CN113385389B

CN113385389B - Resin coating method and LED panel

Info

Publication number: CN113385389B
Application number: CN202110680446.3A
Authority: CN
Inventors: 陈皓
Original assignee: TCL Huaxing Photoelectric Technology Co Ltd
Current assignee: TCL Huaxing Photoelectric Technology Co Ltd
Priority date: 2021-06-18
Filing date: 2021-06-18
Publication date: 2023-12-08
Anticipated expiration: 2041-06-18
Also published as: CN113385389A

Abstract

The application discloses a resin coating method and an LED panel, wherein the resin coating method comprises the following steps: providing a substrate with a binding area; manufacturing a barrier layer on the binding area; manufacturing a resin coating area on the barrier layer; coating a resin on the resin coating region; the coating resin is irradiated to cure the resin. The arrangement of the barrier layer avoids overflow during resin coating and ensures the resin molding shape; the barrier layer is formed by spraying/printing an inorganic solvent, a resin coating area can be formed by illumination, and the whole operation is simple and quick; the blocking layer can volatilize through irradiation, volatilize after the blocking function is completed, and the space of the glass surface and the binding area is not occupied, so that the product can be ensured to have an extremely narrow frame.

Description

Resin coating method and LED panel

Technical Field

The application relates to the technical field of display, in particular to a resin coating method and an LED panel.

Background

At present, the panel presents diversification, wherein the resolution and the color degree of Micro LEDs and Mini LEDs are close to that of OLED, which is superior to LCD; and the power consumption is lower, lighter and thinner. After the Array- & gt Cut- & gt white oil coating- & gt SMT- & gt Bonding process is performed on the Micro LEDs and the Mini LEDs, the substrate terminal exposed parts and the COF lead exposed parts need to be covered with resin, so that short circuits and terminal corrosion between terminals caused by foreign matters, moisture and the like are prevented.

When the LCD product is coated with resin, the resin can well cover the exposed terminals and is not easy to overflow due to the poor blocking of the upper CF substrate and the lower CF substrate and the TFT substrate. And Mini LED only has TFT single-layer glass, and when actually coating, resin has fluidity, causes uneven width, has to spill over to the in-plane LED lamp pearl, influences the risk of product optical display.

Disclosure of Invention

The application aims to provide a resin coating method and an LED panel, which can prevent resin from overflowing everywhere after coating, protect LED lamp beads and ensure the optical display effect of the LED lamp beads when the resin is coated.

In order to achieve the above object, the present application provides a resin coating method comprising the steps of:

providing a substrate with a binding area;

manufacturing a barrier layer on the binding area;

manufacturing a resin coating area on the barrier layer;

coating a resin on the resin coating region;

the coating resin is irradiated to cure the resin.

Further, the steps of: the manufacturing of the barrier layer on the binding area specifically comprises the following steps:

spraying/printing an inorganic solvent on the binding area to form a barrier layer; the resin is insoluble in the inorganic solvent.

Further, the blocking layer covers the binding region.

Further, the steps of: the manufacturing of the resin coating area on the barrier layer specifically comprises the following steps:

a light source is used to irradiate a partial region on the barrier layer, and the inorganic solvent of the partial region volatilizes to form the resin coating region.

Further, the inorganic solvent is water.

Further, the steps of: irradiating a partial region on the barrier layer with a light source, wherein an inorganic solvent of the partial region volatilizes to form the resin coating region, and specifically comprises the following steps:

and irradiating the middle area of the barrier layer by using a light source to form a resin coating area, and coating the periphery of the resin coating area by the barrier layer.

Further, the step of applying the resin to cure the resin specifically comprises the steps of:

the resin coating region and the barrier layer are irradiated, the resin of the resin coating region is cured, and the barrier layer is volatilized.

Further, the steps of: irradiating the substrate to cure the coating resin, and volatilizing the inorganic solvent specifically includes the steps of:

the resin coating region and the barrier layer are irradiated using a UV lamp, the resin of the resin coating region is cured, and the barrier layer is volatilized.

Further, in the step: after the resin coating area is formed on the barrier layer, the steps before the resin coating area is coated with the resin, further comprise the following steps:

and coating a protective adhesive in the resin coating area.

In order to achieve the above object, the present application also provides an LED panel, the resin layer of which is made using the resin coating method as described above.

The application has the technical effects that the overflow during resin coating is avoided and the resin molding shape is ensured by the arrangement of the barrier layer; the barrier layer is formed by spraying/printing an inorganic solvent, a resin coating area can be formed by illumination, and the whole operation is simple and quick; the blocking layer can volatilize through irradiation, volatilize after the blocking function is completed, the space of the TFT surface and the binding area is not occupied, and the product is ensured to be provided with an extremely narrow frame.

