CN113382567A

CN113382567A - Laminating device for processing printed circuit board

Info

Publication number: CN113382567A
Application number: CN202110929211.3A
Authority: CN
Inventors: 杨和斌; 金功成; 李强; 华允军
Original assignee: Jiangyou Xinglian Electronic Technology Co ltd
Current assignee: Jiangyou Xinglian Electronic Technology Co ltd
Priority date: 2021-08-13
Filing date: 2021-08-13
Publication date: 2021-09-10
Anticipated expiration: 2041-08-13
Also published as: CN113382567B

Abstract

The invention discloses a laminating device for processing a printed circuit board, which comprises a base, wherein the upper end of the base is provided with a processing table, the upper end of the processing table is provided with a plurality of laminating processing grooves, the bottoms of the laminating processing grooves are provided with extrusion mechanisms, the upper end of the rear side of the processing table is fixedly hinged with a processing cover through hinges, the lower end of the processing cover is provided with a plurality of sealed air pumping blocks, the sealed air pumping blocks and the laminating processing grooves are arranged in a one-to-one correspondence manner, the laminating processing is respectively carried out on a single circuit board through the arranged laminating processing grooves, the mutual influence of the circuit boards during processing is avoided, the yield is improved, and the extrusion mechanisms arranged at the bottoms of the laminating processing grooves can eject the circuit board after the processing is finished, so that the blanking of the circuit board is convenient.

Description

Laminating device for processing printed circuit board

Technical Field

The invention belongs to the technical field of circuit board processing, and particularly relates to a laminating device for processing a printed circuit board.

Background

In recent years, the market competition degree of the printed circuit board industry in China is higher, the scale of a single manufacturer is not large, and the pricing capability is limited. With the expansion of the capacity and the increase of competition of the downstream industry, the price competition in the downstream industry is increasingly severe, and the control of the product cost is a key concern of many manufacturers. In such a case, the cost pressure of the downstream industry may be partially transferred to the printed circuit board industry, which is a greater barrier to increased prices of printed circuit boards.

The circuit board is the most active industry in the modern electronic element industry, the industry growth speed of the circuit board is generally about 3 percent higher than that of the electronic element industry, from the development situation, the Chinese circuit board industry continuously grows at a high speed, the import and export also realize the high-speed growth, and the circuit board is gradually optimized and improved along with the growth of the industry. A laminator for printed circuit boards is one of necessary equipments in a circuit board forming process,

because the lamination processing needs vacuum processing, in order to improve the processing efficiency, batch processing is generally adopted in the prior art, and a mode of simultaneously laminating a plurality of circuit boards in the same space is adopted, so that the compression and the temperature of each circuit board cannot be uniformly controlled, and the rejection rate is high, therefore, the laminating device for processing the printed circuit board is provided.

Disclosure of Invention

The present invention is directed to a laminating apparatus for processing a printed circuit board to solve the above-mentioned problems of the related art.

In order to achieve the purpose, the invention provides the following technical scheme: the utility model provides a printed circuit board processing is with lamination device, includes the base, the upper end of base sets up and processing platform, a plurality of lamination processing grooves have been seted up to processing bench end, and the bottom in lamination processing groove is provided with extrusion mechanism, the rear side upper end of processing platform is fixed with the processing lid through the hinge joint, the lower extreme of processing lid is provided with a plurality of sealed pieces of taking out air, and is a plurality of sealed pieces of taking out air set up with lamination processing groove one-to-one.

Preferably, the extrusion mechanism comprises a telescopic cylinder and an air source, and a pressing plate is arranged at the upper end of the telescopic cylinder.

Preferably, the upper end of the telescopic cylinder is provided with a magnetic mounting seat, the upper end of the magnetic mounting seat is provided with a square slot, the lower end of the pressing plate is provided with a magnetic insertion block, and the magnetic slot is inserted into the upper end of the magnetic mounting seat.

Preferably, the air source is arranged in the center of the inner cavity of the base, and the air path distributor at the upper end of the air source is communicated with the air inlets at the bottoms of the telescopic cylinders.

Preferably, a heat conduction pipe is buried in the processing table, the heat conduction pipe is arranged around the plurality of heat conduction oil boilers in an S-shaped coiling mode, the heat conduction oil boilers are arranged in the inner cavity of the base, and the output end and the backflow section of each heat conduction oil boiler are communicated with the two ends of the heat conduction pipe through pipelines.

