CN113382592A - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN113382592A CN113382592A CN202110681007.4A CN202110681007A CN113382592A CN 113382592 A CN113382592 A CN 113382592A CN 202110681007 A CN202110681007 A CN 202110681007A CN 113382592 A CN113382592 A CN 113382592A
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- Prior art keywords
- circuit board
- sealing
- sealing layer
- support
- bracket
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1422—Printed circuit boards receptacles, e.g. stacked structures, electronic circuit modules or box like frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/46—Bases; Cases
- H01R13/52—Dustproof, splashproof, drip-proof, waterproof, or flameproof cases
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/02—Details
- H05K5/0217—Mechanical details of casings
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K5/00—Casings, cabinets or drawers for electric apparatus
- H05K5/06—Hermetically-sealed casings
Abstract
The application discloses electronic equipment, which belongs to the field of communication equipment and comprises a circuit board, a sealing element, a support, a middle frame assembly and a supporting assembly, wherein the circuit board is provided with an installation notch formed by inwards extending from the edge of the circuit board, and the support and the supporting assembly are fixedly connected with the circuit board; the seal includes a first sealing layer on a first side of the circuit board and a second sealing layer on a second side of the circuit board; in a thickness direction of the circuit board: the first sealing layer is clamped between the circuit board and the bracket, and the second sealing layer is clamped between the circuit board and the support component; along the extending direction of the installation gap, the sealing element is clamped between the support and the middle frame assembly. The electronic equipment can provide an isolation effect through the wired interface, can reduce the overall thickness of the electronic equipment, and is favorable for the development of the electronic equipment towards light and thin.
Description
Technical Field
The application belongs to the technical field of communication equipment, and particularly relates to electronic equipment.
Background
In view of the superiority of wired connection, the present electronic devices still have some wired interfaces while further developing wireless connection technology. Taking electronic devices such as mobile phones as an example, the mobile phones are provided with charging interfaces, and some mobile phones still have earphone interfaces and the like. At present, the silica gel sleeve is sleeved outside the electronic device at the interface, and the silica gel sleeve is hermetically connected with other parts inside the electronic equipment, so that the inner cavity of the wired interface and the inner space of the electronic equipment can be separated from each other, and therefore external water vapor is prevented from entering the inner space of the electronic equipment through the inner cavity of the wired interface, and adverse effects are generated on the safety and the service life of the electronic equipment. However, in the above scheme, since the periphery of the interface device is covered with a part of the silica gel sleeve, especially, the two opposite sides of the interface device along the thickness direction of the circuit board are covered with the silica gel sleeve, a large adverse effect is generated on the overall thickness of the electronic device, and the development of the electronic device towards lightness and thinness is not facilitated.
Disclosure of Invention
An object of the embodiments of the present application is to provide an electronic device, so as to solve the problem that the overall thickness of the electronic device is large and the development of the electronic device towards lightness and thinness is not facilitated due to the fact that the existing electronic device is an isolated wired interface.
In order to solve the technical problem, the present application is implemented as follows:
the embodiment of the application discloses electronic equipment, it includes: circuit board, sealing member, support, center subassembly and supporting component, wherein,
the circuit board is provided with an installation notch formed by inwards extending from the edge of the circuit board, and the bracket and the supporting component are fixedly connected with the circuit board;
the seal includes a first sealing layer on a first side of the circuit board and a second sealing layer on a second side of the circuit board;
in a thickness direction of the circuit board: the first sealing layer is clamped between the circuit board and the bracket, and the second sealing layer is clamped between the circuit board and the support component;
along the extending direction of the installation gap, the sealing element is clamped between the support and the middle frame assembly.
The embodiment of the application discloses an electronic device, which comprises a circuit board, a sealing element, a support, a middle frame assembly and a supporting assembly, wherein the circuit board is provided with an installation notch extending inwards from the edge of the circuit board, the installation notch can accommodate an interface device, the sealing element comprises a first sealing layer and a second sealing layer, under the condition that the support and the supporting assembly are fixedly connected with the circuit board, the first sealing layer can be clamped between the circuit board and the support, the second sealing layer can be clamped between the circuit board and the supporting assembly, and the sealing element can be clamped between the support and the middle frame assembly along the extending direction of the installation notch, so that the support, the first sealing layer, the circuit board, the second sealing layer, the supporting assembly and the middle frame assembly can form an isolation cavity, the isolation cavity is provided with a cavity opening, the cavity opening corresponds to the opening of the installation notch, and besides the cavity opening, the inner wall in isolated chamber is complete inner wall, and then can prevent that steam and dust that get into from the accent in isolated chamber can flow to the opposite side in isolated chamber through the inner wall in isolated chamber, guarantee that the region that is equipped with interface device among the electronic equipment separates with electronic equipment's inside, even if guarantee that electronic equipment is equipped with wired interface, also have higher waterproof performance.
