CN113385279A - Deburring device with die casting edge measurement function of polishing - Google Patents
Deburring device with die casting edge measurement function of polishing Download PDFInfo
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- CN113385279A CN113385279A CN202110941558.XA CN202110941558A CN113385279A CN 113385279 A CN113385279 A CN 113385279A CN 202110941558 A CN202110941558 A CN 202110941558A CN 113385279 A CN113385279 A CN 113385279A
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- 238000004512 die casting Methods 0.000 title claims abstract description 69
- 238000005259 measurement Methods 0.000 title claims description 4
- 238000005498 polishing Methods 0.000 title claims description 4
- 239000004065 semiconductor Substances 0.000 claims abstract description 83
- 238000000227 grinding Methods 0.000 claims abstract description 11
- 238000000605 extraction Methods 0.000 claims description 28
- 239000000919 ceramic Substances 0.000 claims description 20
- 238000012545 processing Methods 0.000 claims description 18
- 239000012528 membrane Substances 0.000 claims description 16
- 230000008602 contraction Effects 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 6
- 229920000742 Cotton Polymers 0.000 claims description 5
- 241001061140 Caulophryne pelagica Species 0.000 claims 1
- 238000001816 cooling Methods 0.000 abstract description 13
- 230000005679 Peltier effect Effects 0.000 abstract description 5
- 238000009434 installation Methods 0.000 abstract description 2
- 238000007789 sealing Methods 0.000 description 26
- 238000000034 method Methods 0.000 description 10
- 230000009471 action Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 239000000284 extract Substances 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 230000008014 freezing Effects 0.000 description 5
- 238000007710 freezing Methods 0.000 description 5
- 230000008569 process Effects 0.000 description 4
- 238000010288 cold spraying Methods 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 230000009467 reduction Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 230000033001 locomotion Effects 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 241000628997 Flos Species 0.000 description 1
- 238000003723 Smelting Methods 0.000 description 1
- 230000003044 adaptive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
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- 230000003252 repetitive effect Effects 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
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- 238000007711 solidification Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/18—Use of auxiliary physical effects, e.g. ultrasonics, irradiation, for disintegrating
- B02C19/186—Use of cold or heat for disintegrating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/16—Mills provided with vibrators
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B02—CRUSHING, PULVERISING, OR DISINTEGRATING; PREPARATORY TREATMENT OF GRAIN FOR MILLING
- B02C—CRUSHING, PULVERISING, OR DISINTEGRATING IN GENERAL; MILLING GRAIN
- B02C19/00—Other disintegrating devices or methods
- B02C19/18—Use of auxiliary physical effects, e.g. ultrasonics, irradiation, for disintegrating
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B1/00—Cleaning by methods involving the use of tools
- B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22D—CASTING OF METALS; CASTING OF OTHER SUBSTANCES BY THE SAME PROCESSES OR DEVICES
- B22D17/00—Pressure die casting or injection die casting, i.e. casting in which the metal is forced into a mould under high pressure
- B22D17/20—Accessories: Details
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- Engineering & Computer Science (AREA)
- Food Science & Technology (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Mechanical Engineering (AREA)
- Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
Abstract
The invention discloses a deburring device with a die casting grinding edge measuring function, which comprises a base, a sleeve ring and a connecting plate, wherein the sleeve ring is arranged on the base, the connecting plate is arranged in the middle of the base, the connecting plate is positioned in the sleeve ring, the sleeve ring abuts against the die casting, the connecting plate abuts against the top end of a burr, and the sleeve ring and the connecting plate are both electrically connected with a control circuit. The base provides the support for the installation of the lantern ring and linking plate, the lantern ring cover is established in the outside of burr root, the lantern ring inboard is provided with first N type semiconductor, linking plate supports the top at the burr, linking plate bottom is provided with first P type semiconductor, the lantern ring makes the burr insert the circuit with linking plate mutually supporting, make the burr absorb the heat from the external world through the Peltier effect, make burr self temperature drop, before the burr cooling, linking plate makes the inside temperature of the lantern ring reduce, make the burr absorb the heat of self inside, the speed of the cooling of the burr is accelerated, the refrigerated efficiency of burr is improved.
