CN113380958A - Display substrate, preparation method thereof and display device - Google Patents

Abstract

The invention provides a display substrate, a preparation method thereof and a display device, belongs to the technical field of display, and can at least partially solve the problem that images acquired by the existing display device are easy to generate ghost. The display substrate is provided with an acquisition area, and the back side of the display substrate is used for arranging an image acquisition unit for acquiring images through the acquisition area; the display substrate comprises a substrate and a plurality of reflection structures positioned in an acquisition region, wherein light-transmitting parts are arranged among the reflection structures in the acquisition region; the collection area is internally provided with a light extinction structure corresponding to at least part of the reflection structure, and the light extinction structure is positioned on one side of the reflection structure close to the back side; the orthographic projection of each extinction structure on the substrate is overlapped with the orthographic projection of the corresponding reflection structure on the substrate; each extinction structure comprises a first dielectric layer and a second dielectric layer which are positioned at different positions in a horizontal plane parallel to the substrate, and the refractive index of the first dielectric layer is different from that of the second dielectric layer.

Description

Display substrate, preparation method thereof and display device

Technical Field

The invention belongs to the technical field of display, and particularly relates to a display substrate, a preparation method of the display substrate and a display device.

Background

In a display device (e.g., a mobile phone) that employs off-screen imaging, an image capture unit (e.g., a camera) may be disposed on a back side (i.e., a side away from a display side) of a display substrate (display panel). The area of the display substrate corresponding to the image acquisition unit is an acquisition area, and a light-emitting device (such as an organic light-emitting diode) is also arranged in the acquisition area for displaying; the interval of the light emitting device is a light transmission part which can transmit light, and the image acquisition unit can form an image by using the light transmitted through the light transmission part.

However, in the above display device, the image captured by the image capturing unit is likely to have "Ghost" defects, which affect the image capturing quality.

Disclosure of Invention

The invention provides a display substrate, a preparation method thereof and a display device.

In a first aspect, an embodiment of the present invention provides a display substrate having an acquisition region, where a backside of the display substrate is used to dispose an image acquisition unit for acquiring an image through the acquisition region; the display substrate comprises a substrate and a plurality of reflection structures positioned in an acquisition region, wherein light-transmitting parts are arranged among the reflection structures in the acquisition region;

the collection area is internally provided with a light extinction structure corresponding to at least part of the reflection structure, and the light extinction structure is positioned on one side of the reflection structure close to the back side;

the orthographic projection of each extinction structure on the substrate is overlapped with the orthographic projection of the corresponding reflection structure on the substrate; each extinction structure comprises a first dielectric layer and a second dielectric layer which are positioned at different positions in a horizontal plane parallel to the substrate, and the refractive index of the first dielectric layer is different from that of the second dielectric layer.

Optionally, the light extinction structure and the reflection structure are both disposed on a side of the substrate away from the back side, and the light extinction structure is located between the reflection structure and the substrate.

Optionally, the light extinction structure is in contact with a side of the reflective structure near the back side.

Optionally, a plurality of light emitting devices are arranged at intervals in the collection region, and each light emitting device comprises a first electrode;

the reflective structure includes a first electrode of the light emitting device.

Optionally, in a direction away from the substrate, the light emitting device includes a first electrode, a light emitting layer, and a second electrode that are sequentially disposed;

the light extinction structure is located between the first electrode and the substrate.

Optionally, an area of an orthographic projection of the first dielectric layer of each extinction structure on the substrate accounts for 40% -60% of an area of an orthographic projection of the extinction structure on the substrate.

Optionally, the absolute value of the difference between the refractive index of the first medium layer and the refractive index of the second medium layer is between 0.2 and 0.4.

Optionally, the thickness of the light extinction structure is between 0.2 microns and 0.5 microns.

Optionally, the first dielectric layer is made of an inorganic insulating material;

the second dielectric layer is made of an organic insulating material.

Optionally, the material of the first dielectric layer includes at least one of silicon nitride, silicon oxide, and silicon oxynitride;

the material of the second dielectric layer comprises a planarization layer material.

Optionally, the display substrate further includes:

and the part of the planarization layer filled into the interval of the first dielectric layer forms a second dielectric layer.

In a second aspect, an embodiment of the present invention provides a display device, including:

any one of the above display substrates;

the image acquisition unit is arranged on the back side of the display substrate and is used for acquiring images through the acquisition area of the display substrate.

In a third aspect, an embodiment of the present invention provides a method for manufacturing any one of the above display substrates, including:

and forming the reflection structure on a substrate, and forming the extinction structure on the substrate.