Meanwhile, as described above, the first sealing layer and the second sealing layer in the sealing member are respectively disposed on two opposite sides of the circuit board, one end of the interface device extends out from the through hole of the first sealing layer, and the other end of the interface device extends out from the through hole of the second sealing layer, so that the sealing member is not stacked on the interface device accommodated in the mounting notch, and thus the size of the interface device in the thickness direction of the circuit board is not further increased, and further, under the condition of adopting the above sealing mode, the whole thickness of the electronic device is not further increased, which is beneficial to the development of the electronic device towards lightness and thinness.
Drawings
The accompanying drawings, which are included to provide a further understanding of the application and are incorporated in and constitute a part of this application, illustrate embodiment(s) of the application and together with the description serve to explain the application and not to limit the application. In the drawings:
fig. 1 is an exploded schematic view of an electronic device disclosed in an embodiment of the present application;
fig. 2 is a schematic diagram of a partial structure of an electronic device disclosed in an embodiment of the present application;
FIG. 3 is a cross-sectional view of the structure shown in FIG. 2 taken along the direction B-B;
FIG. 4 is a cross-sectional view of the structure shown in FIG. 2 taken along the direction C-C;
FIG. 5 is a diagram illustrating a portion of an electronic device including a stand according to an embodiment of the disclosure;
fig. 6 is an assembly view of a limiting protrusion and a bracket in an electronic device disclosed in an embodiment of the present application;
fig. 7 is a schematic structural diagram of a sealing member in an electronic device disclosed in an embodiment of the present application;
fig. 8 is a schematic cross-sectional view of a sealing member in an electronic device according to an embodiment of the disclosure.
Description of reference numerals:
100-circuit board, 110-installation gap,
200-sealing element, 210-first sealing layer, 220-second sealing layer, 230-sealing part, 231-connecting section, 232-limiting section, 232 a-first plane, 232 b-second plane, 232 c-arc transition plane, 240-arc chamfering part,
300-support, 310-support body, 320-counter sink part, 321-arc matching part,
400-middle frame component, 410-side part, 420-main body part, 430-sealing foam,
500-support component, 510-support plate, 520-main upper, 530-limit projection,
710-interface device, 720-back shell, 730-display screen, 740-camera.
Detailed Description
The technical solutions in the embodiments of the present application will be described clearly and completely with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some, but not all, embodiments of the present application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The terms first, second and the like in the description and in the claims of the present application are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It will be appreciated that the data so used may be interchanged under appropriate circumstances such that embodiments of the application may be practiced in sequences other than those illustrated or described herein, and that the terms "first," "second," and the like are generally used herein in a generic sense and do not limit the number of terms, e.g., the first term can be one or more than one. In addition, "and/or" in the specification and claims means at least one of connected objects, a character "/" generally means that a preceding and succeeding related objects are in an "or" relationship.
The folding mechanism and the electronic device provided in the embodiments of the present application are described in detail below with reference to the accompanying drawings through specific embodiments and application scenarios thereof.
As shown in fig. 1 to 8, the embodiment of the present application discloses an electronic device, which includes a circuit board 100, a bracket 300, a middle frame assembly 400, a support assembly 500, and a sealing member 200, and of course, the electronic device further includes structural members such as a rear case 720 and a display screen 730, and may also be provided with a camera 740, and for brevity, the details will not be described here.
The circuit board 100 is a device for laying out a circuit structure in an electronic device, and the circuit board 100 may be connected to the electronic device in the electronic device, such as the display 730 and the camera 740 that are both electrically connected to the circuit board 100 by soldering. In order to reduce the thickness of the whole electronic device, the circuit board 100 is provided with a mounting notch 110 formed by extending inward from an edge of the circuit board 100, and during the assembling process of the electronic device, the mounting notch 110 can accommodate the interface device 710, so that the maximum thickness of the combined structure of the interface device 710 and the circuit board 100 is relatively small, and the electronic device can be thinned. The interface device 710 is specifically a device having interfaces such as jacks, and the interface device 710 may be provided with solder tails to connect the interface device 710 to the circuit board 100 by soldering, so as to fix the interface device 710 on the one hand, and ensure that the interface device 710 and the circuit board 100 form an electrical connection on the other hand, thereby enabling the electronic device to be in wired connection with devices such as peripheral products or data lines through the interface device 710, so as to perform work such as information interaction or charging and discharging.
The sealing member 200 may be made of a flexible material with a certain water-proof capability, such as rubber, and the sealing member 200 includes a first sealing layer 210 and a second sealing layer 220. The first sealant 210 is located on a first side of the circuit board 100, the second sealant 220 is located on a second side of the circuit board 100, and the first sealant 210 and the second sealant 220 can provide a filling and sealing function for a gap between a component on the two opposite sides of the circuit board 100 and the circuit board 100.