Description
Technical Field
The invention relates to the technical field of die casting surface treatment, in particular to a deburring device with a die casting grinding edge measuring function.
Background
The application range of die castings becomes wider along with the coming of the trend of electronic product metallization, the die casting process relates to the technological processes of alloy melting, injection, solidification forming in a die and the like, so that the appearance defects of air holes, sand holes, burrs and the like exist on the surfaces of various die castings obtained by die casting, and the use of the die castings as high-end appearance parts is further influenced.
In order to solve the above-mentioned defects, a suitable method is usually adopted for processing according to the processing requirements, such as a method for removing burrs on the surface of a die casting, which includes the following methods: 1. the cold spraying method has the disadvantages that the cost of cold spraying equipment and powder materials is high, the requirements on tooling and smelting tools are high, and the deformation of products is easily caused by cold spraying pressure; 2. manual processing, take the instrument through the manual work and handle the burr on die casting surface, nevertheless this mode is not only wasted time and energy, moreover under the less condition of burr quantity is many and size, difficult operation also leads to the unqualified phenomenon of processing to appear in the product easily simultaneously.
Disclosure of Invention
The invention aims to provide a deburring device with a die casting grinding edge measuring function, and the deburring device is used for solving the problems in the background technology.
In order to solve the technical problems, the invention provides the following technical scheme: a deburring device with a die casting grinding edge measuring function comprises a base, a sleeve ring and a connecting plate, wherein the sleeve ring is arranged on the base, the connecting plate is arranged in the middle of the base, the connecting plate is located inside the sleeve ring, the sleeve ring abuts against the die casting, one end of the connecting plate abuts against the top end of a burr, and the sleeve ring and the connecting plate are both electrically connected with a control circuit;
a first N-type semiconductor is arranged on the inner side of one end, far away from the base, of the lantern ring;
and a first P-type semiconductor is arranged in the middle of one end, far away from the base, of the connecting plate.
The base provides the support for the installation of the lantern ring and link up the fishplate bar, the lantern ring cover is established in the outside of burr root, first N type semiconductor supports the outside at the burr root, first P type semiconductor supports the top at the burr under the drive of link up the fishplate bar, the lantern ring makes burr access circuit with linking up the fishplate bar and mutually supporting, the electric current flows through from the burr, make the burr absorb the heat from the external world through the Peltier effect, make burr self temperature decline, before the burr cooling, link up the fishplate bar and make the inside temperature reduction of lantern ring, make the temperature reduction around the burr, force the burr to absorb the inside heat of self, the speed of burr cooling accelerates, make the burr from inside to outside freezing, the frozen efficiency of improvement burr.
The two ends of the connecting plate are respectively provided with a second P-type semiconductor and a second N-type semiconductor, a plurality of groups of fins are arranged on the outer side of the connecting plate, drying cotton is arranged between the fins of each group, one ends of the fins of each group are provided with a top plate, and the second P-type semiconductor and the second N-type semiconductor are electrically connected with the control circuit. The fin increases the area of contact of linkage plate and air, and moisture in the air condenses into water at the fin outward appearance, and dry silk floss absorbs the water that slides on the fin, keeps the inside drying of lantern ring, prevents that the water from dripping on the burr, and second P type semiconductor and second N type semiconductor all are connected with control circuit electricity, make the electric current flow to second P type semiconductor through linkage plate from second N type semiconductor, make linkage plate pass through the fin and cool down to the space of lantern ring inside, make the temperature reduction around the burr, force the burr to absorb self heat.