Preferably, an air pumping seat is arranged at the upper end of the processing cover, an air pumping hole is formed in the center of the sealed air pumping block and communicated with the inner cavity of the air pumping seat, a vacuum pump is arranged in the inner cavity of the base, and the output end of the vacuum pump is communicated with the center of the inner side of the air pumping seat through a pipeline.

Preferably, a connecting socket is arranged at the center of the bottom side of the processing cover corresponding to the sealed air exhaust block and communicated with the inner cavity of the air exhaust seat, and a quick plug is arranged at the upper end of the sealed air exhaust block and inserted into the connecting socket at the lower side of the processing cover.

Preferably, the sealed air extraction block is internally provided with a cavity, the cavity inside the sealed air extraction block is communicated with the inner cavity of the air extraction seat, and the bottom of the sealed air extraction block, which is close to the edge, is provided with a plurality of air outlet holes.

Preferably, the upper end of the pressing plate is fixedly connected with a positioning column, the positioning column is arranged corresponding to the position of the positioning hole in the circuit board, the lower end of the sealed air pumping block is provided with a clamping groove corresponding to the upper end of the positioning column, and the clamping groove is matched with the positioning column.

Preferably, the processing platform all is provided with the locking seat near the front end department with the both sides of processing lid, and is a plurality of circular jack has all been seted up to the front end of locking seat, and just is equipped with the U-shaped inserted bar with the interpolation of two locking seat front end circular jacks of one side.

Compared with the prior art, the invention has the beneficial effects that:

(1) this printed circuit board processing is with lamination device carries out lamination processing to single circuit board respectively through a plurality of lamination processing grooves that set up, has avoided the circuit board to add the mutual influence man-hour, has improved the yield to the extrusion mechanism who sets up at lamination processing tank bottom can be ejecting with the circuit board after processing is accomplished, the unloading of the circuit board of being convenient for.

(2) This printed circuit board processing is with lamination device through the cooperation that sets up vacuum pump and seat of taking out gas, forms even negative pressure in a plurality of sealed piece departments of taking out gas, is convenient for to the evacuation of single circuit board, through the heat pipe and the conduction oil boiler that set up, through the heat conduction of processing platform, can locate to form stable temperature in lamination processing groove to the heat conduction of heat pipe is convenient for to the accurate control of temperature, has further improved the yield.

Drawings

FIG. 1 is a perspective view of the present invention;

FIG. 2 is a perspective view of a processing table and base of the present invention;

FIG. 3 is a front cross-sectional view of the present invention;

FIG. 4 is an enlarged view of the invention at A in FIG. 3;

FIG. 5 is a top cross-sectional view of the present invention;

FIG. 6 is a cross-sectional view of the fitting of the locking socket and the U-shaped insert rod of the present invention

In the figure: 1. a base; 2. a processing table; 3. processing a cover; 4. a lamination processing tank; 5. an air exhaust seat; 6. a telescopic cylinder; 7. a magnetic mount; 8. pressing a plate; 9. a positioning column; 10. sealing the air pumping block; 11. a gas source; 12. a vacuum pump; 13. a heat conducting pipe; 14. a heat conducting oil boiler; 15. a locking seat; 16. u-shaped inserted bar.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Referring to fig. 1 to 6, the present invention provides a laminating apparatus for processing a printed circuit board, including a base 1, a processing table 2 is disposed at an upper end of the base 1, a plurality of laminating processing tanks 4 are disposed at an upper end of the processing table 2, an extrusion mechanism is disposed at bottoms of the laminating processing tanks 4, a processing cover 3 is fixed at an upper end of a rear side of the processing table 2 through a hinge, a plurality of sealed air-pumping blocks 10 are disposed at a lower end of the processing cover 3, the plurality of sealed air-pumping blocks 10 are disposed in one-to-one correspondence with the laminating processing tanks 4, a cross-sectional size of the laminating processing tank 4 is larger than a board size of the circuit board to be processed, and an outer side of the sealed air-pumping block 10 is encapsulated.

In this embodiment, preferably, the squeezing mechanism includes a telescopic cylinder 6 and an air source 11, and a pressure plate 8 is arranged at the upper end of the telescopic cylinder 6; the stretching of the telescopic cylinder 6 is driven by the arranged air source 11, so that the pressing plate 8 is controlled to apply pressure to the circuit board, and the laminating processing is realized.