Drawings

The technical solution and other advantageous effects of the present application will be made apparent by the following detailed description of the specific embodiments of the present application with reference to the accompanying drawings.

Fig. 1 is a plan view of an LED panel in embodiment 1 of the present application at the time of resin coating.

Fig. 2 is a schematic structural view of the barrier layer and the resin coating region thereon in example 1 of the present application.

Fig. 3 is a schematic structural diagram of a substrate, COF and LED beads in embodiment 1 of the present application.

Fig. 4 is a schematic view of disposing a barrier layer on a substrate in embodiment 1 of the present application.

Fig. 5 is a schematic view showing the arrangement of a resin coating region on a barrier layer in example 1 of the present application.

Fig. 6 is a schematic view of the spray coating of resin in the resin coating zone in example 1 of the present application.

FIG. 7 is a schematic view showing the volatilization of the barrier layer after curing the resin in example 1 of the present application.

The components of the drawings are identified as follows:

100. a substrate; 200. binding area;

300. a barrier layer; 310. a resin coating region;

400. LED lamp beads; 500. a resin;

600、COF。

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present application, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Example 1

The first embodiment of the present application discloses a resin coating method applied to a manufacturing process of an LED panel, as shown in fig. 1, the LED panel has a single-layer TFT glass on which a plurality of LED lamps are disposed, and a bonding region 200 is required to be manufactured on one side edge of the TFT during the manufacturing process, and after the bonding region 200 is completed, a terminal exposed portion of a substrate 100 and a COF600 lead exposed portion are required to be covered with a resin 500 to prevent a short circuit between terminals and terminal corrosion caused by foreign matters, moisture, etc. In practice, the resin 500 has fluidity, which causes a problem of uneven width, and overflows to the in-plane LED lamp beads 400, which affects the optical display of the product.

In the prior art, the resin 500 is blocked from overflowing by fabricating a blocking wall on the TFT substrate 100, but the blocking wall is generally low in height due to the product structure limitation, and the resin 500 cannot be blocked from overflowing effectively. And extra design space is required, an extremely narrow frame cannot be achieved.

In view of this, the present embodiment provides a resin coating method that can block the resin 500 from overflowing without additional space, and in which no blocking member is present in the product. The method for coating the resin 500 specifically comprises the following steps:

s100, providing a substrate 100. As shown in fig. 1 and 3, the substrate 100 has a Bonding region 200 (Bonding region), wherein the substrate 100 is subjected to an Array (Array) → cutting) → white oil coating→ patch (SMT) → Bonding (Bonding) process to obtain the Bonding region 200, and the Bonding region 200 is close to the edge of the substrate 100 and is adjacent to the LED lamp beads 400.

S200, manufacturing a barrier layer 300 on the binding area 200. As shown in fig. 4, the barrier layer 300 can block the flow of the resin 500, prevent the resin 500 from overflowing, and now the barrier layer 300 is formed on the bonding region 200 of the substrate 100, and then the resin 500 is coated, so that the resin 500 can be prevented from overflowing.

It should be noted that, a Chip On Film (COF) is disposed on the bonding area 200, and a portion of the COF600 is located on the surface of the bonding area 200, so that the surface of the bonding area 200 is uneven, a portion of the surface is covered by the COF600, the height is higher, and another portion is the upper surface of the TFT glass, and the height is lower. When the barrier layer 300 is fabricated, the binding region 200 is covered by the barrier region, so that the shape of the barrier layer 300 is not the same as the thickness of the film everywhere, as shown in the figure, the thickness of the barrier layer 300 above the COF600 is thinner, and the thickness of the barrier layer 300 on the TFT glass surface is thicker, and the overall heights of the two layers are consistent, so that the top of the barrier layer 300 is flat.

And S300, manufacturing a resin coating area 310 on the barrier layer 300. As shown in fig. 2 and 5, the resin coating region 310 is formed in the middle of the barrier layer 300, and when the resin 500 is coated in the resin coating region 310, the flowing resin 500 is blocked by the surrounding barrier layer 300, and thus, no overflow occurs. The resin coated region 310 may be formed on the barrier layer 300 in a variety of ways, and in one embodiment, a portion may be dug out on the barrier layer 300 after the formation of the barrier layer 300, or a portion may be removed to form the resin coated region 310. In another embodiment, a shielding sheet or shielding portion may be preset on the binding area 200, and after the barrier layer 300 is manufactured, the shielding sheet or shielding portion may be removed, and the covered portion of the shielding sheet or shielding portion may be sprayed or printed to form the resin coating area 310. Generally, when the resin coating region 310 is disposed in the barrier layer 300, the resin coating region 310 is not in communication with the edge of the barrier layer 300, but is surrounded by the barrier layer 300, so that the resin 500 is blocked by the barrier layer 300 in all directions when it is disposed in the resin coating region 310.