The fin is arranged on the top plate, the end, far away from the fin, of the top plate is provided with a groove in a round table shape, the first P-type semiconductor is located in the middle of the groove, the side end face of the groove is provided with second piezoelectric ceramics, and the first P-type semiconductor and the second piezoelectric ceramics are electrically connected with the control circuit. Second piezoceramics produces the ultrasonic wave after letting in the alternating current, makes the burr after freezing vibrate through the ultrasonic wave to make burr self burst apart, smash, thereby realize carrying out accurate processing to die casting surface defect, the recess of round platform form makes piezoceramics with the angle orientation burr of slope, makes the propagation angle grow of ultrasonic wave, thereby make full use of ultrasonic wave.
The one end that the base was kept away from to the lantern ring is provided with the end ring, the inboard of end ring is provided with a plurality of groups expansion plate, every group the one end of expansion plate all is provided with first N type semiconductor, every group it all inclines to be provided with first piezoceramics on the first N type semiconductor, first N type semiconductor and first piezoceramics all are connected with control circuit electricity. First piezoceramics is towards the burr, first piezoceramics lets in the alternating current, first piezoceramics produces the ultrasonic wave towards the burr, the first piezoceramics of a plurality of groups is around the burr, make the burr receive ultrasonic wave from a plurality of directions and assault, accelerate the crushing speed of burr, improve deburring efficiency and die casting surface's processing speed, when first piezoceramics produced the ultrasonic wave, on energy transfer to first N type semiconductor with the vibration, make first N type semiconductor transmit the vibration energy, make the burr vibrations under the influence that receives the vibration energy of first N type semiconductor transmission.
The base is internally provided with a telescopic piece, the telescopic piece is provided with a bearing plate, the base is internally provided with an extraction assembly, and one ends of the fins are fixed with the bearing plate. The extensible member drives the connecting plate to move through the bearing plate and the fins, the connecting plate can reciprocate in the lantern ring, and the distance between the first P-type semiconductor and the burrs is adjusted through the extensible member, so that the first P-type semiconductor adapts to the burrs with different lengths.
The utility model discloses a seal structure, including the base, the base is provided with the seal membrane in the outside of the lantern ring, the one end of seal membrane is provided with the air current ring, the air current ring is connected with the outside of end ring, is provided with the air current hole on the air current ring, every group all be provided with rubber in the air current hole, the gas pocket has all been seted up at the rubber middle part, form sealed chamber between seal membrane and the lantern ring, sealed chamber and extraction subassembly pipe connection. The sealing film is a layer of rubber film, when the lantern ring is pressed against the surface of the die casting and compressed, the sealing film covers the die casting, the extraction assembly extracts air in the sealing cavity, the sealing film is attached to the outer surface of the lantern ring, air between two layers of sealing films covering the die casting is extracted completely, the sealing films on two sides are attached together under the extrusion of outside air, meanwhile, the outside air extrudes the sealing film on the surface of the die casting, the sealing film fills a pit groove in the die casting, rubber is installed in the airflow hole and seals the air hole under the action of elasticity of the rubber, when the air in the sealing cavity is extracted completely, the rubber deforms under the action of air pressure, the air hole is opened, the sealing film is attached to the die casting, the sealing film, the die casting and the airflow ring form a negative pressure cavity, the air hole is communicated with the negative pressure cavity after being opened, the extraction assembly extracts air in the negative pressure cavity through the air hole, make the air between seal membrane and the die casting taken out, laminating effect between further reinforcing seal membrane and the die casting improves the sealed effect between the lantern ring and the die casting to prevent that the fishplate bar from to the lantern ring inside after cooling down, because atmospheric pressure reduces and leads to the outside air to enter into the lantern ring in and influence the cooling effect.
Every group the expansion plate is the bellows structure, and every group expansion plate upper end is inside all to be provided with the shrink tube, expansion plate and shrink tube all with extraction subassembly pipe connection. The expansion plate extends and contracts under the control of extraction subassembly, support first N type semiconductor on the burr when the expansion plate extends, shrink tube and extraction subassembly intercommunication, when the inside air of shrink tube was extracted by the extraction subassembly, the expansion plate receives the influence of shrink tube to be crooked, the one end perk that makes to have first N type semiconductor, after the burr is smashed, the expansion plate extends again in the control of extraction subassembly, the first N type semiconductor of a plurality of groups supports the residue shovel with the burr together, afterwards, the expansion plate upwarps under the influence of shrink tube, make on the residue slide expansion plate, through the repetitive motion of expansion plate, it is clean up the residue from the die casting.