As described above, the circuit board 100 is provided with the mounting notch 110, and the projections of the first sealant 210 and the second sealant 220 in the thickness direction of the circuit board 100 cover the inner wall of the mounting notch 110. That is, the first sealant 210 and the second sealant 220 cover opposite sides of the inner wall of the installation gap 110, respectively. In addition, the first sealant 210 and the second sealant 220 are provided with through holes, the through holes of the first sealant 210 penetrate through the first sealant 210 along the thickness direction of the circuit board 100, and correspondingly, the through holes of the second sealant 220 penetrate through the second sealant 220 along the thickness direction of the circuit board 100, so that one end of the interface device 710 mounted in the mounting notch 110 extends out of the through holes of the first sealant 210, and the other end of the interface device 710 extends out of the through holes of the second sealant 220, thereby reducing the overall thickness of the combined structure of the interface device 710, the circuit board 100 and the sealant 200.
Specifically, the shape of both first sealant 210 and second sealant 220 may be the same as or similar to the shape of the inner wall of mounting notch 110. For example, if the installation notch 110 is an arc-shaped U-shaped structure, the first sealant 210 and the second sealant 220 may also be arc-shaped U-shaped structures, and the installation notch 110 is a folded-line-shaped U-shaped structure, and the first sealant 210 and the second sealant 220 may also be folded-line-shaped U-shaped structures, so as to ensure that both the first sealant 210 and the second sealant 220 can provide reliable sealing effect for the connection between the installation notch 110 and the two opposite side parts 410.
More specifically, each of the first sealant 210 and the second sealant 220 may be a sheet-like structure, the specific shape of each of the first sealant 210 and the second sealant 220 may correspond to the specific shape of the installation notch 110, and the thickness of each of the first sealant 210 and the second sealant 220 may be selected according to actual requirements, which is not limited herein. Optionally, the structures of the first sealing layer 210 and the second sealing layer 220 may be different, and in another embodiment of the present application, the structures of the first sealing layer 210 and the second sealing layer 220 are the same, so that on one hand, the processing difficulty of the sealing member 200 is further reduced, and on the other hand, the structures of the components in the sealing member 200 corresponding to the first sealing layer 210 and the second sealing layer 220, respectively, may be substantially the same, thereby improving the overall sealing performance of the sealing member 200 to a certain extent.
The support assembly 500 may specifically be a front housing in an electronic device, and the display screen 730 may specifically be mounted on a side of the support assembly 500 facing away from the circuit board 100. Both the bracket 300 and the support assembly 500 are fixedly connected to the circuit board 100, thereby providing a necessary condition for the electronic device to form a stable insulating cavity at the region where the mounting notch 110 is located. Specifically, the support 300 and the circuit board 100, and the support assembly 500 and the circuit board 100 may be fixedly connected by a connector such as a screw, or the support 300 and the circuit board 100 may be fixed to each other and the support 300 and the support assembly 500 may be fixed to each other by bonding or the like. In addition, for the specific shapes of the bracket 300, the support assembly 500 and the circuit board 100, it is only necessary to ensure that the areas of the bracket 300 and the support assembly 500 opposite to the installation notch 110 in the circuit board 100 have non-porous surfaces, so as to ensure that the formed cavity has complete cavity walls, and thus prevent moisture, dust and the like from entering from the opening of the installation notch 110 into the interior of the electronic device through the cavity walls. The area of the bracket 300 and the supporting member 500 opposite to the installation gap 110 may have a complete seamless and non-porous surface, or the area of the bracket 300 and the supporting member 500 opposite to the installation gap 110 may be formed into a complete surface by coating an adhesive layer or covering an insulating layer.
In the case where the bracket 300 and the support assembly 500 are fixed to each other with the circuit board 100, the first sealant 210 can be sandwiched between the circuit board 100 and the bracket 300 and the second sealant 220 can be sandwiched between the circuit board 100 and the support assembly 500 in the thickness direction of the circuit board 100, so that the bracket 300, the first sealant 210, the circuit board 100, the second sealant 220, and the support assembly 500 can form an isolation chamber having a mouth corresponding to the position of the opening of the mounting notch 110 at the edge of the circuit board 100.
However, a gap may still exist between the opening of the isolation chamber formed by the above components and the middle frame assembly 400, and based on this situation, the sealing element 200 is clamped between the bracket 300 and the middle frame assembly 400 along the extending direction of the installation notch 110, so that the sealing element 200 and the middle frame assembly 400 form a press fit relationship, and the gap which may exist between the middle frame assembly 400 and the opening of the formed isolation chamber is blocked, so that the formed isolation chamber has a complete inner wall except for the opening corresponding to the opening of the installation notch 110, and it is ensured that water vapor or dust and the like entering the isolation chamber from the opening of the installation notch 110 can only be discharged from the opening of the isolation chamber, and cannot pass through the chamber wall of the isolation chamber to enter the other side of the isolation chamber. It should be noted that the thickness direction of the circuit board 100 is specifically the direction M in fig. 4, and the extending direction of the mounting notch 110 is specifically the direction N in fig. 4.