Optionally, the forming the light extinction structure on the substrate includes:

forming a first dielectric layer on the substrate through a composition process;

and forming a planarization layer covering the first dielectric layer on the substrate, wherein the part of the planarization layer filled into the interval of the first dielectric layer forms a second dielectric layer.

Drawings

FIG. 1 is a schematic diagram illustrating the principle of poor ghost at the collection area of a display device according to the related art;

FIG. 2 is a schematic diagram illustrating a distribution of reflective structures in a collection area of a display substrate according to an embodiment of the present invention;

FIG. 3 is a schematic diagram of destructive interference at an acquisition region of a display device according to an embodiment of the present invention;

FIG. 4 is a schematic view of a partial cross-sectional structure at an acquisition region of a display device in the related art;

FIG. 5 is a schematic diagram illustrating the distribution of a first dielectric layer and a second dielectric layer in a light-extinction structure in a display substrate according to an embodiment of the invention;

FIG. 6 is a schematic diagram of the distribution of a first dielectric layer and a second dielectric layer in a light-extinction structure in another display substrate according to an embodiment of the invention;

FIG. 7 is a schematic diagram of the distribution of a first dielectric layer and a second dielectric layer in a matte structure in another display substrate according to an embodiment of the present invention;

FIG. 8 is a schematic partial cross-sectional view of a display substrate according to an embodiment of the invention;

FIG. 9 is a diagram illustrating simulation results of intensity of light causing poor ghosting in a display substrate according to an embodiment of the present invention and a related art display substrate;

FIG. 10 is a flowchart illustrating a portion of a method for fabricating a display substrate according to an embodiment of the present invention;

FIG. 11 is a flow chart of a portion of a process for fabricating another display substrate according to an embodiment of the present invention;

wherein the meaning of the reference numerals in the above figures is:

1. a reflective structure; 2. a light extinction structure; 21. a first dielectric layer; 22. a second dielectric layer; 3. a planarization layer; 4. a light emitting device; 41. a first electrode; 42. a light emitting layer; 43. a second electrode; 8. an image acquisition unit; 81. a lens; 9. a substrate; 91. a collection zone.

Detailed Description

In order to make the technical solutions of the present invention better understood, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.

It is to be understood that the specific embodiments and figures described herein are merely illustrative of the invention and are not limiting of the invention.

In the embodiments of the present invention, the embodiments and features of the embodiments of the present invention may be combined with each other without conflict.

In the embodiments of the present invention, for convenience of description, only portions related to the embodiments of the present invention are shown in the drawings of the present invention, and portions not related to the embodiments of the present invention are not shown in the drawings.

In the embodiments of the present invention, the size of each component, the thickness of a layer, or a region may be exaggerated for clarity in the drawings. Therefore, one mode of the embodiment of the present invention is not necessarily limited to the dimensions, and the shapes and sizes of the respective components in the drawings do not reflect a true scale. Further, the drawings schematically show desirable examples, and one mode of the embodiment of the present invention is not limited to the shapes, numerical values, and the like shown in the drawings.

In the embodiments of the present invention, ordinal numbers such as "first", "second", "third", and the like are provided to avoid confusion of constituent elements, and are not limited in number.

In the embodiments of the present invention, for convenience, terms indicating orientations or positional relationships such as "middle", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like are used to describe positional relationships of constituent elements with reference to the drawings, only for convenience of description and simplification of description, but not to indicate or imply that the structures referred to must have a specific orientation, be configured in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. The positional relationship of the components is changed as appropriate in accordance with the direction in which each component is described. Therefore, the words described in the specification are not limited to the words described in the specification, and may be replaced as appropriate.

Noun interpretation

Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art. It will be further understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning that is consistent with their meaning in the context of the relevant art and the present invention and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

In the present invention, the following technical terms should be understood according to the following explanations, unless otherwise specified:

"layered" of structures means that the structures are formed from the same layer of material and thus are in layered relationship in the same layer, but does not mean that they are equidistant from the substrate nor that they are completely identical to the structure of other layers between the substrate.

"patterning process" refers to a step of forming a structure having a specific pattern, which may be a photolithography process including one or more steps of forming a material layer, coating a photoresist, exposing, developing, etching, stripping a photoresist, and the like; of course, the patterning process may also be an imprinting process, an inkjet printing process, or other processes.

Detailed Description

In some related arts, referring to fig. 1, in a display device employing the under-screen image pickup, an image pickup unit 8 (e.g., a camera) may be provided on a back side (i.e., a side facing away from a display side) of a display substrate (display panel). The area of the display substrate corresponding to the image capturing unit 8 is a capturing area 91, and the capturing area 91 is also provided with a light emitting device 4 (such as an organic light emitting diode) for displaying. Light emitting device 4 includes first electrode 41 made of a reflective material, so that light is not transmitted at the position of light emitting device 4, and the space between light emitting devices 4 is a light transmitting portion, and image capturing unit 8 can display by light transmitted through the light transmitting portion.