The deburring device further comprises an image acquisition system and an image processing system, wherein the image acquisition system is used for acquiring images of the die castings, and the image processing system is used for acquiring the positions of burrs on the die castings and the lengths of the burrs through image processing. The sleeve ring is sleeved on the outer side of the burr through position data, and the position of the connecting plate in the sleeve ring is controlled through burr length data.
Compared with the prior art, the invention has the following beneficial effects: according to the die casting cooling device, the sleeve ring is sleeved around the burr, the temperature in the sleeve ring is reduced, the first N-type semiconductor abuts against the outer side of the root of the burr, the first P-type semiconductor abuts against the top of the burr under the driving of the connecting plate and is forced to absorb the heat inside the first P-type semiconductor, current flows through the burr, the burr absorbs the heat from the outside through the Peltier effect, the temperature of the burr is reduced, before the burr is cooled, the temperature inside the sleeve ring is reduced due to the connecting plate, the burr cannot absorb the heat from the outside, the heat inside the burr is forced to be absorbed by the burr, the burr cooling speed is accelerated, the burr is frozen from the inside to the outside, the burr freezing efficiency is improved, and compared with a mode of cooling the whole die casting, the die casting cooling mode is quick and accurate, and the cost is relatively low.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of the state of the sleeve ring of the present invention fitted over a die cast part;
FIG. 3 is a schematic top view of the present invention between the collar and the sealing membrane;
figure 4 is a schematic half-section through a connector tile according to the invention;
FIG. 5 is a schematic view of the structure between the bottom ring and the expansion plate of the present invention;
FIG. 6 is a schematic view of a variation of the expansion plate of the present invention;
FIG. 7 is a schematic structural view of the expansion plate of the present invention;
FIG. 8 is a schematic structural view of the region A in FIG. 2 according to the present invention;
fig. 9 is a simulated schematic of flash freezing of the present invention.
In the figure: 1. a base; 2. a collar; 3. a sealing film; 4. a connector tile; 5. die casting; 6. a bottom ring; 1-1, carrying plate; 1-2, a telescopic piece; 1-3, an extraction component; 3-1, an airflow ring; 4-1, a top plate; 4-2, a first P-type semiconductor; 4-3, fins; 4-4, a second P-type semiconductor; 4-5, a second N-type semiconductor; 4-6, drying cotton; 6-1, a telescopic plate; 6-2, a first N-type semiconductor; 6-3, first piezoelectric ceramics; 6-4, a shrink tube.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-9, the present invention provides the following technical solutions: the utility model provides a burring device with die casting edge measurement function of polishing, this burring device includes base 1, the lantern ring 2, links up fishplate bar 4, and lantern ring 2 sets up on base 1, and links up fishplate bar 4 and sets up in base 1 middle part, and inside linking fishplate bar 4 was located lantern ring 2, lantern ring 2 supported on die casting 5, and linking fishplate bar 4 supported on the burr top, and lantern ring 2 and linking fishplate bar 4 all are connected with control circuit electricity.
The base 1 is internally provided with a telescopic part 1-2, the telescopic part 1-2 is equipment capable of stretching, such as an air cylinder, a hydraulic cylinder and the like, the telescopic part 1-2 is provided with a bearing plate 1-1, the base 1 is internally provided with an extraction component 1-3, and the extraction component 1-3 comprises a fan, a pipeline and an electromagnetic valve.
The outer side cover of lantern ring 2 on base 1 is equipped with seal membrane 3, seal membrane 3 is the one deck rubber membrane, the one end of seal membrane 3 is fixed with air current ring 3-1, air current ring 3-1 is connected with the outside of base ring 6 through being annular board, the last air current hole of having seted up of air current ring 3-1, all be provided with rubber in every group air current hole, the gas pocket has all been seted up at the rubber middle part, form the seal chamber between seal membrane 3 and the lantern ring 2, seal chamber and extraction subassembly 1-3 pipe connection.