Specifically, by designing the specific structure of the bracket 300, for example, the cross section of the bracket 300 may be a bent structure, which may include a cross beam and a longitudinal beam connected to each other, the cross beam may cooperate with the first sealant 210, and the longitudinal beam may cooperate with the entire sealing member 200, so as to ensure that the bracket 300 can provide a limiting effect for the first sealant 210 in the thickness direction of the circuit board 100 and the sealing member 200 in the extending direction of the installation gap 110. Moreover, by extending the sealing element 200 relative to the cross beam in a direction close to the center frame assembly 400, the extended portion of the sealing element 200 can be matched with the center frame assembly 400, and the extended portion of the sealing element 200 relative to the support 300 is pressed under the limiting action of the support 300, so as to form a stable and reliable sealing connection relationship with the center frame assembly 400.
It should be noted that, because the support 300 and the middle frame assembly 400 can provide the limiting function for the sealing element 200 along the axial direction, and the support 300, the circuit board 100 and the support assembly 500 can provide the pressing function for the sealing element 200 along the thickness direction of the circuit board 100, even if the support assembly 500 and the middle frame do not provide the limiting function for the sealing element 200 along the extending direction of the installation notch 110, the sealing element 200 and the middle frame can be basically ensured to form a relatively reliable sealing connection relationship, and the formed isolation cavity is ensured to have a complete cavity wall.
The embodiment of the application discloses an electronic device, which comprises a circuit board 100, a sealing member 200, a support 300, a middle frame assembly 400 and a support assembly 500, wherein the circuit board 100 is provided with a mounting notch 110 extending inwards from the edge of the circuit board 100, the mounting notch 110 can accommodate an interface device 710, the sealing member 200 comprises a first sealing layer 210 and a second sealing layer 220, the first sealing layer 210 can be clamped between the circuit board 100 and the support 300 under the condition that the support 300 and the support assembly 500 are fixedly connected with the circuit board 100, the second sealing layer 220 can be clamped between the circuit board 100 and the support assembly 500, and the sealing member 200 can be clamped between the support 300 and the middle frame assembly 400 along the extending direction of the mounting notch 110, so that the support 300, the first sealing layer 210, the circuit board 100, the second sealing layer 220, the support assembly 500 and the middle frame assembly 400 can form an isolation cavity, this isolated chamber has the accent, and the accent corresponds with the opening of installation breach 110, and except aforementioned accent, the inner wall in isolated chamber is complete inner wall, and then can prevent steam and the dust that gets into from the accent in isolated chamber can flow to the opposite side in isolated chamber through the inner wall in isolated chamber, guarantee to be equipped with interface device 710 in the electronic equipment regional separate with electronic equipment's inside, even if guarantee electronic equipment is equipped with wired interface, also have higher waterproof performance.
Meanwhile, as described above, the first sealing layer 210 and the second sealing layer 220 in the sealing member 200 are respectively disposed on opposite sides of the circuit board 100, and one end of the interface device 710 extends out from the through hole of the first sealing layer 210 and the other end of the interface device 710 extends out from the through hole of the second sealing layer 220, so that the sealing member 200 is not stacked on the interface device 710 accommodated in the installation notch 110, and thus the size of the interface device 710 in the thickness direction of the circuit board 100 is not further increased, and further, when the sealing manner is adopted, the overall thickness of the electronic device is not further increased, which is beneficial to the development of thinning of the electronic device.
As described above, the first sealant 210 is sandwiched between the bracket 300 and the circuit board 100, and optionally, at least one side surface of the first sealant 210 is provided with a strip-shaped sealing protrusion, and the extending direction of the strip-shaped sealing protrusion is the same as the extending direction of the whole first sealant 210, for example, the strip-shaped sealing protrusion and the first sealant 210 may be arc-shaped U-shaped structures. More specifically, the opposite sides of the first sealing layer 210 may be provided with strip-shaped sealing protrusions, and the number of the strip-shaped sealing protrusions of each side may be one or more. During the process of assembling the first sealant layer 210, the bracket 300 and the circuit board 100 are fixed to each other, so that the bracket 300 and the circuit board 100 can apply a pressing action to the first sealant layer 210, thereby generating a certain elastic deformation of the strip-shaped sealing protrusion, and further enhancing the sealing fit tightness between the first sealant layer 210 and the bracket 300, and between the first sealant layer 210 and the circuit board 100. Correspondingly, at least one side surface of the second sealing layer 220 opposite to the two sides may also be provided with a strip-shaped sealing protrusion, so as to enhance the tightness of the sealing fit relationship between the circuit board 100 and the supporting assembly 500.