However, referring to fig. 1, the lens of the image capturing unit 8 necessarily includes a lens 81, and the lens 81 may reflect a portion of the light incident thereon through the light-transmitting portion to the first electrode 41, and the light is reflected again by the first electrode 41 and then re-incident on the image capturing unit 8, and finally incident on the array of photosensitive devices (such as a CCD) therein to form an image.

The light reflected to the image capturing unit 8 corresponds to the arrangement of the light emitting devices 4 (first electrodes 41), so that the image captured by the image capturing unit 8 includes "virtual images" corresponding to the light emitting devices 4, but these are not images to be formed by the image capturing unit 8; therefore, the phenomenon is called as "Ghost" defect, which affects the image acquisition quality.

Among them, the ghost is affected by various factors. For example, when the angle between the incident direction of light and the normal direction of the display substrate (the incident angle of light) is 45 degrees, the ghost phenomenon is usually most noticeable. As another example, when the lens of the image pickup unit 8 includes a plurality of mirrors 81, the reflection of each mirror 81 may cause ghost, thereby causing "multi-level ghost".

In a first aspect, referring to fig. 1 to 9, an embodiment of the present invention provides a display substrate having an acquisition region 91, a backside of the display substrate being used for disposing an image acquisition unit 8 for acquiring an image through the acquisition region 91; the display substrate comprises a base 9 and a plurality of reflecting structures 1 positioned in an acquisition region 91, wherein light-transmitting parts are arranged between the reflecting structures 1 in the acquisition region 91;

the acquisition region 91 is provided with a light extinction structure 2 corresponding to at least part of the reflection structure 1, and the light extinction structure 2 is positioned on one side of the reflection structure 1 close to the back side;

the orthographic projection of each extinction structure 2 on the substrate 9 is overlapped with the orthographic projection of the corresponding reflection structure 1 on the substrate 9; each light-extinction structure 2 comprises a first dielectric layer 21 and a second dielectric layer 22 located at different positions in a horizontal plane parallel to the substrate 9, the refractive index of the first dielectric layer 21 being different from the refractive index of the second dielectric layer 22.

The display substrate of the embodiment of the invention is used in a display device, and comprises a base 9 and other structures arranged on the base 9.

The base 9 is a base for supporting other structures on the display substrate, and is a substantially sheet-like structure made of glass, polymer materials (such as polyimide), and the like, and may be rigid or flexible, and the thickness may be in the millimeter order.

Among other things, the display substrates of embodiments of the present invention have an opposing display side (i.e., the side of the display device that is viewed by a user) and a back side (i.e., the "back" of the display device) opposite the display side.

In the display device, the image capturing unit 8 (e.g., a camera) is disposed on the back side of the capturing area 91, and captures an image through the capturing area 91. Of course, to achieve the image acquisition through the acquisition region 91, the base 9 of the display substrate of the embodiment of the present invention may be transparent, or at least transparent at the position corresponding to the acquisition region 91.

The display substrate may further include other regions such as a display region and an edge region, which are not described in detail herein.

In the collecting area 91 of the display substrate, a plurality of reflective structures 1 capable of reflecting light are arranged, but the reflective structures 1 do not fully cover the collecting area 91, so that light-transmitting and light-transmitting parts are arranged between the reflective structures 1, and the image acquisition unit 8 can perform imaging by using the light transmitted through the light-transmitting parts.

Among them, the reflective structure 1 may specifically include electrodes of the light emitting device 4 (such as an organic light emitting diode), electrodes of a driving circuit, leads, a reflective layer for protecting the device, etc., and belongs to the reflective structure 1 as long as it is substantially reflective, and will not be described in detail herein.

The specific shape of the reflective structure 1 may be various, such as circular as shown in fig. 2, or rectangular, strip-shaped, irregular-shaped, and the like, and will not be described in detail herein.

The reflective structure 1 may be provided in other regions such as the display region and the edge region of the display substrate, which will not be described in detail herein.

Referring to fig. 3 and 4, in the display substrate according to the embodiment of the invention, at least part of the reflective structures 1 in the acquisition region 91 have corresponding light extinction structures 2. The light extinction structure 2 is closer to the back side of the display substrate than the reflection structure 1, and is located at the same projection position as the corresponding reflection structure 1 (the light extinction structure 2 and the corresponding reflection structure 1 have the same shape and area), so that light (light reflected by the lens 81 of the lens of the image acquisition unit 8) emitted from the back side to the reflection structure 1 first passes through the light extinction structure 2; light reflected from the reflective structure 1 towards the backside will also pass the light-attenuating structure 2.