When the lantern ring 2 is pressed against the surface of a die casting 5 and compressed, the sealing film 3 covers the die casting 5, the extraction assembly 1-3 extracts air in the sealing cavity, the sealing film 3 is attached to the outer surface of the lantern ring 2, air between two layers of sealing films 3 covering the die casting 5 is extracted to be clean, the sealing films 3 on two sides are attached together under the extrusion of outside air, meanwhile, the sealing film 3 is extruded on the surface of the die casting 5 by outside air, the sealing film 3 fills a pit groove in the die casting 5, rubber is arranged in an airflow hole, the rubber seals the air hole under the action of the elasticity of the rubber, when the air in the sealing cavity is extracted to be clean, the rubber deforms under the action of air pressure, the air hole is opened, the sealing film is attached to the die casting, and the sealing film 3, the die casting 5 and the airflow ring 3-1 form a negative pressure cavity, the gas pocket is opened the back and is linked up the negative pressure chamber, and extraction subassembly 1-3 passes through the air pocket and extracts the air in the negative pressure chamber, makes the air between seal membrane 3 and the die casting 5 taken away, and further laminating effect between reinforcing seal membrane 3 and the die casting 5 improves the sealed effect between the lantern ring 2 and the die casting 5 to prevent that joint board 4 from cooling down the back to 2 insides of the lantern ring, because atmospheric pressure reduces and leads to the outside air to enter into 2 in the lantern ring and influence the cooling effect.
The lantern ring 2 is of a corrugated pipe structure, a bottom ring 6 is installed at one end, far away from the base 1, of the lantern ring 2, a plurality of groups of expansion plates 6-1 are arranged on the inner side of the bottom ring 6, a first N-type semiconductor 6-2 is arranged at one end of each group of expansion plates 6-1, first piezoelectric ceramics 6-3 are obliquely arranged on each group of first N-type semiconductors 6-2, and the first N-type semiconductor 6-2 and the first piezoelectric ceramics 6-3 are electrically connected with a control circuit.
Each group of expansion plates 6-1 is of a corrugated pipe structure, the upper end of each group of expansion plates 6-1 is internally provided with a contraction pipe 6-4, and the expansion plates 6-1 and the contraction pipes 6-4 are connected with the extraction assembly 1-3 through pipelines.
The lantern ring 2 is sleeved on the outer side of the root of the burr, the first N-type semiconductor 6-2 abuts against the outer side of the root of the burr, the first P-type semiconductor 4-2 abuts against the top of the burr under the driving of the connecting plate 4, the lantern ring 2 and the connecting plate 4 are matched with each other to enable the burr to be connected into a circuit, current flows through the burr, the burr absorbs heat from the outside through the Peltier effect, the temperature of the burr is reduced, the temperature inside the lantern ring 2 is reduced through the connecting plate 4 before the burr is cooled, the temperature around the burr is reduced, the heat inside the burr is forced to be absorbed by the burr, the burr cooling speed is accelerated, the burr is frozen from the inside to the outside, and the burr freezing efficiency is improved.
The expansion plate 6-1 extends and contracts under the control of the extraction assembly 1-3, when the expansion plate 6-1 extends, the first N-type semiconductor 6-2 is abutted to the burr, the contraction pipe 6-4 is communicated with the extraction assembly 1-3, when air inside the contraction pipe 6-4 is extracted by the extraction assembly, the expansion plate bends under the influence of the contraction pipe, one end with the first N-type semiconductor is tilted, after the burr is crushed, the expansion plate extends again under the control of the extraction assembly, a plurality of groups of first N-type semiconductors are abutted together to scoop up the residue of the burr, and then the expansion plate tilts up under the influence of the contraction pipe, so that the residue on the residue slide way expansion plate is cleaned from a die casting piece through the repeated movement of the expansion plate.