Optionally, the sealing member 200 further includes a sealing portion 230, the sealing portion 230 includes a connecting section 231, and the first ends of the first sealing layer 210 and the second sealing layer 220 are connected by the connecting section 231 of the sealing portion 230, so that the first sealing layer 210 and the second sealing layer 220 can be connected into a whole, and the installation and transportation of the sealing member 200 are facilitated. Specifically, the connection section 231 may be a block-shaped structure, and in order to improve the processing efficiency of the sealing element 200, the first sealing layer 210, the second sealing layer 220, and the sealing portion 230 may be formed in an integral injection molding manner, which may also improve the connection reliability between the parts, and thus may improve the sealing performance of the entire sealing element 200.
Further, the sealing portion 230 may further include a limiting section 232, the limiting section 232 is connected to the connecting section 231, and the limiting section 232 protrudes toward a side of the first sealing layer 210 away from the second sealing layer 220, that is, the limiting section 232 protrudes relative to the first sealing layer 210, in this case, the limiting section 232 may be clamped between the bracket 300 and the middle frame assembly 400, so that the whole sealing member 200 may be clamped by the bracket 300 and the middle frame assembly 400 along the extending direction of the installation notch 110. Specifically, the position-limiting section 232 may be a block-shaped structural member, and in a case that no structure other than the position-limiting section 232 is disposed between the bracket 300 and the middle frame assembly 400, by making the size of the position-limiting section 232 in the extending direction of the mounting notch 110 slightly larger than the distance between the bracket 300 and the middle frame assembly 400, after the bracket 300 and the circuit board 100 are fixed to each other, the position-limiting section 232 is pressed between the bracket 300 and the middle frame assembly 400, and the sealing member 200 and the middle frame assembly 400 form a better sealing connection relationship.
Compared with the technical scheme that the whole sealing element 200 is arranged between the bracket 300 and the middle frame assembly 400 in a pressing mode, when the technical scheme is adopted, the size of the part clamped by the bracket 300 and the middle frame assembly 400 in the sealing element 200 is relatively small, so that the reliability of the clamping action provided by the bracket 300 and the middle frame assembly 400 can be improved; moreover, in the case of adopting the above technical solution, the situation that the first sealant 210 and/or the second sealant 220 is warped due to the squeezing action of the extending direction of the mounting notch 110 can be reduced as much as possible, and the sealing effect between the bracket 300 and the circuit board 100 and/or between the support assembly 500 and the circuit board 100 can be further improved.
In order to prevent the connection part of the limiting section 232 and the first sealing layer 210 from forming a sealing dead angle in the process of being matched with the bracket 300, further, an arc-shaped chamfer part 240 is arranged at the connection part of the limiting section 232 and the first sealing layer 210 and faces towards the connection corner part of the bracket 300, correspondingly, an arc-shaped matching part 321 is arranged at the end part of the bracket 300, and the arc-shaped matching part 321 is in extrusion fit with the arc-shaped chamfer part 240. Specifically, the dimensions of the arc-shaped fitting portion 321 and the arc-shaped chamfered portion 240 may be determined according to practical situations, and are not limited herein.
Under the condition of adopting the technical scheme, when the support 300 and the circuit board 100 are mutually fixed, so that the support 300 and the circuit board 100 extrude the first sealing layer 210, and the support 300 and the middle frame assembly 400 extrude the limiting section 232, a sealing dead angle cannot be formed between the joint of the limiting section 232 and the first sealing layer 210 and the support 300 basically, the attaching reliability between the support 300 and the sealing element 200 can be improved, and the better sealing condition of the cavity wall of the isolation cavity formed by the components is further ensured.
In order to further improve the sealing reliability between the sealing member 200 and the middle frame assembly 400, the second ends of the first sealing layer 210 and the second sealing layer 220 may be optionally connected by a connecting section 231 of the sealing portion 230, and the two sealing portions 230 may have the same structure. In this case, both ends of the first sealing layer 210 can be in sealing fit with the middle frame assembly 400 through the limiting section 232 of the sealing part 230, so that the sealing reliability between the sealing member 200 and the middle frame assembly 400 can be improved, and the higher sealing performance of the wall of the formed isolation cavity is further ensured.
Alternatively, the support assembly 500 includes a support plate 510 and a main upper 520 connected to each other, the main upper 520 is interposed between the middle frame assembly 400 and the support plate 510, the sealing member 200 is interposed between the bracket 300 and the main upper 520, and the sealing member 200 is further interposed between the support plate 510 and the main upper 520 in the extending direction of the mounting notch 110. In the present embodiment, the opposite sides of the sealing member 200 can be clamped along the extending direction of the installation notch 110, so that the sealing reliability between the sealing member 200 and the middle frame assembly 400, or more specifically between the sealing member 200 and the main upper frame 520, can be further improved.