Referring to fig. 3 and 4, the extinction structure 2 of each reflection structure 1 is provided with different dielectric layers at different positions in the same horizontal plane (i.e., a plane parallel to the substrate 9), i.e., a first dielectric layer 21 and a second dielectric layer 22, or the extinction structure 2 includes a specific Pattern (Pattern) formed by the first dielectric layer 21 and the second dielectric layer 22 in the same horizontal plane. Further, the refractive indices of the above first dielectric layer 21 and second dielectric layer 22 are different.

It should be understood that the first dielectric layer 21 and the second dielectric layer 22 in each of the light extinction structures 2 are not "disposed in the same layer" because they are layers of different materials and formed separately in different processes, although they are located at the same level.

The specific distribution mode of the two dielectric layers in the extinction structure 2 is various. For example, reference may be made to fig. 5 where the two dielectric layers each occupy "half" of the matting structure 2; alternatively, referring also to FIG. 6, one dielectric layer is "inside" and the other dielectric layer is "outside"; alternatively, referring also to fig. 7, the two dielectric layers are divided into "multiple strips"; alternatively, the two medium layers can be arranged in a grid shape, and the like; and will not be described in detail herein.

It should be understood that the positions of the first dielectric layer 21 and the second dielectric layer 22 in fig. 5-7 above are relative and interchangeable.

Thus, at the position of the reflective structure 1 corresponding to the acquisition region 91, the extinction structure 2 corresponding to the reflective structure 1 is formed as long as two dielectric layers with different refractive indexes form a specific pattern in the same plane.

Wherein, other positions outside the reflective structures 1 of the acquisition region 91, for example, positions between the reflective structures 1 corresponding to the acquisition region 91 (i.e. light-transmitting portions), or positions in the display region and the edge region (including positions corresponding to the reflective structures 1 and positions between the reflective structures 1), the arrangement of the two dielectric layers may be various: for example, referring to fig. 4, there may be a layer disposed in the same layer as one of the first dielectric layer 21 and the second dielectric layer 22 at other positions; for another example, there may be a layer stacked in other positions and respectively disposed in the same layer as the first dielectric layer 21 and the second dielectric layer 22; for another example, there may be a specific pattern (which is not a light-extinction structure) formed by layers respectively provided in the same layer as the first dielectric layer 21 and the second dielectric layer 22 at other positions; for example, there may be no layer provided in the same layer as the first dielectric layer 21 and the second dielectric layer 22 at another position; and will not be described in detail herein.

Of course, it should be understood that if there are also layer structures (or first dielectric layer 21 or second dielectric layer 22) formed simultaneously with the first dielectric layer 21 or second dielectric layer 22 at locations outside the light extinction structure 2 (e.g., in regions outside the light extinction structure 2, or at locations above/below the light extinction structure 2), then the layer structures at these locations do not belong to a "light extinction structure". "

Obviously, the size of each reflecting structure 1 in the display substrate is not too large, so with reference to fig. 3, at the same time, the light reflected by the mirror 81 of the lens of the image capturing unit 8 to different positions of one reflecting structure 1 are substantially parallel to each other, and they are still substantially parallel after being reflected again by the reflecting structure 1.

Referring to fig. 3, when having the light extinction structure 2, light reflected by the mirror 81 of the image acquisition unit 8 to different positions of one of the reflective structures 1 (indicated by solid and dotted arrows in fig. 3, respectively) will "pass" through different dielectric layers; because the refractive indexes of the first dielectric layer 21 and the second dielectric layer 22 are different, the optical paths of light passing through different dielectric layers are different, so that an optical path difference is generated, and further, certain phase difference is generated on the light passing through different dielectric layers; and because the light reflected from different positions of the reflection structure 1 are parallel and close to each other, when they have phase difference, they will generate a certain degree of destructive interference due to the difference of phase, and the intensity will be reduced or even disappear.

Thus, referring to fig. 3, compared to the related art without the light extinction structure, in the display substrate according to the embodiment of the present invention, the intensity of the light reflected by the image capturing unit 8 is reduced or even disappears, so that the poor ghost is reduced or eliminated, and the display quality is improved.

Optionally, each reflective structure 1 in the acquisition region 91 has a corresponding light-attenuating structure 2.

Obviously, each reflective structure 1 in the acquisition region 91 may have a corresponding light-attenuating structure 2 for a better ghost-eliminating effect.