S400, coating a resin 500 on the resin coating region 310. As shown in fig. 6, the resin coating area 310 is recessed below the barrier layer 300, and after the resin 500 is coated in the resin coating area 310, the barrier layer 300 blocks the resin 500 from the periphery, so as to avoid the resin 500 from overflowing, and it is worth noting that the thickness of the barrier layer 300 is greater than or equal to the thickness of the resin 500, so as to ensure that the barrier height is sufficient, and avoid incomplete barrier and overflow of the resin 500. Wherein, the thickness of the single-layer barrier layer 300 is greater than or equal to 1um, and when more film thickness is needed, the single-layer barrier layer can be formed by multiple spraying stacks. I.e., the thickness of the barrier layer 300 can be freely controlled and processed as desired.

S500, irradiating the coating resin 500 to cure the resin 500. After the resin 500 is coated, curing and molding can be completed by a certain amount of light, and in this embodiment, the resin 500 is fixed and molded by irradiating the coated resin 500 with UV light.

In step S200, the step of fabricating the barrier layer 300 on the binding area 200 specifically includes the following steps:

and S210, spraying/printing an inorganic solvent on the binding area 200 to form a barrier layer 300. The inorganic solvent, in which the resin 500 is insoluble, may be directly disposed on the bonding region 200.

When the barrier layer 300 is manufactured on the binding area 200, the whole binding area 200 is covered by the barrier layer 300, so that the resin coating area 310 can be arranged at any position on the binding area 200. The binding region 200 is close to the LED beads 400, wherein the binding region 200 has a length direction and a width direction, the width direction of the binding region 200 faces the LED beads 400, the barrier layer 300 is equal to the length of the binding region 200 in the length direction, and the width of the barrier layer 300 is greater than the width of the binding region 200. That is, since the inorganic solvent partially contacts the LED beads 400, if the width of the inorganic solvent is the same as the width of the bonding region 200, the inorganic solvent is easily diffused in the width direction, resulting in a decrease in the height of the barrier layer 300, and thus the resin 500 is easily overflowed. Therefore, the width of the barrier layer 300 in the binding region 200 is larger than that of the binding region 200, so that the inorganic solvent in the middle of the barrier layer 300 is prevented from diffusing or flowing, and the stability of the resin coating region 310 is ensured.

In this embodiment, the inorganic solvent may be water, but in other embodiments, the inorganic solvent may be any other type of solvent, such as ethanol, methanol, benzene, etc., which is not limited in this embodiment. The inorganic solvent is mutually insoluble with the resin 500, so that mutual rejection can be generated, and the rejection effect of the inorganic solvent at the edge and the organic matters of the resin 500 can be realized; the resin 500 cannot overflow into the surface, and the edge is uniformly spread, so that the linearity is better, and the resin 500 is internally molded in the resin coating area 310.

Step S300, after the resin coating area 310 is formed on the barrier layer 300, further includes a step S310 of irradiating a partial area on the barrier layer 300 with a light source, and as shown in fig. 2 and 5, volatilizing an inorganic solvent of the partial area to form the resin coating area 310. Since the barrier layer 300 in this embodiment is composed of an inorganic solvent, in the process of manufacturing the coating layer of the resin 500, a partial area of the barrier layer 300 can be directly irradiated by a light source, so that the solvent in the area volatilizes to form a cavity, which is the resin coating area 310, and in order to save the cost, the inorganic solvent in the middle of the barrier layer 300 can volatilize only by irradiating the middle of the barrier layer 300 by a point light source, so that the process of manufacturing the resin coating area 310 is simple and fast. Meanwhile, the light source irradiation area is easy to control, and the range of emergent light can be limited through a light emergent channel, so that only the irradiation part on the barrier layer 300 volatilizes, and a resin 500 coating layer is formed.

Step 310, irradiating a partial area on the barrier layer 300 with a light source, wherein the inorganic solvent in the partial area volatilizes to form the resin coating area 310, and specifically comprises the following steps: s320, irradiating the middle area of the barrier layer 300 with a light source to form a resin coating area 310, wherein the periphery of the resin coating area 310 is coated by the barrier layer 300.