First piezoceramics is towards the burr, first piezoceramics lets in the alternating current, first piezoceramics produces the ultrasonic wave towards the burr, the first piezoceramics of a plurality of groups is around the burr, make the burr receive ultrasonic wave from a plurality of directions and assault, accelerate the crushing speed of burr, improve deburring efficiency and die casting surface's processing speed, when first piezoceramics produced the ultrasonic wave, on energy transfer to first N type semiconductor with the vibration, make first N type semiconductor transmit the vibration energy, make the burr vibrations under the influence that receives the vibration energy of first N type semiconductor transmission.
The connecting plate 4 is an annular mechanism, a second P-type semiconductor 4-4 and a second N-type semiconductor 4-5 are respectively arranged at the upper end and the lower end of the connecting plate 4, a plurality of groups of fins 4-3 are arranged on the outer side of the connecting plate 4, a drying cotton 4-6 is arranged between each group of fins 4-3, a top plate 4-1 is arranged at the lower end of each group of fins 4-3, and the second P-type semiconductor 4-4 and the second N-type semiconductor 4-5 are electrically connected with a control circuit.
Moisture in the air is condensed into water on the outer surface of the fin 4-3, the water falling from the fin 4-3 is absorbed by the drying cotton 4-6, the inside of the lantern ring 2 is kept dry, water is prevented from falling on burrs, the second P-type semiconductor 4-4 and the second N-type semiconductor 4-5 are electrically connected with the control circuit, current flows to the second P-type semiconductor 4-4 from the second N-type semiconductor 4-5 through the connecting plate, the connecting plate 4 cools the space inside the lantern ring 2 through the fin 4-3, the temperature around the burrs is reduced, and the burrs are forced to absorb heat of the burrs.
A truncated cone-shaped groove is formed in one end, away from the fin 4-3, of the top plate 4-1, the first P-type semiconductor 4-2 is located in the middle of the groove, second piezoelectric ceramics (not shown in the figure) are arranged on the side end face of the groove, and the first P-type semiconductor 4-2 and the second piezoelectric ceramics are electrically connected with the control circuit.
The second piezoelectric ceramics generates ultrasonic waves after alternating current is introduced, the frozen burrs vibrate through the ultrasonic waves, so that the burrs are cracked and crushed, the circular truncated cone-shaped grooves enable the second piezoelectric ceramics to face the burrs at an inclined angle, the propagation angle of the ultrasonic waves is increased, and the ultrasonic waves are fully utilized.
One end of a plurality of groups of fins 4-3 is fixed with the bearing plate 1-1. The telescopic piece drives the connecting plate to move through the bearing plate and the fins, so that the connecting plate reciprocates in the lantern ring, and the distance between the first P-type semiconductor and the burrs is adjusted through the arrangement of the telescopic piece 1-2, so that the first P-type semiconductor is adaptive to the burrs with different lengths, and the first P-type semiconductor 4-2 is abutted to the burrs.
The deburring device further comprises an image acquisition system (not shown in the figure) and an image processing system (not shown in the figure), wherein the image acquisition system is used for acquiring images of the die casting, and the image processing system is used for acquiring the position of burrs on the die casting and the burr length through image processing. The sleeve ring is sleeved on the outer side of the burr through position data, and the position of the connecting plate in the sleeve ring is controlled through burr length data.
The working principle of the invention is as follows:
the die casting 5 is placed on a workbench, an image acquisition system and an image processing system firstly carry out image data processing on the die casting 5, and position information and length data of burrs on the die casting 5 are obtained.
The base 1 is driven by mobile equipment (such as a manipulator, a module and the like) and moves above the burrs, the lantern ring 2 is sleeved outside the burrs, then the extraction assembly 1-3 extracts air in the sealing cavity to enable the sealing film 3 to be attached to the surface of the die casting 5, the extraction assembly 1-3 continues to extract air to enable air holes in rubber in the air flow holes to be opened, and the extraction assembly 1-3 extracts air in the negative pressure cavity to enable the sealing film 3 to be attached to the surface of the die casting 5.