Optionally, the area of the orthographic projection of the first dielectric layer 21 of each light extinction structure 2 on the substrate 9 accounts for 40% to 60% of the area of the orthographic projection of the light extinction structure 2 on the substrate 9.

Optionally, the area of the orthographic projection of the first dielectric layer 21 of each light extinction structure 2 on the substrate 9 accounts for 50% of the area of the orthographic projection of the light extinction structure 2 on the substrate 9.

The theoretically best extinction effect of the extinction structure 2 is to completely reverse the phases of light respectively passing through the two dielectric layers, so that complete extinction is realized through destructive interference. To achieve complete destructive interference, it is also required that the amount of light in two phases (i.e. light passing through two dielectric layers respectively) should be about the same, so the area occupied by the two dielectric layers should be substantially the same, for example, 40% to 60% of one dielectric layer (correspondingly, 60% to 40% of the other dielectric layer) and further 50% of each of the two dielectric layers (i.e. equal area).

Optionally, the absolute value of the difference between the refractive index of the first dielectric layer 21 and the refractive index of the second dielectric layer 22 is between 0.2 and 0.4.

Optionally, the thickness of the light extinction structure 2 is between 0.2 micrometers and 0.5 micrometers.

As mentioned above, if the phases of the light passing through the two dielectric layers are opposite to each other, the optical path difference generated by the light propagating through the two dielectric layers is λ/2, so that the following formula is given:

λ/2＝(n1-n2)*L＝(n1-n2)*[2*d/sinα]；

where λ is the wavelength of light, n1 is the refractive index of the first dielectric layer 21, n2 is the refractive index of the second dielectric layer 22, L is the total distance that light propagates in the dielectric layers, d is the thickness of the light extinction structure 2 (also the thickness of the two dielectric layers), α is the angle between the incident direction of light and the normal direction of the display substrate (the incident angle of light), and "2" before d indicates that light will pass through the same dielectric layer twice after striking the reflection structure 1 and being reflected by the reflection structure 1.

Obviously, the angle of incidence, wavelength, etc. of the light are different in different cases, so that the extinction structure 2 cannot satisfy the above formula in all cases.

Generally speaking, human eyes are most sensitive to light with a wavelength of 550nm, and the ghost is the most serious when the incident angle of the light is 45 degrees, so the optimal parameters of the extinction structure 2 can be calculated according to the above conditions to take account of the extinction effect under various conditions.

In combination with the conventional size range of the structure in the display substrate and the refractive index of the common transparent material, the thickness of the light extinction structure 2 can be usually 0.2-0.5 micron, and the difference between the refractive indexes of the two dielectric layers can be 0.2-0.4.

Optionally, the first dielectric layer 21 is made of an inorganic insulating material; the second dielectric layer 22 is composed of an organic insulating material.

Optionally, the material of the first dielectric layer 21 includes at least one of silicon nitride, silicon oxide, and silicon oxynitride; the material of the second dielectric layer 22 comprises a planarization layer material.

In the light-transmitting materials commonly used for the display substrate, the difference between the refractive indexes of the inorganic insulating material and the organic insulating material is generally large and is within the above range, so that they can be selected as the material of the first dielectric layer 21 and the second dielectric layer 22 respectively, and further, silicon nitride, silicon oxide, and silicon oxynitride can be used as the material of the first dielectric layer 21, and the material forming the Planarization Layer (PLN) can be used as the material of the second dielectric layer 22.

For example, if the refractive index of silicon nitride (SiNx) material (i.e., n1) is 1.903 and the refractive index of the planarization layer material (i.e., n2) is 1.658, then for wavelengths of light above 550nm and angles of incidence of 45 degrees, the following formula can be used:

550nm/2＝(1.903-1.658)*[2*d/sin45°]；

the thickness d of the extinction structure 2 can be calculated to be 398nm to 0.398 μm; in this case, the thickness d of the light-extinction structure 2 may be set to 0.35 μm to 0.45 μm in consideration of the actual process.

Further, when the display substrate without the extinction structure in the related art and the display substrate of the present invention using the silicon nitride material as the first dielectric layer 21 and the planarization layer material as the second dielectric layer 22 are respectively simulated and calculated for use in the display device, the relative intensity of the light (i.e., the light causing the poor ghost) received by the image capturing unit 8 due to the reflection of the reflection structure 1 is different when the wavelength and the incident angle of the light are different. The results of the above simulation calculations are shown in fig. 9, and in fig. 9, the angle in parentheses is the incident angle of light.