Specifically, the shape and size of each of the support plate 510 and the main upper 520 may be determined according to actual requirements, the support plate 510 and the main upper 520 may be fixed to each other by means of a connecting member or bonding, and a structure such as a limiting groove may be provided on the supporting plate 510, so as to ensure that the supporting plate 510 can provide a limiting function for the sealing member 200 along the extending direction of the installation notch 110, correspondingly, the main upper part 520 may also include a lateral extension and a longitudinal extension connected to each other, thereby ensuring that the main upper 520 can provide the sealing member 200 with a position-limiting effect in the thickness direction of the circuit board 100 through the lateral extension portion, and also provide the sealing member 200 with a position-limiting effect in the extension direction of the mounting recess 110 through the longitudinal extension portion, the lateral extension portion of the main upper 520 can be connected with the supporting plate 510, and provides support for a display screen 730 or the like in the electronic device, the longitudinal extension of the main upper part 520 may be sandwiched between the sealing member 200 and the bezel assembly 400.
Further, the middle frame assembly 400 may include a side portion 410 and a main body portion 420, the side portion 410 being connected to an outer circumference of the main body portion 420, the side portion 410 having a side surface of the electronic device, the main body portion 420 being disposed inside the electronic device, and correspondingly, the main upper 520 being sandwiched between the side portion 410 and the support plate 510 along an extending direction of the mounting notch 110; correspondingly, the bracket 300 is sandwiched between the body part 420 and the circuit board 100 in the thickness direction of the circuit board 100. Specifically, the actual structures and dimensions of the side portion 410 and the main body portion 420 may be set according to specific situations, and are not limited herein, the main body portion 420 and the side portion 410 may be made of hard materials such as plastics or metals, and may be fixed integrally by welding, heat fusion or adhesion, and the main body portion 420 and the bracket 300 may be fixed to each other by adhesion or connection by a connector.
Considering that a hole or a groove may be formed on the bracket 300 and the main body 420 to provide a mounting base function or a space avoidance function for other electronic devices in the electronic apparatus, in order to reduce the difficulty of forming a complete surface in the region of the bracket 300 opposite to the mounting notch 110, optionally, a sealing foam 430 is disposed between the bracket 300 and the main body 420 in an extrusion manner, and a projection of the sealing foam 430 in the thickness direction of the circuit board 100 covers the mounting notch 110, in this case, no matter how the specific structures of the bracket 300 and the main body 420 are, the region of the circuit board 100 corresponding to the mounting notch 110 can be ensured to have a complete surface by the sealing foam 430, so that the integrity of the cavity wall of the formed isolation cavity is better. In addition, in the case that the sealing foam 430 is provided, the bracket 300 and the sealing foam 430, and the sealing foam 430 and the main body 420 may be fixed to each other by gluing, which may further improve the surface integrity and sealing performance of the combined structure formed by the circuit board 100, the sealing foam 430 and the main body 420.
In order to improve the reliability of the fit between the bracket 300, the sealing element 200 and the main upper ring 520 and the sealing foam 430, optionally, a first surface of the limiting section 232 facing the sealing foam 430 includes a first plane 232a, a second plane 232b and an arc-shaped transition plane 232c, the first plane 232a is flush with a side surface of the bracket 300 facing the sealing foam 430, the second plane 232b is flush with a side surface of the main upper ring 520 facing the sealing foam 430, the first plane 232a and the second plane 232b are connected by the arc-shaped transition plane 232c, and the sealing foam 430 is fit and disposed on the bracket 300, the first surface and the main upper ring 520.
Under the condition of adopting the technical scheme, by means of the transitional action of the arc-shaped transition surface 232c, the surface of the support 300, the first surface of the sealing element 200 and the surface of the main upper 520 can be connected with each other to form a foam attaching surface which is gentle and almost has no dead angle, so that the sealing foam 430 made of flexible materials can form a tight attaching relation with the foam attaching surface, and the adverse effect on the isolation reliability of the formed isolation cavity due to the existence of gaps among any one of the support 300, the sealing element 200 and the main upper 520 and the sealing foam 430 is prevented.
In the case where the middle frame assembly 400 includes the side portion 410 and the main body portion 420, further, the cradle 300 may include the cradle body 310 and the sinker portion 320, and the sinker portion 320 is concavely provided to one side of the cradle body 310 with respect to the cradle body 310, that is, both the sinker portion 320 and the cradle body 310 are not in the same plane. Specifically, the counter sink part 320 and the bracket body 310 may be formed by a flat plate-shaped structural member via a sheet metal. In the thickness direction of the circuit board 100, the first sealant 210 is clamped between the circuit board 100 and the counter sink portion 320, and the counter sink portion 320 is clamped between the circuit board 100 and the main body portion 420, in this case, by reducing the force-bearing area of the portion of the bracket 300 corresponding to the first sealant 210, the pressing and holding effect of the main body portion 420 on the counter sink portion 320 is better, so that the pressing and holding effect of the counter sink portion 320 on the first sealant 210 is further improved, and the sealing effect between the counter sink portion 320 and the circuit board 100 is better ensured. Of course, a structure similar to the sinking platform part 320 may also be provided in the region of the main body part 420 corresponding to the sinking platform part 320, so as to further reduce the contact area between the main body part 420 and the sinking platform part 320, and improve the pressing effect between the main body part 420 and the sinking platform part 320.