In this embodiment, preferably, the upper end of the telescopic cylinder 6 is provided with a magnetic mounting seat 7, the upper end of the magnetic mounting seat 7 is provided with a square slot, the lower end of the pressing plate 8 is provided with a magnetic insertion block, and the magnetic slot is inserted into the upper end of the magnetic mounting seat 7; the magnetic installation seat 7 is arranged, and the pressing plate 8 is fixed with the magnetic installation seat 7 through magnetic adsorption, so that the pressing plate 8 can be conveniently installed and detached.

In this embodiment, preferably, the air source 11 is disposed in the center of the inner cavity of the base 1, and the air path distributor at the upper end of the air source 11 is communicated with the air inlets at the bottoms of the plurality of telescopic cylinders 6; through the air supply 11 who sets up, air supply 11 passes through gas circuit distributor and a plurality of telescopic cylinder 6 intercommunication, can control a plurality of telescopic cylinder 6 synchronous operation.

In this embodiment, preferably, a heat conduction pipe 13 is embedded in the processing table 2, the heat conduction pipe 13 is wound around a plurality of heat conduction oil boilers 14 in an S-shaped manner, the heat conduction oil boilers 14 are arranged in the inner cavity of the base 1, and the output ends and the return sections of the heat conduction oil boilers 14 are respectively communicated with two ends of the heat conduction pipe 13 through pipelines; through the heat conduction pipe 13 that sets up, the conduction oil boiler 14 is at the conduction oil of heat conduction pipe 13 inner loop conduction to control the ambient temperature of lamination processing groove 4 through the heat conduction pipe 13 with the heat conduction of processing platform 2, be convenient for to the accurate control of processing temperature.

In this embodiment, preferably, the upper end of the processing cover 3 is provided with an air pumping seat 5, the center of the sealed air pumping block 10 is provided with an air pumping hole, the air pumping hole is communicated with the inner cavity of the air pumping seat 5, the inner cavity of the base 1 is provided with a vacuum pump 12, and the output end of the vacuum pump 12 is communicated with the center of the inner side of the air pumping seat 5 through a pipeline; through the seat of taking out air 5 and the vacuum pump 12 that set up, take out air in a plurality of sealed pieces of taking out air 10 tops through vacuum pump 12 to form the negative pressure in lamination processing groove 4, guaranteed the inside inseparable laminating of circuit board, effectively reduced the wastrel that inside residual bubble leads to.

In this embodiment, preferably, a connection socket is arranged at the bottom side of the processing cover 3 corresponding to the center of the sealed air pumping block 10, the connection socket is communicated with the inner cavity of the air pumping seat 5, a quick-plug is arranged at the upper end of the sealed air pumping block 10, and the quick-plug is inserted into the connection socket at the lower side of the processing cover 3; the installation of the base 1 is facilitated by the provision of a connection socket, thereby enabling the sealed pumping block 10 to be installed and replaced as required.

In this embodiment, preferably, a cavity is arranged inside the sealed air pumping block 10, the cavity inside the sealed air pumping block 10 is communicated with the inner cavity of the air pumping seat 5, and a plurality of air outlet holes are formed at the bottom of the sealed air pumping block 10 near the edge; through the cavity, the bottom edge air outlet hole of the sealed air pumping block 10 is communicated with the air pumping seat 5, the sealed air pumping block 10 is used for pumping air around the outer side of the edge of the circuit board, and the circuit board is prevented from being blocked and pumped out.

In this embodiment, preferably, the upper end of the pressing plate 8 is fixedly connected with a positioning column 9, the positioning column 9 is arranged at a position corresponding to a positioning hole on the circuit board, the lower end of the sealed air-extracting block 10 is provided with a clamping groove corresponding to the upper end of the positioning column 9, and the clamping groove is matched with the positioning column 9; through the locating column 9 that sets up, be convenient for to the low temperature internal fixation of circuit board.

In this embodiment, preferably, the locking seats 15 are disposed at the two sides of the processing table 2 and the processing cover 3 near the front ends, the front ends of the locking seats 15 are all provided with circular insertion holes, and the circular insertion holes at the front ends of the two locking seats 15 on the same side are inserted with U-shaped insertion rods 16; the locking seat 15 and the U-shaped inserted rod 16 are arranged to facilitate the fixing and the opening of the processing table 2 and the processing cover 3.