As can be seen from the simulation results shown in fig. 9, the light extinction structure 2 of the present invention can substantially reduce the amount of light reflected by the reflection structure 1 into the image capturing unit 8, thereby substantially reducing or even eliminating the poor ghost and improving the display quality.

For another example, if the refractive index of the silicon nitride (SiOx) material (i.e., n1) is 1.924 and the refractive index of the planarization layer material (i.e., n2) is 1.658, then the above formula can be used to obtain the refractive index of the silicon nitride (SiOx) material for a wavelength of 550nm above and an angle of incidence of 45 degrees:

550nm/2＝(1.924-1.658)*[2*d/sin45°]；

the thickness d of the extinction structure 2 is 366nm 0.366 μm; in this case, the thickness d of the light-extinction structure 2 may be set to 0.3 μm to 0.4 μm in consideration of the actual process.

It can be seen that when the dielectric layers of the above materials are used, the refractive index difference, the thickness of the extinction structure 2, and the like can be made within the above ranges.

Optionally, the display substrate further includes: and the planarization layer 3 covers the first dielectric layer 21, and the part of the planarization layer 3 filled in the interval of the first dielectric layer 21 forms a second dielectric layer 22.

To form the first dielectric layer 21 and the second dielectric layer 22 in the same horizontal plane, the first dielectric layer 21 may be patterned first, and then the second dielectric layer 22 filled only in the space of the first dielectric layer 21 may be patterned.

However, from the viewpoint of process simplification, referring to fig. 4, the first dielectric layer 21 is patterned, and then the planarization layer 3(PLN) covering the first dielectric layer 21 is formed, and the material of the planarization layer 3 naturally enters into the space between the first dielectric layers 21 and constitutes the second dielectric layer 22.

The second dielectric layer 22 and the planarization layer 3 above it are actually a unitary structure, or the second dielectric layer 22 is a part of the planarization layer 3. It is clear that only the portions of the planarization layer 3 that are at the location of the extinction structure 2 and at the same level as the first dielectric layer 21 (i.e. in the spaces of the first dielectric layer 21) are the second dielectric layer 22 and belong to the extinction structure 2.

Optionally, the light-extinction structure 2 and the reflection structure 1 are disposed on the same side of the substrate 9.

In order to achieve better destructive interference, light reflected by the same position of the reflective structure 1 may pass through the same dielectric layer twice, so as to generate a larger optical path difference. In order to make the light energy reflected by most of the reflective structures 1 pass through the same dielectric layer twice, the distances between the light extinction structures 2 (the first dielectric layer 21 and the second dielectric layer 22) and the corresponding reflective structures 1 should be as close as possible, so that the two can be disposed on the same side of the substrate 9.

Optionally, the light extinction structure 2 and the reflection structure 1 are both disposed on a side of the substrate 9 away from the back side, and the light extinction structure 9 is located between the reflection structure 1 and the substrate 9.

Further, various reflective structures 1 (actually, structures required for display) are usually disposed on the display side of the substrate 9, and the back side of the substrate 9 is free of the reflective structures 1, so that if the light extinction structure 2 is closer to the reflective structure 1, the light extinction structure 2 can be located between the substrate 9 and the reflective structure 1 (certainly, located on the display side) in this case, referring to fig. 3 and 4.

Optionally, the light-attenuating structure 2 is in contact with a side of the reflective structure 1 close to the back side.

Obviously, in order to achieve the "closest" distance, reference is made to fig. 8, the light-extinction structure 2 being in direct contact with the reflective structure 1.

Optionally, a plurality of light emitting devices 4 are disposed at intervals in the collecting region 91, and each light emitting device 4 includes a first electrode 41;

the reflective structure 1 includes a first electrode 41 of the light emitting device 4.

Alternatively, the first electrode 41 is an anode of the light emitting device 4.

The display substrate includes a plurality of pixel units (or sub-pixels), and each pixel unit includes a light emitting device 4 for emitting light (displaying), and a driving circuit (pixel circuit) for driving the light emitting device; in addition, the display substrate may further include leads for supplying signals to the respective driving circuits.

In order to transmit more light energy through the collecting region 91 to the image collecting unit 8 for imaging, the light blocking structure in the collecting region 91 should be as small as possible, and the driving circuit, the lead, etc. corresponding to the light emitting device 4 in the collecting region 91 are usually disposed outside the collecting region 91 (for example, in the display region adjacent to the collecting region 91).

For this reason, the reflective structure 1 in the above acquisition region 91 may mainly include the first electrode 41 of the light emitting device 4, and more particularly, may be an Anode (Anode) of the light emitting device 4.