As described above, the sealing member 200 may be compressed between the bracket 300 and the middle frame assembly 400 along the extending direction of the mounting notch 110, and the positioning relationship between the bracket 300 and the middle frame assembly 400 may be specifically formed by fixing the bracket 300, the circuit board 100 and the middle frame assembly 400 to each other. In another embodiment of the present application, a side of the support assembly 500 facing the circuit board 100 is provided with a limit projection 530, and the bracket 300 is compressively disposed between the sealing member 200 and the limit projection 530 in an extending direction of the mounting notch 110. That is, in the present embodiment, the limiting protrusion 530 is provided to further limit the movement of the bracket 300 in the direction away from the middle frame assembly 400 along the extending direction of the installation notch 110, so as to ensure that the sealing member 200 can be stably clamped between the bracket 300 and the middle frame assembly 400, and thus the sealing relationship between the sealing member 200 and the middle frame assembly 400 is stable and reliable.
Specifically, the dimension of the limiting protrusion 530 in the extending direction of the mounting notch 110 may be determined according to the dimensions of the components such as the bracket 300 and the sealing element 200 in the corresponding direction, so that when the bracket 300 is mounted to the limiting protrusion 530, a pressing action may be provided for the sealing element 200, so that the sealing element 200 is press-fitted with the middle frame assembly 400.
More specifically, the number of the position-limiting protrusions 530 may be one, and one position-limiting protrusion 530 may be disposed corresponding to the position of the sealing member 200, so that the connection line between the position-limiting action point provided by the position-limiting protrusion 530 and the force-bearing action point of the sealing member 200 is as parallel as possible to the extending direction of the installation notch 110. Optionally, the number of the limiting protrusions 530 may be multiple, and under the action of the multiple limiting protrusions 530, on one hand, the reliability of the bracket 300 for pressing the sealing element 200 may be further improved, and on the other hand, the bracket 300 may be prevented from generating a deflection rotation by using one limiting protrusion 530 as a fulcrum, so that the stability of the bracket 300 for pressing the sealing element 200 may be improved; the plurality of limiting protrusions 530 may be disposed on the supporting member 500 at intervals, and the plurality of limiting protrusions 530 may be disposed as dispersedly as possible. More specifically, the two limiting protrusions 530 may be provided, and in a direction perpendicular to the extending direction of the mounting notch 110 and the thickness direction of the circuit board 100, the two limiting protrusions 530 may be respectively disposed on two opposite sides of the sealing member 200, so as to provide a more uniform and stable limiting effect for the support 300 to press the sealing member 200.
The electronic device disclosed in the embodiment of the application can be a mobile phone, a computer, an electronic book reader, a wearable device and the like, and the embodiment of the application does not limit the specific type of the electronic device.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element. Further, it should be noted that the scope of the methods and apparatus of the embodiments of the present application is not limited to performing the functions in the order illustrated or discussed, but may include performing the functions in a substantially simultaneous manner or in a reverse order based on the functions involved, e.g., the methods described may be performed in an order different than that described, and various steps may be added, omitted, or combined. In addition, features described with reference to certain examples may be combined in other examples.
While the present embodiments have been described with reference to the accompanying drawings, it is to be understood that the invention is not limited to the precise embodiments described above, which are meant to be illustrative and not restrictive, and that various changes may be made therein by those skilled in the art without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. An electronic device, comprising: circuit board, sealing member, support, center subassembly and supporting component, wherein,
the circuit board is provided with an installation notch formed by inwards extending from the edge of the circuit board, and the bracket and the supporting component are fixedly connected with the circuit board;
the seal includes a first sealing layer on a first side of the circuit board and a second sealing layer on a second side of the circuit board;
in a thickness direction of the circuit board: the first sealing layer is clamped between the circuit board and the bracket, and the second sealing layer is clamped between the circuit board and the support component;
along the extending direction of the installation gap, the sealing element is clamped between the support and the middle frame assembly.
2. The electronic device of claim 1, wherein the seal further comprises a seal portion, and wherein one end of the first sealing layer and one end of the second sealing layer are connected by a connecting segment of the seal portion.
3. The electronic device of claim 2, wherein the sealing portion further includes a limiting section, the limiting section is connected to the connecting section, the limiting section protrudes toward a side of the first sealing layer away from the second sealing layer, and the limiting section is clamped between the bracket and the middle frame assembly along an extending direction of the mounting notch.