The working principle and the using process of the invention are as follows: when the device is used, the processing cover 3 is lifted, the overlapped multilayer circuit board is sequentially placed into the laminating processing tank 4, the positioning hole in the circuit board is correspondingly sleeved with the positioning column 9, then the processing cover 3 is closed, the processing table 2 and the processing cover 3 are fixed through the matching of the locking seat 15 and the U-shaped insertion rod 16, the vacuum pump 12 and the heat-conducting oil boiler 14 are started, the ambient temperature and the ambient pressure in the laminating processing tank 4 meet the processing requirements, the air source 11 is started, the pressure plate 8 is driven to lift through the telescopic cylinder 6, the circuit board is pressed, the laminating processing of the circuit board is completed, after the processing is completed, the vacuum pump 12 and the heat-conducting oil boiler 14 are closed, the temperature and the pressure in the laminating processing tank 4 are recovered to be normal, the processing cover 3 is opened, the pressure plate 8 is driven to lift through the air source 11, the processed circuit board is ejected, and the discharging is facilitated.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a printed circuit board processing is with lamination device, includes base (1), its characterized in that: the upper end of base (1) sets up and adds processing platform (2), a plurality of lamination processing groove (4) have been seted up to processing platform (2) upper end, and the bottom of lamination processing groove (4) is provided with extrusion mechanism, the rear side upper end of processing platform (2) is fixed with processing lid (3) through hinge joint, the lower extreme that adds processing lid (3) is provided with a plurality of sealed pieces of taking out air (10), and is a plurality of sealed pieces of taking out air (10) and lamination processing groove (4) one-to-one setting.

2. The laminating apparatus for printed circuit board processing according to claim 1, wherein: the extrusion mechanism comprises a telescopic cylinder (6) and an air source (11), and a pressing plate (8) is arranged at the upper end of the telescopic cylinder (6).

3. The laminating apparatus for printed circuit board processing according to claim 2, wherein: the upper end of telescopic cylinder (6) is provided with magnetism mount pad (7), the upper end of magnetism mount pad (7) is equipped with square slot, the lower extreme of clamp plate (8) is provided with the magnetism inserted block, just the magnetism slot is inserted and is located magnetism mount pad (7) upper end.

4. The laminating apparatus for printed circuit board processing according to claim 2, wherein: the air source (11) is arranged in the center of the inner cavity of the base (1), and an upper end air channel distributor of the air source (11) is communicated with the bottom air inlets of the telescopic cylinders (6).

5. The laminating apparatus for printed circuit board processing according to claim 1, wherein: processing platform (2) is interior to be buried heat pipe (13) underground, heat pipe (13) are the S-shaped around a plurality of conduction oil boiler (14) and coil the setting, base (1) inner chamber is provided with conduction oil boiler (14), the output and the backward flow section of conduction oil boiler (14) pass through the pipeline intercommunication with the both ends of heat pipe (13) respectively.

6. The laminating apparatus for printed circuit board processing according to claim 1, wherein: the upper end of processing lid (3) is provided with seat (5) of taking out air, the center of sealed piece (10) of taking out air is provided with the extraction opening, extraction opening and seat (5) inner chamber intercommunication of taking out air, the inner chamber of base (1) is provided with vacuum pump (12), the output of vacuum pump (12) passes through the inboard center intercommunication of pipeline and seat (5) of taking out air.

7. The laminating apparatus for printed circuit board processing according to claim 6, wherein: the bottom side of the processing cover (3) is provided with a connecting socket corresponding to the center of the sealed air exhaust block (10), the connecting socket is communicated with the inner cavity of the air exhaust seat (5), the upper end of the sealed air exhaust block (10) is provided with a quick plug, and the quick plug is inserted into the connecting socket on the lower side of the processing cover (3).

8. The laminating apparatus for printed circuit board processing according to claim 1, wherein: the sealed air exhaust block (10) is internally provided with a cavity, the cavity inside the sealed air exhaust block (10) is communicated with the inner cavity of the air exhaust seat (5), and the bottom of the sealed air exhaust block (10) is close to the edge and is provided with a plurality of air outlet holes.

9. The laminating apparatus for printed circuit board processing according to claim 2, wherein: the upper end fixedly connected with reference column (9) of clamp plate (8), and reference column (9) correspond locating hole position setting on the circuit board, the lower extreme of sealed piece (10) of taking out gas corresponds the upper end of reference column (9) and is provided with the draw-in groove, just draw-in groove and reference column (9) phase-match.

10. The laminating apparatus for printed circuit board processing according to claim 1, wherein: processing platform (2) and the both sides of processing lid (3) are close to the front end department and all are provided with locking seat (15), and are a plurality of circular jack has all been seted up to the front end of locking seat (15), and just with two locking seat (15) front end circular jack interpolations of one side be equipped with U-shaped inserted bar (16).