It is obviously also possible, if the acquisition region 91 of the display substrate further comprises other reflective structures 1 and corresponding light-extinction structures 2 to the other reflective structures 1, which will not be described in detail herein.

Here, as described above, in other regions (e.g., a display region) of the display substrate, structures of the light emitting device 4, a lead, a driver circuit, and the like may be provided, and will not be described in detail.

Alternatively, in a direction away from the substrate 9, the light-emitting device 4 includes a first electrode 41, a light-emitting layer 42, and a second electrode 43 which are sequentially disposed;

the light-extinction structure 2 is located between the first electrode 41 and the substrate 9.

As a mode of the embodiment of the present invention, the light emitting device 4 may be constituted by two electrodes and a light emitting layer 42 sandwiched between the two electrodes.

Here, two electrodes of the light emitting device 4, such as an organic light emitting diode, may be an Anode (Anode) and a Cathode (Cathode), respectively, and the light emitting layer 42 may be an organic light emitting layer, and the organic light emitting layer may include a plurality of sub-layers, such as an Electron Transport Layer (ETL), an Electron Injection Layer (EIL), an organic light Emitting Material Layer (EML), a Hole Injection Layer (HIL), and a Hole Transport Layer (HTL), which are sequentially stacked in a direction from the Cathode to the Anode, which will not be described in detail herein.

It should be understood that the light emitting device 4 in fig. 4 is only a schematic representation of the relative position of the structures of the layers, and is not a limitation on the actual structure of the display substrate. For example, the above second electrode 43 (cathode), the organic light emitting layer 42 may both be of a "full layer" structure covering each position, and portions thereof corresponding to different light emitting devices 4 are separated by a Pixel Defining Layer (PDL) or the like.

When the first electrode 41 of the light emitting device 4 is the reflective structure 1, it may be that the first electrode 41 is closer to the substrate 9, that is, closer to the light extinction structure 2, among the structures.

At this time, since the first electrode 41 is a reflective layer, the light emitted from the light emitting device 4 needs to be emitted from the second electrode 43 away from the substrate 9, so that the second electrode 43 should be made of a transmissive material or a semi-reflective and semi-transmissive material, and the display substrate is a "top emission" display substrate.

It is also possible, among others, if the light emitting device and the display substrate are in other forms (e.g. the display substrate is in "bottom emission" mode).

It should be understood that, although only a part of the structure of the display substrate is described above, many other structures may be included in the display substrate, for example, various lead lines (e.g., gate lines, data lines, control lines, initialization signal lines, and power signal lines), a driving circuit (which may include a storage capacitor and a plurality of thin film transistors), a Pixel Definition Layer (PDL), various isolation layers (e.g., a gate insulating layer, a passivation layer, an interlayer insulating layer, other planarization layers, etc.), an encapsulation structure (e.g., an organic encapsulation layer and an inorganic encapsulation layer which are alternately disposed), and the like, which are not described in detail herein.

In a second aspect, referring to fig. 1 to 9, an embodiment of the present invention provides a display device, including:

any one of the above display substrates;

and an image capturing unit 8 disposed on the back side of the display substrate, wherein the image capturing unit 8 is configured to capture an image through the capture area 91 of the display substrate.

The display device of the embodiment of the invention comprises the above display substrate and the image acquisition unit 8 (such as a camera), wherein the image acquisition unit 8 is arranged at the back side of the display substrate and is positioned at the position corresponding to the acquisition area 91 of the display substrate, so that the image at the display side of the display device can be acquired through the acquisition area 91.

The display device may be a display device that uses an off-screen camera (so the image capturing unit 8 is not visible on the display side), such as a full-screen display device (i.e., a display device that can display at all positions on the display side).

In the display device according to the embodiment of the present invention, the display substrate may be combined with other substrates (e.g., a pair of substrates) to form a display panel, so that the image capturing unit 8 is also disposed on the back side of the display panel.

The display device according to the embodiment of the present invention may further include other structures, such as a driving chip, a power supply assembly, a supporting frame, and the like, which are not described in detail herein.

Specifically, the display device according to the embodiment of the present invention may be any product or component having a display function, such as electronic paper, a mobile phone, a tablet computer, a television, a display, a notebook computer, a digital photo frame, and a navigator.

In a third aspect, referring to fig. 1 to 11, an embodiment of the present invention provides a method for manufacturing any one of the above display substrates.

Referring to fig. 10, a method of an embodiment of the present invention includes:

s301, a reflective structure 1 is formed on a substrate 9, and a light extinction structure 2 is formed on the substrate 9.

When the above display substrate is to be prepared, the corresponding reflective structure 1 and the light extinction structure 2 need to be formed separately.

