adsorbing assembly 350, and the adsorbing assembly 350 is used for adsorbing a disassembled piece on the separated electronic device to be disassembled. That is, after the pull wire 3310 separates the electronic device to be disassembled and the disassembled part bonded to the electronic device to be disassembled, the adsorption component 350 can take out the separated disassembled part.
The suction assembly 350 includes a second slide block 3510, a suction disc 3530 and a second driving member 3550, wherein the second driving member 3550 is used for driving the second slide block 3510 to slide on the mounting frame 230; one end of the adsorption disc 3530 is connected to the second slider 3510, and the other end of the adsorption disc 3530 is disposed toward the placement frame 10. That is, when the second driving member 3550 drives the second sliding block 3510, the second sliding block 3510 can slide on the mounting bracket 230, and further drive the suction cup to a position right above the piece to be disassembled, and when the mounting bracket 230 moves on the support 210 in a direction close to the placing rack 10, the suction cup can contact and adsorb the piece to be disassembled; after the adsorption is completed, the mounting frame 230 can move on the support 210 in a direction away from the placement frame 10, so that the disassembled piece can be taken out.
In an embodiment of the application, the suction of the suction cup to the disassembled piece is controlled by controlling the mounting frame 230, in other embodiments, the suction cup may also include a telescopic mechanism, and the telescopic mechanism may enable the bottom of the suction cup to be close to or far away from the disassembled piece on the placing frame 10; when the sucking disc moves to being disassembled directly over the piece, telescopic machanism control sucking disc is toward being close to the direction removal of being disassembled the piece, adsorbs completely when the sucking disc and is disassembled the back, and telescopic machanism control sucking disc is toward the direction removal of keeping away from rack 10, so alright with taking out and being disassembled the piece.
Referring to fig. 9, a bottom plate 120 is disposed at the bottom of the placement frame 10, the placement frame 10 further includes a bottom suction cup 110, and the bottom suction cup 110 is used for adsorbing one end of the electronic device to be disassembled, which is far away from the electronic device to be disassembled and is adhered to a piece to be disassembled. The rack 10 is equipped with the standing groove on the direction towards the mounting bracket 230, this standing groove is used for holding the electronic equipment of waiting to disassemble, be equipped with the mating holes in this standing groove, end sucking disc 110 and mating holes looks adaptation, the one end of end sucking disc 110 is connected with bottom plate 120, the other end of end sucking disc 110 sets up towards the mounting bracket 230 direction, when waiting to disassemble electronic equipment and putting on rack 10, the one end of keeping away from on the electronic equipment of waiting to disassemble the piece contacts with end sucking disc 110, and then end sucking disc 110 can be fixed waiting to disassemble electronic equipment, and then when cutting mechanism 30 treats to disassemble electronic equipment and waits to disassemble bonding on the electronic equipment by disassembling the piece and separate, wait to disassemble electronic equipment can not take place to rock, and then can guarantee the stability of cutting work. In one embodiment of the present application, the number of the bottom suction cups 110 is 4, and every two adjacent bottom suction cups 110 are connected at the center to form a rectangular interval. So can treat better and disassemble electronic equipment and adsorb. In other embodiments, the number of the bottom suction cups 110 may also be 2, 3, or 5, etc., and is not limited herein.
The thickness of the end of the placing frame 10 far away from the lifting component is larger than that of the end near the lifting component. Rack 10 during the slope, when acting as go-between 3310 waiting to disassemble electronic equipment and waiting to disassemble bonding on the electronic equipment by disassembling when removing between the piece, the bottom of acting as go-between 3310 can the butt keep away from the glue film of disassembling the piece, so set up, act as go-between 3310 from waiting to disassemble electronic equipment and waiting to disassemble bonding on the electronic equipment by disassembling when moving between the piece, seldom can contact the bottom surface of disassembling the piece, but the cutting is close to the glue film of waiting to disassemble electronic equipment, so alright protect by disassembling the piece better, make by disassembling the piece can not touched and then by the acting as go-between 3310 and can not receive the damage. And when the placing rack 10 is inclined, the alcohol sol solution dripped from the dropper 3330 can better move along the inclined surface to the direction of the movement of the pull wire 3310, so as to accelerate the contact with the electronic equipment to be disassembled and the bonding material 370 between the disassembled parts bonded on the electronic equipment to be disassembled, thereby improving the dissolving efficiency.
Referring to fig. 9, the support frame 210 includes a driving motor 2110 and a matching assembly 2130, the matching assembly 2130 is connected to the mounting frame 230, and the driving motor 2110 is used for driving the matching assembly 2130 to drive the mounting frame 230 to move away from or close to the placement frame 10. The matching assembly 2130 comprises a screw rod 2131 and at least one optical axis 2133, and the mounting frame 230 is provided with a threaded hole 2135 and an optical hole 2137 which are respectively matched with the screw rod 2131 and the optical axis 2133. The driving motor 2110 is used for driving the lead screw 2131 to rotate so as to drive the mounting rack 230 to move away from or close to the placing rack 10. Optical axis 2133 serves a guiding function.
In an embodiment of the present application, the mounting frame 230 includes a sliding block, and the sliding block is provided with a threaded hole 2135 matched with the screw rod 2131 and a hole position matched with the unthreaded hole 2137. That is, when the driving motor 2110 drives the lead screw 2131 to rotate, the slider is also matched with the lead screw 2131 to move, and due to the guiding and limiting of the optical axis 2133, the slider can only move towards the direction close to the placing frame 10 or away from the placing frame 10.