The telescopic piece 1-2 pushes the connecting plate 4 through the bearing plate 1-1, so that the first P-type semiconductor 4-2 is abutted to the top of the burr, and meanwhile, current flows to the second P-type semiconductor from the second N-type semiconductor through the connecting plate under the control of the control circuit, so that the connecting plate 4 cools the space inside the lantern ring 2 through the fins 4-3.
The plurality of groups of expansion plates 6-1 simultaneously extend and support the first N-type semiconductor 6-2 at the outer side of the root of the burr, the first N-type semiconductor 6-2 surrounds the burr, the first P-type semiconductor 4-2 supports at the top of the burr under the driving of the connecting plate 4, current flows into the first P-type semiconductor 4-2 from the first N-type semiconductor 6-2 through the burr, the burr absorbs heat from the outside through the Peltier effect, the temperature of the burr is reduced, and before the temperature of the burr is reduced, the temperature of the burr surrounding is reduced due to the fact that the connecting plate 4 cools the inner part of the lantern ring 2, the burr is forced to absorb the heat of the inner part of the burr, and the burr is frozen from the inside to the outside.
After the burrs are frozen, alternating current is introduced into the first piezoelectric ceramics 6-3, ultrasonic waves are generated towards the burrs by the first piezoelectric ceramics 6-3, a plurality of groups of the first piezoelectric ceramics 6-3 surround the burrs, so that the burrs are impacted by the ultrasonic waves from multiple directions, the crushing speed of the burrs is accelerated, the first piezoelectric ceramics 6-3 generate the ultrasonic waves and simultaneously transmit vibration energy to the first N-type semiconductor 6-2, the first N-type semiconductor 6-2 transmits the vibration energy, and the burrs vibrate under the influence of the vibration energy transmitted by the first N-type semiconductor 6-2.
The second piezoelectric ceramics generate ultrasonic waves after alternating current is introduced, the frozen burrs are vibrated through the ultrasonic waves, the burrs are cracked and crushed under the action of the ultrasonic waves generated by the first piezoelectric ceramics 6-2 and the second piezoelectric ceramics, and crushed residues fall on the first N-type semiconductor 6-2, so that the surface of the die casting 5 is treated.
After the burrs are crushed, the expansion plate 6-1 is expanded again under the control of the extraction assembly 1-3, a plurality of groups of first N-type semiconductors 6-2 are abutted together to scoop up the residues of the burrs, then when air in the contraction tube 6-4 is extracted by the extraction assembly 1-3, the expansion plate 6-1 is bent under the influence of the contraction tube 6-4, one end with the first N-type semiconductors 6-2 is tilted, the expansion plate is tilted up under the influence of the contraction tube, the residues are cleaned from the die castings 5 on the residue slide expansion plate through repeated bending of the expansion plate 6-1, and then the residues are cleaned, and the residues are cleaned.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The utility model provides a burring device with die casting edge measurement function of polishing which characterized in that: the deburring device comprises a base (1), a sleeve ring (2) and a connecting plate (4), wherein the sleeve ring (2) is arranged on the base (1), the connecting plate (4) is arranged in the middle of the base (1), the connecting plate (4) is positioned inside the sleeve ring (2), the sleeve ring (2) abuts against a die casting, one end of the connecting plate (4) abuts against the top end of a burr, and the sleeve ring (2) and the connecting plate (4) are both electrically connected with a control circuit;
a first N-type semiconductor (6-2) is arranged on the inner side of one end, far away from the base (1), of the lantern ring (2);
and a first P-type semiconductor (4-2) is arranged in the middle of one end, far away from the base (1), of the connecting plate (4).
2. The deburring device with die casting grinding edge measuring function according to claim 1, characterized in that: the two ends of the connecting plate (4) are respectively provided with a second P-type semiconductor (4-4) and a second N-type semiconductor (4-5), the outer side of the connecting plate (4) is provided with a plurality of groups of fins (4-3), drying cotton (4-6) are arranged between the fins (4-3) of each group, one ends of the fins (4-3) of the groups are provided with a top plate (4-1), and the second P-type semiconductor (4-4) and the second N-type semiconductor (4-5) are electrically connected with a control circuit.