It is not possible for the reflective structure 1 and the light-attenuating structure 2 to be formed simultaneously, but the sequence of the words described above does not imply that both must be formed in the corresponding sequence.

Alternatively, referring to fig. 11, forming the light extinction structure 2 on the substrate 9 (S301) includes:

s3011, a first dielectric layer 21 is formed on the substrate 9 by a patterning process.

S3012, forming a planarization layer 3 on the substrate 9 to cover the first dielectric layer 21, wherein the portion of the planarization layer 3 filled into the space of the first dielectric layer 21 constitutes the second dielectric layer 22.

As before, referring to fig. 4, when the second dielectric layer 22 of the light extinction structure 2 is formed by the planarization layer 3 covering the first dielectric layer 21, the first dielectric layer 21 with the required pattern may be formed by a patterning process during the preparation of the display substrate, and then the planarization layer 3 of the whole layer is formed, so that the planarization layer 3 covers the first dielectric layer 21 to form a structure with a flat surface, and is naturally filled into the gaps of the pattern of the first dielectric layer 21; so that the portion of the planarization layer 3 filled into the gap of the first dielectric layer 21 is the above second dielectric layer 22.

When the display substrate includes other structures, the manufacturing method naturally further includes other steps for forming the corresponding other structures, and the specific structures formed, the specific processes adopted, the specific sequence of formation, and the like, which are not described in detail herein.

It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.

Claims (14)

1. A display substrate having an acquisition area, a backside of the display substrate for providing an image acquisition unit for acquiring an image through the acquisition area; the display substrate comprises a substrate and a plurality of reflection structures positioned in an acquisition region, wherein light-transmitting parts are arranged among the reflection structures in the acquisition region; it is characterized in that the preparation method is characterized in that,

the collection area is internally provided with a light extinction structure corresponding to at least part of the reflection structure, and the light extinction structure is positioned on one side of the reflection structure close to the back side;

the orthographic projection of each extinction structure on the substrate is overlapped with the orthographic projection of the corresponding reflection structure on the substrate; each extinction structure comprises a first dielectric layer and a second dielectric layer which are positioned at different positions in a horizontal plane parallel to the substrate, and the refractive index of the first dielectric layer is different from that of the second dielectric layer.

2. The display substrate of claim 1,

the extinction structure and the reflection structure are arranged on one side, away from the back side, of the substrate, and the extinction structure is located between the reflection structure and the substrate.

3. The display substrate of claim 1,

the light-extinction structure is in contact with a side of the reflective structure proximate the back side.

4. The display substrate of claim 1,

a plurality of light emitting devices arranged at intervals are arranged in the acquisition region, and each light emitting device comprises a first electrode;

the reflective structure includes a first electrode of the light emitting device.

5. The display substrate of claim 4,

in the direction far away from the substrate, the light-emitting device comprises a first electrode, a light-emitting layer and a second electrode which are arranged in sequence;

the light extinction structure is located between the first electrode and the substrate.

6. The display substrate of claim 1,

the area of the orthographic projection of the first dielectric layer of each extinction structure on the substrate accounts for 40% -60% of the area of the orthographic projection of the extinction structure on the substrate.

7. The display substrate of claim 1,

the absolute value of the difference between the refractive index of the first medium layer and the refractive index of the second medium layer is 0.2-0.4.

8. The display substrate of claim 1,

the thickness of the extinction structure is 0.2-0.5 micrometer.

9. The display substrate of claim 1,

the first dielectric layer is made of an inorganic insulating material;

the second dielectric layer is made of an organic insulating material.

10. The display substrate of claim 9,

the material of the first dielectric layer comprises at least one of silicon nitride, silicon oxide and silicon oxynitride;

the material of the second dielectric layer comprises a planarization layer material.

11. The display substrate of claim 1, further comprising:

and the part of the planarization layer filled into the interval of the first dielectric layer forms a second dielectric layer.

12. A display device, comprising:

the display substrate of any one of claims 1 to 11;

the image acquisition unit is arranged on the back side of the display substrate and is used for acquiring images through the acquisition area of the display substrate.

13. A method for manufacturing a display substrate, wherein the display substrate is the display substrate according to any one of claims 1 to 11, the method comprising:

and forming the reflection structure on a substrate, and forming the extinction structure on the substrate.

14. The method of claim 13, wherein the display substrate is the display substrate of claim 11, and the forming the light extinction structure on the base comprises:

forming a first dielectric layer on the substrate through a composition process;

and forming a planarization layer covering the first dielectric layer on the substrate, wherein the part of the planarization layer filled into the interval of the first dielectric layer forms a second dielectric layer.

Images