The technical features of the embodiments described above may be arbitrarily combined, and for the sake of brevity, all possible combinations of the technical features in the embodiments described above are not described, but should be considered as being within the scope of the present specification as long as there is no contradiction between the combinations of the technical features.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. An electronic equipment disassembling device, comprising:
the placing rack is used for placing the electronic equipment to be disassembled;
the lifting mechanism comprises a support and a mounting rack, the support is connected with the mounting rack in a sliding mode, and the mounting rack is further far away from or close to the placing rack;
the cutting mechanism comprises a driving assembly and a stay wire assembly, the driving assembly is connected with the mounting rack and drives the stay wire assembly to separate the electronic equipment to be disassembled and a disassembled piece bonded on the electronic equipment to be disassembled.
2. The electronic device disassembling apparatus according to claim 1, wherein the pulling wire assembly includes a pulling wire and at least one dropping pipe, and both ends of the pulling wire are respectively connected to the driving assembly;
in the process that the driving assembly slides along the mounting rack, the driving assembly drives the stay wire to separate the electronic equipment to be disassembled from the disassembled piece bonded on the electronic equipment to be disassembled, and at least part of the stay wire assembly is positioned between the electronic equipment to be disassembled and the disassembled piece bonded on the electronic equipment to be disassembled;
one end of the dropper is connected with the driving assembly, and the other end of the dropper extends into a position close to the electronic equipment to be disassembled and between the disassembled parts bonded on the electronic equipment to be disassembled so as to drip the sol solution to the position.
3. The electronic device disassembling apparatus according to claim 2, wherein the driving assembly includes a connecting rod, a first sliding block, and a first driving member, the pulling wire and the dropping pipe are respectively connected to the connecting rod, and the connecting rod is connected to the first sliding block;
one end of the first driving piece is connected with the first sliding block and used for driving the first sliding block to slide on the mounting frame.
4. A disassembling device for electronic equipment according to claim 3, wherein the mounting frame is provided with a slide rail, and the first slide block is provided with a slide groove adapted to the slide rail;
the connecting rods comprise a first connecting rod and a second connecting rod, and two ends of the stay wire are respectively connected with the first connecting rod and the second connecting rod;
the dropper is connected with at least one of the first connecting rod or the second connecting rod.
5. The electronic device disassembling apparatus according to claim 4, wherein the number of the dropping pipes is two, and the dropping pipes are respectively connected to the first connecting rod and the second connecting rod;
the spacing distance between the dropper and the stay wire is gradually reduced along with the direction away from the connecting frame, so that the liquid flowing out of the dropper is in contact with the stay wire.
6. The electronic equipment dismantling device of claim 1 wherein the cutting mechanism further comprises an adsorbing assembly for adsorbing the dismantled piece of the separated electronic equipment to be dismantled.
7. The electronic device disassembling apparatus according to claim 6, wherein the suction assembly includes a second sliding block, a suction disc, and a second driving member, the second driving member is configured to drive the second sliding block to slide on the mounting frame;
one end of the adsorption disc is connected with the second sliding block, and the other end of the adsorption disc faces towards the direction of the placing frame.
8. The electronic equipment disassembling device according to claim 1, wherein a bottom suction tray is arranged on the placing frame, and the bottom suction tray is used for adsorbing one end of the electronic equipment to be disassembled, which is far away from the electronic equipment to be disassembled and is adhered with a disassembled piece;
the thickness of the end, far away from the lifting component, of the placing frame is larger than the thickness of the end, close to the lifting component, of the placing frame.
9. The electronic device disassembling apparatus of claim 1, wherein the support includes a driving motor and a matching component, the matching component is connected to the mounting rack, and the driving motor is configured to drive the matching component to drive the mounting rack to move away from or close to the rack.
10. A disassembling device for electronic equipment according to claim 9, wherein the engaging assembly includes a screw rod and at least one optical axis, and the mounting frame is provided with a threaded hole and a unthreaded hole for engaging with the screw rod and the optical axis, respectively;
the driving motor is used for driving the screw rod to rotate so as to drive the mounting rack to be far away from or close to the placing rack; the optical axis plays a guiding role.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010172740.9A CN113386080A (en) | 2020-03-12 | 2020-03-12 | Electronic equipment disassembling device |
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| CN202010172740.9A CN113386080A (en) | 2020-03-12 | 2020-03-12 | Electronic equipment disassembling device |
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| CN101934531A (en) * | 2010-07-26 | 2011-01-05 | 友达光电股份有限公司 | Separating equipment |
| CN104044332A (en) * | 2013-03-15 | 2014-09-17 | 纬创资通股份有限公司 | Method for disassembling tablet assembly and disassembling tool |
| CN205427371U (en) * | 2016-03-02 | 2016-08-03 | 北京京东方显示技术有限公司 | Disassemble tool |
| CN206465035U (en) * | 2016-12-30 | 2017-09-05 | 宁德时代新能源科技股份有限公司 | Battery disassembles frock |
| CN207104778U (en) * | 2017-07-03 | 2018-03-16 | 北京长城华冠汽车科技股份有限公司 | Controller casing and device for disassembling |
| CN107498500A (en) * | 2017-09-14 | 2017-12-22 | 京东方科技集团股份有限公司 | One kind disassembles tool |
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| CN109915449A (en) * | 2019-03-14 | 2019-06-21 | Oppo广东移动通信有限公司 | Display screen device for disassembling |
| CN110732864A (en) * | 2019-12-02 | 2020-01-31 | 江苏创源电子有限公司 | battery disassembling equipment and method |
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Application publication date: 20210914 |