4. The electronic device according to claim 3, wherein a connecting corner portion between the limiting section and the first sealing layer is provided with an arc-shaped chamfer portion towards one side of the support, an arc-shaped matching portion is arranged at an end portion of the support, and the arc-shaped matching portion is in extrusion fit with the arc-shaped chamfer portion.
5. The electronic device according to claim 3, wherein the other end of the first sealing layer and the other end of the second sealing layer are connected by a connecting section of another sealing part, and the two sealing parts are identical in structure.
6. The electronic device according to claim 3, wherein the support assembly includes a support plate and a main upper portion connected to each other, the main upper portion is sandwiched between the middle frame assembly and the support plate, the first sealing layer is sandwiched between the bracket and the main upper portion, and the second sealing layer is sandwiched between the support plate and the main upper portion in an extending direction of the mounting notch.
7. The electronic device according to claim 6, wherein the middle frame assembly includes a side portion and a main body portion, the side portion is connected to an outer periphery of the main body portion, and the main upper clamp is interposed between the side portion and the support plate along an extending direction of the mounting notch; along the thickness direction of the circuit board, the support is clamped between the main body part and the circuit board, sealing foam is extruded between the support and the main body part, and the projection of the sealing foam along the thickness direction of the circuit board covers the installation notch.
8. The electronic device of claim 7, wherein the first surface of the limiting section facing the foam sealing body comprises a first plane, a second plane and an arc-shaped transition surface, the first plane is flush with a side surface of the bracket facing the foam sealing body, the second plane is flush with a side surface of the main body facing the foam sealing body, the first plane and the second plane are connected through the arc-shaped transition surface, and the foam sealing body is arranged on the bracket, the first surface and the main body in a fitting manner.
9. The electronic apparatus according to claim 7, wherein the holder includes a holder body and a counter sink portion provided recessed to one side of the holder body with respect to the holder body, the first sealing layer is sandwiched between the circuit board and the counter sink portion in a thickness direction of the circuit board, and the counter sink portion is sandwiched between the circuit board and the main body portion.
10. The electronic device of claim 1, wherein a side of the supporting component facing the circuit board is provided with a limiting protrusion, and the bracket is arranged between the sealing element and the limiting protrusion in a pressing manner in an extending direction of the mounting notch.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110681007.4A CN113382592B (en) | 2021-06-18 | 2021-06-18 | Electronic equipment |
| PCT/CN2022/098328 WO2022262666A1 (en) | 2021-06-18 | 2022-06-13 | Electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110681007.4A CN113382592B (en) | 2021-06-18 | 2021-06-18 | Electronic equipment |
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| Publication Number | Publication Date |
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| CN113382592A true CN113382592A (en) | 2021-09-10 |
| CN113382592B CN113382592B (en) | 2023-06-23 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110681007.4A Active CN113382592B (en) | 2021-06-18 | 2021-06-18 | Electronic equipment |
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| Country | Link |
|---|---|
| CN (1) | CN113382592B (en) |
| WO (1) | WO2022262666A1 (en) |
Cited By (2)
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| WO2022262666A1 (en) * | 2021-06-18 | 2022-12-22 | 维沃移动通信有限公司 | Electronic device |
| WO2023227019A1 (en) * | 2022-05-26 | 2023-11-30 | 维沃移动通信有限公司 | Electronic device |
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| CN211429364U (en) * | 2020-03-26 | 2020-09-04 | Oppo广东移动通信有限公司 | Electronic device |
| CN213028146U (en) * | 2020-10-30 | 2021-04-20 | 维沃移动通信有限公司 | Electronic device |
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| KR102229153B1 (en) * | 2014-06-27 | 2021-03-18 | 삼성전자주식회사 | Connecor device and electronic device with the same |
| CN209233929U (en) * | 2019-01-04 | 2019-08-09 | Oppo广东移动通信有限公司 | Electronic equipment |
| CN113382592B (en) * | 2021-06-18 | 2023-06-23 | 维沃移动通信有限公司 | Electronic equipment |
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- 2021-06-18 CN CN202110681007.4A patent/CN113382592B/en active Active
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| CN207625639U (en) * | 2017-11-09 | 2018-07-17 | 广东欧珀移动通信有限公司 | Mobile terminal |
| CN207625611U (en) * | 2017-11-09 | 2018-07-17 | 广东欧珀移动通信有限公司 | Mobile terminal and its earphone seat installation structure |
| US20200178411A1 (en) * | 2018-11-30 | 2020-06-04 | Samsung Electronics Co., Ltd. | Sealing structure and electronic device including the same |
| CN110602902A (en) * | 2019-08-26 | 2019-12-20 | Oppo（重庆）智能科技有限公司 | Electronic device |
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Also Published As
| Publication number | Publication date |
|---|---|
| WO2022262666A1 (en) | 2022-12-22 |
| CN113382592B (en) | 2023-06-23 |
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