When the barrier layer 300 is irradiated, the middle part of the barrier layer is irradiated, so that the periphery of the resin coating area 310 is coated by the barrier layer 300, and it should be noted that light cannot irradiate the edge of the barrier layer 300, so that the situation that the barrier layer 300 is notched and the resin 500 overflows is avoided.

The steps are as follows: s500, irradiating the coating resin 500 to cure the resin 500, specifically comprising the following steps: s510, irradiating the resin coating region 310 and the barrier layer 300, curing the resin 500, and volatilizing the inorganic solvent. In fig. 6, since the barrier layer 300 is an inorganic solvent and volatilizes at the time of irradiation, the irradiation area can be enlarged in the step of irradiating the resin 500, and the entire barrier layer 300 can be irradiated to volatilize the barrier layer 300. After the product is finished, the barrier layer 300 is not left, the size of the binding region 200 is not affected, no extra barrier space is required to be arranged on the TFT glass, the arrangement of an extremely narrow frame is not affected, and fig. 7 shows a substrate structure after the barrier layer 300 disappears. The resin 500 in this embodiment is a photo-curing resin 500, which is composed of a monomer and a prepolymer of the resin 500, contains active functional groups, and can be polymerized by a photosensitizer under ultraviolet irradiation to generate an insoluble coating film. The irradiation condition may be a UV lamp, and the resin 500 may be directly cured under irradiation of the UV lamp. The irradiation condition of the resin 500 is a UV lamp, and the irradiation condition of the barrier layer 300 may be other light, such as an LED light source, etc., and the inorganic solvent may be volatilized. When the irradiation is carried out, the UV lamp and other light sources can be used for mixing to carry out the irradiation or alternatively irradiating, so that the illumination cost is saved.

Step S510, irradiating the resin coating area 310 and the barrier layer 300 to cure the resin 500, and volatilizing the inorganic solvent, specifically includes the following steps: the coating resin 500 and the inorganic solvent are irradiated using a UV lamp, so that the coating resin 500 is cured while volatilizing the inorganic solvent.

In this embodiment, the UV lamp is used to irradiate the resin 500 and the barrier layer 300 simultaneously, and the barrier layer 300 is volatilized while the coating resin 500 is cured, so that the condition of mixing and replacing illumination is avoided, and the process is convenient.

The resin 500 coating method used in the present embodiment, through the arrangement of the barrier layer 300, avoids overflow during the resin 500 coating, and ensures the molding shape of the resin 500; the barrier layer 300 is formed by spraying/printing an inorganic solvent, and the resin coating area 310 can be formed by illumination, so that the whole operation is simple and quick; the blocking layer 300 can be volatilized by irradiation, and volatilizes after the blocking function is completed, so that the space of the TFT surface and the binding area 200 is not occupied, and the product can be ensured to have an extremely narrow frame.

The resin coating method, the preparation method and the display device provided by the embodiment of the application are described in detail, and specific examples are applied to illustrate the principle and the implementation mode of the application, and the description of the above examples is only used for helping to understand the technical scheme and the core idea of the application; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the application.

Claims

1. A resin coating method, comprising the steps of:

providing a substrate with a binding area; the binding area is provided with a flip chip film;

a shielding part is arranged on the binding area;

spraying/printing an inorganic solvent on the binding region to form a barrier layer, wherein a part of the barrier layer is positioned on the flip chip film, and the width of the barrier layer in the width direction of the binding region is larger than that of the binding region;

removing the shielding part, wherein the shielding part covers part to form a resin coating area, the periphery of the resin coating area is covered by the barrier layer, and the resin coating area is partially positioned on the flip chip film;

coating a resin on the resin coating region, the resin being insoluble in the inorganic solvent;

the coating resin is irradiated to cure the resin.

2. The resin coating method of claim 1, wherein the barrier layer covers the binding region.

3. The resin coating method according to claim 1, wherein the inorganic solvent is water.

4. The resin coating method according to claim 1, wherein irradiating the coating resin to cure the resin specifically comprises the steps of:

5. The resin coating method according to claim 4, characterized by the steps of: irradiating the substrate to cure the coating resin, and volatilizing the inorganic solvent specifically includes the steps of:

6. The resin coating method according to claim 1, wherein, in the step of: after the resin coating area is formed on the barrier layer, the steps before the resin coating area is coated with the resin, further comprise the following steps:

and coating a protective adhesive in the resin coating area.

7. An LED panel, characterized in that a resin layer of the LED panel is made using the resin coating method according to any one of claims 1 to 6.