3. The deburring device with die casting grinding edge measuring function according to claim 2, characterized in that: the fin structure is characterized in that a groove in a circular truncated cone shape is formed in one end, away from the fin (4-3), of the top plate (4-1), the first P-type semiconductor (4-2) is located in the middle of the groove, second piezoelectric ceramics are arranged on the side end face of the groove, and the first P-type semiconductor (4-2) and the second piezoelectric ceramics are electrically connected with the control circuit.
4. The deburring device with die casting grinding edge measuring function according to claim 3, characterized in that: one end, far away from the base (1), of the lantern ring (2) is provided with a bottom ring (6), the inner side of the bottom ring (6) is provided with a plurality of groups of expansion plates (6-1), each group of expansion plates (6-1) is provided with a first N-type semiconductor (6-2), each group of first N-type semiconductor (6-2) is obliquely provided with a first piezoelectric ceramic (6-3), and the first N-type semiconductor (6-2) and the first piezoelectric ceramic (6-3) are electrically connected with a control circuit.
5. The deburring device with die casting grinding edge measuring function according to claim 4, characterized in that: the novel fan fin is characterized in that an extensible part (1-2) is arranged inside the base (1), a bearing plate (1-1) is arranged on the extensible part (1-2), an extraction assembly (1-3) is arranged inside the base (1), and one end of each of the plurality of groups of fins (4-3) is fixed with the bearing plate (1-1).
6. The deburring device with die casting grinding edge measuring function according to claim 5, characterized in that: be provided with seal membrane (3) in the outside of the lantern ring (2) on base (1), be provided with air current ring (3-1) on seal membrane (3), air current ring (3-1) is connected with the outside of end ring (6), is provided with the air current hole on air current ring (3-1), every group all be provided with rubber in the air current hole, the gas pocket has all been seted up at the rubber middle part, form the seal chamber between seal membrane (3) and the lantern ring (2), seal chamber and extraction subassembly (1-3) pipe connection.
7. The deburring device with die casting grinding edge measuring function according to claim 6, characterized in that: each group of expansion plates (6-1) is of a corrugated pipe structure, the inner part of the upper end of each group of expansion plates (6-1) is provided with a contraction pipe (6-4), and the expansion plates (6-1) and the contraction pipes (6-4) are connected with the extraction assembly (1-3) through pipelines.
8. The deburring device with die casting grinding edge measuring function according to claim 7, characterized in that: the deburring device further comprises an image acquisition system and an image processing system, wherein the image acquisition system is used for acquiring images of the die castings, and the image processing system is used for acquiring the positions of burrs on the die castings and the lengths of the burrs through image processing.
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| CN202110941558.XA CN113385279B (en) | 2021-08-17 | 2021-08-17 | Deburring device with die casting edge measurement function of polishing |
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| CN112975639A (en) * | 2021-05-19 | 2021-06-18 | 江苏中科云控智能工业装备有限公司 | Die casting polishing and deburring mechanism and method |
| CN213945890U (en) * | 2020-12-28 | 2021-08-13 | 惠州市杰鑫实业有限公司 | Automatic deburring machine |
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| JP2005329437A (en) * | 2004-05-20 | 2005-12-02 | Ahresty Corp | Method and apparatus for deburring cast product |
| CN109227279A (en) * | 2018-10-18 | 2019-01-18 | 浙江义浩竹木制品有限公司 | A kind of bamboo and wood processing bamboo side depilation thorn device |
| CN209110739U (en) * | 2018-11-05 | 2019-07-16 | 佛山市南海镕信金属制品有限公司 | A kind of aluminum alloy die casting burr removal device |
| CN112276742A (en) * | 2020-10-29 | 2021-01-29 | 义乌郝天贸易有限公司 | Building materials burr abrasive band of polishing is with preventing device that skids |
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| CN113385279B (en) | 2021-11-09 |
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